JP2011228520A - Soldering nozzle, soldering equipment, and soldering method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering nozzle, a soldering equipment with the soldering mozzle, and a soldering method which is able to provide highly reliable solder joints and to shorten operation time for soldering.SOLUTION: A soldering nozzle 1 comprises a tubular part 2 with, at the end thereof, an aperture 3 for jetting a molten solder 12, a sidewall part 4 attached to the tubular part 2 in such a way that it extends from the end of the tubular part 2 along an extending direction of the tubular part 2 and surrounds the aperture 3. The sidewall part 4 comprises a cutout part 5 formed to pass through the sidewall part 4 in a diameter direction of the tubular part 2.

Description

  The present invention relates to a soldering nozzle, a soldering apparatus, and a soldering method, and more particularly to a soldering nozzle, a soldering apparatus, and a soldering method in jet soldering.

  As a soldering method, there is a jet soldering method in which an object to be soldered is immersed in molten solder. In this soldering method, for example, the electronic component is soldered to the printed wiring board by bringing the electronic component inserted into the through hole of the printed wiring board into contact with the molten solder.

  In this soldering method, in order to obtain good solderability, it is extremely important to control the liquid level of the molten solder that is jetted from the soldering nozzle. In a general jet soldering apparatus, a plurality of soldering nozzles corresponding to a portion to be soldered of a printed wiring board are provided. Since the molten solder jet height differs for each of the plurality of soldering nozzles, it is difficult to manage the jet height.

  For example, Japanese Patent Application Laid-Open No. 2008-109033 (Patent Document 1) proposes a soldering apparatus in which one soldering nozzle is provided for a solder bath. The soldering apparatus disclosed in this publication includes a printed circuit board by moving a printed circuit board and a solder bath by configuring a drive system with a substrate setting mechanism of a circuit board transport / drive unit and an XY table unit of a solder execution unit. A predetermined jet nozzle is relatively positioned with respect to each of the soldering portions of each of the soldering parts, and soldering is performed individually.

JP 2008-109033 A

  In the soldering apparatus of this publication, the gap between the printed circuit board (printed wiring board) and the jet nozzle (soldering nozzle) protrudes from the printed wiring board of the lead of the electronic component inserted into the through hole of the printed wiring board. It must be larger than the length of. For this reason, in order to make molten solder contact a printed wiring board, it is necessary to raise the solder jet height of the molten solder jetted from a soldering nozzle.

  However, when the solder jet height is high, the state of the solder jet is not stable, so that there is a problem that soldering defects such as bridges and horns are easily induced. Further, since the gap between the printed wiring board and the soldering nozzle is large, there is a problem that the solderability to the through hole is deteriorated. By increasing the solder immersion time, it is possible to ensure the solder rise. However, if the solder immersion time is increased, there is a problem that the copper electrode of the printed wiring board is excessively eaten.

  Further, since the soldering nozzle solders the soldered portions individually, it takes time to solder when the printed wiring board has a plurality of soldered portions.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a soldering nozzle capable of obtaining a highly reliable solder joint portion and shortening the soldering operation time, and a soldering apparatus including the same And providing a soldering method.

  The soldering nozzle of the present invention is attached to the tubular portion so as to extend from the distal end along the extending direction of the tubular portion, and surrounds the periphery of the opening. The side wall part has a notch part formed so as to penetrate the side wall part in the radial direction of the tubular part.

  According to the soldering nozzle of the present invention, the side wall portion has a cutout portion formed so as to penetrate the side wall portion in the radial direction of the tubular portion, and therefore protrudes from the printed wiring board into the region surrounded by the side wall portion. By inserting the lead, the distance between the printed wiring board and the soldering nozzle can be shortened. For this reason, the solder jet height of the molten solder can be lowered. Therefore, since the state of the solder jet of molten solder can be stabilized, poor soldering such as bridges and horns can be suppressed.

  Further, since the distance between the printed wiring board and the soldering nozzle is short, it is possible to ensure the solderability of the molten solder into the through hole. Moreover, since the soldering property of the molten solder to the through hole is good, the solder immersion time can be shortened. Thereby, the biting of the electrode of a printed wiring board can also be suppressed.

  In addition, since the side wall portion has a notch formed so as to penetrate the side wall portion in the radial direction of the tubular portion, the lead protruding from the printed wiring board through the notch is moved from the inside of the soldering nozzle to the outside. Can be made. For this reason, in order to avoid interference with the lead, the soldering nozzle is moved relatively along the printed wiring board and soldered without moving the soldering nozzle relative to the printed wiring board in the vertical direction. be able to. Therefore, when the printed wiring board has a plurality of soldering portions, the soldering nozzle can be moved to the plurality of soldering portions without relatively moving in the vertical direction toward the printed wiring board. Soldering time can be shortened.

  Therefore, the soldering nozzle of the present invention can obtain a highly reliable solder joint and can shorten the soldering operation time.

It is a schematic sectional drawing of the soldering apparatus in Embodiment 1 of this invention. It is a schematic sectional drawing which shows the P1 part of FIG. It is a schematic perspective view of the soldering nozzle in Embodiment 1 of this invention. In the soldering method in Embodiment 1 of this invention, it is a schematic perspective view which shows a mode that a soldering nozzle and the lead of a printed wiring board move relatively. It is a schematic sectional drawing which shows the 1st process of the soldering method in Embodiment 1 of this invention, Comprising: A cross-sectional position respond | corresponds to the P2 part of FIG. It is a schematic sectional drawing which shows the 2nd process of the soldering method in Embodiment 1 of this invention, Comprising: A cross-sectional position respond | corresponds to P2 part of FIG. It is a schematic sectional drawing which shows the 3rd process of the soldering method in Embodiment 1 of this invention, Comprising: A cross-sectional position respond | corresponds to P2 part of FIG. It is a schematic sectional drawing of the soldering apparatus of a comparative example. It is a schematic perspective view of the soldering nozzle in Embodiment 2 of this invention. In the soldering method in Embodiment 2 of this invention, it is a schematic perspective view which shows a mode that a soldering nozzle and the lead of a printed wiring board move relatively.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
First, the configuration of the soldering apparatus according to the first embodiment of the present invention will be described.

  1 and 2, a soldering apparatus 10 according to the present embodiment includes a soldering nozzle 1, a solder bath 11, a motor 13, a motor shaft 14, an impeller 15, a chamber 16, and a nozzle. It mainly has a plate 17. 1 and 2, the molten solder 12, the printed wiring board 21, the electronic component 31, and the like are also illustrated.

  The soldering device 10 is a device that jets molten solder 12 from a soldering nozzle 1 to bring the molten solder 12 into contact with an object to be soldered such as the printed wiring board 21 and the electronic component 31 and solders.

  A printed wiring board 21 which is an example of a soldering object is soldered by being moved in the XYZ directions in the figure with respect to the soldering nozzle 1 by a conveying means (not shown). In the printed wiring board 21, the lead 32 of the electronic component 31 is inserted into the through hole 23 in which the electrode 22 is formed. By moving the printed wiring board 21, the lead 32 is moved in accordance with the position of the soldering nozzle 1. As the printed wiring board 21, for example, a base material in which an epoxy resin is contained in a glass cloth is used. The electrode 22 is a copper electrode, for example.

  The solder tank 11 is for storing the molten solder 12, and is constituted by a hollow casing having at least a part of the upper surface opened. Molten solder 12 is stored inside the casing. For example, Sn-3.0Ag-0.5Cu, which is a general lead-free solder material, is used for the molten solder 12. A motor shaft 14, an impeller 15, and a chamber 16 are disposed inside the housing. A nozzle plate 17 is attached to the chamber 16. The nozzle plate 17 is disposed on the opened upper surface of the solder tank 11.

  The soldering nozzle 1 is provided so as to protrude from the solder bath 11. In the present embodiment, the soldering nozzle 1 is attached to the nozzle plate 17. For this reason, the soldering nozzle 1 is disposed so as to protrude upward from the opened upper surface of the solder bath 11.

  A suction port 16 a is formed at the lower end of the chamber 16. An impeller 15 is disposed in the vicinity of the suction port 16a. An impeller 15 is disposed inside the chamber 16. The impeller 15 is rotatably disposed via a motor 13 and a motor shaft 14 that are disposed outside the solder bath 11. The impeller 15 may be disposed outside the chamber 16 as long as it can supply the molten solder 12 to the soldering nozzle 1.

  Then, the structure of the soldering nozzle 1 of the soldering apparatus 10 of this Embodiment is demonstrated in detail.

  2 and 3, the soldering nozzle 1 has a tubular portion 2 and a side wall portion 4. A side wall portion 4 is provided at the tip of the tubular portion 2. The tubular portion 2 has an opening 3 for jetting molten solder 12 at the tip. The tubular portion 2 may be a cylindrical tube or a rectangular tube. The opening 3 is constituted by the inner wall of the tubular portion 2 at the distal end of the tubular portion 2.

  The side wall part 4 is attached to the tubular part 2 so as to extend along the extending direction of the tubular part 2 from the distal end of the tubular part 2. The side wall portion 4 is formed so as to surround the periphery of the opening 3. The side wall part 4 is configured to extend a part of the inner wall of the tubular part 2 in the extending direction of the tubular part 2.

  The side wall 4 has a notch 5 formed so as to penetrate the side wall 4 in the radial direction of the tubular portion 2. The notch 5 is constituted by a space region where a part from the inner wall to the outer wall of the tubular part 2 is cut off at a part of the tip of the tubular part 2.

  The cutout portion 5 may include a plurality of cutout portions, and the plurality of cutout portions may have a first cutout portion 51 and a second cutout portion 52 provided on the side wall portion 4 so as to face each other. In this case, the first cutout portion 51 and the second cutout portion 52 are provided in directions of 0 ° and 180 ° of the circumference of the opening 3. That is, the first cutout portion 51 and the second cutout portion 52 are arranged on a straight line in plan view.

  In the above description, the printed wiring board 21 has been described with respect to a case where a base material in which an epoxy resin is contained in a glass cloth is used. A base material containing a polyimide resin, a phenol resin, or the like in the base material may be used.

  In the above description, the molten solder 12 is a Sn—Ag—Cu based solder, but is not limited to this. The Sn—Cu based solder, Sn—Bi based solder, Sn—In based solder, Sn Either -Sb solder or Sn-Pb solder may be used.

Next, the operation of the soldering apparatus of this embodiment will be described.
Referring to FIGS. 1 and 2, molten solder 12 stored in solder bath 11 flows into chamber 16 from suction port 16 a. By receiving the driving force of the motor 13 through the motor shaft 14, the impeller 15 rotates. As the impeller 15 rotates, the molten solder 12 flowing into the chamber 16 from the suction port 16a is supplied toward the soldering nozzle 1 through the chamber 16 as indicated by an arrow A in FIG.

  The molten solder 12 supplied toward the soldering nozzle 1 is jetted from the opening 3 of the soldering nozzle 1. At this time, a part of the molten solder 12 is ejected from the opening 3 through the notch 5 and out of the soldering nozzle 1. Further, the other part of the molten solder 12 moves upward along the side wall part 4 and is ejected from the tip of the side wall part 4 to the outside of the soldering nozzle 1.

  At the tip of the soldering nozzle 1, the tip of the protruding portion of the lead 32 of the electronic component 31 is inserted inside the soldering nozzle 1. That is, the tip end portion of the lead 32 protruding from the printed wiring board 21 is inserted into the area AR surrounded by the side wall 4.

  Since the lead 32 is inserted into the area AR surrounded by the side wall 4, the distance (gap) between the printed wiring board 21 and the soldering nozzle 1 can be shortened. More specifically, the gap NG between the electrode 22 of the printed wiring board 21 and the tip of the soldering nozzle 1 can be shortened. For this reason, the solder jet height of the molten solder 12 jetted from the soldering nozzle 1 can be set low. Therefore, the state of the solder jet of the molten solder 12 is stabilized. Moreover, since the gap NG between the printed wiring board 21 and the soldering nozzle 1 can be narrowed, the soldering of the molten solder 12 to the through hole 23 becomes good.

  The length of the protruding portion of the lead 32 can be set to 2 mm, for example. A gap NG between the printed wiring board 21 and the soldering nozzle 1 can be set to 1 mm, for example. The length PL of the tip portion of the protruding portion of the lead 32 inserted in the region AR surrounded by the side wall portion 4 can be set to 1 mm. The solder jet height SH of the molten solder 12 can be set to 2 mm, for example. The depth of the notch 5 can be set to 2 mm, for example.

  The soldering nozzle 1 can be set in a cylindrical shape having an outer diameter of 8 mm and an inner diameter of 7 mm, for example. The temperature of the molten solder 12 can be set to 280 ° C., for example. The moving speed of the printed wiring board 21 in the horizontal direction can be set to 3 mm / s, for example. Each of these numerical values is not limited, and can be set to a numerical value applicable in a timely manner.

  With reference to FIG. 4, how the lead 32 is taken out from the notch 5 of the soldering nozzle 1 by the relative movement of the soldering nozzle 1 and the lead 32 of the printed wiring board 21 will be described. Note that the molten solder 12 is not shown in FIG. 4 for easy viewing.

  The length of the tip portion of the lead 32 inserted in the area AR surrounded by the side wall portion 4 of the soldering nozzle 1 is shorter than the depth of the notch portion 5. Therefore, when the printed wiring board 21 is moved in the direction of the arrow AX in the figure and the lead 32 is moved in the direction of the arrow AX in the figure, the lead 32 passes through the notch portion 5 from the inside to the outside of the soldering nozzle 1. Moving.

  Since the soldering nozzle 1 has the notch portion 5, contact between the lead 32 and the solder nozzle 1 can be avoided. That is, the soldering nozzle 1 can avoid interference with the lead 32 by the notch 5. For this reason, the lead 32 can be moved from the inside to the outside of the soldering nozzle 1 without moving in the Z direction in the drawing.

  Since the first cutout portion 51 and the second cutout portion 52 are provided in the side wall portion 4, the lead 32 is inserted into the soldering nozzle 1 from the first cutout portion 51, and the second cutout portion 51 It is possible to move from the part 52 to the outside of the soldering nozzle 1. In addition, since the first cutout portion 51 and the second cutout portion 52 are provided on the side wall portion 4 so as to face each other, the lead 32 moves the first cutout portion 51 and the second cutout portion 52 in one direction. Can move linearly.

Next, the soldering method of this embodiment will be described.
Referring to FIG. 5, printed wiring board 21 in which leads 32 of electronic component 31 are inserted into through holes 23 is prepared. The leading end portion of the protruding portion of the lead 32 protruding from the printed wiring board 21 is inserted into the area AR surrounded by the side wall portion 4.

  In this state, the molten solder 12 is jetted from the soldering nozzle 1 to the lead 32 inserted into the through hole 23 of the printed wiring board 21. A part of the molten solder 12 jetted from the soldering nozzle 1 contacts the electrode 22 and the through hole 23 along the lead 32. Further, the molten solder 12 moves upward in the through hole 23. Part of the molten solder 12 jetted from the soldering nozzle 1 is jetted out of the soldering nozzle 1 through the side wall 4 and the notch 5 from the opening 3, and moves downward along the tubular portion 2.

  Referring to FIG. 6, molten solder 12 is jetted until it exceeds the upper end of through hole 23 so as to form a solder fillet on the upper surface of electrode 22. The solder fillet in which the molten solder 12 is solidified is formed between the electrode 22 and the lead 32, between the lead 32 and the lower surface of the electrode 22, and between the lead 32 and the upper surface of the electrode 22.

  After this soldering, the printed wiring board 21 is moved in the direction of arrow AX in the figure. Thereby, the printed wiring board 21 and the soldering nozzle 1 are relatively moved, and the lead 32 is taken out from the soldering nozzle 1 through the notch 5.

  Referring to FIG. 7, thereafter, a region AR surrounded by the side wall portion 4 from the notch portion 5 formed in the soldering nozzle 1 protrudes from the printed wiring board 21 different from the lead 32 previously soldered. The lead 32 is inserted. In this state, the molten solder 12 is ejected from the opening 3 of the soldering nozzle 1 and a lead 32 other than the lead 32 previously soldered is soldered in the same manner as described above. When the printed wiring board 21 has a plurality of soldered portions, the soldering is continuously performed by the soldering nozzle 1 in this manner.

Next, the effect of this embodiment will be described in comparison with a comparative example.
Referring to FIG. 8, the configuration of soldering nozzle 1 is mainly different in the comparative example compared to the present embodiment. The soldering apparatus 10 of the comparative example has a plurality of soldering nozzles 1. In the soldering apparatus 10 of the comparative example, since the solder jet height of the molten solder 12 is different for each of the plurality of soldering nozzles 1, it is difficult to manage the solder jet height.

  On the other hand, in the soldering apparatus 10 of the present embodiment, since one soldering nozzle 1 is provided, management of the solder jet height of the molten solder 12 can be facilitated.

  According to the soldering nozzle 1 of the present embodiment, the side wall portion 4 has the cutout portion 5 formed so as to penetrate the side wall portion 4 in the radial direction of the tubular portion 2. The distance between the printed wiring board 21 and the soldering nozzle 1 can be shortened by inserting the lead 32 protruding from the printed wiring board 21 into the area AR. For this reason, the solder jet height SH of the molten solder 12 can be lowered. Therefore, since the state of the solder jet of the molten solder 12 can be stabilized, poor soldering such as bridges and horns can be suppressed.

  Further, since the gap NG between the printed wiring board 21 and the soldering nozzle 1 is short, the soldering property of the molten solder 12 to the through hole 23 can be ensured.

  Moreover, since the soldering property of the molten solder 12 to the through hole 23 is good, the solder immersion time can be shortened. Thereby, the biting of the electrode 22 of the printed wiring board 21 can also be suppressed.

  In this manner, the soldering nozzle 1 of the present embodiment can obtain a highly reliable solder joint.

  Moreover, since the side wall part 4 has the notch part 5 formed so that the side wall part 4 might be penetrated in the radial direction of the tubular part 2, the lead 32 which protrudes from the printed wiring board 21 through the notch part 5 is soldered. The nozzle 1 can be moved from the inside to the outside. For this reason, in order to avoid interference with the lead 32, the soldering nozzle 1 is moved in the direction along the printed wiring board 21 without moving it relatively in the vertical direction (Z-axis direction in FIG. 1) toward the printed wiring board 21 ( Soldering can be performed by relatively moving the soldering nozzle 1 in the XY axis direction in FIG. Therefore, when the printed wiring board 21 has a plurality of soldering portions, the soldering portions are soldered to the printed wiring board 21 without relatively moving in the vertical direction (Z-axis direction in FIG. 1). Since the attaching nozzle 1 can be moved, the time for the soldering operation can be shortened.

  According to the soldering nozzle 1 of the present embodiment, the cutout portion 5 includes a plurality of cutout portions, and the plurality of cutout portions are first and second cutout portions provided on the side wall portion 4 so as to face each other. 51, 52 may be included. Accordingly, since the plurality of cutout portions are provided on the side wall portion 4 so as to face each other, the soldering nozzle 1 and the lead 32 protruding from the printed wiring board 21 are relatively moved in one direction through the plurality of cutout portions. Can be made.

  For this reason, the lead 32 can move out of the solder nozzle 1 from the second cutout portion facing the first cutout portion 51 that is passed when the lead 32 is inserted into the area AR surrounded by the side wall portion 4. . Therefore, when a plurality of soldering portions are arranged in one direction, the lead 32 can move linearly in one direction between the first cutout portion 51 and the second cutout portion 52. The soldering nozzle 1 can be quickly moved to the soldering portion.

  Further, when soldering the next soldering portion, the next soldering is performed without returning the lead 32 from the first cutout portion 51 that is passed when the lead 32 is inserted into the region AR surrounded by the side wall portion 4. The soldering nozzle 1 can be moved relative to the part. Therefore, since the soldering nozzle 1 can be quickly moved to the next soldering portion, the time for the soldering operation can be shortened.

  According to the soldering apparatus 10 of the present embodiment, since the soldering tank 11 for storing the molten solder 12 and the soldering nozzle 1 provided so as to protrude from the soldering tank 11 are provided, A highly reliable solder joint can be obtained and the soldering operation time can be shortened.

  The soldering method of the present embodiment is a soldering method in which the molten solder 12 is jetted from the soldering nozzle 1 to the lead 32 inserted into the through hole 23 of the printed wiring board 21 and includes the following steps. .

  The printed wiring board 21 in which the leads 32 are inserted into the through holes 23 is prepared. In the soldering nozzle 1, the lead 32 protruding from the printed wiring board 21 is inserted into the area AR surrounded by the side wall 4, and the molten solder 12 is ejected from the opening 3 and soldered. After the soldering, the printed wiring board 21 and the soldering nozzle 1 are relatively moved, and the lead 32 is taken out from the inside of the soldering nozzle 1 through the notch 5. Thereby, since the printed wiring board 21 and the soldering nozzle 1 are relatively moved and the lead 32 is taken out from the inside of the soldering nozzle 1 through the notch portion 5, a highly reliable solder joint can be obtained. In addition, the soldering operation time can be shortened.

  In the above description, the case where the printed wiring board 21 is moved in the XYZ directions in FIG. 1 with respect to the molten solder 12 jetted from the soldering nozzle 1 and soldered to an arbitrary portion of the printed wiring board 21 has been described. However, the soldering nozzle 1 may be configured to move in the XYZ directions in FIG. 1 by the conveying means. In this case, the same effect as described above can be obtained.

(Embodiment 2)
In the second embodiment of the present invention, the configuration of the soldering nozzle is mainly different from that in the first embodiment.

  Referring to FIG. 9, in the present embodiment, soldering nozzle 1 has third and fourth cutout portions 53 and 54 in addition to first and second cutout portions 51 and 52. The plurality of cutout portions include a third cutout portion 53 and a fourth cutout portion provided in the side wall portion 4 so as to face each other in a direction intersecting with a direction in which the first cutout portion 51 and the second cutout portion 52 face each other. The notch portion 54 is provided.

  When the first cutout portion 51 and the second cutout portion 52 are provided in the directions of 0 ° and 180 ° of the circumference of the opening 3, the third cutout portion 53 and the fourth cutout portion 54 are formed. The openings 3 are provided in directions of 90 ° and 270 ° of the circumference of the opening 3. That is, the first to fourth cutout portions 51 to 54 are arranged 90 degrees apart in the circumferential direction. The 3rd notch part 53 and the 4th notch part 54 are arrange | positioned on the straight line which cross | intersects the direction where the 1st notch part 51 and the 2nd notch part 52 are arrange | positioned in planar view.

  With reference to FIG. 10, how the lead 32 is taken out from the notch portion 5 of the soldering nozzle 1 by the relative movement of the soldering nozzle 1 and the lead 32 of the printed wiring board 21 will be described. In FIG. 10, the molten solder 12 is not shown for easy viewing.

  Referring to FIG. 10, in addition to the first cutout portion 51 and the second cutout portion 52, the third cutout portion 53 and the fourth cutout portion 54 are provided in the side wall portion 4. Can be inserted into the soldering nozzle 1 from one of the first to fourth cutout portions 51 to 54 and moved to the outside of the soldering nozzle 1 from the other cutout portion.

  In addition, since the structure and method other than this of this Embodiment are the same as that of Embodiment 1 mentioned above, the same code | symbol is attached | subjected about the same element and the description is abbreviate | omitted.

  According to the soldering nozzle 1 of the present embodiment, the plurality of notch portions are provided on the side wall portion 4 so as to face each other in a direction intersecting with the direction in which the first and second notch portions 51 and 52 face each other. The third and fourth cutout portions 53 and 54 are formed. Therefore, the third notch portion 53 and the fourth notch portion 54 are provided on the side wall portion 4 so as to face each other in a direction intersecting with the direction in which the first notch portion 51 and the second notch portion 52 face each other. Therefore, the lead 32 can move linearly in one direction between the first cutout portion 51 and the second cutout portion 52 and the third cutout portion 53 and the fourth cutout portion 54. Can be moved linearly in one direction.

  Therefore, when a plurality of soldering portions are arranged in one direction and in a direction intersecting therewith, the lead 32 moves linearly in one direction between the first cutout portion 51 and the second cutout portion 52. In addition, the lead 32 can linearly move the third cutout portion 53 and the fourth cutout portion 54 in a direction intersecting one direction thereof. Thereby, since the soldering nozzle 1 can be rapidly moved to the next soldering part, the time of soldering work can be shortened.

The above embodiments can be combined in a timely manner.
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Soldering nozzle, 2 Tubular part, 3 opening, 4 Side wall part, 5 Notch part, 10 Soldering apparatus, 11 Solder tank, 13 Motor, 14 Motor shaft, 15 Impeller, 16 Chamber, 16a Inlet, 17 Nozzle plate, 21 printed wiring board, 22 electrodes, 23 through hole, 31 electronic component, 32 lead, 51 first cutout portion, 52 second cutout portion, 53 third cutout portion, 54 fourth cutout portion.

Claims (5)

A tubular part having an opening for jetting molten solder at the tip;
A side wall portion attached to the tubular portion so as to extend along the extending direction of the tubular portion from the tip, and formed so as to surround the periphery of the opening;
The said side wall part is a soldering nozzle which has a notch part formed so that the said side wall part might be penetrated in the radial direction of the said tubular part. The notch includes a plurality of notches,
2. The soldering nozzle according to claim 1, wherein the plurality of cutout portions have first and second cutout portions provided on the side wall portion so as to face each other.   The plurality of cutout portions include third and fourth cutout portions provided in the side wall portion so as to face each other in a direction intersecting the direction in which the first and second cutout portions face each other. The soldering nozzle according to claim 2. A solder bath for storing the molten solder;
The soldering apparatus provided with the soldering nozzle in any one of Claims 1-3 provided so that it might protrude from the said solder tank. A soldering method in which molten solder is jetted from a soldering nozzle to a lead inserted into a through hole of a printed wiring board,
Preparing the printed wiring board in which the leads are inserted into the through holes;
The soldering nozzle according to any one of claims 1 to 3, wherein the lead protruding from the printed wiring board is inserted into a region surrounded by the side wall portion, and the molten solder is ejected from the opening and soldered. Process,
After the soldering, the method includes: a step of relatively moving the printed wiring board and the soldering nozzle to take the lead out of the soldering nozzle through the notch.

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