JP2011232279A - Tilt inspection device and tilt inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent false recognition of tilt of a substrate due to solder or rubbish or the like scattered on the substrate.SOLUTION: A tilt inspection device 10 comprises a height measurement part 12 for obtaining height information by measuring the surface height of a substrate 2 and a component over the entire area of the substrate 2 from an image of the imaging area outputted by a camera which takes an image of the substrate 2 in which the component is attached using a predetermined range as the imaging area. In addition, the tilt inspection device 10 comprises a measurement point designation part 13 for designating at least three measurement points expressed by the color of the substrate 2 based on binarized information which expresses the color of the substrate 2 included in the image of the imaging area and the color of the component placed in the substrate 2 in two different colors. Further, the tilt inspection device 10 comprises a tilt calculation part 14 for calculating the tilt of the substrate 2 against a predetermined flat surface based on the height information measured every measurement point and a tilt correction part 15 for calculating correction amount of the height information based on the tilt of the substrate 2 to correct the height information over the entire area of the surface of the substrate 2.

Description

  The present invention relates to an inclination inspection apparatus and an inclination inspection method that are suitable for use in, for example, inspecting the inclination of a substrate with respect to a horizontal plane in a manufacturing process for mounting components on the substrate.

  Conventionally, when an electronic component is mounted on a substrate by an electronic component mounting machine, the electronic component is attached to the substrate with reflow solder or an adhesive, and the mounting state is confirmed by another apparatus such as an inspection machine after curing.

  Further, when the electronic component is sucked by the mounting nozzle with a vacuum force, the sucking position is not necessarily the center of the component, and the angle of the electronic component may be shifted from the XY coordinate axis of the mounting machine. In order to inspect the suction state of the electronic component, conventionally, the electronic component is imaged using a plurality of cameras, and the deviation from the center and coordinate axes is calculated from the luminance information of the captured image, and correction is performed. Alternatively, a part of a part is measured by a three-dimensional length measuring device using laser spot light, and correction calculation is sometimes performed from the three-dimensional information.

  Also, when measuring the height of an object (component) using a 3D board inspection machine that measures the height of the component installed on the board, it is necessary to specify the reference position for measuring the height. There is. As this designation, a method is used in which three points on a substrate on which solder or the like is not formed are designated and the inclination of the substrate is calculated from the height information. In general, it is necessary for the user to specify (teaching) the position of an arbitrary reference plane.

  Patent Document 1 discloses a technique for detecting the height of a substrate.

JP 2005-30793 A

  By the way, even if the conventional technique is used, it is necessary to manually specify the reference plane that changes according to the inspection target for each inspection target, and thus it takes time to create data. In addition, since parts are densely installed on the board, a small amount of solder or dust may be scattered on the board, and if solder or dust adheres to the reference surface of the specified board, There was a possibility of misrecognizing the tilt, and the reliability was low.

  The present invention has been made in view of such a situation, and an object thereof is to prevent erroneous recognition of the inclination of the substrate due to solder, dust, or the like scattered on the substrate.

In the present invention, the height information is obtained by measuring the height of the surface of the substrate and the component over the entire area of the substrate from the image of the imaging region output by the camera that images the substrate on which the component is mounted, with the predetermined range as the imaging region. obtain.
Next, based on the binarization information that expresses the color of the substrate included in the image of the imaging region and the color of the member arranged on the substrate with two different colors, at least a place expressed by the color of the substrate Specify 3 measurement points.
Then, based on the height information measured at each measurement point, the inclination of the substrate with respect to a predetermined plane is calculated, the correction amount of the height information is obtained based on the inclination of the substrate, and the height over the entire surface of the substrate is calculated. The information is corrected.

  By doing in this way, it becomes possible to test | inspect the inclination of the board | substrate with respect to a predetermined plane in a manufacturing process.

  According to the present invention, at least three measurement points in the portion specified by the color of the board are designated based on the binarization information that expresses the board and the members arranged on the board in two colors. The inclination of the substrate is calculated based on the height information corresponding to the measurement points. Then, by correcting the height information in each part of the substrate based on the calculated substrate inclination, the influence of the inclination due to solder, dust, etc. scattered on the substrate can be eliminated.

It is a block diagram which shows the internal structural example of the inclination test | inspection apparatus in one embodiment of this invention. It is explanatory drawing which looked at the cross section which shows the example of each component installed in the board | substrate in one embodiment of this invention. It is explanatory drawing which looked at the cross section which shows the example which binarized and displayed the board | substrate in one embodiment of this invention, and each component. It is explanatory drawing which shows the example of the board | substrate and component which were displayed on the display part in one embodiment of this invention. It is explanatory drawing which shows the example which designates the measurement point at the time of performing the inclination measurement in one embodiment of this invention. It is a flowchart which shows the example of the inclination test | inspection method in one embodiment of this invention.

Hereinafter, the best mode for carrying out the invention (hereinafter referred to as an embodiment) will be described. The description will be given in the following order.
1. One embodiment (example of inspecting the inclination of a substrate and correcting the influence of a portion recognized as the inclination)
2. Modified example

<1. Embodiment>
[Example of inspecting the board tilt and correcting the influence of the part recognized as tilt]

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the present embodiment, an example in which the tilt of the substrate is inspected and the tilt of the substrate with respect to the horizontal plane is inspected after removing the influence of dust and the like attached to the substrate will be described.

FIG. 1 shows an internal configuration example of the inclination inspection apparatus 10 of the present example.
First, the tilt inspection system 1 including the tilt inspection apparatus 10 includes a camera 3 that captures a color image of a substrate 2 used as a measurement target, and a display unit 4 that displays a color image captured by the camera 3 and the like. The size of the substrate 2 is, for example, 300 mm × 220 mm. The range of the imaging area where the camera 3 captures the substrate 2 in one imaging operation is, for example, 30 mm × 50 mm.

  In addition, the tilt inspection system 1 inspects the tilt of the substrate 2 and corrects the tilt of the substrate 2, and the tilt inspection device 10 allows the user to perform a predetermined operation instruction while viewing the display unit 4. And a recording unit 6 for recording height information and the like which will be described later. For the recording unit 6, a large-capacity recording device such as a RAM (Random Access Memory) or an HDD (Hard Disk Drive) is used.

  Next, the inclination inspection apparatus 10 includes a color extraction unit 11 that extracts a color at a position designated based on an extraction instruction performed by the user using the operation unit 5 with respect to a color image input from the camera 3. . The color extraction performed by the color extraction unit 11 is performed using an eyedropper function used in general image software. The color extraction unit 11 outputs a binary image obtained by binarizing the color image based on the two colors of the substrate 2 and the component (in this example, solder) at the position specified by the user. The color for binarization can be appropriately determined by the user. The binary image extracted by the color extraction unit 11 is recorded in the recording unit 6 provided outside the inclination inspection apparatus 10. However, the color extraction unit 11 can also output binarization information for displaying a binary image to the height measurement unit 12 described later as it is.

  In addition, the tilt inspection apparatus 10 includes a height measurement unit 12 that obtains the height of the substrate 2 and components for each pixel of the image sensor included in the camera 3 based on the binary image input from the color extraction unit 11. The height obtained at this time is a relative value in which the height range in the imaging region is 0 to 255. In addition, the tilt inspection apparatus 10 includes a measurement point designating unit 13 that designates three measurement points for measuring the tilt of the substrate 2 based on the height data measured by the height measurement unit 12, and a three-point measurement. And an inclination calculation unit 14 for calculating the inclination amount of the substrate 2 based on the points. Here, the measurement point designating unit 13 designates the three measurement points, when the three points are brought into contact with the ground (horizontal plane) on the tripod, the same effect as that in which the inclination of the camera 3 with respect to the ground can be obtained. To get.

  In addition, the inclination inspection apparatus 10 corrects the inclination of the binary image based on the inclination amount calculated by the inclination calculation unit 14, and outputs the corrected data after the inclination correction and the inspection result and the inspection result. Is provided. The corrected data output from the inclination correction unit 15 and the inspection result are recorded in the recording unit 6.

Next, the operation of each unit will be described.
First, the camera 3 takes an image of the substrate 2 to which components (including pads 21 and solder 22 described later) are attached as a measurement object, with a predetermined range as an imaging region. The camera 3 is a full color camera that outputs a color image of the substrate 2. Next, the height measuring unit 12 measures the height of the surface of the substrate 2 and the parts over the entire area of the substrate 2 from the image of the imaging region obtained from the camera 3 as height information. Various components having different heights are installed on the substrate 2, and the color image includes images of the substrate 2 and the components. The color image output from the camera 3 is displayed on the display unit 4 so that the user can check the colors of the substrate 2 and components. The user can give a predetermined instruction to the tilt inspection apparatus 10 by operating the operation unit 5 while viewing the image displayed on the display unit 4.

  In the substrate 2 on which the solder is printed, the solder is usually gray (achromatic), and the substrate 2 is often used in a chromatic color such as green or blue. By using a full-color camera as the camera 3, the color extraction unit 11 can acquire color information output from the camera 3, and can easily identify the substrate portion. And the chromatic color location on the board | substrate 2 is extracted, and the extracted location is used for height measurement as a board | substrate part, ie, a zero reference plane.

  At this time, when a part of the substrate 2 is instructed with respect to the image of the imaging region displayed on the display unit 4, the color extraction unit 11 includes the color extracted from the substrate at the instructed position. 2. Output an image in which each part on 2 is filled with a predetermined color. Further, the color extraction unit 11 outputs an image in which a portion expressed by a color other than the color of the substrate 2 is filled with a color different from a predetermined color. Then, the color extraction unit 11 displays these output images on the display unit 4 as binary images divided by two colors, and the binarization information on the surface of the substrate 2 obtained from the binary images is the height measurement unit. 12 is output.

  Here, in the binarized information of RGB, in the case of a chromatic color, the difference between the maximum and minimum luminance values of the three binarized information of RGB is large. On the other hand, the difference between the maximum and the minimum becomes small in the case of an achromatic color. Using this feature, the substrate portion and the solder portion are clearly distinguished and a zero reference plane is set.

  Next, the measurement point designating unit 13 is based on the binarization information that expresses the color of the substrate 2 included in the image of the imaging region and the color of the member arranged on the substrate 2 with two different colors. Designate at least three measurement points at the locations represented by the two colors. The three measurement points are designated at positions farthest from each other in the vertical or horizontal direction of the image in the imaging region. Specifically, when the first measurement point is designated at one corner among the four corners in the imaging region, the measurement point designating unit 13 is mutually in the vertical direction or the horizontal direction with respect to the first measurement point. The second and third measurement points are designated at the farthest locations (see FIG. 5 described later).

  Next, the inclination calculation unit 14 calculates the inclination of the substrate 2 with respect to a predetermined plane using a trigonometric function or the like based on the height information measured for each measurement point. In this example, the predetermined plane is a “horizontal plane”. In addition, the tilt calculation unit 14 calculates the tilt of the substrate 2 every time the camera 3 captures an image once. Then, the tilt correction unit 15 obtains a correction amount of height information based on the tilt of the substrate 2 and corrects the height information over the entire surface of the substrate 2. Here, the height information of the substrate 2 is obtained for each pixel. Here, for example, the height of the measurement point obtained from the height information is “80”, “85”, “90”, and the height of the component or solder attached to the center of the board 2 is “150”. Assuming that At this time, the inclination correction unit 15 finds that the center height of the substrate 2 is “85” by the average calculation of the measurement points, so the height “85” corresponding to the inclination of the substrate 2 in this portion is reduced. Make corrections.

FIG. 2 shows an example attachment in which the substrate 2 and the attachment member are viewed in cross section.
The substrate 2 is provided with pads 21 on which components such as BGA (Ball grid array) components and capacitors are mounted, and solder 22 that connects the pads 21 to the components. The pad 21 and the solder 22 are used as attachment members for attaching components to the substrate 2. A solder resist 20 is formed on the substrate 2 to expose the pad 21 and cover a wiring (not shown).

  As described above, the substrate 2 includes the pad 21 on which the member is placed, the solder 22 that is formed on the pad 21 and joins the member, and the solder resist 20 that covers the substrate 2 with the pad 21 and the solder 22 exposed. It is formed. Then, when the color of the solder resist 20 is designated, the color extraction unit 11 predetermines a corresponding portion in the image of the imaging region including the color obtained by averaging the colors within a certain range at the position designated by the user. And a binary image is displayed on the display unit 4.

FIG. 3 shows a display example of the substrate 2 represented as a binary image.
Next, a display example of the substrate 2 represented as a binary image will be described with reference to FIG.
The color extracting unit 11 of this example displays a binary image in which the solder resist 20 is blue and the parts other than the solder resist 20 such as the pad 21, the solder 22, the substrate 2, etc. are divided into black colors on the display unit 4. To do. By displaying in this way, a portion corresponding to the surface of the substrate 2 can be clearly identified.

FIG. 4 shows an example of the display screen 7 on which a binary image is displayed.
FIG. 4A shows a display example of the imaging region 25 before binarization.
As described above, the camera 3 images the substrate 2 in the imaging region 25 in a predetermined range. The substrate 2 is coated with a solder resist 20, and pads 21 and solder 22 are installed. On the solder resist 20, dirt 23 such as scattered solder and dust adheres.

The user operates the operation unit 5 to move the cursor 24 displayed on the display screen 7. Here, when the user designates the cursor 24 on the solder resist 20, the color extraction unit 11 extracts the color of the solder resist 20. At this time, the cursor 24 averages the colors included in the range of a certain size, and fills the portion including the averaged color with a predetermined color (blue in this example). However, the color of the solder resist 20 may be dull or shiny depending on the imaging conditions. Even in this case, in order to fill the area with certainty, a certain threshold value is provided based on the averaged color, and if it is within this threshold value, the same color is considered and the predetermined color is used. On the other hand, since the color of the pad 21 and the solder 22 is different from the color of the solder resist 20 (threshold is provided in the same manner as described above), the color different from the color in which the solder resist 20 is filled (in this example, , Black). This painting process is performed in units of pixels of the image output from the camera 3. Then, the color extracting unit 11 sends the binarized information to the height measuring unit 12 for each pixel.
Note that the scattered dirt 23 such as solder or dust is a color different from the substrate color. Therefore, as shown in FIG. 4B, it is painted in black. Since the scattered dirt 23 such as solder and dust is recognized as a portion different from the substrate 2, only the substrate portion can be reliably extracted.

FIG. 5 shows an example in which measurement points are designated in the imaging region.
Here, the imaging area 25 obtained by the camera 3 imaging four locations in the range of the substrate 2 is displayed side by side. The imaging region 25 has already been expressed as a binary image, and a portion corresponding to the substrate 2 (solder resist 20) is shown in black, and a portion corresponding to the pad 21 and the solder 22 is shown in blue.

  The measurement point designating unit 13 designates at least three measurement points for each imaging region 25. However, as the measurement point, a portion corresponding to the substrate 2 (solder resist 20) must be specified, and the measurement point must be specified at the most distant place in the vertical direction or the horizontal direction of the image of the imaging region. Here, when the horizontal direction of the imaging region 25 is the x-axis and the vertical direction is the y-axis, the measurement point designating unit 13 has the first measurement point 26a at the position closest to the origin (the minimum value of x and y). Is specified. Next, the second measurement point 26b is designated at a position farthest in the x-axis direction (the maximum value of x and the minimum value of y) with respect to the first measurement point 26a. Finally, the third measurement point 26c is designated at a position (the minimum value of x and the maximum value of y) farthest in the y-axis direction with respect to the first measurement point 26a. However, when the portion corresponding to the pad 21 and the solder 22 overlaps the position where the measurement point is specified, the measurement point specifying unit 13 specifies the measurement point to the portion corresponding to the vacant board 2.

  The first measurement point 26a to the third measurement point 26c are set in a size that occupies a certain range. For this reason, even if a color different from the surrounding color is detected at the position designated by the cursor 24 due to dirt or the like adhering to the solder resist 20, the surrounding color at the designated position is averaged and the solder resist is averaged. The possibility of erroneous recognition of 20 colors can be reduced.

FIG. 6 shows an example of the tilt inspection method for the substrate 2 of this example.
First, the camera 3 images the substrate 2 (step S1). The user manually specifies the color (for example, blue) of the substrate 2 by operating the operation unit 5 while viewing the color image displayed on the display unit 4 (step S2). At this time, the color extraction unit 11 causes the recording unit 6 to record the binary image and causes the display unit 4 to display the binary image. In this binary image, the part corresponding to the surface of the substrate 2 and the other part are displayed in different colors. In this example, the portion corresponding to the surface of the substrate 2 is the surface of the solder resist 20.

  Next, the height measuring unit 12 measures the height of each part over the entire surface of the substrate 2 in the measurement region using 3D measurement (step S3). Here, as a technique for measuring the height, there are a method of measuring the reflection position with a diaphragm optical probe method (laser beam scanning method), a projection of a line beam, imaging with a two-dimensional camera, and a triangular measurement method. There is a measurement method (laser beam cutting method). In addition, there are a method of examining the height by focusing on each point of the solder (focusing method), a method of obtaining the height from several projected patterns (pattern projection method, phase shift method), and the like. However, since the height measuring unit 12 of this example uses the phase shift method, this technique will be described.

  The height measurement unit 12 uses a phase shift method as a non-contact type three-dimensional measurement method. A CCD camera is used in the three-dimensional measuring apparatus in this technique. In other words, a light pattern having a striped light intensity distribution is irradiated onto a measurement object (in this case, a printed circuit board) by irradiation means comprising a combination of a light source and a sine wave pattern filter. And it observes using the CCD camera which has arrange | positioned the point on a board | substrate directly. In this case, the light intensity I at the point P on the screen is given by the following equation.

I = e + f · cosφ
[However, e: DC light noise (offset component), f: sine wave contrast (reflectance), φ: phase given by unevenness of object]
At this time, the light pattern is moved, the phase is changed in four steps (φ + 0, φ + π / 2, φ + π, φ + 3π / 2), and images having intensity distributions I0, I1, I2, and I3 corresponding to these are captured. The position information θ is obtained based on the following formula.

θ = arctan {(I3-I1) / (I0-I2)}
Using this position information θ, the three-dimensional coordinates (X, Y, Z) of the point P on the substrate 2 are obtained. And especially height is measured as a three-dimensional shape of each component or an attachment member. The measured height value is recorded in the recording unit 6 as “height information” for each pixel of the camera 3. Note that the height information is a relative value assigned with a gradation of 0 to 255 within the imaging region of the camera 3.

  Next, the measurement point designating unit 13 automatically designates three points separated from each other in the blue portion of the substrate 2 for each imaging region (step S4). This designation is automatically performed based on the binarization information described above.

  Next, the inclination calculation unit 14 calculates the inclination in the imaging region from the three height information values measured at the designated three measurement points (step S5). At this time, the inclination calculation unit 14 obtains the inclination of the substrate 2 based on the height information read from the recording unit 6.

  Then, the inclination correction unit 15 corrects the inclination of the substrate 2 (step S6). At this time, the tilt correction unit 15 corrects the height information of the solder 22 based on the tilt information, thereby obtaining the height of the solder 22 relative to the surface of the substrate 2 when the substrate 2 is set as a zero reference plane. Can do.

  According to the tilt inspection apparatus 10 according to the present embodiment described above, when a region coated with a solder resist is used as a reference surface as a region other than the solder paste / land, for example, a 3D inspection of the solder paste ( To obtain the height). At this time, the tilt inspection apparatus 10 extracts the color of the substrate 2 and calculates the tilt of the substrate 2 based on the three measurement points designated in the area filled with the extracted color. Then, the correction amount of the height information can be obtained based on the inclination of the substrate 2, and the height information can be corrected over the entire surface of the substrate 2. Conventionally, since a certain location has been specified as a measurement point in advance, if a part or the like is provided at the specified position or if dust or the like is attached, an incorrect result is obtained in the process of calculating the subsequent inclination. However, in this example, these effects can be eliminated and the inclination can be inspected. Further, since the color of the substrate 2 portion is extracted, the labor for creating inspection data can be reduced.

  Further, the height measuring unit 12 measures the height for each pixel of the camera 3 over the entire surface of the substrate 2 and components, and generates height information. For this reason, even if the substrate 2 is finely processed, height information can be obtained for each minute region in accordance with the resolution of the camera 3. Further, the measurement points specified by the measurement point specifying unit 13 are dynamically specified based on the color of the substrate 2 for each imaging region. In addition, by automating the specification of the measurement point, it is not necessary for the user to specify the measurement point. Moreover, since the inclination calculation part 14 calculates | requires the inclination of the board | substrate 2 and the inclination correction | amendment part 15 correct | amends the inclination of the board | substrate 2, the inclination of the board | substrate 2 can be made parallel to a horizontal surface.

  In addition, since the measurement point designating unit 13 designates the three measurement points as the most distant locations in the vertical direction or the horizontal direction of the image of the imaging region, compared with the case where the measurement points are designated nearby, The reliability of the result of the process of calculating the inclination by the inclination calculating unit 14 is increased. Thereby, the inclination correction | amendment part 15 can obtain | require the inclination of the board | substrate 2 correctly.

  In addition, since the tilt calculation unit 14 calculates the tilt of the substrate 2 every time the camera 3 captures an image once, even if dust or the like adheres to some of the substrates 2, the influence of the dust can be suppressed. it can. In addition, the binary image displayed on the display unit 4 can clearly identify the portion coated with the solder resist 20 and the other portion.

<2. Modification>
The color extraction unit 11 of this example generates binary information of two different colors for the substrate 2 and displays a binary image on the display unit 4. However, the color extraction unit 11 displays three or more colors. You may make it display on the display part 4 the image designated and expressed with this color. Moreover, although the color extraction part 11 extracted the color of the board | substrate 2 (solder resist 20), you may make it extract the color of the other raw material coated on the board | substrate 2. FIG.

  The height measuring unit 12 and the inclination calculating unit 14 obtain the height and inclination of the substrate 2 with respect to the horizontal plane, but may obtain the height and inclination of the substrate 2 with respect to a vertical plane or an oblique plane. .

  In addition, the display unit 4 and the recording unit 6 are configured to be provided outside the inclination inspection device 10, but the configuration in which the inclination inspection device 10 includes the display unit 4 and the recording unit 6 is also preferable. Further, the color extraction unit 11 may automatically extract a color from a color image output from the camera 3 and generate a binary image if the colors of the substrate 2 and the components are known in advance. This saves the user from having to extract colors for each imaging region.

  Further, the present invention is not limited to the above-described embodiments, and it is needless to say that other various application examples and modifications can be taken without departing from the gist of the present invention described in the claims.

  DESCRIPTION OF SYMBOLS 1 ... Inclination inspection system 1, 2 ... Board | substrate, 3 ... Camera, 4 ... Display apparatus, 5 ... Operation part, 6 ... Recording part, 10 ... Inclination inspection apparatus, 11 ... Color extraction part, 12 ... Measurement part, 13 ... Measurement Point designation unit, 14 ... inclination calculation unit, 15 ... inclination correction unit

Claims (7)

The height information is obtained by measuring the height of the surface of the substrate and the part over the whole area of the substrate from the image of the imaging region output by the camera that images the substrate to which the component is attached, with a predetermined range as the imaging region. A height measuring unit to obtain,
Based on the binarization information that expresses the color of the substrate included in the image of the imaging region and the color of the member arranged on the substrate in two different colors, the location expressed by the color of the substrate A measurement point designating unit for designating at least three measurement points;
An inclination calculator that calculates an inclination of the substrate with respect to a predetermined plane based on the height information measured for each measurement point;
An inclination inspection apparatus comprising: an inclination correction unit that obtains a correction amount of the height information based on the inclination of the substrate and corrects the height information over the entire surface of the substrate. Further, when a part of the substrate is instructed with respect to the image of the imaging region displayed on the display unit, each part on the substrate including the color extracted from the substrate at the instructed position is displayed. An image painted with a predetermined color and an image painted with a color other than the color of the substrate with a color different from the predetermined color are displayed on the display unit as a binary image, and from the binary image The inclination inspection apparatus according to claim 1, further comprising a color extraction unit that outputs binarization information on the surface of the substrate to be obtained to the height measurement unit. When the first measurement point is designated at one of the four corners in the imaging region, the measurement point designating unit is farthest from each other in the vertical direction or the horizontal direction with respect to the first measurement point. The inclination inspection apparatus according to claim 2, wherein the second and third measurement points are designated at a location. The tilt inspection apparatus according to claim 3, wherein the tilt calculation unit calculates the tilt of the substrate every time the camera performs one imaging. The substrate is formed with a pad on which the member is placed, solder formed on the pad and joining the member, and a solder resist that covers the substrate with the pad and the solder exposed. When the color of the solder resist is designated, the color extraction unit is configured to identify a corresponding portion in the image of the imaging region including a color obtained by averaging colors within a certain range at a position designated by a user. The inclination inspection apparatus according to any one of claims 2 to 4. The tilt inspection apparatus according to claim 5, wherein the camera outputs a color image of the substrate. The height information is obtained by measuring the height of the surface of the substrate and the part over the whole area of the substrate from the image of the imaging region output by the camera that images the substrate to which the component is attached, with a predetermined range as the imaging region. Obtaining step;
Based on the binarization information that expresses the color of the substrate included in the image of the imaging region and the color of the member arranged on the substrate in two different colors, the location expressed by the color of the substrate Designating at least three measurement points;
Calculating an inclination of the substrate with respect to a predetermined plane based on the height information measured for each measurement point;
A step of obtaining a correction amount of the height information based on the inclination of the substrate and correcting the height information over the entire surface of the substrate.

Images