TWI749747B - An apparatus and method for semiconductor devices - Google Patents

Abstract

An apparatus for a semiconductor device comprises a box body, at least one first support structure, and a buffer structure. The at least one first support structure is disposed within the box body and extends along a first direction. The at least one first support structure is supported by the box body. The buffer structure surrounds the at least one first support structure and rotates with respect to the at least one first support structure.

Description

Equipment and method for semiconductor device

The present invention generally relates to equipment and methods for manufacturing semiconductor devices.

In the current semiconductor packaging process, after a semiconductor device (such as a wafer) is manufactured, the semiconductor device is attached to a substrate to perform a molding operation. Then, the substrate is placed on a rigid carrier and sent to a pressure oven for high-temperature heating, so that the molding compound is cured and the residual gas under the wafer is discharged.

However, in the process of transferring the rigid carrier to the pressure oven, the rigid carrier will rub against the metal support rod in the pressure oven to generate metal particles. The metal particles may fall off and adhere to the molding compound, causing electrical connection problems (for example, short circuits) in the subsequent metal manufacturing process of semiconductor packaging.

In one aspect, a device for a semiconductor device includes a box, at least one first support structure, and a buffer structure. The at least one first support structure is arranged in the box body and extends along a first direction, and the at least one first support structure is supported by the box body. The buffer structure surrounds the at least one first supporting structure and is rotatable relative to the at least one first supporting structure.

In one aspect, a device for semiconductor packaging includes a box, a support structure, and a buffer structure. The box body includes a first bracket, a plurality of pairs of second brackets, and a third bracket, and the plurality of pairs of second brackets are connected between the first bracket and the third bracket. The supporting structure is arranged between one pair of second brackets among the plurality of pairs of second brackets. The supporting structure includes a first supporting structure and at least one second supporting structure. The first support structure is arranged parallel to the first support and the third support. The at least one second support structure is orthogonal to the first support structure and is integrally formed, and the at least one second support structure extends from the first support structure to one of the plurality of second brackets. The buffer structure surrounds the at least one second support structure and is rotatable relative to the at least one second support structure.

In one aspect, a method for manufacturing a semiconductor device includes: providing a substrate on which a semiconductor device is disposed; providing a carrier for supporting the substrate; providing a support structure and a buffer structure, wherein the support The structure includes at least one first support structure, and the buffer structure surrounds the at least one first support structure and is rotatable relative to the at least one first support structure; and transfers the carrier to the at least one first support structure, The carrier is directly in contact with the buffer structure for transmission.

Other aspects, advantages, and features of the present invention will become apparent after reviewing the entire application. The application includes the following parts: a brief description of the drawings, an implementation mode, and the scope of the patent application.

1: equipment

2: Electronic control system

3: Safety mechanism system

4: Ventilation system

5: Heating system

6: Power system

7: Pressurized system

8: Cooling system

10: Cabinet

11: Supporting structure

12: Buffer structure

13: Frame

101: The first bracket

101a: Part One

101b: part two

101c: Part Three

102: second bracket

103: third bracket

103a: Part One

103b: Part Two

103c: Part Three

111: The second support structure

112: At least one first support structure

FIG. 1 illustrates a block diagram of a system for manufacturing a semiconductor device according to some embodiments of the present invention; FIG. 2A illustrates an apparatus for manufacturing a semiconductor device according to some embodiments of the present invention A perspective view; FIG. 2B illustrates a top view of an apparatus for manufacturing a semiconductor device according to some embodiments of the present invention; FIG. 2C illustrates a partial enlarged schematic view of an apparatus for manufacturing a semiconductor device according to some embodiments of the present invention; FIG. 2D illustrates A front view of an apparatus for manufacturing a semiconductor device according to some embodiments of the present invention; FIGS. 3A to 3E illustrate a method of manufacturing a semiconductor device package according to some embodiments of the present invention.

Common reference numbers are used throughout the drawings and embodiments to indicate the same or similar components. It will be easier to understand the embodiments of the present invention from the following detailed description in conjunction with the accompanying drawings.

For the orientation of components as shown in the associated figure, a spatial description is specified for a certain component or a certain group of components, or a certain plane of a component or a group of components, such as "above", "on... "Bottom", "Top", "Left", "Right", "Bottom", "Top", "Bottom", "Vertical", "Horizontal", "Side", "Higher", "Lower", " "Upper", "above", "below" and so on. It should be understood that the spatial description used in this article is for illustrative purposes only, and the actual implementation of the structure described in this article can be spatially arranged in any orientation or manner, and the limitation is that the advantages of the embodiments of the present invention are not therefore The configuration is biased.

FIG. 1 illustrates a block diagram of a system for manufacturing a semiconductor device according to the present invention. The system includes equipment for manufacturing semiconductor devices 1, an electric control system 2, a safety mechanism system 3, a ventilation system 4, a heating system 5, a power system 6, a pressure system 7, and a cooling system 8. In some embodiments, the device 1 is an oven. The device 1 can be a pressure oven.

The electronic control system 2 is coupled to the device 1 to control the device 1 through signal communication, so that other systems and components can be adjusted. The electronic control system 2 includes a programmable logic controller (PLC). The PLC may include functional modules, signal modules, communication modules, and interface modules. With these modules, it is possible to interface control functions and signals to communicate with other systems.

The safety mechanism system 3 is coupled to the equipment 1 to confirm the safety of the equipment and the process. The safety mechanism system 3 can control electromagnetic pulse (EMP), chamber door, temperature, and pressure. In some embodiments, by controlling the chamber door, the safety mechanism system 3 can further control devices such as switch double trigger buttons, door position sensors, shutter sensors and the like. Regarding the temperature range and fine adjustment of the control device 1, the safety mechanism system 3 can further control the main control point temperature control, temperature sensing line monitoring, and over-temperature protector (EGO) power-off mechanical triggering functions. In this way, the safety mechanism system 3 can not only control a large temperature range, but also accurately adjust the temperature and maintain it at a specific temperature. When the temperature is too high, the safety can be ensured by mechanical power-off. The safety mechanism system 3 can further adjust the pressure control, pressure relief of the exhaust valve, and pressure relief of the safety valve, thereby controlling and adjusting the pressure of the equipment 1.

The air extraction system 4 is coupled to the device 1 to perform air extraction operation via an air extraction pipe. The ventilation system 4 may include a fan motor module to promote thermal circulation to increase thermal uniformity. The heating system 5 is coupled to the device 1 to heat the device 1 through a heating module. The power system 6 is coupled to the device 1 to perform three-phase control with 220 volt alternating current to supply power to the device 1.

The pressurizing system 7 is coupled to the device 1 to perform pressurizing operations on the device 1. The pressurizing system 7 includes an air reservoir module and a pressurizing cylinder. The cooling system 8 is coupled to the device 1 to perform cooling operations on the device 1. The cooling system 8 includes a water pump and an exhaust filter.

FIG. 2A illustrates a perspective view of an apparatus 1 for manufacturing a semiconductor device according to the present invention. The equipment 1 includes a box body 10 and a frame body 13. The frame body 13 is arranged in the box body 10 and connected to the box body 10. The frame 13 is supported by the box 10. In some embodiments, the box 10 includes gold Genus. The box body 10 may include stainless steel. The material and structure of the box body 10 can withstand high temperature and increase the uniformity of heat flow.

The box body 10 includes a first bracket 101, a second bracket 102, and a third bracket 103. The second bracket 102 is connected between the first bracket 101 and the third bracket 103. In some embodiments, the first bracket 101 is an upper bracket. The third bracket 103 is a lower bracket. The structure of the third bracket 103 is similar to that of the first bracket 101. The structure of the third bracket 103 can be arranged symmetrically to the first bracket 101. The third bracket 103 may have a chassis under it.

The first bracket 101 has a first part 101a, a second part 101b, and a third part 101c. The first part 101a is the upper peripheral bracket. The first part 101a can be rectangular or rectangular. The second part 101b and the third part 101c are arranged orthogonally. The second part 101b extends from one end (for example, the upper end) of the first part 101a to the other opposite end (for example, the lower end). The third part 101c extends from one end (for example, the left end) of the first part 101a to the other opposite end (for example, the right end). In some embodiments, the intersection of the second part 101b and the third part 101c is the center point of the first part 101a. The first part 101a, the second part 101b, and the third part 101c are integrally formed.

Similar to the first bracket 101, the third bracket 103 has a first portion 103a, a second portion 103b, and a third portion 103c. The first part 103a is the lower peripheral bracket. The first part 103a can be rectangular or rectangular. The second part 103b and the third part 103c are arranged orthogonally. The second part 103b extends from one end (for example, the upper end) of the first part 103a to the other opposite end (for example, the lower end). The third part 103c extends from one end (for example, the left end) of the first part 103a to the other opposite end (for example, the right end). In some embodiments, the intersection of the second part 103b and the third part 103c is the center point of the first part 103a. The first part 103a, the second part 103b, and the third part 103c are integrally formed.

A plurality of second brackets 102 are arranged around the first bracket 101 and the third bracket 103. The plurality of second brackets 102 can be symmetrically arranged on both sides of the first bracket 101 and the third bracket 103 (for example, the left side and the right side), and each of the plurality of second brackets 102 on both sides is separated by a distance to Maintain a uniform thermal cycle. The second bracket 102 is arranged in pairs on both sides of the first bracket 101 and the third bracket 103 in an even number. In some embodiments, the pitch may be about 140 mm to about 180 mm. In other embodiments, at least two second brackets 102 may be provided on both sides. In some embodiments, four second brackets 102 may be provided on both sides. In other embodiments, six second brackets 102 may be provided on both sides. Considering different thermal cycles, the number of second brackets 102 can be adjusted accordingly.

The frame 13 includes a supporting structure 11 and a buffer structure 12. The frame body 13 is disposed between one pair of second frames 102 among the plurality of second frames 102. The material of the support structure 11 is different from the material of the buffer structure 12. The material of the support structure 11 includes metal. The material of the support structure 11 may include stainless steel. The buffer structure is a ceramic sleeve or a ceramic collar. The material of the buffer structure 12 may include ceramic materials.

The supporting structure 11 is connected between one pair of the second brackets 102 among the plurality of second brackets 102. In some embodiments, the supporting structure 11 may be joined to a plurality of second brackets 102. In order to assemble the buffer structure 12 to the plurality of first support structures 112 of the support structure 11 (see FIG. 2B), the support structure 11 and the plurality of second brackets 102 may not be integrally formed.

Figure 2B illustrates a top view of the device 1 according to the invention. The frame body 13 is arranged under the first bracket 101. The supporting structure 11 of the frame 13 includes a second supporting structure 111 and a plurality of first supporting structures 112. In some embodiments, the supporting structure 11 is a fishbone-shaped supporting frame. The plurality of first support structures 112 are arranged corresponding to the plurality of first supports 102. The plurality of first supporting structures 112 are connected to the second supporting structure 111. The second support structure 111 is arranged on the first support Below the second part 101b of 101. The second support structure 111 is arranged parallel to the first support 101 and the third support 103. The plurality of first supporting structures 112 and the second supporting structures 111 are orthogonal and integrally formed. Each of the plurality of first support structures 112 extends from the second support structure 111 to one of the plurality of pairs of second brackets 102 and is supported by the box body 10. The distance between each of the plurality of first supporting structures 112 may be about 180 mm to about 220 mm. The width of the first support structure 112 is about 570 mm to about 650 mm. The interval and the width can be configured and designed for the frame 13 based on requirements.

Each of the plurality of first supporting structures 112 may have two buffer structures 12. The two buffer structures 12 are separated from each other by a gap. The two buffer structures 12 can be respectively arranged on the left and right sides of the first support structure 112.

2C illustrates a partial enlarged schematic view of the frame 13 of the device 1 according to the present invention. As shown in FIG. 2C, the buffer structure 12 surrounds the at least one first support structure 112 and is rotatable relative to the at least one first support structure 112. There is a gap between the buffer structure 12 and the at least one first support structure 112 to reduce the friction between the buffer structure 12 and the at least one first support structure 112.

In some embodiments, a friction reducing structure, such as a bearing, may be provided between the buffer structure 12 and the at least one first support structure 112 to reduce wear between the buffer structure 12 and the at least one first support structure 112. The bearing can be a long cylindrical body, balls or other suitable structures.

Figure 2D illustrates a front view of the device 1 according to the invention. The box 1 includes a plurality of frames 13. The distance between each of the plurality of frame bodies 13 may be about 0.7 cm to about 1.5 cm. Carriers can be placed on each frame 13. The spacing can ensure the uniformity of the thermal cycle between multiple carriers.

3A to 3E illustrate some embodiments of the method of manufacturing a semiconductor device package according to the present invention.

Referring to FIG. 3A, a method for manufacturing a semiconductor device package includes providing a substrate 31. The semiconductor device 32 is provided on the substrate 31. The substrate 31 may include conductive vias (for simplicity, not shown in the figure). The substrate 31 may have conductive terminals formed on its upper surface or lower surface (for simplicity, not shown in the figure). The substrate 31 may be a printed circuit board, an interposer, or a packaging substrate.

Referring to FIG. 3B, the encapsulation layer 33 is disposed on the substrate 31 to encapsulate the substrate 31 and the semiconductor device 32. The encapsulation layer 33 may be a molding compound. The encapsulation layer 33 includes resin.

Referring to FIG. 3C, a carrier 14 is provided for supporting the substrate 31. The carrier 14 includes metal. The carrier 14 includes stainless steel. The carrier 14 can be a rigid board or a rigid substrate.

In some embodiments, the lower part of the substrate 31 itself may also include a metal layer. When the metal layer of the substrate 31 is placed on the carrier 14, metal particles may drop due to friction.

Provide a device 1. The device 1 has a box body 10 and a frame body 13. The frame 13 includes a supporting structure 11 and a buffer structure 12. The supporting structure 11 includes a second supporting structure 111 and a plurality of first supporting structures 112. The buffer structure 12 surrounds the at least one second support structure 112 and is rotatable relative to the at least one first support structure 112. There is a gap between the buffer structure 12 and the at least one first support structure 112 to reduce friction and loss between the buffer structure 12 and the at least one first support structure 112. The buffer structure 12 rotates relative to the at least one first support structure 112, and the carrier 14 is in contact with the buffer structure 12 of the frame 13. Since the buffer structure 12 rotates, it can prevent metal particles from falling onto the encapsulation layer 33 due to friction between metals. superior.

The carrier 14 is transferred to the frame 13. The carrier 14 directly contacts the buffer structure 12. The carrier 14 is spaced apart from the support structure 11 via the buffer structure 12. The carrier 14 does not contact the support structure 11. The carrier 14 is transferred to the box body 10 via the buffer structure 12. The material of the buffer structure 12 includes ceramic materials, so the friction between the buffer structure 12 and the carrier 14 can be reduced, and the carrier 14 can be avoided During the transfer, metal particles are generated by friction with the frame body 13 and fall on the encapsulation layer 33 or on other substrates below.

After the entire carrier 14 is transferred into the device 1, the substrate 31, the semiconductor device 32, and the encapsulation layer 33 on the carrier 14 are heated to cure the encapsulation layer 33. The temperature range of the heating operation is from about 150°C to 200°C. During the heating operation, a fan motor module can be provided to promote heat circulation in the box 10 to increase heat uniformity.

In addition, in certain embodiments, the interval between the second portion 102 of the box body 10 and the first support structure 112 of the frame body 13 may be designed to promote thermal cycling and increase thermal uniformity. The interval between the plurality of frame bodies 13 can be designed to promote thermal circulation to increase thermal uniformity. The box body 10 may have an even-numbered pair of second parts 102. The frame 13 may have an even number of first supporting structures 112. In a specific embodiment, the frame body 13 includes four first supporting structures 112 which can be sufficient to support the carrier 14 so as to prevent the carrier 14 from bending and misalignment affecting the carrier of the next layer.

In some embodiments, the carrier 14 itself may be slightly warped. Since each of the plurality of first support structures 112 of the support structure 11 of the frame 13 can have two buffer structures 12, and the two buffer structures 12 are separated from each other by a gap, the carrier 14 can be transported In this way, the conveying position of the carrier 14 is observed through the gap, so as to avoid the misalignment of the carrier 14.

Referring to FIG. 3D, the package 34 is formed through a number of packaging operations (for example, a drilling operation, a metal plating operation, a patterning operation, a heating operation, and a pressing operation).

Referring to FIG. 3E, in some embodiments, a package 36 with additional semiconductor devices 35 and passive components can be formed through a number of packaging operations (such as semiconductor mounting operations, mold sealing operations, and ball planting operations), wherein the mold sealing operation can be The curing operation is performed using FIG. 3C.

A particular advantage provided by at least one of the aspects, examples, and/or implementations disclosed in this case is that the material of the buffer structure requested in this case is different from that of the carrier, so the buffer structure is different from that of the carrier. Metal particles can be avoided when the rigid carrier is in contact. In addition, since there is a gap between the buffer structure and the at least one first support structure and can rotate relative to the at least one first support structure, it can promote the rigid carrier to reduce frictional obstacles when transporting into the box, so that the manufacturing process Smoother.

Unless the context clearly dictates otherwise, as used herein, the singular terms "a/an" and "the" may include plural indicators. In the description of some embodiments, the provision of a component "on" another component may cover the situation where the previous component is directly on the next component (for example, physically contacting the latter component) and one or more interventions The condition of a component between the previous component and the next component.

As used herein, the terms "approximately", "substantially", "approximately" and "approximately" are used to describe and consider small changes. When used to connect a project or environment, the term can refer to an example where the project or environment occurs correctly, and an example where the project and environment occur at a close approximation. For example, the term may refer to less than or equal to ±10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1 %, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the first value is within a range of ±10% less than or equal to the second value, the first value can be regarded as "substantially" the same as the second value, for example, less than or equal to ±5%, less than Or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

In addition, quantities, ratios, and other numerical values are sometimes presented herein in a range format. It should be understood that this range format is used for convenience and brevity, and should be flexibly understood to include values that are explicitly designated as limits of the range, and as if each value and sub-range are clearly designated, it also includes those included in the range. All individual values or subranges.

Although the present invention has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations are not restrictive. Those familiar with the art should understand that various changes can be made and equivalents can be substituted without departing from the true spirit and scope of the present invention as defined by the scope of the attached patent application. The description does not have to be drawn to scale. Due to manufacturing procedures and tolerances, there may be a difference between the artistic reproduction in the present invention and the actual equipment. There may be other embodiments of the invention that are not specifically described. The description and drawings should be regarded as illustrative rather than restrictive. Modifications can be made to adapt specific situations, materials, material compositions, methods, or procedures to the objectives, spirit, and scope of the present invention. All such modifications are intended to be within the scope of the patent application appended here. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalents without departing from the teachings of the present invention method. Therefore, unless specifically indicated herein, the order and grouping of operations are not limiting.

1: equipment

10: Cabinet

11: Supporting structure

12: Buffer structure

13: Frame

101: The first bracket

101a: Part One

101b: part two

101c: Part Three

102: second bracket

103: third bracket

103a: Part One

103b: Part Two

103c: Part Three

Claims (10)

A device for semiconductor devices, which includes: A box At least one first supporting structure arranged in the box body and extending along a first direction, the at least one first supporting structure being supported by the box body; and A buffer structure surrounds the at least one first supporting structure and is rotatable relative to the at least one first supporting structure. The device of claim 1, further comprising a second support structure, wherein the second support structure extends along a second direction and is connected to the at least one first support structure. The device of claim 1, wherein the material of the buffer structure is different from the material of the at least one first support structure, wherein the buffer structure includes a ceramic sleeve, and the material of the at least one first support structure includes metal. Such as the device of claim 1, wherein a bearing is provided between the buffer structure and the at least one first supporting structure. The device of claim 1, wherein the box body includes a first bracket, a plurality of pairs of second brackets, and a third bracket, and the plurality of pairs of second brackets are connected between the first bracket and the third bracket. Such as the device of claim 5, wherein the at least one first support structure is disposed between one pair of second supports among the plurality of pairs of second supports. A method for manufacturing a semiconductor device, which comprises: Providing a substrate on which a semiconductor device is arranged; Providing a carrier for carrying the substrate; Providing a support structure and a buffer structure, wherein the support structure includes at least one first support structure, and the buffer structure surrounds the at least one first support structure and is rotatable relative to the at least one first support structure; and Transferring the carrier to the at least one first supporting structure, The carrier is directly in contact with the buffer structure for transmission. Such as the method of claim 7, wherein there is a gap between the buffer structure and the at least one second supporting structure. The method of the requested item 7, further comprising heating the substrate, wherein the temperature range is the heating operation from 150 ^o C to about 200 ^o C. Such as the method of claim 9, which further includes providing a fan motor module to promote thermal circulation to increase thermal uniformity.

Images