JP4888433B2 - High frequency module - Google Patents

Description

  The present invention relates to a high-frequency module having a filter that suppresses unnecessary waves including harmonics generated from a high-power amplifier.

  Conventionally, as a technique for suppressing unnecessary waves output from an amplifier, a high-frequency module has a structure in which a band other than a desired wave is suppressed by inserting a band element filter (filter circuit) between the amplifier and an output terminal. There are some (see, for example, Patent Document 1). Some transceiver modules using such a high-frequency module are designed to prevent interference between modules such as an amplifier circuit by sealing or electromagnetic shielding plates (see, for example, Patent Documents 1 and 2).

  The band-pass filter used in the high-frequency module has a microstrip line having a side path (stub) formed on the dielectric substrate, and a cavity (groove portion) that is cut off in the used frequency band on the dielectric substrate. ) Is mounted (see, for example, Patent Document 3). In addition, the electromagnetic shielding gasket used in the high frequency module, when the case lid of the high frequency module is closed and tightened by the lid tightening portion, the electromagnetic shielding gasket is attached to the case main body and the case lid of the high frequency module. There is one that is in close contact with both of the body and conducting both, and electromagnetically shields the mating portion between the case main body and the case lid (for example, see Patent Document 4). Furthermore, the high frequency module is provided with a screw hole through which a screw is inserted in a substrate on which a lid (LID) and a microstrip line (microstrip antenna) are formed, and a metal base is formed by inserting the screw into this screw hole. There is one that fastens (joins together) a screw hole provided in a (motherboard) and fixes a lid and a substrate to a metal base (see, for example, Patent Document 5).

Japanese Patent Laying-Open No. 2005-311337 (FIGS. 6, 2, and 3)

Japanese Patent Laid-Open No. 2001-251206 (FIG. 1)

JP 2006-173792 A (FIG. 4)

JP 2000-124654 A (FIG. 2)

Japanese Patent Laid-Open No. 11-340414 (FIG. 5)

However, when a high-power amplifier is used in a high-frequency module, it is necessary to add a band element filter that suppresses unnecessary wave output because harmonics are output as unnecessary waves. When the suppression amount is increased with respect to the filter that suppresses the unnecessary wave, there is a problem that may lead to functional performance deterioration such as a decrease in the degree of freedom of design and an increase in the desired wave passage loss.

  Furthermore, the unnecessary wave suppressed by the band element filter is radiated, so that it can be coupled to the output terminal of the high frequency module through the space, and the performance of the unnecessary wave suppression amount designed by the band element filter alone cannot be secured. The band element filter having a large amount of unwanted wave suppression has a problem that the area becomes large.

  The present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a high-frequency module having a structure capable of ensuring isolation between a circuit for suppressing unnecessary radiation and a device on the module output side. .

  The high-frequency module according to the invention of claim 1 has a conductive casing having an opening on the upper surface and a lower surface serving as a metal base, a conductive lid for sealing the opening at the top of the casing, An amplifier circuit package mounted inside the housing and having an output part via an input part and a first filter circuit, an input signal line for supplying an input signal to the input part of the amplifier circuit package, and the amplifier circuit The amplifying circuit package amplifies an input signal from the input unit according to a bias line for supplying a bias to the package and a bias supplied from the bias line, and guides an output signal transmitted from the output unit. An output signal line; a dielectric substrate placed inside the housing that is a part of the output signal line and having a microstrip line; a carrier on which the dielectric substrate is placed; A second filter circuit with a conductor pattern of the microstrip line that suppresses unwanted waves from the amplifier circuit package, and is disposed on the second filter circuit, and blocks radiation waves from the second filter circuit; The microstrip line includes a cut-off block having a recess formed in a portion facing the conductor pattern.

  The high-frequency module according to the invention of claim 2 has a conductive casing having an opening on the upper surface and a lower surface serving as a metal base, a conductive lid for sealing the opening at the top of the casing, An amplifier circuit package mounted inside the housing and having an output part via an input part and a first filter circuit, an input signal line for supplying an input signal to the input part of the amplifier circuit package, and the amplifier circuit The amplifying circuit package amplifies an input signal from the input unit according to a bias line for supplying a bias to the package and a bias supplied from the bias line, and guides an output signal transmitted from the output unit. An output signal line; a dielectric substrate placed inside the housing that is a part of the output signal line and having a microstrip line; a carrier on which the dielectric substrate is placed; A second filter circuit based on the conductor pattern of the microstrip line that suppresses unnecessary waves from the amplifier circuit package, a cut-off block that blocks radiation waves from the second filter circuit, and a first filter formed on the carrier. A first hole, a carrier fixing member for fixing the carrier to the housing via the first hole, and a second hole formed in the carrier at a position different from the first hole. And the second hole, the third hole formed in the cut-off block, and the cut-off block to the carrier through the third hole and the second hole. A block fixing member to be fixed; a conductive packing for a block provided between the carrier and the cut-off block; and a guide for the cover portion provided between the lid and the cut-off block. It is characterized in that a sexual packing.

  A high-frequency module according to a third aspect of the present invention includes a conductive casing having an opening on an upper surface and a lower surface serving as a metal base, a conductive lid for sealing the upper opening of the casing, An amplifier circuit package mounted inside the housing and having an output part via an input part and a first filter circuit, an input signal line for supplying an input signal to the input part of the amplifier circuit package, and the amplifier circuit The amplifying circuit package amplifies an input signal from the input unit according to a bias line for supplying a bias to the package and a bias supplied from the bias line, and guides an output signal transmitted from the output unit. An output signal line; a dielectric substrate placed inside the housing that is a part of the output signal line and having a microstrip line; a carrier on which the dielectric substrate is placed; A second filter circuit with a conductor pattern of the microstrip line that suppresses unwanted waves from the amplifier circuit package, and is disposed on the second filter circuit, and blocks radiation waves from the second filter circuit; A cut-off block in which a recess is formed in a portion facing the conductor pattern of the microstrip line, a first hole formed in the carrier, and the carrier through the first hole. A carrier fixing member fixed to the body, a second hole formed in the carrier at a position different from the first hole, and the second hole formed in communication with the second hole to avoid the depression A third hole formed in the off-block, a block fixing member for fixing the cut-off block to the carrier via the third hole and the second hole, and the carrier A conductive packing for blocks provided between the cut-off block and a conductive packing for cover provided between the lid and the cut-off block are provided. is there.

  In the high-frequency module according to a fourth aspect of the present invention, a plurality of the conductive packings for the lid are arranged in a rod shape, and a space formed by the lid, the cut-off block, and the conductive packing for the lid is formed. 4. The device according to claim 2, wherein the space is operated as a blocking space for unnecessary waves from the amplifier circuit package. 5.

  The high-frequency module according to a fifth aspect of the present invention is the high-frequency module according to any one of the first to fourth aspects, wherein the cut-off block has a flange portion that extends to above the amplifier circuit package.

  A high-frequency module according to a sixth aspect of the present invention is the high-frequency module according to the fifth aspect, further comprising a flange-use conductive packing provided between the flange and the amplifier circuit package.

  As described above, according to the first to sixth aspects of the invention, by providing the first filter circuit in the amplifier circuit package and the second filter circuit outside the amplifier circuit package, the first filter circuit By suppressing unnecessary waves to some extent, it is possible to obtain a high-frequency module in which the second filter circuit can easily suppress unnecessary waves to a desired level.

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to FIGS. 1 is a configuration diagram of a high-frequency module according to Embodiment 1, FIG. 1 (a) is an external view of the high-frequency module, FIG. 1 (b) is an external view of the high-frequency module with a lid part removed, and FIG. FIG. 2 is an external view of the high-frequency module with the lid portion of the amplifier circuit package and the cutoff block of the second filter circuit removed, and FIG. 2 is a configuration diagram of the cutoff block of the high-frequency module according to the first embodiment. ) Is a top view of the cut-off block, FIG. 2B is an external view of the cut-off block of FIG. 2A viewed from the right arrow direction, and FIG. 2C is a cut-off block of FIG. FIG. 4 is a bottom view of the cut-off block (with the carrier including the dielectric substrate removed), and FIG. 3 shows the second embodiment of the amplifier circuit package of the high-frequency module according to the first embodiment and the second view. With filter circuit 1 to 3, 1 is a conductive casing of the high-frequency module, 2 is a conductive lid that seals the upper opening of the casing 1, and 3 is a lid 1 that covers the casing 1. 3a is a lid fixing screw hole into which the lid fixing screw 3 is inserted, 4 is an output terminal of the high-frequency module (the output terminal 4 is a coaxial connector described later in the drawing. The input terminal is omitted.) 5 is an amplifying circuit package placed inside the casing 1, 5a is an amplifying unit in the amplifying circuit package 5, and 5b is a DC power supply bias for supplying DC power to the amplifying unit 5a. Line 6 is an output part of the amplifier circuit package (the input part of the amplifier circuit package is omitted), 7 is an amplifier circuit package 5 amplifies the input signal from the input part according to the bias supplied from the bias line. , Output sent from the output unit 6 An output signal line that guides the signal (input signal line is omitted), 8 is a dielectric substrate on which a microstrip line is formed, which is placed inside the housing 1 which is a part of the output signal line 7, 9 is a carrier on which the dielectric substrate 8 is placed, 10 is a first filter circuit formed on the output unit 6 side after the amplification unit 5 a in the amplification circuit package 5, and 10 a is an unnecessary wave from the amplification circuit package 5. It can be said that the second filter circuit 10 is a part of the output signal line 7 by a conductor pattern (stub) of a microstrip line that suppresses. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  1 to 3, 11 is installed on the second filter circuit 10, blocks the radiated wave from the second filter circuit 10, and has a recess (described later) in a portion facing the conductor pattern of the microstrip line. ) Is formed, 12 is a carrier fixing screw hole (first hole) formed in the carrier 9, and 13 is a carrier that fixes the carrier 9 to the housing via the carrier fixing screw hole 12. A fixing screw (carrier fixing member) 14 is a cut-off block fixing screw hole (second hole) formed in the carrier 9 at a position different from the carrier fixing screw hole 12 (carrier fixing screw 13), 15 Is a block fixing screw hole (third hole portion) formed in the cut-off block so as to avoid the hollow portion, and 16 is for block fixing. Block fixing screws (block fixing members) for fixing the cut-off block 11 to the carrier 9 through the through holes 14 and 15, and 17 a block conductive packing provided between the carrier 9 and the cut-off block 11. 17a is a conductive packing groove for the block, 18 is a conductive packing for the lid provided between the lid 2 and the cut-off block 11, 18a is a conductive packing groove for the lid, and 19 is an output of the high frequency module. A coaxial connector (the input terminal of the output terminal of the high-frequency module is omitted) which is a terminal 4, 20 is an electrical connection portion for electrically connecting the coaxial connector 19 and the output signal line 7, and 21 is a second filter circuit 10. This is an electrical connection part that electrically connects the output signal line 7. In this case, the second filter circuit 10 and the output signal line 7 are interpreted as separate bodies. It may be Re. Reference numeral 22 denotes a recess formed in the cut-off block 11, and reference numeral 22 a denotes a recess formed near the opening on the side surface of the cut-off block 11. The output unit 6 is drawn out from the opening on the side of the amplifier circuit package 5 and the opening on the side of the cut-off block 11. The electrical connection portion 20 is drawn out from the opening at the side of the cutoff block 11. The coaxial connector 19 is inserted into the opening on the side of the housing 1. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted.

  Next, the operation will be described. The configuration of the high-output high-frequency module is mainly composed of an amplification function for the supplied desired wave, further has a configuration in which mixing and multiplication functions are added based on IF (Intermediate-Frequency) frequency supply, and an oscillator based on a reference signal There are configurations with additional functions. In any configuration, an unnecessary wave is output from each active device, and it is necessary to suppress the unnecessary wave from the viewpoints of law and maintenance of system performance. However, in general high-power high-frequency modules, from the viewpoint of power efficiency, the high-power amplifier circuit that amplifies the desired wave is often located at the final stage of the active device because of its configuration. A filter circuit for suppressing the output harmonics is arranged. Here, based on the general configuration, the configuration of the output end of the high-output amplifier, the filter circuit, and the high-output high-frequency module will be described with reference to FIGS. In the present invention, particularly for the filter circuit, the first filter circuit 10 included in the high-power amplifier and the second filter circuit 10a added on the module side are defined separately. The amplifier circuit package 5 is electromagnetically shielded by a cover for the amplifier circuit package 5 as shown in FIG. An input signal is supplied from the input signal line to the input part of the amplifier circuit package 5, and the amplifier circuit package 5 (amplifier part 5a) receives the input signal from the input part according to the bias supplied from the DC power supply bias line 5b or the like. An output signal that is amplified and sent from the output unit 6 to the second filter circuit at the subsequent stage is sent out (bias lines other than the DC power supply bias line 5b are omitted in the drawing). A first filter circuit 10 is formed in front of the output unit 6 to suppress unnecessary waves other than the output signal. However, since the first filter circuit 10 is a filter circuit realized with an area that does not increase the circuit scale, it is not possible to suppress unnecessary waves up to a desired level. The unnecessary wave that could not be suppressed is suppressed by the second filter circuit 10a. Note that the oscillation from the second filter circuit 10 a is suppressed by the cutoff block 11.

  Next, the structure of the carrier 9 and the cutoff block 11 will be described with reference to FIG. The cut-off block 11 is installed on the second filter circuit 10a, and a recess is formed in a portion facing the conductor pattern of the microstrip line constituting the second filter circuit 10a. The second filter circuit 10 a is formed on the dielectric substrate 8 in the above-described microstrip line pattern, and is fixed to the carrier 9. The carrier 9 is fixed to a metal base, which is the lower surface of the housing 1, with a carrier fixing screw 9. The cut-off block 11 is fixed to the carrier 9 by a block fixing screw 16. The block fixing screw 16 is fixed to a cut-off block formed on the carrier 9 at a position that does not interfere with the carrier fixing screw 9. Two screw holes, a screw hole 14 for block fixing and a screw hole 15 for fixing the block, which is aligned with the screw hole 14 for fixing the cut-off block and is formed in the cut-off block 11 itself at a position avoiding the recesses 22 and 22a. Has been inserted. The screw hole for the block fixing screw 16 may reach the metal base.

  Thus, by separating the screw for fixing the carrier 9 to the metal base, the cutoff block 11 and the screw for fixing the carrier 9, the cutoff book 11 can be removed from the carrier 9 while the carrier 9 is fixed. This makes it possible to simplify the workability when manufacturing a high-frequency module. Hereinafter, by separating the screw for fixing the carrier 9 to the metal base, the cut-off block 11 and the screw for fixing the carrier 9, the electrical contact between the deteriorated carrier 9 and the cut-off block 11 is improved, and the isolation is improved. It will be described that the screw for fixing the carrier 9 to the metal base, the cut-off block 11 and the screw for fixing the carrier 9 are fixed with the same screw (co-tightening) and not inferior.

  As shown in FIGS. 1C and 2B, a block conductive packing 17 formed of a soft conductive member is provided between the carrier 9 and the cut-off block 11, and the carrier 9 and the cut block 11 are cut. The electrical contact with the off block 11 is improved. The block conductive packing 17 may be disposed at a position where high-frequency signal propagation is expected in the parallel plate mode in the high-frequency module. Further, by disposing (sandwiching) the soft conductive member of the same quality as the block conductive packing 17 in the lid portion 2 and the cut-off block 11, the isolation in the housing 1 may be enhanced. Specifically, as shown in FIG. 2 (a), a conductive packing groove 18a for the lid is provided on the upper surface of the cut-off block 11, and the groove for the lid as shown in FIG. 1 (b) is provided in this groove. The conductive packing 18 is placed. Note that a plurality of lid-use conductive packings 18 are arranged in a rod shape, and a space formed by the lid portion 1, the cut-off block 11, and the lid-use conductive packing 18 is free from unwanted waves from the amplifier circuit package 5. It may be operated as a blocking space.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. 4 is a configuration diagram of an amplifier circuit package and a filter circuit of the high-frequency module according to the second embodiment, FIG. 5 is a mounting diagram of a soft conductive member used in the high-frequency module according to the second embodiment, and FIGS. c) is a view in which a soft conductive member is sandwiched. In FIGS. 4 and 5, 11 a is a flange portion of the cut-off block 11 extending above the amplifier circuit package 5, and 23 is a flange portion 11 a and the amplifier circuit package. 5 is an electrically conductive packing for the heel portion of the soft conductive member provided between the upper surface (lid portion) 5 and 24 is an electrically conductive packing groove portion for the buttock. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. The difference between the high-frequency module according to the first embodiment and the high-frequency module according to the second embodiment is only the members that are necessary due to the presence of the flange portion 11a and the flange portion 11a, and is otherwise the same. In FIG. 4, the DC power supply bias line 5b is not shown.

  By covering the flange portion 11a on the amplification circuit package 5 and sandwiching the flange-use conductive packing 23 therebetween, the isolation in the housing 1 can be further increased. Further, as shown in FIG. 5A, the hook conductive packing 23 may be inserted without providing the hook conductive packing groove 24 as shown in FIG. As shown in FIGS. 5B and 5C, the buttock conductive packing groove 24 may be provided to sandwich the buttock conductive packing 23. Further, although not shown in the drawing, the flange-shaped conductive packing groove portion 24 is similar to the block conductive packing groove portion 17a of the high-frequency module according to Embodiment 1 as shown in FIG. And the amplifier circuit package 5 may be formed only on one of them. In other words, the block conductive packing groove 17a and the cover conductive packing groove 18a of the high-frequency module according to Embodiment 1 may also be implemented in the state shown in FIGS. It will be good. The presence / absence of the groove of the member in contact with the block conductive packing groove 17a and the lid conductive packing groove 18a is also the same as in FIGS.

Embodiment 3 FIG.
Embodiment 3 of the present invention will be described with reference to FIG. 6 is a configuration diagram of the high-frequency module according to Embodiment 3, FIG. 6 (a) is a top view of the high-frequency module, and FIG. 6 (b) is a sectional view taken along the dashed line in FIG. FIG. 6 is a cross-sectional view, in which 9a is a high-frequency circuit carrier on which a later-described high-frequency circuit such as a dielectric substrate is placed, and 11b is placed on the high-frequency circuit 25. Cut-off block cover having recesses formed in opposing portions, 13a is a carrier fixing screw (carrier fixing member) for fixing the high-frequency circuit carrier 9a, and 16a is fixing the cut-off block cover 11b to the high-frequency circuit carrier 9a. A block fixing screw (block fixing member) 17b is a block provided between the high frequency circuit carrier 9a and the cut-off block cover 11b. The conductive packing for the gasket 25 is a high frequency circuit (for example, a microstrip line) in which a conductor layer such as a conductor pattern is formed on the upper and lower surfaces of the dielectric substrate, and 26 is connected to the front stage or the rear stage of the high frequency circuit 25. It is an electronic device. In the drawings, the same reference numerals denote the same or corresponding parts, and detailed descriptions thereof are omitted. In FIG. 6, the cut-off block cover 11b and the block fixing screw 16a are perspective views and are represented by dotted lines.

  In the first and second embodiments, since the screw for fixing the carrier 9 to the metal base, the cut-off block 11 and the screw for fixing the carrier 9 are separated, the cut-off book 11 is fixed to the carrier 9 while the carrier 9 is fixed. Although it has been described that the workability when manufacturing a high-frequency module is simplified, the third embodiment will be described in more detail with reference to FIG. In the conventional high-frequency module, it is necessary to reduce the area required for screw mounting as a means for achieving both miniaturization of the module and securing the circuit area. There is a tendency to use a lot of tightening screws. However, with regard to co-fastening screws, temporarily fix the carrier to the module when connecting the wiring between circuit boards mounted on different carriers, and temporarily release the temporary fixing procedure when attaching the cover for the cut-off block. Since it becomes necessary to retighten the cover for the cutoff block and the carrier with screws, the workability is lowered. Also, as one means of improving the workability shown in the previous section, holes or notches other than those for connection with wiring and other circuits are provided in a part of the cut-off block, and circuit boards on the carrier are There is also a method of making the wiring connection possible with the cut-off block attached. In this case, however, the original electrical shielding function of the cutoff block may be lowered.

  In the high frequency module according to Embodiment 3 (Embodiments 1 and 2), the circuit area inside the high frequency module is reduced, and the screwing positions for fixing the high frequency circuit carrier 9a alone are arranged diagonally (carrier fixing). Screw 13a), the cut-off block cover 11b and the high-frequency circuit carrier 9a are fastened together with the screw fixing position opposite to the screw position for fixing the high-frequency circuit carrier 9a alone (block fixing screw 16a). 4 or more screwing positions can be secured. With the high-frequency circuit carrier 9a alone fixed, the high-frequency circuit 25 mounted on the high-frequency circuit carrier 9a and the electronic device 26 mounted on another carrier are connected, and then the cut-off block cover 11b is attached. Temporary fixing work is unnecessary, and workability is improved.

  Further, the block conductive packing 17b formed of a soft conductive member is disposed between the screwing portion and the circuit, and electrical isolation can be ensured even if the four corners of the cut-off block cover 11b are not fixed. It becomes possible. As described above, according to the present invention, it is possible to realize the effect of improving the workability while maintaining the electrical isolation performance. The state of the block conductive packing 17b (17) sandwiched between the cutoff block cover 11b and the high frequency circuit carrier 9a shown in FIG. 6 and the cutoff block cover 11b (11) and the high frequency circuit carrier 9a (9). The shape of is the same as the lower diagram of FIG. Of course, you may select the state and shape which will be in a state like FIG. The high frequency circuit 25 and the electronic device 26 may be mounted on the same carrier. The high-frequency module according to the third embodiment is basically the same as the high-frequency module according to the first and second embodiments except that the amplifier circuit package 5 is replaced with the electronic device 26. This indicates that the high-frequency module according to the third embodiment is also mounted in a casing such as the casing 1 described in the first and second embodiments.

It is a block diagram of the high frequency module which concerns on Embodiment 1 of this invention. It is a block diagram of the cutoff block of the high frequency module which concerns on Embodiment 1 of this invention. It is a block diagram of an amplifier circuit package and a second filter circuit of the high frequency module according to the first embodiment of the present invention. It is a block diagram of the amplifier circuit package and filter circuit of the high frequency module which concern on Embodiment 2 of this invention. It is a mounting figure of the soft conductive member used for the high frequency module concerning Embodiment 2 of this invention. It is a block diagram of the high frequency module which concerns on Embodiment 3 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Housing | casing, 2 ... Cover part, 3 ... Cover part fixing screw, 3a ... Cover part fixing screw hole, 4 ... Output terminal,
5 ... amplifier circuit package, 5a ... amplifier unit, 5b ... DC feeding bias line, 6 ... output unit,
7 ... Output signal line, 8 ... Dielectric substrate, 9 ... Carrier, 9a ... High frequency circuit carrier,
10: First filter circuit,
10a ... second filter circuit, 11 ... cut-off block, 11a ... buttocks,
11b ... Cover for cut-off block, 12 ... Screw hole for fixing carrier (first hole),
13 ... Carrier fixing screw (carrier fixing member),
13a ... Carrier fixing screw (carrier fixing member),
14 ... Screw hole for fixing the cut-off block (second hole),
15 ... Screw holes for fixing blocks (third hole),
16 ... Block fixing screw (block fixing member),
16a ... Block fixing screw (block fixing member),
17 ... conductive packing for block, 17a ... conductive packing groove for block,
17b ... conductive packing for block, 18 ... conductive packing for lid,
18a ... conductive packing groove for lid, 19 ... coaxial connector, 20 ... electrical connection,
21 ... Electrical connection part, 22 ... Depression part, 22a ... Depression part, 23 ... Conductive packing for heel part,
24: Conductive packing groove for buttock, 25: High frequency circuit, 26: Electronic device.

Claims (6)

A conductive housing having an opening on the upper surface and a lower surface serving as a metal base, a conductive lid for sealing the opening at the top of the housing, and an input portion mounted inside the housing And an amplifier circuit package having an output section through the first filter circuit, an input signal line for supplying an input signal to an input section of the amplifier circuit package, a bias line for supplying a bias to the amplifier circuit package, The amplification circuit package amplifies an input signal from the input unit according to a bias supplied from a bias line, and guides an output signal sent from the output unit, and one of the output signal lines A dielectric substrate placed inside the casing, which is a part, and having a microstrip line formed thereon, a carrier on which the dielectric substrate is placed, and unnecessary waves from the amplifier circuit package are suppressed. A second filter circuit having a conductor pattern of the microstrip line, and a second filter circuit disposed on the second filter circuit, blocking a radiation wave from the second filter circuit and facing the conductor pattern of the microstrip line. A high-frequency module comprising a cut-off block having a recess formed in a part. A conductive housing having an opening on the upper surface and a lower surface serving as a metal base, a conductive lid for sealing the opening at the top of the housing, and an input portion mounted inside the housing And an amplifier circuit package having an output section through the first filter circuit, an input signal line for supplying an input signal to an input section of the amplifier circuit package, a bias line for supplying a bias to the amplifier circuit package, The amplification circuit package amplifies an input signal from the input unit according to a bias supplied from a bias line, and guides an output signal sent from the output unit, and one of the output signal lines A dielectric substrate placed inside the casing, which is a part, and having a microstrip line formed thereon, a carrier on which the dielectric substrate is placed, and unnecessary waves from the amplifier circuit package are suppressed. A second filter circuit having a conductor pattern of the microstrip line, a cut-off block for blocking a radiation wave from the second filter circuit, a first hole formed in the carrier, and the first A carrier fixing member for fixing the carrier to the housing through the hole, a second hole formed in the carrier at a position different from the first hole, and communication with the second hole A block fixing member for fixing the cut-off block to the carrier via the third hole formed in the cut-off block, the third hole and the second hole, and the carrier A high-frequency module comprising a block conductive packing provided between the cut-off block and a cover conductive packing provided between the lid and the cut-off block. A conductive housing having an opening on the upper surface and a lower surface serving as a metal base, a conductive lid for sealing the opening at the top of the housing, and an input portion mounted inside the housing And an amplifier circuit package having an output section through the first filter circuit, an input signal line for supplying an input signal to an input section of the amplifier circuit package, a bias line for supplying a bias to the amplifier circuit package, The amplification circuit package amplifies an input signal from the input unit according to a bias supplied from a bias line, and guides an output signal sent from the output unit, and one of the output signal lines A dielectric substrate placed inside the casing, which is a part, and having a microstrip line formed thereon, a carrier on which the dielectric substrate is placed, and unnecessary waves from the amplifier circuit package are suppressed. A second filter circuit having a conductor pattern of the microstrip line, and a second filter circuit disposed on the second filter circuit, blocking a radiation wave from the second filter circuit and facing the conductor pattern of the microstrip line. A cut-off block in which a depression is formed in a part; a first hole formed in the carrier; a carrier fixing member that fixes the carrier to the housing through the first hole; A second hole formed in the carrier at a position different from the first hole, and a third hole formed in the cut-off block in communication with the second hole and avoiding the depression A block fixing member for fixing the cut-off block to the carrier via the third hole and the second hole, and the carrier and the cut-off block. RF module comprising a block electrically conductive packing, and a conductive gasket lid portion provided between said cut-off block and the lid. A plurality of the conductive packings for the lid part are arranged in a rod shape, and a space formed by the lid part, the cut-off block, and the conductive packing for the lid part is a cut-off space against unnecessary waves from the amplification circuit package The high-frequency module according to claim 2, wherein the high-frequency module is operated as: The high-frequency module according to claim 1, wherein the cut-off block has a flange portion that extends to above the amplifier circuit package. The high-frequency module according to claim 5, further comprising a collar-use conductive packing provided between the collar and the amplifier circuit package.

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