JP2011162570A - Polyimide powder and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for chemically pulverizing a film-like polyimide resin since it is outstandingly difficult that the film-like polyimide resin is mechanically pulverized. <P>SOLUTION: The method manufactures a polyimide powder having 0.2-180 μm particles using a solution of acid alkali while making a polyimide film as a raw material, and in the method, a waste film generated in the manufacturing field is especially used. Further, the manufacturing method forms the state of a paste-like or a colloidal solution using a solvent of an acid and an alkali while making a polyimide film as a raw material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention provides that the film-like polyimide resin is chemically powdered because it is very difficult to mechanically powder.

Polyimide resins have excellent properties such as heat resistance, mechanical strength, electrical insulation, and chemical resistance, and are therefore widely used in the field of resin processing, such as raw materials for producing compression molded resin bodies.

Conventional polyimide powderization includes aromatic polyimide powder obtained by heating a polyamic acid solution in the presence of a tertiary amine (see, for example, Patent Document 1 and Patent Document 2).

Grinding polyimide film to make a flat powder (see Patent Document 3)
Japanese Examined Patent Publication No. 39-30060 JP-A-4-142332 JP 2008-56755 A

The present invention has been achieved as a result of studying the above-described problems in the prior art.

Accordingly, it is an object of the present invention to provide a polyimide powder that hardly aggregates during use and a method for efficiently producing this polyimide powder using an acid and an alkali solvent.

In addition, the method for producing the polyimide powder of the present invention is characterized in that a polyimide film is used as a raw material, and this is pulverized using an acid and an alkali solvent, and the raw material polyimide film is a scrap film generated at a production site. It can be used and contributes to the industrial waste recycling business that matches the times.

According to the present invention, as described below, a polyimide powder that is difficult to aggregate during use can be efficiently produced using an acid and an alkali solvent.

In addition, a large amount of scrap film that is discarded when producing a product roll is generated at the site of polyimide production. Since this polyimide film does not melt even when heated, and does not dissolve in organic solvents, it cannot be recycled in the state of this polyimide film. Therefore, in general, the waste film is treated by landfill or incineration. According to the present invention, these waste films can be pulverized as raw materials and reused to solve the industrial waste problem.

Since polyimide is a property that is weak in alkali in terms of physical properties, when it is immersed in an alkaline solvent having a pH of about 8 to 13 and stirred using the weak point, it becomes a paste and disperses colloidal particles.

When an acidic solution is added to this state to acidify PH 1-6, colloidal particles are solidified.

In order to prevent hydrolysis during the above steps, a glycol solvent such as propylene glycol or glycerin may be used instead of water. Also, alkaline water having a high alkalinity can be used.

The polyimide film used as a raw material in production may be any film thickness, and the composition is not particularly limited. A commercially available polyimide film can also be used as a raw material.

In these series of steps, the temperature is preferably 25 ^L or more.

The solidified product is washed with water, filtered and dried.

The particles of the solidified polyimide powder are pulverized from 180 microns to 0.2 microns, but the particle size can be adjusted depending on the application.

30 g of water and 5 g of caustic soda were added to 30 g of a mechanically pulverized product of about 2 cm of polyimide film, and heated and stirred. After 60 degrees, softening started and a paste was formed at 75 degrees.

30 g of glycerin and 5 g of caustic soda were added to 30 g of a mechanically pulverized product of about 2 cm of polyimide film, and heated and stirred. After 60 degrees, softening started and a paste was formed at 71 degrees.

Alkaline water ph13 was added to 30 g of a mechanically pulverized product of about 2 cm of polyimide film and stirred. After 68 degrees, softening started and a paste was formed at 78 degrees.

It can be used as an abrasive.

Binder for photocatalyst due to good adhesion to metal

Using heat resistance, mixed with gold, silver, etc.

The polyimide powder of the present invention has excellent properties such as heat resistance, electrical insulation, chemical resistance, and the like, and is difficult to agglomerate during use and is easy to handle. Therefore, it can be widely used in the resin processing field.

Claims (3)

A method for producing a polyimide powder of 0.2 to 180 microns using a polyimide film as a raw material and an acid and alkali solvent. 2. The method for producing a polyimide powder according to claim 1, wherein the raw material polyimide film is a scrap film generated at a production site. The method for producing a polyimide powder according to claim 1, wherein a polyimide film is used as a raw material to form a paste or colloidal solution using an acid and an alkali solvent.