JP2011155044A5 - - Google Patents

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Publication number
JP2011155044A5
JP2011155044A5 JP2010014130A JP2010014130A JP2011155044A5 JP 2011155044 A5 JP2011155044 A5 JP 2011155044A5 JP 2010014130 A JP2010014130 A JP 2010014130A JP 2010014130 A JP2010014130 A JP 2010014130A JP 2011155044 A5 JP2011155044 A5 JP 2011155044A5
Authority
JP
Japan
Prior art keywords
gas
set value
vacuum processing
time zone
setting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010014130A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011155044A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010014130A priority Critical patent/JP2011155044A/ja
Priority claimed from JP2010014130A external-priority patent/JP2011155044A/ja
Publication of JP2011155044A publication Critical patent/JP2011155044A/ja
Publication of JP2011155044A5 publication Critical patent/JP2011155044A5/ja
Pending legal-status Critical Current

Links

JP2010014130A 2010-01-26 2010-01-26 真空処理装置 Pending JP2011155044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010014130A JP2011155044A (ja) 2010-01-26 2010-01-26 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010014130A JP2011155044A (ja) 2010-01-26 2010-01-26 真空処理装置

Publications (2)

Publication Number Publication Date
JP2011155044A JP2011155044A (ja) 2011-08-11
JP2011155044A5 true JP2011155044A5 (cg-RX-API-DMAC7.html) 2013-01-17

Family

ID=44540825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010014130A Pending JP2011155044A (ja) 2010-01-26 2010-01-26 真空処理装置

Country Status (1)

Country Link
JP (1) JP2011155044A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5887201B2 (ja) * 2012-05-14 2016-03-16 東京エレクトロン株式会社 基板処理方法、基板処理装置、基板処理プログラム、及び記憶媒体
JP6334369B2 (ja) * 2014-11-11 2018-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP6685179B2 (ja) * 2016-06-01 2020-04-22 東京エレクトロン株式会社 基板処理方法
JP7012613B2 (ja) * 2018-07-13 2022-01-28 東京エレクトロン株式会社 成膜方法及び成膜装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4512533B2 (ja) * 2005-07-27 2010-07-28 住友精密工業株式会社 エッチング方法及びエッチング装置

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