JP2011138944A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To omit a mechanism rotating a substrate, when transferring it between processing chambers, and to prevent an substrate processing apparatus from increasing in size, in the substrate processing apparatus having a plurality of processing chambers where the substrate placed on a tray and transfer is processed. <P>SOLUTION: In the substrate processing apparatus constituted of: a first tray transfer mechanism for transferring the tray, along a first linear direction toward from a first vacuum chamber to a second vacuum chamber; and a second tray transfer mechanism for transferring the tray along a second linear direction toward from the first vacuum chamber to a third vacuum chamber, the constitution of the vacuum chamber side of the second transferring mechanism of the first vacuum chamber is evacuated from a transfer level so that the tray is transferred along the first linear direction, between the first vacuum chamber and the second vacuum chamber, and the constitution of the vacuum chamber side of the first tray transfer mechanism of the first vacuum chamber is evacuated from the transfer level so that the tray is transferred, along the second linear direction between the first vacuum chamber and the third vacuum chamber. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and an electronic device manufacturing method.

  Conventionally, in order to increase processing productivity, a cluster type substrate processing apparatus in which a plurality of processing chambers are arranged around a transfer chamber has been often used. However, such an apparatus has a problem in that the size of the apparatus increases because it is necessary to rotate the substrate in the transfer chamber when transferring between a plurality of processing chambers. As a substrate processing apparatus having a transfer method for solving such a problem, there is a substrate processing apparatus having a transfer chamber in which a plurality of processing chambers are arranged on both sides (for example, see Patent Document 1).

JP 2009-147236 A (FIGS. 3 to 6)

  In a substrate processing apparatus having a plurality of processing chambers for processing by placing a substrate on a tray and performing processing, a mechanism for rotating the substrate when transporting between processing chambers is eliminated, and an increase in size of the apparatus is prevented. Let it be an issue. The invention described in Patent Document 1 does not have a rotation mechanism, but requires an arm-like mechanism when transferring the substrate between the transfer chamber and the load / unload chamber or the processing chamber, and the substrate is large. There is a problem in that the arm mechanism portion droops as it is made.

In order to solve the above problems, a substrate processing apparatus according to the present invention includes a first vacuum chamber, a second vacuum chamber arranged in contact with the first vacuum chamber in a first linear direction, the first vacuum chamber, A third vacuum chamber disposed in contact with one vacuum chamber in the second linear direction, and transports the tray along the first linear direction from the first vacuum chamber toward the second vacuum chamber. The first tray transport mechanism, the second tray transport mechanism that transports the tray along the second linear direction from the first vacuum chamber to the third vacuum chamber, and the tray transport mechanism have a substrate mounted thereon. The first tray located in the first vacuum chamber, comprising a configuration located on the surface of the tray opposite to the surface on which it is placed and a configuration on the vacuum chamber side corresponding to the surface of the tray on the opposite side The first tray transport mechanism at the intersection of the transport mechanism and the second tray transport mechanism; The vacuum chamber side of the second transport mechanism of the first vacuum chamber has a mechanism for retracting the configuration on the vacuum chamber side of any tray transport mechanism of the second tray transport mechanism from the transport level. The tray is transported along the first linear direction between the first vacuum chamber and the second vacuum chamber by retracting the configuration from the transport level, and the first vacuum chamber has the first The configuration on the vacuum chamber side of the tray transport mechanism is retracted from the transport level and the tray is transported along the second linear direction between the first vacuum chamber and the third vacuum chamber. Have.
In order to solve the above-mentioned problem, the invention according to the present application provides a second vacuum chamber in contact with the first vacuum chamber in the first linear direction, and a second straight line with respect to the first vacuum chamber. A first step of arranging a third vacuum chamber in contact with the direction; a second step of conveying the tray along the first linear direction from the first vacuum chamber toward the second vacuum chamber; A third step of transporting the tray along the second linear direction from the first vacuum chamber toward the third vacuum chamber, with respect to the surface determined by the first linear direction and the second linear direction And a first tray mounting surface having a tray transport mechanism for transporting the tray along the first linear direction and the second linear direction, and the first linear direction and the second linear direction. A fourth method of moving the second tray mounting surface having a tray transport mechanism for transporting the tray along The transport level of the tray transport mechanism that moves the tray mounting surface and transports the tray along the first linear direction related to the first tray mounting surface and the tray transport mechanism of the second vacuum chamber The first tray mounting surface and the second vacuum by retracting a part of the tray transport mechanism that transports the tray along the second linear direction of the first tray mounting surface. A fifth step of conveying the tray along the first linear direction between the chambers, moving the tray mounting surface, and along the first linear direction relating to the second tray mounting surface; A tray transport mechanism that transports the tray along the second linear direction of the second tray mounting surface by matching the transport levels of the tray transport mechanism that transports the tray and the tray transport mechanism of the second vacuum chamber. A part of the second tray mounting surface A sixth step of transporting the tray along the first linear direction between the second vacuum chambers, moving the tray mounting surface, and the second step relating to the first tray mounting surface; Match the transport levels of the tray transport mechanism for transporting the tray along the linear direction and the tray transport mechanism of the third vacuum chamber, and move the tray along the first linear direction of the first tray mounting surface. A seventh step of retracting a part of the tray transport mechanism for transporting and transporting the tray along the second linear direction between the first tray mounting surface and the third vacuum chamber; and Move the tray mounting surface to match the transport levels of the tray transport mechanism that transports the tray along the second linear direction related to the second tray mounting surface and the tray transport mechanism of the third vacuum chamber. In the first linear direction of the second tray mounting surface Eighth that conveys the tray along the second linear direction between the second tray mounting surface and the third vacuum chamber by retracting a part of the tray transport mechanism that transports the tray along the second vacuum chamber. A method for manufacturing an electronic device is provided.

  In a substrate processing apparatus having a plurality of processing chambers for processing by placing a substrate on a tray and transporting it, the substrate processing apparatus according to the present invention does not require a mechanism for rotating the substrate when transporting between processing chambers, The direction of conveyance can be changed at that position, and an arm mechanism is not required, and an increase in the size of the apparatus can be prevented.

It is the top view and sectional drawing of the substrate processing apparatus concerning this invention. It is explanatory drawing regarding the tray conveyance mechanism of this invention. It is explanatory drawing about the vacuum cylinder concerning this invention. It is explanatory drawing regarding the rack gear and roller guide of this invention. It is explanatory drawing about the endless type in-line apparatus concerning this invention. It is sectional drawing of a CIGS type compound solar cell.

  The present invention will be described below with reference to the drawings.

  The substrate processing apparatus according to the present invention is a substrate processing apparatus that places a substrate on a tray and transfers the substrate between processing chambers.

  FIG. 1A is a plan view of a cluster type substrate processing apparatus according to the present invention for processing a rectangular substrate. FIG. 1B is a cross-sectional view seen in the AA direction.

  The substrate processing apparatus includes a loading / unloading chamber 2 and a processing chamber 3 with a transfer chamber 1 as a center. More specifically, the processing chambers 3-1 and 3-3 are adjacent to the transfer chamber 1 in the X direction, and the load / unload chamber 2 and the processing chamber 3-2 are adjacent to the Y direction.

  In the case where the shape of the substrate 7 is rectangular, the shape of each vacuum vessel is such that the processing chambers 3-1 and 3-3 having a long side in the tray transport direction and the tray transport direction are in order to transport the tray without rotating. There are two types, a load / unload chamber 2 and a processing chamber 3-2 which are short sides.

  In addition, a slit valve 5 is arranged between the chambers so that the atmosphere in each chamber can be controlled independently from the other chambers. Each chamber is connected to an exhaust means (not shown). Further, a lock valve 4 is arranged in the load / unload chamber so that the atmosphere and the inside thereof can be shut off.

  The tray transport mechanism 11 of the substrate processing apparatus will be described with reference to FIG. The tray transport mechanism 11 has a configuration of a back surface of the tray 8 and a configuration built in, for example, an elevator tray mounting surface corresponding to the back surface of the vacuum chamber side or moving means.

  The back surface of the tray 8 has a rack gear 9 and a roller guide 10. On the other hand, the pinion gear 12, the roller 13, the pinion gear 12, and the support member 15 of the roller 13 and the vacuum cylinder for moving them up and down on the tray mounting surface of the elevator, for example, on the vacuum chamber side portion or moving means corresponding to the rear surface of the tray 14 is arranged.

  FIG. 3 is an explanatory diagram of the vacuum cylinder. The vacuum cylinder 14 is attached to the lower surface of the support member 15 of the tray transport mechanism 11. The support member 15 moves as the piston 25 moves in the cylindrical case according to the inflow / outflow of gas from the compressed gas inflow / outflow hole 26.

  In FIG. 3, 27 is a case, 26 is a compressed gas inflow / outflow hole, and there are an upper compressed gas inflow / outflow hole 26-1 and a lower compressed gas inflow / outflow hole 26-2. 28 is a bellows, 29 is a bottom plate, and 30 is a groove formed in the periphery of the upper part of the piston. Here, a bellows 28 is connected to the center of the piston 30. With this configuration, the inside of the bellows 30 can be maintained in a vacuum atmosphere.

  The compressed gas flows from the upper compressed gas inflow / outflow hole 26-1 to the groove 30 at the periphery of the upper part of the piston, and the compressed gas flows out from the lower compressed gas inflow / outflow hole 26-2. Thus, the support member 15 moves downward in FIG.

  Further, since the compressed gas flows in from the lower compressed gas inflow / outflow hole 26-2 and the compressed gas flows out from the upper compressed gas inflow / outflow hole 26-1, the support member 15 moves upward in FIG. To do.

  When transporting the substrate 8 in the X direction, the pinion gears 12-1 and 12-2 are driven to rotate by a motor (not shown), and the rollers 13-1 and 13-2 are roller guides 10-3 and 10-4. The substrate is transported by moving the tray 8 along the line.

  When transporting the substrate 8 in the Y direction, the pinion gears 12-3 and 12-4 are rotationally driven by a motor (not shown), and the rollers 13-3 and 13-4 are roller guides 10-1 and 10-2. The substrate is transported by moving the tray 8 along the line.

  Here, as shown in FIG. 4B, the rack gear 9 and the guide 10 are arranged so that the rack gears 9-3 and 9-4 for transporting in the Y direction do not hinder movement when transported in the X direction. The length L-2 of −3, 9-4 is a length arranged inside the roller guides 10-3, 10-4. Similarly, as shown in FIG. 4A, the rack gears 9-1, 9- are arranged so as not to hinder the movement of the rack gears 9-1, 9-2. The length L-1 of 2 is a length arranged inside the roller guides 10-1 and 10-2.

  The transfer chamber 1 is configured to move the tray in a direction intersecting with a plane determined by the X direction as the first linear direction and the Y direction as the second linear direction so that a plurality of trays 8 can be accommodated. Have For example, the moving mechanism is equipped with an elevator mechanism 6 that moves in a direction perpendicular to the X direction and the Y direction. The elevator mechanism 6 has a tray 8 on which a pre-processed substrate loaded from the load / unload chamber 2 is placed, a shelf for collecting the tray 8 on which a substrate processed in the treatment chamber 3 is collected, and a substrate that is fed into the treatment chamber 3. It is necessary to arrange at least two shelves for holding the loaded tray 8 on standby. However, the use of the shelves need not be limited for collection or standby.

  As shown in FIG. 1B, the elevator mechanism 6 has a shelf 22 for accommodating a plurality of trays 8 (two shelves in this embodiment) on a bottom plate 19, and supports the bottom plate 19 of the elevator mechanism. It is configured so that it can be moved up and down by a lift motor 16 and a ball screw 17 via a plate 20. In the transfer chamber 1 shown in FIG. 1B, the space surrounded by the container of the vacuum container 1, the bottom plate 19, and the bellows can be in a vacuum state.

  Here, the bottom plate 19 and the support plate 20 are coupled by a column member 21, but the periphery thereof is surrounded by a bellows 23, and the elevator mechanism 6 is lifted while the inside of the transfer chamber 1 is maintained in a vacuum state. It has a possible structure.

  Each of the shelves 22 of the elevator mechanism 6 in the transport chamber 1 is also used for transport in the X direction so that the tray 8 placed on the shelf can be transported in the X direction and the Y direction. 2. It has tray transport mechanism units 11-3 and 11-4 for transporting in the Y direction.

  Also in each shelf 22 of the transfer chamber 1, the tray transfer mechanism 11 used during tray transfer is in a state where the tray 8 is supported by the roller 13 and the guide 10 with the pinion gear 12 engaged with the rack gear 9 of the tray 8. Then, the tray 8 is conveyed. At that time, the support member 15 of the tray transport mechanism 11 that is not used for transport is moved downward using the vacuum cylinder 14 so as not to interfere with transport.

In the load / unload chamber 2 and the processing chamber 3, a tray transport mechanism 11 (pinion gear 12, roller 13, support member 15) that can be transported in a fixed direction is disposed. That is, in the embodiment shown in FIG. 1, the load / unload chamber 2 and the processing chamber 3-2 are provided with a Y-direction transfer mechanism, and the processing chambers 3-1 and 3-3 are provided with an X-direction transfer mechanism. Has been.

  Hereinafter, the substrate 7 carried in from the load / unload chamber 2 is transferred from the transfer chamber 1 to the processing chamber 3-1, the transfer chamber 1, the substrate processing chamber 3-2, the transfer chamber 1, the processing chamber 3-3, and the transfer chamber. A description will be given of the transfer in the case of transfer along the route 1 → load / unload chamber 2.

  With the tray 8 in the load / unload chamber 2, the lock valve 4 is opened. When a substrate processed by the apparatus is placed on the tray 8 using a robot or the like, the substrate 7 is collected and the substrate 7 to be processed by the substrate processing apparatus is placed on the tray 8. Thereafter, the lock valve 4 is closed and the slit valve 5-0 is opened.

The elevator mechanism 6 is operated to move the shelf 22 of the transfer chamber 1 where the tray 8 of the elevator mechanism 6 does not exist (assuming two upper shelves) to the load / unload chamber 2 and the transfer position. After that, in order to transfer the tray 8 from the load / unload chamber 2 with the same transport level, both the tray transport mechanisms 11 in the Y direction of the load / unload chamber 2 and the transport chamber 1 are driven. Here, in the transfer chamber 1, the support members 15-3 and 15-4 of the Y-direction transfer mechanism are moved to the rack gears 9-3 and 9-4 of the tray 8 by operating the vacuum cylinders 14-3 and 14-4. The pinion gears 12-3 and 12-4 are moved to a position where they mesh with each other. Further, the support members 15-1 and 15-2 of the tray transport mechanism in the X direction are retracted downward by operating the vacuum cylinders 14-1 and 14-2 so as not to hinder the transport. Thereafter, the tray 8 on which the unprocessed substrate in the load / unload chamber 2 is loaded is transported to an empty 22 in the transport chamber 1 (the upper shelf in the present embodiment). Thereafter, the slit valve 5-0 between the load / unload chamber 2 and the transfer chamber 1 is closed.

  Next, consider a case where the tray 8 on which an unprocessed substrate in the transfer chamber 11 is placed is transferred to the process chamber 3-1.

  First, the slit valve 5-1 between the transfer chamber 1 and the processing chamber 3-1 is opened. That is, the transport levels are matched. Subsequently, the elevator mechanism 6 is operated so that the shelf 22 on which the tray 8 on which the unprocessed substrate of the elevator mechanism 6 in the transfer chamber 1 is placed (the upper shelf in the case of continuation from the above) is mounted. It moves to the processing chamber 3-1 and the transfer position. That is, the transport levels are matched. Subsequently, the support members 15-1 and 15-2 of the tray conveyance mechanism in the X direction are operated by the vacuum cylinders 14-1 and 14-2, and the pinion gear 12- is connected to the rack gears 9-1 and 9-2 of the tray 8. Move to a position where 1 and 12-2 are engaged. Further, the support members 15-3 and 15-4 of the tray transport mechanism in the Y direction are retracted downward by operating the vacuum cylinders 14-3 and 14-4 so as not to hinder the transport. Thereafter, the tray 8 on which the unprocessed substrate in the transfer chamber 1 is placed is operated on the tray transfer mechanism group in the X direction of both the transfer chamber 1 and the processing chamber 3-1, so that the transfer chamber 1 to the processing chamber 3 are operated. Move to -1.

  In addition, when there is a tray on which the processed substrate processed in the processing chamber 3-1 is placed in the processing chamber 3-1, the tray 8 on which the processed substrate is first placed before carrying out the above-mentioned transport. It is necessary to discharge from the processing chamber 3-1.

  For this purpose, the elevator mechanism 6 is operated to move the shelf 22 on which the tray 8 of the elevator mechanism 6 of the transfer chamber 1 is not placed to a position where it is transferred to the processing chamber 3-1. That is, the transport levels are matched. Subsequently, in the transfer chamber 1, the support members 15-1 and 15-2 of the tray transfer mechanism in the X direction are operated by the vacuum cylinders 14-1 and 14-2, and the rack gears 9-1 and 9-2 of the tray 8 are operated. Are moved to a position where the pinion gears 12-1 and 12-2 are engaged with each other. Further, the support members 15-3 and 15-4 of the tray transport mechanism in the Y direction are retracted downward by operating the vacuum cylinders 14-3 and 14-4 so as not to hinder the transport. Thereafter, the tray 8 on which the processed substrate in the processing chamber 3-1 is placed is operated on the tray transport mechanism base 11 in the X direction in both the processing chamber 3-1 and the transport chamber 1 to process the processing chamber 3-3. 1 to the transfer chamber 1.

  When moving the substrate that has been processed in the processing chamber 3-1 from the processing chamber 1 to the transfer chamber 1, the elevator mechanism 6 is operated so that the vacant shelf 22 of the elevator mechanism 6 is connected to the processing chamber 3-1. Move to the transfer position. That is, the transport levels are matched. The tray transport mechanism base 11 in the X direction in both the processing chamber 3-1 and the transport chamber 1 is operated to move from the processing chamber 3-1 to the transport chamber 1. At this time, the tray transport mechanisms 11-3 and 11-4 in the Y direction of the transport chamber 1 are moved downward by operating the vacuum cylinders 14-3 and 14-4 so that the transport is not hindered. Evacuate. After the transfer, the slit valve 5-1 between the transfer chamber 1 and the processing chamber 3-1 is closed.

In the transfer from the transfer chamber 1 to the processing chamber 3-2, first, the slit valve 5-2 between the transfer chamber 1 and the processing chamber 3-2 is opened. Subsequently, the elevator mechanism 6 is operated to move the shelf 22 on which the tray 8 on which the substrate to be transported to the processing chamber 3-2 is placed to a position where the shelf 22 is transported to the processing chamber 3-2. That is, the transport levels are matched. Subsequently, in order to transfer the tray 8 from the transfer chamber 1 to the processing chamber 3-2, in the transfer chamber 1, the support members 15-3 and 15-4 of the tray transfer mechanism in the Y direction are attached to the vacuum cylinders 14-3 and 14-. 4 is moved to a position where the pinion gears 12-3 and 12-4 engage with the rack gears 9-3 and 9-4 of the tray 8. Further, the support members 15-1 and 15-2 of the tray transport mechanism in the X direction are retracted downward by operating the vacuum cylinders 14-1 and 14-2 so as not to hinder the transport. Thereafter, the tray transport mechanisms 11-3 and 11-4 in the Y direction in both the transport chamber 1 and the processing chamber 3-2 are driven to transport the tray from the transport chamber 1 to the processing chamber 3-2. After completion of the transfer, the slit valve 5-2 between the transfer chamber 1 and the processing chamber 3-2 is closed.

  In addition, when there is a tray on which the processed substrate processed in the processing chamber 3-2 is placed in the processing chamber 3-2, the tray 8 on which the processed substrate is first placed before carrying out the above-mentioned transport. It is necessary to discharge from the processing chamber 3-2 to the transfer chamber 1.

  For this purpose, the elevator mechanism 6 is operated to move the shelf 22 on which the tray 8 is not placed to a position where it is transported to the processing chamber 3-2. That is, the transport levels are matched. Subsequently, in the transfer chamber 1, the support members 15-3 and 15-4 of the tray transfer mechanism in the Y direction are operated by the vacuum cylinders 14-3 and 14-4, and the rack gears 9-1 and 9-2 of the tray 8 are operated. Are moved to a position where the pinion gears 12-1 and 12-2 are engaged with each other. Further, the support members 15-1 and 15-2 of the tray transport mechanism in the X direction are retracted downward by operating the vacuum cylinders 14-1 and 14-2 so as not to hinder the transport. Thereafter, the tray 8 on which the processed substrate in the processing chamber 3-2 is placed is operated on the tray transfer mechanism group in the Y direction of both the processing chamber 3-2 and the transfer chamber 1, thereby processing chamber 3-2. 2 is discharged into the transfer chamber 1.

  Next, a case where the tray 8 is transported from the processing chamber 3-2 to the transport chamber 1 will be considered. Basically, it is almost the same as the case where the substrate having been processed in the processing chamber 3-1 is transferred from the processing chamber 3-1 to the transfer chamber 1, but the tray transfer mechanism that operates is not in the X direction but in the Y direction. The difference is that it is a transport mechanism and the support member to be retracted is a support member for the transport function in the X direction.

  Next, consider a case where a tray on which a substrate to be processed in the processing chamber 3-3 is placed is transferred from the transfer chamber 1 to the processing chamber 3-3. The description is omitted because it is substantially the same as the transfer from the transfer chamber to the processing chamber 3-1.

  Since the transfer of the tray 8 from the processing chamber 3-3 to the transfer chamber 1 is substantially the same as the transfer from the process chamber 3-1 to the transfer chamber 1, description thereof will be omitted.

  In addition, when there is a tray on which the processed substrate processed in the processing chamber 3-3 is placed in the processing chamber 3-3, the tray 8 on which the processed substrate is first placed before carrying out the above transport. It is necessary to discharge from the processing chamber 3-3 to the transfer chamber 1.

  Also in this case, since the process is substantially the same as the process of discharging the processed substrate from the processing chamber 3-1 to the transfer chamber 1 from the processing chamber 3-1, the description is omitted.

  Consider a case where the tray 8 on which the processed substrate is placed is transferred from the transfer chamber 1 to the load / unload chamber 2. First, the slit valve 5-0 between the transfer chamber 1 and the load / unload chamber is opened. Next, the elevator mechanism 6 is operated to move to a position where the shelf 22 on which the tray on which the processed substrate in the transfer chamber 1 is placed is placed is transferred to the load / unload chamber 2. That is, the transport levels are matched. Thereafter, in order to transport the tray of the transport chamber 1 to the load / unload chamber, the support members 15-3 and 15-4 of the tray transport mechanism in the Y direction of the transport chamber 1 are attached to the vacuum cylinders 14-3 and 14-4. By operating, the rack gears 9-3 and 9-4 of the tray 8 are moved to positions where they are engaged with the pinion gears 12-3 and 12-4. Further, in order not to hinder the conveyance, the support members 15-1 and 15-2 of the conveyance mechanism are retracted by operating the vacuum cylinders 14-1 and 14-2 in the X direction. Thereafter, the tray transport mechanism base in the Y direction in both the transport chamber 1 and the load / unload chamber 2 is operated to transport the tray 8 on which the processed substrate in the transport chamber 1 is placed to the load / unload chamber 2. . After the conveyance is completed, the slit valve 5-0 is closed.

  When collecting the processed substrate 7, the lock valve 4 is opened. The processed substrate 7 on the tray 8 is collected using a robot or the like. Then, when processing a new substrate, the substrate 7 to be processed by a robot or the like is placed on the tray 8. Thereafter, the lock valve 4 is closed and the slit valve 5-0 is opened.

  By repeating the above operations, the substrate processing can be continued.

  Below, the manufacturing method of the electronic device which has the process of using the substrate processing apparatus concerning this invention is demonstrated. In particular, a method for manufacturing a solar cell will be described.

  FIG. 6 is a cross-sectional view of a typical Cu—In—Ga—Se (hereinafter referred to as CIGS) based compound solar cell. 111 is a film of glass or stainless steel as the substrate 2, 112 is a Mo layer as a back electrode, 113 is a CIGS compound layer as an electromotive portion, 114 is a buffer layer made of, for example, CdS, and 115 is an AZO layer as a window layer It is.

  Here, the AZO layer consists of three layers of ZnO (zinc oxide) (115-1), GZO (gallium-doped zinc oxide) (115-2), and AZO (Al-doped zinc oxide) (115-3). Can be laminated.

An example of the manufacturing method of a CIGS type compound solar cell will be described. A Mo layer that is the back electrode 112 is formed on the substrate 111 by a sputtering method, and then a light absorption layer that is the electromotive portion 113 is formed. The light absorption layer can be formed by performing high-temperature annealing in a gas atmosphere of H ₂ Se after two-layer stacking of CaGa alloy + In. CdS as the buffer layer is formed by a chemical bath deposition method (hereinafter abbreviated as CBD). Finally, AZO which is the window layer 115 is formed by sputtering.

  As described above, when the AZO layer as the window layer 115 is formed in three layers, it can be manufactured by an apparatus having a configuration such as the sputtering apparatus shown in FIG. 1 according to the present invention. ZnO may be used as the target, GZO may be used as the target of the processing chamber 3-2, and AZO may be used as the target of the processing chamber 3-3.

  In that case, by using the tray-type cluster type sputtering substrate processing apparatus as shown in FIG. 1 according to the present invention, even when a film is formed on a film substrate that cannot be transported unless it is mounted on the tray 8, the rotation mechanism By using the substrate processing apparatus of the present invention in which a mechanism capable of moving the tray 8 back and forth and right and left is used, the area occupied by the apparatus can be reduced.

  Next, another embodiment according to the present invention will be described with reference to FIG. FIG. 5 shows a case where the present invention is applied to an endless inline device. Here, 2 is a load / unload chamber, 3 is a processing chamber, and 100 is a corner chamber. Each room or chamber is connected via a slit valve 5 so that the atmosphere of each room can be controlled independently from other rooms. Further, a lock valve 4 is arranged in the load / unload chamber so that the atmosphere and the inside thereof can be shut off.

  Compared with a linear inline substrate processing apparatus, the apparatus of this type can reduce the length of the apparatus, so that it is easy to install the apparatus. In particular, when it is necessary to form a large number of films, and therefore it is necessary to arrange a large number of processing chambers, the in-line substrate processing apparatus in which the processing chambers are arranged in a straight line unnecessarily increases the length of the apparatus. In such a case, it is particularly advantageous. In addition, since the substrate loading position and the collection position can be made substantially the same position, the burden of transporting the substrate outside the apparatus can be reduced.

  In such a case, in the corner chamber 100, it is necessary to rotate the tray from the X direction to the Y direction or from the Y direction to the X direction. Therefore, there is a problem when the size of the corner chamber becomes larger than the size of other processing chambers.

  By adopting the transfer chamber according to the present invention as the structure of the corner chamber, the size can be made substantially the same as that of other processing chambers.

  However, in this case, since it is not necessary to store a plurality of trays in the transfer chamber 1, it intersects the plane determined by the X direction that is the first X linear direction and the Y direction that is the second linear direction. The moving means for moving the tray in the direction of moving, such as an elevator mechanism, is not always necessary. Therefore, the structure can be simplified correspondingly.

  The preferred embodiments and examples of the present application have been described above with reference to the accompanying drawings, but the present invention is not limited to the embodiments and examples, and is understood from the description of the claims. It can be changed into various forms within the range.

DESCRIPTION OF SYMBOLS 1 Transfer chamber 2 Load / unload chamber 3 Processing chamber 4 Lock valve 5 Slit valve 9 Rack gear 10 Roller guide 11 Tray transfer mechanism
12 pinion gear 13 roller 14 vacuum cylinder 15 support member 16 elevator lifting motor 17 ball screw 19 bottom plate 20 support plate 21 column member 22 shelf 23 bellows 25 piston 26 compressed gas inflow / outflow hole 27 case 28 bellows 29 bottom plate 30 groove 100 corner chamber 111 Substrate 112 Back electrode (Mo layer)
113 Light Absorption Layer (CIGS Compound Layer)
114 Buffer layer 115 Window layer

Claims (6)

First vacuum chamber,
A second vacuum chamber disposed in contact with the first vacuum chamber in a first linear direction;
A third vacuum chamber arranged in contact with the first vacuum chamber in a second linear direction The tray is transported along the first linear direction from the first vacuum chamber toward the second vacuum chamber. A first tray transport mechanism,
A second tray transport mechanism for transporting the tray along the second linear direction from the first vacuum chamber toward the third vacuum chamber;
The tray transport mechanism has a configuration located on the surface of the tray opposite to the surface on which the substrate is placed and a configuration on the vacuum chamber side corresponding to the surface of the opposite tray.
The tray transport mechanism of either the first tray transport mechanism or the second tray transport mechanism at the intersection of the first tray transport mechanism and the second tray transport mechanism located in the first vacuum chamber Having a mechanism for retracting the configuration on the vacuum chamber side from the transport level,
The first linear direction between the first vacuum chamber and the second vacuum chamber by retracting the configuration on the vacuum chamber side of the second transport mechanism of the first vacuum chamber from the transport level. Convey the tray along
The configuration on the vacuum chamber side of the first tray transport mechanism of the first vacuum chamber is withdrawn from the transport level, and the second straight line between the first vacuum chamber and the third vacuum chamber. A substrate processing apparatus for transporting a tray along a direction. Furthermore, it has a moving means for moving the tray in a direction intersecting with the plane determined by the first linear direction and the second linear direction located at the intersection,
The moving means includes a first tray conveying mechanism that conveys a tray along the first linear direction and a second tray conveying mechanism that conveys the tray along the second linear direction. A second tray mounting having a mounting surface and a first tray transport mechanism for transporting the tray along the first linear direction and a second tray transport mechanism for transporting the tray along the second linear direction Has a surface,
The moving means is operated so that the transport level of the first tray transport mechanism related to the first tray mounting surface matches the transport level of the tray transport mechanism of the second vacuum chamber, and the first tray The first linear direction between the first tray mounting surface and the second vacuum chamber by retracting the configuration of the mounting surface on the first tray mounting surface side of the second tray transport mechanism Convey the tray along
The moving means is operated so that the transport level of the first tray transport mechanism related to the second tray mounting surface matches the transport level of the tray transport mechanism of the second vacuum chamber, and the second tray The first linear direction between the second tray mounting surface and the second vacuum chamber by retracting the configuration of the mounting surface on the second tray mounting surface side of the second tray transport mechanism Convey the tray along
The moving means is operated so that the transport level of the second tray transport mechanism related to the first tray mounting surface matches the transport level of the tray transport mechanism of the third vacuum chamber, and the first tray The second linear direction between the first tray mounting surface and the third vacuum chamber by retracting the configuration of the first tray mounting surface side of the first tray transport mechanism of the mounting surface Convey the tray along
The moving means is operated so that the transport level of the second tray transport mechanism related to the second tray mounting surface matches the transport level of the tray transport mechanism of the third vacuum chamber, and the second tray The second linear direction between the second tray mounting surface and the third vacuum chamber by retracting the mechanism on the second tray mounting surface side of the first tray conveying mechanism of the mounting surface The substrate processing apparatus according to claim 1, wherein the tray is transported along the substrate. A fourth vacuum chamber disposed in contact with the first vacuum chamber on the opposite side of the second vacuum chamber along the first linear direction with respect to the first vacuum chamber; and the first vacuum chamber A fifth vacuum chamber disposed on the opposite side of the third vacuum chamber along the second linear direction with respect to the vacuum chamber and in contact with the first vacuum chamber. 3. The substrate processing apparatus according to 1 or 2. 4. A tray transfer mechanism for a tray mounting surface according to claim 2 and 3, wherein a rack gear and a roller guide attached to a surface of the tray opposite to the surface on which the substrate is mounted, and the tray on the opposite side 4. The substrate processing apparatus according to claim 2, further comprising: a pinion gear disposed on the tray mounting surface corresponding to the surface of the tray, a roller, and a support member for the pinion gear and the roller. The tray transport mechanism according to claim 1, wherein a rack gear and a roller guide attached to a surface of a tray opposite to a surface on which a substrate is placed, and the vacuum chamber corresponding to the surface of the opposite tray The vacuum substrate processing apparatus according to claim 1, further comprising: a pinion gear disposed on the side, a roller, and a support member for the pinion gear and the roller. A first vacuum chamber is disposed in contact with the first vacuum chamber in the first linear direction, and a second vacuum chamber is disposed in contact with the first vacuum chamber in the second linear direction. The process of
A second step of transporting the tray along the first linear direction from the first vacuum chamber toward the second vacuum chamber;
A third step of conveying the tray along the second linear direction from the first vacuum chamber toward the third vacuum chamber;
A tray transport mechanism configured to transport the tray along the first linear direction and the second linear direction in a direction intersecting with the plane determined by the first linear direction and the second linear direction; A fourth step of moving a second tray mounting surface having a tray mounting surface and a tray transport mechanism for transporting the tray along the first linear direction and the second linear direction;
The transport level of the tray transport mechanism that moves the tray mounting surface and transports the tray along the first linear direction related to the first tray mounting surface and the transport level of the tray transport mechanism of the second vacuum chamber. The first tray mounting surface and the second vacuum chamber are made to retreat by retracting a part of a tray transport mechanism that transports the tray along the second linear direction of the first tray mounting surface. A fifth step of conveying the tray along the first linear direction between,
The tray transfer surface is moved, and the transfer level of the tray transfer mechanism for transferring the tray along the first linear direction related to the second tray mount surface and the tray transfer mechanism of the second vacuum chamber are set. The second tray mounting surface and the second vacuum chamber are made to retreat by retracting a part of the tray transport mechanism that transports the tray along the second linear direction of the second tray mounting surface. A sixth step of conveying the tray along the first linear direction between,
The tray mounting surface is moved, and the transport level of the tray transport mechanism for transporting the tray along the second linear direction related to the first tray mounting surface and the transport level of the tray transport mechanism of the third vacuum chamber are set. The first tray mounting surface and the third vacuum chamber are made to retreat by retracting a part of the tray transport mechanism that transports the tray along the first linear direction of the first tray mounting surface. A seventh step of conveying the tray along the second linear direction between, and
The transport level of the tray transport mechanism that moves the tray mounting surface and transports the tray along the second linear direction related to the second tray mounting surface and the tray transport mechanism of the third vacuum chamber is set. The second tray mounting surface and the third vacuum chamber are made to retreat by retracting a part of the tray transport mechanism that transports the tray along the first linear direction of the second tray mounting surface. An electronic device manufacturing method comprising an eighth step of conveying the tray along the second linear direction between the two.