JP2011181642A5 - - Google Patents
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- Publication number
- JP2011181642A5 JP2011181642A5 JP2010043715A JP2010043715A JP2011181642A5 JP 2011181642 A5 JP2011181642 A5 JP 2011181642A5 JP 2010043715 A JP2010043715 A JP 2010043715A JP 2010043715 A JP2010043715 A JP 2010043715A JP 2011181642 A5 JP2011181642 A5 JP 2011181642A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- layer
- wiring board
- conductor
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010043715A JP5413597B2 (ja) | 2010-03-01 | 2010-03-01 | 配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010043715A JP5413597B2 (ja) | 2010-03-01 | 2010-03-01 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011181642A JP2011181642A (ja) | 2011-09-15 |
| JP2011181642A5 true JP2011181642A5 (enrdf_load_stackoverflow) | 2013-02-14 |
| JP5413597B2 JP5413597B2 (ja) | 2014-02-12 |
Family
ID=44692866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010043715A Expired - Fee Related JP5413597B2 (ja) | 2010-03-01 | 2010-03-01 | 配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5413597B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5833398B2 (ja) | 2011-06-27 | 2015-12-16 | 新光電気工業株式会社 | 配線基板及びその製造方法、半導体装置 |
| JP6226779B2 (ja) | 2014-03-10 | 2017-11-08 | 株式会社東芝 | 磁気メモリ、磁気メモリ装置、及び磁気メモリの動作方法 |
| JP6220292B2 (ja) | 2014-03-11 | 2017-10-25 | 株式会社東芝 | 磁気メモリ、磁気メモリの再生方法、および磁気メモリの記録方法 |
| JP6193190B2 (ja) | 2014-08-25 | 2017-09-06 | 株式会社東芝 | 磁気記憶素子および磁気メモリ |
| JP6523666B2 (ja) | 2014-12-02 | 2019-06-05 | 東芝メモリ株式会社 | 磁気記憶素子および磁気メモリ |
| KR102689959B1 (ko) * | 2019-03-12 | 2024-07-29 | 에스케이하이닉스 주식회사 | 인쇄 회로 기판을 포함하는 반도체 모듈 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217240A (ja) * | 2001-01-19 | 2002-08-02 | Nec Tohoku Ltd | フリップチップ実装構造及び配線方法 |
| JP3872712B2 (ja) * | 2002-04-18 | 2007-01-24 | 日本特殊陶業株式会社 | 多層配線基板 |
| JP2004273480A (ja) * | 2003-03-05 | 2004-09-30 | Sony Corp | 配線基板およびその製造方法および半導体装置 |
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2010
- 2010-03-01 JP JP2010043715A patent/JP5413597B2/ja not_active Expired - Fee Related