JP2011235311A - Heat transfer apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat transfer apparatus capable of uniformly heating or cooling an article to be treated.SOLUTION: The heat transfer apparatus has a heating medium supplying part 5 on the side part of a heat transfer part 4, and the heat transfer part 4 has a recessed part 6 on the contacting face with the article 20 to be treated, and the heating medium supplying part 5 has a supplying hole 8 for the fluid heating medium 12, and the recessed part 6 and the heating medium-supplying hole 8 are communicated with a communicating hole 9. The fluid heating medium 12 supplied into the heating medium-supplying hole 8 is filled into the recessed part 6 of the heat transfer part 4 through the communicating hole 9, and the opening face of the recessed part 6 filled with the heating medium 12 is closed into a sealed condition with a thin sheet-like covering article 7, and the heat transfer part 4 and the heating medium supplying part 5 are provided so as to be inclined.

Description

  The present invention relates to a heat transfer device capable of uniformly heating or cooling an object to be processed, and is effective when used, for example, in a soldering device.

  Conventionally, as a soldering device, for example, there are devices shown in Patent Document 1 and Patent Document 2. This soldering apparatus has a hot plate and a cooling plate in a chamber, the hot plate has heating means inside, and a substrate is disposed on the surface of the hot plate. The chamber is evacuated, the heating plate is heated by the heating means, and the solder on the substrate is melted. Thereafter, the heating is stopped, the cooling plate is brought into contact with the heating plate to cool the substrate, the molten solder is solidified, and the substrate and the electronic component are soldered. Patent Document 3 proposes a reflow soldering apparatus that includes a vacuum defoaming device that performs vacuum defoaming during soldering and uses a hot plate as a means for heating the solder.

JP 11-233934 A JP 2006-82112 A JP 2005-353965 A

  In the soldering apparatus described above, the heating capability of the hot plate for heating the solder depends on the degree of contact between the hot plate surface and the substrate. Therefore, it is necessary to increase the flatness of the hot plate so that the substrate contacts the hot plate surface without any gap. However, when the substrate has some warpage or the like, it is difficult to closely contact the hot plate surface and the substrate without any gap. As a result, the hot plate has a problem that heat cannot be uniformly transferred to the entire substrate. The same applies to those using a hot plate as the heating means.

  The objective of this invention is providing the heat-transfer apparatus which can heat or cool a to-be-processed object uniformly.

In order to solve the above problems, the present invention employs the following means. That is,
The heat transfer device of the present invention has a heat transfer body heated by a heating means, and there is a fluid heating medium in the contact surface portion of the heat transfer body with the object to be processed, and the surface thereof is a thin sheet. It is characterized by being covered with a covering.

  The heat transfer device of the present invention has a heating medium supply part at a side part of the heat transfer part, the heat transfer part has a concave part at a contact surface part with an object to be processed, and the heating medium supply part is fluid. A heating medium supply hole is provided, and the recess and the heating medium supply hole communicate with each other through a communication hole, and the fluid heating medium supplied to the heating medium supply hole passes through the communication hole and the heat transfer section. The opening surface of the recess filled with the heating medium is hermetically closed with a thin sheet-like covering, and the heat transfer section and the heating medium supply section are provided so as to be inclined. Is preferred.

  According to the present invention, there is a fluid heating medium inside the thin sheet-like coating that comes into contact with the object to be treated during heating or cooling. It is uniformly heated without being contacted and heated or cooled uniformly.

It is a longitudinal cross-sectional view which shows one Embodiment of this invention. It is a figure which shows the state which inclined the apparatus main body from the state of FIG. It is a principal part enlarged view of FIG.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

  Reference numeral 1 denotes a vacuum chamber, which is provided, for example, between a reflow chamber and a reflow chamber in a reflow soldering apparatus. A heat transfer device 2 is installed in the vacuum chamber 1.

  The main body 3 of the heat transfer device 2 includes a heat transfer unit 4 and a heating medium supply unit 5. The heat transfer section 4 is a heat transfer body formed in a flat plate shape that is rectangular in plan view. The heat transfer section 4 is made of a metal, ceramics or other material having a good thermal conductivity. The heating medium supply unit 5 is formed in a rectangular columnar shape in plan view, and has a width smaller than the width of the heat transfer unit 4. The heating medium supply unit 5 is integrally formed on the side portion of the central portion on the short side of the heat transfer unit 4, and protrudes vertically above the heat transfer unit 4.

  On the upper surface of the heat transfer section 4, rectangular recesses 6 are concentrically arranged in a plan view and formed at a constant depth. Around the concave portion 6 on the upper surface of the heat transfer section 4, the periphery of the thin heat-resistant resin sheet 7 made of a thin sheet-like covering, in this embodiment made of polyimide resin or the like, is fixed. The opening surface is closed in a sealed state.

A rectangular hole-shaped supply hole 8 is concentrically arranged in the heating medium supply unit 5 and formed vertically. The supply hole 8 opens to the upper surface of the heating medium supply unit 5 and has a depth deeper than the bottom surface of the recess 6 of the heat transfer unit 4. The inside of the recess 6 of the heat transfer part 4 and the inside of the hollow part of the supply hole 8 of the heating medium supply part 5 are communicated by a communication hole 9. The communication hole 9 has a circular cross section, and has one end connected to one side of the recess 6 of the heat transfer unit 4 and the other end connected to one side of the supply hole 8 of the heating medium supply unit 5.

  An electric heater 10 is embedded as a heating means below the recess 6 of the heat transfer section 4 and connected to a power source not shown. An electric heater 11 is also inserted into the supply hole 8 of the heating medium supply unit 5 and connected to a power source not shown.

  A fluid heating medium, that is, solder 12 in this embodiment, is supplied from the supply hole 8 of the heating medium supply unit 5. The solder 12 is heated and melted by the electric heater 11 installed in the supply hole 8 of the heating medium supply unit 5 and flows into the recess 6 of the heat transfer unit 4 through the communication hole 9. The solder 12 is supplied to the recess 6 of the heat transfer section 4 and the recess 6 is filled with the solder 12. The solder 12 filled in the recess 6 of the heat transfer unit 4 is heated and melted by the electric heater 10 embedded under the recess 6 of the heat transfer unit 4. The surface of the melted solder 12 in the recess 6 is covered with a heat resistant resin sheet 7.

  A pair of fan-like plate members 13 are fixed to the lower surface of the apparatus main body 3 at intervals. The fan-shaped plate member 13 is a fan-shaped plate member when viewed from the front, is fixed to the end of the lower surface of the heat transfer section 4 on the heating medium supply section 5 side, and is disposed so as to protrude from the heating medium supply section 5. A plurality of teeth 14 are formed on the protruding front end surface of the fan-shaped plate member 13. A rack 15 is provided in a pair so as to be opposed to each of the pair of fan-shaped plate members 13, and is fixed to the inner side surface of the vacuum chamber 1. The rack 15 extends in the vertical direction, and a large number of teeth 16 are formed on the surface facing the fan-shaped plate member 13. The teeth 16 of the rack 15 mesh with the teeth 14 of the fan-shaped plate member 13.

  Under the heat transfer section 4 of the apparatus main body 3, support rods 17 are disposed between the pair of fan-shaped plate members 13 with both ends supported by the pair of fan-shaped plate members 13. An elevating rod 18 is supported at the central portion of the support rod 17 so that the upper end portion thereof is pivotable, and hangs downward. The elevating rod 18 is configured to be movable up and down by driving means such as a cylinder device (not shown).

  Therefore, when the elevating rod 18 is lowered from the state shown in FIG. 1 to a predetermined position, as shown in FIG. 2, the engagement position between the fan-like member 13 and the rack 15 is changed, so that the apparatus main body 3 is predetermined. While being lowered by the height, it is disposed at a predetermined angle. From this state, when the elevating rod 18 rises to a predetermined height, as shown in FIG. 1, the engagement position between the fan-like member 13 and the rack 15 is changed, so that the apparatus main body 3 is moved to a predetermined height. As it rises, it is held in a horizontal state.

  The inside of the vacuum chamber 1 is configured to be depressurized by a vacuum pump (not shown) to a predetermined depressurized atmosphere in which solder is defoamed.

  Reference numeral 19 denotes a pair of left and right substrate conveyors provided in the vacuum chamber 1. Reference numeral 20 denotes a printed circuit board on which electronic components are mounted, and a paste-like cream solder is applied to a soldering portion. The printed board 20 is conveyed in the vacuum chamber 1 by the board conveying conveyor 19.

  Hereinafter, the operation of the heat transfer device 2 will be described.

  The printed circuit board 20 on which the electronic components are mounted is heated to a predetermined temperature in a preheating chamber (not shown) while the cream solder on the printed circuit board 20 is conveyed in the furnace of the reflow soldering apparatus, and the solder portion is in the reflow chamber. (Not shown) is heated and melted, and further heated and melted in the vacuum chamber 1 by the heat transfer device 2 and defoamed. The printed circuit board 20 is further heated and melted in a subsequent reflow chamber (not shown). Subsequently, the molten solder is cooled and solidified in a cooling chamber, and electronic components are soldered onto the substrate.

  Hereinafter, heating of the printed circuit board 20 by the heat transfer device 2 in the vacuum chamber 1 will be described. The inside of the vacuum chamber 1 is in a predetermined reduced pressure atmosphere in which the solder part is degassed by the operation of the vacuum pump.

  In the vacuum chamber 1, the solder 12 in the recess 6 of the heat transfer unit 4 and the solder 12 in the supply hole 8 of the heating medium supply unit 5 are connected to the electric heater 10 of the heat transfer unit 4 and the electric heater of the heating medium supply unit 5. 11 and is melted by heating.

  The apparatus main body 3 of the heat transfer apparatus 2 is in the horizontal state shown in FIG. 1, and the lifting rod 18 is lowered by a predetermined height. As a result, as shown in FIG. 2, when the engagement position between the fan-like member 13 and the rack 15 is changed, the apparatus main body 3 is lowered by a predetermined height and is inclined at a predetermined angle. .

  As shown in FIG. 2, the apparatus body 3 of the heat transfer device 2 is inclined at a predetermined angle, so that air is introduced between the molten solder 12 in the recess 6 of the heat transfer section 4 and the heat resistant resin sheet 7. If present, the air moves through the communication hole 9 to the heating medium supply hole 8 of the heating medium supply unit 5, moves upward through the heating medium supply hole 8, and is discharged into the vacuum chamber 1. Thereby, since the molten solder 12 and the heat-resistant resin sheet 7 in the recess 6 of the heat transfer section 4 are in close contact with each other without any gap, the uniform heating of the object to be processed can be performed better.

  The printed circuit board 20 on which electronic components are mounted is transported and held at a predetermined position in the vacuum chamber 1 by the substrate transport conveyor 19. At this time, the apparatus main body 3 of the heat transfer apparatus 2 is inclined at a predetermined angle as shown in FIG.

  In the above state, the lifting rod 18 is raised by a predetermined height. As a result, as shown in FIG. 1, when the meshing position between the fan-like member 13 and the rack 15 is changed, the apparatus main body 3 is raised by a predetermined height and held horizontally.

  When the apparatus main body 3 of the heat transfer device 2 is held horizontally, the printed circuit board 20 contacts the heat resistant resin sheet 7 covering the surface of the molten solder 12 filled in the recess 6 of the heat transfer section 4. . At this time, even when the printed circuit board 20 is slightly warped or the like, the molten solder 12 having fluidity exists inside the heat resistant resin sheet 7. Contact uniformly with no gaps.

  Therefore, since the printed circuit board 20 is uniformly heated by the molten solder 12 heated by the electric heater 10, the solder portion of the printed circuit board 20 on which electronic components are mounted is uniformly melted in the vacuum chamber 1 and defoamed at the same time. Is done. Thereafter, the elevating rod 18 is lowered by a predetermined height, and the apparatus main body 3 is lowered by a predetermined height and is inclined at a predetermined angle. Thereafter, the printed circuit board 20 is sent to the next reflow chamber by the substrate transfer conveyor.

  Although the said embodiment demonstrated the case where the heat-transfer apparatus 2 was used as a heating apparatus, the heat-transfer apparatus of this invention can also be used as a cooling device. For example, if a low-temperature solder having a low melting point is used for the solder 12 in the above embodiment, the heat transfer device is installed in a cooling chamber in the reflow soldering device, and the heating temperature of the electric heater 10 is lowered, thereby reducing the reflow chamber. It is possible to cool the soldered portion that has been heated and melted by the molten solder 12 in the recess 6 of the heat transfer portion 4 of the heat transfer device 2.

  In this embodiment, solder is used as a fluid heating medium. However, the present invention is not limited to this.

  In this embodiment, an electric heater is used as a heating means for a fluid heating medium, but the present invention is not limited to this. For example, a far infrared heater may be provided.

  1 .... Vacuum chamber, 2 .... Heat transfer device, 3 .... Main body, 4 .... Heat transfer part, 5 .... Heating medium supply part, 6 .... Recess, 7 .... Heat resistant resin sheet, ... Heating medium supply hole, 9 ... Communication hole, 10 ... Electric heater, 11 ... Electric heater, 12 ... Solder, 13 ... Fan-shaped plate member, 14 ... Teeth, 15 ... Rack, 16 ... Teeth, 17 .. Support rod, 18 .. Lifting rod, 19 .. Substrate transport conveyor, 20 .. Printed circuit board equipped with electronic components.

Claims (2)

  It has a heat transfer body that is heated by a heating means, there is a fluid heating medium at the contact surface portion of the heat transfer body with the object to be processed, and the surface is covered with a thin sheet-like coating. Heat transfer device characterized by   A heating medium supply section is provided on a side portion of the heat transfer section, the heat transfer section has a recess in a contact surface with the workpiece, and the heating medium supply section has a supply hole for a fluid heating medium. The recess and the heating medium supply hole communicate with each other through a communication hole, and the fluid heating medium supplied to the heating medium supply hole is filled into the recess of the heat transfer unit through the communication hole, and the heating An opening surface of a recess filled with a medium is hermetically closed with a thin sheet-like covering, and the heat transfer unit and the heating medium supply unit are provided so as to be inclined.

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