JP2011218786A - Method for manufacturing gas barrier film and gas barrier film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing gas barrier film capable of preventing functional groups positioned on the surface of a substrate from being amidated or nitrided and capable of improving the interlayer adhesive force without depending on oxygen bonds and to provide the gas barrier film manufactured by using the method for manufacturing gas barrier film.SOLUTION: The method for manufacturing gas barrier film includes: a plasma treatment step of performing plasma treatment onto the surface of a plastic film that roles as the substrate beforehand in such an environment that an atmospheric pressure is 1×10to 1×10torr under the introduction of an inactive gas; and a gas barrier layer lamination step of laminating the gas barrier layer having a gas barrier property on the surface of the plastic film after having performed the plasma treatment step. The gas barrier film obtained by the method is also provided.

Description

  TECHNICAL FIELD The present invention relates to a method for producing a gas barrier film and a gas barrier film obtained by the production method. Specifically, the present invention relates to a high barrier that can suppress and prevent the occurrence of delamination, and at the same time has further improved barrier properties. The present invention relates to a method for producing a gas barrier film having properties and a gas barrier film obtained by the production method.

  Conventionally, a plastic film imparted with a gas barrier property (hereinafter also simply referred to as a “gas barrier film”) for protecting a substance that dislikes oxygen and moisture has been widely used in various scenes. For example, it is used as a packaging material for food or as a packaging material for electronic component materials. In such use, the packaging material is strongly required to have the property of suppressing or preventing the alteration of the contents. In particular, there has recently been a need for a packaging material that can easily protect articles that are so delicate that they are easily altered by oxygen, water vapor, and the like and that require careful handling from oxygen and water vapor.

  Conventionally, plastic films made of polyvinylidene chloride, polyacrylonitrile, or the like have been used as films having gas barrier properties, but these films are no longer used because they discharge environmental harmful substances upon disposal. From the viewpoint of environmental problems, it seems that it is preferable to use a plastic film made of polyvinyl alcohol. However, this film has a high gas barrier humidity dependency, that is, a gas barrier property, particularly water vapor, under high humidity. Since the barrier property is remarkably and easily deteriorated, it cannot be used in a scene that requires a high gas barrier property.

  Therefore, a film in which an inorganic substance such as silicon oxide or aluminum oxide is provided on the surface of a plastic film by physical vapor deposition or chemical vapor deposition is used as a packaging material as a gas barrier film. However, these gas barrier films have durability against bending. In other words, cracks are easily generated in the vapor deposition layer during bending, so that there is a problem that the barrier property is easily lowered. In addition, since the interlayer adhesion between the plastic film and the inorganic material deposited on the surface is small, if the film is repeatedly bent, the inorganic material cannot follow the flexibility of the film. Since there was a loss of sex, there was a problem in practical use.

  Therefore, various proposals have been made to deal with such problems. For example, in Patent Document 1, a surface of a polyester film used as a substrate is subjected to plasma treatment, and then an invention relating to a laminate having a polymer layer containing Si in a structural unit and formed by a plasma polymerization method on the surface. Is disclosed.

Patent registration No. 3427398

  If it is a laminated body described in Patent Document 1, it is possible to obtain a ceramic film having excellent adhesion and flexibility between a polyester film as a base film and a polymer layer laminated on the surface. Is possible.

  However, if the invention described in Patent Document 1 is examined in detail, this invention is mainly intended to control the degree of oxidation in plasma polymerization. Although the adhesion between the polyester film and the polymer layer is improved by the formation of oxidative bonds, the oxidative bonds are formed after lamination because the oxidative bonds are formed on the laminated surface, that is, the surface subjected to plasma treatment. However, since the interlaminar adhesion force is lost due to being easily cut, a laminated body in which it is difficult to maintain high barrier properties is a problem.

  The present invention has been made in view of such problems, and the object thereof is to prevent adhesion of functional groups located on the surface of the substrate to amidation or nitridation, and without relying on oxygen bonding. It is providing the gas barrier film by the manufacturing method of the gas barrier film which made it possible to improve, and the manufacturing method which concerns.

In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention provides at least an air pressure of 1 × 10 ⁻¹ to 1 × 10 ⁻ under the introduction of an inert gas to the surface of a plastic film serving as a base material. ^A plasma treatment step of performing a plasma treatment in an environment of ³ torr, and a first polymer resin lamination step of laminating a first polymer resin on the surface of the substrate subjected to the plasma treatment. After the first polymer resin layer lamination step, the plasma treatment step is performed again on the surface of the first polymer resin layer, and then a gas barrier layer having gas barrier properties is laminated on the surface after the plasma treatment. A gas barrier layer stacking step, wherein the plasma treatment is a glow discharge plasma treatment, and the surface of the base material to which the glow discharge plasma treatment step has been applied is provided on the surface of the substrate. Any metal belonging by subjected to discharge plasma treatment from the 4th period Group 4 of the periodic table in the Group 12, or the alloy with a metal to each other within that range is attached, characterized by.

  Invention of Claim 2 of this invention is a manufacturing method of the gas barrier film of Claim 1, Comprising: After the said gas barrier layer lamination process, 2nd polymer resin is laminated | stacked on the surface of the said gas barrier layer. And performing the second polymer resin laminating step.

In the invention according to claim 3 of the present invention, the pressure of 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr is introduced in advance under the introduction of an inert gas to the surface of the plastic film serving as the base material. By performing the glow discharge plasma treatment on the surface of the base material that has been subjected to the glow discharge plasma treatment step by performing the glow discharge plasma treatment, it belongs to the fourth period group 4 to group 12 in the periodic table. After first performing the plasma treatment process of attaching any metal or alloy of metals within the range,
(A) a gas barrier layer stacking step in which layers having gas barrier properties are stacked;
(B) a first polymer resin lamination step in which the first polymer resin is laminated;
(C) a second polymer resin lamination step in which the second polymer resin is laminated;
Each process of
(Condition 1) (A) must be executed once.
(Condition 2) The same process is not repeated.
(Condition 3) Either (B) or (C) may not be executed.
(Condition 4) Every time the process of any one of (A) to (C) is executed once, it is assumed that the process is executed once, and the process is executed twice or more in total.
It is characterized by being executed in accordance with the condition.

  The invention according to claim 4 of the present invention is the gas barrier film manufacturing method according to any one of claims 1 to 3, wherein the outermost surface of the outermost surface of the laminate obtained by the manufacturing method is used. And a film laminating step in which an outermost layer is laminated by laminating a plastic film.

  Invention of Claim 5 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 4, Comprising: The said inert gas is argon gas or argon / oxygen gas. It is characterized by being.

  Invention of Claim 6 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 5, Comprising: The substance which comprises the said gas barrier layer is silicon, titanium, tin Any one of the group consisting of zinc, aluminum, indium, magnesium, or an oxide, nitride, or compound thereof, or a plurality of the oxides, nitrides, or compounds in the group The gas barrier layer is laminated by a vacuum deposition method.

  Invention of Claim 7 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 6, Comprising: The said gas barrier layer is a silicon oxide shown by SiOx, The x is 1.0 ≦ x ≦ 2.0.

  Invention of Claim 8 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 7, Comprising: Said 1st polymer resin or said 2nd polymer resin Either one or both of them is based on a silane coupling agent or a polymer resin mainly composed of a silane coupling agent.

  Invention of Claim 9 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 8, Comprising: Said 1st polymer resin layer or said 2nd polymer resin A curing catalyst is added to one or both of the layers.

  The invention according to claim 10 of the present invention is the method for producing a gas barrier film according to claim 9, wherein the curing catalyst is iron acetylacetonate, zinc acetylacetonate, aluminum acetonate, tin tetrachloride, It is one or more of diisopropoxybisacetylacetonato titanium and dihydroxybis lactato titanium.

  The invention related to the gas barrier film according to claim 11 of the present invention is characterized by being manufactured by the method for manufacturing a gas barrier film according to any one of claims 1 to 10.

  The invention related to the solar battery backsheet according to claim 12 of the present invention is characterized by using the gas barrier film according to claim 11.

  As described above, conventionally, even if it is easy to improve the oxygen gas barrier property, the water vapor barrier property is improved at the same time, or even if it is easy to improve the water vapor gas barrier property, the oxygen gas barrier property is simultaneously improved. It is difficult to improve the gas barrier film according to the present invention, and it is possible to improve the oxygen gas barrier property as well as the water vapor gas barrier property. At the same time, it becomes possible to make a material suitable as a packaging material for an electronic member that requires a high level of water vapor gas barrier properties. This is because in the production method according to the present invention, the surface of the plastic film is simply and purely physically roughened by applying a so-called plasma treatment to the surface of the plastic film as a substrate under the introduction of an inert gas. As a result, by laminating a so-called anchor coat layer on the surface or directly laminating a gas barrier substance, the connection with the base film becomes strong, that is, hydrolysis occurs in this portion. As a result, it is possible to suppress a decrease in adhesion due to the above, and a delamination associated therewith, so that a gas barrier film capable of maintaining a high level of gas barrier properties can be obtained. In addition, by subjecting the substrate surface to plasma treatment under the introduction of an inert gas, a state in which substances laminated on the surface are densely agglomerated is induced, and such a layer is laminated. Can be made higher level.

  Embodiments of the present invention will be described below. The embodiment shown here is merely an example, and is not necessarily limited to this embodiment.

(Embodiment 1)
A method for manufacturing a gas barrier film according to the present invention will be described as a first embodiment.

The method for producing a gas barrier film according to the present embodiment is at least in the environment of an atmospheric pressure of 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr with an inert gas introduced into the surface of a plastic film serving as a base material. Performing a plasma treatment step of performing a plasma treatment in advance, and a first polymer resin lamination step of laminating a first polymer resin on the surface of the base material that has been subjected to the plasma treatment, After the one polymer resin layer laminating step, the plasma treatment step is performed again on the surface of the first polymer resin layer, and then a gas barrier layer laminating step in which a gas barrier layer having gas barrier properties is laminated on the surface after the plasma treatment. And the plasma treatment is a glow discharge plasma treatment, and the glow discharge plasma is applied to the surface of the base material subjected to the glow discharge plasma treatment step. As a result of the treatment, any metal belonging to Group 4 to Group 12 of the fourth period in the periodic table, or an alloy of metals within the range is attached. .

Hereinafter, description will be made sequentially.
First, the plasma treatment is performed on the surface of the plastic film as the base material while introducing an inert gas. In this embodiment, the atmospheric pressure is 1 × 10 ⁻¹ to 1 × 10 ^{−3 in} this embodiment. It is assumed that it is torr. That is, the plasma treatment in the present embodiment is a GD plasma treatment with an inert gas introduced. Further, the plasma treatment in the present embodiment is a glow discharge plasma treatment, and the substrate surface subjected to the glow discharge plasma treatment step is further subjected to the glow discharge plasma treatment, whereby the fourth period group 4 in the periodic table. To any one of the metals belonging to the same group 12, or an alloy of metals within the range. (Hereinafter, the plasma treatment in the present invention is also referred to as “GD plasma treatment”.)

More specifically, the inert gas is preferably argon gas or argon gas mixed with oxygen, and argon gas is used here. The atmospheric pressure is preferably 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr as described above. This is because plasma discharge occurs when the GD plasma treatment is performed in the presence of argon gas within this range, and the desired effect described later can be reliably obtained. In order to obtain the effect of GD plasma treatment more reliably, the atmospheric pressure range may be 2 × 10 ⁻² torr or more and 7 × 10 ⁻² torr or less. In this embodiment, it is assumed to be 5 × 10 ⁻² torr.

  The state of the GD plasma-treated surface of the base film after the GD plasma treatment according to the present embodiment is determined based on the result of photoelectron spectroscopy (XPS) analysis in which the carbonyl group of the surface functional group is nitrided or It is necessary not to be in an oxidized state. In addition, the surface roughness Ra of any 10 points (excluding protrusions such as fillers) extracted within 1 μm square by atomic force microscope observation is 0.6 nm ± 0.2 nm, and the 10-point average height The thickness Rz satisfies the condition that Rz ≧ 6 nm and the result of contact angle measurement with pure water is 50 ° ± 5 °. This is the same condition in each GD plasma processing in all embodiments described later, that is, in the GD plasma processing in the present invention. The GD plasma processing will be described in detail later.

  The plastic film to be a base material to be subjected to the GD plasma treatment is not particularly limited in the present embodiment, and may be any material that is conventionally used as a base film for a gas barrier film. Polyethylene terephthalate (PET) film, nylon film, unstretched polypropylene (CPP) film, linear low density polyethylene (LLPDE) film, polyethylene naphthalate (PEN) film, cyclic polyolefin (COP) film, polycarbonate (PC) film , Polyethersulfone (PES) film, etc.

  The thickness of the film to be used is not particularly limited, but in the present embodiment, a thickness that does not break even when GD plasma treatment is applied is necessary, and finally a gas barrier film having high barrier properties is obtained. Of course, if a certain degree of flexibility is required, it is necessary to make the thickness not more than a level that can ensure such flexibility, as a matter of course. If this point is considered more specifically, it can be said that the thickness of the film is preferably 5 μm or more and 200 μm or less. It is because it is highly likely to break without being able to withstand the above treatment, and when it is 200 μm or more, the flexibility of the actually obtained film becomes poor, and as a result, it becomes unsuitable as a packaging material. Because. In this embodiment, it is assumed that the PET film has a thickness of 12 μm, but it is not necessarily limited thereto.

  Further, the material of the plastic film used in the present embodiment is not particularly limited, but this film is not subjected to any pretreatment such as corona treatment or easy adhesion coating on its surface, and is a so-called plain. A film of the type is desirable. That is, even if GD plasma processing is performed on a surface that has been subjected to processing such as corona processing or easy adhesion coating, it is highly likely that a harmful surface condition will appear in this embodiment. . This point will be described in detail again.

  When the plasma processing step for performing the GD plasma treatment using the argon gas on the PET film surface is completed in this manner, the first polymer resin as the first layer is laminated on the surface subjected to the GD plasma treatment. The first polymer resin laminating step is executed.

  Although it does not specifically limit as this 1st polymer resin, A silane coupling agent is the most suitable. More preferable are epoxy silane coupling agents, amino silane coupling agents, methacrylic silane coupling agents, and ureido silane coupling agents. In this embodiment, epoxy silanes are used. A coupling agent is used as the first polymer resin.

The reason for providing this first layer is as follows.
In a conventional gas barrier film, a layer made of a metal or metal oxide is directly laminated on the surface of the base film. When the obtained layer is actually used, it is necessary to perform further processing after the lamination. Since the interlayer adhesion between the material film and the metal layer is not sufficient, it peels off, and as a result, a suitable gas barrier film cannot be produced, and the gas barrier property is lowered during use.

  However, by providing this first layer, the unevenness on the laminated surface is first relaxed, that is, the laminated surface becomes substantially smooth, so that the adhesion between the laminates is improved, that is, the interlayer adhesion is secured. In addition, when a gas barrier layer described later is laminated, it is possible to make the gas barrier layer dense. Furthermore, the first layer functions like a so-called adhesive, and it is possible to prevent the base film and the gas barrier layer from being easily peeled off. Therefore, in order to achieve such an object, the first layer is provided in this embodiment mode. Furthermore, if the first layer itself has a gas barrier property, it is possible to further contribute to the improvement of the gas barrier property as a whole.

  And as a material suitable for such purpose, it can be said that a silane coupling agent or a polymer resin mainly containing a silane coupling agent is suitable. In the present embodiment, an epoxy-based resin is used as the first polymer resin. A silane coupling agent is used, and in the following embodiment, description will be continued assuming that this is used.

  The technique for laminating the first polymer resin may be a conventionally known technique, but in this embodiment, the coating method is used, and the thickness of the lamination is 0.2 μm. Incidentally, the thickness of the layer is preferably 0.03 μm or more and 2 μm or less, but if it is 0.03 μm or less, the above-mentioned effect is difficult to be obtained, and if it is 2 μm or more, the gas barrier obtained by the present embodiment. This is because the thickness of the entire film increases and the film becomes inflexible. Further, holograms are generated, cracks are generated, and the drying process takes time during actual production. This is because it is not suitable as a packaging material for reasons such as difficulty in cost control.

  When the first polymer resin laminating step of laminating the first polymer resin layer with the epoxy silane coupling agent on the GD plasma treated surface of the PET film that has been subjected to GD plasma treatment in this way is naturally performed. This is cured, but the method may be a conventionally known one. However, it is also conceivable to accelerate the curing by adding a curing catalyst.

  The curing catalyst used here may be a conventionally known one, but examples of the curing catalyst used include iron acetylacetonate, zinc acetylacetonate, aluminum acetonate, tin tetrachloride, and diisopropoxybisacetylacetonatotitanium. If it is any one or more of dihydroxybislactotitanium, a polymer resin mainly composed of an epoxy-based silane coupling agent will be effectively cured, which will be described later. Depending on the case, it can be made very suitable. In addition, what is necessary is just to select and determine an effective amount suitably about addition amount.

  Thus, when the first polymer resin by the polymer resin mainly composed of the epoxy-based silane coupling agent is laminated and cured on the PET film surface, the formed first polymer resin layer surface is The aforementioned GD plasma treatment is performed again. By applying this treatment, the same effect as described above can be obtained also on the surface of the first polymer resin layer, but since this is the same as already described, detailed description thereof is omitted here.

  When this process is completed, a gas barrier layer laminating step for laminating a gas barrier layer having a gas barrier property on the surface is then performed.

  As a gas barrier substance constituting the gas barrier layer in this embodiment, for example, any one of a group consisting of silicon, titanium, tin, zinc, aluminum, indium, and magnesium, or an oxide, nitride, or compound thereof Or a plurality of oxides, nitrides, or compounds thereof in the group. More specifically, for example, silicon may be used, silicon oxide or silicon nitride may be used, and a silicon compound may be used. Further, it may be an oxide or nitride of an alloy of tin and indium. That is, a gas barrier layer made of a material made of these group of metals may be used.

  Alternatively, the gas barrier layer may be made of silicon oxide represented by SiOx, and x may satisfy 1.0 ≦ x ≦ 2.0.

  As will be described later, the SiOx layer is basically transparent, and the high barrier obtained by the present embodiment can be obtained by using all the materials used for the high barrier film according to the present embodiment that are basically transparent. The entire protective film becomes transparent, and if such a high-barrier film is used as a packaging material, the contents can be easily seen, so the contents are not only protected from gas but also the state of the contents is also visible. It can be said that the use of SiOx is advantageous in this respect.

  When laminating SiOx, the laminating method may be a conventionally known one. In this embodiment mode, the vacuum deposition method is used. However, the method is not necessarily limited to this, and a so-called physical vapor deposition method, chemical vapor deposition method, or other known methods may be used.

  The thickness of the gas barrier layer is preferably 70 to 1000 mm. This is because if the gas barrier layer is 70 mm or less, the gas barrier layer itself has insufficient gas barrier properties, and if it is 1000 mm or more, the flexibility of the entire gas barrier film is poor. . In the present embodiment, this thickness is 120 mm.

  As described above, in the method for manufacturing a gas barrier film in the present embodiment, first, a plasma treatment process for performing a GD plasma treatment is performed, then a first polymer resin lamination process is performed on the surface, and then a gas barrier layer is formed. A lamination process is performed. Here, the GD plasma processing in this embodiment will be further described.

As described above, in the method for producing a gas barrier film according to the present embodiment, a GD plasma treatment is performed on a PET film having a thickness of 12 μm while introducing argon gas. At this time, the atmospheric pressure is 5 × 10 ⁻² torr.

  By performing GD plasma treatment on the surface of the PET film, which is the base film, for example, the surface of the PET film that was “smooth” at first will be in a state of “slowly” after GD plasma treatment. . In the present embodiment, even if this GD plasma treatment is performed, the carbonyl group of the surface functional group present on the surface of the PET film is not oxidized or nitrided.

This is further described as follows.
Even if any lamination is performed on the surface of the PET film whose surface is untreated (plain), the laminate is not fixed on the surface of the PET film having a “smooth” surface, and a phenomenon called “repel” occurs. Lamination with a desired level of adhesion cannot be performed.

  Therefore, if the conventional plasma treatment is performed on the surface of the PET film having a smooth surface, the surface will appear to have been rolled up to some extent, and the laminate will be bonded to the raised portion to improve adhesion. Conceivable. However, at this time, if the portion that has been raised is closely observed, it can be seen that the carbonyl group, which is a surface functional group, is present in an oxidized or nitrided state by performing normal plasma treatment. When any laminate is laminated on the oxidized (nitrided) carbonyl group, the oxidized (nitrided) carbonyl group and the laminate first form an oxygen (nitrogen) bond. It looks like it ’s improved. However, when the laminated body obtained in this way passes a certain period of time, the oxygen (nitrogen) bond portion is easily cut, for example, by hydrolysis. This is caused by a reaction between moisture in the atmosphere and an oxygen (nitrogen) bonding portion. The fact that this oxygen (nitrogen) bond is broken means that delamination easily occurs, that is, the phenomenon that the function imparted by the laminate is weakened or disappears due to delamination. Will occur.

  In other words, the laminated body obtained by performing the lamination after performing the conventional plasma treatment is exposed to the moisture in the atmosphere immediately after it is completed as a laminated body, and the oxygen (nitrogen) bond in the laminated part is caused by the moisture. Hydrolysis occurs in the portion, and therefore, the bonded portion is cut, resulting in delamination, resulting in the loss of the gas barrier property intended in the present invention.

  However, in the present invention, the occurrence of the above phenomenon is avoided because the GD plasma treatment is first performed and the argon gas is used as the introduced gas.

  First, by using argon gas as the introduced gas, the carbonyl group, which is the surface functional group of the PET film, is not oxidized or nitrided during the plasma treatment. In other words, the PET film surface is in a state of “slow up” in a state where the PET film surface is not oxidized or nitrided. It is not bonded by (nitrogen) bonding, but directly bonded to the surface of the PET film that has been physically raised. Therefore, when this is exposed to moisture in the atmosphere, hydrolysis does not occur at the bonding portion, and as a result, delamination does not occur. Therefore, the interlayer adhesion after lamination can be maintained as it is, that is, the function can be maintained.

  In addition, by using GD plasma treatment, the moisture and nitrogen contained in the atmosphere are prevented from inadvertently reacting with the carbonyl group, which is a surface functional group, during plasma treatment. It will be possible.

  Although the same effect can be expected by introducing an inert gas other than argon gas, detailed description thereof is omitted here.

  In addition, it may be difficult to use only argon as the introduced gas in the vacuum chamber when GD plasma processing is actually performed, and oxygen may inevitably be mixed. However, the mixing ratio of oxygen may be 10% or less with respect to the total amount of argon gas. For example, when GD plasma treatment is performed in a vacuum chamber, it is assumed that water vapor in the vacuum chamber is activated and binds to a functional group on the surface of the PET film. It is conceivable that there will be cases where they are combined.

  Accordingly, as a result of intensive studies and examinations by the inventors, it has been found that if the proportion of oxygen is 10% or less of the total amount of the inert gas, the effects of the present embodiment can be sufficiently achieved. In the embodiment, it is assumed that a part of oxygen may be mixed in the inert gas at that level.

  Further, by performing GD plasma treatment, the laminate has a denser structure, and as a result, the gas barrier property can be further improved. This point will be briefly described.

  Normally, when a gas barrier material such as SiOx is to be deposited on a PET film having an untreated surface, the portions where SiOx is deposited first are scattered on the surface of the PET film. That is, the SiOx molecules are not suddenly densely deposited on the PET film surface, but are first deposited in a state where SiOx is scattered in the form of dots on the PET film surface. When SiOx is further evaporated in this state, the SiOx molecules do not enter the gap between the SiOx already deposited on the PET film surface, but try to further deposit on the SiOx molecules on the PET film surface. And in fact it is vapor deposited like that. That is, the SiOx molecules present as dots on the surface of the PET film are used as nuclei, and SiOx is deposited one after another in such a state that the nuclei grow.

  Eventually, SiOx molecules grown from adjacent nuclei are bonded to each other, and a film of SiOx molecules on one surface, that is, a gas barrier layer of SiOx is finally formed.

  When the gas barrier layer that has reached this state is observed in a substantially side view, the distance from the PET film surface to the gas barrier layer by SiOx that has reached a dense state is approximately 3 nm to 5 nm, and further, the gas barrier layer is, for example, 10 nm on the surface. It is in a laminated state.

  That is, in the gap of 3 nm to 5 nm existing between the dense gas barrier layer and the PET film surface, there is a non-dense and sparse SiOx layer. In this case, since there are a large number of voids in which no gas barrier substance is present, the presence of this portion is a major factor for reducing the gas barrier property.

  Therefore, in order to eliminate this unnecessary void as much as possible, when plasma treatment using oxygen or nitrogen as an introduction gas is performed, countless fine irregularities appearing on the surface of the PET film are generated. On the other hand, when SiOx is vapor-deposited, first, SiOx molecules enter the recesses, and then SiOx molecules further deposit with the SiOx molecules entering the recesses as nuclei.

  At this time, when the SiOx molecules enter the recesses, the recesses are filled with the SiOx molecules, but as described above, this is the same substance as the evaporated material, rather than directly depositing SiOx on the PET film surface. This is because SiOx is further deposited on SiOx, and in this case, the state in which SiOx is later deposited around the first SiOx existing in the recess, that is, as if the recess is filled with SiOx is observed. And it is actually buried like that.

  When the deposition is further continued, the SiOx growing as described above are combined with each other, and thereafter the deposition of SiOx in a dense state is continued.

  In this case, the above-described gap portion of about 3 nm to 5 nm is in a state as if it was replaced by the uneven protrusions generated by the plasma treatment. In other words, it can be said that useless voids that impede gas barrier properties are unlikely to occur in this case, which in turn contributes to improvement of gas barrier properties.

  Further, since the layer having a smooth surface can be laminated in this way, the surface of the film obtained by the manufacturing method in the present embodiment can be made very smooth. This is because the surface of the first PET film itself was in a state of being overwhelmed by the GD plasma treatment, but by laminating the surface, the surface of the layer became smooth, and thus the surface was smooth. In addition, since the smoothness is maintained even if the lamination is repeated further, it is easy to make the surface of the finally obtained laminate very smooth by applying a plasma treatment to the substrate surface in advance. It becomes possible.

  If a smooth and dense lamination can be realized, the lamination on the surface inevitably becomes a smooth and dense lamination.

  Here, the case where silicon is vapor-deposited has been described, but the same applies to a resin such as a silane coupling agent. That is, the silane coupling agent was directly applied to the surface of the PET film that had not been subjected to any treatment, and the silane coupling agent was repelled on the surface of the PET film, and sufficient adhesion was secured. Although it is difficult to stack in a state, by performing plasma treatment in advance, the silane coupling agent enters the recess as described above, and the silane coupling agent is further repelled based on that. Instead, they are stacked one after another, and eventually, a state in which the silane coupling agent is stacked in a dense state appears.

  However, as described above, when oxygen or nitrogen is used as the introduction gas, for example, a carbonyl group present on the surface is replaced with oxygen or nitrogen on the surface of the PET film after the plasma treatment, which has been in a flared state. This causes a phenomenon that oxygen and nitrogen are combined with silicon to be deposited. For example, if this is exposed to water vapor with this bond, the water vapor will attack the bonded portion and cut it, causing phenomena such as delamination and degradation of gas barrier properties. is there. Details of this are as described above. Therefore, in the present embodiment, an inert gas, particularly argon gas is preferably used in order to prevent such unnecessary bonding. In the present embodiment, the GD plasma treatment is not merely a plasma treatment, but oxygen or nitrogen existing in the atmosphere reacts with the surface of the PET film during the plasma treatment unless it is in a substantially vacuum state. This is because the above-described useless oxygen bond or the like is generated.

In order to produce the mechanism as described above, the gas barrier film manufacturing method according to the present embodiment performs GD plasma processing using an inert gas as an introduction gas. The atmospheric pressure is set to 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr in order to obtain a vacuum state in which unnecessary oxygen bonds are not generated.

  Further, in this embodiment, the plasma processing is GD plasma processing. This point will be explained.

  The GD plasma treatment is a plasma treatment using glow discharge, and the greatest feature of the GD plasma treatment is a target used as a cathode.

  In the first place, the GD plasma treatment is a plasma treatment using low-pressure gas glow discharge, and only the submicron layer below the substrate surface changes on the surface of the substrate surface treated by this plasma treatment. It has the characteristic of hardly affecting its properties.

  For example, when a GD plasma process performed by applying a voltage in an argon atmosphere is performed on the substrate surface, argon plasma is first generated, and then foreign substances attached to the substrate surface are removed by the argon ions. That is, the substrate surface is cleaned.

  Next, ions in the plasma collide with the target and desorb atoms on the target surface. As a result, various kinds of scientific species such as electrons, ions, radicals, or excited electrons are generated by the target. Has a long lifetime and accumulates at high concentrations in the gas phase. And when this radical arrives at the base material surface and adheres there, it will be in the state that the base material surface was plasma-treated.

  In this state, as described above, only the submicron layer portion below the surface of the base material reacts, so that the GD plasma processing hardly affects the properties of the base material itself.

  As a target used for the GD plasma treatment in the present embodiment, any metal belonging to Group 4 to Group 12 in the periodic table in the periodic table, or an alloy of metals in the range is used, so that glow By subjecting the substrate film surface to plasma treatment using electric discharge, the metal or alloy adheres to the substrate surface, and a thin film layer is formed.

  Taking iron contained in this range of metal as an example, it is known that iron has a strong redox power, but it is therefore highly reactive with silica. And by adhering to the surface of the substrate, the adhesion with the substrate is remarkably preferable when the layer having a gas barrier property, which is further laminated on the surface, specifically, the layer made of silica is laminated. It can be done.

This point will be further described.
First, as described above, iron atoms are attached to the surface of the substrate by executing the GD plasma treatment using iron as a target. In the first place, as described above, since there is no foreign matter or the like on the surface of the base material, iron atoms adhere to the surface of the base material. Next, silica atoms sequentially adhere to the substrate surface and the iron atoms that are in close contact with the surface, and this forms a layer of silica. At this time, a strong bond is formed between iron and silica. And the silica continues to be laminated. That the bond formed by iron and silica is strong means that the adhesion between iron and silica is good. And iron and a base material have adhered. Therefore, it can be said that the adhesion between the substrate and the vapor deposition layer (silica layer) is very strong, and the adhesion is actually good. In this process, due to the strong bond between the iron and silica formed earlier, the silica layer continues to be laminated for a while in the form of more agglomerated silica in the further lamination of the silica. A vapor-deposited film (silica layer). The fact that the silica layer becomes dense means that the barrier property is improved. Then, as silica is continuously deposited on the surface of iron, eventually, the iron spreads in the silica layer, and eventually the iron is scattered in the silica layer. Is done. That is, finally, a layer in which iron atoms are scattered in the silica layer is laminated on the substrate surface as a silica layer. That is, it is not simply a three-layer laminate of base material / iron layer / silica layer, but a layer of “a mixed state of iron and silica” is laminated on the surface of the base material. As a result, the gas barrier layer has improved barrier properties as compared with the case of a layer made of silica alone. Moreover, the interlayer adhesion between the substrate and the vapor deposition layer is further improved. Furthermore, it becomes a layer strong against cohesive stress, and as a result, the wettability is improved.

  In addition, similar effects can be expected by using a substance within the above range, and further, the stress inherent to the base material can be enhanced, and it can be tough against cohesive failure. This also has the effect of.

  In this embodiment, iron (SUS304) is used as a target in order to obtain the above-described effect. However, even if it is a substance other than that, it depends on a metal belonging to the above-mentioned periodic table range, or between metals in the range. An alloy may be used as a target.

  As described above, the method for producing a gas barrier film according to the present embodiment can provide a gas barrier film having a configuration of base film / metal thin film layer / first polymer resin layer / gas barrier layer.

  For example, a polymer resin film such as a PET film is used as a base material, and the surface of the SUS target is brought to a certain extent by GD plasma treatment using an inert gas as an introduction gas. A metal thin film layer is formed by sputtering, and then the surface is laminated with a silane coupling agent as a first polymer resin, and a gas barrier layer made of a gas barrier material such as silicon is laminated on the surface, thereby providing a dense gas barrier layer. In addition, by laminating the silane coupling agent so as to be positioned between the PET film and the gas barrier layer, the interlayer adhesion is further strengthened, and each layer is densely laminated. As a result, the gas barrier properties have been further improved, especially for water vapor etc. Sex very good as the gas barrier film can be obtained.

(Embodiment 2)
Next, in the method for manufacturing a gas barrier film according to the first embodiment described above, a second polymer resin laminating step of laminating a second polymer resin on the surface of the gas barrier layer after completing all the steps is performed. A method for manufacturing a gas barrier film, which is executed, will be described as a second embodiment.

  Regarding this second polymer resin, for example, if it is a substance having a gas barrier property, it is possible to further supplement the gas barrier property obtained by the gas barrier layer by laminating it on the surface of the gas barrier layer, that is, a higher barrier. It can be considered that it can be obtained, and is expected to play a role as a top coat layer for protecting the gas barrier layer itself.

  Further, the second polymer resin is more preferably a polymer resin having a gas barrier property like the first polymer resin described above, and for example, an epoxy silane coupling agent is preferable. . If the same epoxy-based silane coupling agent as the first polymer resin is used as the second polymer resin, the same substance can be used in the manufacturing process to facilitate the work. In order to stabilize the physical properties of the obtained high barrier film, it can be said that it is preferable that the number of constituent materials is as small as possible. Therefore, in this embodiment, the epoxy silane that is the same material as the first layer is used. A coupling agent is used. And by laminating this second polymer resin layer, the gas barrier property can be further improved.

  The thickness of the second polymer resin layer is preferably 0.03 μm or more and 2 μm or less, but if this is 0.03 μm or less, the purpose of improving the gas barrier property cannot be achieved. This is because the flexibility of the film becomes poor. In the present embodiment, this thickness is 0.3 μm.

  The second polymer resin layer is also described in the first embodiment in order to accelerate the curing of the silane coupling agent, as described in the section relating to the first polymer resin layer. It is conceivable to add a curing catalyst similar to the above. The details are the same as described above, and the description thereof is omitted here.

  Although it does not specifically limit as this 1st polymer resin, A silane coupling agent is the most suitable. More preferable are epoxy silane coupling agents, amino silane coupling agents, methacrylic silane coupling agents, and ureido silane coupling agents. In this embodiment, epoxy silanes are used. A coupling agent is used as the first polymer resin.

  According to the method for producing a gas barrier film according to the present embodiment thus performed, a gas barrier film having a configuration of base film / first polymer resin layer / gas barrier layer / second polymer resin is obtained. I can do it.

  In addition, when the gas barrier layer is laminated by directly laminating a substance having a gas barrier property on the surface of the base film subjected to GD plasma treatment using an inert gas as an introduction gas, the above plasma treatment Since there is no problem in terms of adhesion in the present embodiment, detailed description thereof is omitted here.

(Embodiment 3)
Next, a method for manufacturing a gas barrier film having a configuration different from that described so far will be described as a third embodiment.

The third embodiment is executed according to the following procedure.
First, the glow discharge plasma treatment is performed on the surface of the plastic film as the base material in advance under an inert gas introduction in an environment where the atmospheric pressure is 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr. Any metal belonging to Group 4 to Group 12 in the periodic table in the periodic table as a result of performing the glow discharge plasma treatment on the surface of the base material subjected to the plasma treatment step, or a metal in the range After first performing the plasma treatment process that the alloy by each other adheres,
(A) a gas barrier layer stacking step in which layers having gas barrier properties are stacked;
(B) a first polymer resin lamination step in which the first polymer resin is laminated;
(C) a second polymer resin lamination step in which the second polymer resin is laminated;
Each of these steps is performed according to the following conditions.

(Condition 1) (A) must be executed once.
(Condition 2) The same process is not repeated.
(Condition 3) Either (B) or (C) may not be executed.
(Condition 4) Every time the process of any one of (A) to (C) is executed once, it is assumed that the process is executed once, and the process is executed twice or more in total.

Further explanation will be continued.
In short, the gas barrier film manufacturing method according to the present embodiment includes each layer for laminating the gas barrier layer, the first polymer resin layer, and the second polymer resin layer on the surface of the base film subjected to GD plasma treatment. The process is executed. A plurality of these layers may be regularly stacked or randomly stacked.

For example, base film / first polymer resin layer / gas barrier layer / first polymer resin layer / gas barrier layer / second polymer resin layer ...
The form is also conceivable.

  And since it aims at obtaining a gas barrier film in this invention, naturally (A) must be performed once, that is, when the structure of the gas barrier film finally obtained is observed, at least one layer Means that a gas barrier film cannot be formed unless a gas barrier layer is present, and this is self-evident.

  Then, the gas barrier film, the first polymer resin layer, and the second polymer resin layer may be laminated in the gas barrier film manufacturing method according to the present embodiment.

For example, if you want to ensure gas barrier properties at the expense of some flexibility,
It can be considered that the unit of “first polymer resin layer / gas barrier layer / second polymer resin layer” is repeatedly laminated on the gas barrier layer side of “base film / first polymer resin layer / gas barrier layer”. In this case, it is obvious that the first polymer resin layer and the second polymer resin layer are different resins.

  If it is not desired to have regularity in the lamination, a first polymer resin layer, a second polymer resin layer, and a separate gas barrier layer are provided on the surface of “base film / first polymer resin / gas barrier layer”. Including these may be stacked randomly.

However, in consideration of the balance between the properties of flexibility and gas barrier properties, it is not realistic to laminate infinitely. In the present embodiment, the base film / first polymer resin layer is finally used. The structure of / gas barrier layer / first polymer resin layer / gas barrier layer is obtained.

  Moreover, it can be said that it is practical that the thickness of the whole gas barrier film obtained by this Embodiment is designed in 12 micrometers-20 micrometers, More preferably, within 12 micrometers-15 micrometers.

  In addition, since the specific lamination | stacking method of each layer is the same as that of the case in each embodiment demonstrated so far, the detailed description is abbreviate | omitted.

  As described above, a gas barrier film comprising a plurality of layers including at least one gas barrier layer can be obtained by the method for producing a gas barrier film according to this embodiment as described above.

  In addition, when the gas barrier layer is laminated by directly laminating a substance having a gas barrier property on the surface of the base film subjected to GD plasma treatment using an inert gas as an introduction gas, the above plasma treatment Since there is no problem in terms of adhesion in the present embodiment, detailed description thereof is omitted here.

  Further, various embodiments according to the invention of the present application have been described above. Among them, in order to improve the adhesion when something is further laminated on the surface of the first polymer resin layer. By performing the same plasma treatment process as described above on the surface of the first polymer resin layer after performing the first polymer resin layer laminating process, the adhesion of the first polymer resin layer is improved. It is conceivable to improve the interlayer adhesion, and this plasma treatment process is the same as that already described, and therefore, further detailed description is omitted here.

  Further, various embodiments according to the present invention have been described above. Among them, the third polymer resin is used to further improve the gas barrier property on the surface of the gas barrier film obtained by each manufacturing method. It is also conceivable to execute a third polymer resin laminating step for laminating. A suitable third polymer resin in this case may be the same as the first polymer resin or the second polymer resin already described, and the detailed description thereof is omitted here.

  In addition, various embodiments according to the present invention have been described above. Among them, the gas barrier property is improved by laminating a plastic film on the outermost surface of the gas barrier film obtained by each manufacturing method. Is also possible. In this case, the plastic film is not particularly limited, but it can be said that, for example, a thickness of 25 μm to 70 μm is suitable, and a PP film or a PE film is preferably used as a specific material. However, further detailed explanation is omitted here.

  Further, since the gas barrier film obtained by the various embodiments according to the present invention described above has a so-called high barrier property, paying attention to the high barrier property, for example, use it as a back sheet of a solar cell. Can be considered. This is provided in order to protect that the main structure of the solar cell is vulnerable to gas such as water vapor, and the higher the performance of the gas barrier, the more suitable it can be used. Since the specific utilization method is the same as that of the back sheet of a conventionally known solar cell, further detailed description is omitted here.

  The method for producing a gas barrier film according to the present invention and the resulting gas barrier film will be further described below with examples, but the present invention is not limited to these examples. Moreover, the gas barrier film used for each Example was obtained by the manufacturing method already demonstrated in 1st Embodiment-5th Embodiment, and what was used for the comparative example was also manufactured according to it. Note that it was obtained by the method.

(Description of each member and device)
Polymer resin film as substrate: PET film (“NS” thickness 12 μm, manufactured by Teijin Ltd.)
First polymer resin: Shin-Etsu Chemical Co., Ltd.
Product Name: KBM403
Lamination thickness: 0.2 μm
Second polymer resin: Shin-Etsu Chemical Co., Ltd.
Product name: KBE403
Lamination thickness: 0.2 μm
Gas barrier layer: SiOx (1.0 ≦ x ≦ 2.0) Thickness 0.015 μm

(Preparation of the first polymer resin layer)
KBM403 50 parts by weight Water 50 parts by weight Hydrochloric acid (35%) 0.07 parts by weight After preparing a mixture of these and hydrolyzing,
Add IPA / n-butanol = 575/575 (parts by weight) and dilute.
Further, 2 parts by weight of a curing catalyst (aluminum acetylacetonate) is added to complete the preparation.

(Preparation of second polymer resin layer)
KBE403 50 parts by weight Water 50 parts by weight Hydrochloric acid (35%) 0.07 parts by weight After preparing a mixture of these and hydrolyzing them,
Add IPA / n-butanol = 575/575 (parts by weight) and dilute.
Further, 2 parts by weight of a curing catalyst (aluminum acetylacetonate) is added to complete the preparation.

(Explanation regarding GD plasma treatment)
Gas introduced during GD plasma treatment: Argon Degree of vacuum during GD plasma treatment: 5 × 10 ⁻² torr

(Explanation regarding measurement of gas barrier properties)
Gas barrier performance measurement method Moisture and heat resistance test: 85 ° C. hot water test was allowed to stand for 2 weeks and then at 85 ° C. and 85% humidity for 1000 hours.
The obtained gas barrier film was subjected to a permeation humidity test according to JIS Z 0208. (Cup method)
Moreover, the measurement regarding moisture permeability was performed according to JIS K7129. (Mocon method moisture permeability)
Moreover, the measurement regarding oxygen permeability was performed according to JISK7126. (Mocon oxygen)

(Configuration of each example and comparative example)
Example 1-1 Base material / first polymer resin layer / gas barrier layer Example 1-2 Base material / first polymer resin layer / gas barrier layer Example 2-1 Base material / first polymer resin layer / gas barrier Layer / second polymer resin layer Example 2-2 base material / first polymer resin layer / gas barrier layer / second polymer resin layer Example 3 base material / first polymer resin layer / gas barrier layer / first Polymer resin layer / gas barrier layer

As mentioned above, in each Example, after performing GD plasma processing by performing a GD plasma processing process with respect to the surface of a base material, the laminated body was laminated | stacked.
In Example 1-2 and Example 2-2, the surface of the first polymer resin layer was again subjected to GD plasma treatment, and further laminated.

Comparative Example 1 Base Material / First Polymer Resin Layer / Gas Barrier Layer Comparative Example 2 Base Material / First Polymer Resin Layer / Gas Barrier Layer / Second Polymer Resin Layer Comparative Example 3 Base Material / First Polymer Resin Layer / Gas barrier layer / first polymer resin layer / gas barrier layer

  In Comparative Examples 1, 2, and 3, the substrate surface was subjected to plasma treatment using oxygen as an introduction gas.

The following items were examined for each example and each comparative example.
・ Barrier property 1
A sample obtained by dry-laminating a laminated film of each example and comparative example with CPP having a thickness of 60 μm (manufactured by Toyobo Co., Ltd .: trade name “P1446”) by a conventionally known method was used as a sample.
The obtained sample was immersed in hot water at 125 ° C. for 30 minutes.
The barrier properties before and after that were measured. It is described in the table as “initial” before immersion, and “after letting” after immersion. Note that (OTR / WVTR) is oxygen permeability / water vapor permeability.

-Barrier property 2 and adhesion | attachment What laminated | stacked the plastic film on both surfaces of the laminated film of each Example and the comparative example as follows was made into the sample.
Weather-resistant PET having a thickness of 50 μm (manufactured by Toyobo Co., Ltd .: trade name “Shine Beam K1653”) / Laminated film of Example or Comparative Example / White PET having a thickness of 188 μm (trade name “TR810” manufactured by Toyobo Co., Ltd.)
The obtained sample was exposed to the following environment.
1) It was immersed in 85 degreeC warm water for 2 weeks.
2) It was left for 1000 hours in a temperature of 85 degrees and humidity of 85%.
After satisfying each condition, the gas barrier properties measured by the above-mentioned “cup method”, “moisture permeability through the mocon method” and “mocon method oxygen” are described in the table.
In addition, regarding the adhesion, the adhesion at the boundary surface of the laminated film of the weather resistant PET / Example or Comparative Example having a thickness of 50 μm was measured in the configuration of the above sample.
The measuring method was T-type peeling with a pulling speed of 300 mm / min.
Further, as in the previous test, the degree of adhesion of the obtained sample was measured in the same manner before and after immersing the obtained sample in 125 ° C. hot water for 30 minutes. The result is described in the column labeled “adhesion” in the table.

  As can be seen from the above results, it can be seen that the gas barrier film according to the present invention has high barrier properties.

  More specifically, it can be understood that the gas barrier film according to the present invention is much more preferable in terms of interlayer adhesion by performing the lamination after the plasma treatment of the base film. Incidentally, it can be seen that the interlaminar adhesion is further improved when the first polymer resin layer is subjected to plasma treatment.

  Moreover, in this invention, it turns out that it is not a mere plasma process but the GD plasma process which used argon gas as introduction gas, and it turns out that interlayer adhesiveness is favorable compared with the case where the plasma process of a comparative example is performed. As already explained, this is a proof that when oxygen or nitrogen is used for plasma treatment, oxygen bonds that have been inadvertently broken are broken by water vapor, resulting in delamination. Think of things.

  Incidentally, in this embodiment, an example in which the first polymer resin is directly laminated without performing plasma treatment on the surface of the base material is not shown, but this causes a phenomenon called “repellency” even if such lamination is attempted. This is because it was impossible to laminate the layers, that is, as a result, a laminate could not be obtained.

In the invention according to claim 3 of the present invention, the pressure of 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr is introduced in advance under the introduction of an inert gas to the surface of the plastic film serving as the base material. By performing the glow discharge plasma treatment on the surface of the base material that has been subjected to the glow discharge plasma treatment step by performing the glow discharge plasma treatment, it belongs to the fourth period group 4 to group 12 in the periodic table. After first performing the plasma treatment process of attaching any metal or alloy of metals within the range,
(A) a gas barrier layer stacking step in which layers having gas barrier properties are stacked;
(B) a first polymer resin lamination step in which the first polymer resin is laminated;
(C) a second polymer resin lamination step in which the second polymer resin is laminated;
Each process of
(Condition 1) Each of (A), (B), and (C) must be executed once.
(Condition 2) The same process is not repeated.
(Condition 3) Every time one of the steps (A) to (C) is executed, it is assumed that the step is executed once, and the step is executed three times or more in total.
It is characterized by being executed in accordance with the condition.

(Condition 1) Each of (A), (B), and (C) must be executed once.
(Condition 2) The same process is not repeated.
(Condition 3) Every time one of the steps (A) to (C) is executed, it is assumed that the step is executed once, and the step is executed three times or more in total.

The invention according to claim 3 of the present invention is the gas barrier film manufacturing method according to claim 1 or 2, wherein a plastic film is laminated on the outermost surface of the outermost surface of the laminate obtained by the manufacturing method. And performing a film laminating process in which the outermost layer is laminated.

Invention of Claim 4 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 3, Comprising: The said inert gas is argon gas or argon / oxygen gas. It is characterized by being.

Invention of Claim 5 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 4, Comprising: The substance which comprises the said gas barrier layer is silicon, titanium, tin Any one of the group consisting of zinc, aluminum, indium, magnesium, or an oxide, nitride, or compound thereof, or a plurality of the oxides, nitrides, or compounds in the group The gas barrier layer is laminated by a vacuum deposition method.

Invention of Claim 6 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 5, Comprising: The said gas barrier layer is silicon oxide shown by SiOx, The x is 1.0 ≦ x ≦ 2.0.

Invention of Claim 7 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 6, Comprising: Said 1st polymer resin or said 2nd polymer resin Either one or both of them is based on a silane coupling agent or a polymer resin mainly composed of a silane coupling agent.

Invention of Claim 8 of this invention is a manufacturing method of the gas barrier film of any one of Claim 1 thru | or 7, Comprising: Said 1st polymer resin layer or said 2nd polymer resin A curing catalyst is added to one or both of the layers.

Invention of Claim 9 of this invention is a manufacturing method of the gas barrier film of Claim 8, Comprising: The said curing catalyst is iron acetylacetonate, zinc acetylacetonate, aluminum acetonate, tin tetrachloride, It is one or more of diisopropoxybisacetylacetonato titanium and dihydroxybis lactato titanium.

The invention related to the gas barrier film according to claim 10 of the present invention is characterized by being manufactured by the method for manufacturing a gas barrier film according to any one of claims 1 to 9.

The invention relating to the solar battery backsheet according to claim 11 of the present invention is characterized by using the gas barrier film according to claim 10.

Claims (12)

at least,
A plasma treatment step in which a plasma treatment is performed in advance in an environment of an atmospheric pressure of 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr under introduction of an inert gas on the surface of a plastic film serving as a base material;
Performing a first polymer resin laminating step of laminating a first polymer resin on the surface of the substrate subjected to the plasma treatment;
After the first polymer resin layer lamination step, the plasma treatment step is performed again on the surface of the first polymer resin layer, and then a gas barrier layer having a gas barrier property is laminated on the surface after the plasma treatment. Lamination process;
With
The plasma treatment is a glow discharge plasma treatment;
Any metal belonging to Group 4 to Group 12 in the periodic table in the periodic table as a result of performing the glow discharge plasma treatment on the surface of the base material subjected to the glow discharge plasma processing step, or the range The alloy of the metal inside is attached,
A method for producing a gas barrier film, characterized in that
It is a manufacturing method of the gas barrier film according to claim 1,
After the gas barrier layer lamination step,
Performing a second polymer resin lamination step in which a second polymer resin is laminated on the surface of the gas barrier layer;
A method for producing a gas barrier film, characterized in that For the surface of the plastic film as the base material,
Under the introduction of an inert gas, the glow discharge plasma treatment process is performed in advance in an environment where the atmospheric pressure is 1 × 10 ⁻¹ to 1 × 10 ⁻³ torr on the surface of the base material subjected to the glow discharge plasma treatment step. A plasma treatment step of depositing any metal belonging to the fourth group 4 to group 12 in the periodic table or an alloy of metals within the range by performing the glow discharge plasma treatment. After the first run
(A) a gas barrier layer stacking step in which layers having gas barrier properties are stacked;
(B) a first polymer resin lamination step in which the first polymer resin is laminated;
(C) a second polymer resin lamination step in which the second polymer resin is laminated;
Each of the steps are executed according to the following conditions:
A method for producing a gas barrier film, characterized in that
(Condition 1) (A) must be executed once.
(Condition 2) The same process is not repeated.
(Condition 3) Either (B) or (C) may not be executed.
(Condition 4) Every time the process of any one of (A) to (C) is executed once, it is assumed that the process is executed once, and the process is executed twice or more in total.
In the manufacturing method of the gas barrier film of any one of Claim 1 thru | or 3,
Performing a film laminating step in which a plastic film is laminated on the outermost surface of the outermost surface of the laminate obtained by the manufacturing method and the outermost layer is laminated;
A method for producing a gas barrier film, characterized in that A method for producing a gas barrier film according to any one of claims 1 to 4,
The inert gas is argon gas or argon / oxygen gas;
A method for producing a gas barrier film, characterized in that A method for producing a gas barrier film according to any one of claims 1 to 5,
The substance constituting the gas barrier layer is any one of the group consisting of silicon, titanium, tin, zinc, aluminum, indium, and magnesium, or any of oxides, nitrides, or compounds thereof, or the group. A plurality of oxides, nitrides, or compounds thereof,
The gas barrier layer is laminated by a vacuum deposition method;
A method for producing a gas barrier film, characterized in that A method for producing a gas barrier film according to any one of claims 1 to 6,
The gas barrier layer is silicon oxide represented by SiOx, and x is 1.0 ≦ x ≦ 2.0,
A method for producing a gas barrier film, characterized in that A method for producing a gas barrier film according to any one of claims 1 to 7,
Either one or both of the first polymer resin and the second polymer resin is a silane coupling agent, or a polymer resin mainly composed of a silane coupling agent,
A method for producing a gas barrier film, characterized in that A method for producing a gas barrier film according to any one of claims 1 to 8,
A curing catalyst is added to either or both of the first polymer resin layer and the second polymer resin layer;
A method for producing a gas barrier film, characterized in that It is a manufacturing method of the gas barrier film according to claim 9,
The curing catalyst is one or more of iron acetylacetonate, zinc acetylacetonate, aluminum acetonate, tin tetrachloride, diisopropoxybisacetylacetonatotitanium, dihydroxybislactotitanium,
A method for producing a gas barrier film, characterized in that It is manufactured by the method for manufacturing a gas barrier film according to any one of claims 1 to 10.
A gas barrier film characterized by Using the gas barrier film according to claim 11;
A solar battery back sheet characterized by