JP2011234196A - Piezoelectric device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric device and an electronic equipment that can be miniaturized while facilitating manufacture of the piezoelectric device.SOLUTION: The piezoelectric device includes: a base substrate 51 provided with an internal terminal pair 55; a piezoelectric substrate 21 fixed to the base substrate 51; an IDT (interdigital transducer) 22 provided on the piezoelectric substrate 21; a surface acoustic wave element piece 2 provided on the piezoelectric substrate 21 and having an extraction electrode pair 24 that are electrically connected to the IDT 22; a first passive component 31 joined so as to straddle one terminal of the internal terminal pair 55 and one terminal of the extraction electrode pair 24; and a second passive component 32 joined so as to straddle the other terminal of the internal terminal pair 55 and the other terminal of the extraction electrode pair 24.

Description

  The present invention relates to a piezoelectric device and an electronic apparatus.

As a piezoelectric device, a surface acoustic wave element using surface acoustic wave (SAW) is known.
The surface acoustic wave element includes a surface acoustic wave element including a plate-shaped piezoelectric substrate and an IDT (Interdigital Transducer) provided on the piezoelectric substrate.
In addition to the surface acoustic wave element piece, there is known an IC (integrated circuit) having an active function and a passive component having a passive function, which constitute an oscillation circuit (for example, a patent document). 1). In such a surface acoustic wave element, a surface acoustic wave element piece, an IC, and a passive component are housed in a package.

Conventionally, as disclosed in Patent Document 1, a surface acoustic wave element piece, a passive component, and an IC are electrically connected via wires.
Therefore, in such a surface acoustic wave element, when the surface acoustic wave element piece is viewed in plan, the surface acoustic wave element piece, the passive component, and the IC must be arranged so as not to overlap each other, resulting in an increase in size. There was a problem.
Further, conventionally, since the wire described above is formed by wire bonding, there is a problem that the manufacturing process becomes complicated.

Japanese Patent Laying-Open No. 2005-64868

  An object of the present invention is to provide a piezoelectric device and an electronic apparatus that can be miniaturized while facilitating the manufacture of the piezoelectric device.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.
[Application Example 1]
The piezoelectric device of the present invention includes a base provided with a first terminal pair,
A piezoelectric substrate fixed to the substrate; a comb electrode provided on the piezoelectric substrate; and a second electrode provided on the piezoelectric substrate and electrically connected to the comb electrode. A surface acoustic wave element including a terminal pair;
A first passive component electrically connected to one terminal of the first terminal pair and one terminal of the second terminal pair;
A second passive component electrically connected to the other terminal of the first terminal pair and the other terminal of the second terminal pair;
The first passive component is joined so as to straddle one terminal of the first terminal pair and one terminal of the second terminal pair,
The second passive component is joined so as to straddle the other terminal of the first terminal pair and the other terminal of the second terminal pair.

Thereby, when the piezoelectric substrate is viewed in plan, the first passive component and a part of the second passive component are arranged so as to overlap with the piezoelectric substrate, respectively. As a result, the piezoelectric device can be reduced in size.
Further, the joining of the first passive component and the second passive component to the first terminal pair and the second terminal pair can be easily performed without using a complicated method such as wire bonding. Therefore, the manufacture of the piezoelectric device can be facilitated.

[Application Example 2]
In the piezoelectric device of the present invention, it is preferable that each of the first passive component and the second passive component is a chip component.
Since the chip component can be surface-mounted, it can be easily and reliably bonded to the first terminal pair and the second terminal pair with a conductive adhesive.

[Application Example 3]
In the piezoelectric device of the present invention, it is preferable that the chip component is any one of a resistor, a capacitor, and a coil.
These passive components constitute a part of the oscillation circuit of the piezoelectric device. In addition, since these passive components are difficult to be incorporated in electronic components (active components) such as ICs, when incorporating an oscillation circuit in a piezoelectric device, they are mounted on the piezoelectric device separately from electronic components such as ICs. The Rukoto. Therefore, by using such passive components as the first passive component and the second passive component, the mounting area of the electronic component mounted in the piezoelectric device can be reduced. As a result, it is possible to effectively reduce the size of the piezoelectric device.

[Application Example 4]
In the piezoelectric device of the present invention, the base has a step portion that forms a first surface and a second surface at a position lower than the first surface,
The first terminal pair is provided on the first surface;
The piezoelectric substrate is provided on the second surface,
It is preferable that the second terminal pair is provided on a surface opposite to the second surface of the piezoelectric substrate.
Thereby, the separation distance between the first electrode pair and the second electrode pair in the thickness direction of the piezoelectric substrate can be reduced. Therefore, it is possible to easily join the first passive component and the second passive component to the first terminal pair and the second terminal pair.

[Application Example 5]
In the piezoelectric device according to the aspect of the invention, it is preferable that the comb electrode is provided on a surface opposite to the second surface of the piezoelectric substrate.
As a result, even after the piezoelectric substrate is placed on the substrate, the comb-tooth electrode can be processed to adjust the frequency of the surface acoustic wave element.

[Application Example 6]
In the piezoelectric device according to the aspect of the invention, it is preferable that the piezoelectric substrate is fixed to the second surface via an adhesive.
Accordingly, the piezoelectric substrate can be fixed and supported with respect to the base body easily and reliably. Further, by fixing and supporting the piezoelectric substrate with respect to the base body, it is possible to stabilize the bonding between the first passive component and the second passive component and the first terminal pair and the second terminal pair. . For this reason, the reliability of the piezoelectric device can be improved.

[Application Example 7]
In the piezoelectric device according to the aspect of the invention, it is preferable that the adhesive is formed in a range that overlaps a formation region of the second electrode pair when the piezoelectric substrate is viewed in plan.
Thereby, joining of the 1st passive component and the 2nd passive component, and the 1st terminal pair and the 2nd terminal pair can be stabilized more.

[Application Example 8]
In the piezoelectric device according to the aspect of the invention, it is preferable that the adhesive is provided in a range that does not overlap the comb electrode when the piezoelectric substrate is viewed in plan.
Thereby, it is possible to prevent the stress generated between the adhesive and the surface acoustic wave element piece from adversely affecting the comb-tooth electrode. Therefore, the vibration characteristics of the piezoelectric device are not deteriorated.

[Application Example 9]
In the piezoelectric device according to the aspect of the invention, it is preferable that the height of the step portion is equal to the thickness of the piezoelectric substrate.
Thereby, the first terminal pair and the second terminal pair can be flush with each other (arranged along the same plane). In particular, when the height of the stepped portion is equal to the thickness of the piezoelectric substrate, the first passive component and the second passive component can be stably joined to the first terminal pair and the second terminal pair. Can do.

[Application Example 10]
In the piezoelectric device of the present invention, the first passive component is joined to the first terminal pair and the second terminal pair, and the second passive component is connected to the first terminal pair and the second terminal pair. Each of the terminal pairs is preferably joined with a conductive adhesive.
Thereby, these joining can be performed easily and reliably.

[Application Example 11]
In the piezoelectric device of the present invention, it has a package for housing the surface acoustic wave element piece and the passive component,
The substrate preferably constitutes a part of the package.
Thereby, a small packaged piezoelectric device can be realized.

[Application Example 12]
In the piezoelectric device of the present invention, one terminal of the first terminal pair is provided in the vicinity of one terminal of the second terminal pair,
The other terminal of the first terminal pair is preferably provided in the vicinity of the other terminal of the second terminal pair.
As a result, even if the dimensions of the first passive component and the second passive component are relatively small, the first passive component and the second passive component are joined to the first terminal pair and the second terminal pair. It can be performed.

[Application Example 13]
In the piezoelectric device of the present invention, the piezoelectric substrate has a rectangular shape in plan view,
Both terminals of the second terminal pair are preferably provided near one side of the piezoelectric substrate.
Thereby, the piezoelectric substrate can be cantilevered by the first passive component and the second passive component. Therefore, it is possible to prevent unintentional deformation and distortion due to thermal expansion of the piezoelectric substrate. As a result, the reliability of the piezoelectric device can be improved.

[Application Example 14]
In the piezoelectric device of the present invention, the piezoelectric substrate has a rectangular shape in plan view,
One terminal of the second terminal pair is provided in the vicinity of one side of the pair of opposite sides of the piezoelectric substrate, and the other terminal of the second terminal pair is provided on the piezoelectric substrate. It is preferable to be provided near the other side of the pair of sides.
Accordingly, the piezoelectric substrate can be supported at both ends by the first passive component and the second passive component. Therefore, the piezoelectric substrate can be stably fixed and supported with respect to the base.

[Application Example 15]
In the piezoelectric device of the present invention, the piezoelectric substrate has a rectangular shape in plan view,
One terminal of the second terminal pair is provided in the vicinity of one side of the piezoelectric substrate, and the other terminal of the second terminal pair is a side adjacent to the one side of the piezoelectric substrate. It is preferable to be provided in the vicinity.
Accordingly, even when the first passive component and the second passive component are different in size, the first passive component, the second passive component, the first terminal pair, and the second terminal pair can be easily obtained. Can be joined.

[Application Example 16]
The piezoelectric device of the present invention preferably has an active component electrically connected to the first passive component and the second passive component.
Thereby, an oscillation circuit can be incorporated in the piezoelectric device.
[Application Example 17]
In the piezoelectric device of the present invention, the active component is disposed so as to overlap at least a part of the first passive component and the second passive component when the piezoelectric substrate is viewed in plan. preferable.
Thereby, it is possible to reduce the size of the piezoelectric device in which the oscillation circuit is incorporated.
[Application Example 18]
An electronic apparatus according to the present invention includes the piezoelectric device according to the present invention.
Thereby, an electronic device having excellent reliability can be provided.

It is sectional drawing which shows 1st Embodiment of the piezoelectric device of this invention. It is a top view which shows the piezoelectric device shown in FIG. It is a partial expanded sectional view of the piezoelectric device shown in FIG. It is a circuit diagram which shows the circuit structure of the piezoelectric device shown in FIG. It is a top view which shows 2nd Embodiment of the piezoelectric device of this invention. It is a top view which shows 3rd Embodiment of the piezoelectric device of this invention. It is a top view which shows 4th Embodiment of the piezoelectric device of this invention. It is an electronic apparatus (notebook type personal computer) provided with the piezoelectric device of this invention. An electronic apparatus (cellular phone) including the piezoelectric device of the present invention. It is an electronic device (digital still camera) provided with the piezoelectric device of the present invention.

Hereinafter, a piezoelectric device and an electronic apparatus of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
1 is a sectional view showing a first embodiment of the piezoelectric device of the present invention, FIG. 2 is a top view showing the piezoelectric device shown in FIG. 1, and FIG. 3 is a partially enlarged sectional view of the piezoelectric device shown in FIG. FIG. 4 is a circuit diagram showing a circuit configuration of the piezoelectric device shown in FIG. In the following description, for convenience of explanation, the upper side in FIG. 1 is referred to as “upper”, the lower side as “lower”, the right side as “right”, and the left side as “left”.

(Piezoelectric device)
First, the piezoelectric device of the present invention will be described.
A piezoelectric device 1 shown in FIG. 1 is a surface acoustic wave element using a surface acoustic wave (SAW), and includes an oscillation circuit.
Such a piezoelectric device 1 includes a surface acoustic wave element piece 2, a first passive component 31, a second passive component 32, an active component 4, and a package 5 for housing them.

Hereinafter, each part which comprises such a piezoelectric device 1 is demonstrated in detail.
[package]
Next, the package 5 will be described.
The package 5 accommodates the surface acoustic wave element piece 2, the first passive component 31, the second passive component 32, and the active component 4. Thereby, the packaged small piezoelectric device 1 can be realized.
As shown in FIGS. 1 and 2, the package 5 includes a tray-like base substrate 51 that opens upward, and a plate-like lid member 52 that is provided so as to close the opening of the base substrate 51. ing. In the present embodiment, the package 5 has a substantially rectangular shape in plan view.

The base substrate 51 and the lid member 52 are joined by an adhesive or a brazing material. The package 5 houses the surface acoustic wave element piece 2 in an internal space S defined by the base substrate 51 and the lid member 52.
As a constituent material of such a base substrate 51, those having insulating properties (non-conductive) are preferable. For example, various ceramics such as various glass, oxide ceramics, nitride ceramics, carbide ceramics, polyimide, and the like. Various resin materials such as can be used.

Further, as the constituent material of the lid member 52, for example, the same constituent material as that of the base substrate 51, various metal materials such as Al and Cu, various glass materials, and the like can be used. In particular, when a material having light transmissivity such as a glass material is used as a constituent material of the lid member 52, even after the surface acoustic wave element piece 2 is accommodated in the package 5, The frequency adjustment can be performed by irradiating the comb-teeth electrode 22 on the piezoelectric substrate 21 of the surface acoustic wave element piece to be described later with a laser and removing a part thereof.
A surface acoustic wave element piece 2, an active component 4, an internal terminal pair 55, and a wiring pattern (not shown) are provided on the upper surface of the base substrate 51.

More specifically, on the upper surface of the base substrate 51, there are an installation surface (first surface) 58, an installation surface (second surface) 59 at a position lower than the installation surface 58, and an installation surface 58. And an installation surface 61 at a high position.
A step 57 is formed between the installation surface 58 and the installation surface 59, and a step 60 is formed between the installation surface 58 and the installation surface 61.

  A surface acoustic wave element piece 2 (more specifically, a piezoelectric substrate 21 to be described later) is fixed to an installation surface 59 of the base substrate 51 via an adhesive 54 such as epoxy or polyimide. Thereby, the piezoelectric substrate 21 can be fixed and supported with respect to the base substrate 51 easily and reliably. Further, by fixing and supporting the piezoelectric substrate 21 with respect to the base substrate 51, the first passive component 31 and the second passive component 32, which will be described later, and the extraction electrode pair 24 and the internal terminal pair 55 are joined. Can be stabilized. For this reason, the reliability of the piezoelectric device 1 can be improved.

  Thus, by providing the surface acoustic wave element piece 2 (more specifically, a piezoelectric substrate 21 described later) on the installation surface 59, the upper surface (more specifically, described later) of the surface acoustic wave element piece 2. The distance between the upper surface of the piezoelectric substrate 21 and the installation surface 58 in the vertical direction can be reduced. That is, as will be described later, when the extraction electrode pair 24 is provided on the upper surface of the piezoelectric substrate 21 (surface opposite to the installation surface 59 described above), the internal terminal pair 55 in the thickness direction of the piezoelectric substrate 21. And the distance between the lead electrode pair 24 can be reduced. Therefore, the first passive component 31 and the second passive component 32, which will be described later, and the internal terminal pair 55 and the extraction electrode pair 24 can be easily joined.

  The height of the stepped portion 57 that forms the installation surfaces 58 and 59 is equal to the thickness of the piezoelectric substrate 21 described later. Thereby, the internal terminal pair 55 and the extraction electrode pair 24 can be flush with each other (arranged along the same plane). In particular, when the height of the stepped portion 57 is equal to the thickness of the piezoelectric substrate 21, the bonding of the first passive component 31 and the second passive component 32 to the first terminal pair and the second terminal pair is stabilized. Can be done automatically.

Here, “the height of the stepped portion 57 is equal to the thickness of the piezoelectric substrate 21” means that when the height of the stepped portion 57 is D and the thickness of the piezoelectric substrate 21 is T, D / T is Say 0.9-1.1.
The height of the stepped portion 57 is set to be equal to the sum of the thickness of the piezoelectric substrate 21 and the thickness of the adhesive 54.

In the present embodiment, the surface acoustic wave element piece 2 is placed on the base substrate with the surface on which the IDT 22 and the like are formed facing upward (the lid member 52 side). The adhesive 54 may be a conductive adhesive containing conductive particles.
The adhesive 54 is formed in a range that overlaps with a formation region of the extraction electrode pair 24 described later when the piezoelectric substrate 21 described later is viewed in plan. Thereby, the joining of the 1st passive component 31 and the 2nd passive component 32 which are mentioned later, the extraction electrode pair 24, and the internal terminal pair 55 can be stabilized more.
The adhesive 54 is provided in a range that does not overlap with an IDT 22 described later when the piezoelectric substrate 21 described later is viewed in plan. As a result, it is possible to prevent the stress generated between the adhesive 54 and the piezoelectric substrate 21 from adversely affecting the IDT 22. Therefore, the piezoelectric device 1 can be mounted without affecting the vibration characteristics.

In the present embodiment, the surface acoustic wave element piece 2 is cantilevered via an adhesive 54 with respect to the base substrate 51.
Further, the installation surface 58 of the base substrate 51 is provided with an internal terminal pair (first terminal pair) 55 including a pair of internal terminals 55a and 55b. Here, the base substrate 51 constitutes a part of the package 5 and is a base on which the internal terminal pair 55 is provided.

In the present embodiment, the installation surface 58 has an annular shape so as to surround the surface acoustic wave element piece 2 in a plan view, and its inner peripheral edge is rectangular. Among the four peripheral edges, the surface is provided near the side corresponding to the side where the extraction electrode pair 24 of the surface acoustic wave element piece 2 described later is provided.
In addition, the active component 4 is placed on the installation surface 61 of the base substrate 51 via an adhesive 56 such as epoxy or polyimide. Thereby, the active component 4 is fixed on the base substrate 51.

  Such an active component 4 is not shown, but a terminal group (not shown) of a wiring pattern electrically connected to the internal terminal pair 55 described above, for example, via a metal wire (bonding wire) formed by wire bonding. )). Instead of the adhesive 56 and the metal wire, the active component 4 may be fixed on the base substrate 51 and electrically connected to the terminal group by so-called face-down bonding.

On the other hand, four external terminals 53a, 53b, 53c, and 53d are provided on the lower surface of the base substrate 51 so as to be positioned at the four corners.
Out of these four external terminals 53a to 53d, the external terminals 53a and 53b are electrically connected to the internal terminal pair 55 described above via conductor posts provided in via holes formed in the base substrate 51, respectively. This hot terminal is electrically connected to a wiring pattern (not shown). The other two external terminals 53c and 53d are used to increase the bonding strength and equalize the distance between the package 5 and the mounting substrate when the package 5 is mounted on the mounting substrate, respectively. This is a dummy terminal.

Note that the two external terminals 53c and 53d are electrically connected to a wiring pattern (not shown) electrically connected to the active component 4 as required, similarly to the external terminals 53a and 53b. 4 may be used as a writing terminal for rewriting (adjusting) various characteristics information (for example, temperature compensation information of the piezoelectric device 1) in the active component 4.
The external terminals 53a to 53b, the wiring pattern, and the like provided on the base substrate 51 can be formed, for example, by applying gold plating to a base layer of tungsten and nickel plating.

[Surface acoustic wave element]
Next, the surface acoustic wave element piece 2 will be described.
In this embodiment, the surface acoustic wave element piece (piezoelectric vibrating piece) 2 includes a piezoelectric substrate 21 and an IDT (Interdigital Transducer: comb) as an excitation electrode provided on the piezoelectric substrate 21 as shown in FIG. Tooth electrode) 22 and a pair of reflectors 23a and 23b disposed on both sides of the IDT 22.

The piezoelectric substrate 21 is made of quartz. Note that the piezoelectric substrate 21 may be made of a piezoelectric material other than quartz, such as lithium tantalate, lithium niobate, and lithium borate.
In the present embodiment, the piezoelectric substrate 21 is rectangular (more specifically, rectangular) in plan view.

The IDT 22 is provided on the upper surface of the piezoelectric substrate 21. The IDT 22 includes a pair of electrodes 22a and 22b having a plurality of electrode fingers parallel to each other, and is arranged such that the plurality of electrode fingers of the electrode 22a and the electrode fingers of the electrode 22b are engaged with each other. In the present embodiment, the plurality of electrode fingers of the electrodes 22 a and 22 b are arranged in the longitudinal direction of the piezoelectric substrate 21. When such a periodically changing voltage is applied between the electrodes 22a and 22b of the IDT 22, the piezoelectric effect of the piezoelectric substrate 21 causes a periodical period between the electrode finger of the electrode 22a and the electrode finger of the electrode 22b. Strain occurs, and a surface acoustic wave is excited near the upper surface of the piezoelectric substrate 21. The excited surface acoustic wave propagates along the arrangement direction of the electrode fingers of the electrodes 22a and 22b (that is, the longitudinal direction of the piezoelectric substrate 21).
As described above, since the IDT 22 is provided on the upper surface of the piezoelectric substrate 21, even after the piezoelectric substrate 21 is placed on the base substrate 51, the surface acoustic wave of the surface acoustic wave element piece 2 is processed and processed. Frequency adjustment can be performed.

The pair of reflectors 23a and 23b are arranged on both sides of the IDT 22 in the above-described propagation direction of the surface acoustic wave. Such reflectors 23a and 23b have a function of reflecting the surface acoustic wave propagating to the piezoelectric substrate 21 and confining it between the reflectors 23a and 23b.
The IDT 22 and the reflectors 23a and 23b are formed so as to be shifted to one end side in the longitudinal direction of the piezoelectric substrate 21 (right end side in FIG. 2). An extraction electrode pair (second electrode pair) 24 including a pair of extraction electrodes 24 a and 24 b is formed on the other end side (left end side in FIG. 2) of the piezoelectric substrate 21. The extraction electrode 24a is electrically connected to the electrode 22a via the wiring 25a, and the extraction electrode 24b is electrically connected to the electrode 22b via the wiring 25b.

  The lead electrode pair 24 is provided in the vicinity of the internal terminal pair 55 described above. That is, the internal terminal 55 a of the internal terminal pair 55 is provided in the vicinity of the extraction electrode 24 a of the extraction electrode pair 24, and the internal terminal 55 b of the internal terminal pair 55 is provided in the vicinity of the extraction electrode 24 b of the extraction electrode pair 24. As a result, even if the dimensions of the first passive component 31 and the second passive component 32 are relatively small, the first passive component 31 and the second passive component 32, the internal terminal pair 55 and the drawer as described later. Bonding with the electrode pair 24 can be performed.

In the present embodiment, a line segment that connects the center of the internal terminal 55 a of the internal terminal pair 55 and the center of the extraction electrode 24 a of the extraction electrode pair 24, the center of the internal terminal 55 b of the internal terminal pair 55, and the extraction electrode of the extraction electrode pair 24. The line connecting the center of 24b is parallel.
Further, both terminals (both electrodes) of the extraction electrode pair 24 are provided in the vicinity of one side of the piezoelectric substrate 21. Thereby, the piezoelectric substrate 21 can be cantilevered by the first passive component 31 and the second passive component 32. Therefore, it is possible to prevent unintentional deformation and distortion due to thermal expansion of the piezoelectric substrate 21 in the direction in which the electrode fingers of the IDT 22 are arranged. As a result, the reliability of the piezoelectric device 1 can be improved.

The IDT 22, the reflectors 23a and 23b, the extraction electrodes 24a and 24b, and the wirings 25a and 25b can be formed of a metal material having excellent conductivity such as aluminum and aluminum alloy, respectively.
By providing such a piezoelectric vibrating piece 2, the piezoelectric device 1 can constitute a SAW device such as a SAW resonator or a SAW oscillator.

[First passive component and second passive component]
The first passive component 31 includes an extraction electrode 24a that is one terminal of the above-described extraction electrode pair 24 (first terminal pair) and one terminal of the above-described internal terminal pair 55 (second terminal pair). Each internal terminal 55a is electrically connected.
The second passive component 32 includes an extraction electrode 24b which is the other terminal of the extraction electrode pair 24 (first terminal pair) described above and the other of the internal terminal pair 55 (second terminal pair) described above. Each is electrically connected to an internal terminal 55b which is a terminal.

  In particular, the first passive component 31 is joined so as to straddle the extraction electrode 24a and the internal terminal 55a. More specifically, as shown in FIG. 3, one terminal 311 of the first passive component 31 is joined to the internal terminal 55 a through the conductive adhesive 62, and the other of the first passive component 31. The terminal 312 is joined to the extraction electrode 24 a through the conductive adhesive 63. Here, the conductive adhesives 62 and 63 are not particularly limited, but epoxy-based or polyimide-based conductive adhesives containing conductive particles can be used.

Similarly, the second passive component 32 is joined so as to straddle the extraction electrode 24b and the internal terminal 55b.
By disposing the first passive component 31 and the second passive component 32 in this way, a part of the first passive component 31 and the second passive component 32 when the piezoelectric substrate 21 is viewed in plan view. Are arranged so as to overlap with the piezoelectric substrate 21, respectively. As a result, the piezoelectric device 1 can be downsized.

Further, the first passive component 31 and the second passive component 32 and the extraction electrode pair 24 and the internal terminal pair 55 can be easily joined without using a complicated method such as wire bonding. Therefore, the manufacture of the piezoelectric device 1 can be facilitated.
Further, the first passive component 31 and the second passive component 32 each have a longitudinal shape. And in this embodiment, the 1st passive component 31 and the 2nd passive component 32 are arrange | positioned so that a mutual longitudinal direction may become parallel.
In addition, the bonding of the first passive component 31 to the internal terminal pair 55 and the extraction electrode pair 24 and the bonding of the second passive component 32 to the internal terminal pair 55 and the extraction electrode pair 24 are performed by conductive bonding. Since it is performed by the agents 62 and 63, these can be joined easily and reliably.

Depending on the types of the first passive component 31 and the second passive component 32, the constituent materials of the internal terminal pair 55 and the extraction electrode pair 24, etc., these connections may be made by solder, for example.
Each of the first passive component 31 and the second passive component 32 is a chip component. Since the chip component can be surface-mounted, it can be easily and reliably joined to the internal terminal pair 55 and the extraction electrode pair 24.

The chip component used for the first passive component 31 and the second passive component 32 is not particularly limited, and is any one of a resistor, a capacitor, and a coil.
These passive components (resistors, capacitors, and coils) constitute a part of the oscillation circuit of the piezoelectric device 1 (see FIG. 4), which will be described in detail later. In particular, since the coil is difficult to be incorporated in an active component 4 such as an IC described later, when an oscillation circuit is incorporated in the piezoelectric device 1, it is mounted on the piezoelectric device 1 separately from the active component 4 such as an IC. The Rukoto. Therefore, by using (effectively using) such passive components as the first passive component 31 and the second passive component 32, the mounting area of the electronic components mounted in the piezoelectric device 1 can be reduced. As a result, the piezoelectric device 1 can be effectively downsized.

[Active parts]
The active component (electronic component) 4 is, for example, an integrated circuit element (IC), and functions to constitute an oscillation circuit in cooperation with the surface acoustic wave element piece 2, the first passive component 31, and the second passive component 32. Have
Such an active component 4 is electrically connected to the first passive component 31 and the second passive component 32 described above. Thereby, an oscillation circuit can be incorporated in the piezoelectric device 1.

For example, as shown in FIG. 4, the active component 4 includes a feedback resistor _{R f,} an inverter Inv, the gate capacitance _{C G,} the drain capacitance _{C D.}
When the first passive component 31 and the second passive component 32 described above are coils, the surface acoustic wave element piece 2, the first passive component 31, the second passive component 32, and the active component 4, An oscillation circuit as shown in FIG.

When the first passive component 31 is a resistor and the second passive component 32 is a coil, the surface acoustic wave element piece 2, the first passive component 31, the second passive component 32, and the active component 4 are used. Constitutes an oscillation circuit as shown in FIG.
When the first passive component 31 is a capacitor and the second passive component 32 is a coil, the surface acoustic wave element piece 2, the first passive component 31, the second passive component 32, and the active component 4 are Thus, an oscillation circuit as shown in FIG.
In the present embodiment, the active component 4 is disposed so as to overlap at least a part of the first passive component 31 and the second passive component 32 when the piezoelectric substrate 21 is viewed in plan. Thereby, size reduction of the piezoelectric device 1 incorporating the oscillation circuit can be achieved.

According to the piezoelectric device 1 as described above, the first passive component 31 is joined so as to straddle the internal terminal 55a and the extraction electrode 24a, and the second passive component 32 is connected to the internal terminal 55b and the extraction electrode 24b. Since the piezoelectric substrate 21 is viewed in plan, a part of the first passive component 31 and the second passive component 32 are arranged so as to overlap with the piezoelectric substrate 21, respectively. The As a result, the piezoelectric device 1 can be downsized.
Further, the first passive component 31 and the second passive component 32 can be easily joined to the internal terminal pair 55 and the extraction electrode pair 24 without using a complicated method such as wire bonding. Therefore, the manufacture of the piezoelectric device 1 can be facilitated.

Second Embodiment
Next, a second embodiment of the piezoelectric device of the present invention will be described.
FIG. 5 is a top view showing a second embodiment of the piezoelectric device of the present invention.
Hereinafter, the piezoelectric device according to the second embodiment will be described focusing on the differences from the above-described embodiment, and description of similar matters will be omitted.

The piezoelectric device of the second embodiment is substantially the same as the first embodiment except that the arrangement of the first terminal pair and the second terminal pair and the configuration related thereto are different. In FIG. 5, the same reference numerals are given to the same configurations as those in the above-described embodiment.
As shown in FIG. 5, the piezoelectric device 1A of the present embodiment includes a surface acoustic wave element piece 2A, a first passive component 31, a second passive component 32, an active component 4, and a package 5A that houses them. Have.

The package 5A includes a tray-like base substrate 51A that opens upward, and a plate-like lid member 52A that is provided so as to close the opening of the base substrate 51A.
Further, the surface acoustic wave element piece 2A, the active component 4, the internal terminal pair 55A, and a wiring pattern (not shown) are provided on the upper surface of the base substrate 51A.
More specifically, the upper surface of the base substrate 51A has an installation surface (first surface) 58A and an installation surface (second surface) 59A at a position lower than the installation surface 58A.
A stepped portion 57A is formed between the installation surface 58A and the installation surface 59A.

The surface acoustic wave element piece 2A is fixed to the installation surface 59A of the base substrate 51A via adhesives 54a, 54b such as epoxy or polyimide.
Further, the adhesives 54a and 54b are formed in a range that overlaps with a formation region of a later-described extraction electrode pair 24A when a later-described piezoelectric substrate 21A is viewed in plan.
In the present embodiment, the surface acoustic wave element piece 2A is supported on both sides of the base substrate 51A via adhesives 54a and 54b.
Further, the installation surface 58A of the base substrate 51A is provided with an internal terminal pair (first terminal pair) 55A including a pair of internal terminals 55a and 55b.
The active component 4 is placed on the installation surface 58 </ b> A of the base substrate 51 via an epoxy or polyimide adhesive 56.

On the other hand, the surface acoustic wave element 2A includes a piezoelectric substrate 21A, an IDT 22 as an excitation electrode provided on the piezoelectric substrate 21A, a pair of reflectors 23a and 23b disposed on both sides of the IDT 22, and an extraction electrode. And a pair (second electrode pair) 24A.
The piezoelectric substrate 21A has a rectangular shape (specifically, a rectangular shape) in plan view.
An extraction electrode pair (second electrode) including a pair of extraction electrodes 24a and 24b is disposed in the vicinity of a pair of opposite sides of the piezoelectric substrate 21A (the upper side and the lower side on the left side in FIG. 5). Pair) 24A is formed.

More specifically, the extraction electrode 24a of the extraction electrode pair 24A is provided in the vicinity of one side of the pair of opposite sides of the piezoelectric substrate 21A, and the extraction electrode 24b of the extraction electrode pair 24A is the piezoelectric substrate. 21A is provided near the other side of the pair of sides.
Accordingly, the piezoelectric substrate 21 </ b> A can be supported at both ends by the first passive component 31 and the second passive component 32. Therefore, the piezoelectric substrate 21A can be stably fixed and supported with respect to the base substrate 51A. As a result, the reliability (especially impact resistance) of the piezoelectric device 1A can be improved.
In particular, in the present embodiment, the extraction electrode 24a of the extraction electrode pair 24A is provided in the vicinity of the center part of a pair of opposite sides of the piezoelectric substrate 21A, and the extraction electrode 24b of the extraction electrode pair 24A is the piezoelectric substrate. 21A is provided near the center of the other side of the pair of sides. Therefore, the piezoelectric substrate 21A can be stably fixed and supported with respect to the base substrate 51A.

Further, a line segment connecting the center of the internal terminal 55a of the internal terminal pair 55A and the center of the extraction electrode 24a of the extraction electrode pair 24A, the center of the internal terminal 55b of the internal terminal pair 55A and the center of the extraction electrode 24b of the extraction electrode pair 24A. And the line segment connecting the two are on the same line segment.
The extraction electrode 24a of the extraction electrode pair 24A is electrically connected to the electrode 22a via the wiring 25c, and the extraction electrode 24b of the extraction electrode pair 24A is electrically connected to the electrode 22b via the wiring 25d. ing.

The internal terminal 55a of the internal terminal pair 55A is provided in the vicinity of the extraction electrode 24a of the extraction electrode pair 24A, and the internal terminal 55b of the internal terminal pair 55A is provided in the vicinity of the extraction electrode 24b of the extraction electrode pair 24A.
The first passive component 31 includes an extraction electrode 24a which is one terminal of the extraction electrode pair 24A (first terminal pair) described above and one terminal of the internal terminal pair 55A (second terminal pair). It is joined so as to straddle a certain internal terminal 55a.

The second passive component 32 includes an extraction electrode 24b which is the other terminal of the extraction electrode pair 24A (first terminal pair) described above and the other terminal of the internal terminal pair 55A (second terminal pair). It is joined so as to straddle a certain internal terminal 55b.
The piezoelectric device 1A according to the second embodiment as described above can also exhibit the same effects as those of the piezoelectric device 1 according to the first embodiment described above.

<Third Embodiment>
Next, a third embodiment of the piezoelectric device of the present invention will be described.
FIG. 6 is a top view showing a third embodiment of the piezoelectric device of the present invention.
Hereinafter, the piezoelectric device according to the third embodiment will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.

The piezoelectric device of the third embodiment is substantially the same as the first and second embodiments except that the arrangement of the first terminal pair and the second terminal pair and the configuration related thereto are different. In FIG. 6, the same reference numerals are given to the same configurations as those in the above-described embodiment.
As shown in FIG. 6, the piezoelectric device 1B of the present embodiment includes a surface acoustic wave element piece 2B, a first passive component 31, a second passive component 32, an active component 4, and a package 5B that houses them. Have.

The package 5B includes a tray-like base substrate 51A that opens upward, and a plate-like lid member 52A that is provided so as to close the opening of the base substrate 51A.
Further, the surface acoustic wave element piece 2B, the active component 4, the internal terminal pair 55B, and a wiring pattern (not shown) are provided on the upper surface of the base substrate 51A.
The surface acoustic wave element piece 2B is fixed to the installation surface 59A of the base substrate 51A via adhesives 54c and 54d such as epoxy or polyimide.

The adhesives 54c and 54d are formed in a range that overlaps with a formation region of an extraction electrode pair 24B described later when the piezoelectric substrate 21A is viewed in plan.
In the present embodiment, the surface acoustic wave element piece 2B is cantilevered via the adhesives 54c and 54d with respect to the base substrate 51A.
The installation surface 58A of the base substrate 51A is provided with an internal terminal pair (first terminal pair) 55B including a pair of internal terminals 55a and 55b.

On the other hand, the surface acoustic wave element 2B includes a piezoelectric substrate 21A, an IDT 22 as an excitation electrode provided on the piezoelectric substrate 21A, a pair of reflectors 23a and 23b disposed on both sides of the IDT 22, and an extraction electrode. It has a pair (second electrode pair) 24B.
An extraction electrode pair (second electrode pair) composed of a pair of extraction electrodes 24a and 24b is located near two adjacent sides (the upper left side and the left side in FIG. 6) of the piezoelectric substrate 21A. 24B is formed.

More specifically, the extraction electrode 24a of the extraction electrode pair 24B is provided near one side of the piezoelectric substrate 21A, and the extraction electrode 24b of the extraction electrode pair 24B is adjacent to the one side of the piezoelectric substrate 21A. It is provided near the side to be.
Accordingly, even when the first passive component 31 and the second passive component 32 are different in size from each other, the first passive component 31 and the second passive component 32, the internal terminal pair 55B, and the extraction electrode can be easily obtained. Bonding with the pair 24B can be performed. Further, even if the sizes of the first passive component 31 and the second passive component 32 are changed, the first passive component 31 and the second passive component 32 can be changed without changing the configuration other than the first passive component 31 and the second passive component 32. The component 31 and the second passive component 32 can be joined to the internal terminal pair 55B and the extraction electrode pair 24B.

  In particular, in the present embodiment, the extraction electrode 24a of the extraction electrode pair 24B is provided at one end (the lower end in FIG. 6) of one side (the left side in FIG. 6) of the piezoelectric substrate 21A. The extraction electrode 24b of the extraction electrode pair 24B is provided at the other end portion (the upper end portion in FIG. 6) of the one side of the piezoelectric substrate 21A. Therefore, the piezoelectric substrate 21A can be cantilevered by the first passive component 31 and the second passive component 32.

The extraction electrode 24a of the extraction electrode pair 24B is electrically connected to the electrode 22a via the wiring 25e, and the extraction electrode 24b of the extraction electrode pair 24B is electrically connected to the electrode 22b via the wiring 25f. ing.
The internal terminal 55a of the internal terminal pair 55B is provided in the vicinity of the extraction electrode 24a of the extraction electrode pair 24B, and the internal terminal 55b of the internal terminal pair 55B is provided in the vicinity of the extraction electrode 24b of the extraction electrode pair 24B.

In the present embodiment, a line segment connecting the center of the internal terminal 55a of the internal terminal pair 55B and the center of the extraction electrode 24a of the extraction electrode pair 24B, the center of the internal terminal 55b of the internal terminal pair 55B, and the extraction electrode of the extraction electrode pair 24B. The line segment connecting the center of 24b is orthogonal.
The first passive component 31 includes an extraction electrode 24a that is one terminal of the above-described extraction electrode pair 24B (first terminal pair) and one terminal of the internal terminal pair 55B (second terminal pair). It is joined so as to straddle a certain internal terminal 55a.

The second passive component 32 includes an extraction electrode 24b which is the other terminal of the above-described extraction electrode pair 24B (first terminal pair) and the other terminal of the internal terminal pair 55B (second terminal pair). It is joined so as to straddle a certain internal terminal 55b.
The piezoelectric device 1B according to the third embodiment as described above can also exhibit the same effects as those of the piezoelectric device 1 according to the first embodiment described above.

<Fourth embodiment>
Next, a fourth embodiment of the piezoelectric device of the present invention will be described.
FIG. 7 is a top view showing a fourth embodiment of the piezoelectric device of the present invention.
Hereinafter, the piezoelectric device according to the fourth embodiment will be described focusing on the differences from the above-described embodiment, and description of similar matters will be omitted.

The piezoelectric device of the fourth embodiment is substantially the same as the first to third embodiments except that the arrangement of the first terminal pair and the second terminal pair and the configuration related thereto are different. In FIG. 7, the same reference numerals are given to the same components as those in the above-described embodiment.
As shown in FIG. 7, the piezoelectric device 1C of this embodiment includes a surface acoustic wave element piece 2C, a first passive component 31, a second passive component 32, an active component 4, and a package 5C that houses them. Have.

The package 5C includes a tray-like base substrate 51A that opens upward, and a plate-like lid member 52A that is provided so as to close the opening of the base substrate 51A.
Further, the surface acoustic wave element piece 2C, the active component 4, the internal terminal pair 55C, and a wiring pattern (not shown) are provided on the upper surface of the base substrate 51A.
A surface acoustic wave element piece 2C is fixed to the installation surface 59A of the base substrate 51A via adhesives 54c, 54d, 54e, 54f such as epoxy or polyimide.
The adhesives 54c and 54f are formed in a range that overlaps with a formation region of an extraction electrode pair 24C described later when the piezoelectric substrate 21A is viewed in plan.
Further, the installation surface 58A of the base substrate 51A is provided with an internal terminal pair (first terminal pair) 55C including a pair of internal terminals 55a and 55b.

On the other hand, the surface acoustic wave element piece 2C includes a piezoelectric substrate 21A, an IDT 22 as an excitation electrode provided on the piezoelectric substrate 21A, a pair of reflectors 23a and 23b disposed on both sides of the IDT 22, and an extraction electrode. A pair (second electrode pair) 24C is provided.
An extraction electrode pair (second electrode pair) composed of a pair of extraction electrodes 24a and 24b is located near two adjacent sides (the upper left side and the left side in FIG. 7) of the piezoelectric substrate 21A. 24C is formed.

More specifically, the extraction electrode 24a of the extraction electrode pair 24C is provided near one side of the piezoelectric substrate 21A, and the extraction electrode 24b of the extraction electrode pair 24C is adjacent to the one side of the piezoelectric substrate 21A. It is provided near the side to be.
In particular, in the present embodiment, the extraction electrode 24a of the extraction electrode pair 24C is provided at one corner of the pair of diagonals of the piezoelectric substrate 21A (left and lower corners in FIG. 7). The lead electrode 24b of the electrode pair 24C is provided at the other corner (the right and upper corner in FIG. 7) of the pair of diagonals of the piezoelectric substrate 21A. Therefore, both the piezoelectric substrate 21A can be supported by the first passive component 31 and the second passive component 32.

The extraction electrode 24a of the extraction electrode pair 24C is electrically connected to the electrode 22a via the wiring 25e, and the extraction electrode 24b of the extraction electrode pair 24C is electrically connected to the electrode 22b via the wiring 25g. ing.
The internal terminal 55a of the internal terminal pair 55C is provided in the vicinity of the extraction electrode 24a of the extraction electrode pair 24C, and the internal terminal 55b of the internal terminal pair 55C is provided in the vicinity of the extraction electrode 24b of the extraction electrode pair 24C.

In the present embodiment, a line segment connecting the center of the internal terminal 55a of the internal terminal pair 55C and the center of the extraction electrode 24a of the extraction electrode pair 24C, the center of the internal terminal 55b of the internal terminal pair 55C and the extraction electrode of the extraction electrode pair 24C. The line segment connecting the center of 24b is orthogonal.
The first passive component 31 includes an extraction electrode 24a which is one terminal of the extraction electrode pair 24C (first terminal pair) described above and one terminal of the internal terminal pair 55C (second terminal pair). It is joined so as to straddle a certain internal terminal 55a.

The second passive component 32 includes an extraction electrode 24b which is the other terminal of the extraction electrode pair 24C (first terminal pair) described above and the other terminal of the internal terminal pair 55C (second terminal pair). It is joined so as to straddle a certain internal terminal 55b.
The piezoelectric device 1B according to the fourth embodiment as described above can also exhibit the same effects as those of the piezoelectric device 1 according to the first embodiment described above.
The piezoelectric device 1 as described above can be incorporated into various electronic devices. An electronic apparatus including such a piezoelectric device 1 is highly reliable.

Here, an electronic apparatus including the piezoelectric device of the present invention will be described in detail with reference to FIGS.
FIG. 8 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus including the piezoelectric device of the present invention is applied.
In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably.
Such a personal computer 1100 incorporates a piezoelectric device 1 that functions as a filter, a resonator, a reference clock, and the like.

FIG. 9 is a perspective view showing a configuration of a mobile phone (including PHS) to which an electronic apparatus including the piezoelectric device of the present invention is applied.
In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204.
Such a cellular phone 1200 incorporates the piezoelectric device 1 that functions as a filter, a resonator, or the like.

FIG. 10 is a perspective view illustrating a configuration of a digital still camera to which an electronic apparatus including the piezoelectric device of the present invention is applied. In this figure, connection with an external device is also simply shown.
Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit is a finder that displays an object as an electronic image. Function.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.
In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

Such a digital still camera 1300 incorporates a piezoelectric device 1 that functions as a filter, a resonator, or the like.
In addition to the personal computer (mobile personal computer) shown in FIG. 8, the mobile phone shown in FIG. 9, and the digital still camera shown in FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments (For example, vehicle, aircraft, ship instrumentation) , It can be applied to a flight simulator or the like.
Although the piezoelectric device and the electronic apparatus of the present invention have been described based on the illustrated embodiments, the present invention is not limited to these.

DESCRIPTION OF SYMBOLS 1 ... Piezoelectric device 1A ... Piezoelectric device 1B ... Piezoelectric device 1C ... Piezoelectric device 2 ... Surface acoustic wave element piece 2A ... Surface acoustic wave element piece 2B ... Surface acoustic wave element piece 2C ... Surface acoustic wave Element 4 ... Active parts 5 ... Package 5A ... Package 5B ... Package 5C ... Package 21 ... Piezoelectric substrate 21A ... Piezoelectric substrate 22 ... Comb electrode 22a ... Electrode 22b ... Electrode 23a Reflector 23b Reflector 24 Extractor electrode pair 24A Extractor electrode pair 24B Extractor electrode pair 24C Extractor electrode pair 24a Extractor electrode 24b Extractor electrode 25a Wiring 25b Wiring 25c ... Wiring 25d ... Wiring 25e ... Wiring 25f ... Wiring 25g ... Wiring 31 ... First passive component 32 ... Second passive component 51 ... Base base 51A ... Base substrate 52 ... Lid member 52A ... Lid member 53a ... External terminal 53b ... External terminal 53c ... External terminal 53d ... External terminal 54 ... Adhesive 54a ... Adhesive 54b ... Adhesive 54c ... Adhesive 54d ... Adhesive 54e ... Adhesive 54f ... Adhesive 55 ... Internal terminal pair 55A ... Internal terminal pair 55B ... Internal terminal pair 55C ... Internal terminal pair 55a ... Internal terminal 55b ... Internal terminal 56 ... Adhesive 57 ... Step part 57A ... Step part 58 ... Installation surface 58A ... Installation surface 59 ... Installation surface 59A ... Installation surface 60 ... Step part 61 ... Installation surface 62 ... Conductive adhesive 63 ... Conductive adhesive 100 ... Display 311 ... Terminal 312 ... Terminal 1100 ... Personal computer 1102 ... Keyboard 1104 ... Body 11 6 ... Display unit 1200 ... Mobile phone 1202 ... Operation buttons 1204 ... Earpiece 1206 ... Mouthpiece 1300 ... Digital still camera 1302 ... Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Memory 1312 ‥‥ video signal output terminal 1314 ‥‥ output terminal 1430 ‥‥ television monitor 1440 ‥‥ personal computer C _D ‥‥ drain capacitance C _G ‥‥ gate capacitance Inv ‥‥ inverter R _f ‥‥ feedback resistor S ‥‥ interior space

Claims (18)

A base body provided with a first terminal pair;
A piezoelectric substrate fixed to the substrate; a comb electrode provided on the piezoelectric substrate; and a second electrode provided on the piezoelectric substrate and electrically connected to the comb electrode. A surface acoustic wave element including a terminal pair;
A first passive component electrically connected to one terminal of the first terminal pair and one terminal of the second terminal pair;
A second passive component electrically connected to the other terminal of the first terminal pair and the other terminal of the second terminal pair;
The first passive component is joined so as to straddle one terminal of the first terminal pair and one terminal of the second terminal pair,
The piezoelectric device is characterized in that the second passive component is joined so as to straddle the other terminal of the first terminal pair and the other terminal of the second terminal pair.   The piezoelectric device according to claim 1, wherein each of the first passive component and the second passive component is a chip component.   The piezoelectric device according to claim 2, wherein the chip component is one of a resistor, a capacitor, and a coil. The base has a step portion that forms a first surface and a second surface at a position lower than the first surface;
The first terminal pair is provided on the first surface;
The piezoelectric substrate is provided on the second surface,
4. The piezoelectric device according to claim 1, wherein the second terminal pair is provided on a surface opposite to the second surface of the piezoelectric substrate. 5.   The piezoelectric device according to claim 4, wherein the comb electrode is provided on a surface opposite to the second surface of the piezoelectric substrate.   The piezoelectric device according to claim 4 or 5, wherein the piezoelectric substrate is fixed to the second surface via an adhesive.   The piezoelectric device according to claim 6, wherein the adhesive is formed in a range that overlaps a formation region of the second electrode pair when the piezoelectric substrate is viewed in plan.   The piezoelectric device according to claim 6 or 7, wherein the adhesive is provided in a range that does not overlap the comb-tooth electrode when the piezoelectric substrate is viewed in plan.   The piezoelectric device according to claim 4, wherein a height of the stepped portion is equal to a thickness of the piezoelectric substrate.   The junction between the first passive component and the first terminal pair and the second terminal pair, and the junction between the second passive component and the first terminal pair and the second terminal pair are as follows: The piezoelectric device according to claim 1, wherein each of the piezoelectric devices is performed with a conductive adhesive. A package containing the surface acoustic wave element piece and the passive component;
The piezoelectric device according to claim 1, wherein the base constitutes a part of the package. One terminal of the first terminal pair is provided in the vicinity of one terminal of the second terminal pair,
The piezoelectric device according to claim 1, wherein the other terminal of the first terminal pair is provided in the vicinity of the other terminal of the second terminal pair. The piezoelectric substrate has a rectangular shape in plan view,
The piezoelectric device according to claim 1, wherein both terminals of the second terminal pair are provided near one side of the piezoelectric substrate. The piezoelectric substrate has a rectangular shape in plan view,
One terminal of the second terminal pair is provided in the vicinity of one side of the pair of opposite sides of the piezoelectric substrate, and the other terminal of the second terminal pair is provided on the piezoelectric substrate. The piezoelectric device according to claim 1, wherein the piezoelectric device is provided near the other side of the pair of sides. The piezoelectric substrate has a rectangular shape in plan view,
One terminal of the second terminal pair is provided in the vicinity of one side of the piezoelectric substrate, and the other terminal of the second terminal pair is a side adjacent to the one side of the piezoelectric substrate. The piezoelectric device according to claim 1, wherein the piezoelectric device is provided in the vicinity.   The piezoelectric device according to claim 1, further comprising an active component electrically connected to the first passive component and the second passive component.   The piezoelectric device according to claim 16, wherein the active component is disposed so as to overlap at least part of the first passive component and the second passive component when the piezoelectric substrate is viewed in plan.   An electronic apparatus comprising the piezoelectric device according to claim 1.

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