JP2011151124A - Adhesive fixing jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive fixing jig that prevents an object to be fixed from being applied with an excessive force when the object to be fixed is removed in order to prevent damage to the object to be fixed. <P>SOLUTION: The adhesive fixing jig includes an adhesive sheet 1 in which a plurality of columnar adhesive parts 1a respectively having at least an adhesive upper surface are formed on one main surface, and a rigid plate 2 formed with a plurality of openings 2a having the number and shape corresponding to those of the adhesive parts 1a. The upper surface of each adhesive part 1a is exposed from each opening 2a so as to overlap the adhesive sheet 1 with the rigid plate 2, thereby adhesively fixing an object arranged on the rigid plate 2 by the upper surface of each adhesive part 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an adhesive fixing jig, and more particularly to an adhesive fixing jig capable of removing an object to be fixed without applying an excessive force to the object to be fixed.

  2. Description of the Related Art Conventionally, in a manufacturing process of electronic equipment or the like, a workpiece is fixed to a fixing jig and then processed or conveyed. This is done to protect the work piece, make it easier to handle, maintain its shape, etc. when the work piece is fragile, small, or flexible. It is what

  For example, in the manufacturing process of electronic equipment, a ceramic substrate or flexible printed circuit board is fixed to a fixture, and electronic components such as capacitors, resistors, coils, and ICs are mounted on the substrate by soldering. Has been done.

  As such a fixing jig, there is an adhesive fixing jig disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 7-22795) that adheres and fixes an object to be fixed at an adhesive portion. FIG. 6 shows an adhesive fixing jig 500 disclosed in Patent Document 1. The adhesive fixing jig 500 is obtained by forming an adhesive layer 502 having an adhesive property such as silicone rubber on the surface of a rigid plate 501 made of a metal such as SUS. (Not shown) is adhesively fixed.

JP-A-7-22795

The adhesive fixing jig 500 disclosed in Patent Document 1 described above is formed by forming an adhesive layer 502 on a rigid plate 501 having rigidity, and has rigidity as a whole.
Then, when removing the object to be fixed (not shown) from the adhesive fixing jig 500, a force must be applied to the object to be fixed and the adhesive fixing jig 500 in the direction of separating them from each other. Since the jig 500 has rigidity and is difficult to break, when the object to be fixed is fragile, such as a thin plate, or when the object to be fixed is firmly fixed more than necessary, the pulling force is In some cases, such as when concentrated on a specific part of the fixed object, the fixed object may be damaged. For example, if the object to be fixed is a ceramic substrate, the ceramic substrate may be cracked or chipped, or the ceramic substrate may be subjected to bending stress, causing the mounted electronic component to come off the ceramic substrate. .

  The present invention has been made in order to solve the problems of the above-mentioned conventional adhesive fixing jig, and as the means, the adhesive fixing jig of the present invention has a columnar adhesive portion having at least an upper surface having adhesiveness. A plurality of pressure-sensitive adhesive sheets formed on one main surface, and a rigid plate having openings corresponding to the number and shape corresponding to the pressure-sensitive adhesive portions, with the upper surface of the pressure-sensitive adhesive portions being exposed from the openings, And the rigid plate are overlapped, and the fixed object placed on the rigid plate is adhesively fixed by the upper surface of the adhesive portion exposed from the opening.

  Since the adhesive fixing jig of the present invention has the above-described configuration, it is impossible to fix the fixed object by gradually separating the adhesive sheet from the fixed object and the rigid plate while supporting the fixed object with the rigid plate. Without applying force, each adhesive part can be gradually pulled away from the back surface of the object to be fixed, and the object to be fixed can be removed from the adhesive fixing jig. Therefore, no damage occurs to the fixed object.

1 is a perspective view showing an adhesive fixing jig 100 according to a first embodiment of the present invention. 1A shows a state where the adhesive sheet 1 and the rigid plate 2 are separated, and FIG. 1B shows a state where the adhesive sheet 1 and the rigid plate 2 are overlapped. It is sectional drawing which shows the usage method of the adhesive fixing jig 100 shown in FIG. FIG. 2 shows a chain line YY portion of FIG. FIG. 3 is a continuation of FIG. 2, and is a cross-sectional view showing a method for using the adhesive fixing jig 100 shown in FIG. 1. Note that FIG. 3 shows the portion of the chain line YY in FIG. It is a top view which shows the adhesive fixing jig 200 concerning the 2nd Embodiment of this invention, and the adhesive fixing jig 300 concerning 3rd Embodiment. 4A shows the adhesive fixing jig 200, and FIG. 4B shows the adhesive fixing jig 300. FIG. It is sectional drawing which shows the adhesive fixing jig 400 concerning the 4th Embodiment of this invention. It is a perspective view which shows the conventional adhesive fixing jig 500. FIG.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

[First Embodiment]
1A and 1B show an adhesive fixing jig 100 according to a first embodiment of the present invention. 1A is a perspective view showing a state where the adhesive sheet 1 and the rigid plate 2 are separated, and FIG. 1B is a perspective view showing a state where the adhesive sheet 1 and the rigid plate 2 are overlapped.

  The adhesive fixing jig 100 includes an adhesive sheet 1.

  On the main surface on the upper side of the adhesive sheet 1, a plurality of columnar adhesive portions 1a having at least an upper surface having adhesiveness are formed. In the present embodiment, five pressure-sensitive adhesive sheets 1 are formed on the pressure-sensitive adhesive sheet 1. However, the adhesive portion 1a is not limited to a cylinder, and may be a polygonal column such as a quadrangular column. Moreover, the number of the adhesion parts 1a should just be plural, and is not restricted to five.

  The adhesive sheet 1 has a grip portion 1b that does not overlap the rigid plate 2 when the adhesive sheet 1 is overlapped with the rigid plate 2 described later. The gripping portion 1b is a portion for gripping with a gripping means such as a chuck when using the adhesive fixing jig 100.

  For the adhesive sheet 1, for example, an adhesive resin such as silicon can be used. In this case, the adhesive sheet 1 can be formed integrally with the adhesive part 1a by molding. However, the adhesive part 1 a is not necessarily formed integrally with the adhesive sheet 1, and a separate adhesive part 1 a may be attached to the adhesive sheet 1.

  In addition, as for the adhesive sheet 1, the upper surface of the adhesion part 1a should just have adhesiveness at least. Moreover, the surface which contacts the rigid board 2 of the adhesive sheet 1 may have adhesiveness.

  The pressure-sensitive adhesive sheet 1 has, for example, dimensions of 200 mm in length, 200 mm in width, and 0.8 mm in thickness (however, the dimensions excluding the grip portion 1b). Moreover, the adhesion part 1a consists of a dimension of diameter 8mm and height 1.05mm, for example.

  The adhesive fixing jig 100 includes a rigid plate 2.

  The rigid plate 2 is formed with openings 2a having the number and shape corresponding to the adhesive portions 1a of the adhesive sheet 1. That is, in this embodiment, five circular openings 2 a are formed in the rigid plate 2.

  A material having rigidity, for example, a metal is used for the rigid plate 2. If the metal which has magnesium as a main component is used for the rigid board 2, since a process is easy, it is preferable.

  The rigid plate 2 has dimensions of, for example, a length of 200 mm, a width of 200 mm, and a thickness of 1 mm. Further, the opening 2a has a diameter of 10 mm, for example.

  As shown in FIG. 1B, the adhesive fixing jig 100 is used in a state where the upper surface of the adhesive portion 1a is exposed from the opening 2a and the adhesive sheet 1 and the rigid plate 2 are overlapped. In this embodiment, since the height of the adhesive portion 1a is 1.05 mm and the thickness of the rigid plate 2 is 1 mm, the upper surface of the adhesive portion 1a is slightly protruded from the upper surface of the rigid plate 2. Become. That is, the adhesive fixing jig 100 is used by adhering and fixing an object to be fixed to the upper surface of the adhesive portion 1a having adhesiveness slightly protruding from the opening 2a of the rigid plate 2.

  Hereinafter, the usage method of the adhesive fixing jig 100 will be described in more detail with reference to FIGS. 2 (A) to 3 (F). 2A to 3F are cross-sectional views showing the steps of the usage method.

  First, as shown in FIG. 2 (A), an adhesive sheet 1 is prepared.

  Next, as shown in FIG. 2B, the rigid plate 2 is overlaid on the adhesive sheet 1. At this time, the upper surface of the adhesive portion 1a is exposed from the opening 2a.

  Next, as shown in FIG. 2C, for example, a ceramic substrate 3 having a plurality of electrodes 3a formed on the surface thereof is disposed on the rigid plate 2 as an object to be fixed. As a result, the bottom surface of the ceramic substrate 3 comes into contact with the upper surface of the adhesive portion 1a exposed from the opening 2a, and the ceramic substrate 3 is adhesively fixed to the adhesive fixing jig 100 by the adhesiveness of the adhesive portion 1a.

  The ceramic substrate 3 is processed and transported in a state where it is adhesively fixed to the adhesive fixing jig 100. For example, as shown in FIG. 3D, the electronic component 4 is mounted on the electrode 3a of the ceramic substrate 3 by soldering by reflow or the like.

  Next, a method of removing the ceramic substrate 3 that has been processed or conveyed from the adhesive fixing jig 100 will be described.

  First, as shown in FIG. 3 (E), one end (left end in the drawing) of the adhesive sheet 1, the rigid plate 2, and the ceramic substrate 3 stacked in three layers is held by the chuck 5a, and the adhesive sheet 1 gripping portion 1 b is gripped by chuck 5 b, chuck 5 b is pulled away from rigid plate 2 and ceramic substrate 3, and adhesive portion 1 a of adhesive sheet 1 is gradually pulled away from the bottom surface of ceramic substrate 3.

  Next, as shown in FIG. 3F, the other end (right end in the drawing) of the rigid plate 2 and the ceramic substrate 3 stacked in two layers is held by the chuck 5c, and then the chuck 5a on the opposite side is used. The gripping is released, and the chuck 5 b is further pulled away from the rigid plate 2 and the ceramic substrate 3, and the adhesive portion 1 a of the adhesive sheet 1 is completely pulled away from the bottom surface of the ceramic substrate 3. As a result, the adhesive sheet 1 is removed from the ceramic substrate 3 and the rigid plate 2, and the rigid plate 2 and the ceramic substrate 3 are simply overlapped without adhesive force. Finally, after the chuck 5c is released, the ceramic substrate 3 is taken out of the rigid plate 2 to complete the removal of the ceramic substrate 3 from the adhesive fixing jig 100.

  The ceramic substrate 3 which is adhesively fixed by the adhesive fixing jig 100, processed and transported is not subjected to excessive force even when it is removed, so that it is not cracked or chipped and mounted from the ceramic substrate 3. The electronic component 4 is not removed.

  In addition, the adhesive sheet 1 and the rigid board 2 after use can be reused. When contamination occurs, it can be washed with a solvent or the like.

  The adhesive fixing jig 100 according to the first embodiment and an example of how to use it have been described above. However, the present invention is not limited to the above contents, and various modifications can be made along the gist of the invention. For example, the number, size, position, etc. of the adhesive portion 1a formed on the adhesive sheet 1 and the opening 2a formed on the rigid plate 2 corresponding to the adhesive portion 1a are arbitrary. It can be changed according to the adhesive strength required for the above. Further, the object to be fixed is not limited to an electronic device such as the ceramic substrate 3 and may be a product in another field.

[Second Embodiment]
FIG. 4A shows an adhesive fixing jig 200 according to the second embodiment of the present invention. FIG. 4A is a plan view.

  The adhesive fixing jig 200 increases the number of adhesive portions 11a formed on the adhesive sheet 11 and the corresponding number of openings 12a formed on the rigid plate 12 to 25 in 5 rows and 5 columns. . Since the total area of the upper surface of the adhesive portion 11a exposed from the opening 12a is larger than that of the first embodiment, the adhesive fixing force of the object to be fixed is improved as compared with the first embodiment. The adhesive fixing jig 200 can fix and fix an object to be fixed more firmly than the adhesive fixing jig 100.

[Third Embodiment]
FIG. 4B shows an adhesive fixing jig 300 according to the third embodiment of the present invention. FIG. 4B is a plan view.

  In the adhesive fixing jig 300, the adhesive portions 21a formed in the adhesive sheet 21 and the openings 22a formed in the rigid plate 22 corresponding thereto are arranged in a staggered manner. The adhesive fixing jig 300 has the same number of the adhesive portions 21a and the openings 22a as the adhesive fixing jig 200 according to the second embodiment. However, the adhesive fixing jig 300 is arranged in a staggered manner to remove an object to be fixed. The force applied to the object to be fixed can be dispersed, and compared to the adhesive fixing jig 200, the stress to the object to be fixed at the time of removal can be reduced.

[Fourth Embodiment]
FIG. 5 shows an adhesive fixing jig 400 according to the fourth embodiment of the present invention. FIG. 5 is a cross-sectional view.

  In addition to the adhesive sheet 31 in which the adhesive part 31 a is formed and the rigid plate 32 in which the opening 32 a is formed, the adhesive fixing jig 400 further includes a floor plate 36 for laying the adhesive sheet 31. . A plurality of protrusions 36 a are formed on the upper main surface of the floor plate 36. Further, the rigid plate 32 is formed with a through hole 32c for fitting the projection 36a at a position corresponding to the projection 36a of the floor plate 36.

  The floor plate 36 is also made of a rigid material. For example, similarly to the rigid plate 32, a metal containing magnesium as a main component can be used.

  In the adhesive fixing jig 400, the adhesive sheet 31 is laid on the upper main surface of the floor plate 36, the rigid plate 32 is overlaid thereon, and the protrusions 36a are fitted into the through holes 32a. 31 is held between the floor plate 36 and the rigid plate 32. In the adhesive fixing jig 400, the rigid plate 32 and the adhesive sheet 31 are in close contact with each other. Therefore, when the object to be fixed is disposed on the rigid plate 32, the adhesive part exposed from the opening 32a by the object to be fixed. 31a is not pushed downward, and the object to be fixed can be securely adhered and fixed to the adhesive fixing jig 400.

1, 11, 21, 31: Adhesive sheets 1a, 11a, 21a, 31a: Adhesive parts 1b, 11b, 21b: Grasping parts 2, 21, 22, 32: Rigid plates 2a, 21a, 22a, 32a: Opening 3: Ceramic substrate (fixed object)
4: Electronic components 5a, 5b, 5c: Chuck (gripping means)
36: floorboard

Claims (8)

A pressure-sensitive adhesive sheet in which a plurality of columnar pressure-sensitive adhesive portions having adhesiveness at least on the one main surface;
A number corresponding to the adhesive portion, and a rigid plate formed with an opening of a shape,
The upper surface of the adhesive portion is exposed from the opening by exposing the upper surface of the adhesive portion from the opening, superimposing the adhesive sheet and the rigid plate, and placing the fixed object disposed on the rigid plate. An adhesive fixing jig characterized in that it is adhesively fixed by means of.   2. The pressure-sensitive adhesive according to claim 1, wherein a grip portion used when the pressure-sensitive adhesive portion of the pressure-sensitive adhesive sheet is separated from the object to be fixed is formed on at least one side of the pressure-sensitive adhesive sheet. Fixing jig.   The adhesive fixing jig according to claim 1, wherein the adhesive part is made of an adhesive resin.   The adhesive fixing jig according to claim 3, wherein the adhesive sheet is made of a resin, and the adhesive part and the adhesive sheet are integrally formed of the same resin.   The adhesive fixing jig according to any one of claims 1 to 4, wherein the rigid plate is made of metal.   The adhesive fixing jig according to claim 5, wherein the metal contains magnesium as a main component.   The adhesive fixing jig according to any one of claims 1 to 6, wherein the opening is circular.   The adhesive fixing jig according to claim 1, wherein the fixed object is a substrate of an electronic device.