JP2011215305A - Optical communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical communication module that facilitates positioning of a photoelectric element such as a laser diode or photodiode.SOLUTION: A positioning projection portion 16 is molded integrally with a base 10 in which a conductive plate 30 is buried, and a positioning recess portion 23 is provided to the photodiode 20 to position the photodiode 20 relative to the base 10 by engagement between the positioning projection portion 16 and positioning recess portion 23. The positioning projection portion 16 is substantially in a shape of a trapezoid of a quadrangular pyramid having outer peripheral surfaces 16a with a predetermined inclination angle, and the positioning recess portion 23 is in a shape having inner peripheral surfaces 23a with an inclination angle corresponding to the outer peripheral surfaces 16a. A light-receiving portion of the photodiode 20 is provided on a bottom surface 23b of the positioning recess portion 23, and the base 10 is molded out of a translucent synthetic resin. Further, a first lens surface 14 is provided to a top surface 16b of the positioning projection portion 16.

Description

  The present invention relates to an optical communication module in which photoelectric elements such as a laser diode and / or a photodiode for optical communication are packaged.

  Conventionally, optical communication using an optical fiber or the like has been widely used. In optical communication, an electrical signal is converted into an optical signal by a photoelectric element such as a laser diode, the optical signal is transmitted and received via an optical fiber, and the received optical signal is converted into an electrical signal by a photoelectric element such as a photodiode. Is done by. For this reason, optical communication modules are widely used in which photoelectric elements such as laser diodes and / or photodiodes are configured as one package together with peripheral circuit elements for operating the photoelectric elements. This optical communication module is called OSA (Optical Sub-Assembly). In recent years, various inventions related to optical communication and optical communication modules have been made.

  For example, in Patent Document 1, a photoelectric element that transmits or receives an optical signal, a stem for fixing the photoelectric element, a cap for covering the photoelectric element, an electric signal applied to the photoelectric element, or from the photoelectric element A plurality of leads for transmitting electrical signals, and a plane portion is provided at one end of a predetermined lead located in a package constituted by a stem and a cap, and one end is connected to the photoelectric element on the plane portion. There has been proposed an optical-electrical conversion module that is excellent in high-frequency characteristics and can be miniaturized by providing an electric circuit component whose end is connected to a lead.

  An optical fiber for performing optical communication includes a core through which light passes and a cladding that covers the periphery of the optical fiber and confines light. The optical fiber is composed of a core and cladding such as HPCF (Hard Polymer Clad Fiber) in which a quartz glass core is covered with a high-strength plastic cladding, and AGF (All silica Glass Fiber) in which the core and cladding are composed of quartz glass. There are various types depending on the material, and it is selected in consideration of the communication speed and cost. HPCF used for relatively low-speed optical communication has a core diameter of about 200 μm, and AGF used for high-speed optical communication has a core diameter of about several μm to several tens of μm. On the other hand, the size of the light emitting portion of the laser diode is about several μm to several tens of μm, and the size of the light receiving portion of the photodiode is about several tens of μm. For this reason, the AGF having a small core diameter needs to be aligned (aligned) with the light emitting portion of the laser diode or the light receiving portion of the photodiode.

JP 2005-167189 A

  An optical communication module having a photoelectric element such as a laser diode or a photodiode needs to be assembled with high accuracy in order to perform alignment with an optical fiber with high accuracy and perform communication with high accuracy. In the photoelectric conversion module described in Patent Document 1, it is necessary to fix the photoelectric element to the stem with high accuracy, and it is necessary to attach the cap on which the lens is provided to the stem with high accuracy.

  Since the optical communication module is composed of relatively small parts, it is not easy to position and assemble these parts with high accuracy. In order to perform positioning with high accuracy, it is necessary to use an expensive device in the process of assembling the optical communication module, and there is a problem that much work time is required even if these devices are used.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an optical communication module capable of easily positioning a photoelectric element such as a laser diode or a photodiode. is there.

  The optical communication module according to the present invention has a polyhedral shape including a connection surface provided with a connection terminal portion for connecting to other members and inputting / outputting an electric signal, and from an optical signal to an electric signal or from an electric signal to an optical signal. A photoelectric element that performs conversion into a conductor, a conductor to which the photoelectric element is connected via the connection terminal portion, and a resin that is molded, and the conductor is embedded so that a connection portion with the photoelectric element is exposed. A resin mold body, a positioning convex portion protruding from the resin mold body and having a tapered truncated cone shape or a substantially polygonal truncated cone shape at the protruding end, and a concave projection formed on the connection surface of the photoelectric element. A positioning recess having an inclined inner peripheral surface corresponding to the outer peripheral surface of the portion, and the photoelectric element is configured to contact the outer peripheral surface of the positioning convex portion with the inner peripheral surface of the positioning recess, Embedded in the resin mold body Characterized in that is connected to the conductor.

  Further, in the optical communication module according to the present invention, the photoelectric element is provided with a light receiving portion for receiving an optical signal or a light emitting portion for emitting an optical signal at an inner back surface of the positioning recess, and the resin mold body is transparent. It is characterized by being molded with a light-sensitive resin.

  The optical communication module according to the present invention further includes a lens surface provided on a protruding end surface of the positioning convex portion.

  The optical communication module according to the present invention is characterized in that a height of the positioning convex portion and a depth of the positioning concave portion coincide with each other.

In the present invention, a positioning convex portion is provided in a resin mold body in which a conductor to which a photoelectric element is connected is embedded, a positioning concave portion is provided in the photoelectric element, and the resin molding body is engaged with the positioning convex portion and the positioning concave portion. The photoelectric element is positioned. The positioning convex portion has a substantially truncated cone shape or a substantially polygonal frustum shape that is tapered toward the protruding end, and has an outer peripheral surface with a predetermined inclination angle. The positioning concave portion has a shape having an inclined inner peripheral surface corresponding to the outer peripheral surface of the positioning convex portion.
Thus, by mounting the photoelectric element on the resin mold body so that the positioning convex portion is accommodated in the positioning concave portion, the outer peripheral surface of the positioning convex portion and the inner peripheral surface of the positioning concave portion are brought into contact, and the photoelectric element with respect to the resin mold body Is uniquely determined. In other words, since the self-alignment structure in which the photoelectric element is automatically positioned can be obtained, the work related to the positioning of the photoelectric element can be facilitated.

  Moreover, in this invention, the light-receiving part or light emission part of a photoelectric element is provided in the inner back surface (bottom surface) of a positioning recessed part. In this configuration, when the photoelectric element is mounted on the resin mold body, the light receiving part or the light emitting part of the photoelectric element faces the positioning convex part. By molding the resin mold body with a translucent synthetic resin, the light receiving portion or the light emitting portion of the photoelectric element can receive or emit an optical signal through the resin mold body.

  Moreover, in this invention, when the light-receiving part or light emission part of a photoelectric element is provided in the bottom face of a positioning recessed part, a lens surface is provided in the protrusion end surface of a positioning convex part. Thereby, the light receiving part or light emitting part of the photoelectric element is provided so as to face the lens surface, and the light can be condensed to the light receiving part by the lens surface or the light from the light emitting part can be condensed to the outside by the lens surface. .

  Further, in the present invention, the height of the positioning convex portion and the depth of the positioning concave portion are matched. Thus, when the photoelectric element is mounted on the resin mold body, the protruding end surface of the positioning convex part and the bottom surface of the positioning concave part abut, and the photoelectric element is positioned with respect to the resin mold body also in the height direction of the positioning convex part. Can do.

  In the case of the present invention, a substantially convex truncated cone-shaped or substantially polygonal frustum-shaped positioning convex portion is provided on the resin mold body at the protruding end, and the shape has an inclined inner peripheral surface and bottom surface corresponding to the outer peripheral surface of the positioning convex portion. The optical communication module is assembled by positioning the photoelectric element with respect to the resin mold body by providing the positioning concave part of the photoelectric element in the photoelectric element and bringing the outer peripheral surface of the positioning convex part into contact with the inner peripheral surface of the positioning concave part. Since the positioning operation of the photoelectric element can be easily performed in the process, the manufacturing cost of the optical communication module can be reduced.

It is typical sectional drawing which shows the structure of the optical communication module which concerns on this invention. It is a typical top view which shows the structure of the electrically conductive board with which OSA is provided. It is typical sectional drawing which shows the structure of the positioning convex part of the optical communication module which concerns on this invention, and a positioning recessed part. It is a schematic diagram which shows the structure of the positioning convex part of the optical communication module which concerns on this invention, and a positioning recessed part. It is a typical sectional view showing the composition of the optical communication module concerning modification 1 of the present invention. It is typical sectional drawing which shows the structure of the optical communication module which concerns on the modification 2 of this invention. It is a typical sectional view showing composition of a positioning convex part and a positioning concave part of an optical communication module concerning modification 3 of the present invention.

  Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof. FIG. 1 is a schematic cross-sectional view showing a configuration of an optical communication module according to the present invention. In the figure, reference numeral 1 denotes an OSA in which a photodiode (photoelectric element) 20 is packaged, and corresponds to an optical communication module according to the present invention. The OSA 1 is connected to an optical communication line (not shown) such as an optical fiber, receives an optical signal emitted from another device via the optical communication line, and receives the optical signal as an electrical signal. It is a part for optical communication that is converted into and output.

  The OSA 1 includes a base (resin molded body) 10 having a substantially square shape in plan view, and the base 10 is resin-molded with a light-transmitting synthetic resin. The OSA 1 has a photodiode 20 mounted on one side surface (upper surface in FIG. 1) of the base 10 and a cylindrical portion 11 for connecting an optical communication line on the opposite side (lower side). . On the upper surface of the base 10, a peripheral wall portion 12 is provided over the circumference of the peripheral portion, and the upper surface of the base 10 and the peripheral wall portion 12 constitute a recess 12 a that accommodates the photodiode 20.

  The photodiode 20 has a plate shape that is substantially square in plan view. As will be described in detail later, on the lower surface (connection surface) of the photodiode 20, a light receiving portion 22 that detects light and converts it into an electrical signal is provided in the positioning recess 23. The connection terminal portion 21 is provided. The connection terminal portion 21 is a terminal for inputting / outputting an electric signal to / from the photodiode 20 and for connecting to the conductive plate (conductor) 30 via solder or a conductive adhesive. It is. A terminal connected to the conductive plate 30 via a metal wire 35 is provided on the upper surface of the photodiode 20.

  A conductive plate 30 made of metal is embedded and held in the base 10 of the OSA 1 so that one surface thereof is exposed in the recess 12a. In the conductive plate 30, the connection terminal portion 21 of the photodiode 20 is connected to an exposed portion in the recess 12a using solder or a conductive adhesive, or a terminal provided on the upper surface of the photodiode 20 or the like. It is connected via a wire 35 and is used for transmitting and receiving electrical signals between the photodiode 20 and the outside. In other words, the conductive plate 30 corresponds to a wiring for connecting circuit components in the receiving circuit using the photodiode 20.

  FIG. 2 is a schematic plan view showing the configuration of the conductive plate 30 included in the OSA 1, in which the outer shape of the base 10 is superimposed on the shape of the conductive plate 30 in a top view with broken lines. In the illustrated example, OSA1 includes three conductive plates 30a to 30c. The first conductive plate 30 a has a substantially rectangular shape, and one end portion in the longitudinal direction is arranged at the center of the base 10, and the other end portion is provided to extend to the outside of the base 10. The first conductive plate 30 a is formed with a substantially square opening 31 at a portion corresponding to the center of the base 10, and the photodiode 20 is soldered or conductive at the peripheral portion of the opening 31 of the first conductive plate 30. The connecting terminal portion 21 is connected via the adhesive.

  The second conductive plate 30b has a substantially rectangular shape, and is arranged side by side with the first conductive plate 30a so that one end portion thereof extends to the outside of the base 10. The second conductive plate 30 b is connected to a terminal provided on the upper surface of the photodiode 20 via a wire 35. The third conductive plate 30c is substantially U-shaped and is disposed so as to surround a portion of the first conductive plate 30a to which the photodiode 20 is connected, and one end portion thereof extends to the outside of the base 10. ing. The third conductive plate 30c is connected to the ground potential, for example, and is used to shield the OSA1. The portions extending from the base 10 of the conductive plates 30a to 30c are used as terminals for connecting the OSA 1 and, for example, a circuit board of a communication device.

  A quadrangular frustum-shaped positioning convex portion 16 protrudes from the center of the upper surface of the base 10. Although details will be described later, the positioning convex portion 16 projects upward from the upper surface of the first conductive plate 30a through the opening 31 formed in the first conductive plate 30a, and a convex lens is formed on the projecting end surface. A surface 14 is formed. The positioning convex portion 14 is for defining the mounting position of the photodiode 20 with respect to the base 10 by engaging with the positioning concave portion 23 of the photodiode 20.

  A convex lens surface 15 is provided at the center of the lower surface of the base 10. The lens surface 15 is formed so that the optical axis substantially coincides with the lens 14 provided on the upper surface of the base 10. Accordingly, light can be transmitted from the lower side of the base 10 to the upper side through the transparent base 10 and the opening 31 of the conductive plate 30, and light from the lower side of the base 10 can be transmitted through the lens surface 15 and the lens surface 14. The light can be condensed on the light receiving portion 22 of the photodiode 20.

  The cylindrical portion 11 of the OSA 1 has a cylindrical shape and protrudes from the lower surface of the base 10 so as to surround the lens surface 15 provided on the lower surface of the base 10. The cylindrical portion 11 is formed so that its axis is substantially coincident with the optical axis of the lens surface 15. Moreover, the cylinder part 11 is the aspect which expanded the internal diameter by the side of a protrusion end stepwise, and can insert and fit an optical fiber in this protrusion end side. The cylindrical portion 11 is formed so that the center of the optical fiber substantially coincides with the optical axis of the lens surface 15 when the optical fiber is fitted.

  The base 10, the cylindrical portion 11, the peripheral wall portion 12, the first lens surface 14, the second lens surface 15 and the positioning convex portion 16 of the OSA 1 are integrally molded with a light-transmitting synthetic resin. For example, the integral molding can be performed by a so-called injection molding method in which a conductive plate 30 that has been processed into a desired shape in advance is placed in a mold and a liquid transparent resin is poured and cured. Since the synthetic resin constituting the base 10 and the cylindrical portion 11 can be selected regardless of the heat resistance performance of the photodiode 20, etc., the synthetic resin has high molding accuracy and hardly undergoes deformation due to the surrounding environment such as temperature change. A resin can be selected.

  The OSA 1 is provided with a lid 40 that is joined to the upper end of the peripheral wall 12 provided on the upper side of the base 10 and seals the recess 12a. The lid 40 has a plate shape that is substantially square in plan view, and is joined to the upper end of the peripheral wall 12 by a method such as ultrasonic welding or bonding with an adhesive. The lid 40 may be translucent or non-translucent, and may be formed of the same material as the base 10 and the peripheral wall portion 12, or may be formed of a different material. There may be. When the lid 40 is joined, a gas such as nitrogen gas or dry air may be sealed in the recess 12a, and the recess 12a may be evacuated.

  FIG. 3 is a schematic cross-sectional view showing the configuration of the positioning convex portion 16 and the positioning concave portion 23 of the optical communication module according to the present invention, and enlarges the periphery of the photodiode 20 of the OSA 1 and the opening 31 of the conductive plate 30. It is illustrated. FIG. 4 is a schematic diagram showing the configuration of the positioning convex portion 16 and the positioning concave portion 23 of the optical communication module according to the present invention. FIG. 4A shows the configuration of the photodiode 20 in a bottom view, and FIG. A configuration of the periphery of the convex portion 16 in a top view is shown.

  The positioning convex part 16 integrally molded with the base 10 is provided so as to protrude upward through the opening 31 of the conductive plate 30 at the approximate center of the upper surface of the base 10 in the recess 12a. The positioning convex portion 16 has a substantially square frustum shape having a substantially square shape having a size substantially the same as that of the opening 31 of the conductive plate 30 in a plan view and a protruding end side having a tapered shape. The positioning convex portion 16 has an outer peripheral surface 16a composed of four side surfaces that are tapered and inclined at a predetermined angle, and a substantially square top surface 16b, and a first lens at a substantially center of the top surface 16b. A surface 14 is formed.

  The positioning recess 23 formed in the photodiode 20 is a recess that narrows from the substantially square opening to the back, and has a tapered inner peripheral surface 23a that is inclined at substantially the same angle as the outer peripheral surface 16a of the positioning convex portion 16; And a substantially square bottom surface 23b. The size of the opening of the positioning concave portion 23 is smaller than or substantially the same as the opening 31 of the conductive plate 30, that is, smaller than or substantially the same as the size of the square of the positioning convex portion 16 in plan view. A light receiving portion 22 for receiving an optical signal is provided at substantially the center of the bottom surface 23b.

  The size (area or length of one side) of the bottom surface 23 b of the positioning concave portion 23 is smaller than the top surface 16 b of the positioning convex portion 16. The depth of the positioning recess 23 (the vertical length from the bottom surface of the connection terminal portion 21 to the bottom surface 23b in FIG. 3) is the height of the positioning projection 16 (from the top surface of the conductive plate 30 to the top surface 16b in FIG. 3). (Vertical length up to) deeper (longer) or similar.

  The photodiode 20 is mounted on the upper surface of the base 10 so that the positioning convex portion 16 of the base 10 fits in the positioning concave portion 23 of the photodiode 20. At this time, since the outer peripheral surface 16a of the positioning convex portion 16 and the inner peripheral surface 23a of the positioning concave portion 23 have substantially the same inclination angle, they are in contact with each other. Further, since the top surface 16b of the positioning convex portion 16 is larger than the bottom surface 23b of the positioning recess 23, the top surface 16b and the bottom surface 23b are not in contact with each other, and the top surface 16b and the bottom surface 23b face each other with a predetermined distance therebetween.

  In addition, since the opening size of the positioning recess 23 is smaller than or substantially the same as the square size of the positioning projection 16 in plan view, when the photodiode 20 is mounted on the base 10, the connection terminal portion 21 of the photodiode 20 There may be a case where a gap is formed between the lower surface and the upper surface of the conductive plate 30 provided on the base 10. Therefore, the connection terminal portion 21 and the conductive plate 30 are filled with solder or a conductive adhesive to ensure electrical connection between the connection terminal portion 21 and the conductive plate 30.

  The photodiode 20 is mounted on the base 10 with the outer peripheral surface 16a of the positioning convex portion 16 and the inner peripheral surface 23a of the positioning concave portion 23 in contact with each other, so that the center of the positioning convex portion 16 and the center of the positioning concave portion 23 are Are approximately the same. That is, the center of the first lens surface 14 formed at the center of the top surface 16 b of the positioning convex part 16 and the center of the light receiving part 22 provided at the center of the bottom surface 23 b of the positioning concave part 23 substantially coincide. Therefore, in the manufacturing process of the OSA 1, the center of the light receiving unit 22 and the first lens surface 14 is simply mounted on the base 10 without performing positioning work (alignment work) of the photodiode 20 with respect to the base 10. Can be substantially matched.

  In the OSA 1 having the above-described configuration, the positioning protrusion 16 is integrally formed on the base 10 in which the conductive plate 30 is embedded, the positioning recess 23 is provided in the photodiode 20, and the base 20 is engaged by the engagement of the positioning protrusion 16 and the positioning recess 23. In this configuration, the photodiode 20 is positioned with respect to 10. The positioning convex portion 16 has a substantially quadrangular pyramid shape having an outer peripheral surface 16a having a predetermined inclination angle, and the positioning concave portion 23 has an inner peripheral surface 23a having an inclination angle corresponding to the outer peripheral surface 16a. Thus, by mounting the photodiode 20 on the base 10 so that the positioning convex portion 16 is accommodated in the positioning concave portion 23a, the outer peripheral surface 16a of the positioning convex portion 16 and the inner peripheral surface 23a of the positioning concave portion 23 abut, The position of the photodiode 20 with respect to the base 10 is uniquely determined. That is, since the self-alignment structure in which the positioning of the photodiode 20 is automatically performed can be achieved, the work related to the positioning of the photodiode 20 can be facilitated in the manufacturing process of the OSA1.

  Further, by providing the light receiving portion 22 of the photodiode 20 on the bottom surface 23b of the positioning recess 23 and molding the base 10 with a light-transmitting synthetic resin, the photodiode 20 transmits the light signal through the light-transmitting base 10. Can be received. Furthermore, by providing the first lens surface 14 on the top surface 16b of the positioning convex portion 16, the light receiving portion 22 of the photodiode 20 and the first lens surface 14 can be arranged opposite to collect light. Since the centers of the positioning convex portion 16 and the positioning concave portion 23 substantially coincide with each other by engagement, the center of the light receiving portion 22 and the center of the first lens surface 14 can be substantially coincided with each other.

  In the present embodiment, the positioning convex portion 16 of the base 10 has a substantially quadrangular pyramid shape, but is not limited thereto, and may be a polygonal frustum shape such as a triangular frustum shape or a pentagonal frustum shape, A truncated cone may be used. Similarly, the shape of the positioning recess 23 of the photodiode 20 may be another shape, and the shape can be determined corresponding to the shape of the positioning protrusion 16. The positioning recess 23 may be formed using a micromachining technique such as etching.

  In addition, although the OSA 1 includes the photodiode 20 as a photoelectric element to receive light, the present invention is not limited to this, and a configuration in which a laser diode is provided as a photoelectric element to emit light may be used. Moreover, although OSA1 was set as the structure provided with one photoelectric element in the recess 12a, it is not restricted to this, It is good also as a structure provided with a some photoelectric element. In this case, by mounting both photodiodes and laser diodes, the OSA can emit and receive light, and can transmit and receive optical signals.

  In addition, although the first lens surface 14 is provided on the top surface 16b of the positioning convex portion 16, the configuration is not limited to this, and a configuration in which no lens surface is provided may be employed. Even in such a configuration, the top surface 16b of the positioning convex portion 16 and the bottom surface 23b of the positioning concave portion 23 provided with the light receiving portion 22 are made as close as possible to each other, so that the translucent base 10 and the light receiving portion 22 are separated. The optical path between them can be shortened, and the optical signal reception accuracy can be improved.

  In addition, the configuration of the conductive plate 30 (30a to 30c) illustrated in FIG. 2 is an example and is not limited thereto. In addition, the terminal on the upper surface of the photodiode 20 and the conductive plate 30 are connected by the wire 35. However, the present invention is not limited to this, and a plurality of connection terminal portions 21 are provided on the lower surface of the photodiode 20. Alternatively, the connection by the wire 35 may not be performed.

(Modification 1)
FIG. 5 is a schematic cross-sectional view showing a configuration of an optical communication module according to Modification 1 of the present invention. The OSA 1 according to the embodiment shown in FIG. 1 and the like described above is equipped with the photodiode 20 having a configuration in which the connection terminal portion 21 and the light receiving portion 22 are both provided on the lower side, but is not limited thereto. . The OSA 1a according to the modified example 1 is configured to mount the photodiode 25 in which the connection terminal portion 21 and the light receiving portion 22 are provided on opposite surfaces.

  The photodiode 25 of the OSA 1a according to the modified example 1 has a plate shape having a substantially square shape in plan view, and a light receiving unit 22 is provided on the upper surface thereof at a substantially central position, and a wire 35 is provided at a predetermined position around the light receiving unit 22. A terminal connected to the conductive plate 30 is provided. In addition, a positioning recess 23 is formed substantially at the center of the lower surface (connection surface) of the photodiode 25, and an annular connection terminal portion 21 is provided therearound.

  The base 10a of the OSA 1a according to the modified example 1 has a substantially square shape in plan view and is molded from a non-transparent synthetic resin. A conductive plate 30 is embedded in the upper portion of the base 10a with its upper surface exposed, and the connection terminal portion 21 of the photodiode 25 is connected and fixed to the exposed portion of the conductive plate 30 using solder or a conductive adhesive. Is done. Further, a positioning convex portion 16 is integrally formed at the approximate center of the upper surface of the base 10 a so as to protrude upward through an opening 31 formed in the conductive plate 30.

  The configuration of the positioning convex portion 16 and the positioning concave portion 23 of the OSA 1a according to the modification 1 is the same as that of the OSA 1 of the embodiment shown in FIGS. Therefore, by mounting the photodiode 25 on the base 10a so that the positioning convex portion 16 is accommodated in the positioning concave portion 23a, the outer peripheral surface 16a of the positioning convex portion 16 and the inner peripheral surface 23a of the positioning concave portion 23 come into contact with each other. Since the position of the photodiode 25 with respect to 10a is uniquely determined, the work related to the positioning of the photodiode 25 in the manufacturing process of the OSA 1a can be facilitated.

(Modification 2)
FIG. 6 is a schematic cross-sectional view showing a configuration of an optical communication module according to Modification 2 of the present invention. As described above, the OSA 1 according to the embodiment shown in FIGS. 1 to 4 and the OSA 1a according to the modification 1 shown in FIG. 5 have a configuration in which the conductive plate 30 is directly embedded in the base 10 or 10a. However, it is not limited to this. OSA1b which concerns on the modification 2 is the structure which embedded the printed circuit board 39 with which the conductor 38 was provided in the surface at the base 10b. The printed circuit board 39 and the conductor 38 are formed with an opening 31 for allowing the positioning convex portion 16 to protrude above the base 10b.

  Even in the OSA 1b according to the modified example 2 having such a configuration, the photodiode 25 is mounted on the base 10b so that the positioning convex portion 16 is accommodated in the positioning concave portion 23a, similarly to the OSA 1a according to the modified example 1 described above. Thus, the outer peripheral surface 16a of the positioning convex portion 16 and the inner peripheral surface 23a of the positioning concave portion 23 come into contact with each other, and the position of the photodiode 25 with respect to the base 10b is uniquely determined. Therefore, the positioning of the photodiode 25 is performed in the manufacturing process of the OSA 1a. The work which concerns on can be made easy.

(Modification 3)
FIG. 7 is a schematic cross-sectional view illustrating the configuration of the positioning convex portion 16 and the positioning concave portion 23 of the optical communication module according to the third modification of the present invention, and shows the photodiode 25 and the conductive plate 30 of the OSA 1c according to the third modification. The periphery of the opening 31 and the like is enlarged and illustrated. As described above, in the OSA 1 according to the embodiment shown in FIGS. 1 to 4, when the photodiode 20 is mounted on the base 10, the top surface 16 b of the positioning convex portion 16 and the bottom surface 23 b of the positioning concave portion 23 are Although it is configured to face each other with a predetermined distance, the present invention is not limited to this. The OSA 1c according to the modified example 3 has a configuration in which the top surface 16b of the positioning convex portion 16 and the bottom surface 23b of the positioning concave portion 23 are in close contact with each other when the photodiode 25 is mounted on the base 10c.

  In the OSA 1c according to the modification 3, the top surface 16b of the positioning convex portion 16 provided on the base 10c and the bottom surface 23b of the positioning concave portion 23 formed on the lower surface of the photodiode 25 are approximately the same size. Further, the size of the positioning convex portion 16 in a plan view is substantially the same as the size of the opening portion of the positioning concave portion 23. Furthermore, the height of the positioning convex portion 16 (the length from the upper surface of the conductive plate 30 to the top surface 16b of the positioning convex portion 16) and the depth of the positioning concave portion 23 (from the lower surface of the connection terminal portion 21 to the positioning concave portion 23). The length to the bottom surface 23b is substantially the same.

  Thereby, the positioning convex portion 16 of the base 10c is accommodated in the positioning concave portion 23 of the photodiode 25 without excess and shortage, and the outer peripheral surface 16a of the positioning convex portion 16 and the inner peripheral surface 23a of the positioning concave portion 23 abut, The top surface 16b of the positioning convex part 16 and the bottom surface 23b of the positioning concave part 23 abut. Therefore, the photodiode 25 can be positioned not only in the horizontal direction with respect to the upper surface of the base 10c but also in the vertical direction by the engagement of the positioning convex part 16 and the positioning concave part 23. Therefore, in the manufacturing process of the OSA 1c, Work related to positioning of the diode 25 can be facilitated.

1, 1a, 1b, 1c OSA (optical communication module)
10, 10a, 10b, 10c Base (resin mold body)
DESCRIPTION OF SYMBOLS 11 Tube part 12 Peripheral wall part 12a Concave 14 1st lens surface 15 2nd lens surface 16 Positioning convex part 16a Outer surface 16b Top surface 20 Photodiode (photoelectric element)
21 Connection terminal part 22 Light receiving part 23 Positioning recessed part 23a Inner peripheral surface 23b Bottom face (inner back face)
25 Photodiode 30, 30a-30c Conductive plate (conductor)
31 opening 35 wire 38 conductor 39 printed circuit board 40 lid

Claims (4)

A polyhedral shape including a connection surface provided with a connection terminal portion that performs connection with other members and input / output of an electric signal, and a photoelectric element that converts an optical signal into an electric signal or an electric signal into an optical signal,
A conductor to which the photoelectric element is connected via the connection terminal portion;
A resin molded body in which the conductor is embedded so that a connection portion with the photoelectric element is exposed,
A positioning convex part that protrudes from the resin mold body and has a substantially truncated cone shape or a substantially truncated cone shape that is tapered toward the protruding end;
A positioning recess recessed in the connection surface of the photoelectric element and having an inclined inner peripheral surface corresponding to the outer peripheral surface of the positioning convex portion, and
In the photoelectric element, an inner peripheral surface of the positioning concave portion is brought into contact with an outer peripheral surface of the positioning convex portion, and the connection terminal portion is connected to the conductor embedded in the resin mold body. Optical communication module. In the photoelectric element, a light receiving portion that receives an optical signal or a light emitting portion that emits an optical signal is provided on the inner back surface of the positioning recess,
The optical communication module according to claim 1, wherein the resin mold body is molded from a translucent resin. The optical communication module according to claim 2, further comprising a lens surface provided on a protruding end surface of the positioning convex portion. The optical communication module according to claim 1, wherein a height of the positioning convex portion and a depth of the positioning concave portion coincide with each other.

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