JP2011177851A - Manufacturing method of mems parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of MEMS parts which can reduce the occurrence of defective parts and manufacture the MEMS parts with good productivity. <P>SOLUTION: A through-hole 22 for injecting an adhesive agent is formed on either a first microcomponent 10 or a second microcomponent 20. After the first microcomponent 10 comes into close contact with the second microcomponent 20, the adhesive agent 7 is injected into the through-hole 22 and the first and second microcomponents 10 and 20 are fixed by hardening the adhesive agent 7. A photosensitive curing resin is preferably used as the adhesive agent 7. The first and/or second microcomponents 10 and/or 20 are preferably formed with a transparent material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a MEMS component such as a vibrator device.

  The MEMS (Micro Electro Mechanical System) technology is one of micromachine technologies, and has attracted attention as a manufacturing technology for components used in small electronic devices such as mobile phones.

  As one of the MEMS parts formed by the MEMS technology, there is a MEMS vibrator device formed by joining a first substrate having a vibrator to a second substrate on which a capacitance detection electrode is formed. Such MEMS parts are utilized for applications such as resonators and various sensors by utilizing the function of the vibrator.

  Conventionally, a method of bonding and fixing with an adhesive has been performed in manufacturing MEMS parts by joining respective micro parts.

  3 (a) to 3 (d) are schematic cross-sectional views showing a manufacturing process of a conventional MEMS vibrator device, and FIGS. 4 (a) to 4 (d) are cross-sectional views of A ′ in FIGS. 3 (a) to 3 (d). It is the top view seen from -A 'arrow gaze line. In the figure, 1 is a silicon substrate (first substrate), 2 is a vibrator, 3 is an electrode pad, 4 is a capacitance detection electrode, 5 is a glass substrate (second substrate), 7 Is an adhesive, and 8 is an adhesive application nozzle.

  As shown in FIGS. 3 and 4, a glass substrate 5 on which a capacitance detection electrode 4 is formed is disposed above the silicon substrate 1 on which the vibrator 2 is formed (FIGS. 3A and 4A). )), The silicon substrate 1 and the glass substrate 5 are brought into contact with each other for alignment (FIGS. 3 (b) and 4 (b)), and the nozzle 8 is formed around the joint between the silicon substrate 1 and the glass substrate 5. The MEMS vibrator device is manufactured by applying the adhesive 7 and bonding and fixing the silicon substrate 1 and the glass substrate 5 (FIG. 3C, FIG. 4C).

  Further, in Patent Document 1 below, a groove having a coating width for the conductive adhesive is formed on the upper surface of the support fixed with the conductive adhesive, and the conductive adhesive is quantitatively applied along the groove. However, after that, it is disclosed that the piezoelectric plates are stacked and the piezoelectric plate and the support base are fixedly attached.

Japanese Patent Laid-Open No. 5-283967

  However, since the amount of the adhesive used for bonding and fixing the minute parts is extremely small, it is difficult to minutely control the coating amount. For this reason, as shown in FIGS. 3 and 4, when an adhesive is applied to the periphery of the joint between the respective microparts, the adhesive oozes out over a wide area and is shown in FIGS. 3 (d) and 4 (d). As shown, even parts such as the electrode pad 3 that should not be bonded to each other may be bonded with an adhesive, causing malfunction and leading to generation of defective products.

  Further, in the case of the method of Patent Document 1, when the position adjustment is performed after aligning the minute parts, the parts are shifted in a state where the adhesive is attached. The adhesive sometimes entered the surface. Moreover, when there was too much application amount of the adhesive agent, the adhesive agent overflowed from the groove | channel might approach into the contact | adherence surface between micro components. When the adhesive enters the close contact surface between the minute parts, the part interval varies. Particularly in the case of a capacitance sensor or the like, this part interval variation appears as a sensor error, leading to the generation of defective products.

  Therefore, an object of the present invention is to provide a method of manufacturing a MEMS part that can reduce the occurrence of defective products and can manufacture a MEMS part with high productivity.

  In order to achieve the above object, a method of manufacturing a MEMS component according to the present invention is a method of manufacturing a MEMS component in which a first micro component and a second micro component are fixed with an adhesive. A through hole for injecting adhesive is formed in one of the component and the second micro component, and the first micro component and the second micro component are brought into close contact with each other, and then bonded to the through hole. It is characterized by injecting an agent and curing the adhesive.

  In the MEMS component manufacturing method of the present invention, a photosensitive curable resin is preferably used as the adhesive.

  In the MEMS component manufacturing method of the present invention, the first micro component is a first substrate having a vibrator, and the second micro component is a second substrate on which a capacitance detection electrode is formed. preferable.

  In the MEMS component manufacturing method of the present invention, it is preferable that the first microcomponent and / or the second microcomponent are made of a transparent material.

According to the method for manufacturing a MEMS part of the present invention, a through hole for injecting an adhesive is formed in one of the first micro part and the second micro part, and the first micro part and the second micro part are formed. Since the adhesive is injected into the through-hole after the microparts are in close contact with each other and the adhesive is cured, the adhesive is maintained in the through-hole even if the amount of adhesive applied varies. Since diffusion to the surface can be suppressed, troubles such as fixing unnecessary portions with an adhesive can be suppressed.
In addition, the injection of the adhesive into the through hole can be performed after the minute parts are brought into close contact with each other and the positional deviation of the installation position, etc. is adjusted, so that the adhesive can enter the contact surface between the parts. It is possible to suppress the trouble that the interval between parts varies for each product.
For this reason, in this invention, generation | occurrence | production of inferior goods can be suppressed and a MEMS component can be manufactured with sufficient productivity.

It is a schematic sectional drawing of the manufacturing process of the MEMS component of this invention. It is the top view which looked at each manufacturing process of FIG. 1 from the AA arrow line. It is a schematic sectional drawing which shows the manufacturing process of the conventional MEMS vibrator device. FIG. 4 is a plan view of each manufacturing process of FIG. 3 as viewed from the line A′-A ′.

  The MEMS component manufacturing method of the present invention will be described by taking as an example a case where a MEMS vibrator device is manufactured by bonding a first substrate having a vibrator and a second substrate on which a capacitance detection electrode is formed. To do. 1 (a) to 1 (d) are schematic cross-sectional views of the manufacturing process of the MEMS component of the present invention, and FIGS. 2 (a) to 2 (d) are arrows AA in FIGS. 1 (a) to (d). It is the top view seen from eyes | visual_axis.

  The first substrate 10 includes a vibrator 11 and an electrode pad 12 as shown in FIGS. Such a 1st board | substrate 10 can be manufactured as follows, for example.

That is, titanium, Al, W, Ta, Au, titanium, Al, W, Ta, Au, are formed at positions where the electrode pads 12 of the first substrate material composed of one or more selected from silicon, Ge, SiGe, SiC, GaAs, GaN, and carbon are to be formed. A metal film is formed by sputtering one or an alloy selected from Ge and Ni, and the metal film is subjected to resist patterning into a desired electrode shape, and then dried using an etching gas such as BCl ₃ or SF _3. The electrode pad 12 is formed by etching.

Next, a portion of the substrate material on which the vibrator is to be formed is resist-patterned into a desired vibrator shape, and an etching gas (a mixed gas of C ₄ F ₈ and SF ₆ when silicon is used as the first substrate material) Is preferably used) to form the vibrator 11 by dry etching. In this way, the first substrate 10 can be manufactured.

  As shown in FIGS. 1 and 2, the second substrate 20 has a capacitance detection electrode 21 formed substantially at the center thereof. Further, through holes 22 and 22 for injecting adhesive are formed on both sides of the second substrate 20. Such a 2nd board | substrate 20 can be manufactured as follows, for example.

That is, a resist pattern is formed at a position where a through hole portion of a second substrate material made of at least one selected from glass, sapphire, AlN, SiC, and GaN is to be formed into a desired shape, and the through hole 22 is formed using sand blasting. Then, a hole (VIA hole) for the capacitance detection electrode 21 is formed. Next, one kind or an alloy selected from titanium, Al, W, Au, Ni, and Ta is sputtered on the position where the capacitance detection electrode 21 is formed and on the side surface of the hole for the capacitance detection electrode 21. After forming a metal film and resist patterning the metal film into a desired electrode shape, the capacitance detection electrode 21 is formed by dry etching using an etching gas such as BCl ₃ or SF ₃ . In this way, the second substrate 20 can be manufactured.

  In the present invention, the first substrate material and / or the second substrate material is preferably composed of a transparent material. If the first substrate and / or the second substrate material is made of a transparent material, the first substrate 10 and the second substrate 20 may be bonded to each other after optical alignment is confirmed using visible light. Since the adhesive can be injected and fixed, the generation of defective products due to poor alignment can be suppressed. If the first substrate material and the second substrate material are made of a transparent material, it is easy to finely adjust the installation position, and a defective product due to misalignment is extremely difficult to occur.

  Next, the manufacturing method of the MEMS component of this invention is demonstrated.

  First, the 2nd board | substrate 20 is arrange | positioned above the 1st board | substrate 10 (FIG. 1 (a), FIG. 2 (a)), these are match | combined and it adheres, and fine adjustment of an installation position etc. are carried out as needed. Position misalignment adjustment is performed (FIGS. 1B and 2B). In the case where the first substrate material and / or the second substrate material is made of a transparent material, the positional deviation can be adjusted optically using visible light or the like, and the positional deviation can be adjusted with high accuracy.

  Then, after adjusting the positional deviation as necessary, the adhesive application nozzle 8 is inserted into the through hole 22 formed in the second substrate in a state where the first substrate 10 and the second substrate 20 are in close contact with each other. Adhesive 7 is injected (FIGS. 3C and 4C). Then, the adhesive 7 injected into the through hole 22 is cured by heating, light irradiation, etc., whereby the first substrate 10 and the second substrate 20 are bonded and fixed, and the MEMS vibrator device is manufactured. (FIG. 3D, FIG. 4D).

  The type of the adhesive 7 is not particularly limited and can be appropriately selected depending on the application. For example, conductive adhesives made by adding conductive fillers such as silver, nickel, and carbon to resins such as epoxy, polyurethane, and silicone, and polyepoxy resin, polyimide resin, polyurethane resin, silicone resin, etc. as the main component Non-conductive adhesives can be mentioned. A photosensitive curable resin is preferable. Since the photosensitive curable resin is cured by light irradiation, the first substrate 10 and the second substrate 20 can be bonded and fixed by a simple process.

  The injection amount of the adhesive is preferably equal to or less than the volume of the through hole 22, more preferably 30 to 80%, and particularly preferably 50 to 60% of the volume of the through hole 22. If the injection amount of the adhesive is too small, the bonding strength between the first substrate 10 and the second substrate 20 may not be sufficiently obtained. When the adhesive is injected beyond the volume of the through hole 22, the adhesive overflows from the through hole 22 and easily diffuses around. If the injection amount of the adhesive is 30 to 80% of the volume of the through-hole 22, the adhesive does not diffuse to the surroundings, and sufficient adhesive strength between the first substrate 10 and the second substrate 20 can be ensured.

  As described above, according to the present invention, the through hole 22 for injecting the adhesive is formed in the second substrate 20, and the first substrate 10 and the second substrate 20 are brought into close contact with each other, and then formed in the second substrate 20. Since the adhesive 7 is injected into the formed through-hole 22 and the adhesive 7 is cured, the adhesive 7 is maintained in the through-hole 22 even if the application amount of the adhesive 7 varies. The agent 7 does not diffuse around. In addition, since the adhesive 7 is injected into the through hole 22 after the first substrate 10 and the second substrate 20 are brought into close contact with each other and the positional deviation is adjusted, the close contact between the first substrate 10 and the second substrate 20 is performed. The adhesive 7 does not enter the surface. For this reason, it is possible to suppress the generation of defective products and manufacture MEMS parts with high productivity.

  In this embodiment, the through hole 22 for injecting the adhesive is formed on the second substrate 20 side, but may be formed on the first substrate 10 side. It may be formed on both the first substrate 10 and the second substrate 20.

  In this embodiment, a case where a MEMS vibrator device is manufactured by joining the first substrate 10 having the vibrator 11 and the second substrate 20 on which the capacitance detection electrode 21 is formed is taken as an example. As described above, the present invention is not limited to these MEMS parts. Any MEMS part can be used as long as it is a part in which an electric circuit (control unit) and a fine mechanical structure (drive unit) are integrated on one substrate. For example, the present invention can be applied to manufacture of various MEMS parts such as a printer head, a pressure sensor, an acceleration sensor, a capacitance sensor, and a gyroscope.

1: silicon substrate 2: vibrator 3: electrode pad 4: capacitance detection electrode 5: glass substrate 7: adhesive 8: adhesive application nozzle 10: first substrate 11: vibrator 12: electrode pad 20: second Substrate 21: Capacitance detection electrode 22: Through hole

Claims (4)

A method for manufacturing a MEMS component in which a first micro component and a second micro component are fixed with an adhesive,
A through hole for injecting an adhesive is formed in one of the first microcomponent and the second microcomponent,
A method of manufacturing a MEMS component, comprising: bonding an adhesive into the through hole after the first microcomponent and the second microcomponent are brought into close contact with each other; and curing the adhesive.   The method for manufacturing a MEMS component according to claim 1, wherein a photosensitive curable resin is used as the adhesive.   3. The MEMS component according to claim 1, wherein the first micro component is a first substrate having a vibrator, and the second micro component is a second substrate on which a capacitance detection electrode is formed. Production method.   The manufacturing method of the MEMS component according to any one of claims 1 to 3, wherein the first microcomponent and / or the second microcomponent is made of a transparent material.