JP2011257283A - Method and device for measuring position of current-carrying part - Google Patents

Method and device for measuring position of current-carrying part Download PDF

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JP2011257283A
JP2011257283A JP2010132570A JP2010132570A JP2011257283A JP 2011257283 A JP2011257283 A JP 2011257283A JP 2010132570 A JP2010132570 A JP 2010132570A JP 2010132570 A JP2010132570 A JP 2010132570A JP 2011257283 A JP2011257283 A JP 2011257283A
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current
measuring
carrying part
potential
metal plate
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JP5456591B2 (en
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Yuichi Watanabe
裕一 渡辺
Toshio Ishii
俊夫 石井
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JFE Steel Corp
JFE Engineering Corp
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JFE Engineering Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a method and device for measuring a position of a current-carrying part, which is capable of accurately measuring a position of a current-carrying part.SOLUTION: In the method for measuring the position of the current-carrying part, which measures the position and shape of the current-carrying part when evaluating an electromagnetic wave leaking through a gap between metallic plates, a high frequency current is caused to flow between the metallic plates, and a potential distribution generated on metallic plate surfaces is obtained by potential difference measurement with a feed point on the metallic plate surfaces as a reference of potential, and the position of the current-carrying part is determined from the potential distribution.

Description

本発明は、OA・電機製品などの内部に組み込まれた電子回路からの電磁波漏洩の評価に関し、特に電磁波漏洩の評価にあたって通電部の位置を正確に測定する通電部の位置測定方法および装置に関するものである。   The present invention relates to the evaluation of electromagnetic wave leakage from an electronic circuit incorporated in an OA / electrical product, and more particularly to a position measuring method and apparatus for a current-carrying part that accurately measures the position of the current-carrying part in the evaluation of electromagnetic wave leakage. It is.

OA・電機製品には、製品内部に組み込まれた電子回路からの漏洩電磁波をシールドすることが求められている。これは、漏洩電磁波が他のOA・電機製品を誤作動させる可能性があるだけでなく、心臓ペースメーカなどの電子機器を誤作動させて、使用している人へ影響を及ぼす可能性があるためである。   OA / electrical products are required to shield leakage electromagnetic waves from electronic circuits incorporated in the product. This is because leaked electromagnetic waves may not only cause other OA / electrical products to malfunction, but also may cause electronic devices such as cardiac pacemakers to malfunction and affect people using them. It is.

OA・電機製品の筐体は、鋼板やアルミ板等の金属で作製されている場合が多い。そして、金属製の筐体内部に電磁波の発信源がある場合に、金属板が重なった部分を溶接など連続的な接合を施さない限り、隙間ができてしまい、ここから電磁波が漏洩することが問題となる。そのため、筐体外部へ電磁波が漏洩する機構に基いて、その漏洩電磁波の強度を評価する手法は、電磁波漏洩を制御する上で重要な技術である。   The casing of OA / electrical products is often made of a metal such as a steel plate or an aluminum plate. If there is an electromagnetic wave source inside the metal housing, a gap will be created unless the metal plate overlaps the welded part, and electromagnetic waves may leak from here. It becomes a problem. Therefore, a technique for evaluating the strength of the leaked electromagnetic wave based on a mechanism for leaking the electromagnetic wave to the outside of the housing is an important technique for controlling the electromagnetic wave leakage.

このような漏洩電磁波の強度を評価する技術として、特許文献1に開示された技術がある。この技術は、通電部の位置と形状を測定し、通電部の間隔および長さを求めて電磁波の強度を評価するようにしたものであり、簡便かつ高精度に漏洩電磁波の強度を評価することができるという特徴がある。   As a technique for evaluating the strength of such leakage electromagnetic waves, there is a technique disclosed in Patent Document 1. This technology measures the position and shape of the current-carrying part, calculates the interval and length of the current-carrying part, and evaluates the strength of the electromagnetic wave, and evaluates the strength of the leaked electromagnetic wave easily and with high accuracy. There is a feature that can be.

特開2009−58324号公報JP 2009-58324 A

特許文献1に開示された技術では、通電部を以下のようにして求めている。すなわち、図1に示すように金属板A1の表面に複数の導線3を接続し、この金属板A1に金属板B2を重ねて板間に高周波電源4からの高周波電流を印加する。金属板A1の表面の電位分布を任意の導線を電位の基準(以下、Groundまたはグランドとも称する)として電位差を測定する。導線間の電位差は、オシロスコープ等の電位差測定器5で測定するが、導線からの信号は必要があればアンプで増幅あるいは、フィルターによって不要な信号を除去して電位差測定器5に入力される。通電部は、測定された電位分布に基づいて求められる。   In the technique disclosed in Patent Document 1, the energization unit is obtained as follows. That is, as shown in FIG. 1, a plurality of conducting wires 3 are connected to the surface of a metal plate A1, a metal plate B2 is overlapped on the metal plate A1, and a high frequency current from a high frequency power source 4 is applied between the plates. The potential difference of the potential distribution on the surface of the metal plate A1 is measured using an arbitrary lead as a potential reference (hereinafter also referred to as Ground or ground). The potential difference between the conductors is measured by a potential difference measuring device 5 such as an oscilloscope. If necessary, a signal from the conductor is amplified by an amplifier or unnecessary signals are removed by a filter and input to the potential difference measuring device 5. The energization unit is obtained based on the measured potential distribution.

特許文献1で示されている実施例では、図2(条件−1)および図3(条件−2)に示すように金属板間の2箇所に高誘電体がはさまれている箇所が異なる系に対し、10kHzの高周波を印加した場合の板表面の電位分布を測定している。高誘電体が挟まれた部分はコンデンサーとなっており、この場合2個のコンデンサーが通電部となっている。   In the Example shown by patent document 1, as shown in FIG. 2 (condition-1) and FIG. 3 (condition-2), the location where the high dielectric material is pinched | interposed into two places between metal plates differs. The potential distribution on the plate surface when a high frequency of 10 kHz is applied to the system is measured. A portion where the high dielectric material is sandwiched is a capacitor, and in this case, two capacitors are energized portions.

そして、図4には、条件−1および条件−2での金属板A1の表面の電位分布を示している。この図に示すように、それぞれの通電部付近で電位分布は極小値を示しており、通電部の位置と電位分布に対応が見られる。   FIG. 4 shows the potential distribution on the surface of the metal plate A1 under conditions-1 and-2. As shown in this figure, the potential distribution shows a minimum value in the vicinity of each energized portion, and a correspondence is seen between the position of the energized portion and the potential distribution.

抵抗、コンデンサー、およびコイルに、それぞれ高周波(交流)電圧を印加した場合には、電流の位相は電圧の位相に対して、それぞれ0、+π/2、−π/2だけ変化する。上述の実施例のように通電部がコンデンサーのみ、あるいは抵抗のみ、コイルのみの場合は、金属板表面の任意の点をGroundとして測定された電位分布は通電部の位置に対応したものとなる。   When a high frequency (alternating current) voltage is applied to each of the resistor, the capacitor, and the coil, the current phase changes by 0, + π / 2, and −π / 2, respectively, with respect to the voltage phase. When the current-carrying part is only a capacitor, only a resistor, or only a coil as in the above-described embodiment, the potential distribution measured with an arbitrary point on the surface of the metal plate as a ground corresponds to the position of the current-carrying part.

しかしながら、抵抗、コンデンサー、およびコイルが混在した系、例えば図5に示すように金属板間に抵抗と高誘電体(コンデンサー)が挟まれて通電部となっている系に高周波電圧を印加したときには、任意の点をGroundとして電位分布を測定した場合,電位分布の極小位置と通電部の位置が一致しないという問題がある。   However, when a high frequency voltage is applied to a system in which a resistor, a capacitor, and a coil are mixed, for example, a system in which a resistor and a high dielectric (capacitor) are sandwiched between metal plates as shown in FIG. When the potential distribution is measured with an arbitrary point as a ground, there is a problem that the minimum position of the potential distribution does not match the position of the energization unit.

本発明では、これら従来技術の問題点に鑑みなされたものであり、通電部の位置を正確に測定できる、通電部の位置測定方法および装置を提供することを課題とする。   The present invention has been made in view of these problems of the prior art, and it is an object of the present invention to provide a position measuring method and apparatus for a current-carrying part that can accurately measure the position of the current-carrying part.

本発明者らは、Groundの位置を工夫することによって上の問題が解決できることを見出し、以下に記載する本発明に想到した。   The present inventors have found that the above problem can be solved by devising the position of Ground, and have arrived at the present invention described below.

[1] 金属板間の隙間を漏洩する電磁波の評価にあたって通電部の位置を測定する通電部の位置測定方法であって、前記金属板間に高周波電流を流し、金属板表面の給電点を電位の基準として電位差測定することによって金属板表面に生ずる電位分布を求め、該電位分布から通電部を決定することを特徴とする通電部の位置測定方法。   [1] A method for measuring a position of a current-carrying unit for measuring an electromagnetic wave leaking through a gap between metal plates, wherein a high-frequency current is passed between the metal plates, and a feeding point on the surface of the metal plate is a potential. A method for measuring the position of a current-carrying part, wherein a potential distribution generated on the surface of a metal plate is obtained by measuring a potential difference as a reference for determining a current-carrying part from the potential distribution.

[2] 上記[1]に記載の通電部の位置測定方法において、前記電位分布を、前記金属板表面に複数の導線を接続して、前記給電点を電位の基準として前記導線との電位差を測定することによって求めることを特徴とする通電部の位置測定方法。   [2] In the method for measuring the position of the energization unit according to [1] above, the potential distribution is obtained by connecting a plurality of conductors to the surface of the metal plate, and calculating a potential difference from the conductors with the feeding point as a potential reference. A method for measuring the position of a current-carrying part, which is obtained by measurement.

[3] 上記[1]または[2]に記載の通電部の位置測定方法において、前記電位分布の極小値を示す位置を通電部と判断することを特徴とする通電部の位置測定方法。   [3] The position measuring method of the energization unit according to the above [1] or [2], wherein the position indicating the minimum value of the potential distribution is determined as the energization unit.

[4] 上記[1]ないし[3]のいずれか1項に記載の通電部の位置測定方法において、前記金属板は、鋼板であることを特徴とする通電部の位置測定方法。   [4] The energization part position measuring method according to any one of [1] to [3], wherein the metal plate is a steel plate.

[5] 金属板間の隙間を漏洩する電磁波の評価にあたって通電部の位置を測定する通電部の位置測定装置であって、前記金属板間に高周波電流を流す高周波電源と、前記高周波電流を前記金属板に印加する給電点と、金属板表面に生ずる電位分布を測定するための導線と、該導線間の電位差を測定する電位差測定器と、前記測定された電位差から通電部を決定する手段と、を備え、前記給電点を電位差測定の電位の基準とすることを特徴とする通電部の位置測定装置。   [5] A position measurement device for a current-carrying unit that measures the position of a current-carrying part in evaluating electromagnetic waves leaking through a gap between metal plates, a high-frequency power source for passing a high-frequency current between the metal plates, A feeding point to be applied to the metal plate, a conductor for measuring a potential distribution generated on the surface of the metal plate, a potential difference measuring device for measuring a potential difference between the conductors, and a means for determining a current-carrying portion from the measured potential difference , And using the feeding point as a potential reference for potential difference measurement.

本発明は、給電点を電位差測定の電位の基準とするようにしたので、通電部に位相特性が異なるものが混在して印加電圧に対する電流の位相の変化量が異なる場合でも、正確な電位分布が得られ、通電部の位置と形状を簡便かつ高精度に特定できる。   In the present invention, since the feeding point is used as a potential reference for potential difference measurement, accurate potential distribution can be obtained even when current-carrying parts having different phase characteristics are mixed and the amount of change in the phase of the current with respect to the applied voltage is different. Thus, the position and shape of the energization part can be specified easily and with high accuracy.

直流電流を印加した場合の電位分布測定方法を示す図である。It is a figure which shows the electric potential distribution measuring method at the time of applying a direct current. 通電部(高誘電体)の位置(条件−1)を示す図である。It is a figure which shows the position (condition-1) of an electricity supply part (high dielectric material). 通電部(高誘電体)の位置(条件−2)を示す図である。It is a figure which shows the position (condition-2) of an electricity supply part (high dielectric material). 高周波電流による電位分布測定の結果を示す図である。It is a figure which shows the result of the electric potential distribution measurement by a high frequency current. 通電部(高誘電体と抵抗)の位置を示す図である。It is a figure which shows the position of an electricity supply part (a high dielectric material and resistance). 高周波電流による電位分布測定の結果を示す図である。It is a figure which shows the result of the electric potential distribution measurement by a high frequency current.

以下に本発明を実施するための形態を添付図面を参照して説明する。図1に示すように、金属板A1の電位分布を測定する場合、電源からの導線が板表面に接続されている点を給電点7とする。通電部に位相特性が異なるものが混在して印加電圧に対する電流の位相の変化量が異なる場合には、給電点7をGround6として金属板A1表面の電位分布を測定すると、通電部の位置に対応した電位分布が得られることが分かった。   EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated with reference to an accompanying drawing. As shown in FIG. 1, when measuring the potential distribution of the metal plate A <b> 1, a point where a conducting wire from a power source is connected to the plate surface is a feeding point 7. When current carrying parts with different phase characteristics are mixed and the amount of change in the phase of the current with respect to the applied voltage is different, measuring the potential distribution on the surface of the metal plate A1 with the feeding point 7 as Ground 6 corresponds to the position of the conducting part. It was found that the obtained potential distribution was obtained.

図5は、金属板E及びF間に抵抗と高誘電体(コンデンサー)を挟んで、通電部とした例を示している。図中の給電点7をGround6として、金属板間に0.3Hz〜10kHzの高周波を印加して金属板表面の電位分布を測定した。図6は、上記高周波電流による電位分布測定の結果を示す図である。   FIG. 5 shows an example in which a resistor and a high dielectric (capacitor) are sandwiched between metal plates E and F to form a current-carrying part. With the feeding point 7 in the figure as Ground 6, a high frequency of 0.3 Hz to 10 kHz was applied between the metal plates, and the potential distribution on the metal plate surface was measured. FIG. 6 is a diagram showing the results of potential distribution measurement using the high-frequency current.

抵抗で構成される通電部では、低い周波数でも高い周波数でも電位分布は極小値を示しており、この通電部を特定できることが分かる。一方、コンデンサーで構成される通電部では、印加電圧の周波数が低い場合、インピーダンスが高く通電部とならないが、周波数が高い場合インピーダンスが低くなり通電部となる。図に示すように、印加電圧の周波数が0.3Hz の場合、コンデンサー部の電位は極小値を示していないが、周波数が高くなるにしたがって極小値となり通電部となっていることが分かる。   In the current-carrying part composed of resistors, the potential distribution shows a minimum value at both low and high frequencies, and it can be seen that this current-carrying part can be specified. On the other hand, when the frequency of the applied voltage is low, the current-carrying part composed of a capacitor has a high impedance and does not become a current-carrying part, but when the frequency is high, the impedance becomes low and becomes a current-carrying part. As shown in the figure, when the frequency of the applied voltage is 0.3 Hz, the potential of the capacitor portion does not show a minimum value, but it becomes a minimum value as the frequency increases, and it becomes an energized portion.

給電点以外の点をGroundとした場合には、このような電位分布は得られず、印加電圧に対する電流の位相の変化量が通電部によって異なる場合、給電点をGroundとすると、通電部に対応した電位分布が得られることが確認された。   If the point other than the feed point is set to Ground, such a potential distribution cannot be obtained, and if the amount of change in the phase of the current with respect to the applied voltage varies depending on the energized part, it corresponds to the energized part if the feed point is set to Ground. It was confirmed that the obtained potential distribution was obtained.

1 金属板A
2 金属板B
3 導線
4 高周波電源
5 電位差測定器
6 Ground
7 給電点
1 Metal plate A
2 Metal plate B
3 Conductor 4 High frequency power supply 5 Potential difference measuring device 6 Ground
7 Feeding point

Claims (5)

金属板間の隙間を漏洩する電磁波の評価にあたって通電部の位置を測定する通電部の位置測定方法であって、
前記金属板間に高周波電流を流し、金属板表面の給電点を電位の基準として電位差測定することによって金属板表面に生ずる電位分布を求め、該電位分布から通電部を決定することを特徴とする通電部の位置測定方法。
A method for measuring the position of a current-carrying part for measuring the position of a current-carrying part in evaluating electromagnetic waves leaking through a gap between metal plates,
A high-frequency current is allowed to flow between the metal plates, and a potential distribution generated on the surface of the metal plate is obtained by measuring a potential difference using a feeding point on the surface of the metal plate as a potential reference, and a current-carrying portion is determined from the potential distribution. Method for measuring the position of the current-carrying part.
請求項1に記載の通電部の位置測定方法において、
前記電位分布を、前記金属板表面に複数の導線を接続して、前記給電点を電位の基準として前記導線との電位差を測定することによって求めることを特徴とする通電部の位置測定方法。
In the method for measuring the position of the energization unit according to claim 1,
A method for measuring a position of an energization unit, wherein the potential distribution is obtained by connecting a plurality of conductors to the surface of the metal plate and measuring a potential difference from the conductors with the feeding point as a potential reference.
請求項1または請求項2に記載の通電部の位置測定方法において、
前記電位分布の極小値を示す位置を通電部と判断することを特徴とする通電部の位置測定方法。
In the method of measuring the position of the energization unit according to claim 1 or 2,
A position measuring method for a current-carrying part, wherein a position indicating a minimum value of the potential distribution is determined as a current-carrying part.
請求項1ないし請求項3のいずれか1項に記載の通電部の位置測定方法において、
前記金属板は、鋼板であることを特徴とする通電部の位置測定方法。
In the method for measuring the position of the energization unit according to any one of claims 1 to 3,
The metal plate is a steel plate.
金属板間の隙間を漏洩する電磁波の評価にあたって通電部の位置を測定する通電部の位置測定装置であって、
前記金属板間に高周波電流を流す高周波電源と、
前記高周波電流を前記金属板に印加する給電点と、
金属板表面に生ずる電位分布を測定するための導線と、
該導線間の電位差を測定する電位差測定器と、
前記測定された電位差から通電部を決定する手段と、
を備え、
前記給電点を電位差測定の電位の基準とすることを特徴とする通電部の位置測定装置。
A position measuring device for a current-carrying part that measures the position of a current-carrying part in evaluating electromagnetic waves leaking through a gap between metal plates,
A high frequency power source for passing a high frequency current between the metal plates;
A feeding point for applying the high-frequency current to the metal plate;
A conductor for measuring the potential distribution generated on the surface of the metal plate;
A potentiometer that measures the potential difference between the conductors;
Means for determining a current-carrying part from the measured potential difference;
With
An apparatus for measuring a position of a current-carrying unit, wherein the feeding point is used as a reference for potential of potential difference measurement.
JP2010132570A 2010-06-10 2010-06-10 Method and apparatus for measuring position of energization unit Expired - Fee Related JP5456591B2 (en)

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JPH04178571A (en) * 1990-11-14 1992-06-25 Hitachi Ltd Inspecting method for printed board
JPH0915080A (en) * 1995-06-26 1997-01-17 Sakata Denki Kk Water leak position detector
JP2001330531A (en) * 2000-05-24 2001-11-30 Taisei Corp Water leakage detection system
JP2009058324A (en) * 2007-08-31 2009-03-19 Jfe Steel Kk Position measuring method and device for current-carrying part

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04178571A (en) * 1990-11-14 1992-06-25 Hitachi Ltd Inspecting method for printed board
JPH0915080A (en) * 1995-06-26 1997-01-17 Sakata Denki Kk Water leak position detector
JP2001330531A (en) * 2000-05-24 2001-11-30 Taisei Corp Water leakage detection system
JP2009058324A (en) * 2007-08-31 2009-03-19 Jfe Steel Kk Position measuring method and device for current-carrying part

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