JP2011136715A - Method for molding carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for molding carrier tape, whereby a positional relation between a minute-component accommodating pocket and an engagement portion for tape feed is strictly regulated, and trouble such as falling of component is greatly suppressed even when an extremely minute electronic component is accommodated or taken out. <P>SOLUTION: The method for molding carrier tape includes: molding strip tape made of resin, such that component accommodating pockets 2 and positioning posts 5 are formed; conveying the stripe tape positioned by the positioning posts; and subsequently piercing sprocket holes 3 in the positions of the positioning posts. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an embossed carrier tape by vacuum forming, and in particular, a carrier tape having a fine emboss.

  As means for transporting electronic components and the like to a mounting machine, carrier tapes in which component storage pockets are formed on a tape-like base material are widely used. As a carrier tape substrate, a thermoplastic resin substrate having an antistatic treatment or conductivity imparted to its surface has been used. Conventionally, an electronic component such as an IC chip is accommodated in a carrier tape as shown in FIG.

  In this case, in the carrier tape, as is apparent from FIG. 4, the component storage pockets 2 for storing electronic components are formed at regular intervals along the longitudinal direction of the carrier tape. The carrier tape is provided with sprocket holes (feed holes) 3 at a predetermined pitch along the longitudinal direction of the carrier tape. As a result, in forming the carrier tape, the sprocket 21 in which the feed pins 22 are provided at the same pitch as the sprocket hole 3 is used in the molding machine, and the sprocket hole 3 is used as a reference to sequentially run at a predetermined pitch in the longitudinal direction. Drive.

  Such a carrier tape is formed by, for example, forming a component storage pocket 2 at regular intervals along the longitudinal direction by thermoforming a thermoplastic resin tape, and then forming the component storage pocket in the next separate process. Since the sprocket holes 3 are sequentially drilled at regular intervals on the basis of 2, the two are likely to be displaced and it is difficult to increase the relative positional accuracy between the component storage pocket 2 and the sprocket hole 3. The electronic component is stored in each component storing pocket 2 or the operation of taking out the electronic component from each component storing pocket 2 cannot be performed with high accuracy, and the electronic component falls from the pickup holding the electronic component by suction. There was a problem that caused inconvenience. If the molding of the component storage pocket 2 and the drilling of the sprocket hole 3 are performed simultaneously in the same process, the relative positional accuracy of the two can be improved. However, in such a method used in a press molding machine, It is difficult to form a precise internal shape required for a component storage pocket accompanying the miniaturization.

  In order to solve these problems, as shown in FIG. 5, it has been proposed that the component storage pocket 2 and the engaging portion 6 corresponding to the sprocket hole 3 in FIG. (See Patent Documents 1 and 2). In these carrier tapes, the component storage pocket 2 and the engaging portion 6 are formed at the same time, so that their relative positional relationship is greatly improved as compared with the conventional sprocket hole 3, and the engaging portion 6 is compatible. Although the operation of storing and taking out the electronic component can be performed with a certain degree of accuracy by using the feed pin 22, not only a sufficient fitting accuracy between the engaging portion 6 and the feed pin 22 of the molding machine is required. It does not correspond to the feeding mechanism of the current taping machine and chip mounter, and cannot be used for general purposes.

  Further, in recent years, the size of parts has been remarkably reduced, and fine parts of 1005 size (long side dimension; 1.0 mm, short side dimension; 0.5 mm) or less, such as 0402 size (long side dimension; 0.4 mm, short side dimension); 0.2mm), 0603 size (long side dimension; 0.6 mm, short side dimension; 0.3 mm), etc. are appearing. The carrier tape as described above is insufficient for storing and taking out such extremely fine electronic components without any trouble.

Japanese Patent No. 4093436 JP 2002-347710 A

The present invention strictly regulates the positional relationship between the pocket for storing micro-parts and the engaging portion for feeding the tape, and troubles such as dropping of parts even when storing and taking out extremely fine electronic parts as described above. It is an object of the present invention to provide a method for manufacturing a carrier tape capable of greatly suppressing the above.

As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the occurrence of troubles in storing and taking out electronic components is remarkably suppressed by using a carrier tape molded as follows. The present invention has been reached.
That is, the present invention provides a molding process for forming a component storage pocket and a positioning post on a strip-shaped resin tape, and transports the strip-shaped tape in a state where the positioning post is used for positioning. A sprocket hole is drilled in the carrier tape manufacturing method. In the molding step, the component storing pocket is preferably formed in a concave shape with respect to the upper surface of the carrier tape, whereas the positioning post is preferably formed in a convex shape.
On the other hand, in the case of a carrier tape having a center hole at the center of the bottom surface of the component storage pocket, it is preferable to simultaneously drill the center hole in the next step of drilling the sprocket hole.
The production method of the present invention is extremely effective in the vacuum rotary molding method. Further, a molding method in which the component storage pocket is formed by male molding and the positioning post is formed by female molding is preferable.

With the manufacturing method of the present invention, the positional relationship between the pocket for storing micro components and the engaging portion for tape feeding is strictly regulated. It is possible to obtain a carrier tape that can greatly suppress troubles.

It is a perspective view which shows an example of the formation process of the carrier tape of this invention. It is a conceptual diagram which shows the structure of a rotary type male vacuum forming machine. It is sectional drawing of the metal mold | die for male type | mold rotary. It is the perspective view, side view, and sectional drawing which show the structure of the conventional carrier tape. It is the perspective view, side view, and sectional drawing which show the structure of the carrier tape of a prior art using an engaging part.

The manufacturing method of the carrier tape of this invention is demonstrated.
The molding method of the present invention is a molding method having at least a molding step and a drilling step. In the molding step, the component storage pocket and the positioning post are molded at the same time, and in the next drilling step, the positioning post A sprocket hole is formed at a position. Examples of the molding machine to be used include a rotary vacuum molding machine, a press molding machine, and a pressure forming machine. The production of carrier tapes for storing micro components is not an intermittent molding method but a continuous molding method, and rotary vacuum molding is preferred because pitch deviation between the molding processes on the tape substrate is less likely to occur. Among these, male rotary vacuum molding using a male mold is preferable because it is possible to form a precise internal shape of the component storage pocket.

The molding process of the present invention will be described with reference to FIGS. 2 and 1 showing male rotary vacuum molding, which is an example of the molding method of the present invention.
The slit resin tape 1 (FIG. 2) is preheated by the preheating device 23, then heated to the molding temperature by the heating device 24, and positioned by the molding die device 26 and the component storing pocket 2 (FIG. 1). The post 5 is formed, cooled by the cooler 27, drilled in a state where the relative position with the component storage pocket 2 is strictly regulated by using the positioning post 5, and wound by the winder 28. A carrier tape is formed. Specifically, first, the resin tape is preheated. Examples of the heating means in the preheating include an infra heater (infrared heater) using a masking plate, an indirect heating method such as hot air blowing, and a direct heating method in which a heat bar is brought into contact with a resin tape. According to such a heating means, only a predetermined place can be heated.
Next, a certain amount of the resin tape is transferred to the molding die. Examples of the method for transferring the resin tape include a method using an air feeder, a gripper feeder, a roll feeder, etc., but there is a mechanism for feeding the reel around which the tape is wound so as to synchronize with the rotational speed of the mold. For example, the above method may not be used.
Next, a part of the resin tape that contacts the male part of the mold (hereinafter referred to as a mold contact part) is heated again from the opposite side of the molding die until just before molding using a heating device. As the heating device, the same heating means as the preheating can be used.

Next, the resin tape 1 is moved to the molding die device 26. With the molding die shown in FIG. 3, a vacuum is drawn through the vacuum hole 263, and a part of the resin tape 1 is brought into close contact with the mold insert (male mold) 262 and the positioning post molding hole 261, and the respective parts are accommodated. A carrier tape having the use pocket 2 and the positioning post 5 is formed. That is, in the example shown in FIG. 3 of the present invention, the molding die device 26 is used for shaping the male mold insert 262 for shaping the component storage pocket 2 and the positioning post 5. The post forming hole 261 for positioning is provided. The heated resin tape forms a concave component storage pocket 2 and a convex positioning post 5 on the mold at the same time, so that the component storage pocket 2 and the positioning post conform to the mold accuracy. 5 is obtained. The component storage pocket 2 preferably uses male molding in which the inside of the pocket in which the component is stored is regulated by the dimensional accuracy of the mold, whereby a precise internal shape can be formed. Since the positioning post 5 is required to have outer dimensional accuracy to be fitted into the post carrier 221, it is preferable to use female molding in which the outer side of the post is regulated by mold dimensional accuracy.
By continuously repeating the formation of the sprocket hole 3 and cooling the carrier tape thus formed in the next drilling step, the component storage pocket 2 and the positioning post 5 are aligned along the length direction. Thus, a large number of embossed carrier tapes can be obtained.

One characteristic of the carrier tape molded by the above method is that a convex positioning post 5 is formed at the sprocket hole position of the conventional carrier tape during the molding process. The positioning post 5 is preferably a cylindrical shape having a diameter of 0.50 to 1.55 mm or a truncated cone shape whose side surface is less than 10 degrees with respect to the vertical direction with respect to the bottom surface. A plurality of lines can be formed in a line in the longitudinal direction at a constant interval with high accuracy.
Further, the size of the component storage pocket formed simultaneously is not particularly limited, but usually the length in the longitudinal direction of the carrier tape is 0.1 to 3.5 mm, and the length in the short direction of the carrier tape is 0.00. Applicable to carrier tape of 1-4.0mm and depth of 0.1-2.0mm. This carrier tape is used in the drilling process using a post carrier 221 having two or more recesses closely contacting and fitting with the positioning post 5 as shown in FIG. Then, the post carrier 221 is removed, and the punching is performed at the position of the post carrier 221 in a state where the drilling position and the position of the component storage pocket 2 are strictly regulated.
In this way, it is possible to obtain a carrier tape in which the relative positional accuracy between the sprocket hole 3 and the component storage pocket 2 is extremely high as compared with the conventional carrier tape shown in FIG. When the center hole 4 is provided at the bottom center of the component storage pocket 2, the center hole 4 having the same high positional accuracy is formed by drilling simultaneously with the sprocket hole 3 in the drilling step. be able to.

The present invention will be illustrated more specifically with reference to examples, but the present invention is not limited by the contents described in these examples.
(Example 1)
An embossed carrier tape for 0603 size ceramic capacitor was manufactured as follows.
First, a carbon kneading type conductive PC-based sheet (thickness: 0.15 mm) as a plastic substrate was preheated to 100 ° C. with a preheating device. Next, the preheated PC sheet is transferred to a molding die having a positioning post molding hole having the structure shown in FIG. 3, and the mold contact portion of the PC sheet is heated from the opposite side of the mold. It was heated again by a device (hot air blow) (hot air temperature; 600 ° C.). After that, while vacuuming through the vacuum hole of the mold, the male mold portion of the mold and the PC mold sheet were brought into close contact with each other to form a component storage pocket and a positioning post at 5 m / min. After that, by carrying out the drilling process with the post fixed in the position accuracy with the post carrier having the shape shown in FIG. 1, the carrier with excellent position accuracy of the component storage pocket, sprocket hole, and center hole I got a tape. The embossed carrier tape thus obtained had an interval between the component storage pockets of 4 mm, and the size of the component storage pockets was as follows: long side dimension: 0.76 mm, short side dimension: 0.38 mm, depth 0.40 mm The diameter of the sprocket hole is 1.55 mm.
(Comparative Example 1)
A carrier tape was obtained in the same manner as in Example 1 except that a molding die without positioning post molding holes was used.

(Evaluation method of mounting failure rate)
The embossed carrier tapes obtained in the examples and comparative examples were evaluated as follows.
Using a mounting machine (high-speed modular type, mounting accuracy ± 0.05 mm / chip), 10,000 ceramic capacitors 0603 stored in the component storage pocket of the embossed carrier tape were mounted at a mounting tact of 0.10 seconds / chip. The mounting error rate at that time was obtained by the following formula. The ceramic capacitors that were not mounted were not stored in a predetermined arrangement in the component storage unit. Therefore, the mounting defect rate corresponds to the number of ceramic capacitors that were not stored in a predetermined arrangement in the component storage portion of the embossed carrier tape. The evaluation results are shown in Table 1.
Mounting failure rate = [(number of ceramic capacitors not mounted) / (number of total ceramic capacitors)] × 1000000 (ppm)

1. 1. Resin tape 2. Pocket for storing parts Sprocket hole 4. Center hall 5. 5. Post for positioning Engaging portion 21. Sprocket 22. Feed pin 221. Post carrier 23. Preheating device 24. Heating device 25. Drum 26. Molding device (male mold)
261. Positioning post forming hole 262. Mold nesting (male)
263. Vacuum hole 27. Cooler 28. Winder

Claims (5)

The band tape is transported in the molding process for forming the component storage pocket and positioning post on the belt-shaped resin tape, and the positioning post is used for positioning. A method of manufacturing a carrier tape, comprising: The method for producing a carrier tape according to claim 1, wherein, in the molding step, the component storing pocket is formed in a concave shape with respect to the upper surface of the carrier tape, whereas the positioning post is formed in a convex shape.   3. The method of manufacturing a carrier tape according to claim 1, wherein in the next step of the forming step, a center hole is drilled in a central portion of the bottom surface of the component storage pocket at the same time as the sprocket hole is drilled. . The method for manufacturing a carrier tape according to any one of claims 1 to 3, wherein the forming step is vacuum rotary forming. 5. The method of manufacturing a carrier tape according to claim 4, wherein in the vacuum rotary molding, the component storage pocket is formed by male molding and the positioning post is formed by female molding.

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