JP2011155044A5 - - Google Patents

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Publication number
JP2011155044A5
JP2011155044A5 JP2010014130A JP2010014130A JP2011155044A5 JP 2011155044 A5 JP2011155044 A5 JP 2011155044A5 JP 2010014130 A JP2010014130 A JP 2010014130A JP 2010014130 A JP2010014130 A JP 2010014130A JP 2011155044 A5 JP2011155044 A5 JP 2011155044A5
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JP
Japan
Prior art keywords
gas
set value
vacuum processing
time zone
setting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010014130A
Other languages
English (en)
Japanese (ja)
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JP2011155044A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010014130A priority Critical patent/JP2011155044A/ja
Priority claimed from JP2010014130A external-priority patent/JP2011155044A/ja
Publication of JP2011155044A publication Critical patent/JP2011155044A/ja
Publication of JP2011155044A5 publication Critical patent/JP2011155044A5/ja
Pending legal-status Critical Current

Links

JP2010014130A 2010-01-26 2010-01-26 真空処理装置 Pending JP2011155044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010014130A JP2011155044A (ja) 2010-01-26 2010-01-26 真空処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010014130A JP2011155044A (ja) 2010-01-26 2010-01-26 真空処理装置

Publications (2)

Publication Number Publication Date
JP2011155044A JP2011155044A (ja) 2011-08-11
JP2011155044A5 true JP2011155044A5 (cg-RX-API-DMAC10.html) 2013-01-17

Family

ID=44540825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010014130A Pending JP2011155044A (ja) 2010-01-26 2010-01-26 真空処理装置

Country Status (1)

Country Link
JP (1) JP2011155044A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5887201B2 (ja) * 2012-05-14 2016-03-16 東京エレクトロン株式会社 基板処理方法、基板処理装置、基板処理プログラム、及び記憶媒体
JP6334369B2 (ja) * 2014-11-11 2018-05-30 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP6685179B2 (ja) * 2016-06-01 2020-04-22 東京エレクトロン株式会社 基板処理方法
JP7012613B2 (ja) * 2018-07-13 2022-01-28 東京エレクトロン株式会社 成膜方法及び成膜装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4512533B2 (ja) * 2005-07-27 2010-07-28 住友精密工業株式会社 エッチング方法及びエッチング装置

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