JP2011141176A - Electron beam irradiator - Google Patents

Electron beam irradiator Download PDF

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JP2011141176A
JP2011141176A JP2010001636A JP2010001636A JP2011141176A JP 2011141176 A JP2011141176 A JP 2011141176A JP 2010001636 A JP2010001636 A JP 2010001636A JP 2010001636 A JP2010001636 A JP 2010001636A JP 2011141176 A JP2011141176 A JP 2011141176A
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electron beam
tube
emitter
beam irradiation
window
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Yoshihisa Ishiguro
義久 石黒
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Life Technology Research Institute Inc
K AND I Inc
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Life Technology Research Institute Inc
K AND I Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electron beam irradiator which can irradiate an object with an electron beam like a curtain. <P>SOLUTION: When a voltage between an emitter 14 and a gate electrode 15 and that between a grid electrode 19 and a metal film (anode) 18 are set at a few kV and about 40 kV, an electron beam 16 is emitted from the emitter 14, and the electron beam 16 is directed by the electrode 15, diaphragmed by the grid electrode 19 and applied outward from a window 17 like a curtain. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、直管チューブ型の電子線照射装置に関する。   The present invention relates to a straight tube type electron beam irradiation apparatus.

半導体ウェーハやガラス基板の表面に塗布したレジスト液の硬化、或いは刷版の硬化の手段として、UV(紫外線)による重合開始剤をレジスト液や刷版内に含有させている。しかしながら、UV硬化法は材質の劣化を伴うため、最近では電子線照射によって硬化させることが考えられている。 As a means for curing a resist solution applied to the surface of a semiconductor wafer or glass substrate or curing a printing plate, a polymerization initiator by UV (ultraviolet rays) is contained in the resist solution or the printing plate. However, since the UV curing method is accompanied by deterioration of the material, it has recently been considered to cure by electron beam irradiation.

真空中でエミッタ(陰極)と陽極との間に高電圧を印加することで電子線が発生する。陽極をタングステンなどのターゲットとした場合にはX線が発生する。 An electron beam is generated by applying a high voltage between the emitter (cathode) and the anode in a vacuum. X-rays are generated when the anode is a target such as tungsten.

特許文献1には筐体の一面に絶縁体を介してエミッタを取り付けた構成が開示され、特許文献2にあっては面板に形成した溝部にエミッタ(炭素系電子放出材料)を入れ込み、面板にゲート電極を設けた構成が開示されている。 Patent Document 1 discloses a configuration in which an emitter is attached to one surface of an enclosure via an insulator. Patent Document 2 discloses that an emitter (carbon-based electron emission material) is inserted into a groove formed in a face plate, A configuration in which a gate electrode is provided is disclosed.

特開2007−305565号公報JP 2007-305565 A 国際公開第2007/135812号International Publication No. 2007/135812

特許文献1、2ともガラス製の直管型チューブを用いておらず、従来の電子線照射装置を用いて線状に電子を照射したい場合には、チューブの一端を電子線の照射窓とした複数個の照射装置を、線に沿って配置することになり、コスト的にもメンテナンスの面でも問題がある。 In both Patent Documents 1 and 2, when a straight tube tube made of glass is not used and it is desired to irradiate electrons linearly using a conventional electron beam irradiation device, one end of the tube is used as an electron beam irradiation window. A plurality of irradiation devices are arranged along the line, and there are problems in terms of cost and maintenance.

また特許文献1には、エミッタの両側にゲート電極は存在せず、電子線を効率よく窓部から照射させることができず、特許文献2のように溝部内にエミッタを入れてしまうと、溝部の角にチャージアップが発生してしまい、これはゲート電極を設けることでは解消できない。 Further, in Patent Document 1, there are no gate electrodes on both sides of the emitter, and it is impossible to efficiently irradiate an electron beam from the window portion. If the emitter is put in the groove portion as in Patent Document 2, the groove portion A charge-up occurs at the corner of this, which cannot be eliminated by providing a gate electrode.

上記課題を解決するため本発明に、減圧雰囲気に維持されたチューブ内に電子ビームを放出するエミッタを配設した電子線照射装置において、前記チューブはガラス製の直管型チューブとされるとともに複数の窓部がチューブの長さ方向に沿って貫通して形成されるとともに金属膜で外側から気密に閉じられ、また前記エミッタは棒状をなすナノカーボン電極であって前記窓部を形成したチューブ内面と対向するチューブ内面に寄った位置にチューブの長さ方向に沿って配置され、このエミッタの両脇で前記窓部と対向するチューブ内面に寄った位置にチューブの長さ方向に沿って棒状をなすゲート電極が配置され、前記エミッタと窓部との間にグリッド電極が配置された構成とした。   In order to solve the above-mentioned problems, in the present invention, in an electron beam irradiation apparatus in which an emitter for emitting an electron beam is disposed in a tube maintained in a reduced pressure atmosphere, the tube is a straight tube type tube made of glass and a plurality of tubes are used. And the emitter is a rod-shaped nanocarbon electrode, and the inner surface of the tube forming the window is formed by penetrating along the length of the tube and being hermetically closed with a metal film from the outside. It is arranged along the length direction of the tube at a position close to the inner surface of the tube opposite to the tube, and a bar shape is formed along the length direction of the tube at a position close to the inner surface of the tube facing the window portion on both sides of the emitter. The gate electrode is arranged, and the grid electrode is arranged between the emitter and the window.

上記構成とすることで、エミッタで発生した電子線はゲート電極で方向が定められ、グリッド電極で絞られて窓部から線状(カーテン状)に放射される。   With the above configuration, the direction of the electron beam generated at the emitter is determined by the gate electrode, is narrowed by the grid electrode, and is emitted in a linear shape (curtain shape) from the window portion.

本発明に係る電子線照射装置は、塗布液の硬化以外にも、殺菌(滅菌)にも使用することができる。この場合も点照射ではなく、一定の幅で電子線を照射できるので、効率がよい。 The electron beam irradiation apparatus according to the present invention can be used not only for curing the coating solution but also for sterilization (sterilization). Also in this case, not the point irradiation but the electron beam can be irradiated with a certain width, so that the efficiency is good.

上記の他に本発明に係る電子線照射装置は、ガンマー線やUVのような材質劣化、着色、臭気を伴わず温度上昇が5℃程度と殆どないので、食品加工や薬品製造において有利である。 In addition to the above, the electron beam irradiation apparatus according to the present invention is advantageous in food processing and pharmaceutical manufacturing because there is almost no temperature rise of about 5 ° C. without material deterioration, coloring, and odor such as gamma rays and UV. .

また、電子線はガンマー線やUVに比較して殺菌(滅菌)処理時間は短く(1/10程度)てすみ、電子線は物質を透過するため、最終梱包状態での処理が可能であり、更に殺菌(滅菌)判定を電子線の照射量(線量)で行うことができるので、別途検査が不要になる。 In addition, the electron beam has a shorter sterilization (sterilization) treatment time (about 1/10) compared to gamma rays and UV, and the electron beam penetrates the substance, so that it can be processed in the final packaging state. Furthermore, since sterilization (sterilization) determination can be performed with the irradiation amount (dose) of an electron beam, a separate inspection becomes unnecessary.

本発明に係る電子線照射装置を適用したガラス基板搬送ラインの側面図Side view of glass substrate transfer line to which electron beam irradiation apparatus according to the present invention is applied 本発明に係る電子線照射装置の斜視図The perspective view of the electron beam irradiation apparatus which concerns on this invention 本発明に係る電子線照射装置の断面図Sectional drawing of the electron beam irradiation apparatus which concerns on this invention (a)は本発明に係る電子線照射装置の要部の拡大断面図、(b)は(a)を下から見た図(A) is the expanded sectional view of the principal part of the electron beam irradiation apparatus which concerns on this invention, (b) is the figure which looked at (a) from the bottom. 本発明に係る電子線照射装置のエミッタとゲート電極とグリッド電極の位置関係を示す斜視図The perspective view which shows the positional relationship of the emitter of the electron beam irradiation apparatus which concerns on this invention, a gate electrode, and a grid electrode エミッタとしてのナノカーボン電極表面の拡大写真Enlarged photo of nanocarbon electrode surface as emitter 別実施例を示す図3と同様の図The same figure as FIG. 3 which shows another embodiment

図1において、本実施例に係る電子線照射装置11は直管型チューブとなっている。直管型チューブとしては、パイレックス(登録商標)などのガラス製を用いる。   In FIG. 1, an electron beam irradiation apparatus 11 according to the present embodiment is a straight tube. The straight tube is made of glass such as Pyrex (registered trademark).

電子線照射装置11は直管型チューブの上方及び側方を保護ケース12で覆われ、搬送ラインは多数のローラ100を平行に配置して構成され、このローラ100上をガラス基板(半導体ウェーハ)Wが搬送される。   The electron beam irradiation device 11 is covered with a protective case 12 at the top and side of a straight tube, and the transport line is configured by arranging a large number of rollers 100 in parallel. A glass substrate (semiconductor wafer) is placed on the rollers 100. W is conveyed.

電子線照射装置11からはガラス基板(半導体ウェーハ)W上に塗布されたレジスト液にカーテン状に電子線が照射されレジスト液が硬化する。   From the electron beam irradiation apparatus 11, the resist solution applied on the glass substrate (semiconductor wafer) W is irradiated with an electron beam in a curtain shape to cure the resist solution.

前記電子線照射装置11は図2および図3に示すように、減圧状態(1〜10−6Torr)に維持されたチューブ13内にエミッタ14を挿入している。エミッタ14はステンレスなどの棒状電極の表面に、ナノカーボン層を形成している。このナノカーボン層は図6に示すように、先端が尖っており、この先端から電子が大量且つ容易に放出される。 As shown in FIGS. 2 and 3, the electron beam irradiation apparatus 11 has an emitter 14 inserted in a tube 13 maintained in a reduced pressure state (1 to 10 −6 Torr). The emitter 14 has a nanocarbon layer formed on the surface of a rod-shaped electrode such as stainless steel. As shown in FIG. 6, the nanocarbon layer has a sharp tip, and a large amount of electrons are easily emitted from the tip.

図6に示すようなナノカーボン層を形成するには、プラズマ雰囲気中にCH4+H2ガスを導入し、プラズマによってCH4を活性化し、基体表面にナノカーボン層を形成する。   In order to form a nanocarbon layer as shown in FIG. 6, CH4 + H2 gas is introduced into a plasma atmosphere, CH4 is activated by plasma, and a nanocarbon layer is formed on the substrate surface.

また、エミッタ14の両脇には棒状をなすゲート電極15、15を配置し、エミッタ14から放出される電子ビーム16の幅をコントロールしている。ゲート電極15としては、図7に示すように、エミッタ14の背後にチャージアップ防止用の別のゲート電極15を配置してもよい。   Further, on both sides of the emitter 14, rod-shaped gate electrodes 15 and 15 are arranged to control the width of the electron beam 16 emitted from the emitter 14. As the gate electrode 15, another gate electrode 15 for preventing charge-up may be disposed behind the emitter 14 as shown in FIG.

前記チューブ13には複数の窓部17がチューブの13長さ方向に沿って貫通して形成されるとともに金属膜(陽極)18で外側から気密に閉じられている。前記棒状をなすエミッタ14は前記窓部17を形成したチューブ13内面と対向するチューブ内面に寄った位置にチューブの長さ方向に沿って配置され、前記ゲート電極15はエミッタの両脇で前記窓部17と対向するチューブ内面に寄った位置にチューブの長さ方向に沿って配置されている。   A plurality of window portions 17 are formed through the tube 13 along the length direction of the tube 13 and are hermetically closed with a metal film (anode) 18 from the outside. The bar-shaped emitter 14 is disposed along the length of the tube at a position close to the inner surface of the tube 13 facing the inner surface of the tube 13 forming the window portion 17, and the gate electrode 15 is located on both sides of the emitter on the window. It is disposed along the length direction of the tube at a position close to the inner surface of the tube facing the portion 17.

前記窓部17の径は200〜800μm、チューブ13の厚みは0.5〜1.0mmとし、金属膜(陽極)18の厚みはチューブ13の厚みより薄く且つチューブ13内の真空が破壊されない厚みを確保している。   The diameter of the window portion 17 is 200 to 800 μm, the thickness of the tube 13 is 0.5 to 1.0 mm, the thickness of the metal film (anode) 18 is smaller than the thickness of the tube 13, and the thickness in the tube 13 is not broken. Is secured.

また、前記エミッタ14およびゲート電極15、15と窓部17との間にグリッド電極19が配置されている。このグリッド電極19は図5に示すように板状をなすとともに、電子線を絞るためのスリット20を長さ方向に形成している。 A grid electrode 19 is disposed between the emitter 14 and gate electrodes 15 and 15 and the window portion 17. As shown in FIG. 5, the grid electrode 19 has a plate shape and is formed with slits 20 for narrowing the electron beam in the length direction.

以上において、エミッタ14に−40kV〜−70kVの電圧を印加し、エミッタ14からの電流制御のためゲート電極15に必要な電流となるように−20kV〜−70kVの電圧を加える。 In the above, a voltage of −40 kV to −70 kV is applied to the emitter 14, and a voltage of −20 kV to −70 kV is applied so as to obtain a current required for the gate electrode 15 for current control from the emitter 14.

グリッド電極19は電界レンズとして機能し、窓部17の領域以外に電子が照射されない役目をする。そのために0(接地)〜−10kVの電圧を印加する。グリッド電極19で集束した電子はそのまま薄いBe製の窓部17を通り抜け、外気に放出される。したがって、集束された電子によりX線の発生は殆んどない。 The grid electrode 19 functions as an electric field lens, and serves to prevent electrons from being irradiated outside the region of the window portion 17. For this purpose, a voltage of 0 (ground) to -10 kV is applied. The electrons focused by the grid electrode 19 pass through the thin Be window 17 as they are and are emitted to the outside air. Therefore, almost no X-rays are generated by the focused electrons.

またグリッド電極19のスリット20を適当な大きさにし、バイアス電圧の印加によりレンズ効果を作ることで対象物に対し、制御された電子ビーム(カーテン状)が照射される。 In addition, the slit 20 of the grid electrode 19 is appropriately sized, and a lens effect is created by applying a bias voltage, whereby a controlled electron beam (curtain shape) is irradiated onto the object.

本発明に係る電子線照射装置は、半導体(電子回路)製造工程、食品や薬品の殺菌(滅菌)工程などにおいて利用することができる。   The electron beam irradiation apparatus according to the present invention can be used in semiconductor (electronic circuit) manufacturing processes, food and chemical sterilization (sterilization) processes, and the like.

11…電子線照射装置、12…保護ケース、13…チューブ、14…エミッタ、15…ゲート電極、16…電子ビーム、17…窓部、18…金属膜(陽極)、19…グリッド電極、20…スリット、100…ローラ、W…ガラス基板(半導体ウェーハ)。 DESCRIPTION OF SYMBOLS 11 ... Electron beam irradiation apparatus, 12 ... Protective case, 13 ... Tube, 14 ... Emitter, 15 ... Gate electrode, 16 ... Electron beam, 17 ... Window part, 18 ... Metal film (anode), 19 ... Grid electrode, 20 ... Slit, 100 ... roller, W ... glass substrate (semiconductor wafer).

Claims (1)

減圧雰囲気に維持されたチューブ内に電子ビームを放出するエミッタを配設した電子線照射装置において、前記チューブはガラス製の直管型チューブとされるとともに複数の窓部がチューブの長さ方向に沿って貫通して形成されるとともに金属膜で外側から気密に閉じられ、また前記エミッタは棒状をなすナノカーボン電極であって前記窓部を形成したチューブ内面と対向するチューブ内面に寄った位置にチューブの長さ方向に沿って配置され、このエミッタの両脇で前記窓部と対向するチューブ内面に寄った位置にチューブの長さ方向に沿って棒状をなすゲート電極が配置され、前記エミッタと窓部との間にグリッド電極が配置されていることを特徴とする電子線照射装置。 In an electron beam irradiation apparatus in which an emitter that emits an electron beam is disposed in a tube maintained in a reduced-pressure atmosphere, the tube is a glass straight tube, and a plurality of windows are arranged in the length direction of the tube. And the emitter is a rod-shaped nanocarbon electrode that is close to the tube inner surface facing the tube inner surface forming the window portion. A gate electrode arranged in a rod shape along the length of the tube is disposed along the length of the tube, and at a position near the inner surface of the tube facing the window on both sides of the emitter. An electron beam irradiation apparatus, wherein a grid electrode is disposed between the window part and the window part.
JP2010001636A 2010-01-07 2010-01-07 Electron beam irradiator Pending JP2011141176A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115529710A (en) * 2022-09-28 2022-12-27 中国原子能科学研究院 Electron curtain accelerator

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JPS62278744A (en) * 1986-05-27 1987-12-03 Sony Corp Ion gun for focusing ion beam device
JP2002341100A (en) * 2001-05-21 2002-11-27 Ushio Inc Electron beam irradiation device
JP2003197511A (en) * 2001-12-27 2003-07-11 Mitsubishi Heavy Ind Ltd Electron beam irradiation device and method therefor
JP2006120431A (en) * 2004-10-21 2006-05-11 Yyl:Kk Electron beam equipment
JP2007528497A (en) * 2004-03-09 2007-10-11 コリア アトミック エナージイ リサーチ インスチチュート Low energy large area electron beam irradiation system using field emission tip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62278744A (en) * 1986-05-27 1987-12-03 Sony Corp Ion gun for focusing ion beam device
JP2002341100A (en) * 2001-05-21 2002-11-27 Ushio Inc Electron beam irradiation device
JP2003197511A (en) * 2001-12-27 2003-07-11 Mitsubishi Heavy Ind Ltd Electron beam irradiation device and method therefor
JP2007528497A (en) * 2004-03-09 2007-10-11 コリア アトミック エナージイ リサーチ インスチチュート Low energy large area electron beam irradiation system using field emission tip
JP2006120431A (en) * 2004-10-21 2006-05-11 Yyl:Kk Electron beam equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115529710A (en) * 2022-09-28 2022-12-27 中国原子能科学研究院 Electron curtain accelerator
CN115529710B (en) * 2022-09-28 2024-02-20 中国原子能科学研究院 Electronic curtain accelerator

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