JP2011216797A - Method of mounting electronic component on multi-piece substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the production efficiency of component mounting on a multi-piece substrate that includes defective blocks, to easily develop a production plan, and also to easily sort blocks mounted with components into acceptable substrate blocks and defective blocks.SOLUTION: The multi-piece substrates 11 are sorted into different groups according to the combination of the number of defective blocks and the locations thereof. The multi-piece substrates 11 sorted into groups are carried into an electronic component mounting line by group. The electronic component mounting line is run by a production program having a layer structure wherein the order of mounting components, arrangement of a common feeder, etc. are optimized for each group to mount electronic components on each substrate block 12 while skipping the defective blocks of the multi-piece substrates 11.

Description

  The present invention mounts an electronic component on each board block of a multi-piece board (also referred to as a multi-sided board) integrally formed with a plurality of board blocks that are finally divided into a plurality of circuit boards on an electronic component mounting line. The invention relates to a method for mounting electronic components on a multi-chip substrate.

  In order to improve the production efficiency of component mounting on a small circuit board, a multi-unit board, in which a plurality of board blocks that are finally divided into a plurality of circuit boards, are integrally formed, is carried into an electronic component mounting line. In general, an electronic component is mounted on each board block of a multi-piece board.

  At this time, a defective substrate block (hereinafter referred to as “defective block”) may exist among the plurality of substrate blocks integrally formed on the multi-piece substrate. If electronic components are mounted on the defective block in the same manner as other board blocks, all the electronic components mounted on the defective block are wasted, so it is necessary to skip mounting of components on the defective block.

  Therefore, as described in Patent Document 1 (Japanese Patent Laid-Open No. 2009-99886), information on a defective block (hereinafter referred to as “skip information”) that skips component mounting is displayed at a predetermined position on the multi-cavity board. Alternatively, a barcode label to be recorded, an electronic tag, etc. are provided, the position of the defective block is recognized based on the skip information, and the electronic block is mounted on each board block by skipping the defective block of the multi-chip board. There is what I did.

JP 2009-99886 A

  However, if a multi-chip board with no defective blocks and a multi-chip board with a different number of defective blocks are randomly mixed in the multi-chip board to be carried into the electronic component mounting line, In addition, it is necessary to read the skip information by image processing etc. to determine the number of defective blocks, which not only deteriorates the production efficiency but also predicts the time until the completion of mounting the component on the multi-chip board of the planned number. However, it is difficult to make a production plan. In addition, the sorting operation of the non-defective board block and defective block after component mounting must be complicated.

  Therefore, the problem to be solved by the present invention is to improve the production efficiency of component mounting on a multi-piece substrate including a defective block, and to easily make a production plan, and in addition, a good substrate block after component mounting It is an object of the present invention to provide a method for mounting electronic components on a multi-chip substrate that can easily sort the defective blocks and the defective blocks.

  In order to solve the above-mentioned problem, the invention according to claim 1 is directed to electronic components placed on each board block of a multi-chip board in which a plurality of board blocks that are finally divided into a plurality of circuit boards are integrally formed. In an electronic component mounting method for a multi-chip board to be mounted on a component mounting line, a multi-chip board having no defective board block (hereinafter referred to as “defective block”) is sorted into one group from among a large number of multi-chip boards. In addition, the process of sorting the multi-piece substrate including defective blocks into different groups for each number of defective blocks per board, and carrying the grouped multi-piece substrate to the electronic component mounting line for each group, Operate the electronic component mounting line with a production program adapted to each group to skip defective blocks on the multi-chip board and to block each board block. It is characterized in that a step of mounting an electronic component on.

  In this way, the process of recognizing the number of defective blocks for each multi-chip board can be omitted, and the production efficiency of component mounting on the multi-chip board including the defective block can be improved. Moreover, since the number of defective blocks per multi-ply board is the same for each group, the component mounting time per multi-pick board can be made substantially the same for each group. It is possible to easily predict the time until component mounting on the multi-chip substrate is completed, and it is easy to make a production plan. In addition, if the number of defective blocks per multi-chip substrate is the same for each group, it is easy to sort non-defective substrate blocks and defective blocks after component mounting.

  In consideration of the fact that there are many cases where a supplier that manufactures a multi-chip board and a supplier that mounts electronic components on the multi-chip board are different, the multi-chip board that has no defective blocks in advance is provided. Acquire a large number of multi-layered boards divided into different groups according to the number of defective blocks per group of substrates and the number of multi-layered boards (that is, those obtained by the manufacturer of multi-layered boards according to the number of defective blocks) Obtained by a component mounter), and the grouped multi-piece boards are carried into the electronic component mounting line for each group, and the electronic component mounting line is operated with a production program adapted for each group. Electronic components may be mounted on the substrate block by skipping defective blocks of the individual substrate.

  Further, as in claim 3, the number of defective blocks per one multi-chip substrate and the position of each defective block (each combination of the number of defective blocks and the position) may be classified into different groups. If the number and position of the defective blocks of a multi-chip board belonging to the same group are the same, the component mounting time per multi-chip board for each group will be completely the same, and Processing for recognizing the position of the defective block for each substrate is not required, and the production efficiency can be further improved. In addition, if the position of the defective block is the same for each group, the sorting operation of the non-defective board block and the defective block after the component mounting is further facilitated.

FIG. 1 is a plan view of a multi-piece substrate in one embodiment of the present invention. FIG. 2 is a flowchart for explaining the procedure for dividing the multi-piece board group. FIG. 3 is a flowchart for explaining the procedure of the electronic component mounting operation.

Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described.
First, the configuration of the multi-chip substrate 11 will be described with reference to FIG.
The multi-chip substrate 11 is a single large substrate in which a plurality of substrate blocks 12 are integrally formed. After mounting electronic components on each substrate block 12, each substrate block 12 is divided into a plurality of circuit substrates. Form. A block skip mark 13 for identifying whether or not the substrate block 12 is a defective block is provided at a predetermined position of each substrate block 12, and the block skip mark 13 is defective depending on the color, shape, number, symbol, etc. The block can be identified.

  Further, a group mark 14 for identifying which group the multi-chip substrate 11 is assigned to is provided at a predetermined position of the multi-chip substrate 11, and the numbers, symbols, colors, shapes, etc. of the group mark 14 are provided. The group can be recognized by. Based on the information of the group mark 14, the number of defective blocks per one multi-chip substrate 11 and the position of each defective block (each combination of the number of defective blocks and the position) are sorted into different groups. Accordingly, only the multi-chip substrate 11 having the same number and position of defective blocks belongs to the same group. The block skip mark 13 and the group mark 14 may be formed by printing, coating, or the like, or may be formed by attaching a label or the like.

Next, a method for mounting electronic components on a multi-cavity board of this embodiment will be described with reference to the flowcharts of FIGS.
The flowchart of FIG. 2 shows a procedure for grouping multiple board substrates that sort the multiple board 11 into different groups for each combination of the number and position of defective blocks. The multi-piece board grouping operation may be performed by a manufacturer that manufactures a multi-piece board, or by a supplier that mounts electronic components on the multi-piece board 11.

  In the multi-chip board grouping operation, first, in step 101, the entire surface of the multi-chip board 11 is imaged by a camera (not shown), the block skip mark 13 is recognized by the image processing, and in the next step 102. Then, the number and position of defective blocks on the multi-chip substrate 11 are read.

  Thereafter, the process proceeds to step 103, where it is determined which group it belongs to based on the number and position of the defective blocks, and in the next step 104, a large number of group marks 14 representing the group determined in step 103 are obtained. 11 are provided at predetermined positions. At this time, the group mark 14 may be provided only on the first (first) multi-chip substrate 11 of each group, and the group mark 14 may not be provided on the second and subsequent multi-chip substrates 11. (This is because each group has the same number and position of defective blocks). Thereafter, the process proceeds to step 105, where the multi-chip substrate 11 is sorted into each group.

  The flowchart of FIG. 3 shows a procedure for mounting electronic components on the multi-chip substrate 11. In the electronic component mounting operation, first, in step 201, a production program having a layer structure optimized for each group is transmitted to a control device (not shown) of the electronic component mounting line. This layered production program optimizes the order of component placement, common feeder placement, etc. for each group.

  Thereafter, the process proceeds to step 202, and the number of the multi-chip boards 11 of each group is input to the control device of the electronic component mounting line. Then, the process proceeds to step 203, and the multi-chip boards 11 grouped are grouped. Carry into the electronic component mounting line.

  Thereafter, the process proceeds to step 204, where the group mark 14 of the first (first) multi-chip substrate 11 of each group is image-recognized, and the number and position of defective blocks in the group are read. Then, the defective block of the multi-chip substrate 11 of each group is skipped by the production program having a layer structure in which the component mounting order, the common feeder arrangement, etc. are optimized for each group, and the electronic component is mounted on each substrate block 12.

  For example, if group 1 is “N1”, group 2 is “N2”, and group 3 is “N3”, the multi-chip board 11 of group 1 is first loaded into the electronic component mounting line and is optimal for group 1 The electronic program is mounted on the “N1” multi-chip board 11 with the optimized program, and then the multi-chip board 11 of group 2 is carried into the electronic component mounting line, and the program optimized for group 2 is used. The electronic components are mounted on the “N2” multi-chip substrate 11, and then the multi-chip substrate 11 of group 3 is loaded into the electronic component mounting line, and “N3” of the program is optimized for group 3. Electronic components are mounted on the multi-chip substrate 11.

  It should be noted that when an electronic component is mounted by skipping the defective block of the multi-cavity board 11 having a defective block using the production program optimized for the multi-cavity board 11 having no defective block, Compared with the case where electronic components are mounted by skipping bad blocks using a layer structure production program optimized in consideration of the former, there is a bad block for the group whose cycle time is shorter in the former. However, electronic components may be mounted using a production program optimized for the multi-chip substrate 11 having no defective blocks.

  After all the components are mounted, the process proceeds to step 206, where each board block 12 of the multi-chip board 11 is divided to classify the non-defective board block 12 and the defective block. Note that it is also possible to monitor whether or not the group has been switched by recognizing the group marks 14 of all the multi-chip substrates 11 of each group. In this way, it is possible to omit the operation (step 202) of inputting the number of the multi-chip substrates 11 of each group to the control device of the electronic component mounting line.

  According to the present embodiment described above, the multi-cavity boards 11 grouped according to the number and position of defective blocks are carried into the electronic component mounting line for each group, and the component mounting order for each group. In the production program with the optimized layer structure, the electronic component mounting line is operated to skip the defective block of the multi-piece board 11 and mount the electronic parts on each board block 12. The process of recognizing the number and position of defective blocks for each substrate 11 can be omitted, and the production efficiency of component mounting on the multi-device substrate 11 including defective blocks can be improved. Moreover, since the number and position of the defective blocks of the multi-chip substrate 11 are the same for each group, the component mounting time per one multi-chip substrate 11 can be made the same for each group, and the schedule It is possible to easily predict the time until the component mounting on the multi-chip substrate 11 is completed, and it is easy to make a production plan. In addition, if the number and position of the defective blocks of the multi-chip substrate 11 are the same for each group, it is easy to sort the non-defective substrate blocks 12 and defective blocks after component mounting. In addition, if a production program having a layer structure in which the order of component placement is optimized for each group is used, there is an advantage that it is not necessary to switch the production program for each group, and the production program switching time can be shortened.

  In this embodiment, different groups are classified for each combination of the number and position of defective blocks. However, in order to reduce the number of groups, grouping is performed only by the number of defective blocks per multi-chip substrate. You may make it do. If the number of defective blocks per multi-chip board is the same for each group, the component mounting time per multi-chip board can be made substantially the same for each group, and a large number of planned blocks It is possible to easily predict the time until component mounting on the take-off board is completed, and it is easy to make a production plan.

  Further, in this embodiment, the block skip mark 13 is provided for each substrate block 12 of the multi-chip substrate 11, but the block skip mark 13 for each substrate block 12 is omitted and the multi-chip substrate 11 is omitted. The group mark 14 may be written with information on the number and position of defective blocks, and the group mark 14 may be recognized so as to read the group information and information on the number and position of defective blocks. Further, the group mark 14 may be constituted by a bar code label, an electronic tag or the like.

  11 ... Multi-chip substrate, 12 ... Board block, 13 ... Block skip mark, 14 ... Group mark

Claims (3)

In an electronic component mounting method for a multi-chip substrate, an electronic component is mounted on each board block of the multi-chip board in which a plurality of board blocks that are finally divided into a plurality of circuit boards are formed integrally. ,
A multi-chip board having no defective block (hereinafter referred to as “defective block”) is sorted into one group from a large number of multi-chip boards, and a multi-chip board including a defective block is defective per one board. The process of sorting into different groups for each number of blocks,
The grouped multi-piece boards are transferred to the electronic component mounting line for each group, and the electronic component mounting line is operated with a production program adapted for each group to skip defective blocks on the multi-piece board. And mounting electronic components on each substrate block. A method for mounting electronic components on a multi-chip substrate, comprising: In an electronic component mounting method for a multi-chip substrate, an electronic component is mounted on each board block of the multi-chip board in which a plurality of board blocks that are finally divided into a plurality of circuit boards are formed integrally. ,
Obtain a multi-chip substrate that has been sorted into different groups for each group of multi-block substrates that do not have defective substrate blocks (hereinafter referred to as “defective blocks”) and defective blocks per multi-chip substrate,
The grouped multi-unit board is carried into the electronic component mounting line for each group, and the electronic component mounting line is operated with a production program adapted to each group to skip defective blocks on the multi-unit board. A method for mounting electronic components on a multi-chip substrate, wherein electronic components are mounted on each substrate block.   3. The method of mounting electronic components on a multi-cavity board according to claim 1 or 2, wherein the number of defective blocks per multi-cavity board and the group of the defective blocks are classified into different groups.

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