JP2011210844A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability by preventing a failure, such as warpage, from easily occurring in machining.SOLUTION: A circuit element packaging unit of chip diodes D1, D2 is disposed in a linearly symmetric position with the center line Y of a light-emitting element packaging unit as an axis of symmetry, a circuit element packaging unit of a resistor R is disposed on the center line Y. Thus, a lead frame 5 is formed in a linearly symmetric shape with the center line as an axis of symmetry. The light-emitting element packaging unit and a plurality of circuit element packaging units are arranged, therefore, in balance to a conductive material 2, thus preventing a failure such as warpage, from easily occurring in punching of a metal plate, and hence improving reliability of a light-emitting device.

Description

  The present invention relates to a light emitting device.

  In recent years, light-emitting devices using light-emitting diodes are becoming popular in place of existing incandescent bulbs. Patent Document 1 includes an LED assembly in which a chip-shaped light-emitting diode and a current-limiting chip resistor are mounted on a three-dimensional molded circuit board in which a metal plate is insert-molded on an insulating base made of a synthetic resin material. A light emitting device is described.

  Patent Document 2 describes a light-emitting device (light bulb) including a full-wave rectifier composed of a diode bridge in order to increase the light emission efficiency when connected to an AC power supply.

Japanese Patent Laying-Open No. 2003-212039 (see paragraph 0014, FIG. 4) JP 2003-151306 A

  By the way, the three-dimensionally molded circuit board is usually formed by simultaneously molding (insert molding) an insulating base on a lead frame punched from a metal plate and cutting off unnecessary portions. Here, the lead frame is formed with a plurality of mounting portions on which light emitting elements and circuit elements are mounted. If the plurality of mounting parts are arranged so as to be offset from the lead frame, the force applied to the metal plate during the punching process is also offset, so that problems such as warping of the lead frame are likely to occur. And there is a possibility that the reliability of the light emitting device may be reduced due to a defect occurring in the lead frame.

  The present invention has been made in view of the above problems, and an object of the present invention is to improve reliability.

  The light-emitting device of the present invention comprises a conductor made of a conductive material, a light-emitting element mounting portion provided on the conductor and mounted with a light-emitting element, and a light-emitting circuit of the light-emitting element provided on the conductor. A plurality of circuit element mounting portions each mounted with a plurality of circuit element mounting portions, and the conductor is arranged symmetrically about the center line of the light emitting element mounting portion. It is characterized by being provided.

  In this light-emitting device, it is preferable that the two conductor element mounting portions are arranged in line symmetry with respect to the center line of the light-emitting element mounting portion as the symmetry axis.

  In this light-emitting device, the circuit element includes a chip diode having two diodes connected in series, and the conductor includes two circuit element mounting portions on which the chip diode is mounted, respectively. It is preferable that the mounting portion is arranged in line symmetry with the center line as the axis of symmetry.

  In this light-emitting device, the circuit element includes a current-limiting resistor, and the conductor includes the circuit element mounting portion on which the resistor is mounted on a center line of the light-emitting element mounting portion. preferable.

  In the light emitting device, it is preferable that the circuit element mounting portion has different resistors mounted on the front surface and the back surface.

  In the light emitting device, it is preferable that the light emitting element mounting portion and the circuit element mounting portion are arranged on the same plane in the conductor.

  In the light-emitting device of the present invention, since the light-emitting element mounting portion and the plurality of circuit element mounting portions are arranged with a good balance with respect to the conductor, problems such as warpage are less likely to occur during processing, and reliability is improved. There is an effect that can be.

It is a perspective view of a lead frame in an embodiment of the present invention. It is a perspective view of the light source block in the same as the above. It is a front view of the light source block in the same as the above. It is a top view of the light source block in the same as the above. It is a left view of the light source block in the same as the above. It is a front view of the conductor in the same as the above. It is a front view of the lead frame and light source block in the same as the above. It is a rear view of the lead frame and light source block in the same as the above. It is a left view of the lead frame and light source block in the same as the above. It is a perspective view of a nozzle | cap | die in the same as the above. It is a perspective view of the lens cap in the same as the above. It is a perspective view of the light source block and nozzle | cap | die in the same as the above. It is a perspective view same as the above.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, in the following description, the vertical and horizontal directions and the front and rear directions are defined in FIG.

  The light emitting device of this embodiment is configured as a light bulb shown in FIG. 13, and a light source block A described later is accommodated in a base 100 and a lens cap (optical member) 110.

  As shown in FIGS. 2 to 5, the light source block A includes a support 1 made of a synthetic resin molding having insulating properties, a conductor 2 that is simultaneously molded on the support 1, and a light emission provided on the conductor 2. A light emitting element (light emitting diode) 3 mounted on the element mounting portion, and a circuit element (current limiting chip resistor R, chip diodes D1 and D2) mounted on the circuit element mounting portion similarly provided on the conductor 2 It has.

  The conductor 2 is composed of six conductive portions 20 to 25 as shown in FIG. The pair of conductive parts 20 and 21 arranged in the upper stage are in a mirror image relationship with each other, the wide terminal pieces 20a and 21a, the arm pieces 20b and 21b extending upward from the outside of the terminal pieces 20a and 21a, and the arm pieces It has substantially bowl-shaped terminal pieces 20c, 21c extending in the left-right direction from the upper ends of 20b, 21b. The arm pieces 20b and 21b are provided with bent portions 20d and 21d, and the arm pieces 20b and 21b are bent rearward substantially at a right angle in the bent portions 20d and 21d (see FIG. 5). And the cathode and anode of the light emitting element 3 are soldered to a pair of terminal pieces 20c and 21c. That is, in this embodiment, the light emitting element mounting part is comprised by the pair of terminal pieces 20c and 21c.

  The pair of conductive portions 22 and 23 disposed on the left and right sides of the middle stage are also mirror images of each other, and are substantially projecting outward from the lower ends of the strip-shaped terminal pieces 22a and 23a and the terminal pieces 22a and 23a. It has trapezoidal conductive pieces 22b and 23b. In addition, the conductive portion 24 arranged at the center of the middle stage is formed in a substantially letter E shape by a pair of upper and lower terminal pieces 24a and 24b and a central piece 24c connecting the two terminal pieces 24a and 24b. Then, three terminals (described later) of the chip diode D1 are soldered to the terminal piece 20a of the conductive part 20, the terminal piece 22a of the conductive part 22 and the terminal piece 24a of the conductive part 24, respectively. Three terminals of the chip diode D2 are soldered to the terminal piece 23a of the conductive part 23 and the terminal piece 24a of the conductive part 24, respectively. That is, in the present embodiment, the circuit element mounting portions for the chip diodes D1 and D2 are configured by the terminal pieces 20a, 21a, 22a, 23a, and 24a. Here, in the chip diodes D1 and D2, two diodes are connected in series in the forward direction, a terminal connected to the cathode of one diode, a terminal connected to the anode of the other diode, and the anode of one diode And a terminal commonly connected to the cathode of the other diode. These two chip diodes D1 and D2 are respectively mounted on the circuit element mounting portion to form a diode bridge (full wave rectifier).

  The conductive portion 25 arranged in the lower stage is formed in a substantially T-shape with a strip-shaped terminal piece 25a and a terminal piece 25b suspended downward from the center of the terminal piece 25a. Then, the two terminals of the chip resistor R are soldered to the terminal piece 24b of the conductive part 24 and the terminal piece 25a of the conductive part 25, respectively. That is, in this embodiment, the circuit element mounting portion for the chip resistor R is configured by the terminal piece 24b and the terminal piece 25a. A substantially hemispherical center electrode 4 is attached to the tip (lower end) of the terminal piece 25b.

  As shown in FIGS. 2 to 5, the support body 1 includes first to fourth support portions 10 to 13, a base fitting portion 14, and an optical member fitting portion 15. The first support portion 10 is formed in a substantially cylindrical shape and supports the middle three conductive portions 22 to 24. Note that the conductive pieces 22b and 23b of the conductive portions 22 and 23 are exposed on the peripheral surface of the first support portion 10 (see FIG. 5).

  The second support portion 11 is formed in a substantially square shape and is suspended from the lower surface of the first support portion 10 to support one lower conductive portion 25. The terminal pieces 24 b and 25 a are exposed inside the second support portion 11. Therefore, the chip resistor R is soldered to the two terminal pieces 24b and 25a and mounted on the circuit element mounting portion in a state of being accommodated inside the second support portion 11 (see FIGS. 2 and 3).

  The third support portion 12 is formed in a substantially U-shape and protrudes from the upper surface of the first support portion 10 to support the terminal pieces 20a and 21a and the arm pieces 20b and 21b in the upper two conductive portions 20 and 21. ing. The third support part 12 is provided with a pair of left and right window holes 12a, 12a, and terminal pieces 20a, 22a, 24a and terminal pieces 21a, 23a, 24a constituting circuit element mounting parts for the chip diodes D1, D2. Are exposed in the respective window holes 12a, 12a (see FIG. 3). Therefore, the chip diode D1 is soldered to the terminal pieces 20a, 22a, and 24a and mounted on the circuit element mounting portion while being housed inside the one window hole 12a, and is housed inside the other window hole 12a. Thus, the chip diode D2 is soldered to the terminal pieces 21a, 23a, 24a and mounted on the circuit element mounting portion (see FIG. 3). In addition, the 1st support part 10, the 2nd support part 11, and the 3rd support part 12 are integrally formed as a synthetic resin molding.

  The fourth support portion 13 is formed in a flat and substantially prismatic shape, and supports the pair of terminal pieces 20 c and 21 c in the two conductive portions 20 and 21. A rectangular window hole 13a is opened at the center of the fourth support portion 13, and the terminal pieces 20c and 21c are exposed in the window hole 13a. In the light emitting element 3, a light emitting diode chip (not shown) is accommodated in a rectangular parallelepiped package 30, and light is emitted from a circular emission hole 31 provided in the center of the upper surface of the package 30. A pair of terminals (not shown) are exposed so as to straddle the side surface from the lower surface of the package 30. Therefore, the light emitting element 3 is mounted on the light emitting element mounting portion by soldering the pair of terminals to the terminal pieces 20c and 21c in a state of being accommodated inside the window hole 13a (see FIG. 4).

  The base fitting portion 14 is formed in a substantially prismatic shape and is suspended from the left and right sides of the second support portion 11 on the lower surface of the first support portion 10 (see FIGS. 2 and 5). The optical member fitting portion 15 is formed in a substantially prismatic shape and protrudes in the front-rear direction from the left and right ends of the third support portion 12 on the upper surface of the first support portion 10 (see FIGS. 2 and 4).

  Here, the support 1 in the present embodiment is formed in a line-symmetric shape with the optical axis of the light-emitting element 3 (the center line S of the light-emitting element mounting portion) as the axis of symmetry (see FIG. 3).

  The base 100 has a substantially cylindrical large-diameter portion 101, a small-diameter portion 102 that is also substantially cylindrical, has a diameter smaller than that of the large-diameter portion 101, and is provided below the large-diameter portion 101, and both ends open. And a truncated cone part 103 provided on the lower side of the small diameter part 102. The large diameter portion 101, the small diameter portion 102, and the truncated cone portion 103 are integrally formed by processing a metal plate. And the lower part from the 1st support part 10 of the light source block A is inserted in the nozzle | cap | die 100, and the nozzle | cap | die fitting parts 14 and 14 of the support body 1 and the large diameter part 101 of the nozzle | cap | die 100 are fitted. The light source block A and the base 100 are combined (see FIG. 12). At this time, the center electrode 4 of the light source block A projects from the lower opening of the truncated cone part 103 of the base 100. Further, the pair of conductive pieces 22b and 23b exposed on the peripheral surface of the first support portion 10 are in elastic contact with the inner peripheral surface of the large-diameter portion 101, and the conductive portions 22 and 23 and the base 100 connect the conductive pieces 22b and 23b. Electrically connected.

  As shown in FIG. 11, the lens cap 110, which is an optical member, is formed in a bottomed cylindrical shape from a synthetic resin material having translucency. And the upper part from the 1st support part 10 of the light source block A is inserted in the lens cap 110, and the optical member fitting parts 15 and 15 of the support body 1 and the peripheral wall of the lens cap 110 are fitted, The light source block A and the lens cap 110 are combined to complete the light bulb (see FIG. 13).

  Next, with reference to FIGS. 1 and 7 to 9, a method for manufacturing the light emitting device of the present embodiment will be described.

  The manufacturing method of this embodiment includes a first step of forming a lead frame 5 including the conductor 2, a second step of simultaneously molding (insert molding) the support 1 on the lead frame 5, and a light emitting element of the conductor 2. A third step of mounting the light emitting element 3 on the mounting portion and mounting a circuit element (chip resistor R and chip diodes D1, D2) on the circuit element mounting portion; a fourth step of separating the conductor 2 from the lead frame 5; A fifth step of changing the posture of the light emitting element 3 by bending the bent portions 20d and 21d provided on the arm pieces 20b and 21b of the conductor 2, and attaching the base 100 and the lens cap 110 to the light source block A as described above. And a sixth step.

  As shown in FIG. 1, the lead frame 5 includes a rectangular frame-shaped frame portion 50 and a plurality of holding portions 51 to 58 that hold the conductive portions 20 to 25. The holding parts 51 and 52 connect the arm pieces 20 b and 21 b and the frame part 50 to hold the conductive parts 20 and 21. The holding portion 53 holds the conductive portion 25 by connecting the terminal piece 25 b and the frame portion 50. The holding part 54 holds the conductive part 24 by connecting the terminal piece 24b and the terminal piece 25a. The holding parts 55 and 56 hold the conductive parts 20, 21 and 24 by connecting the terminal pieces 24 a and the terminal pieces 20 a and 20 b. The holding part 57 holds the conductive part 22 by connecting the terminal piece 22a and the terminal piece 24a. The holding part 58 holds the conductive part 23 by connecting the terminal piece 23a and the terminal piece 24a. Here, as shown in FIG. 1, the circuit element mounting portions of the chip diodes D1 and D2 are arranged in line-symmetrical positions with the center line of the light emitting element mounting portion (the one-dotted line a in FIG. 1) as the symmetry axis, and the resistance R The circuit element mounting portion is arranged on the center line A. Thereby, the lead frame 5 in the present embodiment is formed in a line-symmetric shape with the center line A as the axis of symmetry. The center line A is a straight line passing between the terminal piece 20c and the terminal piece 21c, the center of the central piece 24c of the conductive portion 24, and the center of the terminal piece 25b of the conductive portion 25.

  In the first step, the lead frame 5 is formed by punching a metal plate. In this embodiment, the lead frame 5 is formed in a line-symmetric shape with the center line A of the light-emitting element mounting portion as the axis of symmetry, so that the light-emitting element mounting portion and the plurality of circuit element mounting portions are formed on the conductor 2. On the other hand, it is arranged with good balance. Therefore, problems such as warping are less likely to occur when the metal plate is punched. As a result, the reliability of the light emitting device can be improved.

  In the second step, the support 1 is formed simultaneously with the conductor 2 while being held by the holding portions 51 to 58 of the lead frame 5. Subsequently, in the third step, the light emitting element 3 is mounted on the light emitting element mounting portion of the conductor 2 by reflow soldering, which is well known in the art, and the circuit elements (chip resistor R and chip diodes D1, D2 are mounted on the circuit element mounting portion). ) Is mounted (see FIGS. 7 to 9). Here, in the third step, the light emitting element mounting portion (terminal pieces 20c, 21c of the conductive portions 20, 21), the circuit element mounting portion (terminal pieces 20a, 21a of the conductive portions 20, 21 and the conductive portions 22, 23). The terminal pieces 22a and 23a, the terminal pieces 24a and 24b of the conductive portion 24, and the terminal pieces 25a of the conductive portion 25 are on the same plane. For this reason, there exists an advantage that the operation | work which mounts the light emitting element 3 and a circuit element (chip resistance R and chip diode D1, D2) in each mounting part is easy.

  In the fourth step, the conductor 2 is separated from the lead frame 5 and the conductive portions 20 to 25 are separated from each other by cutting all the connecting portions of the holding portions 51 to 58 and the conductive portions 20 to 25. Further, in the fifth step, the light source block A is formed by changing the posture of the light emitting element 3 by bending the bent portions 20d and 21d provided on the arm pieces 20b and 21b of the conductor 2 substantially at a right angle. In the sixth step, the base 100 and the lens cap 110 are coupled to the light source block A as already described.

  By the way, in the light emitting device of this embodiment, the base 100 and the center electrode 4 are connected to an AC power source via a lamp socket, and the AC current supplied from the AC power source is limited by a resistor R, and then a full wave is generated by a diode bridge. The light is rectified and flows to the light emitting element 3. Here, instead of the current limiting resistor R, if a parallel circuit of two resistors R ′ and R ′ is connected to the input side of the diode bridge, the current flowing through the resistor R ′ per one is reduced, and the resistor R ′. , R ′ can be reduced. As described above, when a parallel circuit of two resistors R ′ and R ′ is provided instead of the current limiting resistor R, both sides (front and rear in FIG. 2) of the circuit element mounting portion including the terminal piece 24b and the terminal piece 25a are provided. One resistor R ′ and one R ′ may be mounted. However, the resistance values of the resistors R ′ and R ′ constituting the parallel circuit are different from the resistance value of one resistor R.

2 Conductor 5 Lead frame 20-25 Conductive part 50 Frame part 51-58 Holding part

Claims (6)

A conductor made of a conductive material, a light emitting element mounting portion provided on the conductor and mounted with a light emitting element, and a plurality of circuit elements provided on the conductor and constituting a light emitting circuit of the light emitting element, respectively A plurality of circuit element mounting parts to be mounted;
The light emitting device according to claim 1, wherein the plurality of circuit element mounting portions are arranged symmetrically with respect to a center line of the light emitting element mounting portion as an axis of symmetry.   2. The light emitting device according to claim 1, wherein the conductor includes two circuit element mounting portions arranged symmetrically with respect to a center line of the light emitting element mounting portion. The circuit element includes a chip diode having two diodes connected in series,
2. The conductor according to claim 1, wherein the two circuit element mounting portions on which the chip diodes are mounted are arranged symmetrically with respect to the center line of the light emitting element mounting portion. 2. The light emitting device according to 2. The circuit element includes a current limiting resistor,
4. The light emitting device according to claim 2, wherein the circuit element mounting portion on which the resistor is mounted is disposed on a center line of the light emitting element mounting portion.   The light emitting device according to claim 4, wherein the circuit element mounting portion has different resistors mounted on a front surface and a back surface.   4. The light emitting device according to claim 2, wherein the light emitting element mounting portion and the circuit element mounting portion are arranged on the same plane.

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