JP2011216917A5 - Pattern transfer method, metal thin film pattern transfer method, and transfer device - Google Patents
Pattern transfer method, metal thin film pattern transfer method, and transfer device Download PDFInfo
- Publication number
- JP2011216917A5 JP2011216917A5 JP2011168000A JP2011168000A JP2011216917A5 JP 2011216917 A5 JP2011216917 A5 JP 2011216917A5 JP 2011168000 A JP2011168000 A JP 2011168000A JP 2011168000 A JP2011168000 A JP 2011168000A JP 2011216917 A5 JP2011216917 A5 JP 2011216917A5
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- Prior art keywords
- blanket
- flat plate
- transfer
- stage
- flat
- Prior art date
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- 239000010409 thin film Substances 0.000 title claims description 6
- 239000002184 metal Substances 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 4
- 230000002093 peripheral Effects 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000000875 corresponding Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 1
- 238000007645 offset printing Methods 0.000 description 1
Description
本発明は、反転オフセット印刷法を用いたパターン転写方法および金属薄膜パターン転写方法、ならびにこれらの転写方法に適用される転写装置に関する。 The present invention relates to a pattern transfer method using a reverse offset printing method, a metal thin film pattern transfer method , and a transfer apparatus applied to these transfer methods .
本発明はかかる問題点に鑑みてなされたもので、その目的は、薄膜の抵抗値を必要以上に高くすることなく、従来よりも微細化および高歩留り化を実現することが可能なパターン転写方法および金属薄膜パターン転写方法ならびに転写装置を提供することにある。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a pattern transfer method capable of realizing miniaturization and a higher yield than the conventional one without increasing the resistance value of the thin film more than necessary. And a metal thin film pattern transfer method and a transfer apparatus .
本発明のパターン転写方法および金属薄膜パターン転写方法は、以下の要件（Ａ）〜（Ｃ）を含むものである。
（Ａ）平板ブランケット上にインクを塗布する塗布工程
（Ｂ）平板ブランケットと、所定のパターンからなる凸部を有する凸版とを互いに向かい合わせ、これらを加圧圧縮によって接触させることにより、平板ブランケット上のインクのうちの凸部に対応する部分を凸版上に転写させる第１転写工程
（Ｃ）第１転写工程後の平板ブランケットと基板とを互いに向かい合わせ、これらを加圧圧縮によって接触させることにより、平板ブランケット上に残留するインクを基板上に転写させる第２転写工程
本発明の転写装置は、平板ブランケットを固定するための第１のステージと、凸版または基板を固定するための第２のステージと、平板ブランケットの外周部を第１のステージに固定するための固定部とを備え、第１のステージには、圧縮空気を噴射するための空気導入口が設けられているものである。
The pattern transfer method and metal thin film pattern transfer method of the present invention include the following requirements (A) to (C).
(A) Application process of applying ink onto a flat blanket (B) A flat blanket and a relief printing plate having a predetermined pattern are opposed to each other and brought into contact with each other by pressure compression. A first transfer step (C) for transferring a portion corresponding to the convex portion of the ink on the relief plate, the flat blanket after the first transfer step and the substrate face each other, and these are brought into contact with each other by pressure compression Second transfer step of transferring ink remaining on flat blanket onto substrate
The transfer device of the present invention includes a first stage for fixing a flat plate blanket, a second stage for fixing a relief plate or a substrate, and fixing for fixing the outer peripheral portion of the flat plate blanket to the first stage. The first stage is provided with an air inlet for injecting compressed air.
Claims (16)
前記平板ブランケットと、所定のパターンからなる凸部を有する凸版とを互いに向かい合わせ、これらを加圧圧縮によって接触させることにより、前記平板ブランケット上のインクのうちの前記凸部に対応する部分を前記凸版上に転写させる第１転写工程と、
前記第１転写工程後の平板ブランケットと基板とを互いに向かい合わせ、これらを加圧圧縮によって接触させることにより、前記平板ブランケット上に残留するインクを前記基板上に転写させる第２転写工程と
を含むパターン転写方法。 An application process for applying ink on a flat blanket;
The flat plate blanket and a relief plate having a convex portion having a predetermined pattern are faced to each other and brought into contact with each other by pressure compression, whereby a portion corresponding to the convex portion of the ink on the flat plate blanket is A first transfer step for transferring onto the relief plate;
A second transfer step of transferring the ink remaining on the flat plate blanket onto the substrate by causing the flat plate blanket and the substrate after the first transfer step to face each other and contacting them by pressure compression. Pattern transfer method.
前記平板ブランケットまたは前記凸版の背面側から圧縮空気を噴射することにより、前記平板ブランケットと前記凸版とを接触させる
請求項１に記載のパターン転写方法。 In the first transfer step,
The pattern transfer method according to claim 1, wherein the flat plate blanket and the relief printing plate are brought into contact with each other by spraying compressed air from a back side of the flat plate blanket or the relief printing plate.
前記平板ブランケットまたは前記基板の背面側から圧縮空気を噴射することにより、前記平板ブランケットと前記基板とを接触させる
請求項１または請求項２に記載のパターン転写方法。 In the second transfer step,
The pattern transfer method according to claim 1, wherein the flat plate blanket and the substrate are brought into contact with each other by ejecting compressed air from the flat plate blanket or the back side of the substrate.
前記第１転写工程において圧縮空気を噴射した空間を真空排気することにより、前記平板ブランケットと前記凸版とを分離させる分離工程を含む
請求項１ないし請求項３のいずれか１項に記載のパターン転写方法。 After the first transfer step,
The pattern transfer according to any one of claims 1 to 3, further comprising a separation step of separating the flat blanket and the relief plate by evacuating the space in which the compressed air is jetted in the first transfer step. Method.
前記平板ブランケットの背面側に伸縮性フィルムを設け、前記伸縮性フィルムを介して圧縮空気を噴射することにより、前記平板ブランケットと前記凸版または前記基板とを接触させる
請求項２ないし請求項４のいずれか１項に記載のパターン転写方法。 In the first transfer step or the second transfer step,
5. The flat plate blanket and the relief plate or the substrate are brought into contact with each other by providing a stretchable film on the back side of the flat plate blanket and spraying compressed air through the stretchable film. The pattern transfer method according to claim 1.
前記基板は第２のアライメントマークを有し、
前記第２転写工程の前に、前記第１のアライメントマークと前記第２のアライメントマークとに基づいて前記平板ブランケットと前記基板との位置合わせをする位置合わせ工程を含む
請求項１ないし請求項５のいずれか１項に記載のパターン転写方法。 The flat blanket has a first alignment mark;
The substrate has a second alignment mark;
6. The alignment step of aligning the flat plate blanket and the substrate based on the first alignment mark and the second alignment mark before the second transfer step. The pattern transfer method according to any one of the above.
前記第１転写工程において形成された前記平板ブランケット上のパターンの一部からなる
請求項６に記載のパターン転写方法。 The first alignment mark is
The pattern transfer method according to claim 6, comprising a part of the pattern on the flat blanket formed in the first transfer step.
凸版または基板を固定するための第２のステージと、A second stage for fixing the relief or substrate;
前記平板ブランケットの外周部を、前記第１のステージに固定するための固定部とA fixing portion for fixing an outer peripheral portion of the flat plate blanket to the first stage;
を備え、With
前記第１のステージには、圧縮空気を噴射するための空気導入口が設けられているThe first stage is provided with an air inlet for injecting compressed air.
転写装置。Transfer device.
前記空気導入口から圧縮空気が噴射され、Compressed air is jetted from the air inlet,
前記開口は真空排気を行うThe opening is evacuated
請求項９に記載の転写装置。The transfer device according to claim 9.
請求項９に記載の転写装置。The transfer device according to claim 9.
請求項９または請求項１１に記載の転写装置。The transfer device according to claim 9 or 11.
請求項１２に記載の転写装置。The transfer device according to claim 12.
前記開口から前記平板ブランケットを真空吸着することにより、前記平板ブランケットを前記第１のステージに固定するThe flat plate blanket is fixed to the first stage by vacuum suction of the flat plate blanket from the opening.
請求項１０ないし請求項１３のいずれか１項に記載の転写装置。The transfer device according to any one of claims 10 to 13.
請求項９ないし請求項１４のいずれか１項に記載の転写装置。The transfer device according to any one of claims 9 to 14.
請求項１５に記載の転写装置。The transfer device according to claim 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011168000A JP5177260B2 (en) | 2011-08-01 | 2011-08-01 | Pattern transfer method, metal thin film pattern transfer method, and electronic device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011168000A JP5177260B2 (en) | 2011-08-01 | 2011-08-01 | Pattern transfer method, metal thin film pattern transfer method, and electronic device manufacturing method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007158341A Division JP5041214B2 (en) | 2007-06-15 | 2007-06-15 | Method for forming metal thin film and method for manufacturing electronic device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012249304A Division JP2013032022A (en) | 2012-11-13 | 2012-11-13 | Transfer device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011216917A JP2011216917A (en) | 2011-10-27 |
| JP2011216917A5 true JP2011216917A5 (en) | 2011-12-08 |
| JP5177260B2 JP5177260B2 (en) | 2013-04-03 |
Family
ID=44946274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011168000A Expired - Fee Related JP5177260B2 (en) | 2011-08-01 | 2011-08-01 | Pattern transfer method, metal thin film pattern transfer method, and electronic device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5177260B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5977044B2 (en) * | 2012-02-28 | 2016-08-24 | 株式会社Ｓｃｒｅｅｎホールディングス | Printing apparatus and printing method |
| JP6013212B2 (en) * | 2013-01-30 | 2016-10-25 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern forming device |
| JP6196054B2 (en) * | 2013-03-27 | 2017-09-13 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern transfer system and pattern transfer method |
| JP6178235B2 (en) * | 2013-12-27 | 2017-08-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern forming method, pattern printing method, pattern forming system, and pattern printing system |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3059473B2 (en) * | 1990-10-01 | 2000-07-04 | 大日本印刷株式会社 | Fine pattern transfer method and fine pattern transfer device |
| JP4316816B2 (en) * | 2001-01-29 | 2009-08-19 | 日本メクトロン株式会社 | Flexible circuit board exposure method |
| JP4332395B2 (en) * | 2003-09-25 | 2009-09-16 | キヤノン株式会社 | Near-field exposure mask and near-field exposure method |
| JP4622626B2 (en) * | 2005-03-30 | 2011-02-02 | 凸版印刷株式会社 | Method for forming conductive pattern |
| JP2007134368A (en) * | 2005-11-08 | 2007-05-31 | Nikon Corp | Pattern transferring apparatus, aligner, and pattern transfer method |
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2011
- 2011-08-01 JP JP2011168000A patent/JP5177260B2/en not_active Expired - Fee Related
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