JP2011249144A - Light-emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting module such that even if a light-emitting panel deforms, an arch-shaped wire bonding does not come into contact with a case portion, and is hardly damaged.SOLUTION: A light-emitting module 1 comprises: a flat plate type light-emitting panel 2 which has a light-emitting portion 22 and an electrode terminal 23 formed on a substrate 21; a wiring board 3 which supplies electric power to a light-emitting portion 22; and a case portion 4 which houses the light-emitting panel 2 and wiring board 3, and is configured such that the electrode terminal 23 and wiring board 3 are electrically connected by the arch-shaped wire bonding 7, and an interval X between a top portion 7a of the wire bonding 7 and an inner surface of the case portion 4 which faces the top portion 7a is larger than an interval Y between a side face of the light-emitting panel 2 and an inner side face 43 of the case portion 4. Consequently, even if the light-emitting panel 2 deforms, the wire bonding 7 does not contact the case portion 4 and is hardly damaged.

Description

  The present invention relates to a light emitting module using a light emitting panel.

  In an electroluminescence (EL) element, a light emitting part in which a light emitting layer is sandwiched between an anode and a cathode is formed on a transparent substrate, and when a voltage is applied between the electrodes, electrons injected as carriers into the light emitting layer Then, light is emitted by excitons generated by the recombination of holes.

  EL elements are roughly classified into an organic EL element using an organic substance as a fluorescent material of a light emitting layer and an inorganic EL element using an inorganic substance. In particular, an organic EL element can emit light with high luminance at a low voltage, and various emission colors can be obtained depending on the type of fluorescent material, and since it can be easily manufactured as a flat light emitting panel, It is attracting attention for use in lighting equipment.

  A light emitting panel using an organic EL element is housed in a predetermined case portion together with a wiring board and a power circuit board for supplying power to the light emitting panel, and is used as a light emitting module. In assembling the light emitting module, in order to electrically connect the light emitting panel and the wiring board, for example, a method using a conductive adhesive or a conductive tape, a method of pressing and pressing an electrode terminal, etc. are known. (For example, refer to Patent Document 1).

  However, many organic materials used for the light emitting portion of the organic EL element have low heat resistance, and may be deteriorated at a temperature of about 80 ° C., for example. Therefore, the assembly of the light emitting module using the organic EL element as the light emitting panel needs to be performed by a low temperature process. However, the method using the conductive tape described above generally requires heating at 150 ° C. or higher for a short time when the conductive tape is bonded to the electrode terminal of the light emitting panel. Therefore, in order to use this method, it is necessary to provide the electrode terminal at a position away from the light emitting part so that the light emitting part of the light emitting panel is not affected by heat, and the design freedom of the light emitting module is limited. There is.

  In addition, when a conductive adhesive that can be bonded at a low temperature is used, the linear expansion coefficient of the constituent material of a general wiring board (for example, FR-4) or a lead frame and a glass substrate constituting the light emitting panel Due to this difference, a large thermal stress accompanying a change in temperature may occur, and the bonded portion may be damaged. Further, in the method of pressing the electrode terminal, since the electrode terminal is mechanically sandwiched, the module needs to have a certain thickness, and is not necessarily suitable for a light emitting module using an organic EL element that is desired to be thin. Not.

Therefore, a method of using a wire bonding technique widely used in the semiconductor field in the assembly process of the light emitting module can be considered. According to this method, it is possible to connect at a normal temperature using a wire (wire) such as aluminum, so that an electrode terminal can be formed in the vicinity of the light emitting portion. In addition, when wire bonding is performed, so-called wire loops are provided so that the wires are arched, so that even if they are deformed due to the difference in the coefficient of linear expansion between the wiring board and the glass substrate, damage to the connection parts Can be suppressed.
JP 2007-287344 A

  However, in a light emitting module in which a light emitting panel, a wiring board, etc. are housed in a case part, when the light emitting panel is deformed, the top of the arched wire bonding contacts the case part and the wire is damaged. There is. In particular, light-emitting modules using organic EL elements are required to be large and thin, and as a result, the deformation width of the light-emitting panel increases and the top of wire bonding comes into contact with the case. Since it becomes easy, it may happen that a wire breaks.

  The present invention has been made in view of the above problems, and even when the light emitting panel is deformed, arched wire bonding for electrically connecting the electrode terminals of the light emitting panel and the wiring board is performed. An object of the present invention is to provide a light emitting module that does not come into contact with a case part and is not easily damaged.

  In order to solve the above problems, a light emitting module according to the present invention includes a flat light emitting panel having a light emitting part and an electrode terminal formed on a substrate, a wiring board for supplying power to the light emitting part, the light emitting panel, A light emitting module, wherein the electrode terminal and the wiring board are electrically connected by arch-shaped wire bonding, and a top portion of the arch-shaped wire bonding; An interval between the inner surface of the case portion and the inner surface of the case portion which faces the inner surface of the case portion is configured to be larger than an interval between the side end surface of the light emitting panel and the inner surface of the case portion.

  Preferably, the light emitting panel is held in the case portion without being fixed.

  Preferably, a portion facing the wire bonding in the inner surface of the case portion is thinner than other portions.

  According to the present invention, when the light emitting panel is deformed, the side end surface of the light emitting panel is in contact with the side surface of the case portion, and this functions as a stopper. Furthermore, since the case portion is deformed following the deformation of the light emitting panel, a space between the top portion of the wire bonding and the case portion facing the wire bonding is ensured. Therefore, even when the light emitting panel is deformed, the arched wire bonding is difficult to come into contact with the case portion, and the wire damage can be suppressed.

The disassembled perspective view of the light emitting module which concerns on the 1st Embodiment of this invention. (A) is a top view of a light-emitting panel used in the light-emitting module, and (b) is a top view in a configuration in which wire bonding is provided on the light-emitting panel. (A) is the A-A 'line cross section of FIG.2 (b), Comprising: The partial sectional view of the same light emission module, (b) is a sectional side view when the said light emission panel deform | transforms. (A) is a partial sectional side view of the light emitting module in the reference example, and (b) is a sectional side view when the light emitting panel in the reference example is deformed. (A) is a front view of the light emitting module which concerns on the modification of the said embodiment, (b) is the sectional view on the B-B 'line of (a), (c) is the sectional view on the C-C' line of (a).

  A light emitting module according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the light emitting module 1 of the present embodiment includes a flat light emitting panel 2 having a light emitting unit 22 and electrode terminals 23 formed on a substrate 21, and a wiring substrate 3 that supplies power to the light emitting unit 22. And a case portion 4 that accommodates the light emitting panel 2, the wiring board 3, and the like. A copper foil 5 for sealing is bonded and fixed on the light emitting panel 2, and the wiring board 3 is disposed on the copper foil 5. A power circuit board 6 is disposed on the copper foil 5. In the present embodiment, a transparent electrode (not shown) is formed on the substrate 21, and a description will be given based on a so-called bottom emission type configuration in which light emitted from the light emitting unit 22 is extracted from the substrate 21 side. However, the configuration is not necessarily limited to this, and a so-called top emission type configuration may be used.

  As shown in FIG. 2A, the light emitting panel 2 is provided with a transparent electrode (not shown), a light emitting unit 22, and an electrode terminal 23 on a substrate 21. The electrode terminal 23 includes an auxiliary electrode 23a and an external electrode 23b. The auxiliary electrode 23a is provided as a transparent electrode in order to increase power supply efficiency when a material having a relatively low electrical conductivity such as ITO (indium tin oxide: indium tin oxide) is used. The external electrode 23 b is electrically connected to the electrode layer formed in the light emitting unit 22.

  The substrate 21 is preferably made of a material that hardly causes elution of alkali ions, such as alkali-free glass, and does not damage the organic material constituting the light-emitting portion 22. Since the substrate 21 is a structural main component of the light emitting panel 2, the linear expansion coefficient of the material used greatly affects the deformation of the light emitting panel 2.

On the substrate 21, an anode layer (not shown) for injecting holes into the light emitting layer of the light emitting unit 22 is formed. For the anode layer, an electrode material made of a metal, an alloy, a conductive compound or a mixture thereof having a high work function is used, and preferably, a work function having a work function of 4 eV or more is used. For example, a light-transmitting conductive material such as ITO (indium tin oxide: indium tin oxide), SnO ₂ (tin oxide), or ZnO (zinc oxide) is preferably used. In particular, the ITO is widely used, and in the present embodiment, an example using the ITO is taken as an example. The anode layer is formed by depositing and patterning ITO on the substrate 21 by a method such as a vacuum deposition method or a sputtering method.

  By the way, since ITO has a relatively low electrical conductivity as a conductive material, particularly in the light-emitting panel 2 having a large area of the light-emitting portion 22, a voltage drop occurs as the distance from the feeding point increases. There are things you can do. Therefore, in the present embodiment, a metal pattern for preventing a voltage drop of ITO, that is, the auxiliary electrode 23a is formed.

  The auxiliary electrode 23a is formed by a method such as sputtering so that a portion corresponding to a portion where the light emitting layer is formed is opened so as not to prevent light emission to the substrate 21 side. Here, the auxiliary electrode 23a is patterned so that the periphery of the opening is in contact with the transparent electrode made of ITO, and a part of the auxiliary electrode 23a extends to become an electrode terminal. As the type of metal constituting the auxiliary electrode 23a, a metal that has good adhesion and conductivity to ITO, little deterioration due to humidity and heat, and that can be ultrasonically bonded is preferable. For example, a three-layer sputtering film of molybdenum, aluminum, molybdenum, an alloy film of silver palladium copper, or the like is used.

  The external electrode 23b is formed on the substrate 21, and is formed by patterning on the substrate 21 so as not to contact the transparent electrode and the auxiliary electrode 23a. The auxiliary electrode 23a and the external electrode 23b are simultaneously formed by the same process. After these patterning, the light emitting part 22 having a light emitting layer or the like is formed on the transparent electrode.

  Examples of the light emitting layer of the light emitting unit 22 include anthracene, naphthalene, pyrene, tetracene, coronene, perylene, phthaloperylene, naphthaloperylene, diphenylbutadiene, tetraphenylbutadiene, coumarin, oxadiazole, bisbenzoxazoline, bisstyryl, cyclopentadiene, Quinoline metal complex, tris (8-hydroxyquinolinate) aluminum complex, tris (4-methyl-8-quinolinato) aluminum complex, tris (5-phenyl-8-quinolinato) aluminum complex, aminoquinoline metal complex, benzoquinoline metal Complex, tri- (p-terphenyl-4-yl) amine, 1-aryl-2,5-di (2-thienyl) pyrrole derivative, pyran, quinacridone, rubrene, distylbenzene derivative, distyryl Ren derivatives, and compounds having a part of the basis of the molecular structure consisting of luminescent compounds, polymeric materials, mixed material of various fluorescent dyes are used. Although an example in which an organic material is used for the light emitting layer is shown here, an inorganic material may be used. The light emitting layer is formed by, for example, forming and patterning by a vacuum deposition method. Note that the light-emitting layer may be formed by stacking a plurality of different materials, and a buffer layer for adjusting a potential may be interposed between the plurality of layers. Further, a hole injection / transport layer (not shown) that promotes a hole injection effect from the anode layer to the light emitting layer may be provided between the anode layer and the light emitting layer. Furthermore, an electron injection / transport layer (not shown) that promotes an electron injection effect from the cathode layer to the light emitting layer may be provided between the light emitting layer and the cathode layer.

The cathode layer (not shown) of the light emitting panel 2 is an electrode for injecting electrons into the light emitting unit 22 and is formed on the surface opposite to the light extraction side. For the cathode layer, an electrode material made of a metal, an alloy, a conductive compound or a mixture thereof having a low work function is used, and preferably, a work function having a work function of 5 eV or less is used. In particular, a reflective conductive material such as lithium, aluminum, an aluminum-lithium alloy, a magnesium-silver mixture, an Al / Al ₂ O ₃ mixture, or an Al / LiF mixture is preferable. The cathode layer is also formed by the same method as the anode layer. At this time, a part of the cathode layer is patterned so as to be electrically connected to the external electrode 23b. The thickness at the time of film formation is preferably 300 nm or more as a thickness that exhibits sufficient conductivity and can withstand damage of ultrasonic bonding. Note that the top emission type light emitting panel 2 is formed of a light-transmitting conductive material such as ITO.

  As shown in FIG. 2B, the copper foil 5 is bonded and fixed on the substrate 21 so as to cover the light emitting portion 22 and the like and to expose each electrode terminal 23. The copper foil 5 having no pinhole and having a high sealing ability is preferably used. In the vicinity of each electrode terminal 23 on the copper foil 5, a pair of wiring boards 3 are arranged and bonded and fixed. A power circuit board 6 is disposed on the copper foil 5 between the pair of wiring boards 3.

  The wiring board 3 is formed by forming a wiring circuit for individually connecting each electrode terminal 23 and the power circuit board 6 to a general-purpose printed wiring board or the like. Preferably, a glass fiber board in which an epoxy resin or the like is impregnated into a glass fiber cloth and cured (for example, FR-4 (FLAM Regentant Type 4)) is used as a base material having both flame retardancy and low electrical conductivity. . Moreover, the gold plating is given to the connection point of the both ends of each wiring circuit. The wiring board 3 is bonded onto the copper foil 5 with an acrylic double-sided adhesive tape containing a core material having excellent heat resistance, moisture resistance and stress relaxation properties. In addition, although the stress relaxation performance is so high that the thickness of the said core material is thick, the grade which does not interfere with thickness reduction of an apparatus is good, for example, about 100 micrometers is desirable.

  The power supply circuit board 6 includes a rectifier circuit and an electrolytic capacitor for rectifying the AC power supply, a voltage conversion circuit for converting these output voltages to a voltage to be supplied to the light emitting panel 2, an inverting circuit for switching a current to be supplied to the light emitting panel 2, etc. A voltage / current control circuit for controlling the voltage and current of the light emitting panel 2 such as a drive IC and a microcomputer is provided. The power circuit board 6 is also fixed to the light-emitting panel 2 via the copper foil 5 similarly to the wiring board 3, but through heat insulation or the like so that the heat of the circuit does not affect the light-emitting portion 22 of the light-emitting panel 2. It is desirable to be partially bonded. In the present embodiment, the wiring board 4 and the power circuit board 6 are configured as different ones, but they may be integrated by configuring a power circuit on the wiring board 4, for example.

  The electrode terminals 23 and the wiring board 3 are connected by bonding wires 7. A pure aluminum wire is preferably used for the wire 7. This pure aluminum wire can bond the gold plating on the wiring board 3 and the metal thin film constituting the electrode terminal 23 in a short time at room temperature by ultrasonic bonding. The diameter of the wire 7 is determined in consideration of the current consumption and material of the light emitting panel 2. For example, when the consumption current is 1 A, a 100 μm wire diameter with a fusing current of 2 A is used in consideration of a safety factor of 50%. In addition to aluminum, copper or gold wire may also be used. However, copper needs to be bonded in an inert atmosphere, and gold requires heating to a certain degree of 200 ° C. or less.

  The case portion 4 is not particularly limited as long as it can accommodate the light emitting panel 2 and the like, but in the present embodiment, the front case portion 41 disposed on the light emitting surface side of the light emitting panel 2 and the back case portion 42 disposed on the back surface side. Is shown (see FIG. 1 again). In addition, the shape of the light emission panel 2 is not restricted to the elongate shape shown in figure, Arbitrary shapes according to the use of the light emission module 1 are used, and the case part 4 is formed in the shape corresponding to the shape of the light emission panel 2. FIG. As a constituent material of the case portion 4, for example, a plastic material such as ABS resin, acrylic resin, or polystyrene resin, or a metal material such as aluminum is used.

  The resin material is easy to mold and the material unit price is low. In addition, the ABS resin is easily colored, the acrylic resin is easy to process a transparent case, and the polystyrene resin can improve the durability of the case portion 4. On the other hand, aluminum has better heat dissipation than the resin material, but the material unit price is high. When a resin material is used as the material of the case portion 4, for example, in order to maintain the structural function of a module having a panel size of 90 × 100 mm square, the minimum thickness of the case portion 4 is set to 1.0 mm or more. There is a need. On the other hand, if aluminum is used as the material of the case portion 4, the minimum thickness can be reduced to about 0.2 mm in the same case. The linear expansion coefficient of each material is 23 ppm / K for aluminum, 80 ppm / K for ABS resin, and 80 ppm / K for acrylic resin.

  The front case portion 41 has an internal space that can be accommodated in a state where the light emitting panel 2 and the wiring board 3 are stacked, and a substantially central portion of the surface facing the light emitting surface of the light emitting panel 2 is open or light-transmitting. It is formed in a box shape having properties. Side surfaces 43 are erected on four sides of the bottom surface of the front case portion 41, and these side surfaces 43 are formed at a height corresponding to the thickness of the light emitting panel 2, the wiring board 3, and the like. As the back case part 42, a plate-like member provided on the back side of the light emitting panel 2 is used. The front case part 41 and the rear case part 42 are combined and fixed by screwing or by engaging engagement parts (not shown) formed with each other.

  The front case portion 41 and the rear case portion 42 are configured to hold the light emitting panel 2 and the like without being fixed by an adhesive or the like by sandwiching the light emitting panel 2 and the wiring board 3 and the like. By so doing, a slight gap (play) is formed between the case portion 4 and the light emitting panel 2, so that even when the light emitting panel 2 is thermally denatured, a thermal stress that becomes a load on the wire 7 is generated. It becomes difficult to do. In addition, for example, a buffer member or a filler may be appropriately provided so that the case unit 4 and the light emitting panel 2 are not in direct contact with each other.

  As shown in FIG. 3A, the wire bonding is performed so that the wire 7 has an arch shape. Bonding is performed by wedge bonding, and a ball or the like is not formed at the start point and end point of the wire 7.

  The distance X between the top portion 7a of the arch-shaped wire bonding and the inner surface of the case portion 4 facing this is larger than the distance Y between the side end surface of the light emitting panel 2 and the inner surface of the side surface 43 of the case portion 4. It is configured. The distance X and the distance Y take into consideration how much deformation occurs in a predetermined environment from the difference in linear expansion coefficients of the materials constituting the light emitting panel 2 (substrate 21) and the case portion 4. Is set. Further, the height of the side surface 43 of the case part 4, the holding position of the light emitting panel 2 in the case part 4, the dimensions and thickness of the light emitting panel 2, the dimensions of the wiring board 3, the fixing position and thickness, the thickness and length of the wire 7, Factors such as width and arched height are also considered.

  For example, the wiring board 3 and the light-emitting panel 2 have greatly different linear expansion coefficients of 16.5 ppm / K (FR-4 base material) and 3.5 ppm / K (non-alkali glass). Moreover, the linear expansion coefficient (16 ppm / K) of the copper foil 5 also affects. Therefore, when they are placed in a low temperature environment in a state where they are bonded and fixed, as shown in FIG.

  However, in the present embodiment, the interval X is configured to be larger than the interval Y. Therefore, when the light emitting panel 2 is deformed, the side end surface of the light emitting panel 2 comes into contact with the side surface 43 of the case portion 4 and functions as a stopper, so that the top portion 7a of wire bonding hardly comes into contact with the case portion 4. Furthermore, since the case portion 4 is deformed following the deformation of the light emitting panel 2, the interval X is secured, the top portion a of the wire bonding becomes difficult to contact the case portion 4, and the disconnection of the wire 7 is suppressed. it can.

  Even if the wiring board 3 and the light emitting panel 2 are deformed and the relative distance of the connection position is changed, the arched wire bonding absorbs the change, so that the connected portion is hardly damaged.

  On the other hand, when the interval X is configured to be smaller than the interval Y as shown in FIG. 4A, the side end surface of the light-emitting panel 2 is placed on the case portion 4 as shown in FIG. Before coming into contact with the side surface 43, the wire bonding apex portion 7 a comes into contact with the case portion 4. Therefore, the wire 7 may be damaged and the wire 7 may be disconnected.

  As described above, according to the present embodiment, the light emitting panel 2 and the wiring board 3 are electrically connected even when the light emitting panel 2, the wiring board 3, and the case unit 4 are deformed in various thermal environments. Since the wire is not easily broken, the light emitting module 1 with high operation reliability can be obtained. The light emitting module 1 can be used for a lighting apparatus that can be installed in various temperature environments from a cold region to a warm region. In addition, since the light emitting module 1 can perform wire bonding at room temperature, the light emitting part 22 of the light emitting panel 2 and the wiring board 3 can be provided in close proximity, and the degree of design freedom as a module is high. It can be used for various lighting equipment.

  Next, a light emitting module according to a modification of the present embodiment will be described with reference to FIGS. In the light emitting module 1 according to this modification, a portion 44 facing the wire bonding is thinner than other portions in the inner surface of the case portion 4 (back case portion 42). Specifically, as shown in FIGS. 5 (a) and 5 (b), a recess is formed in a portion 44 facing wire bonding. On the other hand, no depression is formed in the portion 44 that does not face wire bonding, as shown in FIGS. Other configurations are the same as those of the above-described embodiment.

  According to this configuration, by forming the depression in the portion 44 facing the wire bonding, the arched wire bonding is hardly damaged by the deformation of the light emitting panel 2 or the external force. Moreover, since the part which makes the case part 4 thin becomes limited, the rigidity fall of the case part 4 can be suppressed. In the illustrated example, an example is shown in which the back case 42 is formed with a recess 45 at a substantially central portion of the surface facing the light emitting panel 2 and the wiring board 3. By forming the recess 45, the case portion 4 can be more easily deformed following the deformation of the light emitting panel 2, and the heat dissipation of the light emitting module 1 can be improved.

<Example>
The light emitting panel 2 is made of non-alkali glass (linear expansion coefficient 3 ppm / K) as a substrate 21 and has a size of 100 × 100 × 0.7 mm. On the substrate 21, a transparent electrode (ITO) and an electrode terminal 23 were patterned as shown in FIG. The electrode terminal 23 was formed of molybdenum / aluminum / molybdenum or a silver alloy on the side facing the light-emitting portion 22 and flash gold plating on the substrate 21 side. At this time, the dimension of the part where the wire 7 was connected was at least 0.5 × 0.5 mm.

  The light emitting portion 22 was formed on the electrode terminal 23, and the copper foil 5 (linear expansion coefficient 16 ppm / K) was bonded and fixed as shown in FIG. Further, the wiring substrate 3 having FR-4 (linear expansion coefficient 16.5 ppm / K) as a base material and having a size of 80 × 20 × 1.0 mm is bonded to the vicinity of the electrode terminal 23 on the copper foil 5. Fixed.

  The wire 7 is made of pure aluminum (linear expansion coefficient: 23 ppm / K) (bonding wire manufactured by Tanaka Kikinzoku Kogyo Co., Ltd.) with a wire diameter of 200 μm. The loop has an arch shape and does not form balls at both the start and end points. A wedge bonder manufactured by Kogyo Co., Ltd.). The light-emitting panel 2 and the like that were wire-bonded were accommodated in the case part 4 made of ABS resin (linear expansion coefficient 80 ppm / K), and the light-emitting module 1 was produced.

  The produced light emitting module 1 did not contact the case part 4 with the wire 7 in the low temperature storage test at −40 ° C. Further, in the high temperature storage test at 80 ° C., the contact of the case portion 4 with the wire 7 did not occur. Furthermore, even when the heat cycle test at −40 ° C./80° C. was performed 1000 times, the wire 7 did not break. From these tests, the effect of the light emitting module 1 of this embodiment was proved.

  In addition, this invention is not restricted to the said embodiment, A various deformation | transformation is possible. For example, in the said embodiment, although the electrode terminal 23 was formed in the both ends of the longitudinal direction of the light emission panel 2, the electrode terminal 23 was formed in the both ends of the direction orthogonal to this, These electrode terminals The wiring board 3 may be provided in the vicinity of 23. That is, the wiring board 3 may be disposed so as to surround the four sides of the light emitting unit 22, and the arch-shaped wire bonding described above may be provided between the wiring board 3 and each electrode terminal 23.

DESCRIPTION OF SYMBOLS 1 Light emitting module 2 Light emitting panel 21 Board | substrate 22 Light emission part 23 Electrode terminal 3 Wiring board 4 Case part 43 Side surface (inner side surface) of a case part
44 Parts facing wire bonding 7 Wire (wire bonding)
7a Top of arched wire bonding

Claims (3)

A flat light-emitting panel having a light-emitting portion and an electrode terminal formed on the substrate; a wiring substrate that supplies power to the light-emitting portion; and a case portion that houses the light-emitting panel and the wiring substrate. A light emitting module in which the electrode terminal and the wiring board are electrically connected by wire bonding,
The distance between the top of the arch-shaped wire bonding and the inner surface of the case portion facing the arch-shaped wire bonding is configured to be larger than the distance between the side end surface of the light emitting panel and the inner surface of the case portion. The light emitting module is characterized.   The light emitting module according to claim 1, wherein the light emitting panel is held in the case portion without being fixed.   The light emitting module according to claim 1, wherein a portion of the inner surface of the case portion facing the wire bonding is thinner than other portions.

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