JP2011172055A - Television camera - Google Patents

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JP2011172055A
JP2011172055A JP2010034580A JP2010034580A JP2011172055A JP 2011172055 A JP2011172055 A JP 2011172055A JP 2010034580 A JP2010034580 A JP 2010034580A JP 2010034580 A JP2010034580 A JP 2010034580A JP 2011172055 A JP2011172055 A JP 2011172055A
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heat
electronic circuit
television camera
housing
circuit boards
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Hiroaki Kanda
広明 神田
Hiroki Matsunaga
裕樹 松永
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Hitachi Kokusai Electric Inc
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Hitachi Kokusai Electric Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide television camera equipment for efficiently discharging heat generated in the electronic circuit device of a circuit board to the outside of a case body by radiation by fan convection and radiation by heat conduction, and thereby for suppressing the rise of temperature inside the case body. <P>SOLUTION: Radiator plates 2b, 3b are formed by using excellently heat-conductive and thin copper with a thickness of about 0.5 mm. Thin heat-conductive sheets 2c, 3c are attached onto the electronic circuit devices 2a, 3a in order to reduce a contact resistance between the radiator plates 2b, 3b and the electronic circuit devices 2a, 3a, and also pressure sponge pieces 2d, 3d are put between the radiator plates 2b, 3b and the circuit boards 3, 4. Thus, adhesiveness is improved by using the spring property of the thin radiator plates 2b, 3b. Besides, the radiator plates 2b, 3b are made thinner, and then radiation is promoted by reducing the resistance of an air flow to an intake port from the bottom and side surface lower parts of the case body 50. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、ポータブルタイプのテレビジョンカメラに係り、特に業務用/放送用グレードのハンディタイプのテレビジョンカメラに関する。 The present invention relates to a portable type television camera, and more particularly to a professional / broadcast grade handy type television camera.

業務用/放送用グレードのテレビジョンカメラには、かなりハイスペックが要求されるのが通例であり、このことは、ハンディタイプのテレビジョンカメラにおいても、それが業務用/放送用グレードである以上、例外ではない。
しかも、この種のハンディタイプのカメラの場合、その使用環境は、屋内屋外を問わないのが通例であり、このため、炎天下での使用も想定しておかなくてはならない。
It is common for commercial / broadcasting grade television cameras to require fairly high specs, which means that even handy-type television cameras are commercial / broadcasting grades. , No exception.
Moreover, in the case of this type of handy-type camera, the use environment is usually not limited to indoors and outdoors, and therefore it must be assumed to be used in hot weather.

そこで、このとき問題になるのは、テレビジョンカメラの中には、動作時に発熱を伴う多数の回路基板が存在することである。
特に、業務用/放送用グレードの場合、要求されるスペックが比較的ハイレベルであることから、カメラ側で画像信号などについて処理すべき項目が複雑になり、このため、より一層、多数の回路基板が必要になり、この結果、回路基板での発熱量が更に多くなり、従って、それらの放熱が不可避であるが、この場合、上記した炎天下での温度環境も考慮する必要がある。
Therefore, a problem at this time is that a large number of circuit boards that generate heat during operation exist in the television camera.
In particular, in the case of commercial / broadcasting grades, the required specifications are relatively high level, which complicates the items to be processed for image signals and the like on the camera side. A substrate is required, and as a result, the amount of heat generated on the circuit board is further increased. Therefore, heat dissipation is inevitable. In this case, it is necessary to consider the temperature environment under the above-mentioned hot weather.

図3は、このような多数の回路基板を備えたハンディタイプのテレビジョンカメラの一例であるが、従来技術においては、図4の図3のA−A線による断面図、図5の図3のA−A線による拡大断面図、および図6の図4のB−B線における断面図に示すように、マザーボード(MB)と呼ばれている1枚の回路基板1に、例えば、DSP、FPGA等の電子回路デバイス2a、3a、4aが搭載された複数枚、例えば、3枚の回路基板2、3、4がコネクタ5を介して積み重なるように取り付けられている。回路基板2、3には、各々放熱板20b、30bを組み合わせ、回路基板2、3の電子回路デバイス2a、3aが実装されている箇所に放熱シート20c、30cを介在させることにより熱結合させている。また、回路基板4の電子回路デバイス4aが実装されている箇所には、放熱シート4cを介在させ、テレビジョンカメラの筐体50の一部を形成する放熱フィン50aに熱結合させている。 FIG. 3 is an example of a handy type television camera provided with such a large number of circuit boards. In the prior art, a cross-sectional view taken along line AA in FIG. 3 in FIG. 4 and FIG. 3 in FIG. As shown in an enlarged sectional view taken along line AA of FIG. 6 and a sectional view taken along line BB of FIG. 4 in FIG. 6, a circuit board 1 called a mother board (MB) is provided with, for example, a DSP, A plurality of, for example, three circuit boards 2, 3, and 4 on which electronic circuit devices 2 a, 3 a, and 4 a such as FPGA are mounted are attached via a connector 5 so as to be stacked. The circuit boards 2 and 3 are combined with the heat sinks 20b and 30b, respectively, and are thermally coupled by interposing the heat dissipation sheets 20c and 30c at locations where the electronic circuit devices 2a and 3a of the circuit boards 2 and 3 are mounted. Yes. Further, a heat radiating sheet 4c is interposed at a place where the electronic circuit device 4a of the circuit board 4 is mounted, and is thermally coupled to a heat radiating fin 50a that forms a part of the casing 50 of the television camera.

また、放熱板20b、30bは、例えば、アルミニウムや銅など熱伝導性に優れた材料の板材で作られ、図示のように、熱を筐体50へ放熱するための放熱座6、7にそれぞれ固定ネジ51、52で締結されている。
従って、回路基板2、3の電子回路デバイス2a、3aで発生した熱は、各々放熱シート20c、30cを介して放熱板20b、30bに流れ、その後、それぞれ放熱座6、7を介して筐体50に流入する。
Further, the heat radiating plates 20b and 30b are made of, for example, a plate material made of a material having excellent thermal conductivity such as aluminum and copper. Fastened with fixing screws 51 and 52.
Therefore, the heat generated in the electronic circuit devices 2a and 3a on the circuit boards 2 and 3 flows to the heat radiating plates 20b and 30b through the heat radiating sheets 20c and 30c, respectively, and then the housings via the heat radiating seats 6 and 7, respectively. 50.

一方、回路基板4の電子回路デバイス4aで発生した熱は、放熱シート4cを介して放熱フィン50aに流入する。
このとき、図3及び図6に示すように、テレビジョンカメラの筐体50には放熱用のファン60が設けてあり、白抜きの矢印で示すように、筐体50の底部および側面下部に設けた吸気口50bから取り込まれた空気が、放熱フィン50aや回路基板1、2、3、4の間を通った後、筐体50の背面側下部に設けた排気口50cから外部に排出されるようになっている。
On the other hand, the heat generated in the electronic circuit device 4a on the circuit board 4 flows into the heat radiating fins 50a through the heat radiating sheet 4c.
At this time, as shown in FIG. 3 and FIG. 6, a heat dissipation fan 60 is provided in the casing 50 of the television camera. The air taken in from the provided intake port 50 b passes between the heat radiation fins 50 a and the circuit boards 1, 2, 3, and 4, and then is discharged to the outside from the exhaust port 50 c provided in the lower part on the back side of the housing 50. It has become so.

従って、この従来技術によれば、回路基板2、3、4に実装された電子回路デバイス2a、3a、4aの温度上昇をスペックに定めた範囲に抑えるのに必要な放熱が与えられるので、テレビジョンカメラの正常な動作が保証されることなる。
なお、この種の技術として関連するものには、例えば特許文献1の開示を挙げることが
できる。
Therefore, according to this prior art, since the heat radiation required to suppress the temperature rise of the electronic circuit devices 2a, 3a, 4a mounted on the circuit boards 2, 3, 4 within the range specified in the specification is provided, The normal operation of the John camera is guaranteed.
For example, the disclosure of Patent Document 1 can be cited as a related technology.

特開平11−355623号公報JP-A-11-355623

上記従来技術では、回路基板2、3の電子回路デバイス2a、3aで発生した熱は、各々放熱シート20c、30cを介して放熱板20b、30bに流れ、それぞれ放熱座6、7を介して筐体50に熱伝導される。しかし、回路基板2と3、及び回路基板3と4の基板間隔は約8mmであって、この間に電子回路デバイス2a、3aが実装され、また、これを避けるように板厚1.5mmのアルミニウムの放熱板20b、30bが設けられ、筐体50の側板へ放熱していることから、回路基板2,3、4間の隙間は狭く、ファン60による対流放熱の効果を低減させていた。また、伝導放熱するために、筐体50の前方部と後方部に筐体50の側板へ熱伝導させるための放熱用の放熱座6,7を有しており、後方部の放熱座7については、ファン60による対流放熱の流れを妨げるという問題があった。
本発明の目的は、回路基板の電子回路デバイスで発生した熱をファンの対流による放熱と熱伝導による放熱で効率良く筐体外に排出することができ、筐体内の温度上昇が抑えられるようにしたテレビジョンカメラを提供することにある。
In the above prior art, the heat generated in the electronic circuit devices 2a and 3a of the circuit boards 2 and 3 flows to the heat radiating plates 20b and 30b via the heat radiating sheets 20c and 30c, respectively, and the housings via the heat radiating seats 6 and 7 respectively. Heat conduction to the body 50. However, the circuit board 2 and 3 and the circuit board 3 and 4 have a distance of about 8 mm between which the electronic circuit devices 2a and 3a are mounted. Since the heat radiation plates 20b and 30b are provided and heat is radiated to the side plate of the housing 50, the gap between the circuit boards 2, 3, and 4 is narrow, and the effect of convection heat radiation by the fan 60 is reduced. In addition, in order to conduct and dissipate heat, heat dissipating seats 6 and 7 for conducting heat to the side plate of the housing 50 are provided at the front and rear portions of the housing 50. Has a problem that the flow of convection heat radiation by the fan 60 is obstructed.
The object of the present invention is to efficiently discharge the heat generated in the electronic circuit device of the circuit board to the outside of the housing by heat dissipation by the convection of the fan and heat dissipation by heat conduction, and suppress the temperature rise in the housing. To provide a television camera.

上述した課題を解決し、目的を達成するため、本発明の請求項1に係る発明は、筐体内部に熱結合した放熱板を備え、当該筐体に積み重なるように搭載された複数の回路基板それぞれに実装された電子回路デバイスにより発生した熱を、前記放熱板を介して前記筐体に熱伝導して前記筐体外部に放熱するテレビジョンカメラにおいて、前記放熱板は、板厚の薄い熱伝導性の良い金属で形成され、また、前記回路基板間に搭載されると共に、電子回路デバイスとの間で熱伝導シートを介して取り付けられ、更に、隣り合う回路基板との間にオサエスポンジを備えることにより、板厚の薄い放熱板のバネ性を利用し密着性を向上させることを特徴とするテレビジョンカメラ。 In order to solve the above-described problems and achieve the object, the invention according to claim 1 of the present invention includes a plurality of circuit boards that are provided so as to be stacked on the casing, including a heat sink thermally coupled to the casing. In a television camera that dissipates heat generated by the electronic circuit devices mounted on each case to the outside of the case by conducting heat to the case through the heat sink, the heat sink has a thin plate thickness. It is formed of a metal having good conductivity, and is mounted between the circuit boards, and is attached to the electronic circuit device via a heat conductive sheet. Further, an Osae sponge is provided between adjacent circuit boards. By providing, a television camera characterized by using the spring property of a thin heat sink to improve adhesion.

本発明によれば、放熱フィンの冷却能力が向上され、カメラ筐体内の温度上昇が抑制されるので、テレビジョンカメラの使用環境を問わず、充分にカメラの性能を発揮することができる。 According to the present invention, the cooling capacity of the heat dissipating fins is improved and the temperature rise in the camera housing is suppressed, so that the camera performance can be sufficiently exhibited regardless of the use environment of the television camera.

本発明に係るテレビジョンカメラの一実施の形態を示す図3のA−A線による断面図である。It is sectional drawing by the AA line of FIG. 3 which shows one Embodiment of the television camera which concerns on this invention. 本発明に係るテレビジョンカメラの一実施の形態を示す図3のA−A線による拡大断面図である。It is an expanded sectional view by the AA line of FIG. 3 which shows one Embodiment of the television camera which concerns on this invention. ハンディタイプのテレビジョンカメラの一例を示す側面図である。It is a side view which shows an example of a handy type television camera. 従来技術によるテレビジョンカメラの一例を示す図3のA−A線による断面図である。It is sectional drawing by the AA line of FIG. 3 which shows an example of the television camera by a prior art. 従来技術によるテレビジョンカメラの一例を示す図3のA−A線による拡大断面図である。It is an expanded sectional view by the AA line of FIG. 3 which shows an example of the television camera by a prior art. 従来技術によるテレビジョンカメラの一例を示す図4のB−B線における縦方向の断面図である。It is sectional drawing of the vertical direction in the BB line of FIG. 4 which shows an example of the television camera by a prior art.

以下、本発明によるテレビジョンカメラについて、図示の実施形態により詳細に説明する。
図1と図2は、本発明の一実施の形態で、このとき図1は、図3のA−A線による断面図で、図2は、同じくその拡大図である。
Hereinafter, a television camera according to the present invention will be described in detail with reference to embodiments shown in the drawings.
1 and 2 show an embodiment of the present invention. FIG. 1 is a cross-sectional view taken along line AA of FIG. 3, and FIG. 2 is an enlarged view of the same.

ここで、まず、この実施形態においても、マザーボード(MB)と呼ばれている1枚の回路基板1に、例えばDSP、FPGA等の電子回路デバイス2a、3a、4aが搭載された複数枚、例えば、3枚の回路基板2、3、4がコネクタ5を介して積み重なるように取り付けられている。回路基板2、3には、各々放熱板2b、3bを組み合わせ、回路基板2、3の電子回路デバイス2a、3aが実装されている箇所に放熱シート2c、3cを介在させることにより熱結合させている。
また、回路基板4の電子回路デバイス4aが実装されている箇所には、放熱シート4cを介在させ、テレビジョンカメラの筐体50の一部を形成する放熱フィン50aに熱結合させている点は、図4、図5および図6で説明した従来技術の場合と同じである。
Here, first, also in this embodiment, a plurality of boards in which electronic circuit devices 2a, 3a, 4a such as DSPs and FPGAs are mounted on one circuit board 1 called a mother board (MB), for example, Three circuit boards 2, 3, and 4 are attached so as to be stacked via a connector 5. The circuit boards 2 and 3 are combined with the heat dissipation plates 2b and 3b, respectively, and are thermally coupled by interposing the heat dissipation sheets 2c and 3c at locations where the electronic circuit devices 2a and 3a of the circuit boards 2 and 3 are mounted. Yes.
Further, a point where the electronic circuit device 4a of the circuit board 4 is mounted is interposed with a heat radiating sheet 4c and is thermally coupled to the heat radiating fins 50a forming a part of the casing 50 of the television camera. These are the same as in the case of the prior art described in FIG. 4, FIG. 5 and FIG.

また、図3及び図6と同様に、テレビジョンカメラの筐体50には放熱用のファン60が設けてあり、図3及び図6の白抜きの矢印で示すように、筐体50の底部および側面下部に設けた吸気口50bから取り込まれた空気が、放熱フィン50aや回路基板1、2、3、4の間を通った後、筐体50の背面側下部に設けた排気口50cから外部に排出されるようになっている点も、図4、図5および図6で説明した従来技術の場合と同じである。 3 and 6, the television camera casing 50 is provided with a heat radiating fan 60. As indicated by the white arrows in FIGS. 3 and 6, the bottom of the casing 50 is provided. After the air taken in from the intake port 50b provided at the lower side of the side surface passes between the heat radiation fins 50a and the circuit boards 1, 2, 3, and 4, the exhaust port 50c provided at the lower rear side of the housing 50 The point of being discharged to the outside is also the same as in the case of the prior art described with reference to FIGS.

ここで、これら図1と図2に示した本発明の実施形態においては、図示のように、放熱板2b、3bは、熱を筐体50へ放熱するために、放熱座6に固定ネジ51で締結されている。
従って、回路基板2、3の電子回路デバイス2a、3aで発生した熱は、各々放熱シート2c、3cを介して放熱板2b、3bに流れるが、その後、放熱座6のみを介して筐体50に流入するようになっている。
つまり、放熱板2b、3bから放熱座を介しての筐体50への熱伝導は、テレビジョンカメラの筐体50の前方のみに放熱座6を設け、従来技術での放熱座7は廃止することにより隙間を確保し、ファン60への風の流れを良くしている。
なお、放熱座6は、筐体50との一体構造が望ましいが、別部品で取り付けても同様の効果がある。
Here, in the embodiment of the present invention shown in FIGS. 1 and 2, as shown in the figure, the heat radiating plates 2 b and 3 b are fixed to the heat radiating seat 6 with fixing screws 51 in order to radiate heat to the housing 50. It is concluded with.
Accordingly, the heat generated in the electronic circuit devices 2a and 3a on the circuit boards 2 and 3 flows to the heat radiating plates 2b and 3b through the heat radiating sheets 2c and 3c, respectively, but thereafter, the housing 50 is connected only through the heat radiating seat 6. To flow into.
That is, for heat conduction from the heat radiating plates 2b and 3b to the housing 50 through the heat radiating seat, the heat radiating seat 6 is provided only in front of the housing 50 of the television camera, and the heat radiating seat 7 in the prior art is eliminated. This secures a gap and improves the flow of wind to the fan 60.
The heat dissipating seat 6 preferably has an integral structure with the housing 50, but the same effect can be obtained even if it is attached as a separate part.

また、放熱板2b、3bは、板厚0.5mm程度の薄く熱伝導性の良い銅を用いる(アルミニウムでも可能だが、熱伝導率が約45%悪くなる)。さらに、放熱板2b、3bと電子回路デバイス2a、3aとの接触抵抗を少なくするために、電子回路デバイス2a、3aの上には薄い熱伝導シート2c、3cを取り付け、放熱板2b、3bと回路基板3、4との間にオサエスポンジ2d、3dを入れることにより、板厚の薄い放熱板2b、3bのバネ性を利用し密着性を向上させるだけではなく、放熱板2b、3bを薄くすることにより、筐体50の底部および側面下部からの吸気口の風の流れの抵抗を低減させ放熱を促進させることができる。 Moreover, the heat sinks 2b and 3b are made of copper having a thin plate thickness of about 0.5 mm and good thermal conductivity (although aluminum can be used, the thermal conductivity is deteriorated by about 45%). Further, in order to reduce the contact resistance between the heat sinks 2b and 3b and the electronic circuit devices 2a and 3a, thin heat conductive sheets 2c and 3c are attached on the electronic circuit devices 2a and 3a, and the heat sinks 2b and 3b By inserting Osae sponges 2d and 3d between the circuit boards 3 and 4, not only is the spring property of the thin heat sinks 2b and 3b improved, but the heat sinks 2b and 3b are thinned. By doing so, it is possible to reduce the resistance of the airflow from the inlet port from the bottom and the lower side of the housing 50 and promote heat dissipation.

1:回路基板(マザーボード)、2:回路基板、2a:電子回路デバイス、2b:放熱板、2c:放熱シート、2d:オサエスポンジ、3:回路基板、3a:電子回路デバイス、3b:放熱板、3c:放熱シート、3d:オサエスポンジ、4:回路基板、4a:電子回路デバイス、4c:放熱シート、5:コネクタ、6:放熱座、7:放熱座、20b:放熱板、20c:放熱シート、30b:放熱板、30c:放熱シート、50:筐体、50a:放熱フィン、50b:吸気口、50c:排気口、51:固定ネジ、52:固定ネジ、60:ファン。

1: circuit board (motherboard), 2: circuit board, 2a: electronic circuit device, 2b: heat dissipation plate, 2c: heat dissipation sheet, 2d: osae sponge, 3: circuit board, 3a: electronic circuit device, 3b: heat dissipation plate, 3c: heat dissipation sheet, 3d: osae sponge, 4: circuit board, 4a: electronic circuit device, 4c: heat dissipation sheet, 5: connector, 6: heat dissipation seat, 7: heat dissipation seat, 20b: heat dissipation plate, 20c: heat dissipation sheet, 30b: heat radiating plate, 30c: heat radiating sheet, 50: housing, 50a: heat radiating fin, 50b: air inlet, 50c: air outlet, 51: fixing screw, 52: fixing screw, 60: fan.

Claims (1)

筐体内部に熱結合した放熱板を備え、当該筐体に積み重なるように搭載された複数の回路基板それぞれに実装された電子回路デバイスにより発生した熱を、前記放熱板を介して前記筐体に熱伝導して前記筐体外部に放熱するテレビジョンカメラにおいて、
前記放熱板は、板厚の薄い熱伝導性の良い金属で形成され、また、前記回路基板間に搭載されると共に、電子回路デバイスとの間で熱伝導シートを介して取り付けられ、更に、隣り合う回路基板との間にオサエスポンジを備えることにより、板厚の薄い放熱板のバネ性を利用し密着性を向上させることを特徴とするテレビジョンカメラ。
A heat sink thermally coupled to the inside of the housing is provided, and heat generated by the electronic circuit devices mounted on each of the plurality of circuit boards mounted so as to be stacked on the housing is transmitted to the housing via the heat sink. In a television camera that conducts heat and dissipates heat outside the housing,
The heat radiating plate is formed of a thin metal having good thermal conductivity, and is mounted between the circuit boards and attached to the electronic circuit device via a heat conductive sheet. A television camera characterized in that, by providing an osae sponge between matching circuit boards, the spring property of a thin heat sink is used to improve adhesion.
JP2010034580A 2010-02-19 2010-02-19 Television camera Pending JP2011172055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010034580A JP2011172055A (en) 2010-02-19 2010-02-19 Television camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010034580A JP2011172055A (en) 2010-02-19 2010-02-19 Television camera

Publications (1)

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JP2011172055A true JP2011172055A (en) 2011-09-01

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JP2010034580A Pending JP2011172055A (en) 2010-02-19 2010-02-19 Television camera

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104932175A (en) * 2015-07-08 2015-09-23 北京旷视科技有限公司 Camera

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104932175A (en) * 2015-07-08 2015-09-23 北京旷视科技有限公司 Camera

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