JP2011171580A - Heat sink including placing means - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a new (sub-assembled) heat sink for continuously assembling a placing means for fixing the heat sink onto a circuit board to a body of the heat sink. <P>SOLUTION: The heat sink 1 includes a movable catch piece 6 on which energization of a spring member 4 continuously operates between a spring member 4 and the body 2 of the heat sink. By appropriately changing a position of the catch piece 6, the catch piece 6 is locked to one portion of the body 2 of the heat sink, such as a locking projection 25 for assembly, thus obtaining a sub-assembled state for assembling the spring member 4 to the body 2 of the heat sink. Also, when placing the body 2 of the heat sink on the circuit board B, a position of the catch piece 6 is changed, the sub-assembled state is released, and the catch piece 6 is locked to an anchor 5 (locking level difference 54), thus placing the body 2 of the heat sink on the circuit board B. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat sink that is mounted to efficiently release heat generated from electronic components (semiconductor circuit elements) such as a microprocessor and an inverter, and in particular, means for mounting the heat sink on a circuit board. Is a new heat sink that is always assembled (sub-assembled) to the heat sink body.

Since the semiconductor circuit element mounted on the circuit board generates heat with the operation of the electronic device, in order to efficiently release this heat, the heat sink (heat Replacement parts) are installed. As the performance of semiconductor circuit elements increases, the density of circuit boards becomes higher and the necessity for fixing high-performance heat sinks quickly and accurately with a small mounting area is increasing.
Conventionally, when mounting (fixing) the heat sink 1 ′ on the circuit board B, for example, as shown in FIG. 17, mounting means 3 ′ using a substantially Z-shaped wire spring 41 ′ when viewed from the plane (for example, Patent Documents) 1) or mounting means 3 'using a push pin P as shown in FIG. 18 (a), or a mounting technique 3' by screwing as shown in FIG. 18 (b). Etc.) are known.

Among these, the mounting means 3 ′ using the wire spring 41 ′ shown in Patent Document 1 and FIG. 17 has a circuit of a substantially U-shaped part (anchor 5 ′) for hooking both ends of the wire spring 41 ′ in advance. The heat sink 1 'is pressed by the wire spring 41' after being installed on the substrate B, and then hooked (inserted) into the U-shaped portion of the anchor 5 'while bending both ends of the spring, and the heat sink 1' is mounted. It is pressed and fixed to the circuit board B side.
As shown in the enlarged view of FIG. 17A, the anchor 5 ′ is installed from the side opposite to the mounting surface of the heat sink 1 ′ (the back side of the substrate), and as shown in FIG. 17B, In some cases, the anchor 5 'is installed from the upper surface of the circuit board B (the mounting surface side of the heat sink 1'), and the anchor 5 'is installed from the rear surface of the circuit board. A bowl-shaped omission-preventing portion 52 'is formed so that ′ does not escape from the circuit board B. On the other hand, in the case of FIG. 17B in which the anchor 5 ′ is installed from the upper surface of the substrate, it is necessary to fix the portion protruding to the rear surface of the substrate with solder or the like.

Here, the mounting means 3 'using the wire spring 41' has the following problems.
First, the normal anchor 5 ′ is arranged at two locations on the outside of the heat sink 1 ′ (outside the range where the heat sink 1 ′ is mounted) and diagonally because of the structure in which both ends of the wire spring 41 ′ are hooked. Therefore, there is a problem that the effective area of the circuit board B is reduced (the circuit board B is mounted with various members in addition to the heat sink 1 '(semiconductor circuit element)). .
In such mounting means 3 ', the heat sink 1' is normally fixed on the circuit board B only by the pressing force of the wire spring 41 ', so that it can be fixed at an accurate position with respect to the circuit board B. was difficult. That is, when fixing the heat sink 1 ′ using the wire spring 41 ′, the tip of the wire spring 41 ′ is hooked and fixed to the anchor 5 ′ one by one, but the wire having one end already hooked to the anchor 5 ′. Naturally, the spring 41 ′ has a corresponding elastic force and twist. The spring 41 is bent against the spring 41, and the other end is hooked and fixed on the other anchor 5 ′. As a result, the heat sink 1 'also moved slightly (occurrence of deviation). Such a shift is a phenomenon that occurs inevitably because the wire spring 41 ′ is slightly twisted during fixing even if the heat sink 1 ′ is fixed while being held at a predetermined position.
In general, a heat conductive sheet is provided between the heat sink 1 'and the semiconductor circuit element in order to increase the heat exchange efficiency. The above-described misalignment causes damage to the heat conductive sheet. In addition, there are concerns that similar problems may occur due to vibrations associated with the operation of electronic devices during use.

  Further, in this mounting means 3 ', since the wire spring 41' is not assembled to the heat sink 1 '(since it is not sub-assembled), the wire spring 41' is combined with the heat sink 1 'in the mounting step (heat sink 1' Even when the wire spring 41 'is supplied to the circuit board B), the wire spring 41' may be lost during the supply. Further, if the wire spring 41 'is separated (separated) from the heat sink 1', there is a problem that efficient mounting work cannot be performed. That is, since there are various types (specifications) of the heat sink 1 ', the pressing force (elastic force) according to each specification is prescribed, and therefore various types of wire springs 41' exist and are attached. If the means 3 ′ is not sub-assembled with the heat sink 1 ′, for example, various wire springs 41 ′ may be mixed, and it is extremely difficult to perform the mounting operation efficiently.

Next, the mounting means 3 'using the push pin P will be described. First, as shown in FIG. 18A, the push pin P has a flange portion P2 formed at one end of the pin-shaped shaft portion P1, and prevents the pin from coming off after being inserted into the other end side (insertion end side). A bulging portion P3 to be formed and a slit P4 that can elastically shrink the bulging portion P3 are formed. Further, in the mounting means 3 ', an insertion hole P5 for passing the push pin P (shaft portion P1) is formed in the heat sink 1' and the circuit board B, and further, the push pin P and the heat sink 1 ' A coil spring P6 is provided between them.
Here, the bulging portion P3 of the push pin P is naturally formed larger than the insertion hole P5. However, when the push pin P is inserted, the bulge is formed because the slit P4 is formed. The portion P3 is bent so as to be small as a whole and penetrates the insertion hole P5. Further, after penetrating to the circuit board B, the bulging part P3 protrudes from the back surface of the board and returns to the original expanded state, and the interval between the heat sink 1 '(base part 21') and the flange part P2 is set to the coil spring P6. In order to maintain a dimension shorter than the natural length, the heat sink 1 'is pressed against the circuit board B side by the elastic force of the coil spring P6 and fixed (mounted state).

And the following points are mentioned as problems of the mounting means 3 ′ by such push pins P.
First, in order to remove the heat sink 1 'once mounted on the circuit board B, the bulging portion P3 of the push pin P must be narrowed (because the bulging portion P3 must be pinched to be entirely contracted). ), This removal work inevitably becomes an operation from the back side of the substrate. That is, since such a circuit board B is usually housed in the housing, in order to remove the heat sink 1 ′, the circuit board B itself is first removed from the housing, which is a laborious operation. It was.
Further, to remove the heat sink 1 'once mounted, the bulging portion P3 is pinched and pushed out from the insertion hole P5 as described above, so that the pinch force is excessive or the insertion hole P5 When the wear (wearing) is remarkable, there is a problem that the bulging portion P3 is damaged by several removals, or the elastic force by the slit P4 is lost, and it cannot be reused.
Also, the diameter of the push pin P (shaft portion P1) tends to be relatively large due to the formation of the slit P4 in the bulging portion P3 and the provision of the coil spring P6 having a sufficient mounting force (pressing force). (It is impossible to increase only the winding diameter of the coil spring P6). Therefore, there is a problem that the effective area of the circuit board B is reduced.
Of course, the push pin P must be formed with a bulge P3 and a slit P4 at the tip, and it must have a sufficient mounting force but cannot be easily pulled out during normal use. For this reason, the fact that the push pin P is designed and processed requires a relatively large amount of time, which is one factor for avoiding the mounting means 3 '.

Next, the mounting means 3 'by screwing will be described. The mounting means 3 ′ by screwing is also similar to the mounting means 3 ′ by the push pin P used in combination with the coil spring P 6. The difference is that, as an example, as shown in FIG. However, it is not a bulging part with a slit, but a point formed in a male screw shape. Of course, an appropriate guide (shape) for facilitating the screwing operation, such as a cross hole, is formed on the head of the screw S (the flange S2). For this reason, in the mounting means 3 ′ by screwing, a fastening member such as a nut or a standoff is fixed to the back surface or the top surface of the substrate, and the screw S penetrating the heat sink 1 ′ is fastened. It is necessary to screw (fasten) the member.
The problem with the mounting means 3 'is that the fastening member must be provided on the circuit board B, and the effective area of the circuit board B is reduced by the fastening member.
In order to prevent overtightening of the screw S, the use of a stepped screw or the like is considered, but such a member is expensive and causes a total cost increase of the mounting means 3 '. .

JP 2005-150192 A

  The present invention has been made in view of such a background, and the attachment means such as a wire spring is sub-assembled to the heat sink body so that it can be quickly and reliably attached to a narrow attachment area by a simple operation. This is an attempt to develop a new heat sink.

  That is, the heat sink having the mounting means according to claim 1 uses a spring member as a heat sink body including a base portion that is pressure-bonded to a semiconductor circuit element on a circuit board and a radiating fin protruding from the base portion. In the heat sink that is mounted on the circuit board, a catch piece is provided in a movable state between the spring member and the heat sink body, and the spring member is always biased by the catch piece. In order to obtain a sub-assembly state in which the spring member is assembled to the heat sink main body before the heat sink main body is mounted on the circuit board, the position of the catch piece is appropriately changed so that The catch piece is locked to the part, and the sub-assy state is obtained. It is those composed of Te.

  In addition to the requirement of claim 1, the heat sink having the mounting means according to claim 2 has an anchor for mounting the heat sink body on the circuit board on the mounting side of the heat sink body. When the heat sink main body is mounted on the circuit board, by changing the position of the catch piece, the sub-assy state is released and the catch piece is hooked on the anchor. The heat sink main body is mounted on the circuit board.

  In addition to the requirement of claim 2, the heat sink provided with the mounting means according to claim 3 also uses the anchor as a positioning of the heat sink body when mounting the heat sink body on the circuit board. It consists of

  In addition to the requirements of claim 2 or 3, the heat sink having the mounting means according to claim 4 is characterized in that the anchor installed on the circuit board is provided inside the range where the heat sink is mounted. It consists of

  In addition to the requirements of claim 1, 2, 3 or 4, the heat sink having the mounting means according to claim 5 is provided with a locking mechanism for preventing the catch piece from moving in the sub-assy state. Thus, the catch piece in the sub-assy state is not moved in the mounting direction.

  In addition to the requirement described in claim 5, the heat sink having the mounting means according to claim 6 mounts the heat sink body on the circuit board with the catch piece locked in the sub-assy state as it is. It becomes the positioning posture at the time, and also becomes the initial position in the mounting process.

  In addition to the requirements described in claim 2, 3, 4, 5 or 6, the heat sink having the mounting means according to claim 7 is mounted in a mounted state in which the heat sink body is mounted on the circuit board. A lock mechanism for preventing the movement of the catch piece is provided, whereby the attached catch piece is prevented from moving in the sub-assembly direction.

  Further, in addition to the requirements of claim 1, 2, 3, 4, 5, 6 or 7, the heat sink comprising the mounting means according to claim 8, the catch piece is assembled to the heat sink body in a movable state, It is characterized by being formed so as not to be always separated from the heat sink body.

The above-described problems can be solved by using the configuration of the invention described in each of the claims.
That is, according to the first aspect of the present invention, the spring member, which is originally a member completely different from the heat sink body, can be assembled to the heat sink body by interposing the catch piece. For this reason, for example, the spring member is not separated from the heat sink body until the heat sink is mounted on the circuit board, so that the spring member can be prevented from being lost, and the mounting workability is improved.
In this specification, regarding the catch piece, the description “provides a catch piece between the spring member and the heat sink body” and the description “inserts the catch piece between the spring member and the heat sink body”. However, the term “between” and “intervene” here means that the spring member, catch piece, and heat sink body (locking protrusion for assembly) are intermediate in terms of how the force is applied and the operational process in transmission. It does not simply indicate the positional relationship / installation location in the sub-assy state or the like. In other words, for example, in the sub-assy state, the catch piece is always urged upward (in the protruding direction of the radiating fin) by the spring member, and this upwardly urged catch piece is the heat sink body (assembly locking projection) The catch piece is provided between the spring member and the heat sink body on the path of this force.

  According to the invention described in claim 2, since the spring member is indirectly hooked on the anchor by applying the catch piece and the heat sink is mounted on the circuit board, the effective area of the circuit board is not reduced. In addition, it is possible to switch between the sub-assy state and the mounted state at low cost. That is, the push pin mounting means has a relatively large diameter because the coil spring is externally fitted to the push pin and the shaft tip is provided with a slit and a bulging portion. The effective area of the circuit board may be reduced. However, in the present invention, an anchor having a small diameter is sufficient, and the effective area is not reduced. In addition, in the mounting means using screws, it is very expensive to use a stepped screw or the like, but in the present invention, since it is an indirect mounting means for hooking the spring member to the anchor, there are no expensive members, Can be manufactured at low cost.

According to the third aspect of the present invention, since positioning exists first, when the heat sink body is mounted on the circuit board, the heat sink body can be held at an accurate position of the board. For this reason, the heat sink main body is not displaced from the specified position even during mounting or use, and there is no fear of damaging the semiconductor circuit element or the heat conductive sheet.
In addition, since the anchor that indirectly hooks the spring member is also used as positioning, the board area can be used effectively, and at the same time, the number of components is reduced (the number of components is reduced) and the weight of the heat sink is reduced. And there is an effect of cost reduction.

  According to the fourth aspect of the invention, since the anchor is provided inside the range where the heat sink is mounted, the circuit board surface can be used more effectively. In total, the heat sink can be mounted quickly and reliably in a small area.

  According to the fifth aspect of the present invention, since the lock mechanism for maintaining the sub-assy state is provided, the heat sink can be supplied to the mounting step in this locked state. That is, even if a certain amount of vibration is applied to the heat sink in the sub-assy state during transportation during supply, the sub-assy state is maintained by the lock mechanism. For this reason, a spring member does not come off from a heat sink, and the workability | operativity of a mounting process can be improved more.

  According to the invention of claim 6, since the sub-assy state (lock) is in the positioning posture as it is and is also the initial position in the mounting process, the sub-assy state can be smoothly transferred to the mounting process, The workability of the mounting work is further improved.

  According to the seventh aspect of the invention, since the lock mechanism for maintaining the mounting state is provided, the heat sink can be continuously maintained in the locked state during operation of the electronic device. That is, during the operation of the electronic device, vibration or the like accompanying the operation is assumed, but even when a certain amount of vibration or the like is applied, the mounting state can be firmly maintained by the lock mechanism.

  According to the eighth aspect of the invention, the catch piece for assembling the spring member to the heat sink body is assembled to the heat sink body in a movable state so as not to be separated, so that separation of the spring member from the heat sink body can be eliminated. it can. In addition, since the catch piece is assembled to the heat sink body, it is easy to carry out the work in the sub-assembly or the mounting process, and the total workability is improved.

It is a disassembled perspective view which shows the heat sink (Example 1) provided with the mounting means of this invention. It is a perspective view (a) which is a heat sink of Example 1 same as the above, and partially shows a subassembly state, and a perspective view (b) which shows a mounting state partially. When mounting the heat sink (Example 1) made into a subassembly on a circuit board, it is explanatory drawing (a) which shows a mode that this heat sink is positioned, and explanatory drawing (b) which shows the mode after positioning. It is explanatory drawing which shows in steps from the positioning state (mounting start state) on a circuit board to a mounting completion state about the heat sink (Example 1) performed to positioning on a circuit board after subassembly. It is explanatory drawing which shows the heat sink (Example 2) provided with the mounting means of this invention by the state (state which is not mounted | worn with a circuit board) only by subassembly. It is explanatory drawing which shows the mounting state of the heat sink of Example 2 same as the above. Regarding the heat sink (Embodiment 2) that has been subjected to positioning on the circuit board after subassembly, an explanatory diagram (a) showing the positioning state (mounting start state) on the circuit board and an explanatory diagram showing the mounting completion state ( b). The exploded perspective view (a) which shows partially the heat sink (Example 3) provided with the mounting means of this invention, the perspective view (b) which shows a sub assembly state (state which is not mounted | worn to a circuit board), and explanatory drawing (C). It is explanatory drawing (a) which shows the state which mounted the heat sink (Example 3) made into sub assembly on the circuit board, and performed to positioning, and explanatory drawing (b) which shows a mounting completion state. It is explanatory drawing which shows in steps from the positioning state (mounting start state) on a circuit board to a mounting completion state about the heat sink (Example 3) performed to positioning on a circuit board after subassembly. It is a perspective view which shows the other Example which formed the positioning formed in a heat sink main body in groove shape. It is a perspective view which shows the other Example to which a plate-shaped anchor is applied. It is sectional drawing (a) which shows the other Example using the coil spring as a spring member, and a perspective view (b). It is explanatory drawing which shows the other Example using the height difference by a taper instead of a protrusion in locking a mounting state. It is explanatory drawing which shows the other Example which provided the anchor outside the heat sink. It is explanatory drawing which shows the other Example which provided the pillar for height adjustment in the heat sink in order to adjust the mounting force (pressing force) by a spring member, when mounting a heat sink main body on a circuit board. It is the perspective view (a) which shows the conventional mounting means using a wire spring, and explanatory drawing (b) which is an anchor which can be applied with this mounting means, and is the type attached from the upper surface of a circuit board. They are explanatory drawing (a) which shows the conventional mounting means using a pushpin, and a perspective view (b) which expands and shows the screw used for the conventional mounting means by screwing.

  The mode for carrying out the present invention includes one described in the following embodiments, and further includes various methods that can be improved within the technical idea.

The heat sink 1 provided with the mounting means of the present invention is detachably mounted on the circuit board B. First, the circuit board B on which the heat sink 1 is mounted will be described.
The circuit board B is mounted (mounted) with, for example, a semiconductor circuit element C such as a GPU unit, a chip set unit, or a CPU unit, and the semiconductor circuit element C generates heat as the electronic device operates, so that the heat sink Efficient heat dissipation from the semiconductor circuit element C is achieved by attaching 1 to the semiconductor circuit element C in a crimped state.
In the present invention, the spring member 4 for mounting the heat sink 1 on the circuit board B is assembled to the heat sink in advance (subassembly), and the heat sink 1 is supplied to the mounting process (final assembly process). In this case, the spring member 4 is prevented from being separated / dropped off from the heat sink 1.

In this specification, attaching (fixing) the heat sink 1 on the circuit board B is referred to as “attached”, and the attached state is referred to as “attached state”. On the other hand, attaching (accompanying) the spring member 4 to the heat sink 1 is referred to as “assembly” or “sub-assembly”, and the assembled state is referred to as “sub-assembly state”.
Further, when the spring member 4 is assembled to the heat sink 1 (to achieve sub-assembly), a catch piece 6 described later is interposed (provided), and depending on the form of the catch piece 6 and the form of sub-assembly. The heat sink 1 will be described separately in Examples 1 to 3. For this reason, when the heat sinks 1 of the respective embodiments are distinguished from each other, the respective heat sinks 1 of the first to third embodiments are denoted by “1A”, “1B”, and “1C”.

As shown in FIG. 1 as an example, the heat sink 1 (1A) provided with the mounting means of the present invention includes a heat sink body 2 mainly responsible for heat dissipation and a mounting means for mounting the heat sink body 2 on the circuit board B. 3 and comprising.
The heat sink main body 2 is formed of a material having excellent thermal conductivity and heat dissipation, such as aluminum, and basically has a structure in which a large number of heat radiation fins 22 protrude from the plate-like base portion 21.
Further, in the base portion 21, the surface on which the heat radiation fins 22 are not formed becomes a contact surface to be crimped (contacted) with the semiconductor circuit element C, and a heat conductive sheet for promoting heat conduction is provided here. Is common.
In addition, the heat sink 1 has a positioning 23 for mounting the heat sink 1 on the circuit board B. In this embodiment, the anchor 5 fixed in a protruding state from the circuit board B (back surface) is attached to the base portion. The heat sink 1 is positioned by passing through 21. Therefore, the positioning 23 of this embodiment is a combination of the anchor 5 and a through hole opened in the base portion 21.

  Next, the mounting means 3 will be described. The mounting means 3 is a means for mounting the heat sink body 2 on the circuit board B as described above, and includes the spring member 4, the anchor 5, and the catch piece 6. Of course, as described above, when mounting, the heat sink body 2 is first held by the positioning 23 so as not to deviate from the specified position. Therefore, the positioning 23 and other members related to the mounting are used. (Posts 24 and the like described later) are also included in the mounting means 3. Hereinafter, the spring member 4, the anchor 5, and the catch piece 6 will be described.

The spring member 4 is mainly mounted by pressing the heat sink 1 against the circuit board B side, and here, as an example, as shown in FIG. 1, a wire spring 41 having a substantially Z shape as viewed from above is applied. . That is, the wire spring 41 is a so-called torsion bar type spring, and includes arm portions 43 on both sides of the central torsion portion 42 in the middle portion, and uses the repulsive force when both arm portions 43 are twisted. Then, the heat sink 1 is pressed against the circuit board B and attached. In other words, the wire spring 41 acts so as to always urge the catch piece 6 upward (in the protruding direction of the radiating fins 22).
Here, in the present embodiment, the central torsion part 42 is formed in a substantially straight straight bar shape, and here, the heat sink 1 (base part 21) is entirely pressed (the central torsion part 42 is entirely in contact with the base part 21). However, the central torsion part 42 is not necessarily limited to this. For example, the central torsion part 42 is formed in a substantially V shape, and the base part 21 may be pressed at substantially one point in the middle of the central torsion part 42. Possible (so-called point contact state).
Further, the distal end sides of both arm portions 43 are folded back so as to be substantially parallel to the central torsion portion 42 (this is referred to as a folded portion 44), and the catch pieces are utilized using the arm portion 43 and the folded portion 44. 6 is held in a movable state (connected).
The spring member 4 is originally a member for mounting the heat sink 1 on the circuit board B as described above. However, in the present invention, the spring member 4 is also used to make a sub-assembly.

Next, the anchor 5 will be described. As described above, the anchor 5 is installed in a protruding state on the mounting surface side of the heat sink 1 on the circuit board B, and the catch piece 6 held by the wire spring 41 is hooked on the anchor 5. The mounting of the heat sink 1 is intended. Therefore, as shown in FIG. 1 as an example, the anchor 5 has a pin-shaped (shaft-shaped) main body portion 51 as a main portion, and one end (terminal portion) of the anchor 5 includes a hook-shaped drop prevention portion 52, where The anchor 5 installed (press-fitted) on the circuit board B is prevented from coming off. In addition, a small-diameter portion 53 that is somewhat thinner than the main body 51 is formed at a position near the tip of the anchor 5, and a latching step 54 that hooks the catch piece 6 is formed by the small-diameter portion 53 and the tip. The anchor 5 is preferably formed in a somewhat narrowed (conical) shape on the tip side so that it can be easily inserted into the circuit board B and received in the catch piece 6. Part 55.
Reference numeral 56 in the figure denotes a knurled portion formed near the end of the main body 51, which is a process for increasing the fixing force of the anchor 5 press-fitted into the circuit board B. (In this case, the circuit board B into which the anchor 5 is press-fitted is also subjected to drilling corresponding to serration). Of course, as long as the anchor 5 can be firmly installed on the circuit board B, such knurl processing or the like is not particularly performed, and it may be merely joined by an adhesive or soldering. Incidentally, symbol H in the figure is an attachment hole opened in the circuit board B in order to fix (press-fit) the anchor 5.

In this embodiment, as described above, the anchor 5 for mounting the heat sink 1 is also used as the positioning 23 of the heat sink 1. Therefore, a positioning hole (here circular) through which the main body 51 of the anchor 5 passes is opened in the heat sink main body 2 (base portion 21). That is, when the heat sink 1 is mounted on the circuit board B, the heat sink body 2 is first positioned with the anchor 5 protruding on the circuit board B (in a state where the heat sink 1 is held in a prescribed position). Even if the arm portion 43 of the wire spring 41 is twisted during mounting, the position of the heat sink 1 does not shift.
And since the positioning 23 (hole) is formed in the heat sink main body 2, the fin fin 22 of this part is formed slightly short, for example so that it may not interfere with the positioning 23. The movement (movability) of the catch piece 6 in the vertical direction is restricted (this is referred to as a post 24).
The post 24 is formed with an assembly locking projection 25 for locking with the catch piece 6 in a sub-assy state (not mounted on the circuit board B). The catch piece 6 urged upward (in the protruding direction of the radiating fin 22) is pressed at the lower end (step) of the assembling locking convex portion 25, and the sub The assembly state is obtained. In other words, the wire spring 41 is formed completely separate from the heat sink body 2 by holding the catch piece 6 on the wire spring 41 and locking the catch piece 6 on the locking projection 25 for assembly of the post 24. 41 is assembled to the heat sink body 2.

  Next, the catch piece 6 will be described. The catch piece 6 is held (connected) in a movable state by the wire spring 41, and this is the position / posture of the catch piece 6 that is locked to the assembly locking projection 25 in the sub-assembly state. This is because the engagement is released and the catch piece 6 is hooked on the hooking step 54 of the anchor 5 so that the heat sink 1 is mounted. Of course, when the catch piece 6 is in the sub-assy state, that is, in a state where the catch piece 6 is locked to the assembly locking projection 25, the latch with the anchor 5 is released.

  Here, the usage of the terms “locking” and “hanging” in this specification will be described. The term “locking” as used herein refers to a state where the catch piece 6 is hooked on the mounting locking projection 25 (heat sink body 2) (sub-assy state). The catch piece 6 is in a state of being caught on the anchor 5 (attached state). This is a state in which the upward biasing of the catch piece 6 is restricted (blocked), and there is no clear distinction (strict distinction) in that the catch piece 6 is hooked to achieve coupling. In the book, for the sake of easy understanding, the catch piece 6 is distinguished according to whether it is in the sub-assy state or the mounted state. However, in general, in a mounting state in which the heat sink 1 is fixed to the circuit board B, it is necessary to almost completely avoid this state (unintentionally) being released. The “mounting” is a state in which the (mounting) is actively held and a strong catch is exerted.

  As shown in FIG. 1 as an example, the catch piece 6 is formed by forming an anchor receiving opening 62 in a plate-like main body 61, and the main body 61 is movable by a wire spring 41. A held portion 63 that is held (connected) in a state is formed. Specifically, a part of the main body portion 61 is curved and formed so as to be substantially parallel to the flat main body portion 61 (this is the held portion 63), and the wire is formed between the main body portion 61 and the held portion 63. The spring 41 (mainly the arm portion 43) is received in a clamped state, and the catch piece 6 is held in a movable state. More specifically, while the arm portion 43 and the folded portion 44 of the wire spring 41 are supported from above by the main body portion 61, the arm portion 43 is also supported from below by the held portion 63, and the slide movement of the catch piece 6 is performed. It is possible.

The opening 62 includes a through opening 62a that allows passage of the assembly locking projection 25 and the anchor 5 of the post 24, a locking opening 62b that blocks passage of the assembly locking projection 25, and an anchor. 5 is provided with a latching opening 62c that prevents passage of the main body 51, and a locking opening 62b and a latching opening 62c are formed on both sides of the penetrating opening 62a continuously to the penetrating opening 62a. The
The opening 62 will be described in more detail. The through-opening 62a is opened in a rectangular shape larger than the assembly locking projection 25 and the main body 51 of the anchor 5 as an example, and allows the passage thereof. It is formed. The locking opening 62b is formed in a rectangular shape that allows only the post 24 portion on which the assembly locking projection 25 is not formed to pass, and the edge of the opening is the assembly locking projection. 25 (see FIG. 2A) and formed so as to prevent passage of the assembly locking projection 25 (sub-assy state). The latching opening 62c is larger than the small-diameter portion 53 of the anchor 5, but is smaller than the main body 51, that is, is formed in a size that allows only the small-diameter portion 53 to be fitted. The end edge is latched on the latching step 54 (see FIG. 2B), and the passage of the main body 51 is blocked (mounted state).

  Further, the catch piece 6 has protrusions formed on both sides of the through-opening 62a (both sides of the opening edge), and the protrusion formed at the boundary between the through-opening 62a and the locking opening 62b is for assembly. The catch piece 6 locked to the locking projection 25 is prevented from sliding in the width direction (lateral movement) of the radiating fin 22 (see FIG. 2A), so to speak, the sub-assy state is maintained. (This is referred to as a sub-assy state lock 64). On the other hand, the projections formed at the boundary between the penetrating opening 62a and the latching opening 62c serve to prevent the catch piece 6 that is latched on the latching step 54 of the anchor 5 from sliding (lateral movement). (Refer to FIG. 2B), that is, a lock protrusion for maintaining the mounting state (this is referred to as a mounting state lock 65).

The heat sink 1 (Embodiment 1) having the mounting means of the present invention has the basic structure as described above, and the operation mode of the heat sink 1 will be described below. In the description, the sub-assy state in which the wire spring 41 is simply assembled to the heat sink body 2 (not attached to the circuit board B) and the process of attaching it, that is, the heat sink 1 positioned on the circuit board B is actually used. The explanation will be divided into the situation until installation.
(1) Sub-Assembly State To achieve sub-assembly, while holding the catch piece 6 on the arm portion 43 of the wire spring 41 (while connecting), hold the catch piece 6 against the elasticity of the wire spring 41. On the other hand, as shown in the enlarged plan view of FIG. 1, the through hole 62 a and the locking opening 62 b are used to fit into the post 24. At this time, the catch piece 6 is fitted so that the assembly locking projection 25 is accommodated in the through-opening 62a as viewed from above.

Further, when the fitting is inserted, the catch piece 6 is slid (moved in the lateral direction) when the penetrating opening 62a (strictly, the sub-assy state lock 64) reaches a position lower than the engaging projection 25 for assembly. Therefore, the catch piece 6 is moved (slid) so that the sub-assy state lock 64 (protrusion) passes under the assembly locking projection 25 and the downward pressing of the catch piece 6 is released. . The catch piece 6 is urged upward by the wire spring 41 by the release of the pressing, but as shown in FIG. 2A, the end edge of the locking opening 62b is the mounting locking convex portion 25. And the upward biasing of the catch piece 6 is prevented. Further, in the sub-assy state, the catch piece 6 is fixed in such a state. As a result, the catch piece 6 acts to press both ends of the wire spring 41, and the wire spring 41 is attached to the heat sink body 2. It can be assembled.
Note that such a movement (moving in the lower left direction in FIG. 2 (a)) in which the catch piece 6 fitted in the post 24 is slid (laterally moved) to form a sub-assembly is referred to as “sub It is defined as “movement in the assembly direction (slide)”.

  Further, in this sub-assembly state, the sub-assembly state lock 64 (protrusions) causes the catch piece 6 to slide in the direction of releasing the locking state, that is, the through-opening 62a is aligned with the mounting locking convex portion 25. Since such sliding is prevented, the sub-assy state is maintained. That is, the wire spring 41 is sub-assembled with the heat sink main body 2 by the catch piece 6 and supplied to the mounting process (final assembly process). Even if 6 tries to slide in the direction of releasing the locked state, the sub-assy state lock 64 (protrusion) abuts on the locking protrusion 25 for assembly, and thus such sliding is prevented. For this reason, the catch pieces 6 and the wire springs 41 that have been sub-assembled do not fall off the heat sink 1 during supply.

(2) Positioning Furthermore, in this embodiment, as shown in FIG. 3A as an example, in this sub-assy state (locked state), the through-opening 62a of the catch piece 6 is positioned in the positioning 23 ( Hole). This is because if the sub-assembled heat sink 1 is positioned at a fixed position on the circuit board B, it is considered that the anchor 5 faces the through-opening 62a as it is and can immediately shift to the mounting process.
That is, in order to mount the heat sink 1 in the sub-assy state (locked state) on the circuit board B, first, the positioning 23 (hole) of the heat sink body 2 is fixed to the circuit board B as shown in FIG. The heat sink body 2 is positioned by fitting into the anchor 5. In this embodiment, as shown in FIG. 3B, the anchor 5 (receiving tip 55) penetrating the positioning 23 (hole) is inserted into the penetrating opening 62 a of the opening 62 by this positioning (insertion) operation. It is located to face. Of course, this positioning completion state is a state in which, as described above, when the catch piece 6 is pushed downward, the anchor 5 is relatively lifted and passes through the penetration opening 62a as it is. That is, in this embodiment, the sub-assy state (locked state) is also the initial position in the mounting process.

Thus, in this embodiment, it is extremely epoch-making that the catch piece 6 locked in the sub-assy state becomes the positioning posture in this posture and also becomes the initial position in the mounting process. In other words, it is possible to sub-assemble the wire spring 41 to the heat sink body 2 using only the catch piece 6 without providing the sub-assy state lock 64, and there is a corresponding effect. If the piece 6 moves freely, the positions of the catch pieces 6 become uneven during supply (separately), and when the heat sink 1 is mounted on the circuit board B, the initial position of the catch pieces 6 is first set to the same. It may be necessary to set one by one. However, in this embodiment, the initial position of the catch piece 6 can be set simultaneously with the sub-assembly (that is, it becomes unnecessary), and the heat sink 1 can be mounted more efficiently.
Hereinafter, a mode in which the heat sink 1 is mounted on the circuit board B will be described.

(3) Mounting mode (after positioning)
After positioning the heat sink 1 on the circuit board B, the catch piece 6 is gradually pushed down (pushed in) as shown in FIG. 4 (a). If it separates from the lower end of the assembly | attachment latching convex part 25, the latching (contact) by this will be cancelled | released.
Further, such pushing is further continued, and as shown in FIG. 4B, the sub-assy state lock 64 (protrusion) of the catch piece 6 reaches a position lower than the lower end of the assembly locking projection 25. Then, the lock in the sub-assy state is also completely released, and the catch piece 6 can be freely slid. Of course, as the catch piece 6 is pushed downward, the latching step 54 of the anchor 5 relatively rises and reaches a position higher than the through-opening 62 a of the catch piece 6.

  Thereafter, the catch piece 6 is slid (moved to the right in FIG. 4) while maintaining the pushing force and pushing action of the catch piece 6 as shown in FIG. Is fitted into the small-diameter portion 53 of the anchor 5. This state is also a state in which the latching opening 62c of the catch piece 6 is positioned below the latching step 54 of the anchor 5. Here, moving the catch piece 6 in such a direction (direction in which the mounting state is formed) is defined as “movement in the mounting direction (slide)”.

Then, when the downward pushing (pressing down) applied to the catch piece 6 is released with the small diameter portion 53 fitted in the latching opening 62c, as shown in FIG. 4 (d) and FIG. 2 (b). In addition, the catch piece 6 is lifted by the urging force of the wire spring 41, and the opening edge of the latching opening 62 c is latched (attached closely) to the latching step 54 of the anchor 5 from below. In FIG. 4D, the arrow in the upward direction of the catch piece 6 is drawn with a broken line. This operation is performed by urging the wire spring 41 without requiring an artificial operation as described above. Because.
In this mounted state, as shown in FIGS. 2B and 4D, the mounted state lock 65 (protrusion) is located in the vicinity of the latching step 54 (receiving tip 55) of the anchor 5. In this state, the catch piece 6 is prevented from moving in the sub-assembly direction. That is, when vibration or the like due to the operation of the electronic device is applied to the heat sink 1, for example, even if the catch piece 6 tries to slide in the sub-assembly direction, the mounting state lock 65 (protrusion) is the locking step 54 (receiving tip portion) of the anchor 5 55), such a slide is prevented. For this reason, the heat sink 1 that has been attached to the circuit board B is not dropped from the circuit board B, and the catch piece 6 and the wire spring 41 are not separated from the heat sink 1.
When the heat sink 1 once mounted is removed from the circuit board B, the operations shown in FIG. 4 are performed in the reverse order, and the heat sink 1 is removed in the sub-assy state shown in FIG. is there.

  Next, the heat sink 1 (1B) of Example 2 will be described. The heat sink 1B of the second embodiment is shown in FIGS. 5 to 7 and basically follows the idea of the first embodiment. That is, also in the second embodiment, the idea of sub-assembling the wire spring 41 to the heat sink body 2 with the catch piece 6 interposed, and positioning the heat sink 1 in the sub-assy state (locked state), and mounting this state The idea of setting the initial position in the process is the same as in the first embodiment. Therefore, the overall description of the constituent members is omitted, and the differences from the first embodiment will be mainly described below.

The second embodiment is different from the first embodiment in the post 24 that restricts the movement (movement) of the catch piece 6 in the vertical direction. Specifically, as shown in FIG. 5, for example, the post 24 according to the second embodiment is formed in a substantially quadrangular prism shape, and the catch piece 6 (penetration) held (connected) by the wire spring 41 on the post 24 After fitting the opening 62a) from above, the catch piece 6 is crushed, extended, expanded, etc. at an appropriate height position (not necessarily the same height as the radiating fins 22). Is prevented from coming off from the post 24 (for this reason, a bulging portion formed as a slip prevention at the upper end portion of the post is referred to as a retaining portion 26). That is, the catch piece 6 is always urged upward by the wire spring 41 (in the protruding direction of the radiating fin 22), but is prevented by the retaining portion 26. Of course, this is in the sub-assy state shown in FIG. 7 (a). In the mounted state shown in FIG. 7 (b), the catch piece 6 is positioned at a position lower than the retaining portion 26 at the anchor 5 (engaging step). 54), and the upward biasing of the catch piece 6 is stopped here.
Incidentally, in Example 2, once the catch piece 6 is fitted into the post 24 and the retaining portion 26 is formed at the upper end of the post 24, the wire spring 41 and the catch piece 6 are not always separated from the heat sink body 2. Is.

Moreover, in Example 2, the catch piece 6 is formed with a portion that enters between the radiating fin 22 and the radiating fin 22, and this is a portion that stabilizes the sliding direction (movable posture) of the catch piece 6. This part is referred to as a slide stabilizing part 66. Thereby, when the catch piece 6 slides (moves) in the sub-assembly direction or the mounting direction, the blur is suppressed.
In the second embodiment, the held portion 63 of the catch piece 6 held (connected) by the wire spring 41 is formed to be longer than the first embodiment, and the wire spring 41 (arm portion 43) is moved upward. It is formed so that it may be wound from. Thereby, the slide of the catch piece 6 in the sub-assembly direction and the mounting direction is a slide along the arm portion 43 of the wire spring 41 rather than a slide restricted by the heat radiation fin 22.
Moreover, in Example 2, the folding | returning 61a for the purpose of reinforcement etc. is formed in the edge of the catch piece 6 (main-body part 61).

Next, the operation | movement aspect of the heat sink 1B of Example 2 is demonstrated. FIG. 5 is a diagram showing the heat sink 1B in the sub-assy state, and the circuit board B is not yet mounted with the heat sink 1B (that is, the sub-assembly only). As described above, it is also a state that becomes an initial position in the mounting process. In FIG. 5, the anchor 5 is drawn with an imaginary line (two-dot chain line) because it is intended that the circuit board B is not attached (possibly).
In the sub-assy state shown in FIG. 5, the post 24 is positioned in the locking opening 62b as viewed from above, and the penetration opening 62a of the catch piece 6 is positioned in the positioning 23 (hole) of the heat sink body 2. That is, it matches the anchor 5 and is allowed to penetrate the anchor 5 (see FIG. 7A).
In the second embodiment, the sub-assy state is maintained and locked until the mounting process is started. Specifically, as shown in FIG. The stop portion 26 is formed so as to be engaged (contacted) with the sub-assy state lock 64 (projection) of the catch piece 6, and the catch piece 6 is prevented from moving (sliding) in the mounting direction.

Next, a mode of mounting the sub-assembled heat sink 1B on the circuit board B will be described. This mounting mode is basically the same as that of the first embodiment.
In order to mount the heat sink 1B in the sub-assembly state on the circuit board B, first, as shown in FIG. 7A, the positioning 23 (hole) of the heat sink body 2 is fitted into the anchor 5 to position the heat sink 1B. Is. After the positioning is completed, the receiving distal end portion 55 of the anchor 5 penetrating the positioning 23 (hole) is positioned so as to face the penetrating opening 62a of the opening 62. Of course, as in the first embodiment, this state is a position where the anchor 5 penetrates the penetration opening 62a as it is when the catch piece 6 is pushed downward (when pushed).

  Thereafter, the catch piece 6 is pushed down as shown by the two-dot chain line in FIG. At this time, the sub assembly state lock 64 is released in a state where the sub assembly state lock 64 (protrusion) of the catch piece 6 is gradually separated from the retaining portion 26 and is positioned lower than the retaining portion 26. Further, the catch piece 6 can be slid (moved) in the mounting direction in a state where the mounting state lock 65 (projection) is lower than the latching step 54 of the anchor 5. In other words, as the catch piece 6 is pushed downward, the latching step 54 of the anchor 5 rises relatively and reaches a position higher than the through-opening 62a of the catch piece 6. is there.

Thereafter, as shown in FIG. 7B, the catch piece 6 is slid (moved) in the mounting direction while keeping the catch piece 6 pressed down, and the catching opening 62 c of the catch piece 6 is moved to the small diameter of the anchor 5. It operates so that it may fit in the part 53. FIG. By this operation, the catching opening 6c of the catch piece 6 is positioned below the catching step 54 of the anchor 5, and when the pushing (pressing down) applied to the catch piece 6 in this state is released, the catch piece 6 is As shown by the solid line in FIG. 7B, the opening end edge of the latching opening 62c is latched (attached closely) to the latching step 54 of the anchor 5 from below.
Further, in this mounted state, as shown in FIG. 6, the mounted state lock 65 (projection) is positioned in the vicinity of the latching step 54 (receiving tip portion 55) of the anchor 5, and in the sub assembly direction of the catch piece 6. Is to prevent movement. That is, when vibration or the like accompanying the operation of the electronic device is applied, for example, even if the catch piece 6 tries to slide in the sub-assembly direction, the mounting state lock 65 (protrusion) is placed on the latching step 54 (receiving tip 55) of the anchor 5. Such a slide is prevented because of the contact. Of course, in this embodiment, since the retaining portion 26 is located between the sub-assembly state lock 64 (protrusion) and the attachment state lock 65 (protrusion) in this mounted state, the movement in the sub-assembly direction is The assembly state lock 64 (protrusion) is also prevented from coming into contact with the retaining portion 26.

  Next, the heat sink 1 (1C) of Example 3 will be described. The heat sink 1C of the third embodiment is shown in FIGS. 8 to 10 and basically follows the idea of the first embodiment. That is, also in the third embodiment, the idea is that the wire spring 41 is sub-assembled to the heat sink body 2 with the catch piece 6 interposed, and the heat sink 1 is positioned in the sub-assy state (locked state), and this state is mounted. The idea of setting the initial position in the process is the same as in the first embodiment. Therefore, the overall description of the constituent members is omitted, and the differences from the first embodiment will be mainly described below.

The third embodiment is different from the first embodiment in the form of the post 24, the shape of the catch piece 6, the sub-assy state, the hooked state in the mounted state, and the like. Specifically, the post 24 of the third embodiment is formed in a substantially quadrangular prism shape as shown in FIG. 8 (this state is a sub-assy state), but the opening of the catch piece 6 is formed at the base of the post 24. A locking groove 27 into which the end edge of the portion 62 is fitted is formed. Further, the base portion 21 of the heat sink body 2 is formed with a movement preventing protrusion 28 that prevents the movement of the catch piece 6 near the base of the post 24 (on the side where the locking groove 27 is formed).
The catch piece 6 has a held portion 63 held (connected) by the wire spring 41 at a position slightly higher than the main body portion 61 (that is, the main body portion 61 and the held portion 63 are stepped). The arm portion 43 of the wire spring 41 is hooked from the lower side of the held portion 63.

  For this reason, in the catch piece 6, the held portion 63 is always urged upward with the end edge of the opening 62 fitted in the locking groove 27 as a fulcrum, while the tip portion 67 is always on the lower base portion 21. Energized to bite into. That is, the catch piece 6 is urged so as to always take the posture of the lever by the elasticity of the wire spring 41, the supported portion 63 corresponds to the power point of the lever, and the tip portion 67 is the point of action of the lever. It is equivalent to. For this reason, as shown in FIG. 8, the tip portion 67 of the catch piece 6 is folded back in a claw shape from the main body portion 61 to increase the biting force into the base portion 21 and strongly against the movement preventing projection 28. It is effective in terms of locking and hooking.

Further, in the opening 62 of the catch piece 6, the through-opening 62 a that allows passage of the post 24 also serves as the function (function) of the locking opening 62 b, and at first glance, the through-opening 62 a and the latching opening 62 It seems that there is only 62c.
Further, as shown in FIG. 8, the catch piece 6 in the sub-assy state has a distal end portion 67 positioned near the root of the movement preventing projection 28 on the side of the locking groove 27, and the distal end portion 67 contacts the movement preventing projection 28. By contact, movement in the mounting direction is prevented, and the sub-assy state is maintained and locked. For this reason, the movement prevention protrusion 28 functions as the sub assembly state lock 64.

Next, although the operation mode of the heat sink 1C of Example 3 is demonstrated, it demonstrates from a mounting state here.
FIG. 9 shows a comparison between the sub-assy state and the mounted state of the heat sink 1C, and FIG. 9A shows the sub-assy state (actually, the state is set on the circuit board B and performed until positioning). FIG. 9B shows the mounted state. Here, the mounting state of FIG. 9B is obtained by moving the catch piece 6 from the state of FIG. 9A, and in this mounting state, the latching opening 62c of the opening 62 is of the anchor 5. The catch piece 6 is engaged with the small-diameter portion 53 and is latched on the latching step 54. Further, in the mounted state, the through-opening 62a of the catch piece 6 is separated from the locking groove 27 of the post 24, and the locking by the locking groove 27 is released. The latching step 54 is used as a fulcrum for latching with the piece 6, and takes the posture of the lever, that is, the posture in which the claw-shaped tip portion 67 is pressed against the base portion 21 as in the sub-assy state. At this time, the claw-shaped tip portion 67 is located near the base of the movement preventing projection 28 opposite to the locking groove 27, and the tip portion 67 abuts against the movement preventing projection 28 to move in the sub-assembly direction. Movement is prevented, and the wearing state is maintained and locked. For this reason, the movement prevention protrusion 28 also functions as the mounting state lock 65.

Next, a mode of mounting the sub-assembled heat sink 1C on the circuit board B will be described. This mounting mode is basically the same as that of the first embodiment.
In order to attach the heat sink 1C in the sub-assy state to the circuit board B, first, as shown in FIG. 9 (a) and FIG. 10 (a), the positioning 23 (hole) of the heat sink body 2 is fitted into the anchor 5, The heat sink 1C is positioned. In this case, the heat sink 1C that has just been sub-assembled is in a state in which the anchor 5 can pass through the through-opening 62a as it is, so that it is simply positioned and becomes the initial position in the mounting process. . However, in this embodiment, as shown in FIGS. 9A and 10A, the anchor 5 (receiving tip 55) that has penetrated the positioning 23 (hole) is already more than the through-opening 62 a of the opening 62. It is located above. Of course, the receiving tip 55 does not necessarily have to protrude above the catch piece 6 in this state after positioning, and may stand by in a state where it can pass under the through-opening 62a.

  After positioning the heat sink 1C in this way, the claw-shaped tip 67 is raised by pushing down the catch piece 6 (held portion 63) as shown in FIG. If the tip 67 is positioned above the movement preventing projection 28 by such an operation, the catch piece 6 is unlocked from the movement preventing projection 28 and the catch piece 6 can be moved in the mounting direction. It becomes.

  Thereafter, while keeping the catch piece 6 pushed downward of the held portion 63 (that is, while maintaining the tip 67 at a higher position than the movement preventing projection 28), as shown in FIG. Then, the catch piece 6 is slid (moved) in the mounting direction so that the distal end portion 67 exceeds the movement preventing projection 28. Note that the edge of the through-opening 62 a (the locking opening 62 b) fitted in the locking groove 27 of the post 24 is separated from the locking groove 27 by such movement of the catch piece 6. . At the same time, the small-diameter portion 53 of the anchor 5 is fitted into the latching opening 62c of the catch piece 6.

In this state, when the push-down applied to the catch piece 6 (held portion 63) is released, the catch piece 6 is held by the urging of the wire spring 41 as shown in FIG. While the part 63 rises, the tip part 67 is pressed against the base part 21. Further, the edge of the latching opening 62 c is latched on the latching step 54 of the anchor 5. In this state, as described above, the movement preventing projection 28 formed on the base portion 21 prevents the catch piece 6 from moving in the sub-assembly direction.
In addition, since the heat sink 1C of Example 3 changes a state by the above-described operation, the position where the held portion 63 of the catch piece 6 is pushed down is easily pulled out of the catch groove 27 from the catch groove 27. It is preferable that the height position is easy to fit in the 27. For this reason, it is desirable to set (restrict) a height for pushing down the held portion 63 in advance, and to efficiently perform the attaching / detaching operation to / from the locking groove 27. Reference numeral 29 in FIG. 21 is a low-order restricting protrusion formed on 21.

[Other Examples]
The present invention has the above-described embodiment as one basic technical idea, but the following modifications can be considered. That is, in the embodiment shown in FIGS. 1 to 10, the positioning 23 of the heat sink 1 is a hole through which the anchor 5 fixed to the circuit board B is passed. As the positioning 23, for example, as shown in FIG. It may be groove-shaped.

  Further, in the embodiment described above, the anchors 5 are all axial (substantially cylindrical), but the anchors 5 are not necessarily limited to such a form, for example, as shown in FIG. Such a plate-shaped material may be used.

  In the above-described embodiments, the toe-shaun bar type wire spring 41 is applied as the spring member 4, but the spring member 4 is not necessarily limited to such a form. For example, FIG. It is also possible to apply a coil spring 45 as shown in a). In this case, for example, a method is conceivable in which a coil spring 45 is externally fitted to the post 24 and the catch piece 6 is always urged upward by its elastic force. Further, in this case, as shown in FIG. 13B, the catch piece 6 is formed to be slidable while being pushed down. In this example, the upward urging of the catch piece 6 is suppressed by one anchor 5 with respect to one catch piece 6. However, in order to maintain the posture of the catch piece 6 more stably, two anchors 5 are used. It is also possible to hold the upward biasing of the catch piece 6 with one anchor 5.

  Further, in the above-described embodiments, the protrusions are used as the ones that maintain and lock the mounting state (sub-assy state). However, as such a mounting state lock 65, for example, as shown in FIG. A structure utilizing the height difference due to the taper can also be adopted. That is, in FIG. 14, the latching opening 62c is installed at a low position, the locking opening 62b is installed at a high position, and a through-opening 62a that connects them is formed in a tapered shape in a side view. . As a result, for example, when the catch piece 6 is about to move in the sub-assembly direction when the catching opening 62c of the catch piece 6 is latched with the catch step 54 of the anchor 5, the anchor 5 (hanging) This is difficult because the stop step 54 is an operation of climbing the taper-shaped (that is, slope-like) penetrating opening 62 a, and this is a mounting state lock 65. Of course, in comparison with this, in the sub-assy state, for example, the stopper 26 at the upper end of the post is positioned in the locking opening 62b at the high position, so that it may be somewhat easy to move in the mounting direction. However, since the locking opening 62b is flat, it is possible to form a situation in which it is difficult to move in the mounting direction by forming the opening 62b relatively long (this becomes the sub-assy state lock 64). ).

Further, in all of the embodiments described above, the anchor 5 is provided inside the heat sink 1 (inside the range where the heat sink 1 is attached). However, as shown in FIG. It is also possible to provide it outside 1 (outside the area where the heat sink 1 is mounted). In addition, for this reason, in FIG. 15, the positioning is not provided to the anchor 5 but a positioning 23 is provided separately. That is, here, a positioning pin 23a is provided in advance on the circuit board B (inside the heat sink 1), and a positioning hole 23b corresponding to the pin 23a is formed in a non-penetrating state on the back side of the heat sink 1. It is something to keep. The reason why the positioning 23 is formed inside the heat sink 1 is to use the circuit board B surface effectively even a little. Incidentally, in this embodiment, since the positioning 23 is different from any of the above-described embodiments, it can be said that a further modification of the positioning 23 is shown. Moreover, the modification which does not bear the positioning effect | action to the anchor 5 is also shown.
Of course, the positioning 23 can also be provided outside the heat sink 1. In this case, an overhanging portion that protrudes outside the base portion 21 is formed on the heat sink 1. It is generally considered that positioning is performed.

By the way, when a heat conductive sheet is provided between the heat sink body 2 (base portion 21) and the semiconductor circuit element C, the efficiency of the heat conductive sheet varies depending on the magnitude of pressure applied to the sheet, The higher the pressure, the higher the performance. On the other hand, some semiconductor circuit elements C have a maximum allowable load, and it is required that the mounting load of the heat sink 1 be within an appropriate range.
Here, the mounting load and its pressure vary depending on the thickness of the circuit board B, the thickness of the semiconductor circuit element C, the contact area between the semiconductor circuit element C and the heat sink 1, the thickness of the base portion 21 of the heat sink 1, and the like. Therefore, the mounting means 3 using the wire spring 41 cannot use the same spring.
Therefore, the embodiment shown in FIG. 16 solves such a problem on the heat sink 1 side. That is, in the embodiment shown in FIG. 16, in the heat sink 1, a mounting load (pressure) adjustment pole (this is an adjustment column 30 for adjustment) is provided at a place pressed by the wire spring 41 (here, substantially the central portion of the base portion 21). This is subjected to secondary processing (cutting / cutting) to change the height of the adjustment support 30, the thickness of the circuit board B, the thickness of the semiconductor circuit element C, the heat sink The pressure applied to the heat conductive sheet is set as a target load by adjusting the difference in the thickness of the base portion 21 of one.
As a result, the same wire spring 41 can be used for many heat scenes 1 and can be integrated with a wide variety of wire springs 41 (for example, several kinds). Can be suppressed).

1 Heat sink (heat sink with mounting means)
1A heat sink (Example 1)
1B heat sink (Example 2)
1C heat sink (Example 3)
2 Heat sink body 3 Mounting means 4 Spring member 5 Anchor 6 Catch piece

2 Heat sink body 21 Base portion 22 Radiation fin 23 Positioning 23a Positioning pin 23b Positioning hole 24 Post 25 Assembly locking projection 26 Retaining prevention portion 27 Locking groove 28 Movement prevention protrusion 29 Lower restriction protrusion 30 Adjustment Prop

4 Spring member 41 Wire spring 42 Central torsion part 43 Arm part 44 Folding part 45 Coil spring

5 Anchor 51 Body 52 Detachment Preventing Portion 53 Small Diameter Portion 54 Retaining Step 55 Receiving Tip 56 Knurling

6 Catch Piece 61 Body 61a Folding 62 Opening 62a Passing Opening 62b Locking Opening 62c Hatching Opening 63 Held Part 64 Subassembly Lock 65 Mounted Lock 66 Slide Stabilizer 67 Tip

B Circuit board C Semiconductor circuit element H Mounting hole P Push pin P1 Shaft part P2 collar part P3 Expansion part P4 Slot P5 Insertion hole P6 Coil spring S Screw S2 collar part

Claims (8)

In a heat sink in which a heat sink body comprising a base portion to be crimped to a semiconductor circuit element on a circuit board and a heat radiation fin protruding from the base portion is mounted on the circuit board using a spring member,
Between the spring member and the heat sink body, a catch piece is provided in a movable state, and the bias of the spring member always acts on the catch piece,
Prior to mounting the heat sink body on the circuit board, in order to obtain a sub-assembly state in which the spring member is assembled to the heat sink body, the position of the catch piece is appropriately changed so that a part of the heat sink body is caught. A heat sink comprising mounting means, wherein a piece is locked to obtain a sub-assy state.
In the circuit board, an anchor for mounting the heat sink body on the circuit board is provided in a protruding state on the mounting side of the heat sink body,
When mounting the heat sink body on the circuit board, by changing the position of the catch piece, the sub-assy state is released, and the catch piece is hooked on the anchor, and the heat sink body is mounted on the circuit board. A heat sink comprising the mounting means according to claim 1.
3. The heat sink having mounting means according to claim 2, wherein when mounting the heat sink body on the circuit board, the anchor is also used for positioning the heat sink body.
4. The heat sink having mounting means according to claim 2, wherein the anchor installed on the circuit board is provided inside a range where the heat sink is mounted.
The catch piece is provided with a lock mechanism that prevents movement of the catch piece in the sub-assy state, thereby preventing the catch piece in the sub-assy state from moving in the mounting direction. A heat sink comprising the mounting means according to 3 or 4.
6. The catch piece locked in the sub-assembly state is in a positioning posture when the heat sink body is mounted on the circuit board in the same posture, and is also an initial position in the mounting step. A heat sink comprising the mounting means described.
The catch piece is provided with a lock mechanism that prevents movement of the catch piece when the heat sink body is mounted on the circuit board, thereby preventing the catch piece in the attached state from moving in the sub-assembly direction. A heat sink comprising the mounting means according to claim 2, 3, 4, 5 or 6.
  The mounting means according to claim 1, 2, 3, 4, 5, 6 or 7, wherein the catch piece is assembled to the heat sink body in a movable state so as not to be always separated from the heat sink body. A prepared heat sink.

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