JP2011192676A5 - - Google Patents
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- Publication number
- JP2011192676A5 JP2011192676A5 JP2010055062A JP2010055062A JP2011192676A5 JP 2011192676 A5 JP2011192676 A5 JP 2011192676A5 JP 2010055062 A JP2010055062 A JP 2010055062A JP 2010055062 A JP2010055062 A JP 2010055062A JP 2011192676 A5 JP2011192676 A5 JP 2011192676A5
- Authority
- JP
- Japan
- Prior art keywords
- transfer arm
- substrate
- processing apparatus
- substrate processing
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010055062A JP2011192676A (ja) | 2010-03-11 | 2010-03-11 | 基板処理装置、積層半導体装置製造方法及び積層半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010055062A JP2011192676A (ja) | 2010-03-11 | 2010-03-11 | 基板処理装置、積層半導体装置製造方法及び積層半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011192676A JP2011192676A (ja) | 2011-09-29 |
JP2011192676A5 true JP2011192676A5 (de) | 2013-06-27 |
Family
ID=44797321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010055062A Pending JP2011192676A (ja) | 2010-03-11 | 2010-03-11 | 基板処理装置、積層半導体装置製造方法及び積層半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2011192676A (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102829722B (zh) * | 2012-08-29 | 2013-09-18 | 江苏建威电子科技有限公司 | 位置传感器 |
US9442482B2 (en) | 2013-04-29 | 2016-09-13 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
WO2016103292A1 (ja) * | 2014-12-22 | 2016-06-30 | 川崎重工業株式会社 | ロボットシステム及びエンドエフェクタの変形検出方法 |
CN106935538B (zh) * | 2015-12-30 | 2020-08-04 | 上海微电子装备(集团)股份有限公司 | 一种载片传输装置及其传输方法 |
KR102022804B1 (ko) * | 2017-11-02 | 2019-09-18 | 조재용 | 웨이퍼 이송용 로봇 감지장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10275753A (ja) * | 1997-03-31 | 1998-10-13 | Hitachi Ltd | 半導体基板の製造方法 |
JP2001127136A (ja) * | 1999-10-29 | 2001-05-11 | Applied Materials Inc | 基板搬送ロボットの検査装置 |
US6956489B2 (en) * | 2002-07-17 | 2005-10-18 | Mrl Industries | Heating element condition monitor |
JP2005051171A (ja) * | 2003-07-31 | 2005-02-24 | Applied Materials Inc | 基板処理装置 |
JP4899478B2 (ja) * | 2003-09-02 | 2012-03-21 | 株式会社ニコン | 保守管理装置、保守管理方法、保守管理プログラム、及び情報記録媒体 |
JP4835839B2 (ja) * | 2006-04-07 | 2011-12-14 | 株式会社安川電機 | 搬送用ロボットおよび搬送用ロボットの位置補正方法 |
JP2009123722A (ja) * | 2007-11-12 | 2009-06-04 | Dainippon Screen Mfg Co Ltd | 基板搬送装置 |
JP2009233788A (ja) * | 2008-03-27 | 2009-10-15 | Daihen Corp | 搬送用ロボットの制御方法 |
JP5417751B2 (ja) * | 2008-06-30 | 2014-02-19 | 株式会社ニコン | 接合装置および接合方法 |
-
2010
- 2010-03-11 JP JP2010055062A patent/JP2011192676A/ja active Pending
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