JP2011249471A - Wiring board, connection board, manufacturing apparatus and manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board, a connection board, a manufacturing apparatus and a manufacturing method, reducing the occurrence of a solder bridge.SOLUTION: The wiring board in an embodiment has a through hole 2 formed on a connection terminal portion 7. The connection terminal portion 7 has lead wires 5 on an insulation layer 4 in an exposed state. The through hole 2 is formed along the lead wires 5 in a manner not to stride over the mutually adjacent lead wires 5. Further, a connection board manufacturing apparatus 20 includes: a backup plate 21; a heater tool 22 for crimping the connection terminal portion 7 of a first wiring board 3 to a connection terminal portion 13 of a second wiring board 9 mounted on the backup plate 21, by the intermediary of solder 8. The heater tool 20 has a formed slit S to enable removal of the surplus of the solder 8 at the crimping, by the capillary phenomenon.

Description

  The present invention relates to connection of a wiring board, and relates to a wiring board, a connection board, a manufacturing apparatus, and a manufacturing method.

  In recent years, various electronic devices have been reduced in size and weight. In connection with this, also in connection of a flexible wiring board and another wiring board, it is changing from what was connected using the connector to the structure which solders directly (for example, refer patent document 1).

  As shown in FIG. 6, the connection substrate 101 described in Patent Document 1 has a connection terminal 102 facing the first wiring substrate 105 in which a plurality of conductive wires 104 are provided on an insulating layer 103 via solder 106. A second wiring board 110 having a connection terminal 107 in which a through hole H is formed in alignment with the plurality of conductive wires 109 on the insulating layer 108 is provided on the surface, and the heater tool 111 is connected to the first wiring board 105. The structure was such that the excess solder 106 was caused to flow into the through hole H by being crimped to the insulating layer 103.

JP 2003-86913 A

  However, in the connection substrate 101 described in Patent Document 1, when the second wiring substrate 110 provided with the through hole H is not sufficiently heated, or when the inside of the through hole H is oxidized, the molten solder 106 is used. May not be sufficiently wet, and the excess solder 106 may not flow into the through hole H. As a result, surplus solder 106 may flow out of the connecting portion and connect between adjacent conductors 104 and 109 (a solder bridge may be formed).

  Therefore, an object of the present invention is to provide a wiring board, a connection board, a manufacturing apparatus, and a manufacturing method that reduce the occurrence of solder bridges.

  In order to achieve the above object, a wiring board according to the present invention is a wiring board in which a through hole is formed in a connection terminal portion, and the connection terminal portion is provided in a state where a conductive wire is exposed on an insulating layer. The through hole is formed along the conductive wire so as not to cross between the adjacent conductive wires.

  The connection board manufacturing apparatus of the present invention includes a backup plate, and a heater tool for crimping the connection terminal part of the first wiring board to the connection terminal part of the second wiring board placed on the backup plate via solder. The heater tool is characterized in that a slit capable of removing excess solder by capillary action is formed during the crimping.

  Moreover, the manufacturing method of the connection board of the present invention is a first wiring board in which a through hole is formed in the connection terminal portion, and the connection terminal portion includes a plurality of conductive wires laminated on an insulating layer, The through hole is a connection for crimping a connection terminal of a second wiring board placed on a backup plate to the first wiring board formed along the conducting wire without crossing the adjacent conducting wire via solder. A method of manufacturing a board, comprising: filling the through hole of the first wiring board with the solder; heating and melting the solder in the through hole; and the first on the backup plate. And a step of crimping the connection surface of the two wiring boards and the connection surface of the first wiring board with a heater tool.

  The connection board of the present invention is connected by the method for manufacturing a connection board according to claim 3 or claim 4.

  The present invention provides a wiring board, a connection board, a manufacturing apparatus, and a manufacturing method that reduce the occurrence of solder bridges.

The top view of the 1st wiring board concerning the embodiment of the present invention. Sectional drawing of the 1st wiring board which follows the AA line of FIG. Sectional drawing of the connection board which concerns on embodiment of this invention. Schematic of the manufacturing apparatus of the connection board which concerns on embodiment of this invention. Process sectional drawing which shows the manufacturing method of the connection board which concerns on embodiment of this invention. Sectional drawing which shows the conventional wiring board.

  Hereinafter, a wiring board, a connection board, a manufacturing apparatus, and a manufacturing method for reducing the occurrence of solder bridges according to embodiments of the present invention will be described in detail with reference to the drawings.

  First, a wiring board according to an embodiment of the present invention will be described with reference to FIGS.

  The wiring board in this embodiment is the first wiring board 3, and the connection terminal portion 7 of the first wiring board 3 is provided with the through hole 2.

  The first wiring board 3 is formed by laminating the conductive wire 5 and the solder resist 6 in this order on the insulating layer 4 except for the connection terminal portion 7, and in this embodiment, a flexible wiring board is used. I can't.

  The insulating layer 4 is made of a heat resistant resin containing polyimide, for example. Moreover, the conducting wire 5 is provided with two or more, for example, is formed with electroconductive substances, such as copper foil.

  The connection terminal portion 7 is a portion where the conducting wire 5 provided on the insulating layer 4 is exposed and provided, and a plurality of through holes 2 are formed along the direction in which the conducting wire 5 is provided. Moreover, the conducting wire 5 is provided with two or more, and let the surface where the conducting wire 5 is exposed be the connection surface B1.

  The through-hole 2 has a diameter that is slightly larger than the width of the conducting wire 5 and has a size that does not extend between adjacent conducting wires 5, and is formed using, for example, a drill or a laser. In addition, although the diameter of the through-hole 2 of the embodiment of the present invention is formed slightly larger than the width of the conducting wire 5, it may be any size as long as it does not cross the adjacent conducting wires 5. Absent.

  Further, the through hole 2 is provided with a certain distance from the plurality of through holes 2 formed in the adjacent conducting wires 5 in order to prevent the occurrence of solder bridges.

  Next, the connection substrate 1 according to the embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 3, the connection substrate 1 in the present embodiment has a structure in which a first wiring substrate 3 provided with a through hole 2 and a second wiring substrate 9 are provided via solder 8.

  The second wiring board 9 is formed by laminating the conductive wire 11 and the solder resist 12 on the insulating layer 10 in this order. In this embodiment, the printed wiring board is used, but the present invention is not limited to this.

  The conducting wire 11 is formed of a conductive material such as copper foil, for example, and is provided in alignment with the conducting wire 5 of the first wiring board 3. Further, the solder resist 12 is provided except for the connection surface B <b> 2 of the connection terminal portion 13.

  The connection terminal portion 13 is in a state in which the conducting wire 11 provided on the insulating layer 10 is exposed, and a plurality of conducting wires 11 are provided. And the surface where the conducting wire 11 is exposed is defined as a connection surface B2.

  Next, a connection board manufacturing apparatus will be described with reference to FIG.

  As shown in FIG. 4, the connection board manufacturing apparatus 20 includes a backup plate 21 and a heater tool 22.

  The backup plate 21 plays a role of supporting the second wiring board 9 when connecting the connection surfaces B1 and B2 of the first wiring board 3 and the second wiring board 9 by pressure bonding.

  The heater tool 22 is crimped from the back surface of the connection surface B1 of the first wiring board 3 toward the backup plate 21 side, and is provided with a slit S for removing excess solder 8 from the plurality of through holes 2 by capillary action. ing.

  The shape of the slit S of the heater tool 22 is provided so as to be perpendicular to the direction in which the conductive wire 5 is provided, but may be, for example, a parallel direction, an oblique direction, or a lattice shape, and the excess solder 8 Any slit S may be used as long as it can be removed.

  The depth of the slit S of the heater tool 22 is adjusted to an appropriate depth so as not to remove the solder 8 excessively. The solder 8 that has entered the slit S of the heater tool 22 Can be blown, blown off and used again.

  Next, a method for manufacturing the connection substrate will be described with reference to FIG.

  First, as shown in FIG. 5A, the receiving jig 23 and the first wiring board 3 are placed so that they contact each other, and the solder 8 is filled into the through holes 2.

  The receiving jig 23 is formed with a gap 24 in alignment with the position where the through hole 2 of the connection terminal portion 7 of the first wiring board 3 is provided, and fills the through hole 2 with the solder 8. At this time, the connection terminal portion 7 is supported.

  The solder 8 is filled in the through hole 2 by, for example, solder paste printing. Specifically, the paste-like solder 8 is provided on the insulating layer 4, and the squeegee 25 is moved to fill the through-hole 2 with the solder 8.

  At this time, the supply amount of the solder 8 is supplied so as to be larger than the amount that can be filled in the through hole 2, and is provided so as to protrude slightly from the connection surface B <b> 1 of the first wiring substrate 3.

  Next, as shown in FIG. 5B, the first wiring board 3 provided with the solder 8 is put into a heating device 26 and heated to melt the solder 8. As a result, the melted solder 8 spreads wet on the conductive wire 5 on the connection surface B1.

  Then, as shown in FIG. 5C, the second wiring board 9 is installed on the backup plate 21, and the connection surface B1 of the first wiring board 3 and the connection surface B2 of the second wiring board 9 are positioned. The heater tool 22 pressure-bonds them from the back surface of the connection surface B1 toward the backup plate 21 side.

  At this time, surplus solder 8 enters the slits of the heater tool 22 and is removed, so that crimping can be performed while preventing solder bridges.

  As described above, according to the present embodiment, the first wiring substrate 3 in which a plurality of through holes 2 are formed at regular intervals along the direction in which the conductive wires 5 are provided is prepared, and the solder 8 is provided in the through holes 2. And the first wiring board 3 and the second wiring board 9 can be crimped while removing the excess solder 8 using the heater tool 22 provided with the slits S of the wiring board manufacturing apparatus 20. . As a result, connection can be made while preventing the occurrence of solder bridges.

  Furthermore, since the solder 8 can be supplied without using a mask when the solder 8 is provided by using the first wiring board 3 provided with the through hole 2, it is possible to provide the solder 8 more. It becomes easy and the connection board | substrate 1 can be manufactured efficiently.

DESCRIPTION OF SYMBOLS 1,101 ... Connection board | substrate 2 ... Through-hole 3,105 ... 1st wiring board 4, 10, 103,108 ... Insulating layer 5, 11, 104, 109 ... Conductor 6, 12 ... Solder resist 7, 13, 102, 107 ... connection terminal portion 8, 106 ... solder 9, 110 ... second wiring board 20 ... manufacturing device 21 ... backup plate 22, 111 ... heater tool 23 ... receiving jig 24 ... gap 25 ... squeegee 26 ... heating device B1, B2 ... connection Surface S ... Slit H ... Through hole

Claims (5)

A wiring board in which a through hole is formed in the connection terminal portion,
The connection terminal portion is provided in a state where the conductive wire is exposed on the insulating layer,
The wiring board, wherein the through hole is formed along the conductive wire so as not to straddle between the adjacent conductive wires. A backup plate,
A heater tool for crimping the connection terminal part of the first wiring board to the connection terminal part of the second wiring board placed on the backup plate via solder;
A connection board manufacturing apparatus including:
The connection tool manufacturing apparatus according to claim 1, wherein the heater tool is formed with a slit capable of removing an excess of the solder by a capillary phenomenon during the crimping. A first wiring board having a through hole formed in a connection terminal portion, wherein the connection terminal portion has a plurality of conductive wires stacked on an insulating layer, and the through hole crosses the adjacent conductive wires. A method of manufacturing a connection board, wherein the connection terminal of the second wiring board placed on the backup plate is pressure-bonded via solder without connecting the first wiring board formed along the conducting wire.
Filling the solder into the through hole of the first wiring board;
Heating and melting the solder in the through hole;
Crimping the connection surface of the second wiring board and the connection surface of the first wiring board on the backup plate with a heater tool;
The manufacturing method of the connection board | substrate characterized by including.   The method of manufacturing a connection board, further comprising the step of removing the excess solder with the heater tool.   A connection substrate connected by the method for manufacturing a connection substrate according to claim 3.

Images