JP2011187740A - High-frequency package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency package for reducing leak of high-frequency signals. <P>SOLUTION: The high-frequency package 20 includes a substrate 1 loading, on the first surface thereof; a high-frequency oscillator for transmitting radio-waves; an annular pattern 2 formed surrounding the high-frequency oscillator; and a cover 3 soldered to the substrate with the solder deposited on the annular pattern 2; to cover the high-frequency oscillator. The annular pattern 2 forms at least in one place a gap portion; by separating the pattern in view of forming an air-ventilating hole to the solder and also includes a part having ordinary width as a first width and a part having expanded width as a second width which is wider than the first width provided at the location facing the gap portion. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a non-hermetic high-frequency package in which a substrate on which a high-frequency oscillation unit is mounted is sealed with a lid that is joined by solder, and more particularly to a high-frequency package in which a vent is formed in solder.

  Conventionally, by forming an annular pattern so as to surround the high-frequency oscillation unit on the substrate on which the high-frequency oscillation unit for transmitting radio waves is mounted, by joining the lid to the substrate with solder stacked on the annular pattern, A high-frequency package having a structure in which a high-frequency oscillation unit is sealed with a lid is known (for example, see Patent Document 1).

  In the high-frequency package having the above-described structure, the internal space in which the high-frequency oscillation unit is housed may be a non-airtight space without being airtight. When making a high-frequency package non-hermetic, it is necessary to provide minute ventilation holes that do not leak radio waves for the purpose of preventing condensation. Conventionally, a method has been proposed in which the vent hole is formed in solder for joining the substrate and the lid. According to this method, for example, one portion of the annular pattern is divided to form a void portion without a pattern locally. As a result, since no solder is placed in the gap, a minute air hole can be easily formed in a part of the solder that joins and seals the substrate and the lid.

JP 2009-010170 A

  However, in the method of forming a vent hole in the solder that joins the substrate and the lid, the solder fillet cannot be formed into an appropriate shape due to variations in the amount of solder applied, resulting in an increase in the size of the vent hole. there were. For this reason, conventionally, the amount of solder applied is strictly controlled so that the vent hole does not become large. However, due to manufacturing variations, there may be a case where the width of the vent hole inevitably increases. If the size of the vent hole is larger than a predetermined value, a high-frequency signal inside the high-frequency package leaks to the outside, and there is a problem that EMI characteristics deteriorate and system noise increases.

  The present invention has been made in view of the above, and it is possible to form a solder fillet in an appropriate shape and to leak a high-frequency signal by making the shape appropriate without increasing the size of the vent hole. An object of the present invention is to provide a high-frequency package that can reduce the frequency.

  In order to solve the above-described problems and achieve the object, a high-frequency package according to the present invention includes a substrate on which a high-frequency oscillation unit for transmitting radio waves is mounted on a first surface, and a high-frequency oscillation unit on a first surface of the substrate. An annular pattern formed so as to surround the substrate, solder placed on the annular pattern, and a lid that is joined to the first surface of the substrate by the solder and covers the high-frequency oscillation unit. The annular pattern passes through the solder. In order to form the pores, a void portion in which the pattern is divided is formed at least at one place, and the normal width portion having the first width and the width that is provided at a position facing the void portion are wider than the first width. It has the expansion width part made into the 2nd width, It is characterized by the above-mentioned.

  According to the present invention, by increasing the width of the annular pattern at the position facing the gap, the pattern area at the position facing the gap is increased, and the amount of solder on the pattern is sufficient for fillet formation. Therefore, the solder fillet has an appropriate shape, and the vent hole does not become large. Therefore, leakage of high frequency signals can be reduced.

FIG. 1 is an exploded perspective view of an embodiment of a high-frequency package according to the present invention. FIG. 2 is a cross-sectional view taken along plane A in FIG. FIG. 3 is a top view of an annular pattern in the vicinity of which the A plane of FIG. 1 intersects. FIG. 4 is a cross-sectional view of a conventional high-frequency package corresponding to FIG. FIG. 5 is a top view of an annular pattern corresponding to FIG. 3 of a conventional high-frequency package.

  Embodiments of a high-frequency package according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment)
FIG. 1 is an exploded perspective view of an embodiment of a high-frequency package according to the present invention. FIG. 2 is a cross-sectional view taken along plane A in FIG. FIG. 3 is a top view of an annular pattern in the vicinity of which the A plane of FIG. 1 intersects. In FIG. 1, the solder stacked on the annular pattern is omitted.

  The high-frequency package 20 of the present embodiment includes a substrate 1, an annular pattern 2 formed on the first surface of the substrate 1, solder 4 (FIG. 2) stacked on the annular pattern 2, and the solder 4. 1 has a metal lid (lid body) 3 joined to the first surface. A transmission / reception circuit (not shown) as a high-frequency amplifier that amplifies a high-frequency signal from the outside of the high-frequency oscillator is mounted at the center of the first surface of the substrate 1. A recess 3a is formed on the back surface of the metal lid 3 to avoid interference with the transmission / reception circuit. The annular pattern 2 is formed on the first surface of the substrate 1 at a position facing the outer peripheral edge of the metal lid 3 so as to surround the transmission / reception circuit. The annular pattern 2 is formed to deposit solder 4 for joining the metal lid 3.

  As shown in FIG. 2, the metal lid 3 is joined to the substrate 1 by solder 4 placed on the annular pattern 2 to form a generally closed space for accommodating the transmission / reception circuit inside the package. The solder 4 is provided with a minute ventilation hole 5 that does not leak radio waves for the purpose of preventing condensation.

  As shown in FIG. 3, in order to form the air holes 5 in the solder 4, the annular pattern 2 forms a gap portion 2 c where the pattern is divided at a predetermined position. In consideration of leakage of high-frequency signals to the outside, it is desirable that the formed air holes 5 be as small as possible. Therefore, the size of the gap 2c for forming the vent hole 5 (the length in the longitudinal direction of the annular pattern 2) is preferably as small as possible (short) as long as the vent hole 5 can be reliably formed. And two edge parts which oppose the space | gap part 2c are formed wider than the other part, and become the expansion width part 2b. That is, the annular pattern 2 includes a normal width portion 2a having a first width and an enlarged width portion 2b having a second width wider than the first width provided at a position facing the gap portion 2c. Has been.

  The enlarged width portion 2b provided at a position facing the gap portion 2c is widened by the same amount on both sides in the short direction with respect to the normal width portion 2a, and the normal width portion 2a is connected. It is generally T-shaped together with the location to be done. Therefore, the formed solder fillet has a symmetrical shape in the width direction.

  According to the high-frequency package 20 having such a configuration, the enlarged width portion 2b provided at a position facing the gap portion 2c is wider than the normal width portion 2a so as to be wide. Since the pattern area at the opposing position increases and the amount of solder placed on the pattern also increases, the solder fillet has an appropriate shape and the vent hole 5 does not increase.

  Further, since the enlarged width portion 2b facing the gap portion 2c and the normal width portion continuing to the enlarged width portion 2b are substantially T-shaped, the formed solder fillet is symmetrical in the width direction, and more appropriately Therefore, the vent hole 5 is not further enlarged.

  FIG. 4 is a cross-sectional view corresponding to FIG. 2 of a conventional high-frequency package shown for comparison. FIG. 5 is a top view of an annular pattern corresponding to FIG. 3 of the conventional high-frequency package, also shown for comparison. In the conventional high-frequency package 50, the conventional annular pattern 12 has the same width, including the portion facing the gap 2c. Therefore, due to variations in the amount of solder applied, the solder applied to the portion facing the gap 12c escapes to the opposite side of the gap 12c, or the amount of solder at the portion facing the gap 12c does not become a sufficient amount. Sometimes happened. For this reason, when the amount of solder near the gap 12c is reduced, the solder fillet formed is reduced, and the vent hole 15 formed in this part may be larger than expected, thereby leaking high-frequency signals. Has been regarded as a problem. According to the above embodiment, this problem can be solved as described above.

  As described above, the high-frequency package according to the present invention is useful when applied to a high-frequency package in which a substrate on which a high-frequency oscillation unit is mounted is sealed with a lid that is joined by solder. It is optimally applied to the non-hermetic type high frequency package to be formed.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Annular pattern 2a Normal width part 2b Enlarged width part 2c Cavity part 3 Metal lid (lid)
4 Solder 5 Vent 20 High frequency package

Claims (2)

A substrate on which a high-frequency oscillation unit for transmitting radio waves is mounted on a first surface;
An annular pattern formed on the first surface of the substrate so as to surround the high-frequency oscillating portion; and solder stacked on the annular pattern;
A lid that is bonded to the first surface of the substrate by the solder and covers the high-frequency oscillating portion; and the annular pattern is divided at least at one place in order to form a vent hole in the solder A normal width portion having a first width and an enlarged width portion having a second width wider than the first width provided at a position facing the gap portion, and forming a gap portion. High frequency package characterized by 2. The high-frequency package according to claim 1, wherein the enlarged width portion facing the gap and the normal width portion continuous with the enlarged width portion are substantially T-shaped.

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