JP2011204820A - Semiconductor device, semiconductor wafer, and its power supply control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of accurately controlling a power supply circuit without increasing the cost of an external measuring device in a semiconductor device having a power supply structure.SOLUTION: The semiconductor device comprises a main circuit, power supply wiring, a wireless circuit for receiving a wireless signal and outputting a control signal, a first power supply circuit connected to the power supply wiring and the main circuit and to control the state of power supply to the main circuit based on the control signal from the wireless circuit, and a second power supply circuit connected to the power supply wiring and the wireless circuit to control the state of power supply to the wireless circuit.

Description

  The present invention relates to a semiconductor device, a semiconductor wafer, and a power supply control method thereof, and more particularly to a semiconductor device, a semiconductor wafer, a power supply control method thereof, and a semiconductor wafer provided with a power supply structure.

  With the miniaturization of electronic circuit manufacturing technology and the high integration of elements, the functions of an electronic circuit mounted on one semiconductor device have become complicated. The main circuit portion of the electronic circuit having these functions needs to perform an accurate logic operation. Therefore, it is necessary to stably supply power to the main circuit unit.

  As a method for stably supplying power to the main circuit unit, a technique for controlling the power supplied from the power supply wiring to the main circuit unit with a control circuit is known. One example thereof is described in Patent Document 1.

  A semiconductor device described in Patent Document 1 includes a power supply wiring that supplies power from outside during the burn-in mode, a signal pad that supplies power from outside during wafer testing, a power supply circuit that supplies power to the main circuit unit, and a power supply circuit And a detection circuit for outputting a control signal. When the detection circuit detects a change in the external power supply, it outputs a control signal to the power supply circuit. The power supply circuit turns on / off the power supply of the main circuit unit based on a control signal from the detection circuit. With this operation, power supply to the main circuit unit is controlled.

  On the other hand, Patent Document 2 describes a semiconductor device that receives a control signal using a wireless connection. This semiconductor device includes a transmission / reception circuit that outputs a control signal received by wireless connection to a power supply circuit, and a power supply circuit for operating a logic circuit based on the control signal. With this configuration, the power switch to the logic circuit is controlled using a control signal by wireless connection.

Japanese Patent Laid-Open No. 11-354721 (FIG. 6) JP2009-207129A (FIG. 1)

  In the semiconductor device described in Patent Document 1, it is necessary to supply some signal from an external device to the power supply circuit in order to arbitrarily turn on and off the main circuit unit. However, when a signal is supplied from an external device, it is necessary to connect the power supply circuit and the external device using a cable, a plug, a probe needle, or the like, and there is a problem that the cost of the external measuring device increases.

  Therefore, in order to reduce the cost of the external measurement device, it is conceivable to transmit and receive control signals using a wireless connection. That is, in the semiconductor device described in Patent Document 1, a control signal from the outside is received by wireless connection using the wireless circuit unit that receives the wireless signal described in Patent Document 2. By using the wireless signal, it is possible to reduce the number of channels of the inspection apparatus as the external measurement apparatus, the number of needles of the probe card, and the like, and the cost of the external measurement apparatus can be reduced.

  However, in the semiconductor device having such a configuration, the radio circuit unit and the main circuit unit share the same power supply wiring unit, so that the radio circuit unit is affected by the power supply noise generated by the operation of the main circuit unit. There was a problem of causing malfunction. In particular, since the radio circuit unit handles very weak signals, it is extremely sensitive to noise as compared to other circuit units, and has a high possibility of malfunction.

  The related semiconductor device has a problem that it is difficult to accurately control the power supply circuit without increasing the cost of the external measuring device.

  An object of the present invention is to provide a semiconductor device that solves the problem that it is difficult to accurately control a power supply circuit without increasing the cost of an external measuring device in a semiconductor device having the above-described power supply structure. It is to provide.

  The semiconductor device of the present invention includes a main circuit unit, a power supply wiring unit, a radio circuit unit that receives a radio signal and outputs a control signal, and a control signal from the radio circuit unit that is connected to the power supply wiring unit and the main circuit unit. A first power supply circuit unit that controls the power supply state to the main circuit unit, and a second power supply circuit unit that is connected to the power supply wiring unit and the radio circuit unit and controls the power supply state to the radio circuit unit And have.

  The semiconductor device of the present invention has a plurality of semiconductor circuit units and a common power supply wiring unit, and each of the plurality of semiconductor circuit units receives a radio signal and outputs a control signal with the main circuit unit. A wireless circuit unit, a first power supply circuit unit connected to the common power supply wiring unit and the main circuit unit, and controlling a power supply state to the main circuit unit based on a control signal from the wireless circuit unit, and a common power supply wiring unit And a second power supply circuit unit that is connected to the wireless circuit unit and controls a power supply state to the wireless circuit unit.

  In the semiconductor device power supply method of the present invention, the first power supply voltage is supplied to the power supply wiring portion that supplies power to the main circuit portion and the wireless circuit portion, and the wireless circuit portion is supplied based on the first power supply voltage. A method for controlling a power supply of a semiconductor device, wherein a power supply state of the main circuit unit is controlled based on a wireless signal acquired by the wireless circuit unit by setting the wireless circuit unit to an operating state by controlling a power supply state of

  According to the semiconductor device of the present invention, the power supply circuit can be accurately controlled without increasing the cost of the external measuring device.

It is a block diagram which shows the structure of the semiconductor device of 1st embodiment by this invention. 3 is a timing chart showing an operation of the semiconductor device according to the first embodiment of the present invention. It is a block diagram which shows the structure of another semiconductor device of 1st embodiment by this invention. It is a timing chart which shows operation | movement of another semiconductor device of 1st embodiment by this invention. It is a block diagram which shows the structure of another semiconductor device of 1st embodiment by this invention. It is a block diagram which shows the structure of another semiconductor device of 1st embodiment by this invention. It is a block diagram which shows the structure of the semiconductor device of 2nd embodiment by this invention. It is a block diagram which shows the structure of another semiconductor device of 2nd embodiment by this invention. It is a block diagram which shows the structure of another semiconductor device of 2nd embodiment by this invention. It is a block diagram which shows the structure of the semiconductor device of 3rd embodiment by this invention. It is a block diagram which shows the structure of another semiconductor device of 3rd embodiment by this invention. It is a block diagram which shows the structure of another semiconductor device of 3rd embodiment by this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

[First embodiment]
FIG. 1 is a block diagram showing the configuration of the semiconductor device according to the first embodiment of the present invention. In FIG. 1, the semiconductor device 1 includes a main circuit unit 11, a power supply wiring unit 12, a radio circuit unit 13, a first power supply circuit unit 14, and a second power supply circuit unit 15.

  When the voltage or current is applied to the power supply wiring unit 12, the second power supply circuit unit 15 is activated, and the second power supply circuit unit 15 starts applying voltage or current to the wireless circuit unit 13. The radio circuit unit 13 generates a control signal based on the received radio signal. This control signal is output to the first power supply circuit unit 14.

  The first power supply circuit unit 14 is connected to the main circuit unit 11, the power supply wiring unit 12, and the wireless circuit unit 13. The first power supply circuit unit 14 controls the power supply state from the power supply wiring unit 12 to the main circuit unit 11 based on the control signal from the wireless circuit unit 13.

  The second power supply circuit unit 15 controls the power supply state from the power supply wiring unit 12 to the wireless circuit unit 13 to be constant. As a result, malfunction of the radio circuit unit 13 due to the influence of noise from the power supply wiring unit 12 or the main circuit unit 11 can be avoided.

  Here, controlling the power supply state includes switching between a state in which a power supply potential is applied and a state in which the power supply is shut off (opened or opened), and also controls the power supply voltage with a certain degree of accuracy.

  In the semiconductor device of the present embodiment, compared with a semiconductor device that connects an external device with a cable or the like and receives a control signal, a wireless circuit and a power supply circuit that controls a power supply state of the wireless circuit are newly required. Since the parts of the measuring device can be reduced, the cost can be reduced as a result.

  Further, each circuit unit may be constituted by an individual semiconductor chip. In this case, by using a mounting technology such as SIP (System in Package), a cable or the like is unnecessary, and the apparatus cost can be reduced.

  FIG. 2 is an example of a timing chart showing the operation of the semiconductor device according to the first embodiment of the present invention. In FIG. 2, when the power supply voltage (VDD) is input to the power supply wiring section, the second power supply circuit section 15 connected to the power supply wiring section is activated and applies the power supply voltage (VDDa) to the wireless circuit section 13. . As a result, the wireless circuit unit 13 enters an operating state.

  The radio circuit unit 13 that has received the radio signal from the outside generates a control signal based on the radio signal. This control signal is output to the first power supply circuit unit 14. The first power supply circuit unit 14 supplies a power supply voltage (VDDb) to the main circuit unit 11 based on the control signal.

  Further, as shown in FIG. 3, the control circuit unit 31 may be connected between the wireless circuit unit 33 and the first power supply circuit unit 34. When receiving the radio signal, the radio circuit unit 33 outputs a first control signal to the control circuit unit 31.

  The control circuit unit 31 receives a voltage or current from the power supply wiring unit 32 and outputs a second control signal for controlling the power supply state to the main circuit unit 35 based on the first control signal from the radio circuit unit 33. Generated and output to the first power supply circuit unit 34. The first power supply circuit unit 34 controls the power supply state to the main circuit unit 35 based on the second control signal acquired from the control circuit unit 31.

  FIG. 4 is an example of a timing chart showing the operation of the semiconductor device 3 shown in FIG. In FIG. 4, when the power supply voltage (VDD) is input to the power supply wiring section 32, the second power supply circuit section 36 is activated and supplies the power supply voltage (VDDa) to the wireless circuit section 33.

  As a result, the radio circuit unit 33 enters an operating state, and when a radio signal is received, for example, a pulse signal is generated as a first control signal in accordance with the radio signal. The first control signal is output to the control circuit unit 31.

  The control circuit unit 31 generates a second control signal for supplying power to the main circuit unit 35 in synchronization with the rising edge of the first control signal, and outputs the second control signal to the first power circuit unit 34. The first power supply circuit unit 34 supplies a power supply voltage (VDDb) to the main circuit unit 35 based on the second control signal.

  Next, when a pulse signal as the first control signal is input to the control circuit unit 31, the control circuit unit 31 stops outputting the second control signal in synchronization with the rising edge of the first control signal. To do. At this time, the first power supply circuit unit 34 cuts off the power supply to the main circuit unit 35. By such a series of operations, the power supply state of the main circuit unit is controlled using a control signal by wireless connection.

  In general, the output of the wireless circuit unit immediately after the application of the power supply voltage is not necessarily in the off state, and the first power supply circuit 34 may be in the on state. Therefore, in the semiconductor device 1 shown in FIG. 1, it is necessary to reset the initial state of the wireless circuit unit to the off state. On the other hand, in the semiconductor device 3 shown in FIG. 3, the first power supply circuit unit 34 is not turned on unless the pulse signal as the first control signal is generated by providing the control circuit unit. The power supply voltage state of the power supply circuit unit 34 can be controlled more accurately.

  Further, since the voltage level of the output of the wireless circuit unit 33 and the operating voltage level of the first power supply circuit unit 34 are different, the leakage current increases due to signal transmission between different potentials in the configuration of the semiconductor device 1 shown in FIG. there's a possibility that. However, by providing the control circuit unit 31, the voltage level can be converted by the control circuit unit 31, and an increase in power due to a leakage current can be avoided. Although FIG. 3 shows a case where the control circuit unit is connected from the power supply wiring unit and power is supplied, power may be supplied from the wireless circuit unit.

  The first power supply circuit unit or the second power supply circuit unit of this embodiment includes a voltage level generation circuit unit that generates a reference voltage and a power supply voltage control unit for uniquely determining an output potential. The reference voltage may be input externally.

  FIG. 5 shows a semiconductor device 5 including a signal wiring portion 51 for applying a reference voltage to the first power supply circuit portion 52. By connecting the signal wiring part 51 to the first power supply circuit part 52, a reference voltage serving as a reference for determining the voltage level of the first power supply circuit part 52 can be applied from the outside.

  In FIG. 5, the signal wiring unit 51 is connected to the first power supply circuit unit 52, but may be connected to the second power supply circuit unit 53.

  Since the power supply potential of the main circuit section may be set to various values for voltage reduction or testing, the circuit area may increase if the voltage level generation circuit section is provided. On the other hand, as shown in FIG. 5, by arranging the signal wiring part 51 and connecting it to the first power circuit part 52, a reference voltage for determining the voltage level of the first power circuit part 52 is externally supplied. Can be applied. Therefore, the voltage level generation circuit unit having the high accuracy and wide voltage range of the first power supply circuit unit 52 becomes unnecessary. That is, the area of the first power supply circuit unit 52 can be reduced.

  On the other hand, since it is not always necessary to vary the power supply potential of the second power supply circuit unit connected to the radio circuit unit, for example, if the power supply configuration disclosed in Patent Document 2 (FIG. 1) is adopted, it is relatively simple. A small area power supply circuit can be configured. Therefore, it is not always necessary to supply the wireless circuit unit 55 with a high-accuracy and wide voltage range reference voltage from the signal wiring unit 51. However, by connecting the signal wiring part 51 to the second power supply circuit part 53, the voltage level generation circuit part of the second power supply circuit part 53 becomes unnecessary, so the area of the second power supply circuit part 53 is reduced. It becomes possible to do.

  Further, as shown in FIG. 6, a first signal wiring part 63 for applying a reference voltage to the first power supply circuit part 64 from the outside is connected to the first power supply circuit part 64, and further, a second signal is supplied from the outside to the second power supply circuit part 64. The second signal wiring unit 61 that applies a reference voltage to the power supply circuit unit 62 may be connected to the second power supply circuit unit 62. By providing the first signal wiring part 63 and the second signal wiring part 61, the voltage level generation circuit part of the first power circuit part 64 and the second power circuit part 62 becomes unnecessary.

  As a result, the areas of the first power supply circuit unit 64 and the second power supply circuit unit 62 can be reduced, and an increase in device cost due to an increase in the circuit area of the semiconductor device 1 can be further suppressed.

[Second Embodiment]
FIG. 7 is a block diagram showing the configuration of the semiconductor device according to the second embodiment of the present invention. In FIG. 7, the semiconductor device 7 has a plurality of semiconductor circuit portions 71.

  Each semiconductor circuit unit 71 includes a main circuit unit 73, a radio circuit unit 72, a first power circuit unit 76, and a second power circuit unit 75. The functions of these circuit units are the same as those in the first embodiment.

  The common power supply wiring section 74 is connected to the first power supply circuit section 76 and the second power supply circuit section 75 of each semiconductor circuit section 71. Here, although the common power supply wiring portion 74 is connected to a plurality of power supply circuit portions, all the power supply circuit portions of the semiconductor device 7 may be connected to the common power supply wiring portion 74, or some of the plurality of power supply circuit portions may be connected. These power supply circuit units may be connected to the common power supply wiring unit 74.

  The radio circuit unit 72 of each semiconductor circuit unit 71 receives power supply noise generated by the operation of the radio circuit unit 72 and the main circuit unit 73 of the peripheral semiconductor circuit unit through the common power supply wiring unit 74. For this reason, there is a problem in that the radio circuit unit cannot stably control the power supply, and the radio circuit unit 72 malfunctions.

  In the configuration of the present embodiment, the power supply voltage of the wireless circuit unit 72 is controlled to be constant by the second power supply circuit unit 75 of each semiconductor device. As a result, since a stable power supply voltage is applied to the radio circuit unit 72, malfunction of the radio circuit unit 72 due to the influence of noise from the common power supply wiring unit 74 and the main circuit unit 73 can be avoided. That is, the reception sensitivity of the radio circuit unit 72 can be increased.

  FIG. 8 shows each semiconductor circuit unit 85 including a common signal wiring unit 81 for applying a reference voltage to the first power supply circuit unit 82. By connecting the common signal wiring portion 81 to the first power supply circuit portion 82, a reference voltage that serves as a reference for determining the voltage level of the first power supply circuit portion 82 can be applied from the outside.

  This eliminates the need for the voltage level generation circuit unit having the high accuracy and wide voltage range of the first power supply circuit unit 82. That is, the area of the first power supply circuit portion 82 can be reduced.

  Although FIG. 8 shows the case where the common signal wiring portion 81 is connected to the first power supply circuit portion 82, the common signal wiring portion 81 may be connected to the second power supply circuit portion 84.

  By connecting the common signal wiring portion 81 to the second power supply circuit portion 84, the voltage level generation circuit portion of the second power supply circuit portion 84 becomes unnecessary, so the area of the second power supply circuit portion 84 is reduced. It becomes possible.

  Further, as shown in FIG. 9, a first common signal wiring portion 97 for applying a reference voltage to the first power supply circuit portion 93 from the outside is connected to the first power supply circuit portion 93, and further, the second from the outside A second common signal wiring portion 91 that applies a reference voltage to the power supply circuit portion 92 may be connected to the second power supply circuit portion 92. By providing the first common signal wiring section 97 and the second common signal wiring section 91, the voltage level generation circuit sections of the first power supply circuit section 93 and the second power supply circuit section 92 become unnecessary.

  As a result, the areas of the first power circuit section 93 and the second power circuit section 92 can be reduced, and an increase in device cost due to an increase in the area of the semiconductor circuit can be further suppressed.

[Third embodiment]
FIG. 10 is a block diagram showing the configuration of the semiconductor device according to the third embodiment of the present invention. In FIG. 10, the semiconductor device 10 is configured on a semiconductor wafer 100, and the semiconductor wafer 100 has a plurality of semiconductor chip regions 101.

  Each semiconductor chip region 101 includes a main circuit unit 103, a radio circuit unit 102, a first power circuit unit 106, and a second power circuit unit 105. The functions of these circuit units are the same as those in the first embodiment.

  The common power supply wiring section 104 is connected to the first power supply circuit section 106 and the second power supply circuit section 105 in each semiconductor chip region 101. Here, although the common power supply wiring unit 104 is connected to a plurality of power supply circuit units, all the power supply circuit units of the semiconductor device 100 may be connected to the common power supply wiring unit 104, or some of the plurality of power supply circuit units may be connected. These power supply circuit sections may be connected to the common power supply wiring section 104.

  The wireless circuit unit 102 in each semiconductor chip region 101 receives power supply noise generated by the operations of the wireless circuit unit 102 and the main circuit unit 103 in the peripheral chip region through the common power supply wiring unit 104. In addition, as the diameter of the semiconductor wafer 100 increases, the common power supply wiring portion 104 becomes longer, and the voltage applied to the circuit portion arranged away from the power supply point may decrease. Therefore, the voltage applied to the wireless circuit unit 102 is non-uniform depending on the distance from the voltage supply point. For this reason, there is a problem that the wireless circuit unit cannot stably control the power supply, and the wireless circuit unit 102 malfunctions.

  In the configuration of the present embodiment, the power supply voltage of the wireless circuit unit 102 is controlled to be constant by the second power supply circuit unit 105 in each semiconductor chip region. For this reason, in the semiconductor device 10 according to the present embodiment, even when the common power supply wiring portion 104 is provided on the semiconductor wafer 100, the power supply voltage can be stably controlled. As a result, since a stable power supply voltage is supplied to the wireless circuit unit 102, malfunction of the wireless circuit unit 102 due to the influence of noise from the common power supply wiring unit 104 and the main circuit unit 103 can be avoided.

  As shown in FIG. 11, each semiconductor chip region 116 may include a common signal wiring portion 111 for applying the voltage level of the first power supply circuit portion 112. By connecting the common signal wiring unit 111 to the first power supply circuit unit 112, a reference voltage for determining the voltage level of the first power supply circuit unit 112 can be applied from the outside.

  Therefore, the high-precision and wide-range voltage level generation function of the first power supply circuit unit 112 is not necessary. That is, the area of the first power supply circuit unit 112 can be reduced.

  In FIG. 11, the common signal wiring unit 111 is connected to the first power supply circuit unit 112, but may be connected to the second power supply circuit unit 114.

  By connecting the common signal wiring part 111 to the second power supply circuit part 114, the voltage level generation circuit part of the second power supply circuit part 114 becomes unnecessary, and thus the area of the second power supply circuit part 114 is reduced. It becomes possible.

  In addition, as shown in FIG. 12, a first common signal wiring portion 127 that applies a reference voltage to the first power supply circuit portion 123 from the outside is connected to the first power supply circuit portion 123, and further, a second from the outside. The second common signal wiring unit 121 that applies the reference voltage to the power supply circuit unit 122 may be connected to the second power supply circuit unit 122. By providing the first common signal wiring portion 127 and the second common signal wiring portion 121, the voltage level generation circuit portions of the first power supply circuit portion 123 and the second power supply circuit portion 122 become unnecessary.

  As a result, the areas of the first power supply circuit unit 123 and the second power supply circuit unit 122 can be reduced, and an increase in chip cost due to an increase in chip area can be further suppressed.

  The embodiment of the present invention has been described above, but the present invention is not limited to the above description, and various modifications can be made without departing from the scope of the invention.

1, 3, 5, 7, 9, 10 Semiconductor device 11, 35, 56, 66, 73, 83, 94, 103, 113, 124 Main circuit part 12, 32, 57, 67 Power supply wiring part 13, 33, 55 , 65, 72, 87, 92, 102, 117, 125 Wireless circuit unit 14, 34, 52, 64, 76, 82, 93, 106, 112, 123 First power circuit unit 15, 36, 53, 62, 75, 84, 95, 105, 114, 122 Second power supply circuit section 31 Control circuit section 51 Signal wiring section 61 Second signal wiring section 63 First signal wiring section 71, 85, 96 Semiconductor circuit sections 74, 89 , 94, 104, 119, 128 Common power supply wiring part 81, 111 Common signal wiring part 91, 121 Second common power supply wiring part 97, 127 First common signal wiring part 100, 110, 120 Semiconductor wafer 101, 116, 126 Semiconductor chip region

Claims (13)

A main circuit section;
Power supply wiring section;
A radio circuit unit for receiving a radio signal and outputting a control signal;
A first power supply circuit section connected to the power supply wiring section and the main circuit section, for controlling a power supply state to the main circuit section based on the control signal from the radio circuit section;
A semiconductor device comprising: a power supply wiring portion; and a second power supply circuit portion connected to the wireless circuit portion and controlling a power supply state to the wireless circuit portion. A control circuit unit connected to the wireless circuit unit and the first power supply circuit unit;
The radio circuit unit outputs the first control signal constituting the control signal based on the radio signal to the control circuit unit,
The control circuit unit outputs the second control signal constituting the control signal to the first power circuit unit based on the first control signal,
The semiconductor device according to claim 1, wherein the first power supply circuit unit controls a power supply state to the main circuit unit based on the second control signal. A plurality of semiconductor circuit portions and a common power supply wiring portion;
Each of the plurality of semiconductor circuit units is
A main circuit section;
A radio circuit unit for receiving a radio signal and outputting a control signal;
A first power supply circuit section connected to the common power supply wiring section and the main circuit section and controlling a power supply state to the main circuit section based on the control signal from the radio circuit section;
A semiconductor device comprising: the common power supply wiring section; and a second power supply circuit section that is connected to the wireless circuit section and controls a power supply state to the wireless circuit section. The semiconductor device according to claim 3, further comprising a common signal wiring portion that supplies a reference voltage to at least one of the first power supply circuit portion and the second power supply circuit portion. The semiconductor device according to claim 4, further comprising a common signal wiring portion that supplies a reference voltage to the plurality of first power supply circuit portions. A first common signal wiring section for supplying a first reference voltage to the first power supply circuit section;
The semiconductor device according to claim 3, further comprising: a second common signal wiring portion that supplies a second reference voltage to the second power supply circuit portion. A semiconductor wafer,
A semiconductor device according to any one of claims 3 to 6 is provided on the semiconductor wafer, the semiconductor wafer having a plurality of semiconductor chips,
The plurality of semiconductor circuit units are provided on the corresponding semiconductor chips,
A semiconductor wafer, wherein the common power supply wiring portion and the plurality of semiconductor chips are provided on the semiconductor wafer. Supply the first power supply voltage to the power supply wiring section that supplies power to the main circuit section and the radio circuit section,
By controlling the power supply state to the wireless circuit unit based on the first power supply voltage, the wireless circuit unit is in an operating state,
A power control method for a semiconductor device, wherein the power supply state to the main circuit unit is controlled based on a radio signal acquired by the radio circuit unit. 9. The power control method for a semiconductor device according to claim 8, wherein a control signal is generated from the radio signal, and a power supply state to the main circuit unit is controlled based on the control signal. 10. The semiconductor device according to claim 8, wherein a first reference voltage for a power supply voltage of the main circuit unit is acquired, and a power supply state to the main circuit unit is controlled based on the first reference voltage. Power control method. 11. The power supply of the semiconductor device according to claim 8, wherein a second reference voltage for a power supply voltage of the wireless circuit unit is acquired, and a power supply state to the wireless circuit unit is controlled based on the second reference voltage. Control method. 12. The power control method for a semiconductor device according to claim 9, wherein a power supply state to the main circuit unit is controlled in synchronization with a rising edge of the control signal. A first control signal is generated from the wireless signal, the second control signal having a voltage level different from that of the first control signal is generated based on the first control signal, and the second generation signal is generated. 9. The power control method for a semiconductor device according to claim 8, wherein a power supply state to the main circuit unit is controlled based on the control.

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