JP2011257528A - Array substrate and liquid crystal display device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an array substrate having an improved opening ratio of a pixel in lateral electric field liquid crystal device, and also to provide the liquid crystal display device.SOLUTION: In the array substrate used in the lateral electric field liquid crystal display device constituted of a common electrode, a pixel electrode, a thin film transistor, color pixels having a plurality of colors provided covering the thin film transistor and a protective layer, the common electrode is disposed on the color pixels, and the pixel electrode is provided on the common electrode via an insulation layer.

Description

  The present invention relates to an array substrate used in a liquid crystal display device, and more particularly to a horizontal electric field type liquid crystal display device including a color filter on the array substrate side.

  Color liquid crystal display devices are rapidly spreading mainly in computer terminal display devices and television image display devices. As shown in FIG. 1, the color liquid crystal display device includes an array substrate, a counter substrate disposed opposite to the array substrate with a predetermined gap therebetween, and a liquid crystal layer sandwiched between the two substrates. The array substrate or the counter substrate is usually provided with a color filter composed of three colored layers of red, green, and blue for colorization.

  In recent years, this liquid crystal display device has various demands such as high contrast, high viewing angle, low power consumption, etc., and the same requirements have been achieved for color filters indispensable for color display of liquid crystal display devices. There is a need to. Usually, the color filter is provided on the counter substrate, but recently, an attempt has been made to form a black matrix (hereinafter referred to as “BM”) formed of the colored pixels and the resin on the array substrate side. (For example, Patent Documents 1 to 5)

Patent 2758410 Japanese Patent No. 3210639 Japanese Patent Laid-Open No. 2001-154013 JP 2006-259725 A JP 2005-018093 A

  Until now, in order to prevent display defects such as white spots due to misalignment between the array substrate and the counter substrate, the BM provided in the color filter must be provided wider than the wiring on the array substrate side. There was a problem that the aperture ratio could not be improved. On the other hand, such a problem can be solved by forming the color filter on the array substrate side.

  FIG. 1 shows an example of a structure in which a colored layer constituting a color filter is formed on the array substrate side. The alignment is performed with a wide viewing angle controlled so that the alignment directions of liquid crystal molecules in one pixel are a plurality of directions. It is explanatory drawing which showed typically the cross section of an example of the liquid crystal display device of a MVA (Multi-domain Vertical Alignment) system which is a division | segmentation vertical alignment system.

  As shown in FIG. 1, this MVA liquid crystal display device has a counter substrate (a common substrate (13) having a slit (14) provided on a glass substrate (11) through a liquid crystal layer (4)). 1) and an array substrate (2) provided with a thin film transistor layer (3), a colored layer (23R, G, B), a pixel electrode (24), and a protrusion (26) on a glass substrate (21). Structure. These protrusions (26) and slits (14) are provided at alternate positions in one pixel and have a function of controlling the alignment of liquid crystal molecules in place of the conventional rubbing process. The pixel electrode (24) is a transparent conductive film made of ITO (indium tin oxide), zinc oxide, tin oxide, etc., and is divided into pixels by photoetching, and on the colored layer (23R, G, B). Is provided. The pixel electrode is connected to the thin film transistor layer through a contact hole formed in the colored layer using a photolithography method, and a liquid crystal can be driven for each pixel by applying a voltage. Around the array substrate, there are a gate line driver and a data line driver as a drive circuit, and a controller for controlling them.

  Currently, in a liquid crystal display device, in addition to a vertical alignment method such as the MVA method, a horizontal electric field type liquid crystal driving method called an IPS (In Plane Switching) method or an FFS (Fringe Field Switching) method is widely used. An example of the structure of the array substrate (2) used in an FFS liquid crystal display device (for example, Patent Document 5) is shown in FIG. A common electrode (25) formed of a transparent conductive film on a glass substrate (21) and a gate electrode (31) made of a metal such as molybdenum, tungsten, or an alloy thereof are formed, and silicon oxide is used to improve switching performance. A semiconductor layer (34) made of amorphous silicon, a data line made of molybdenum or aluminum, a source electrode (35), and a drain electrode (36) are provided via an insulating layer (32) made of silicon nitride or the like. An insulating layer (33) is formed on these layers, and a comb-like pixel electrode (24) is provided on the insulating layer. The array substrate (2) is composed of a counter substrate (1) on which a colored layer (18R, G) and a black matrix (16) are formed via a liquid crystal layer (4). As shown in FIG. 3, the principle of FFS mode liquid crystal driving is by rubbing treatment using a so-called fringe electric field generated obliquely between the common electrode (25) and the comb-like pixel electrode (24). Liquid crystal driving is realized by controlling liquid crystal molecules having positive dielectric anisotropy whose orientation is controlled on the alignment film.

  FIG. 4 is a plan view of the display area of the FFS array substrate shown in FIG. A region delimited by the data line and the gate line is a sub-pixel. The comb-like pixel electrode (24) is formed at an angle to reduce the viewing angle dependency as shown in FIG. 4, and is connected to the drain electrode (36) through the contact hole (29). Yes. The common electrode (25) not shown connects all the sub-pixels by a bridge formed in the same layer as the pixel electrode (24) through the common wiring (25) and the contact hole (29).

  However, since the gate line and the common electrode are in the same layer in the structure of the current array substrate, if the common electrode is increased for the purpose of increasing the aperture ratio of the pixel, crosstalk or RC delay is caused between the common electrode and the gate line. May occur, and a distance of about 5 to 7 μm is required between the common electrode and the gate line, which reduces the aperture ratio. Further, as compared with the MVA liquid crystal display device, there is a problem that the BM line width becomes thick and the aperture ratio cannot be increased.

  The present invention has been made to solve the above problems, and it is an object of the present invention to increase the area of a common electrode and improve the aperture ratio of a pixel in a horizontal electric field type liquid crystal display device.

  According to a first aspect of the present invention, a horizontal electric field type liquid crystal display device including a common electrode, a pixel electrode, a thin film transistor, a plurality of colored pixels provided so as to cover the thin film transistor, and a protective layer is used. In the array substrate, a common electrode is disposed on the colored pixel, and the pixel electrode is further provided on the common electrode through a protective layer.

  According to a second aspect of the present invention, there is provided a horizontal electric field type liquid crystal display device comprising a common electrode, a pixel electrode, a thin film transistor, a light shielding layer provided to cover the thin film transistor, a plurality of colored pixels, and a protective layer. In the array substrate used in the present invention, a common electrode is disposed on the colored pixel, and the pixel electrode is further provided on the common electrode through a protective layer.

  A third invention according to a third aspect is a liquid crystal display device formed by using the array substrate according to the first and second aspects.

  According to the present invention, a liquid crystal display device having a high panel aperture ratio can be manufactured in a liquid crystal display device driven by a lateral electric field method.

Schematic diagram of a cross section in an example of a liquid crystal display device having colored pixels on the array substrate side Schematic of a cross section of an example of a horizontal electric field type liquid crystal display device Schematic diagram of applied voltage in horizontal electric field method Schematic diagram of a plane in an example of an array substrate in the horizontal electric field method Schematic diagram of a cross section in an example of a liquid crystal display device in a horizontal electric field mode in which a common electrode is formed on a colored layer on the array substrate side Schematic diagram of a plane in an example of an array substrate used in a liquid crystal display device Schematic diagram of a cross section in an example of a liquid crystal display device in a horizontal electric field mode in which a common electrode is formed on a light shielding layer and a colored layer on the array substrate side

Below, the liquid crystal display device by this invention is demonstrated in detail based on the embodiment.
A liquid crystal display device using the array substrate of the present invention includes at least a pixel electrode, a common electrode, and a thin film transistor, an array substrate having a plurality of colored pixels provided so as to cover the thin film transistor, and a predetermined gap in the array substrate. And a liquid crystal material having a positive dielectric anisotropy filled between the pair of substrates, and the pixels of the plurality of colors are composed of at least a colored layer. . A plurality of colors include a combination of red, green, and blue (RGB), and a combination in which yellow, magenta, and cyan are added. The color filter used in the present invention is particularly preferably applicable to the RGB system.

  The transparent substrate used in the method of the present invention preferably has a certain degree of transmittance with respect to visible light, and more preferably has a transmittance of 80% or more. Generally, it may be one used in a liquid crystal display device, and examples thereof include a plastic substrate such as PET and glass, but a glass substrate is usually used.

The thin film transistor layer used in the array substrate of the present invention includes a gate electrode 31, a gate insulating film 32, an insulating film 33, a semiconductor layer 34, a source electrode 35, and a drain electrode 36. The gate electrode 31 is formed to control the current between the source and the drain, and a metal such as molybdenum (Mo) or tungsten (W) or an alloy such as chromium-molybdenum (Cr—Mo) is used. The gate insulating film 31 is formed together with the gate electrode to give an electric field to the semiconductor layer, and silicon nitride (SiN _x ), silicon oxide (SiO), or the like is used. The insulating layer 33 is formed in order to prevent deterioration of the transistor due to a post process or moisture, and silicon nitride, silicon oxide, or the like is used like the gate insulating film. The semiconductor layer 34 is made of amorphous silicon and has a thickness of about 500 to 2000 mm. N (+) type amorphous silicon doped with phosphorus (P) for ohmic contact is provided at the contact portion between the source electrode and the drain electrode. Since the polarity of the source electrode and the drain electrode is reversed during driving, the source electrode and the drain electrode are also switched during driving. For convenience, one is fixed as a source electrode and the other is fixed as a drain electrode. The source electrode and the drain electrode are formed of a titanium-aluminum (Ti-Al) alloy or chromium-molybdenum (Cr-Mo).

The coloring layer and the light-shielding layer used in the present invention can be formed on the array substrate by any known method such as an ink jet method, a printing method, a photolithography method, and an etching method. In consideration of controllability and reproducibility, the photolithography method is preferable.

  In addition, the colored layer and the light-shielding layer, for example, disperse a pigment as a colorant, a transparent resin, a photoinitiator, a polymerizable monomer, and the like in a solvent by various dispersion methods such as a mill base, a three roll, a jet mill. It consists of the coloring resin composition adjusted by this.

  Specific examples of organic pigments that can be used in the colored resin composition constituting the colored layer are shown below by color index numbers.

  Examples of the pigment that can be used in the red colored resin composition for forming a red pixel include C.I. I. Pigment Red 7, 9, 14, 41, 48: 1, 48: 2, 48: 3, 48: 4, 81: 1, 81: 2, 81: 3, 97, 122, 123, 146, 149, 168, 177, 178, 179, 180, 184, 185, 187, 192, 200, 202, 208, 210, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 246, 254, 255, Red pigments such as H.264, 272, and 279 can be used. The red colored resin composition can be used in combination with a yellow pigment and an orange pigment as a fine adjustment of red.

  Examples of the yellow pigment include C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 144, 146, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 1 73, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214 and the like.

  Examples of the orange pigment include C.I. I. Pigment Orange 36, 43, 51, 55, 59, 61, 71, 73 and the like.

  Examples of the pigment that can be used in the green coloring resin composition for forming a green pixel include C.I. I. Green pigments such as Pigment Green 7, 10, 36, 37, and 58 can be used. Moreover, the yellow pigment similar to a red coloring resin composition can be used together with a green coloring resin composition as a green fine adjustment.

  Examples of the pigment that can be used in the blue colored resin composition for forming a blue pixel include C.I. I. Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 80, etc., preferably C.I. I. Pigment Blue 15: 6 can be used. The blue colored resin composition includes C.I. I. Pigment Violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50 and the like, preferably C.I. I. Pigment Violet 23 can be used in combination.

In combination with the organic pigment, an inorganic pigment may be used in combination in order to ensure good coatability, sensitivity, developability and the like while balancing saturation and lightness. Inorganic pigments include yellow lead, zinc yellow, red bean (red iron oxide (III)), cadmium red, ultramarine, bitumen, chromium oxide green, cobalt green and other metal oxide powders, metal sulfide powders, metal powders, etc. Can be mentioned. Furthermore, for color matching, a dye can be contained within a range that does not lower the heat resistance.

  In addition to carbon black and titanium oxide, a mixture of colored pigments such as red, blue, green, yellow and purple is used as the light shielding agent used in the light shielding layer, that is, the light shielding colored resin composition forming the resin BM. I can do it. As carbon black used as a light-shielding agent, carbon blacks # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 970, # 960, # 950, # 900, # 850 manufactured by Mitsubishi Chemical Corporation, MCF88, # 650, MA600, MA7, MA8, MA11, MA100, MA220, IL30B, IL31B, IL7B, IL11B, IL52B, # 4000, # 4010, # 55, # 52, # 50, # 47, # 45, # 44 , # 40, # 33, # 32, # 30, # 20, # 10, # 5, CF9, # 3050, # 3150, # 3250, # 3750, # 3950, Diamond Black A, Diamond Black N220M, Diamond Black N234 , Diamond black I, diamond black LI, diamond black II, diamond Rack 339, diamond black SH, diamond black SHA, diamond black LH, diamond black H, diamond black HA, diamond black SF, diamond black N550M, diamond black E, diamond black G, diamond black R, diamond black N760M, diamond black LR . Carbon black thermax N990, N991, N907, N908, N990, N991, N908 made by Cancarb. Carbon black Asahi # 80, Asahi # 70, Asahi # 70L, Asahi F-200, Asahi # 66, Asahi # 66HN, Asahi # 60H, Asahi # 60U, Asahi # 60, Asahi # 55, Asahi # 50H, Asahi # 51, Asahi # 50U, Asahi # 50, Asahi # 35, Asahi # 15, Asahi Thermal, Degussa's carbon black ColorBlack Fw200, ColorBlack Fw2, ColorBlack Fw1, ColorBlack Fw1, ColorBlack F170, BlackBlack 170, BlackBlack 170 , SpecialBlack6, SpecialBlack5, SpecialBlack4, SpecialBlack4A, PrintexU, PrintexV, Printex140U, Printex140V And the like.

  As the light-shielding agent used for the resin BM, a mixture of carbon black and a color pigment is preferable from the relationship between relative permittivity and transmittance. If the relative dielectric constant of the resin BM is high, it may affect signal transmission between wirings and wiring-pixel electrodes, and may cause display defects such as RC delay and crosstalk. The relative dielectric constant of the resin BM is preferably 10 or less, more preferably 6 or less. The amount of the light-shielding agent added to the coloring composition is preferably 35% by weight to 50% by weight. If the addition amount of the light-shielding agent is 35% by weight or less, sufficient light-shielding property cannot be obtained, and if the addition amount of the light-shielding agent is 50% by weight or more, sufficient patternability as BM cannot be obtained. The light shielding property is represented by a common logarithm of the reciprocal of the transmittance called an OD (Optical Density) value. In order to maintain a sufficient light shielding property, the resin BM as a whole needs an OD value of 3.5 to 4.5.

  The transparent resin constituting the colored resin composition of the present invention has a transmittance of preferably 80% or more, more preferably 95% or more of a thermoplastic resin or thermosetting in the entire wavelength region of 400 to 700 nm in the visible light region. And a photosensitive resin. In addition, as the transparent resin, a transparent resin obtained by curing the polymerizable monomer or oligomer, which is a precursor thereof, alone or in combination of two or more, as necessary, can be used.

Examples of the thermoplastic resin include butyral resin, styrene-maleic acid copolymer, chlorinated polyethylene, chlorinated polypropylene, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, polyurethane resin, and polyester resin. , Acrylic resins, alkyd resins, polystyrene, polyamide resins, rubber resins, cyclized rubber resins, celluloses, polyethylene, polybutadiene, polyimide resins, and the like.

  Examples of the thermosetting resin include an epoxy resin, a benzoguanamine resin, a rosin-modified maleic acid resin, a rosin-modified fumaric acid resin, a melamine resin, a urea resin, and a phenol resin.

  Examples of the photosensitive resin include (meth) acrylic compounds having a reactive substituent such as an isocyanate group, an aldehyde group, and an epoxy group on a linear polymer having a reactive substituent such as a hydroxyl group, a carboxyl group, or an amino group, A resin obtained by reacting an acid and introducing a photocrosslinkable group such as a (meth) acryloyl group or a styryl group into the linear polymer is used. In addition, linear polymers containing acid anhydrides such as styrene-maleic anhydride copolymer and α-olefin-maleic anhydride copolymer can be obtained from (meth) acrylic compounds having hydroxyl groups such as hydroxyalkyl (meth) acrylate. Half-esterified products are also used.

  Examples of the polymerizable monomer and oligomer constituting the colored resin composition include methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and cyclohexyl (meth). Acrylate, β-carboxyethyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, trimethylol Propane tri (meth) acrylate, polyethylene glycol di (meth) acrylate, pentaerythritol tri (meth) acrylate, 1,6-hexanediol diglycidyl ether di (meth) acrylate Bisphenol A diglycidyl ether di (meth) acrylate, neopentyl glycol diglycidyl ether di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tricyclodecanyl (meth) acrylate, ester acrylate, melamine (meth) Various acrylic esters and methacrylic esters such as acrylate, (meth) acrylic ester of methylolated melamine, epoxy (meth) acrylate, various acrylic esters such as urethane acrylate and methacrylic ester, (meth) acrylic acid, styrene, Vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth) acrylamide, N-hydroxy Examples include dimethyl (meth) acrylamide, N-vinylformamide, and acrylonitrile. Moreover, it is preferable to use the polyfunctional urethane acrylate which has the (meth) acryloyl group obtained by making polyfunctional isocyanate react with the (meth) acrylate which has a hydroxyl group. The combination of the (meth) acrylate having a hydroxyl group and the polyfunctional isocyanate is arbitrary and is not particularly limited. Moreover, one type of polyfunctional urethane acrylate may be used alone, or two or more types may be used in combination. These can be used alone or in admixture of two or more.

  When the colored resin composition is cured by ultraviolet irradiation, a photopolymerization initiator or the like is added. As photopolymerization initiators, 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- Acetophenone compounds such as hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl Benzoin compounds such as dimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, , 3 ', 4,4'-tetra (t-butylperoxycarbonyl) benzophenone, benzophenone compounds, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, 2,4 Thioxanthone compounds such as 2-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4 6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2-piphenyl-4,6-bis (trichloromethyl) -s- Triazine, 2-piperonyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl)- 6-styryl-s-triazine, 2- (naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4,6- Triazine compounds such as bis (trichloromethyl) -s-triazine, 2,4-trichloromethyl- (piperonyl) -6-triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine, 2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], O- (acetyl) -N- (1-phenyl-2-oxo-2- (4′-methoxy-) Oxime ester compounds such as naphthyl) ethylidene) hydroxylamine, phosphine compounds such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide , 9,10-phenanthrenequinone, camphor quinone, quinone-based compounds such as ethyl anthraquinone, borate compounds, carbazole compounds, imidazole compounds, titanocene compounds and the like. These photopolymerization initiators can be used alone or in combination. The amount of the photopolymerization initiator used is preferably 0.5 to 50% by weight, more preferably 3 to 30% by weight, based on the total solid content of the colored composition.

  Furthermore, as a sensitizer, α-acyloxy ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10-phenanthrenequinone, camphorquinone, ethylanthraquinone, 4,4′-diethylisophthalo Compounds such as phenone, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, 4-dimethylaminobenzoate Ethyl 4-methylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-dimethylhexyl 4-dimethylaminobenzoate, N, N-dimethylparatoluidine, 4,4′-bis (dimethylamino) benzophenone, 4 , 4'-bis (diechi Amino) benzophenone, can be used in combination of 4,4'-bis (ethylmethylamino) amine compounds such as benzophenone. These sensitizers can be used alone or in combination. The amount of the sensitizer used is preferably 0.5 to 60% by weight, more preferably 3 to 40% by weight based on the total amount of the photopolymerization initiator and the sensitizer. Moreover, it is preferable to use together a polymerization initiator and a photosensitizer.

Surfactants include polyoxyethylene alkyl ether sulfate, sodium dodecylbenzenesulfonate, alkali salt of styrene-acrylic acid copolymer, sodium alkylnaphthalenesulfonate, sodium alkyldiphenyletherdisulfonate, lauryl sulfate monoethanolamine, lauryl Anionic surfactants such as triethanolamine sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate; Polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene Nonionic surfactants such as alkyl ether phosphates, polyoxyethylene sorbitan monostearate, and polyethylene glycol monolaurate; chaotic surfactants such as alkyl quaternary ammonium salts and their ethylene oxide adducts; alkyldimethylamino Examples include amphoteric surfactants such as alkylbetaines such as betaine acetate and alkylimidazolines, and these can be used alone or in admixture of two or more.

  Furthermore, the colored resin composition can contain a polyfunctional thiol that functions as a chain transfer agent. The polyfunctional thiol may be a compound having two or more thiol groups. For example, hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene Glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, Pentaerythritol tetrakisthiopropionate, tris (2-hydroxyethyl) isocyanurate trimercaptopropionate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-s-to Azine, 2- (N, N- dibutylamino) -4,6-dimercapto -s- triazine. These polyfunctional thiols can be used alone or in combination. The amount of the polyfunctional thiol used is preferably 0.1 to 30% by weight, more preferably 1 to 20% by weight, based on the total solid content of the colored composition. If it is less than 0.1% by mass, the effect of adding a polyfunctional thiol is insufficient, and if it exceeds 30% by mass, the sensitivity is too high and the resolution is lowered.

  The colored resin composition may contain a storage stabilizer in order to stabilize the viscosity with time of the composition. Examples of the storage stabilizer include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid, and organic acids such as methyl ether, t-butylpyrocatechol, triethylphosphine, and triphenylphosphine. Examples thereof include phosphine and phosphite. The storage stabilizer can be contained in an amount of 0.1 to 10 parts by weight with respect to 100 parts by weight of the pigment in the coloring composition.

  Moreover, in order to improve the adhesiveness with a board | substrate, the said colored resin composition can also be made to contain adhesion improvement agents, such as a silane coupling agent. Examples of the silane coupling agent include vinyl silanes such as vinyltris (β-methoxyethoxy) silane, vinylethoxysilane, and vinyltrimethoxysilane, (meth) acrylsilanes such as γ-methacryloxypropyltrimethoxysilane, β- (3 , 4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) methyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, β- (3,4-epoxycyclohexyl) ) Epoxysilanes such as methyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β ( Aminoethyl) γ-aminopro Lutriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldiethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N Examples include aminosilanes such as -phenyl-γ-aminopropyltriethoxysilane, thiosilanes such as γ-mercaptopropyltrimethoxysilane, and γ-mercaptopropyltriethoxysilane. The silane coupling agent can be contained in an amount of 0.01 to 100 parts by weight with respect to 100 parts by weight of the pigment in the colored resin composition.

The colored resin composition can contain an organic solvent as necessary. Examples of the organic solvent include cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, ethylene glycol diethyl ether, xylene, ethyl cellosolve, methyl-n amyl ketone, propylene glycol monomethyl ether, toluene , Methyl ethyl ketone, ethyl acetate, methanol, ethanol, isopropyl alcohol, butanol, isobutyl ketone, petroleum solvent, and the like. These may be used alone or in combination. The solvent can be used in an amount of 800 to 4000 parts by weight, preferably 1000 to 2500 parts by weight with respect to 100 parts by weight of the pigment in the coloring composition.

  As a method for forming a colored layer and a light-shielding layer on the array substrate, the colored resin composition is applied by a coating means such as spin coating, dip coating, or die coating, and then prebaked. The means for applying are not limited to these as long as they can be applied with a uniform film thickness on the substrate. The pre-bake is preferably performed at 50 to 120 ° C. for about 1 to 20 minutes.

  Next, exposure is performed through a pattern mask having a shape required for the colored layer or the light shielding layer. A normal high-pressure mercury lamp or the like may be used as the light source.

  Subsequently, development is performed using an alkaline aqueous solution, followed by washing with water and drying to obtain an arbitrary one-color pattern. As an example of the alkaline aqueous solution, a tetramethylammonium hydroxide aqueous solution or a potassium hydroxide aqueous solution is preferably used, but a sodium carbonate aqueous solution, a sodium hydrogen carbonate aqueous solution, a mixed aqueous solution thereof, or a surfactant suitable for them. You may use what added.

  By repeating the above-described series of steps by changing the colored resin composition and the pattern as many times as necessary, it is possible to obtain a colored pattern in which a necessary number of colors are combined, that is, a pixel of a plurality of colors.

  The thickness of the colored pixels formed on the array substrate side is generally about 2.0 to 3.5 μm. If the film thickness is smaller than this, there is a concern about display defects such as RC delay and crosstalk due to the distance between the pixel electrode formed on the colored pixel and the wiring, so that a sufficient opening of the pixel electrode cannot be obtained. . On the other hand, when the film thickness is thicker than this, it is difficult to open a contact hole formed on the colored pixel.

  The resin BM formed on the array substrate side has a thickness of about 1.0 to 3.0 μm. If the film thickness is thinner than this, sufficient light shielding properties cannot be obtained, or the concentration of the light shielding agent becomes high, and the relative dielectric constant becomes high. Further, if the film thickness is thicker than this, sufficient patterning properties such as poor linearity cannot be obtained. As shown in FIG. 6, the resin BM may be formed either before the colored pixel is formed or after the colored pixel is formed.

  As shown in FIGS. 5 and 7, the protective layer (2A) formed on the array substrate side is formed not only for preventing impurities from eluting into the liquid crystal from the colored layer but also for preventing alignment defects by flattening the surface of the array substrate. The As a material used for the protective layer (2A), an inorganic material such as silicon oxide and silicon nitride, or an organic material similar to the material used for the colored resin composition can be used. As a method for forming the protective layer on the colored pixel, when an inorganic material is used, the protective layer is formed by using a vapor deposition method such as a plasma CVD method, and the film thickness is about 0.02 to 0.05 μm. In the case of using an organic material, it is formed using a photolithography method, and the film thickness is about 0.5 to 2.0 μm.

  The alignment films (15, 27) applied to the array substrate (2) and the counter substrate (1) have the property of aligning the liquid crystal in a predetermined direction director. It is necessary to select. As the material for the alignment film, photosensitive or non-photosensitive materials such as polyimide resin, polyamide resin, and polyvinyl alcohol resin are preferably used. From the viewpoint of heat resistance and reliability of the alignment film, polyimide resin is preferable. preferable. Moreover, you may use the orientation film marketed. For example, Nissan Chemical's Sun Ever 4742, Sun Ever 5410, Sun Ever 6414, JSR AL1051 may be used alone, or two or more of these may be used in combination. Other polymer components may be added as appropriate, and the resin components contained in these products may be appropriately selected and used.

  The alignment film is applied to a liquid crystal display substrate by flexographic printing, spin coating, roll coating, slit die coating, silk printing, ink jet printing, etc., and dried, baked or irradiated with light as necessary. Formed.

  Examples of the solvent used for the alignment film solution include water, ethanol, methanol, isobutanol, alcohols such as 3-methyl-3-methoxybutanol, ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, diethyl ether, Isopropyl ether, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol diethyl ether and other ethers, ethyl acetate, n-butyl acetate, 3-methoxy-3-methylbutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol Monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether Cetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, esters such as γ-butyrolactone, amides such as N, N-dimethylformamide, N, N-dimethylacetamide, 2-pyrrolidone Pyrrolidones such as N-methylpyrrolidone, butyl cellosolve and the like can be used.

  The process of uniformly aligning the liquid crystal direction (director) at the liquid crystal interface is used in liquid crystal display modes such as FFS, IPS, and TN that align the liquid crystal director horizontally or nearly horizontally on the liquid crystal display substrate. Orientation treatment. A rubbing process in which the alignment film is rubbed with a cloth such as rayon or cotton, or photo-alignment is used.

  As a liquid crystal material that can be used in the present invention, there is a nematic liquid crystal having positive dielectric anisotropy. In order to implement the configuration of the liquid crystal display device of the present invention, a commercially available liquid crystal may be used. For example, MLC-2041, MLC-6601, MLC-6614, MLC-6686, MLC-6669, etc. manufactured by Merck & Co., Inc. can be used.

  Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited thereto without departing from the spirit of the present invention.

[Synthesis of Resin Solution (A)]
A reaction vessel was charged with 800 parts by weight of cyclohexanone, heated while injecting nitrogen gas into the vessel, and a mixture of the following monomer and thermal polymerization initiator was added dropwise to carry out a polymerization reaction.

Styrene 60 parts by weight Methacrylic acid 60 parts by weight Methyl methacrylate 65 parts by weight Butyl methacrylate 65 parts by weight Thermal polymerization initiator 10 parts by weight Chain transfer agent 3 parts by weight After sufficient heating after dropping, 2.0 parts by weight of thermal polymerization initiator is added. What was dissolved in 50 parts by weight of cyclohexanone was added, and the reaction was further continued to obtain an acrylic resin solution. Cyclohexanone was added to the solution so that the solid content was 20% by weight to prepare an acrylic resin solution, which was designated as resin solution (A). The weight average molecular weight of the acrylic resin was about 10,000.

[Synthesis of Resin Solution (B)]
A reaction vessel was charged with 800 parts by weight of cyclohexanone, heated while injecting nitrogen gas into the vessel, and a mixture of the following monomer and thermal polymerization initiator was added dropwise to carry out a polymerization reaction.

Styrene 55 parts by weight Methacrylic acid 65 parts by weight Methyl methacrylate 65 parts by weight Benzyl methacrylate 60 parts by weight Thermal polymerization initiator 15 parts by weight Chain transfer agent 3 parts by weight After sufficient heating after dropping, 2.0 parts by weight of thermal polymerization initiator is added. What was dissolved in 50 parts by weight of cyclohexanone was added, and the reaction was further continued to obtain an acrylic resin solution. Cyclohexanone was added to the solution so that the solid content was 30% by weight to prepare an acrylic resin solution, which was designated as a resin solution (B). The weight average molecular weight of the acrylic resin was about 20,000.

[Preparation of colored resin composition]
Red, blue and green colored resin compositions and resin BM were prepared in the following manner.
<Red colored resin composition>
A mixture having the following composition was uniformly stirred and mixed, then dispersed in a sand mill for 5 hours using glass beads having a diameter of 1 mm, and then filtered through a 5 μm filter to prepare a red pigment dispersion.

Red pigment: C.I. I. Pigment Red 254
("Ilgar Four Red B-CF" manufactured by Ciba Specialty Chemicals)
18 parts by weight Red pigment: C.I. I. Pigment Red 177
("Chromophthal red A2B" manufactured by Ciba Specialty Chemicals
2 parts by weight Dispersant (“Ajisper PB821” manufactured by Ajinomoto Fine Techno Co., Ltd.) 2 parts by weight Resin solution (A) 108 parts by weight Then, the mixture having the following composition was stirred and mixed to be uniform, and then filtered through a 5 μm filter. Thus, a red coloring composition was obtained.

130 parts by weight of the above dispersion Resin solution (A) 100 parts by weight Polyfunctional polymerizable monomer 25 parts by weight (“Aronix M-520” manufactured by Toa Gosei)
Photoinitiator ("Irgacure 369" manufactured by Ciba Specialty Chemicals)
15 parts by weight Sensitizer ("EAB-F" manufactured by Hodogaya Chemical Co., Ltd.) 5 parts by weight Cyclohexanone 325 parts by weight The amount of carboxyl group-containing monomer in the adjusted colored resin composition was 21.1% by weight in the solid content Met.

<Green colored resin composition>
A mixture having the following composition was uniformly stirred and mixed, then dispersed in a sand mill for 5 hours using glass beads having a diameter of 1 mm, and then filtered through a 5 μm filter to prepare a green pigment dispersion.

Green pigment: C.I. I. Pigment Green 36 20 parts by weight (Toyo Ink Manufacturing Co., Ltd. “Lionol Green 6YK”)
Yellow pigment: C.I. I. Pigment Yellow 150 8 parts by weight (manufactured by Bayer "Funchon First Yellow Y-5688")
Dispersant ("Disperbyk-103" manufactured by Big Chemie) 2 parts by weight Resin solution (A) 102 parts by weight After that, using the above dispersion 132 parts by weight, and further stirring and mixing the mixture of the following composition to be uniform, Filtration through a 5 μm filter gave a green colored resin composition.

Resin solution (A) 116 parts by weight Polyfunctional polymerizable monomer 32 parts by weight (Osaka Organic Chemical Co., Ltd. “Biscoat # 2500”)
Photoinitiator ("Irgacure OXE-02" manufactured by Ciba Specialty Chemicals)
7 parts by weight Sensitizer ("EAB-F" manufactured by Hodogaya Chemical Co., Ltd.) 2 parts by weight 313 parts by weight of cyclohexanone The amount of the carboxyl group-containing monomer in the adjusted colored resin composition was 24.2% by weight in the solid content Met.

<Blue colored resin composition>
A mixture having the following composition was uniformly stirred and mixed, then dispersed in a sand mill for 5 hours using glass beads having a diameter of 1 mm, and then filtered through a 5 μm filter to prepare a blue pigment dispersion.

Blue pigment: C.I. I. Pigment Blue 20 parts by weight (Toyo Ink Manufacturing Co., Ltd. “Lionol Blue ES”)
Purple pigment: C.I. I. 2 parts by weight of Pigment Violet 23 ("Paliogen Violet 5890" manufactured by BASF)
Dispersant ("Sols Birds 20000" manufactured by Zeneca) 5 parts by weight Resin solution (A) 125 parts by weight Thereafter, a mixture having the following composition is stirred and mixed to be uniform, and then filtered through a 5 µm filter to give a blue colored resin composition I got a thing.

152 parts by weight of the dispersion Resin solution (A) 100 parts by weight Polyfunctional polymerizable monomer 31 parts by weight (Osaka Organic Chemical Co., Ltd. “Biscoat # 2500”)
Photoinitiator (Ciba Specialty Chemicals “Irgacure 907”)
14 parts by weight Sensitizer ("EAB-F" manufactured by Hodogaya Chemical Co., Ltd.) 3 parts by weight Cyclohexanone 300 parts by weight The amount of the carboxyl group-containing monomer in the adjusted colored resin composition was 23.8% by weight in the solid content Met.

<Light-shielding resin composition>
A mixture having the following composition was spread and mixed uniformly, then dispersed with a sand mill for 5 hours using glass beads having a diameter of 1 mm, and then filtered with a 5 μm filter to obtain a dispersion of a light shielding agent.

Red pigment: C.I. I. 14 parts by weight of Pigment Red 254 (“Ilgar For Red B-CF” manufactured by Ciba Specialty Chemicals)
Blue pigment: C.I. I. Pigment Blue 15 14 parts by weight (“Rionol Blue ES” manufactured by Toyo Ink Manufacturing Co., Ltd.)
Dispersant ("Ajisper PB821" manufactured by Ajinomoto Fine Techno Co., Ltd.)
2 parts by weight Resin solution (A) 120 parts by weight Thereafter, a mixture having the following composition was stirred and mixed so as to be uniform, and then filtered through a 5 μm filter to obtain a light-shielding resin composition.

150 parts by weight of the dispersion 100 parts by weight of the resin solution (A) Carbon black dispersant (TPBK-2C manufactured by Mikuni Dye Co.)
37 parts by weight Polyfunctional polymerizable monomer 30 parts by weight (“Aronix M-400” manufactured by Toa Gosei)
Photoinitiator ("Irgacure 369" manufactured by Ciba Specialty Chemicals)
14 parts by weight Sensitizer ("EAB-F" manufactured by Hodogaya Chemical Co., Ltd.) 3 parts by weight Cyclohexanone 100 parts by weight Propylene glycol monomethyl ether acetate 200 parts by weight
<Transparent resin composition 1>
A mixture having the following composition was spread and mixed uniformly, and then dispersed with a sand mill for 5 hours using glass beads having a diameter of 1 mm, followed by filtration with a 5 μm filter to obtain a transparent dispersion.

Resin solution (A) 150 parts by weight
20 parts by weight of polyfunctional polymerizable monomer (“Aronix M-400” manufactured by Toa Gosei)
Photoinitiator ("Irgacure 907" manufactured by Ciba Specialty Chemicals)
16 parts by weight
200 parts by weight of cyclohexanone
<Transparent resin composition 2>
A mixture having the following composition was spread and mixed uniformly, and then dispersed with a sand mill for 5 hours using glass beads having a diameter of 1 mm, followed by filtration with a 5 μm filter to obtain a transparent dispersion.

Resin solution (B) 100 parts by weight
Polyfunctional polymerizable monomer 20 parts by weight EO-modified bisphenol A methacrylate (BPE-500: manufactured by Shin-Nakamura Chemical Co., Ltd.)
Photoinitiator ("Irgacure 907" manufactured by Ciba Specialty Chemicals)
16 parts by weight
200 parts by weight of cyclohexanone

<Production of array substrate>
[Formation of thin film transistor layer]
A positive resist NPR-9000 (manufactured by Nagase ChemteX) was applied on an alkali-free glass substrate OA-10 (manufactured by Nippon Electric Glass Co., Ltd.) on which a Mo thin film was formed by sputtering. After exposure through a photomask with an ultraviolet exposure machine, development was performed with a 2.4 wt% tetramethylammonium hydroxide aqueous solution. The gate line (38) and the gate electrode (31) were formed by a photolithography process in which the positive resist was removed by Unlast TN-1 (manufactured by Mikawaka Pharmaceutical Co., Ltd.) after the Mo thin film was patterned by the substrate wet etching in the previous period. A gate insulating layer (32) and a semiconductor layer (34) made of silicon nitride were formed on the substrate by plasma CVD. A data line (39), a source electrode (35), and a drain electrode (36) were formed on the substrate by a photolithography process using a Ti / Al alloy. An insulating layer (33B) made of silicon nitride was formed on the substrate.

(Formation of colored layer)
On the thin film transistor layer, the <red colored resin composition> was applied by spin coating so that the finished film thickness was 3.0 μm. After drying at 90 ° C for 60 seconds on a hot plate, pattern exposure is performed through a photomask with an ultraviolet exposure machine, and after unexposed portions are removed with an alkali developer, heat curing is performed at 230 ° C for 20 minutes in an oven. A red pixel, which is a striped colored layer, was formed on the array substrate on the pixel surrounded by the gate line and the data line. At this time, a through hole of 25 μm was formed on the drain electrode in order to form a contact hole. The alkaline developer has the following composition.

Sodium carbonate 1.5% by weight
Sodium bicarbonate 0.5% by weight
Anionic surfactant 8.0% by weight
("Peralex NBL" manufactured by Kao Corporation)
90.0% by weight of water
Next, the <green colored resin composition> was similarly applied by spin coating so that the final film thickness was 3 μm, dried, and then the striped colored layer was shifted from the above-mentioned red pixel by an exposure machine. A green pixel adjacent to the red pixel was formed by exposing and developing the area. At this time, a through hole of 25 μm was also formed on the drain electrode.

  Further, in the same manner as in red and green, the above-mentioned <blue colored resin composition> was also formed with blue pixels adjacent to the red and green pixels with a finished film thickness of 3 μm. At this time, a through hole of 25 μm was also formed on the drain electrode.

[Formation of common electrode]
A transparent conductive film having a thickness of 0.1 μm was formed on each of the red, green, and blue colored pixels by sputtering using ITO as a target. Next, a positive resist LC-100 (Rohm and Haas) was applied on the transparent conductive film. After exposure and development through a photomask with an ultraviolet exposure machine, the transparent conductive film was etched using ITO-CF60 (Mitsubishi Gas Chemical Co., Ltd.). After removing the positive resist with Unlast TN-1, heat curing is carried out at 230 ° C. for 20 minutes in an oven, so that it is 2 to 2 pixels above the region surrounded by the gate line (38) and the data line (37) on the colored pixel. A solid common electrode (25) having a narrow width of 3 μm was formed. At this time, the distance between the common electrode (25) and the gate line (38) was 2 μm, and the distance between the common electrode (25) and the data line (37) was 3 μm.

(Formation of protective layer)
After forming silicon nitride with a film thickness of 0.05 μm on the colored pixel provided with the common electrode by plasma CVD, the silicon nitride on the through hole formed in the colored pixel is removed by dry etching. And a silicon nitride protective layer.

[Formation of pixel electrode]
Next, a transparent conductive film having a thickness of 0.1 μm was formed on the colored pixels by sputtering using ITO as a target. A positive resist LC-100 (Rohm and Haas) was applied on the transparent conductive film. After exposure and development through a photomask with an ultraviolet exposure machine, the transparent conductive film was etched using ITO-CF60 (Mitsubishi Gas Chemical Co., Ltd.). After removing the positive type resist with Unlast TN-1, a comb-like pixel electrode connected to the drain electrode through the contact hole (29) is formed on the protective layer by thermosetting in an oven at 230 ° C. for 20 minutes. did. Thus, the red, green, and blue colored pixels on the thin film transistor layer (3) as shown in FIGS. 5 and 6 and the common electrode (25), the protective layer (2A), and the pixel electrode formed on the colored pixels are provided. An array substrate (2) having was formed.

<< Formation of counter substrate >>
As the counter substrate (1) to be bonded to the array substrate, the <light-shielding resin composition> is applied as a light-shielding layer on a non-alkali glass OA-10 by spin coating so that the finished film thickness is 1.6 μm. Went. At this time, the OD value of the light shielding layer was 3.6. After drying at 90 ° C for 60 seconds on a hot plate, pattern exposure is performed through a photomask with an ultraviolet exposure machine, and after unexposed portions are removed with an alkali developer, heat curing is performed at 230 ° C for 40 minutes in a batch oven. Went. At this time, the line width of the light shielding layer extending in the x-axis direction was 90 μm, and the line width of the light shielding layer extending in the y-axis direction was 24 μm. As the flattening layer, <Transparent Resin Composition 1> was applied by spin coating so that the finished film thickness was 2.0 μm. 90 ° C on a hot plate
After drying for 60 seconds, the entire surface was exposed with an ultraviolet light exposure machine, and heat cured at 230 ° C. for 40 minutes in a batch oven.

<Production of liquid crystal display device>
On the counter substrate (1) and the array substrate (2), a polyimide alignment film Sunever 5410 (Nissan Chemical Co., Ltd.) is applied with a thickness of 0.1 μm by a flexographic printing machine, and dried at 90 ° C. for 60 seconds on a hot plate. Then, heat curing was performed in an oven at 230 ° C. for 60 minutes. After rubbing the pair of substrates for cleaning, Photorec S (Sekisui Chemical Co., Ltd.), which is a sealing agent, is applied to the outer periphery of the display portion with a seal dispenser, and then MLC2041 with a liquid crystal dispenser. After dropping (manufactured by Merck), a liquid crystal panel was prepared by a vacuum dropping method. A transverse electric field type liquid crystal display device was obtained by mounting a polarizing plate, an IC driver / drive circuit and a backlight on the liquid crystal panel. In the obtained liquid crystal display device, since the common electrode is provided in a layer different from the gate line with a sufficient distance, the plane distance between the common electrode and the gate line can be reduced to 2 μm, and one pixel opening is 158 μm × 430 μm. The horizontal electric field type liquid crystal display device was obtained.

<Production of array substrate>
An array substrate was produced in the same manner as in Example 1 except that <Transparent resin composition 2> was used as the protective film. As a method for forming a protective film, the transparent resin composition 2 is applied by spin coating so that the final film thickness is 0.8 μm, dried on a hot plate at 90 ° C. for 60 seconds, and then photomasked with an ultraviolet exposure machine. Then, pattern exposure was carried out so that the protective film at the contact hole portion could be removed via, and after the unexposed portion was removed with an alkaline developer, thermosetting was performed at 230 ° C. for 40 minutes in a batch type oven.

<< Preparation of counter substrate >>
As the counter substrate (1) to be bonded to the array substrate, the light-shielding resin composition is applied as a light-shielding layer on a non-alkali glass OA-10 by spin coating so that the finished film thickness is 1.6 μm. It was. At this time, the OD value of the light shielding layer was 3.6. 90 ° C on a hot plate
After drying for 60 seconds, pattern exposure was performed through a photomask with an ultraviolet exposure machine, and after unexposed portions were removed with an alkaline developer, thermosetting was performed at 230 ° C. for 40 minutes in a batch oven. At this time, the line width of the light shielding layer extending in the x-axis direction was 90 μm, and the line width of the light shielding layer extending in the y-axis direction was 24 μm. As the planarizing layer, the transparent resin composition 1 was applied by spin coating so that the finished film thickness was 2.0 μm. After drying at 90 ° C. for 60 seconds on a hot plate, the entire surface was exposed with an ultraviolet exposure machine, and thermosetting was performed at 230 ° C. for 40 minutes in a batch oven.

<Production of liquid crystal display device>
On the counter substrate (1) and the array substrate (2), a polyimide alignment film Sunever 5410 (Nissan Chemical Co., Ltd.) is applied with a thickness of 0.1 μm by a flexographic printing machine, and dried at 90 ° C. for 60 seconds on a hot plate. Then, heat curing was performed in an oven at 230 ° C. for 60 minutes. After rubbing the pair of substrates for cleaning, Photorec S (Sekisui Chemical Co., Ltd.), which is a sealing agent, is applied to the outer periphery of the display portion with a seal dispenser, and then MLC2041 with a liquid crystal dispenser. After dropping (manufactured by Merck), a liquid crystal panel is manufactured by a vacuum dropping method, and a polarizing plate, an IC driver / driving circuit and a backlight are mounted, so that one pixel opening is 158 μm × 430 μm horizontal electric field type liquid crystal display device Got.

<Production of array substrate>
[Formation of thin film transistor layer]
A positive resist NPR-9000 (manufactured by Nagase ChemteX) was applied on an alkali-free glass substrate OA-10 (manufactured by Nippon Electric Glass Co., Ltd.) on which a Mo thin film was formed by sputtering. After exposure through a photomask with an ultraviolet exposure machine, development was performed with a 2.4 wt% tetramethylammonium hydroxide aqueous solution. The gate line (38) and the gate electrode (31) were formed by a photolithography process in which the positive resist was removed by Unlast TN-1 (manufactured by Mikawaka Pharmaceutical Co., Ltd.) after the Mo thin film was patterned by the substrate wet etching in the previous period. A gate insulating layer (32) and a semiconductor layer (34) made of silicon nitride were formed on the substrate by plasma CVD. A data line (39), a source electrode (35), and a drain electrode (36) were formed on the substrate by a photolithography process using a Ti / Al alloy. An insulating layer (33) made of silicon nitride was formed on the substrate.

(Formation of light shielding layer)
On the thin film transistor layer, the light shielding resin composition 1 was applied as a light shielding layer by spin coating so that the finished film thickness was 1.6 μm. After drying at 90 ° C for 60 seconds on a hot plate, pattern exposure is performed through a photomask with an ultraviolet exposure machine, and after unexposed portions are removed with an alkali developer, heat curing is performed at 230 ° C for 40 minutes in a batch oven. Went. At this time, the light shielding layer was patterned to cover the thin film transistor layer, the gate line, and the data line. At this time, the OD value of the light shielding layer was 3.6, the line width of the light shielding layer extending in the x-axis direction was 90 μm, and the line width of the light shielding layer extending in the y-axis direction was 14 μm.

(Formation of colored layer)
On the thin film transistor layer, the red colored resin composition was applied by spin coating so that the finished film thickness was 3.0 μm. After drying at 90 ° C for 60 seconds on a hot plate, pattern exposure is performed through a photomask with an ultraviolet exposure machine, and after unexposed portions are removed with an alkali developer, heat curing is performed at 230 ° C for 20 minutes in an oven. A red pixel, which is a striped colored layer, was formed on the array substrate on the pixel surrounded by the gate line and the data line. At this time, a through hole of 25 μm was formed on the drain electrode in order to form a contact hole.

  Next, the green colored resin composition is similarly applied by spin coating so that the finished film thickness is 3 μm, dried, and then exposed to a place where the striped colored layer is shifted from the above-mentioned red pixel by an exposure machine. Then, a green pixel adjacent to the red pixel was formed. At this time, a through hole of 25 μm was also formed on the drain electrode.

  Further, in the same manner as in red and green, the blue colored resin composition was also formed with blue pixels adjacent to the red and green pixels with a finished film thickness of 3 μm. At this time, a through hole of 25 μm was also formed on the drain electrode.

[Formation of common electrode]
A transparent conductive film having a thickness of 0.1 μm was formed on the colored pixels by sputtering using ITO as a target. A positive resist LC-100 (manufactured by Rohm and Haas) was applied on the transparent conductive film. After exposure and development through a photomask with an ultraviolet exposure machine, IT
The transparent conductive film was etched using O-CF60 (manufactured by Mitsubishi Gas Chemical Company). After removing the positive resist with Unlast TN-1, heat curing is carried out at 230 ° C. for 20 minutes in an oven, so that it is 2 to 2 pixels above the region surrounded by the gate line (38) and the data line (37) on the colored pixel. A solid common electrode (25) having a narrow width of 3 μm was formed. At this time, the distance between the common electrode (25) and the gate line (38) was 2 μm, and the distance between the common electrode (25) and the data line (38) was 3 μm.

(Formation of protective layer)
After forming silicon oxide with a film thickness of 0.05 μm on the colored pixel provided with the common electrode by plasma CVD, the silicon oxide on the through-hole part formed in the colored pixel is removed by dry etching, and nitriding A protective layer of silicon was obtained.

[Formation of pixel electrode]
A transparent conductive film having a thickness of 0.1 μm was formed on the colored pixels by sputtering using ITO as a target. A positive resist LC-100 (manufactured by Rohm and Haas) was applied on the transparent conductive film. After exposure and development through a photomask with an ultraviolet exposure machine, the transparent conductive film was etched using ITO-CF60 (Mitsubishi Gas Chemical Co., Ltd.). After removing the positive resist with Unlast TN-1, thermosetting in an oven at 230 ° C. for 20 minutes forms a comb-like pixel electrode connected to the drain electrode through the contact hole (29) on the insulating layer did. Thus, the red, green, and blue colored pixels on the thin film transistor layer (3) as shown in FIGS. 5 and 6 and the common electrode (25), the insulating layer (2A), and the pixel electrode formed on the colored pixels are provided. An array substrate (2) having was formed.

<< Formation of counter substrate >>
Non-alkali glass OA-10 was used as the counter substrate (1) to be bonded to the array substrate.

<Production of liquid crystal display device>
On the counter substrate (1) and the array substrate (2), a polyimide alignment film Sunever 4742 (manufactured by Nissan Chemical Co., Ltd.) is applied with a thickness of 0.1 μm by a flexographic printing machine, and dried at 90 ° C. for 60 seconds on a hot plate. Then, heat curing was performed in an oven at 230 ° C. for 60 minutes. After rubbing the pair of substrates for cleaning, Photorec S (Sekisui Chemical Co., Ltd.), which is a sealing agent, is applied to the outer periphery of the display portion with a seal dispenser, and then MLC2041 with a liquid crystal dispenser. After dropping (manufactured by Merck), a liquid crystal panel was prepared by a vacuum dropping method. An FFS liquid crystal display device was obtained by mounting a polarizing plate, an IC driver / drive circuit, and a backlight on the liquid crystal panel. Since the obtained liquid crystal display device does not need to consider the bonding margin between the array substrate and the counter substrate, the line width of the light-shielding layer can be made narrower than those in Example 1 and Example 2. The aperture of one pixel in the obtained liquid crystal display device was 168 μm × 430 μm.

Comparative example

<Production of array substrate>
[Formation of thin film transistor layer]
A positive resist LC-100 (made by Rohm and Haas) was applied on an alkali-free glass substrate OA-10 (made by Nippon Electric Glass Co., Ltd.) on which a 0.1 μm ITO thin film was formed by sputtering. After exposure and development through a photomask with an ultraviolet exposure machine, the transparent conductive film was etched using ITO-CF60 (Mitsubishi Gas Chemical Co., Ltd.). After removing the positive resist with Unlast TN-1, a common electrode (25) was formed by thermosetting in an oven at 230 ° C. for 20 minutes. Subsequently, a Mo thin film was formed on the previous substrate by sputtering, and a positive resist NPR-9000 was applied. After exposure through a photomask with an ultraviolet exposure machine, development was performed with a 2.4 wt% tetramethylammonium hydroxide aqueous solution. The gate line (38) and the gate electrode (31) were formed by a photolithography process in which the positive resist was removed by unlast TN-1 after patterning the Mo thin film by the substrate wet etching in the previous period. A gate insulating layer (32) and a semiconductor layer (34) made of silicon nitride were formed on the substrate by plasma CVD. A data line (39), a source electrode (35), and a drain electrode (36) were formed on the substrate by a photolithography process using a Ti—Al alloy. An insulating layer (33) made of silicon nitride was formed on the substrate. At this time, the distance between the common electrode (25) and the gate line (38) was 7 μm, and the distance between the common electrode (25) and the data line (38) was 3 μm.
(Formation of colored layer)
On the thin film transistor layer, the red colored resin composition was applied by spin coating so that the finished film thickness was 3.0 μm. After drying at 90 ° C for 60 seconds on a hot plate, pattern exposure is performed through a photomask with an ultraviolet exposure machine, and after unexposed portions are removed with an alkali developer, heat curing is performed at 230 ° C for 20 minutes in an oven. A red pixel, which is a striped colored layer, was formed on the array substrate on the pixel surrounded by the gate line and the data line. At this time, a through hole of 25 μm was formed on the drain electrode in order to form a contact hole.
Next, the green colored resin composition is similarly applied by spin coating so that the finished film thickness is 3 μm, dried, and then exposed to a place where the striped colored layer is shifted from the above-mentioned red pixel by an exposure machine. Then, a green pixel adjacent to the red pixel was formed. At this time, a through hole of 25 μm was also formed on the drain electrode.
Further, in the same manner as in red and green, the blue colored resin composition was also formed with blue pixels adjacent to the red and green pixels with a finished film thickness of 3 μm. At this time, a through hole of 25 μm was also formed on the drain electrode.
(Formation of protective layer)
After forming silicon nitride with a film thickness of 0.05 μm on the colored pixels by plasma CVD method, the silicon nitride on the through holes formed in the colored pixels is removed by dry etching, and a silicon nitride protective layer is formed. did.
[Formation of pixel electrode]
A transparent conductive film having a thickness of 0.1 μm was formed on the colored pixels by sputtering using ITO as a target. A positive resist LC-100 (manufactured by Rohm and Haas) was applied on the transparent conductive film. After exposure and development through a photomask with an ultraviolet exposure machine, the transparent conductive film was etched using ITO-CF60 (Mitsubishi Gas Chemical Co., Ltd.). After removing the positive type resist with Unlast TN-1, a comb-like pixel electrode connected to the drain electrode through the contact hole (29) is formed on the protective layer by thermosetting in an oven at 230 ° C. for 20 minutes. did. Thus, the red, green, and blue colored pixels on the thin film transistor layer (3) as shown in FIGS. 5 and 6 and the common electrode (25), the protective layer (2A), and the pixel electrode formed on the colored pixels are provided. An array substrate (2) having was formed.
<< Formation of counter substrate >>
As the counter substrate (1) to be bonded to the array substrate, the light-shielding resin composition 1 as a light-shielding layer is applied onto the alkali-free glass OA-10 by spin coating so that the finished film thickness is 1.6 μm. It was. At this time, the OD value of the light shielding layer was 3.6. After drying at 90 ° C for 60 seconds on a hot plate, pattern exposure is performed through a photomask with an ultraviolet exposure machine, and after unexposed portions are removed with an alkali developer, heat curing is performed at 230 ° C for 40 minutes in a batch oven. Went. As the planarizing layer, the transparent resin composition 1 was applied by spin coating so that the finished film thickness was 2.0 μm. After drying at 90 ° C. for 60 seconds on a hot plate, the entire surface was exposed with an ultraviolet exposure machine, and thermosetting was performed at 230 ° C. for 40 minutes in a batch oven.
<Production of liquid crystal display device>
On the counter substrate (1) and the array substrate (2), a polyimide alignment film Sunever 5410 (manufactured by Nissan Chemical Industries, Ltd.) is applied in a thickness of 0.1 μm with a flexographic printing machine, and is heated at 90 ° C. with a hot plate
After second drying, heat curing was performed in an oven at 230 ° C. for 60 minutes. After rubbing the pair of substrates for cleaning, Photorec S (Sekisui Chemical Co., Ltd.), which is a sealing agent, is applied to the outer periphery of the display portion with a seal dispenser, and then MLC2041 with a liquid crystal dispenser. After dropping (manufactured by Merck), a liquid crystal panel was prepared by a vacuum dropping method. A transverse electric field type liquid crystal display device was obtained by mounting a polarizing plate, an IC driver / drive circuit and a backlight on the liquid crystal panel. The opening of one pixel in the obtained liquid crystal display device was 158 μm × 420 μm.

DESCRIPTION OF SYMBOLS 1 ... Opposite substrate 11 ... Glass substrate 12 ... Polarizing plate 13 ... Common electrode 14 ... Slit 15 ... Orientation film 16 ... Black matrix 17 ... Flattening layer 18 ... Colored layer (R, G, B)
19 .... Protrusions 2. Array substrate 21 ... Glass substrate 22 ... Polarizing plate 23 ... Colored layer (R, G, B)
24..Pixel electrode 25..Common electrode 26..Protrusion 27..Alignment film 28..Black matrix 29..Contact hole 2A..Insulating layer 2B..Common wiring 3..Thin film transistor layer 31..Gate electrode 32.・ Gate insulating film 33 ..Insulating layer 34 ..Semiconductor layer 35 ..Source electrode 36 ..Drain electrode 37 ..Data line 38 ..Gate line 4.

Claims (3)

  A common electrode, a pixel electrode, a thin film transistor, a plurality of colored pixels provided so as to cover the thin film transistor, and an array substrate used in a horizontal electric field type liquid crystal display device including a protective layer, the common electrode on the colored pixel An array substrate, further comprising a pixel electrode on the common electrode through an insulating layer.   In an array substrate used in a horizontal electric field mode liquid crystal display device comprising a common electrode, a pixel electrode, a thin film transistor, a light shielding layer provided over the thin film transistor and a plurality of colored pixels, and a protective layer, the colored pixel layer An array substrate comprising: a common electrode disposed thereon; and a pixel electrode provided on the common electrode through an insulating layer.   A liquid crystal display device using the array substrate according to claim 1 or 2.

Images