JP2011233716A - Component built-in module, camera module, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve performance of active electronic components or other integrated electronic components by gently suppressing heat conduction, where the heat is generated at an integrated electronic component and conducting to active electronic components or other integrated electronic components, which suppresses excessive increase and ununiformity of operating temperature of active electronic components or other integrated electronic components.SOLUTION: A heat generating integrated electronic component 10A is disposed on a wiring layer 4A separated from but laid on the same layer as a wiring layer 4. The generated heat from the integrated electronic component 10A is conducted to a wiring pattern or the like on an underneath wiring layer 5 from the wiring layer 4A through an interlayer connection part 6, then conducted from the wiring pattern of the wiring layer 5 to a side of an active electronic component 12 and conducted from the wiring layer 5 to external of a multilayer substrate 11 through the multilayer substrate 11, then the heat is rid to external.

Description

  The present invention is a component built-in module incorporating an electronic component, for example, a camera module using a solid-state imaging device that performs photoelectric conversion of image light from a subject, and the camera module as an image input device in an imaging unit. For example, digital cameras such as digital video cameras and digital still cameras; image input cameras such as surveillance cameras; electronic devices such as scanner devices, facsimile devices, television telephone devices, and mobile phone devices with cameras; Related to electronic equipment.

  As this type of conventional component built-in module, for example, a camera module used for a digital still camera, a camera-equipped mobile phone device, or the like is required to be a small module with high color reproducibility.

  An example of a conventional camera module incorporating various electronic components is shown in Patent Document 1.

  8A is a schematic cross-sectional view of a conventional component built-in module disclosed in Patent Document 1, and FIG. 8B is a schematic cross-sectional explanatory diagram of a conventional camera module disclosed in Patent Document 1. is there.

  As shown in FIGS. 8A and 8B, in the conventional component built-in module 100 (or camera module 100A), the multilayer substrate P1 has a layer structure of two or more layers in order to reduce the substrate area. Is used. In the multilayer substrate P 1, a plurality of conductor pads 102 are stacked by the interlayer connection portion 101, and these are insulated by the insulating material 103.

  Built-in electronic components such as a resistor 104 and a capacitor 105 are arranged below the multilayer substrate P1. From the surface side on which these resistors 104 and capacitors 105 are mounted, an insulating material 106 and a copper foil 107 are sequentially stacked on the insulating material 106, and pressure-bonded by a laminating press by heating to obtain a component built-in multilayer board.

  In the insulating material 106, in consideration of the height of the chip component in the thickness direction, it is preferable to previously form a through hole at the mounting position of the chip component. This is because when the insulating material 106 is stacked, the height of the chip component follows the surface layer position and suppresses the occurrence of irregularities in the surface layer portion of the entire multilayer substrate. A multi-layer substrate having a good flatness can be obtained without causing irregularities in the surface copper foil 107 after the stacking is completed.

  In the conventional component built-in module 100 shown in FIG. 8A, the active electronic component 109 such as an LSI is connected by the solder connecting portion 110 using a material such as a solder ball on the end face through hole 108 and the conductor pad 102. To do.

  In the conventional camera module 100A shown in FIG. 8 (b), an image pickup element in which an image pickup region 111 for picking up an image is provided in the center using a material such as a solder ball on the end face through hole 108 and the conductor pad 102. The chip 112 is connected from the surface by the solder connection part 110. As described above, as the imaging element chip 112, an imaging component such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) is soldered by the solder connection portion 110, and the lens 113 is provided at an upper position facing the imaging area 111. As shown, a lens frame 114 to which the lens 113 is fixed is attached above the multilayer substrate P1.

  A solder connection portion 115 is used by a solder ball or the like on the surface of the conductor pad 102a on the back side of the component built-in module 100 and the camera module 100A, and the conventional component built-in module 100 and camera module 100A are electrically mounted on the flexible sheet 116. Mounted by connecting to.

JP 2007-165460 A

In the above conventional configuration, when a built-in electronic component that generates heat is arranged and connected at a short distance such as a wiring length with respect to an imaging component such as a sensor as an active electronic component, heat generated from the built-in electronic component is detected by the sensor. If the structure is such that the heat transfer is easily performed by the image pickup component, the operation temperature of the image pickup component such as the sensor is excessively increased, and the operation temperature is uneven in the image pickup area. As described above, when the operating temperature of an imaging component such as a sensor increases, dark current increases and noise increases, and when temperature non-uniformity in the imaging area increases, a correction error increases and There is a problem that the color reproducibility deteriorates.

  The present invention solves the above-mentioned conventional problems, and suppresses heat conduction of the heat generated from the built-in electronic component to the active electronic component and other built-in electronic components more gently, thereby reducing the active electronic component and other built-in electronic components. A component built-in module that can improve the performance of active electronic components and other built-in electronic components by suppressing excessive operating temperature rise and non-uniformity of components, and heat conduction to, for example, image sensors as active electronic components A camera module that can suppress the excessive increase in the operating temperature of the image sensor and can improve the color reproducibility with a small size. For example, a digital still camera or a camera-equipped mobile phone using the camera module as an image input device as an image input device It is an object of the present invention to provide an electronic device such as a telephone device and an electronic device using the component built-in module.

  The component built-in module according to the present invention includes a multilayer wiring structure in which active electronic components are mounted on the uppermost wiring layer, and wiring between upper and lower wiring layers is connected by an interlayer connection portion, and covers the periphery of the multilayer wiring structure. A component built-in module having a multilayer substrate in which a connection terminal is provided on the back surface wiring connected to the wiring of the lowermost wiring layer of the multilayer wiring structure, and a heat-generating built-in electronic component incorporated in the multilayer substrate. In the wiring layer to which the heat generating built-in electronic component is connected, the power line and the ground line of the heat generating built-in electronic component and the power line and the ground line of the active electronic component are electrically separated from each other. This achieves the above object.

  Preferably, in each wiring layer of the multilayer wiring structure in the component built-in module of the present invention, and in the wiring layer in the direction in which the connection terminal is located from the wiring layer to which the heat generating built-in electronic component is connected, The power supply line and the ground line of the built-in electronic component are electrically isolated from the power supply line and the ground line of the active electronic component.

  Further preferably, the power supply line and ground line of the heat-generating built-in electronic component in the component built-in module of the present invention, and the power supply line and ground line of the active electronic component are among the wiring layers of the multilayer wiring structure, It is electrically connected only to the lowest wiring layer closest to the multilayer substrate.

  Further preferably, the power supply line and the ground line of the heat generating built-in electronic component and the power supply line and the ground line of the active electronic component in the component built-in module of the present invention are electrically connected in the back surface wiring of the multilayer substrate. They are separated independently or commonly connected electrically.

  Further preferably, in the layer in which the heat generating built-in electronic component is arranged in the component built-in module of the present invention, the wiring layer connected to the heat generating built-in electronic component is arranged separately from the same wiring layer. Has been. That is, preferably, in the module with a built-in component according to the present invention, the arrangement layer of the heat generating built-in electronic component is connected to the first wiring layer to which the heat generating built-in electronic component is connected and the heat generating built-in electronic component. Consists of a second wiring layer that is not.

  Further preferably, the wiring layer to which the heat generating built-in electronic component in the component built-in module of the present invention is connected is one of the wiring layers of the multilayer wiring structure.

  Further preferably, in the layer immediately below the layer in which the heat generating built-in electronic component is arranged in the component built-in module of the present invention, the wiring layer including the power supply line and the ground line of the heat generating built-in electronic component is the same layer. Separated from the wiring layer. That is, preferably, the wiring layer immediately below the wiring layer to which the heat generating built-in electronic component in the component built-in module of the present invention is connected is the first wiring including the power line and the ground line of the heat generating built-in electronic component. And a second wiring layer not including a power line and a ground line of the heat-generating built-in electronic component.

  Further, preferably, the heat generating built-in electronic component in the component built-in module of the present invention is electrically connected only to the wiring layer in the direction in which the connection terminal is present.

  Further preferably, each wiring layer of the multilayer wiring structure is disposed in a region other than directly above the heat-generating built-in electronic component in the component built-in module of the present invention.

  Further preferably, the active electronic component in the component built-in module of the present invention is an image sensor that images a target object.

  Further preferably, the active electronic component in the component built-in module of the present invention is a light emitting element that irradiates light to an object and / or a light receiving element that receives light from the object.

  Further preferably, the active electronic component in the component built-in module of the present invention is an LSI chip.

  The camera module according to the present invention includes a component built-in module according to the present invention, a lens disposed between the object and the active electronic component, and a lens position that freely displaces the position of the lens with respect to the active electronic component. It has a displacement means and a driver as the heat-generating built-in electronic component that drives the lens position displacement means to control the position of the lens, thereby achieving the above object.

  Preferably, in the component built-in module in the camera module of the present invention, at least one of the ground line of the heat-generating built-in electronic component and the ground line of the active electronic component forms a metal frame constituting an outer wall. Is electrically connected.

  Further preferably, the lens position displacement means in the camera module of the present invention has an electromagnet and a voice coil, and a resistance means is connected in series to the voice coil.

  Further preferably, the resistance means in the camera module of the present invention is mounted on the surface side of the multilayer substrate.

  An electronic apparatus according to the present invention is equipped with the component built-in module according to the present invention, thereby achieving the above object.

  The electronic apparatus according to the present invention uses the camera module according to the present invention as an image input device in an imaging unit, and thereby achieves the above-described object.

  With the above configuration, the operation of the present invention will be described below.

  In the component built-in module of the present invention, in the wiring layer on which the heat-generating built-in electronic components are mounted, and in the wiring layer of the multilayer wiring structure in the same layer, the power supply line and the ground line of the heat-generating built-in electronic components, The power line and the ground line of the active electronic component are electrically separated from each other. In addition, in each wiring layer of the multilayer wiring structure and the wiring layer in the direction in which the connecting terminal on the back surface is located from the wiring layer on which the heat generating built-in electronic components are mounted, the power line and the ground line of the heat generating built-in electronic components The power supply line and the ground line of the active electronic component are electrically separated from each other.

  In the camera module of the present invention, the component built-in module of the present invention, a lens disposed between the object and the active electronic component, and a position of the lens with respect to the active electronic component can be displaced freely. Lens position displacing means, and a driver as the heat-generating built-in electronic component that drives the lens position displacing means to control the position of the lens.

  As described above, since the power supply line and the ground line of the heat-generating built-in electronic component and the power supply line and the ground line of the active electronic component are electrically separated from each other, active electrons generated from the built-in electronic component are activated. Suppress heat conduction to components and other built-in electronic components more slowly, suppress excessive operating temperature rise and non-uniformity of active electronic components and other built-in electronic components, The performance of parts can be improved.

  As described above, according to the present invention, the power supply line and the ground line of the heat-generating built-in electronic component and the power supply line and the ground line of the active electronic component are electrically separated from each other. Active electronic components by suppressing heat conduction to active electronic components and other built-in electronic components more slowly, and suppressing excessive operating temperature rise and non-uniformity of active electronic components and other built-in electronic components And the performance of other built-in electronic components can be improved.

It is a longitudinal cross-sectional view which shows the principal part structural example of the component built-in module in Embodiment 1 of this invention. It is a longitudinal cross-sectional view which shows the principal part structural example of the component built-in module in Embodiment 2 of this invention. It is a longitudinal cross-sectional view which shows the principal part structural example of the camera module in Embodiment 3 of this invention. It is a longitudinal cross-sectional view which shows the example of a principal part structure of the camera module in Embodiment 4 of this invention. It is a longitudinal cross-sectional view which shows the example of a principal part structure of the camera module in Embodiment 5 of this invention. FIG. 6 is a circuit diagram illustrating a configuration example of a coil connection portion of a driver in the camera module of FIG. 5. It is a block diagram which shows the schematic structural example of the electronic device which used either of the camera modules of Embodiment 3-5 of this invention for the imaging part as Embodiment 6 of this invention. (A) is a schematic sectional drawing of the conventional component built-in module currently disclosed by patent document 1, (b) is a schematic sectional drawing of the conventional camera module currently disclosed by patent document 1. FIG.

  Embodiments 1 and 2 of the component built-in module of the present invention, Embodiments 3 to 5 when any one of Embodiments 1 and 2 of the component built-in module of the present invention is applied to a camera module, and these camera modules An electronic device such as a mobile phone device with a camera using any one of Embodiments 3 to 5 as an image input device in an imaging unit, and an electronic device using any one of Embodiments 1 and 2 of this component built-in module Embodiment 6 will be described in detail with reference to the drawings. In addition, each thickness, length, etc. of the structural member in each figure are not limited to the structure to illustrate from a viewpoint on drawing preparation.

(Embodiment 1)
FIG. 1 is a longitudinal sectional view showing an example of the configuration of the main part of a component built-in module according to Embodiment 1 of the present invention.

  In FIG. 1, the component built-in module 30A according to the first embodiment has been reduced in size, and in order to improve wiring efficiency from the viewpoint of improving wiring density and routing of circuit wiring, It has a five-layer configuration (not limited to a five-layer configuration but a multiple-layer configuration) in which an interlayer connection 6 is interposed. This component built-in module 30A includes each of the built-in electronic components 7 to 9 mounted on the wiring layers 2, 4 and 5, respectively, and the heat generation mounted on the wiring layer 4A which is the same layer as the wiring layer 4 and is separated from the wiring layer 4A. Built-in electronic component 10A, a part on wiring layer 1 (covering a part other than active electronic component 12 to be described later), multilayer substrate 11 covering the side and bottom surfaces of a five-layer structure, and the center on wiring layer 1 And an active electronic component 12 mounted at a position.

  The wiring layers 1 to 5 are configured to support each layer with an interlayer connection portion 6 of a conductive material interposed between the wiring layers 1 to 5. Between each of the wiring layers 1 to 5, an insulating layer (such as a resin layer or an air layer) is interposed and insulated except for the interlayer connection portion 6 made of a conductive material. Although the built-in electronic component 10 </ b> A is located immediately below the active electronic component 12, it is mounted on the wiring layer 4 </ b> A separated from the wiring layer 4, and the wiring layer 4 </ b> A is connected to the wiring layer 4 </ b> A via the interlayer connection portion 6. It is electrically and thermally connected to the wiring layer 5 immediately below. As a result, the component built-in module 30A conducts heat from the built-in electronic component 10A through the wiring pattern or other conductive material to the wiring layer 5 via the interlayer connection portion 6, and further to the wiring. The layer 5 is configured to conduct heat to the wiring pattern outside the multilayer substrate 11 and the solder balls 11a.

  The interlayer connection portion 6 is made of a conductive material, supports the wiring layer immediately above, and electrically connects the upper and lower wiring layers.

  The built-in electronic components 7 to 9 include various elements such as capacitors as components that do not generate heat. The built-in electronic component 10 </ b> A includes a heat generating element such as a driver, a regulator, an LSI chip, and a resistance element as a heat generating component. Examples of the driver include a driver for driving a voice coil for autofocus. As the regulator, for example, when the active electronic component 12 uses a voltage different from that of other components outside the module, the regulator is used inside the module. Although only one built-in electronic component 10A is shown here, a plurality of drivers and regulators may be used.

  The multilayer substrate 11 has active electronic components 12 mounted on the top surface and has a plurality of solder balls 11a on the back surface using a solder material. The solder ball 11a is electrically connected to the active electronic component 12, the built-in electronic components 7 to 9 and 10A, the wiring layers 1 to 5, and the interlayer connection portions 6 therebetween.

  The active electronic component 12 includes various LSI chips, laser elements and LEDs (Light Emitting Diodes) as light emitting elements, photodiodes as light receiving elements, and a plurality of light receiving elements for photoelectrically converting image light from a subject Is an image sensor or the like arranged in a planar shape. In particular, since the image sensor generates a large number of signal charges and performs image processing, the image is greatly affected by heat.

  The wiring layer 4A on which the built-in electronic component 10A is mounted, and the power supply line and the GND line of the active electronic component 12 and the built-in electronic component 10A disposed inside the multilayer substrate 11 in the wiring layer 4 in the same layer. The power supply line and the GND line are separated from each other by wiring patterns and are electrically independent. Here, the wiring layer 4A and the wiring layer 4 are separately separated in the same layer.

  The built-in electronic component 10A is not provided in the wiring layer 3 closer to the top surface, but is provided in the wiring layer 4A in the same layer as the wiring layer 4 closer to the bottom surface. In the wiring layer 4A, wiring connected to the built-in electronic component 10A The wiring connected to the active electronic component 12 is structured so as not to be connected to each other in the same layer, thereby further suppressing the heat generated from the built-in electronic component 10B from being conducted to the active electronic component 12.

  With the above configuration, heat generated from the built-in electronic component 10 </ b> A is sequentially conducted from the terminal of the built-in electronic component 10 </ b> A downward to the multilayer substrate 11 from the wiring layer 5 via the wiring layer 4 </ b> A and the interlayer connection portion 6. Then, heat conduction is sequentially performed from the wiring pattern of the wiring layer 5 through the wiring patterns of the wiring layers 4 to 1 and the interlayer connection portions 6 therebetween, and is conducted to the active electronic component 12 side.

  On the other hand, the heat transmitted to the back surface of the multilayer substrate 11 is once taken out of the multilayer substrate 11 through the solder balls 11a and then cooled by the outside air. The heat reenters the multilayer substrate 11 and is successively conducted through the wiring patterns of the wiring layers 5-1 and the interlayer connection portions 6 therebetween. Further, the heat conducted to the uppermost wiring layer 1 is transferred to the active electronic component 12.

  Therefore, according to the first embodiment, the built-in electronic component 10A that generates heat is mounted on the same wiring layer 4A that is separated from the wiring layer 4, and the heat generated from the built-in electronic component 10A is transmitted from the wiring layer 4A. Heat conduction is performed to the wiring pattern of the wiring layer 5 below the interlayer connection portion 6, and the heat is transferred from the wiring pattern of the wiring layer 5 to the active electronic component 12 side and from the wiring layer 5 to the solder ball. Heat is conducted to the outside of the multilayer substrate 11 through 11a, and the heat is taken out to the outside. As described above, the heat from the built-in electronic component 10 </ b> A is once taken out of the multilayer substrate 11, and then detoured, and is sequentially conducted to the wiring layers 5-1 to be transmitted to the active electronic component 12. As a result, the heat conduction from the built-in electronic component 10A to the active electronic component 12 can be reduced more slowly by turning it downward, and an excessive increase in the operating temperature and temperature non-uniformity of the active electronic component 12 can be suppressed. It is possible to suppress the malfunction of the active electronic component 12 and improve its performance. For this reason, it is particularly suitable for semiconductor components such as an image pickup device in which an increase in operating temperature is a problem.

  In short, since the built-in electronic component 10A is electrically connected to the surface in the direction opposite to the surface on which the active electronic component 12 is installed, the heat generated from the built-in electronic component 10A is generated by the active electronic component. The rate of heat conduction to 12 can be suppressed.

Since the power supply line and the GND line of the active electronic component 12 and the built-in electronic component 10A are electrically connected only to the wiring layer 5 closest to the bottom surface of the multilayer substrate 11, the heat generated in the built-in electronic component 10A It is possible to suppress the rate of heat conduction to the active electronic component 12 by turning away from the wiring layer 4A on which the component 10A is mounted to the wiring layer 5 by one layer downward. Furthermore, since it goes through the wiring layer 5, it becomes easy to radiate the heat to the outside through the solder 11a, and an increase in temperature can be suppressed. In this structure, the power supply terminal and the GND terminal of the multilayer substrate 11 can be shared by the active electronic component 12 and the built-in electronic component 10A, and is particularly suitable for a module in which the number of terminals is limited.
(Embodiment 2)
In the first embodiment, the built-in electronic component 10A that generates heat is mounted on the same wiring layer 4A that is separated from the wiring layer 4, and the heat generated from the built-in electronic component 10A is detoured through the wiring layer 5 immediately below it. Then, the wiring layers 4 to 1 are sequentially conducted with heat, and the wiring layer 5 is rotated around the multilayer substrate 11 so that the heat conduction is sequentially performed from the multilayer substrate 11 to the wiring layers 5 to 1 so that the heat is transmitted to the active electronic component 12. In the second embodiment, in addition to this, the built-in electronic component 10B that generates heat is removed from directly below the active electronic component 12 and disposed sideways, and the wiring layer 4B on which the built-in electronic component 10B is mounted is wired. A case where the wiring layer 5B is separated from the layer 4 and the wiring layer 5B below the layer 4 is separated from the wiring layer 5 will be described.

  FIG. 2 is a longitudinal sectional view showing a configuration example of a main part of a component built-in module according to Embodiment 2 of the present invention.

  In FIG. 2, the component built-in module 30 </ b> B according to the second embodiment has been reduced in size, and in order to improve the wiring efficiency from the viewpoint of improving the wiring density and routing the circuit wiring, Further, a five-layer structure (not limited to a five-layer structure but a multiple-layer structure) in which interlayer connection portions 6 of conductive material are respectively interposed. The component built-in module 30B includes the built-in electronic components 7 to 9 mounted on the wiring layers 3 to 5 and the heat-generating built-in electronic mounted on the wiring layer 4B which is the same layer as the wiring layer 4 and separated from the wiring layer 4B. The component 10B, a part on the wiring layer 1 (covering a part other than the active electronic component 12 described later), a multilayer substrate 11 covering the side surface and bottom surface of the five-layer structure, and a central position on the wiring layer 1 And an active electronic component 12 mounted thereon.

  The wiring layers 1 to 5 are configured to support each layer with a conductive interlayer connection 6 interposed between the wiring layers 1 to 5. Each of the wiring layers 1 to 5 is insulated by an insulating layer (such as a resin layer or an air layer) except for the interlayer connection portion 6 made of a conductive material.

  Without increasing the size of the component built-in module 30 </ b> B itself, the heat generating built-in electronic component 10 </ b> B is removed from the lower position of the active electronic component 12 that is easily affected by heat generation, and is arranged laterally separately from the wiring layers 1 to 5. There is no wiring layers 1 to 3 above the built-in electronic component 10B that generates heat, which is an insulating space (such as a resin layer or an air layer), and the heat insulation is high upward. The position of the terminal of the built-in electronic component 10B that generates heat is provided in the downward direction (back surface) so that heat is transferred in a direction away from the active electronic component 12 that is susceptible to heat generation (downward direction).

  The built-in electronic component 10A is mounted on the same wiring layer 4B separated from the wiring layer 4, and the wiring layer 4B is electrically and thermally connected to the wiring layer 5B directly below it via the interlayer connection portion 6. It is connected to the. This wiring layer 5B is also separated from the lowermost wiring layer 5 of the same layer.

  The heat generated from the built-in electronic component 10B is thermally conducted from the wiring layer 4B to the wiring layer 5B through the interlayer connection portion 6 through the wiring pattern or conductive material, and from the wiring layer 5B to the multilayer via the solder balls 11a. Heat conduction is performed outside the substrate 11. Therefore, for the active electronic component 12 that is easily affected by heat, heat from the terminal on the back surface of the built-in electronic component 10B that generates heat is external to the multilayer substrate 11 from the wiring layer 4B and the wiring layer 5B via the solder balls 11a. Is once thermally conducted.

  In this way, the heat generated from the built-in electronic component 10B once exits to the outside of the multilayer substrate 11 via the wiring pattern, and then enters the inside of the multilayer substrate 11 again to be active via the wiring patterns of the wiring layers 5-1. It is transmitted to the electronic component 12. In short, the built-in electronic component 10 </ b> B and the active electronic component 12 are mostly connected in common, for example, as power supply lines and ground lines as wiring patterns, but the wiring layers 4, 5 below the active electronic component 12 are connected to each other. The wiring layers 4B and 5B on which the built-in electronic component 10B that generates heat is mounted are separate from the power supply line and the ground line, respectively, on the side that generates heat (built-in electronic component 10B), and those that are affected by heat (active The lines of the electronic component 12) are completely separated (not only the pattern separation but also the wiring layer itself). Therefore, even if the power supply line and the ground line are shared outside the multilayer substrate 11 (connection terminals can be shared), once the heat generation is taken out from the multilayer substrate 11, the heat generation temperature decreases, Even if the ground line is shared on the metal casing side, for example, the heat is conducted to the metal casing, so that a considerable decrease in heat generation temperature can be expected.

  The interlayer connection portion 6 is made of a conductive material, supports the wiring layer immediately above, and electrically connects the upper and lower wiring layers.

  The built-in electronic components 7 to 9 include various elements such as capacitors as electronic components that do not generate heat. The built-in electronic component 10B includes drivers, regulators, and heating elements such as LSI chips and resistance elements as electronic components that generate heat. Examples of the driver include a driver for driving a voice coil for autofocus. As the regulator, for example, a regulator may be used inside the module when the active electronic component 12 uses a power supply voltage different from other electronic components outside the module. Although only one built-in electronic component 10B is shown here, a plurality of heat-generating built-in electronic components such as a driver and a regulator may be used.

  The multilayer substrate 11 has active electronic components 12 mounted on the top surface and has a plurality of solder balls 11a on the back surface using a solder material. The plurality of solder balls 11a are electrically connected to the active electronic component 12, the built-in electronic components 7 to 9 and 10A, the wiring layers 1 to 5, and the interlayer connection portions 6 therebetween.

  The active electronic component 12 is an element component that is susceptible to temperature, such as various LSIs, a light emitting element and a light receiving element, and an imaging element that photoelectrically converts image light from a subject. In particular, since the image sensor generates signal charges and performs image processing, the influence of heat on the image is great.

  In the wiring layer 4B on which the built-in electronic component 10B is mounted and the wiring layer 5B immediately below the wiring layer 4B, the power supply line and the GND line of the active electronic component 12 and the inside of the multilayer substrate 11 The power supply line and the GND line of the built-in electronic component 10B arranged in are separated from each other by wiring patterns and are electrically independent wirings. In short, here, the same wiring layer 4 and wiring layer 4B are separated, and the same wiring layer 5 and wiring layer 5B are separated.

  The built-in electronic component 10B is not provided in the wiring layer 3 closer to the top surface, but is provided in the wiring layer 4 closer to the bottom surface, and is mounted on the same wiring layer 4B separated from the wiring layer 4. In the layers 4B and 5B, the wiring connected to the built-in electronic component 10B and the wiring connected to the active electronic component 12 are not connected to each other, and the wiring patterns of the wiring layers 1 to 3 are formed above the built-in electronic component 10B. Is not provided, the heat generated from the built-in electronic component 10 </ b> B is further suppressed from being conducted to the active electronic component 12.

  With the above configuration, the heat generated from the built-in electronic component 10B is sequentially directed from the back terminal in the downward direction (back surface) of the built-in electronic component 10B to the multilayer substrate 11 from the wiring layer 4B and the interlayer connection portion 6 through the wiring layer 5B. Heat conduction.

  Next, the heat transmitted to the outer back surface of the multilayer substrate 11 is once taken out of the multilayer substrate 11 via the solder balls 11a and then cooled, and the multilayer substrate 11 is subjected to the multilayer via the wiring pattern on the back surface of the multilayer substrate 11. Reentering the inside of the substrate 11, heat conduction is sequentially performed from the wiring layer 5 to the interlayer connection 6 and further to the wiring layers 4 to 1.

  Further, the heat conducted to the uppermost wiring layer 1 is transferred to the active electronic component 12.

  Therefore, according to the second embodiment, the built-in electronic component 10B that generates heat is mounted on the same wiring layer 4B separated from the wiring layer 4, and the heat generated from the built-in electronic component 10B is transmitted from the wiring layer 4B. Thermal conduction is performed via the interlayer connection 6 to the wiring pattern of the wiring layer 5B (separated separately from the wiring layer 5). The heat is once taken out of the multilayer substrate 11 from the wiring pattern of the wiring layer 5B through the solder balls 11a and cooled. As described above, the heat from the built-in electronic component 10 </ b> B is once taken out of the multilayer substrate 11, and then detoured, and is sequentially conducted to the wiring layers 5-1 to be transmitted to the active electronic component 12. Moreover, the active electronic component 12 and the wiring pattern connected thereto are not located above the heat generating built-in electronic component 10B, and the wiring layer 5B is separated from the wiring layer 5, and the wiring layer 5B is separated from the wiring layer 5B. No heat is directly transferred to the wiring pattern 5 in the same layer. As a result, the heat from the built-in electronic component 10B to the active electronic component 12 is completely taken out of the multilayer substrate 11 and detoured to lower the temperature, and the excessive operating temperature of the active electronic component 12 is increased and the temperature is decreased. The uniformity can be more reliably suppressed, and the malfunction of the active electronic component 12 can be prevented to further improve its performance. Actually, the temperature of 5 to 10 degrees Celsius can be lowered at the position of the active electronic component 12. For this reason, it is particularly suitable for semiconductor components such as an image pickup device in which an increase in operating temperature is a problem.

  In short, since the built-in electronic component 10B is electrically connected to a surface in the direction opposite to the surface where the active electronic component 12 is installed, the heat generated from the built-in electronic component 10B goes around and the active electronic component The rate of heat conduction to 12 can be greatly reduced.

  Since there is no wiring pattern of the wiring layers 1 to 3 higher than the wiring layer 4B on the planar view area where the built-in electronic component 10B is located in the upward direction from the built-in electronic component 10B to the top surface of the multilayer substrate 11, The rate at which heat generated from the built-in electronic component 10B indirectly conducts heat to the active electronic component 12 via the wiring patterns of the wiring layers 1 to 3 can be further suppressed.

  The power supply line and the GND line of the active electronic component 12 and the power supply line and the GND line of the built-in electronic component 10B are independent from each other in the multilayer wiring layers 1 to 5, and the heat generated from the built-in electronic component 10B is generated by the active electronic component 12B. It is possible to greatly reduce the rate of heat conduction. In this structure, the power supply line and the GND line of the active electronic component 12 and the power supply line and the GND line of the built-in electronic component 10B may be independent or common to each other in the multilayer substrate 11. In the case where the set of the power supply terminal and the GND terminal of 10B is set separately from the set of the power supply terminal and the GND terminal of the active electronic component 12, it is particularly suitable for a module that allows an increase in the number of terminals.

(Embodiment 3)
In the third embodiment, a case where the component built-in module 30A of the first embodiment is applied to a camera module will be described.

  FIG. 3 is a longitudinal sectional view showing an example of the configuration of the main part of a camera module according to Embodiment 3 of the present invention.

  In FIG. 3, in the camera module 40 </ b> A according to the third embodiment, the driving leg 18 is fixed to the lens holder 15 in which the condensing lenses 13 and 14 are accommodated and extends downward. The coil part 19 is arrange | positioned on the outer side, and the magnet 20 is being fixed to the inner wall part of the flame | frame 21 which covers the lens holder 15 and the drive leg part 18 so that it may oppose this. An upper spring 16 that biases downward is provided on the upper surface of the lens holder 15, and a lower spring 17 that biases upward is provided on the lower surface of the front end of the drive leg 18, so that the lens holder 15 and the drive leg 18 are Balances vertically. The lens holder 15 in which the lenses 13 and 14 are accommodated and the driving leg 18 are moved up and down by the electromagnetic driving force of the coil portion 19 and the magnet 20 to thereby change the image pickup device chip 12A as the active electronic component 12 of the component built-in module 30A. On the imaging area, the lenses 13 and 14 are configured to condense the external incident light and perform autofocus. In this case, the built-in electronic component 10A that generates heat from the component built-in module 30A is an autofocus driver. With this driver, the coil portion 19 is driven by current and the lenses 13 and 14 are moved up and down together with the lens holder 15 to perform autofocus control.

  The lens holder 15, the drive leg 18, the coil 19, and the magnet 20 constitute lens position displacing means, and the outer periphery of the lens holder 15 and the drive leg 18 can be moved up and down on the inner periphery of the frame 21. The positions of the lenses 13 and 14 with respect to the image sensor chip 12A are configured to be vertically displaceable. The driver as the built-in electronic component 10A controls the position of the lenses 13 and 14 with respect to the surface of the image sensor chip 12A by controlling the current to the coil portion 19 of the lens position displacement means.

  The component built-in module 30A has a built-in electronic component 10A that generates heat mounted on a wiring layer 4A separated from the wiring layer 4, and heat generated from the built-in electronic component 10A is heated through the wiring layer 5 or the multilayer substrate 11 directly below the built-in electronic component 10A. Is configured to be thermally conducted to the wiring layers 5 to 1 sequentially.

  The coil unit 19 is a voice coil, and an electric current of about 100 mA flows through the coil unit 19 in order to move the lens holder 15 up and down together with the lenses 13 and 14. The driver as the built-in electronic component 10A controls the current flowing through the coil unit 19 and moves the lens holder 15 up and down together with the lenses 13 and 14 by a predetermined distance by the magnetic field force generated by the coil unit 19 and the magnet 20, thereby The focus of the image light can be controlled with respect to the imaging region surface of the imaging element chip 12 </ b> A as the component 12.

  As described above, according to the third embodiment, by suppressing the rate at which heat generated from the built-in electronic component 10A is thermally conducted to the image sensor chip 12A, an excessive increase in the operating temperature of the image sensor chip 12A can be suppressed, and the size can be reduced. Thus, the camera module 40A with high color reproducibility can be realized.

  In addition, the power supply line and the GND line of the image pickup device chip 12A and the power supply line and the GND line of the driver are made independent in the wiring layer 4 in the same layer as the wiring layer 4A on which the driver is mounted. By suppressing the heat conduction from the heat generated to the image pickup device chip 12A, an excessive increase in the operating temperature of the image pickup device chip 12A can be suppressed and the malfunction of the camera module 40B can be suppressed.

  The GND line of the image pickup device chip 12A and / or the GND line of the driver is configured to be electrically connected to the frame 21 constituting the metal outer wall. When the GND line of the image sensor chip 12A is connected to the frame 21, the heat generated from the image sensor chip 12A can be radiated through the frame 21, and the increase in the operating temperature of the image sensor chip 12A is efficiently suppressed. Can do. On the other hand, when the GND line of the driver is connected to the frame 21, the heat generated from the driver can be dissipated through the frame 21, and the increase in the operating temperature of the multilayer substrate 11 is suppressed, and the operation of the image pickup device chip 12A is performed. An increase in temperature can be suppressed.

  Further, since the driver is electrically connected to a surface in a direction opposite to the surface on which the image sensor chip 12A is installed, the heat generated by the driver is caused to travel around the heat conduction path and the image sensor chip 12A is heated. The rate of heat conduction can be suppressed.

  Further, the power supply line and the GND line of the image pickup element chip 12A and the power supply line and the GND line of the driver are connected only to the wiring layer 5 closest to the bottom surface of the multilayer substrate 11, and the heat generated from the driver is generated by the image pickup element chip 12A. It is possible to reduce the rate of heat conduction. In this structure, if the power supply terminal and the GND terminal on the back surface of the multilayer substrate 11 are made common, it is particularly suitable for the camera module 40A in which the number of terminals is limited.

(Embodiment 4)
In the fourth embodiment, a case where the component built-in module 30B of the second embodiment is applied to a camera module will be described.

  FIG. 4 is a longitudinal sectional view showing an example of the configuration of the main part of a camera module according to Embodiment 4 of the present invention.

  In FIG. 4, in the camera module 40 </ b> B according to the fourth embodiment, the driving leg 18 is fixed to the lens holder 15 in which the condensing lenses 13 and 14 are accommodated and extends downward, and the tip of the driving leg 18. A coil part 19 is disposed outside the part, and a magnet 20 is fixed to an inner wall part of a frame 21 covering the lens holder 15 and the drive leg part 18 so as to face the coil part 19. An upper spring 16 that biases downward is provided on the upper surface of the lens holder 15, and a lower spring 17 that biases upward is provided on the lower surface of the front end of the drive leg 18, so that the lens holder 15 and the drive leg 18 are Balances vertically. The lens holder 15 in which the lenses 13 and 14 are accommodated and the drive leg 18 are moved up and down by the electromagnetic drive force of the coil part 19 and the magnet 20, and the imaging element chip 12B as the active electronic component 12 of the component built-in module 30B. On the imaging area, the lenses 13 and 14 collect external incident light and perform autofocus. In this case, the built-in electronic component 10B that generates heat from the component built-in module 30B is a driver for autofocusing. The coil unit 19 is driven by this driver to move the lenses 13 and 14 up and down together with the lens holder 15, thereby picking up the image sensor chip. Autofocus control is performed so that light is focused on the 12B imaging region.

  In the component built-in module 30B, the heat generating built-in electronic component 10B is mounted on the wiring layer 4B separated from the wiring layer 4, and the heat generating built-in electronic component 10B is removed from directly below the active electronic component 12 and arranged horizontally. In addition, the wiring layer 5B immediately below the wiring layer 4B on which the built-in electronic component 10B is mounted is also separated from the wiring layer 5.

  The coil unit 19 is a voice coil, and a current of about 100 mA flows in order to move the lens holder 15 up and down together with the lenses 13 and 14. The driver as the built-in electronic component 10B controls the current flowing through the coil unit 19 and moves the lens holder 15 up and down with the lenses 13 and 14 by a predetermined distance by the magnetic field force generated by the coil unit 19 and the magnet 20, thereby The focus of the image light can be controlled with respect to the imaging region surface of the imaging element chip 12B as the component 12.

  The driver as the built-in electronic component 10B is mounted on the wiring layer 4B closer to the bottom surface of the multilayer substrate 11, and the wiring pattern of the driver and the wiring pattern connected to the imaging element chip 12B are connected to each other independently in the wiring layer 4B. In addition, the wiring pattern of the wiring layers 1 to 3 connected to the imaging element chip 12B is not provided on the upper part of the driver as the built-in electronic component 10B, and heat generated from the driver is indirect. Therefore, conduction to the image sensor chip 12B is suppressed. By electrically connecting the GND line of the image sensor chip 12B to the frame 21, it is possible to reduce the operating temperature of the image sensor chip 12B. Further, if the GND line of the driver is also electrically connected to the frame 21, the operating temperature of the driver can be lowered and the operating temperature of the image sensor chip 12B can be lowered.

  As described above, according to the fourth embodiment, by suppressing the rate at which heat generated from the built-in electronic component 10B is conducted to the image sensor chip 12B, an excessive increase in the operating temperature of the image sensor chip 12B is suppressed, and the size and color are reduced. A highly reproducible camera module 40B can be realized.

  The GND line of the image pickup device chip 12B and / or the GND line of the driver as the built-in electronic component 10B are electrically connected to the frame 21 of the metal outer casing. When the GND line of the image sensor chip 12B is connected to the frame 21, the heat generated from the image sensor chip 12B can be dissipated through the frame 21, and the increase in the operating temperature of the image sensor chip 12B is efficiently suppressed. Can do. On the other hand, when the GND line of the driver is connected to the frame 21, the heat generated from the driver can be dissipated through the frame 21, suppressing the increase in the operating temperature of the multilayer substrate 11, and the operating temperature of the image sensor chip 12B. Can be suppressed.

  Further, since the driver as the built-in electronic component 10B is electrically connected to a surface in the direction opposite to the surface on which the image pickup device chip 12B is installed, heat conduction goes around and heat generated from the driver is generated. However, the rate of heat conduction to the image sensor chip 12B can be suppressed.

  Furthermore, since the wiring pattern of the wiring layer does not exist in the planar view area where the driver is located in the top surface direction from the driver as the built-in electronic component 10B, the heat generated from the driver passes through the wiring pattern of the wiring layer above it. Thus, the rate of heat conduction to the image sensor chip 12B can be further suppressed.

  Further, the power supply line and the GND line of the imaging element chip 12B and the power supply line and the GND line of the driver are independent from each other in the wiring layers 1 to 5 and / or the multilayer substrate 11, and heat generated from the driver as the built-in electronic component 10B. The ratio of heat conduction to the image sensor chip 12B as the active electronic component 12 can be greatly suppressed. In this structure, the power supply terminals and the GND terminals of the multilayer substrate 11 need to be different from each other, so that the structure is particularly suitable for the camera module 40B that can allow an increase in the number of terminals.

(Embodiment 5)
In the fifth embodiment, a case will be described in which an external resistor is provided in the coil connection portion of the driver of the fourth embodiment and a part of the heat generated by the driver is also given to the external resistor.

  FIG. 5 is a longitudinal sectional view showing an example of the configuration of the main part of a camera module according to Embodiment 5 of the present invention.

  In FIG. 5, the camera module 40 </ b> C according to the fifth embodiment has a driving leg 18 fixed to a lens holder 15 in which condensing lenses 13 and 14 are accommodated, and a coil portion is provided outside the distal end of the driving leg 18. 19 is disposed, and a magnet 20 is fixed to the inner wall portion of the frame 21 covering the lens holder 15 and the drive leg portion 18 so as to be opposed thereto. An upper spring 16 that urges downward is provided on the upper surface of the lens holder 15, and a lower spring 17 that urges upward is provided on the tip surface of the drive leg 18, so that the lens holder 15 and the drive leg 18 are It is balanced. The lens holder 15 in which the lenses 13 and 14 are accommodated and the driving leg 18 are moved up and down by the electromagnetic driving force of the coil portion 19 and the magnet 20 to thereby change the image pickup device chip 12B as the active electronic component 12 of the component built-in module 30C. The lens 13, 14 collects the incident light from the outside in the imaging area and performs autofocus. In this case, the built-in electronic component 10B that generates heat from the component built-in module 30C is a driver for autofocusing, and the coil portion 19 is driven by this driver to move the lenses 13 and 14 up and down together with the lens holder 15, thereby picking up the image sensor. Autofocus drive is performed so that light is condensed on the imaging region of the chip 12B.

  In the component built-in module 30C, the heat generating built-in electronic component 10B is mounted on the wiring layer 4B separated from the wiring layer 4, and the heat generating built-in electronic component 10B is removed from directly below the active electronic component 12 and arranged horizontally. In addition, the wiring layer 5B immediately below the wiring layer 4B on which the built-in electronic component 10B is mounted is separated from the wiring layer 5.

  The coil unit 19 is a voice coil, and a current flows about 100 mA in order to move the lens holder 15 up and down together with the lenses 13 and 14. The driver as the built-in electronic component 10 </ b> B controls the current flowing through the coil unit 19 and moves the lens holder 15 up and down by a predetermined distance for focusing together with the lenses 13 and 14 by the magnetic field force generated by the coil unit 19 and the magnet 20. Thus, it is possible to control the focus of the image light with respect to the imaging region surface of the imaging element chip 12B as the active electronic component 12. In this case, as shown in FIG. 6, it is connected to the terminal (OUT) of the driver transistor MN of the driver as the built-in electronic component 10B from the power supply (VM) output terminal via a series circuit of the coil unit 19 and the resistor 22. . As described above, by providing the external resistor 22 between the coil unit 19 and the terminal (OUT) of the driver transistor MN of the driver as the built-in electronic component 10B, a part of heat generation in the driver 22 is also generated. The heat radiation source can be divided as a whole. The resistance value of the resistor 22 is a resistance value of about several ohms (about 1 to 10 ohms) to ensure the driving performance of the driver. By disposing the resistor 22 on the upper surface on the outer side of the multilayer substrate 11, the heat source is dispersed to thereby reduce the influence of heat on the image sensor chip 12B as the active electronic component 12.

  A resistor 22 is connected in series to the coil unit 19, and the heat generation location is distributed in two parts: a driver as the built-in electronic component 10 </ b> B and the resistor 22. The resistor 22 is mounted on the top surface of the multilayer substrate 11, and the resistor 22 is provided outside the multilayer substrate 11 to enhance heat dissipation. For this reason, the operating temperature rise and temperature non-uniformity of the image sensor chip 12B can be suppressed.

  As shown in the circuit configuration of the coil connection portion of the driver in FIG. 6, the power consumption W1 of the driver is expressed by the following equation when Io is a current, VM is a power supply voltage, and Rc is a resistance value of the coil. .

W1 = Io * (VM-Rc * Io)
When the resistor 22 (resistance value Rex) is connected in series with the coil unit 19, the power consumption W2 at the coil terminal portion of the driver and the power consumption W3 at the resistor 22 are respectively Io as current, VM as power supply voltage, and Rc as coil power. The resistance value is expressed by the following equation.

W2 = Io * (VM− (Rc + Rex) * Io)
W3 = Io * Rex
Although W1 = W2 + W3 and the total power consumption does not change, the temperature can be made uniform by dispersing the heat generation source in two, and the resistor 22 is mounted on the upper surface of the multilayer substrate 11 so that the resistor 22 The heat dissipation of the image pickup device chip 12B can be reduced.

  As described above, according to the fifth embodiment, an excessive increase in the operating temperature of the image sensor chip 12B is suppressed by suppressing the rate at which heat generated from the built-in electronic component 10B conducts to the image sensor chip 12B. A small camera module 40B having high color reproducibility can be realized.

  Further, since the resistor 22 is connected in series to the coil portion 19 and then connected to the driver as the built-in electronic component 10B, the power consumption generated by the driver alone in the conventional structure can be distributed to the driver and the resistor 22. . For this reason, the temperature rise and temperature non-uniformity of the multilayer substrate 11 can be suppressed, and the temperature rise and temperature non-uniformity of the operating temperature of the image sensor chip 12B can be suppressed.

  Further, since the resistor 22 is mounted not on the inner side of the multilayer substrate 11 but on the outer surface of the multilayer substrate 11, the heat dissipation of the heat generated from the resistor 22 can be improved and the operating temperature of the camera module 40C can be suppressed. it can.

(Embodiment 6)
FIG. 7 is a block diagram illustrating a schematic configuration example of an electronic apparatus using the camera module 40A, 40B, or 40C according to Embodiments 3 to 5 of the present invention as an imaging unit as Embodiment 6 of the present invention.

  In FIG. 6, an electronic device 90 according to the sixth embodiment includes a solid-state imaging device 91 that obtains a color image signal by performing predetermined signal processing on an imaging signal from the camera module 40A, 40B, or 40C according to the third to fifth embodiments. The color image signal from the solid-state image pickup device 91 is subjected to predetermined signal processing for recording, and then a memory unit 92 such as a recording medium capable of recording data, and the color image signal from the solid-state image pickup device 91 is predetermined for display. The display unit 93 such as a liquid crystal display device which can be displayed on a display screen such as a liquid crystal display screen after the signal processing is performed, and the color image signal from the solid-state imaging device 91 is subjected to predetermined signal processing for communication and then communicated A communication unit 94 such as a transmission / reception device capable of processing and a color image signal from the solid-state imaging device 91 are subjected to a predetermined print signal processing for printing and then a printing process is performed. And an image output unit 95 such as a printer that enables. The electronic information device 90 is not limited to this, but in addition to the solid-state imaging device 91, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As described above, the electronic information device 90 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear surveillance camera, and a video phone camera. An electronic device having an image input device such as an image input camera, a scanner device, a facsimile device, a camera-equipped mobile phone device, and a portable terminal device (PDA) is conceivable.

  Therefore, according to the sixth embodiment, on the basis of the color image signal from the solid-state imaging device 91, the image is displayed on the display screen, or the image output unit 95 prints it out on the paper. (Printing), communicating this as communication data in a wired or wireless manner, performing a predetermined data compression process in the memory unit 92 and storing it in a good manner, or performing various data processings satisfactorily Can do. Further, in this case, it is possible to realize an electronic device that can be reduced in size and prevented from malfunctioning due to heat.

  In the sixth embodiment, a case has been described in which the camera module 40A, 40B, or 40C according to the third to fifth embodiments does not include a signal processing unit that performs predetermined signal processing on the imaging signal to obtain a color image signal. Not limited to this, the camera module 40A, 40B, or 40C of the third to fifth embodiments may include a signal processing unit that obtains a color image signal by performing predetermined signal processing on the imaging signal. For example, the camera module 40A, 40B, or 40C including the signal processing function of the solid-state imaging device 91 may be an electronic device using the imaging unit.

  In the sixth embodiment, the electronic device 90 using the camera module 40A, 40B, or 40C of the third to fifth embodiments as an image input device in the imaging unit has been described. As a modified example, an electronic device in which the component built-in module 30A or 30B of the first and second embodiments is mounted may be used. For example, the present invention can be applied to an electronic device that transmits / receives an optical signal used for optical fiber communication. Optical elements such as light-emitting elements and light-receiving elements have problems such as a decrease in efficiency and a change in wavelength depending on the operating temperature. However, by using the active electronic component in this embodiment as an optical element, the operating temperature is excessively increased. Can be suppressed. In FIG. 7 (b), a predetermined signal is driven by a driver as a laser element as a light emitting element to place the signal on the laser beam, and transmission signal light via the optical fiber F is received by a photodiode PD as a light receiving element. The signal is detected and a transmission signal can be obtained by a current / voltage conversion element such as a transimpedance amplifier. In this case, the active electronic component can be a laser element as a light emitting element or a photodiode PD as a light receiving element. Built-in electronic components that generate heat include drivers and regulators.

  Although not specifically described in the first to sixth embodiments, in the component built-in module of the present invention, a wiring layer on which a heat-generating built-in electronic component is mounted, and a wiring having a multilayer wiring structure in the same layer In the layer, the power supply line and the ground line of the heat-generating built-in electronic component are electrically separated from the power supply line and the ground line of the active electronic component. In the camera module of the present invention, the component built-in module of the present invention, a lens disposed between the object and the active electronic component, and a position of the lens with respect to the active electronic component are configured to be displaceable. A lens position displacing unit; and a driver as the heat-generating built-in electronic component that controls the position of the lens by driving the lens position displacing unit. As a result, heat conduction from the built-in electronic components is more moderately suppressed to the active electronic components and other built-in electronic components, resulting in excessive operating temperature rise and non-uniformity of the active electronic components and other built-in electronic components. The object of the present invention to improve the performance of active electronic components and other built-in electronic components can be achieved.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-6 of this invention, this invention should not be limited and limited to this Embodiment 1-6. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments 1 to 6 of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention is a component built-in module incorporating an electronic component, for example, a camera module using a solid-state imaging device that performs photoelectric conversion of image light from a subject, and the camera module as an image input device in an imaging unit. For example, digital cameras such as digital video cameras and digital still cameras; image input cameras such as surveillance cameras; electronic devices such as scanner devices, facsimile devices, television telephone devices, and mobile phone devices with cameras; In the field of electronic equipment, the power lines and ground lines of heat-generating built-in electronic components and the power lines and ground lines of active electronic components are electrically separated from each other. The heat conduction to active electronic components and other built-in electronic components Suppressed by the, by suppressing the increase and nonuniformity of the excessive operating temperature of the active electronic components and other built-in electronic part, it is possible to improve the performance of the active electronic components and other built-in electronic components.

1-5, 4A, 4B, 5B Wiring layer 6 Interlayer connection 7-9 Built-in electronic component 10A, 10B Heat-generating built-in electronic component (driver)
11 Multilayer substrate 11a Solder ball (connection terminal)
DESCRIPTION OF SYMBOLS 12 Active electronic component 12A, 12B Image pick-up element chip 13, 14 Lens for condensing 15 Lens holder 16 Upper spring 17 Lower spring 18 Drive leg part 19 Coil part 20 Magnet 21 Frame 30A, 30B Component built-in module 40A, 40B, 40C Camera Module 12A, 12B Image sensor chip 22 Resistor 90 Electronic device 91 Solid-state imaging device 92 Memory unit 93 Display unit 94 Communication unit 95 Image output unit

Claims (18)

An active electronic component is mounted on the uppermost wiring layer, and a multilayer wiring structure in which wiring between upper and lower wiring layers is connected by an interlayer connection portion, and a back surface wiring connected to the wiring of the lowermost wiring layer of the multilayer wiring structure A component built-in module having a multilayer board provided with connection terminals, and a heat-generating built-in electronic component built in the multilayer board,
In the wiring layer to which the heat generating built-in electronic component is connected, the power line and the ground line of the heat generating built-in electronic component and the power line and the ground line of the active electronic component are electrically separated from each other. Built-in component module.   In each wiring layer of the multilayer wiring structure, and a wiring layer in a direction in which the connecting terminal is located from a wiring layer to which the heat generating built-in electronic component is connected, a power line and a ground line of the heat generating built-in electronic component The component built-in module according to claim 1, wherein a power supply line and a ground line of the active electronic component are electrically separated from each other.   The power supply line and ground line of the heat-generating built-in electronic component and the power supply line and ground line of the active electronic component are the lowest wiring layer closest to the multilayer board among the wiring layers of the multilayer wiring structure. The component built-in module according to claim 1, wherein only the components are electrically connected.   The power supply line and the ground line of the heat-generating built-in electronic component and the power supply line and the ground line of the active electronic component are electrically separated from each other on the back surface wiring of the multilayer substrate, or are electrically connected in common. The component built-in module according to claim 1, which is connected in a mechanical manner.   The arrangement layer of the exothermic internal electronic component includes a first wiring layer to which the exothermic internal electronic component is connected and a second wiring layer that is not connected to the exothermic internal electronic component. The component built-in module according to 1.   The component built-in module according to claim 1, wherein the wiring layer on which the heat generating built-in electronic component is mounted is one of the wiring layers of the multilayer wiring structure.   The wiring layer immediately below the wiring layer to which the heat generating built-in electronic component is connected includes a first wiring layer including a power line and a ground line of the heat generating built-in electronic component, and the heat generating built-in electronic component. The component built-in module according to claim 1, comprising a power supply line and a second wiring layer not including a ground line.   2. The component built-in module according to claim 1, wherein the heat generating built-in electronic component is electrically connected only to a wiring pattern of a wiring layer in a direction in which the connection terminal is present.   The component built-in module according to claim 1, wherein each wiring layer of the multilayer wiring structure is disposed in a region other than directly above the heat-generating built-in electronic component.   The component built-in module according to claim 1, wherein the active electronic component is an image sensor that images an object.   2. The component built-in module according to claim 1, wherein the active electronic component is a light emitting element that emits light to an object and / or a light receiving element that receives light from the object. 3.   The component built-in module according to claim 1, wherein the active electronic component is an LSI chip. The component built-in module according to claim 10;
A lens disposed between the object and the active electronic component;
Lens position displacing means configured to freely displace the position of the lens with respect to the active electronic component;
A camera module comprising: a driver as the heat-generating built-in electronic component that drives the lens position displacement means to control the position of the lens.   In the component built-in module, at least one of a ground line of the heat-generating built-in electronic component and a ground line of the active electronic component is electrically connected to a metal frame constituting an outer wall. 14. The camera module according to 13.   14. The camera module according to claim 13, wherein the lens position displacing means has an electromagnet and a voice coil, and a resistance means is connected in series to the voice coil.   The camera module according to claim 15, wherein the resistance means is mounted on a surface side of the multilayer substrate.   The electronic device carrying the component built-in module in any one of Claims 1-12.   The electronic device which used the camera module in any one of Claims 13-16 as an image input device for the imaging part.

Images