JP2011217547A - Vehicle-mounted electronic device - Google Patents

Vehicle-mounted electronic device Download PDF

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Publication number
JP2011217547A
JP2011217547A JP2010084775A JP2010084775A JP2011217547A JP 2011217547 A JP2011217547 A JP 2011217547A JP 2010084775 A JP2010084775 A JP 2010084775A JP 2010084775 A JP2010084775 A JP 2010084775A JP 2011217547 A JP2011217547 A JP 2011217547A
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Prior art keywords
sealing material
electronic device
circuit board
metal base
recess
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JP2010084775A
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JP2011217547A5 (en
JP5350311B2 (en
Inventor
Taku Koyama
拓 小山
Hiroyuki Abe
博幸 阿部
Toshiaki Ishii
利昭 石井
Koji Sato
弘二 佐藤
Enjo Tsuyuno
円丈 露野
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Priority to JP2010084775A priority Critical patent/JP5350311B2/en
Priority to PCT/JP2011/057785 priority patent/WO2011125645A1/en
Publication of JP2011217547A publication Critical patent/JP2011217547A/en
Publication of JP2011217547A5 publication Critical patent/JP2011217547A5/ja
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/088—Dustproof, splashproof, drip-proof, waterproof, or flameproof casings or inlets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Abstract

PROBLEM TO BE SOLVED: To provide a vehicle-mounted electronic device with a sealing structure having a high resistance to salt corrosion and a superior durable waterproof property.SOLUTION: The vehicle-mounted electronic device includes a circuit board mounted with electronic components, a connector for electrically connecting the circuit board externally, a metal base on which the circuit board is mounted and to which the connector is bonded via a sealing material, and a metal cover which is bonded to the metal base and the connector via the sealing material and which seals the circuit board and part of the connector. Multiple recesses are formed inside of a chassis in the sealant bonding surface of the metal base or the metal cover, and the recesses are filled with the sealing material.

Description

本発明は、シール材を兼ねる接着剤で接着される第一の構成部材（例えば金属ベース）と第二の構成部材（例えば、コネクタや金属カバー）を有する車載用電子機器に関する。   The present invention relates to an in-vehicle electronic device having a first constituent member (for example, a metal base) and a second constituent member (for example, a connector or a metal cover) that are bonded with an adhesive that also serves as a sealing material.

従来、自動車用エンジンコントロールユニット等の車載用電子機器として、電子部品が実装された回路基板と、回路基板と外部とを電気的に接続するためのコネクタと、回路基板及びコネクタを保持するベースと、回路基板を覆うべくコネクタ及びベース上に被せられる密封用のカバーとを備えたものが知られている。   Conventionally, as an in-vehicle electronic device such as an engine control unit for automobiles, a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, a base for holding the circuit board and the connector, A device having a connector and a sealing cover that covers the base to cover the circuit board is known.

このような車載用電子機器では、通常、ベースとコネクタ，コネクタとカバー，カバーとベースは、それらの間をシール材で水密的に封止して接着固定し、さらにカバーとベースがねじ止めにより固定される。   In such an in-vehicle electronic device, the base and the connector, the connector and the cover, and the cover and the base are usually sealed and sealed with a sealing material between them, and the cover and the base are fixed with screws. Fixed.

例えば、特許文献１には、互いに対向するシール面間にシール材を介在させてシール面間をシールするシール構造において、少なくとも一方のシール面の縁部を、シール面間の間隔が広くなるように切り欠いて空隙部を形成し、シール面間及び空隙部にシール材を介在させたシール構造が開示されている。このようなシール構造で初期シール性および振動衝撃に強いシール構造を達成する試みが行われている。   For example, in Patent Document 1, in a seal structure in which a sealing material is interposed between seal surfaces facing each other to seal between the seal surfaces, at least one edge of the seal surface has a large interval between the seal surfaces. A seal structure is disclosed in which a gap is formed by cutting a gap between the seal surfaces and between the seal surfaces. Attempts have been made to achieve such a seal structure that is resistant to initial sealability and vibration shock.

特開２００３−２５８４５１号公報JP 2003-258451 A 特開２００８−１４４９１１号公報JP 2008-144911 A

エンジンルーム等の車室外で使用される車載用電子機器は、初期の防水性に加えて種々の環境下での使用を考慮した耐久防水性が必要とされる。車載用電子機器の筺体は、種々の環境下での使用を考慮して、剛性の高い金属にて構成されることが多い。ここで、降雪地帯では、道路の融雪・凍結防止目的で、塩化カルシウムが散布されている。このため、路上の塩化カルシウムが融雪により水溶液となり、その上を車両が通行する際にしぶきとなり、霧状になった水溶液が車載用電子機器の筐体のシール部分に付着して、筐体とシール材の接着界面を塩食し、金属筐体の腐食部がシール材剥離の原因となる。このような環境下においても十分な信頼性を確保するために、より耐塩食性が高く、耐久防水性に優れたシール構造が必要となる。   In-vehicle electronic devices used outside a vehicle compartment such as an engine room are required to be durable and waterproof in consideration of use in various environments in addition to initial waterproofness. The housing of an in-vehicle electronic device is often composed of a highly rigid metal in consideration of use in various environments. Here, in the snowfall area, calcium chloride is sprayed for melting and freezing prevention of roads. For this reason, calcium chloride on the road turns into an aqueous solution due to melting snow, and it becomes splashed when the vehicle passes over it, and the mist-like aqueous solution adheres to the seal portion of the housing of the in-vehicle electronic device, The adhesive interface of the sealing material is corroded, and the corroded portion of the metal casing causes the peeling of the sealing material. In order to ensure sufficient reliability even in such an environment, a seal structure with higher salt corrosion resistance and excellent durability and waterproofness is required.

特許文献１は初期シール性や耐衝撃性に優れたシール構造として有効であるが、耐塩食性という観点では十分な検討はなされていない。   Patent Document 1 is effective as a seal structure excellent in initial sealability and impact resistance, but has not been sufficiently studied from the viewpoint of salt corrosion resistance.

本発明は、耐塩食性が高く、耐久防水性に優れたシール構造を備える車載用電子機器を提供することを目的とする。   An object of the present invention is to provide an in-vehicle electronic device having a seal structure having high salt corrosion resistance and excellent durability and waterproofness.

本発明は、電子部品が実装された回路基板と、該回路基板と外部を電気的に接続するためのコネクタと、前記回路基板が搭載されるとともに前記コネクタがシール材を介して接着される金属ベースと、前記金属ベース及びコネクタにシール材を介して接着され、前記回路基板とコネクタの一部を密封する金属カバーとを備える車載用電機機器であって、前記金属ベースまたは前記金属カバーのシール剤接着面の筐体内側に複数の凹部が形成されており、前記凹部内にシール材が充填されていることを特徴とする。   The present invention provides a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, and a metal on which the circuit board is mounted and the connector is bonded via a sealing material A vehicle-mounted electrical apparatus comprising: a base; and a metal cover that is bonded to the metal base and the connector via a sealing material and seals a part of the circuit board and the connector, wherein the metal base or the metal cover is sealed A plurality of recesses are formed inside the housing of the adhesive bonding surface, and the recesses are filled with a sealing material.

また、前記金属ベースまたは前記金属カバーのシール剤接着面の筐体内側に複数の凹部が形成され、シール材を介して前記凹部と対向する部分の前記金属ベースまたは前記金属カバーに突起が形成され、前記凹部と突起の隙間にシール材が充填されていることを特徴とする。ここで、一方のくぼみの幅が他方の突起の幅より大きく、前記くぼみと突起が対向するようにシール材により接着されていることが望ましい。また、凹部の深さあるいは突起の高さが、シール材の厚さよりも大きいことが望ましい。   In addition, a plurality of recesses are formed inside the casing of the sealant bonding surface of the metal base or the metal cover, and protrusions are formed on the metal base or the metal cover at a portion facing the recess via a sealing material. The sealing material is filled in the gap between the recess and the protrusion. Here, it is desirable that the width of one recess is larger than the width of the other projection, and the recess and the projection are bonded by a sealing material so as to face each other. Further, it is desirable that the depth of the recess or the height of the protrusion is larger than the thickness of the sealing material.

また、シール材接着面の筺体外側が平坦化されていることが望ましい。ここで平坦化とは機械的研磨、あるいはポリアミドイミドで構成された乾燥後に平坦な皮膜を形成する液体を塗布することにより行うことができる。   Moreover, it is desirable that the outer side of the casing of the sealing material bonding surface is flattened. Here, planarization can be performed by mechanical polishing or by applying a liquid that forms a flat film after drying, which is composed of polyamideimide.

なお、本発明において、シール剤接着面の筐体内側とは金属カバーにより密封された空間側を意味し、シール剤接着面の筐体外側はその反対側を意味する。   In the present invention, the inside of the casing with the sealing agent bonding surface means the space side sealed by the metal cover, and the outside of the casing with the sealing agent bonding surface means the opposite side.

本発明により、耐塩食性が高く、耐久防水性に優れたシール構造を備えた車載用電子機器を提供することできる。   INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an in-vehicle electronic device provided with a seal structure having high salt corrosion resistance and excellent durability and waterproofness.

車載用電子機器の全体斜視図と展開図である。It is the whole perspective view and expansion | deployment figure of a vehicle-mounted electronic device. 車載用電子機器の部分切欠概略断面図である。It is a partial notch schematic sectional drawing of the vehicle-mounted electronic device. 車載用電子機器の平面図である。It is a top view of a vehicle-mounted electronic device. 車載用電子機器のシール構造を説明する断面図である。It is sectional drawing explaining the seal structure of a vehicle-mounted electronic device. 車載用電子機器のシール構造を説明する断面図である。It is sectional drawing explaining the seal structure of a vehicle-mounted electronic device. 車載用電子機器のシール構造を説明する断面図である。It is sectional drawing explaining the seal structure of a vehicle-mounted electronic device. 比較例のシール構造を説明する断面図である。It is sectional drawing explaining the seal structure of a comparative example.

以下、本発明の実施の形態について図面を参照しながら説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１（ａ）は本発明に係る車載用電子機器の一実施形態を示す外観の斜視図、図１（ｂ）は車載用電子機器の内部構造を示す展開図であり、図２は部分切欠概略断面図、図３はその平面図である。   FIG. 1A is an external perspective view showing an embodiment of an in-vehicle electronic device according to the present invention, FIG. 1B is a development view showing an internal structure of the in-vehicle electronic device, and FIG. FIG. 3 is a schematic sectional view and FIG.

本実施形態の車載用電子機器１０は、自動車用エンジンコントロールユニットとして用いられるものであり、電子部品２１が実装された回路基板１４に、回路基板１４と外部のセンサ類や制御機構とを電気的に接続するためのコネクタ１３が取付固定され、回路基板１４が搭載される放熱用金属ベース１５にコネクタ１３がシール材を兼ねる接着材２０を介して接着され、金属ベース１５に金属カバー１１がシール材２０を介して接着され、コネクタ１３と金属カバー１１がシール材２０を介して接着されている。   The in-vehicle electronic device 10 of the present embodiment is used as an automobile engine control unit, and an electric circuit board 14 and external sensors and control mechanisms are electrically connected to a circuit board 14 on which an electronic component 21 is mounted. The connector 13 is connected and fixed to the metal base 15, the connector 13 is bonded to the heat radiating metal base 15 on which the circuit board 14 is mounted via the adhesive 20 that also serves as a sealing material, and the metal cover 11 is sealed to the metal base 15. The connector 13 and the metal cover 11 are bonded via the sealing material 20.

回路基板１４は、長方形の樹脂製のプリント配線基板である。この回路基板１４の表面には、共晶はんだペーストがスクリーン印刷機で印刷され、所要の電子部品２１が自動搭載機で搭載された後、はんだリフロー炉ではんだ接合が行われたものである。ここで、電子部品２１は演算用ＩＣ，チップ抵抗体，チップコンデンサ，アルミ電解コンデンサなどである。   The circuit board 14 is a rectangular resin printed wiring board. A eutectic solder paste is printed on the surface of the circuit board 14 by a screen printing machine, and a required electronic component 21 is mounted by an automatic mounting machine, and then soldered by a solder reflow furnace. Here, the electronic component 21 is an arithmetic IC, a chip resistor, a chip capacitor, an aluminum electrolytic capacitor, or the like.

コネクタ１３は、熱可塑性樹脂で成形された概略直方体状のハウジング１３Ａとハウジング１３Ａ内に収容されている所要本数の金属端子１３Ｂとからなり、ハウジング１３Ａは、外部ハーネスのプラグが差し込まれる、角丸付き矩形筒状の大小二つのソケット部１３ｃ，１３ｄ，金属端子１３Ｂを保持する厚板状の端子保持持壁部１３ｅ、及び、端子保持壁部１３ｅから内方に突出する正面視外形が台形状で筒状の内方突出部１３ｆを有する。   The connector 13 includes a substantially rectangular parallelepiped housing 13A formed of a thermoplastic resin and a required number of metal terminals 13B accommodated in the housing 13A. The housing 13A is a rounded circle into which an external harness plug is inserted. A rectangular plate-like large and small socket parts 13c, 13d, a thick plate-like terminal holding holding wall part 13e for holding the metal terminal 13B, and a front view outer shape protruding inward from the terminal holding wall part 13e is trapezoidal. And has a cylindrical inward protruding portion 13f.

金属端子１３Ｂは、例えば、厚さ０.５mmの銅板を幅０.５mmに打ち抜かれ、さらにＬ字状にプレス成形されたもので、前記回路基板１４との接続部分（下端部）には、錫めっきが施されている。また、金属端子１３Ｂは、大きい方のソケット部１３ｃには入力用としてＸ本（例えば８０本）、小さい方のソケット部１３ｄには出力用としてＹ本（例えば４０本）、それぞれ端子保護壁部１３ｅ及び内方突出部１３ｆの底面部に形成された通し孔に差し込まれて保持固定されている（なお、図には各部が簡略化して描かれている）。   The metal terminal 13B is, for example, a 0.5 mm thick copper plate punched out to a width of 0.5 mm, and press-formed into an L shape. Tin-plated. Also, the metal terminal 13B has X terminal (for example, 80 terminals) for input to the larger socket part 13c, and Y terminal (for example, 40 terminals) for output to the smaller socket part 13d, respectively. 13e and the inwardly projecting portion 13f are inserted into through holes formed in the bottom surface portion, and are held and fixed (in the drawing, each portion is depicted in a simplified manner).

コネクタ１３は、回路基板１４の前端部に固定用の爪で一体的に取付固定されている。このコネクタ１３の金属端子１３Ｂの下端部は、回路基板１４に形成されているスルーホール１４ｓに挿入されて、そこから約１mm下方に突き出るようにされており、この下端部を回路基板１４にはんだで接合して電気的に接続するようになっている。   The connector 13 is integrally attached and fixed to the front end portion of the circuit board 14 with fixing claws. The lower end portion of the metal terminal 13B of the connector 13 is inserted into a through hole 14s formed in the circuit board 14 so as to protrude about 1 mm downward therefrom, and this lower end portion is soldered to the circuit board 14. Are joined and electrically connected.

一方、放熱用金属ベース１５はアルミダイカスト製であり、平面視矩形で、回路基板１４を搭載する主面側には、この回路基板１４が載せ置かれる凸部１５ｄが突設されるとともに、その裏面側には放熱用のフィン１５ｂが形成されている。   On the other hand, the heat radiating metal base 15 is made of aluminum die-casting and is rectangular in plan view. On the main surface side on which the circuit board 14 is mounted, a convex portion 15d on which the circuit board 14 is placed protrudes. A heat dissipation fin 15b is formed on the back side.

また、金属ベース１５の四隅近くには、金属カバー１１との締付固定用螺子１９がねじ込まれる雌ねじが形成されている。   Further, near the four corners of the metal base 15, female screws into which the fastening screws 19 for fastening with the metal cover 11 are screwed are formed.

金属カバー１１は、厚さ０.５mmの鋼板をトレー状にプレス成形したもので、平面視矩形とされ、回路基板１４を覆う部分１１Ａが深さ約１９mm、コネクタ１３（の内方突出部１３ｆ）に被せる部分１１Ｂが深さ約３０mmとなっており、前端側を除く３辺の外周部は、横倒しＬ形状のフランジ部１１Ｃとなっている。このフランジ部１１Ｃは、後述するように、金属ベース１５の３辺端部１５Ｂ，１５Ｃ，１５Ｄ上に塗布されたシール材２０（第３接着材層２０Ｃ）に当接する部分であり、その四隅近くには、金属カバー１１を金属ベース１５に螺子１９で締め付け固定するための、螺子止め用段上げ凸部１８が設けられ、該段上げ凸部１８に形成された螺子通し穴を介して金属ベース１５に形成された雌ねじ部に螺子１９がねじ込まれている（図２参照）。なお、前記フランジ部１１Ｃは、前記螺子止め用段上げ凸部１８部分では、そこを避けて内側に円弧を描くように形成されている。また、金属カバー１１の中央部分には防水フィルタ２２の取り付け用の孔が形成され、金属カバー１１の全面は亜鉛めっきが施されている。   The metal cover 11 is formed by pressing a steel plate having a thickness of 0.5 mm into a tray shape, has a rectangular shape in plan view, a portion 11A covering the circuit board 14 has a depth of about 19 mm, and a connector 13 (inward protruding portion 13f of the connector 13). 11B has a depth of about 30 mm, and the outer peripheral portion of the three sides excluding the front end side is laid down to form an L-shaped flange portion 11C. As will be described later, the flange portion 11C is a portion that comes into contact with the sealing material 20 (third adhesive material layer 20C) applied on the three side end portions 15B, 15C, and 15D of the metal base 15, and is close to the four corners thereof. Is provided with a screw-fastening stepped convex portion 18 for fastening and fixing the metal cover 11 to the metal base 15 with a screw 19, and the metal base through a screw through hole formed in the stepped convex portion 18. A screw 19 is screwed into the female screw portion 15 (see FIG. 2). The flange portion 11C is formed so as to draw an arc on the inner side of the stepped convex portion 18 for screwing to avoid the flange portion 11C. In addition, a hole for attaching the waterproof filter 22 is formed in the central portion of the metal cover 11, and the entire surface of the metal cover 11 is galvanized.

本発明の車載用電子機器のシール構造の一実施形態について説明する。図４にシール部の断面構造と金属ベースの斜視図を示す。図４では金属ベース１５のシール材接着面５１２の筐体内側に断続的に複数の凹部５３０を形成した例である。回路基板１４が搭載された金属ベース１５のシール材接着面５１２にシール材２０を塗布する。この際、複数の凹部５３０にはシール材２０が充填される。その後、金属ベース１５に金属カバー１１を取り付けて金属ベース１５と金属カバー１１をシール材により接着する。なお、シール材接着面５１２にはシール材の厚さを確保するための突起５０４が形成されており、突起５０４によりシール材の高さを調整している。なお、この突起５０４は螺子止め用段上げ凸部１８であってもよい。図４のシール構造では、塩食が凹部５３０まで進行しても、凹部５３０の壁面５３１部分のシール材２０の接着力により、シール材２０に、エンジンルーム内の気温差による熱変形や、振動が加わっても、シール材の剥離を抑制することができる。また、図４に示したように、金属カバー１１が金属ベース１５の側面の一部を覆うように構成し、金属ベース１５のシール材接着面５１２を上面及び側面の複数の面で構成することで、シール部の塩水の浸入が抑制されるため好ましい。なお、図４では金属ベース１５に複数の凹部を形成したが、金属カバー１１のシール材接着面５１１に複数の凹部を形成しても良い。なお、凹部５３０には接着力を発現する程度にシール材２０が充填されていればよく、必ずしもシール材２０は凹部５３０に完全に充填されていなくても良い。   An embodiment of a seal structure for an in-vehicle electronic device according to the present invention will be described. FIG. 4 shows a cross-sectional structure of the seal portion and a perspective view of the metal base. FIG. 4 shows an example in which a plurality of recesses 530 are intermittently formed inside the housing of the sealing material bonding surface 512 of the metal base 15. The sealing material 20 is applied to the sealing material bonding surface 512 of the metal base 15 on which the circuit board 14 is mounted. At this time, the plurality of recesses 530 are filled with the sealing material 20. Thereafter, the metal cover 11 is attached to the metal base 15, and the metal base 15 and the metal cover 11 are bonded with a sealing material. Note that a protrusion 504 for ensuring the thickness of the sealing material is formed on the sealing material bonding surface 512, and the height of the sealing material is adjusted by the protrusion 504. Note that the protrusion 504 may be a stepped protrusion 18 for screwing. In the seal structure of FIG. 4, even when salt corrosion progresses to the recess 530, due to the adhesive force of the seal material 20 on the wall surface 531 portion of the recess 530, the seal material 20 is subjected to thermal deformation or vibration due to the temperature difference in the engine room. Even if is added, peeling of the sealing material can be suppressed. Further, as shown in FIG. 4, the metal cover 11 is configured to cover a part of the side surface of the metal base 15, and the sealing material bonding surface 512 of the metal base 15 is configured by a plurality of upper and side surfaces. Therefore, it is preferable because the intrusion of salt water in the seal portion is suppressed. In FIG. 4, a plurality of recesses are formed in the metal base 15, but a plurality of recesses may be formed in the sealing material bonding surface 511 of the metal cover 11. Note that it is only necessary that the recess 530 is filled with the sealing material 20 to the extent that an adhesive force is developed, and the sealing material 20 does not necessarily have to be completely filled in the recess 530.

本発明の車載用電子機器のシール構造の他の実施形態を図５に示す。図５は金属カバー１１のシール材接着面５１１に突起５４０が設けられ、金属ベース１５のシール材接着面５１２に凹部５３０が設けられたシール構造の断面図である。また、点線部分の側面を筐体内側から見た側面図を点線枠内に示している。金属ベース１５のシール材接着面５１２の筐体内側に複数の凹部５３０が形成され、金属カバーの凹部５３０に対向する部分に突起５４０が形成され、凹部５３０と突起５４０の隙間にシール材が充填されている。本構成では、図４のシール構造よりもシール材界面を構成する壁面５３１が増大され、よりシール材の密着性を高めることができる。筐体外側のシール材厚さをｄ１とし、筐体内側のシール材厚さをｄ４とした場合、シール材厚さがｄ４＞ｄ１となるように凹部５３０，突起５４０を設けることが好ましい。また、突起５４０の幅ｄ２が凹部の幅ｄ３より小さく、突起５４０と凹部５３０が対向するように設けられることが望ましい。   FIG. 5 shows another embodiment of the seal structure of the in-vehicle electronic device according to the present invention. FIG. 5 is a cross-sectional view of a sealing structure in which a protrusion 540 is provided on the sealing material adhesion surface 511 of the metal cover 11 and a recess 530 is provided on the sealing material adhesion surface 512 of the metal base 15. Moreover, the side view which looked at the side surface of the dotted line part from the housing | casing inside is shown in the dotted line frame. A plurality of recesses 530 are formed inside the housing of the sealing material bonding surface 512 of the metal base 15, a protrusion 540 is formed in a portion facing the recess 530 of the metal cover, and a sealing material is filled in a gap between the recess 530 and the protrusion 540. Has been. In this structure, the wall surface 531 which comprises a sealing material interface is increased rather than the sealing structure of FIG. 4, and the adhesiveness of a sealing material can be improved more. When the thickness of the sealing material on the outside of the housing is d1 and the thickness of the sealing material on the inside of the housing is d4, it is preferable to provide the recesses 530 and the protrusions 540 so that the sealing material thickness is d4> d1. In addition, it is desirable that the width d2 of the protrusion 540 is smaller than the width d3 of the recess, and the protrusion 540 and the recess 530 are opposed to each other.

本発明の車載用電子機器のシール構造の他の実施形態を図６に示す。本構成は図５の構成において、さらにシール材接着面５１１，５１２の筐体外側の面を平坦化処理した例である。通常、金属ベース１５や金属カバー１１の表面には加工精度との兼ね合いからうねりを有している。図６に示したように、塩水と接するシール材接着面５１１，５１２の筐体外側の面を平坦化処理することにより、塩水に対するシール材接着界面の露出量を小さくなり、シール材接着界面への塩水の付着を抑制し、塩食を抑制することができる。   FIG. 6 shows another embodiment of the seal structure of the in-vehicle electronic device according to the present invention. This configuration is an example in which the outer surfaces of the sealing material bonding surfaces 511 and 512 are further flattened in the configuration of FIG. Usually, the surfaces of the metal base 15 and the metal cover 11 have undulations in consideration of processing accuracy. As shown in FIG. 6, by flattening the outer surfaces of the sealing material adhesion surfaces 511 and 512 that are in contact with salt water, the amount of exposure of the sealing material adhesion interface with respect to salt water is reduced, and the sealing material adhesion interface is reached. It is possible to suppress the salt water from adhering to salt water.

また、金属ベース１５や金属カバー１１とシール材２０の界面から塩水が浸入する際に、金属ベース１５や金属カバー１１の表面のうねりがあると隙間が生じやすくなり、この隙間から塩水の浸入が進行しやすくなる。これに対して、シール材接着面の筐体外側の面を平坦化処理することにより、金属カバー等とシール材との密着性が向上できるため、シール材接着界面に塩水が侵入してもその進行を抑制しやすくなり、これにより塩食の開始を遅らせることができる。また、一方で内側には断続的に凹部や突起を設けてシール材接着面積を大きくしているため、塩食が進んだ場合でもシール材接着界面の剥離を防止することができる。   Further, when salt water enters from the interface between the metal base 15 or the metal cover 11 and the sealing material 20, if there are undulations on the surface of the metal base 15 or the metal cover 11, gaps are likely to be generated, and salt water intrudes from the gaps. Easy to progress. On the other hand, since the adhesion between the metal cover or the like and the sealing material can be improved by flattening the surface outside the housing of the sealing material adhesion surface, even if salt water enters the sealing material adhesion interface It becomes easy to suppress the progress, and thereby the start of the salt diet can be delayed. On the other hand, since the sealing material bonding area is increased by intermittently providing recesses and protrusions on the inner side, peeling of the sealing material bonding interface can be prevented even when salt corrosion progresses.

車載用電気機器を塩水噴霧環境下において試験した結果、シール材接着界面の塩食は主にカバーとベースを固定するボルトの間の中央部分のシール材や、エンジンルームに筺体を固定するためのボルト付近のシール部等、シール材の変形量が大きくなる箇所や、筺体に振動等の負荷がかかりやすい箇所で生じやすいことを確認している。上述したシール構造は、主に筺体の金属カバーと金属ベースを固定するボルトの間の中央部分や、エンジンルームに筺体を固定するためのボルト付近のシール部等、シール材の変形量が大きくなる箇所や、筺体に振動等の負荷がかかりやすい箇所に施すことが好ましい。上述した断続的な凹部や突起はシール材接着面の全体に形成してもよいが、上述した塩食の発生しやすい場所のみに限定して設けることでもよい。このように塩食の発生しやすい所定の箇所に選択的に凹部や突起を設ければ、シール材の塗布量を少なくでき、電子機器の製造コストを下げることが可能である。   As a result of testing automotive electrical equipment in a salt spray environment, salt corrosion at the sealing material adhesion interface is mainly used to seal the sealing material at the center between the bolt that secures the cover and the base, and to fix the chassis to the engine room. It has been confirmed that this is likely to occur at locations where the amount of deformation of the sealing material is large, such as the seal portion near the bolt, or where the load on the housing is likely to be subject to vibrations. The above-described seal structure mainly increases the amount of deformation of the sealing material, such as the central portion between the bolts that fix the metal cover of the casing and the metal base, and the seal portions near the bolts that fix the casing to the engine room. It is preferable to apply to places or places where loads such as vibration are likely to be applied to the housing. The intermittent recesses and protrusions described above may be formed on the entire sealing material bonding surface, but may be limited to the above-described locations where salt corrosion is likely to occur. In this way, if a recess or protrusion is selectively provided at a predetermined location where salt corrosion is likely to occur, the amount of sealing material applied can be reduced, and the manufacturing cost of the electronic device can be reduced.

本発明のシール構造により、シール材の接着面積が向上し、シール材接着界面の塩食が進んでも、シール材が剥離し難くなり、塩食による車載用電子機器の破壊を防ぐことができる。本発明の車載用電子機器はハイブリッド車両や電動車両等に適用することが可能である。   With the sealing structure of the present invention, the bonding area of the sealing material is improved, and even when salt corrosion at the sealing material bonding interface progresses, the sealing material becomes difficult to peel off, and the on-vehicle electronic device can be prevented from being damaged by salt corrosion. The on-vehicle electronic device of the present invention can be applied to a hybrid vehicle, an electric vehicle, or the like.

本実施例は図１に示した車載用電子機器において、図４に示したシール構造を適用したものである。   In this embodiment, the seal structure shown in FIG. 4 is applied to the in-vehicle electronic device shown in FIG.

金属ベース１５には凹型溝５２２によって固定される放熱シート５２１が設けられ、放熱シート５２１と接するように回路基板１４が配置されている。回路基板１４には電子部品２１が実装されている。また、回路基板にはコネクタ１３が取り付けられており、コネクタ１３を介して回路基板と外部との電気信号の入出力が行われる。金属ベース１５の金属カバー１１とのシール材接着面には、筐体内側に断続的な複数の凹部５３０が形成されている。   The metal base 15 is provided with a heat radiating sheet 521 fixed by the concave groove 522, and the circuit board 14 is disposed so as to be in contact with the heat radiating sheet 521. An electronic component 21 is mounted on the circuit board 14. A connector 13 is attached to the circuit board, and electrical signals are input / output between the circuit board and the outside via the connector 13. A plurality of intermittent recesses 530 are formed on the inner side of the housing on the sealing material bonding surface of the metal base 15 to the metal cover 11.

金属ベース１５のシール材接着面５１２へシール材５２０を塗布し、凹部５３０にシール材を充填する。シール材は回路基板５０７に接触しないように設けられ、シール材の塗布高さは固定用螺子１９付近に設けられたシール塗布高さ保持用の突起５０４にて規定されている。その後、金属ベース１５の所定の位置にコネクタ１３を配置する。コネクタ１３の金属カバー１１とのシール材接着面にシール材２０を塗布した後、防水換気フィルタが取り付けられた金属カバー１１を取り付け、金属ベース１５，コネクタ１３および金属カバーをシール材２０により接着し、筐体内部を金属カバーで密封する。その後、金属ベース１５と金属カバー１１の四隅を固定用螺子１９で締め付け固定し、図４に示したシール構造を有する車載用電子機器１０を作製した。この車載用電子機器１０は、エンジンルーム組み付け用ボルトによりエンジンルーム内に設置されて使用される。   The sealing material 520 is applied to the sealing material bonding surface 512 of the metal base 15, and the recess 530 is filled with the sealing material. The sealing material is provided so as not to come into contact with the circuit board 507, and the coating height of the sealing material is defined by a protrusion 504 for maintaining the sealing coating height provided in the vicinity of the fixing screw 19. Thereafter, the connector 13 is disposed at a predetermined position of the metal base 15. After the sealing material 20 is applied to the sealing material adhesion surface of the connector 13 to the metal cover 11, the metal cover 11 to which the waterproof ventilation filter is attached is attached, and the metal base 15, the connector 13, and the metal cover are adhered by the sealing material 20. The inside of the housing is sealed with a metal cover. Thereafter, the four corners of the metal base 15 and the metal cover 11 were fastened and fixed with fixing screws 19 to produce the in-vehicle electronic device 10 having the seal structure shown in FIG. The in-vehicle electronic device 10 is installed and used in an engine room with an engine room assembling bolt.

信頼性試験として、本実施例の車載用電子機器を塩水噴霧装置の塩水噴霧槽内に設置し、防水フィルタ部分からポンプにて電子機器内部を１００kgｆ／cm2の負圧とし、５％ＮａＣｌ水溶液を電子機器に噴霧し、その後塩水噴霧槽内の湿度を８５％ＲＨとし、再び塩水を噴霧するという工程を繰り返したところ、３０日経過してもシール部分はリークせず、必要な特性を満足した。本実施例の凹部５３０にシール材２０が充填されたシール構造により、塩食が凹部５３０まで進行しても、凹部５３０の壁面５３１部分のシール材２０の接着力により、シール材２０に、エンジンルーム内の気温差による熱変形や、振動が加わっても、シール材の剥離を抑制することができる。 As a reliability test, the on-vehicle electronic device of this example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution. Was sprayed on the electronic equipment, then the humidity in the salt spray tank was set to 85% RH, and salt water was sprayed again. The seal part did not leak even after 30 days and satisfied the required characteristics. did. Even if salt corrosion progresses to the recess 530 by the seal structure in which the recess 530 of the present embodiment is filled with the seal material 20, the adhesive force of the seal material 20 on the wall surface 531 of the recess 530 causes the seal material 20 to Even if thermal deformation or vibration due to temperature difference in the room is applied, peeling of the sealing material can be suppressed.

本実施例は図１に示した車載用電子機器において、図５に示したシール構造を適用したものである。   In this embodiment, the seal structure shown in FIG. 5 is applied to the in-vehicle electronic device shown in FIG.

金属カバー１１のシール材接着面５１１に突起５４０が設けられ、金属ベースのシール材接着面５１２に凹部５３０が形成されている。ここで、凹部５３０の幅ｄ３は突起５４０の幅ｄ２よりも大きくし、筺体内側のシール材２０の高さｄ４が筺体外側のシール材２０の高さｄ１よりも高くなる構造とした。また、凹部５３０と対向するように突起５４０が形成されている。   A protrusion 540 is provided on the sealing material bonding surface 511 of the metal cover 11, and a recess 530 is formed on the sealing material bonding surface 512 of the metal base. Here, the width d3 of the recess 530 is larger than the width d2 of the protrusion 540, and the height d4 of the sealing material 20 inside the housing is higher than the height d1 of the sealing material 20 outside the housing. Further, a protrusion 540 is formed so as to face the recess 530.

金属カバー１１の突起５４０，金属ベースの凹部５３０の構成以外は実施例１と同じであり、実施例１と同様の方法で車載用電子機器１０を作製した。   Except for the configuration of the protrusion 540 of the metal cover 11 and the recess 530 of the metal base, it is the same as that of Example 1, and the in-vehicle electronic device 10 was manufactured by the same method as in Example 1.

信頼性試験として、本実施例の車載用電子機器を塩水噴霧装置の塩水噴霧槽内に設置し、防水フィルタ部分からポンプにて電子機器内部を１００kgｆ／cm2の負圧とし、５％ＮａＣｌ水溶液を電子機器に噴霧し、その後塩水噴霧槽内の湿度を８５％ＲＨとし、再び塩水を噴霧するという工程を繰り返したところ、４０日経過してもシール部分はリークせず、必要な特性を満足した。 As a reliability test, the on-vehicle electronic device of this example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution. Was sprayed on the electronic equipment, then the humidity in the salt spray tank was set to 85% RH, and salt water was sprayed again. The seal did not leak even after 40 days, and the required characteristics were satisfied. did.

本実施例は図１に示した車載用電子機器において、図６に示したシール構造を適用したものである。   In this embodiment, the seal structure shown in FIG. 6 is applied to the in-vehicle electronic device shown in FIG.

本実施例では、金属カバーのシール材接着面５１１および金属ベース１５のシール材接着面５１２の筺体外側部分が平坦化処理されている。それ以外の構成は実施例２と同様である。   In this embodiment, the outer side portions of the casing of the sealing material adhesion surface 511 of the metal cover and the sealing material adhesion surface 512 of the metal base 15 are flattened. Other configurations are the same as those in the second embodiment.

金属カバーのシール材接着面５１１および金属ベース１５のシール材接着面５１２の筺体外側部分の表面にポリアミドイミドで構成されたコート剤を塗布，硬化させて皮膜５０８を形成した。この皮膜５０８により、シール材接着面５１１，５１２の筺体内側部分の表面よりも平坦な表面となる。なお、本実施例はポリアミドイミドで構成されたコート剤を使用したが、平坦化処理できるものであれば他のコート剤も使用することが可能である。また、コート剤による平坦化処理のほかに機械的に平坦化処理を施してもよい。   A coating agent made of polyamideimide was applied and cured on the surface of the outer side of the housing of the sealing material adhesion surface 511 of the metal cover and the sealing material adhesion surface 512 of the metal base 15 to form a coating 508. By this film 508, the surface becomes flatter than the surface of the inner part of the casing of the sealing material adhesion surfaces 511 and 512. In this example, a coating agent composed of polyamideimide was used, but other coating agents can be used as long as they can be planarized. In addition to the flattening process using a coating agent, the flattening process may be performed mechanically.

シール材接着面５１１，５１２の平坦化処理を施した後、実施例１と同様の方法により車載用電子機器を作製した。   After performing the planarization process of the sealing material adhesion surfaces 511 and 512, an in-vehicle electronic device was manufactured by the same method as in Example 1.

信頼性試験として、本実施例の車載用電子機器を塩水噴霧装置の塩水噴霧槽内に設置し、防水フィルタ部分からポンプにて電子機器内部を１００kgｆ／cm2の負圧とし、５％ＮａＣｌ水溶液を電子機器に噴霧し、その後塩水噴霧槽内の湿度を８５％ＲＨとし、再び塩水を噴霧するという工程を繰り返したところ、実施例２と比較してシール材接着界面の塩食の開始日数が４日伸び、信頼性が向上した。 As a reliability test, the on-vehicle electronic device of this example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution. Was sprayed on the electronic equipment, the humidity in the salt water spray tank was then set to 85% RH, and salt water was sprayed again. Increased by 4 days and improved reliability.

〔比較例１〕
図７は本発明の比較例を示したものである。金属カバー１１のシール接着面６１１の筺体内側に筺体全内周にわたって連続的な切り欠き６１２を設けた構成とした。実施例１と同様の方法により車載用電子機器１０を作製した。 [Comparative Example 1]
FIG. 7 shows a comparative example of the present invention. It was set as the structure which provided the continuous notch 612 over the inner periphery of the housing inside the housing of the seal | sticker adhesion surface 611 of the metal cover 11. FIG. The in-vehicle electronic device 10 was produced by the same method as in Example 1.

信頼性試験として、本比較例の車載用電子機器を塩水噴霧装置の塩水噴霧槽内に設置し、防水フィルタ部分からポンプにて電子機器内部を１００kgｆ／cm2の負圧とし、５％ＮａＣｌ水溶液を電子機器に噴霧し、その後塩水噴霧槽内の湿度を８５％ＲＨとし、再び塩水を噴霧するという工程を繰り返したところ、１８日でシール部分がリークし、塩水が回路基板１４まで浸入し、電子機器が破壊した。 As a reliability test, the in-vehicle electronic device of this comparative example is installed in a salt spray tank of a salt spray device, and the inside of the electronic device is set to a negative pressure of 100 kgf / cm 2 by a pump from a waterproof filter portion, and a 5% NaCl aqueous solution. Was sprayed on the electronic equipment, and then the humidity in the salt spray tank was set to 85% RH and salt water was sprayed again. As a result, the seal part leaked in 18 days, and salt water entered the circuit board 14. An electronic device has been destroyed.

１０ 車載用電子機器
１１ 金属カバー
１３ コネクタ
１３Ａ ハウジング
１３Ｂ 金属端子
１４ 回路基板
１５ 金属ベース
１９ 締付固定用螺子
２０ シール材
２１ 電子部品
２２ 防水フィルタ
５０４，５４０ 突起
５０８ 皮膜
５１１，５１２ シール材接着面
５２１ 放熱シート
５２２ 凹型溝
５３０ 凹部
５３１ 壁面 DESCRIPTION OF SYMBOLS 10 In-vehicle electronic device 11 Metal cover 13 Connector 13A Housing 13B Metal terminal 14 Circuit board 15 Metal base 19 Tightening fixing screw 20 Seal material 21 Electronic component 22 Waterproof filter 504, 540 Protrusion 508 Film 511, 512 Seal material adhesion surface 521 Heat dissipation sheet 522 Concave groove 530 Concave part 531 Wall surface

Claims (8)

電子部品が実装された回路基板と、
該回路基板と外部を電気的に接続するためのコネクタと、
前記回路基板が搭載されるとともに前記コネクタがシール材を介して接着される金属ベースと、
前記金属ベース及びコネクタにシール材を介して接着され、前記回路基板とコネクタの一部を密封する金属カバーとを備える車載用電機機器であって、
前記金属ベースまたは前記金属カバーのシール剤接着面の筐体内側に複数の凹部が形成されており、前記凹部内にシール材が充填されていることを特徴とする車載用電子機器。 A circuit board on which electronic components are mounted;
A connector for electrically connecting the circuit board and the outside;
A metal base on which the circuit board is mounted and the connector is bonded via a sealing material;
A vehicle-mounted electrical device comprising a metal cover that is bonded to the metal base and the connector via a sealing material and seals a part of the circuit board and the connector,
A vehicle-mounted electronic device, wherein a plurality of recesses are formed inside a housing of a sealing agent bonding surface of the metal base or the metal cover, and the sealing material is filled in the recesses. 前記金属ベースのシール剤接着面の筐体内側に複数の凹部が形成され、前記金属カバーの前記凹部に対向する部分に突起が形成され、前記凹部と突起の隙間にシール材が充填されていることを特徴とする請求項１記載の車載用電子機器。   A plurality of recesses are formed inside the casing of the metal base sealant bonding surface, a protrusion is formed in a portion of the metal cover facing the recess, and a gap between the recess and the protrusion is filled with a sealing material. The in-vehicle electronic device according to claim 1. 一方の凹部の幅が他方の突起の幅より大きいことを特徴とする請求項２記載の車載用電子機器。   The in-vehicle electronic device according to claim 2, wherein the width of one recess is larger than the width of the other protrusion. 凹部の深さ、あるいは、突起の高さが、シール材の厚さよりも大きいことを特徴とする請求項２記載の車載用電子機器。   The in-vehicle electronic device according to claim 2, wherein the depth of the recess or the height of the protrusion is larger than the thickness of the sealing material. 前記金属ベースのシール剤接着面の筐体内側に複数の突起が形成され、前記金属カバーの前記突起に対向する部分に凹部が形成され、前記凹部と突起の隙間にシール材が充填されていることを特徴とする請求項１記載の車載用電子機器。   A plurality of protrusions are formed inside the casing of the metal base sealant adhesive surface, a recess is formed in a portion of the metal cover facing the protrusion, and a gap between the recess and the protrusion is filled with a sealing material. The in-vehicle electronic device according to claim 1. 一方の凹部の幅が他方の突起の幅より大きいことを特徴とする請求項５記載の車載用電子機器。   6. The in-vehicle electronic device according to claim 5, wherein the width of one recess is larger than the width of the other protrusion. 凹部の深さ、あるいは、突起の高さが、シール材の厚さよりも大きいことを特徴とする請求項５記載の車載用電子機器。   6. The in-vehicle electronic device according to claim 5, wherein the depth of the recess or the height of the protrusion is larger than the thickness of the sealing material. 前記金属ベースまたは前記金属カバーのシール剤接着面の筺体外側が平坦化されていることを特徴とする請求項１記載の車載用電子機器。   The in-vehicle electronic device according to claim 1, wherein an outer side of the casing of the sealant bonding surface of the metal base or the metal cover is flattened.
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