JP2011122911A - Temperature measuring system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature measuring system which, while moving a substrate as an object to be treated, measures a substrate temperature accurately. <P>SOLUTION: A temperature measuring device 30 having a crystal oscillator is mounted to the principal surface of a substrate W as an object to be treated. While moving the substrate W, when the temperature measuring device 30 has passed through a lower detection area of a transmitting and receiving antenna 20, wireless transmission and reception is performed between the transmitting and receiving antenna 20 and the temperature measuring device 30, and the temperature of the substrate W is measured from the rate of change in transmission and reception frequency at that time. Since the temperature of the substrate W is measured using the crystal oscillator, temperature measurement is performed with high precision. Since the temperature measuring device 30 is bonded to the substrate W in an attachable with an adhesive and detachable manner, the temperature measuring device 30 is bonded, not to a substrate exclusively for temperature measurement, but to the substrate W as an actual object to be treated to measure its temperature. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a temperature measurement system for measuring the temperature of a thin plate-like precision electronic substrate (hereinafter simply referred to as “substrate”) such as a moving glass substrate for a flat panel display, a silicon substrate for a solar cell, and a semiconductor wafer, In particular, the present invention relates to a temperature measurement system capable of measuring temperatures at a plurality of locations on a substrate surface.

  In the manufacturing process of semiconductor devices and FPDs (flat panel displays), it is desirable to measure the temperature of the substrate as accurately as possible and perform appropriate temperature management. Patent Document 1 discloses a device in which a temperature sensor is installed on a substrate and the temperature sensor and a transmission device for transmitting detection data are connected by a cable. Patent Document 2 discloses a technique in which a temperature sensor and a transmitter or a memory are provided on a temperature measurement substrate.

  Patent Document 3 proposes a technique for measuring temperature by using a damped vibration when a crystal resonator is mounted on a temperature measurement substrate and the crystal resonator is resonated at a natural frequency. ing. Since the quartz resonator has high heat resistance and high thermal sensitivity, temperature measurement can be performed with high accuracy even on a high-temperature substrate.

JP 2002-124457 A JP-A-11-307606 JP 2004-140167 A

  However, in the past, temperature measurement was performed using a dedicated temperature measurement board with a temperature sensor attached. For this reason, the temperature of the substrate actually processed has not been directly measured accurately.

  Further, the conventional temperature measurement is to measure the temperature of the temperature measurement substrate that is placed and heated in the heat treatment unit, and does not measure the history of the substrate temperature throughout the entire process. In order to measure such a temperature history, it is necessary to measure the temperature of the substrate in the transfer stage carried in and out of the heat treatment unit, but it is difficult to accurately measure the temperature of the moving substrate. there were.

  Furthermore, for a substrate that is heated while moving like a conveyor-type heat treatment furnace, the temperature of the moving substrate must be measured, especially if the uniformity of heating is to be grasped. Although it is necessary to measure the temperature at a plurality of locations, it is difficult to measure the temperature at a plurality of locations on the moving substrate.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a temperature measurement system capable of accurately measuring temperatures at a plurality of locations on a substrate while moving the substrate to be processed. To do.

  In order to solve the above-mentioned problems, a first aspect of the present invention is a temperature measurement system for measuring temperatures at a plurality of locations on a moving substrate, wherein a plurality of substrates are mounted on the substrate along the moving direction of the substrate. A temperature sensing element having a sensor antenna connected to a vibrator and a temperature sensing element provided on one side of the moving substrate, extending in a direction intersecting with the moving direction of the substrate, and attached to the substrate A transmission / reception antenna for transmitting / receiving wirelessly to / from a sensor antenna, a transmission wave to the temperature sensing element via the transmission / reception antenna, and an electromagnetic wave emitted from the temperature sensing element after the transmission of the transmission wave is stopped Temperature calculation for calculating the temperature of the substrate based on the frequency of the electromagnetic wave from the temperature sensing element received by the transmission / reception means Characterized in that it comprises a stage, a.

  According to a second aspect of the present invention, in the temperature measurement system according to the first aspect of the invention, the temperature measuring element has a lower surface detachably attached to the substrate, and a sensor antenna at a position away from the substrate surface by a predetermined distance. It further comprises a spacer for holding.

  According to a third aspect of the present invention, in the temperature measurement system according to the second aspect of the present invention, one end of the temperature measuring element is held by a spacer, the other end holds a crystal resonator, and the crystal resonator is placed on a substrate. It further comprises an elastic member that is biased so as to be pressed, and a wiring that electrically connects the crystal resonator and the sensor antenna.

  According to a fourth aspect of the present invention, in the temperature measurement system according to the third aspect of the present invention, the temperature detecting element includes an open portion that exposes a part of a region to be covered when mounted on the substrate. .

  The invention according to claim 5 is the temperature measurement system according to any one of claims 1 to 4, wherein the substrate is arranged such that only one temperature sensing element passes through the detection area of the transmission / reception means at the same time. A plurality of temperature sensing elements are mounted at intervals, and the transmission / reception means transmits transmission waves having the same frequency to all temperature sensing elements mounted on the substrate.

  According to a sixth aspect of the present invention, there is provided the temperature measurement system according to any one of the first to fourth aspects of the present invention, wherein the plurality of temperature sensing elements pass through the detection area of the transmitting / receiving means at the same time. A plurality of temperature sensing elements are attached, and the transmission / reception means transmits transmission waves having different frequencies to each of the plurality of temperature sensing elements that pass through the detection area at the same time.

  The invention according to claim 7 is the temperature measuring system according to the invention of claim 6, wherein markings according to frequencies corresponding to a plurality of temperature measuring elements passing through the detection area at the same time are attached.

  The invention according to claim 8 is the temperature measurement system according to any one of claims 1 to 7, wherein the temperature calculation means calculates the temperature of the substrate being subjected to the predetermined processing while being moved. It is characterized by doing.

  According to a ninth aspect of the present invention, in the temperature measurement system according to any one of the first to eighth aspects of the present invention, the temperature at a plurality of locations of the substrate that is linearly moved is measured.

  According to a tenth aspect of the present invention, in the temperature measurement system according to any one of the first to eighth aspects of the present invention, the temperature at a plurality of locations of the substrate that is rotated is measured.

  According to the first to tenth aspects of the present invention, there is provided a transmission / reception antenna that is mounted on a substrate with a plurality of temperature sensing elements each having a crystal resonator and extends long in a direction that intersects the moving direction of the substrate while moving the substrate. Since the temperature of the substrate is calculated based on the frequency received at that time, and is transmitted to and received from the temperature measuring element, while moving the substrate to be processed, a plurality of locations along the substrate transport direction, and The substrate temperature can be accurately measured at a plurality of locations along the direction intersecting the substrate transport direction.

  In particular, according to the invention of claim 2, since the temperature measuring element includes a spacer for holding the sensor antenna at a position spaced apart from the main surface of the substrate by a predetermined distance, an external metal member is disposed between the transmission / reception antenna and the temperature measuring element. Interference with transmission / reception is prevented, and measurement errors can be minimized.

  In particular, according to the invention of claim 3, the temperature measuring element includes an elastic member having one end held by the spacer, the other end holding the crystal unit, and biasing the crystal unit to press against the substrate. Therefore, the crystal unit can measure the temperature of the substrate directly in contact with the substrate, without interposing any extraneous matter that interferes with the temperature measurement of the adhesive or the like, and in contact with the substrate. Is also pressed and heat conduction is good, and high measurement accuracy can be expected.

  In particular, according to the invention of claim 4, the temperature measuring element includes an open portion that exposes a part of the region to be covered when bonded to the substrate, and is therefore suitable for supplying a processing liquid to the substrate and performing liquid processing. It is.

  In particular, according to the invention of claim 7, since markings according to frequencies corresponding to a plurality of temperature sensing elements passing through the detection area at the same time are attached, workability of bonding the temperature sensing elements to the substrate can be improved. .

  In particular, according to the eighth aspect of the present invention, the temperature of the substrate being processed while being subjected to the predetermined processing is calculated, so that the temperature of the substrate being processed can be accurately measured.

It is a figure which shows an example of the process line of the board | substrate to which the temperature measurement system which concerns on this invention is applied. It is the top view which looked at the board | substrate conveyed by the conveyance path of FIG. 1 from the upper surface. It is an external appearance perspective view which shows an example of a temperature measuring element. It is a figure which shows typically the state which mounted | wore the board | substrate with the temperature sensing element. 1 is an overall configuration diagram of a temperature measurement system using a temperature measuring element and a transmission / reception antenna. It is a figure which shows typically the structure of the other example of a temperature sensing element. It is a figure which shows typically the structure of the other example of a temperature sensing element. It is a figure which shows typically the structure of the other example of a temperature sensing element. It is the top view which looked at the other example of the board | substrate conveyed in a conveyance path from the upper surface. It is a figure which shows typically the structure of the apparatus which processes a semiconductor wafer as a board | substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. First Embodiment>
FIG. 1 is a diagram showing an example of a substrate processing line to which a temperature measurement system according to the present invention is applied, and is specifically a side view of a substrate transport path between processing units. FIG. 2 is a plan view of the substrate W transported along the transport path of FIG. 1 as viewed from above. The substrate W to be processed in the first embodiment is a rectangular glass substrate for a flat panel display.

  Metal casings 11a and 11b (hereinafter simply referred to as a casing 11 when the upper and lower sides are not distinguished) are fixedly installed above and below the transport path. A plurality of transport rollers 12 are provided in the vicinity of the upper side of the housing 11b. The transport roller 12 is rotated by a rotation driving unit (not shown). As the transfer roller 12 rotates, the substrate W is linearly moved as indicated by arrows AR1 and AR2 in FIGS. A heat source (not shown) such as a resistance heater, an induction heater, or a lamp heater is installed between the transport roller 12 and the transport roller 12 or between the transport roller 12 and the housing 11b. Heat treatment is performed while moving by a transfer roller 12 in a tunnel-shaped heat treatment furnace surrounded by the casings 11a and 11b.

  A transmitting / receiving antenna 20 is provided below the housing 11a. Specifically, the rail 21 is screwed and fixed to the housing 11a that constitutes the ceiling portion of the heat treatment furnace. The rail 21 is provided such that its longitudinal direction is along a horizontal direction perpendicular to the transport direction of the substrate W. And the insulating block 22 provided with the transmission / reception antenna 20 is attached to the rail 21 so that sliding is possible. Therefore, by moving the block 22 along the rail 21, the position of the transmitting / receiving antenna 20 can be adjusted along the horizontal direction (width direction of the substrate W) perpendicular to the transport direction of the substrate W. The transmission / reception antenna 20 installed in the conveyance path via the block 22 is provided at a distance of at least 10 mm from the upper casing 11a.

  In the first embodiment, the transmission / reception antenna 20 is configured as a loop antenna. The transmission / reception antenna 20 installed in the conveyance path via the block 22 is connected to a transmission / reception unit 60 described later by wiring. In addition, what is necessary is just to fix the wiring which connects the transmission / reception antenna 20 and the transmission / reception part 60 along the rail 21. FIG.

  A plurality of temperature measuring elements 30 are bonded to the upper surface of the substrate W to be processed. In the first embodiment, a set of four temperature measuring elements 30 is attached to the upper surface of the substrate W. As shown in FIG. 2, the four temperature measuring elements 30 constituting one set are attached at predetermined intervals along the oblique direction of the substrate W. More specifically, the temperature measuring element 30 is attached to four different points in the width direction of the substrate W, and is also attached to four different points in the longitudinal direction (transport direction). As the four different points in the width direction of the substrate W, it is preferable to select four points that are appropriate for measuring the temperature distribution in the width direction. On the other hand, with respect to the longitudinal direction, the respective temperature detecting elements 30 are provided at intervals in which two temperature detecting elements 30 cannot simultaneously exist in the detection area of the transmitting / receiving antenna 20. That is, the detection area on the upper surface of the substrate W that passes below the transmission / reception antenna 20 installed in the upper part of the transport path is almost directly below the transmission / reception antenna 20. When the substrate W moves linearly, the plurality of temperature sensing elements 30 are bonded to the substrate W with an interval through which only one temperature sensing element 30 passes through the detection area of the transmission / reception antenna 20 at the same time. In the first embodiment, when the substrate W moves linearly, the layout of the plurality of temperature sensing elements 30 is as long as only one temperature sensing element 30 passes through the detection area of the transmission / reception antenna 20 at the same time. It is not limited to the example of FIG.

  FIG. 3 is an external perspective view of the temperature detecting element 30 according to the first embodiment. FIG. 4 is a diagram schematically showing a state in which the temperature measuring element 30 is mounted on the substrate W. The temperature measuring element 30 includes a crystal resonator 32, a sensor antenna 34, a spacer 35, and a leaf spring 36. The crystal resonator 32 is built in the package and attached to one end side of the leaf spring 36. Crystals have different natural frequencies depending on the angle cut from the crystal and have various temperature characteristics, and so-called Ys cuts of them have a large rate of change in transmission / reception frequency with respect to temperature. If an electric signal having a frequency corresponding to the natural frequency is transmitted to the crystal unit 32 and the frequency of the electric signal received from the crystal unit 32 is measured after the transmission is stopped, the temperature measuring element 30 is based on the rate of change of the transmission / reception frequency. Temperature can be calculated. If a quartz resonator is used, temperature measurement can be performed with very high accuracy compared to a resistance temperature detector or the like. In the first embodiment, the natural frequencies of all the crystal resonators 32 provided in the plurality of temperature measuring elements 30 mounted on the substrate W are the same.

  The spacer 35 is a cylindrical member made of a resin material having heat resistance and a small heat capacity. Examples of resin materials having such heat resistance and a small heat capacity include polyimide, polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE), polyetheretherketone (PEEK), and polyphenylene sulfide (PPS). ), Polyvinylidene fluoride (PVDF), polyethersulfone (PES), polysulfone (PSF), polyetherimide (PEI), or a heat-resistant rubber material. The height of the cylindrical spacer 35 is 10 mm. A glass epoxy substrate on which the sensor antenna 34 is patterned is mounted on the cylindrical upper portion of the spacer 35. Instead of the glass epoxy substrate, a flexible printed circuit board obtained by patterning the sensor antenna 34 may be used.

  The other end side of the leaf spring 36 (the side opposite to the side where the crystal unit 32 is mounted) is fixedly connected to the lower surface of the glass epoxy substrate provided with the sensor antenna 34. The leaf spring 36 is made of, for example, a polyimide resin. The crystal unit 32 and the sensor antenna 34 are electrically connected by a wiring (not shown). The other end side of the leaf spring 36 may be fixedly connected to the inner wall surface of the spacer 35.

  When the temperature measuring element 30 having such a structure is attached to the main surface of the substrate W, the crystal unit 32 can be pressed against the main surface of the substrate W as shown in FIG. Specifically, an adhesive is applied to the lower end of the spacer 35 of the temperature measuring element 30, and the spacer 35 is pressed against the upper surface of the substrate W. As the adhesive, for example, an epoxy adhesive or a silicon adhesive can be used. Thereby, the spacer 35 is bonded to the upper surface of the substrate W. When the spacer 35 comes into contact with the upper surface of the substrate W, the leaf spring 36 bends and presses in a state where the tip crystal unit 32 is in contact with the upper surface of the substrate W. That is, the leaf spring 36 functions as an elastic member that presses the crystal unit 32 against the main surface of the substrate W. When the leaf spring 36 bends, the tip protrudes from the notch portion of the spacer 35 to the outside of the cylinder. By using the spacer 35 and the leaf spring 36 in this way, the quartz crystal resonator 32 does not have any intervening material such as an adhesive that interferes with the temperature measurement, such as an adhesive. The main surface of the substrate W can be pressed so as to come into contact with the substrate W. Instead of applying the adhesive to the spacer 35, the spacer 35 may be adhered to the main surface of the substrate W by a double-sided adhesive tape using a silicon adhesive or the like. As for mounting the temperature measuring element 30 on the substrate W, a concave portion is formed on the surface of the substrate, a convex portion that fits into the concave portion is formed on the lower surface of the spacer 35, and the spacer 35 is attached to the substrate W by fitting. You may mount | wear, and you may mount | wear not only by the above-mentioned adhesive agent and the adhesion | attachment by a double-sided adhesive tape, and the above-mentioned fitting but by another method.

  The temperature measuring element 30 is mounted on the upper surface of the substrate W that is actually a processing target. The operator sequentially adheres the spacers 35 of the plurality of temperature sensing elements 30 to the upper surface of the substrate W with an adhesive at an appropriate timing before processing. In the first embodiment, the layout for mounting the plurality of temperature sensing elements 30 is as shown in FIG. When the spacer 35 of the temperature measuring element 30 is bonded to the upper surface of the substrate W, the crystal unit 32 is pressed against the upper surface of the substrate W by the elastic force of the leaf spring 36. In addition, the sensor antenna 34 electrically connected to the crystal unit 32 is located about 10 mm away from the upper surface of the substrate W.

  Further, the operator removes the plurality of temperature detecting elements 30 from the substrate W at an appropriate timing after processing. Since the temperature measuring element 30 has the spacer 35 bonded to the upper surface of the substrate W with an adhesive, it can be easily removed from the substrate W after the temperature measurement is completed. That is, the plurality of temperature measuring elements 30 are detachably mounted on the upper surface of the substrate W by an adhesive. The substrate W is actually a glass substrate to be processed, and it is needless to say that the next process can be performed on the substrate W from which the temperature sensing element 30 has been removed.

  FIG. 5 is an overall configuration diagram of a temperature measurement system using a detachable temperature sensing element 30 and a transmission / reception antenna 20. The transmission / reception antenna 20 installed in the conveyance path is wired to the transmission / reception unit 60 via a wire. The transmission / reception unit 60 includes a switch 61, a transmitter 62, a receiver 63 and a frequency counter 64. The switch 61 switches the connection destination of the transmission / reception antenna 20 between the transmitter 62 and the receiver 63. The transmitter 62 transmits an electric signal having a predetermined frequency to the crystal resonator 32 of the temperature detecting element 30 as a transmission wave via the transmission / reception antenna 20. Further, the receiver 63 receives the electromagnetic wave emitted from the crystal resonator 32 of the temperature measuring element 30 via the transmission / reception antenna 20. A frequency counter 64 is connected to the receiver 63, and the frequency counter 64 counts the frequency of the electromagnetic wave received by the receiver 63.

  Further, a temperature calculation unit 69 is connected to the frequency counter 64. The temperature calculation unit 69 calculates the temperature of the substrate W at the part where the temperature measuring element 30 is mounted based on the frequency of the electromagnetic wave counted by the frequency counter 64. The transmitter / receiver 60 and the temperature calculator 69 may be controlled by a controller (not shown) provided in the processing line of the substrate W.

  When the temperature of the substrate W is measured by the above temperature measurement system, it is executed as follows. First, an operator sequentially adheres a plurality of temperature sensing elements 30 to a substrate W to be processed and a temperature measurement target. At this time, the plurality of temperature sensing elements 30 are attached to any one of four locations in the width direction of the substrate W, and two or more temperature sensing elements 30 are simultaneously provided in the detection area of the transmission / reception antenna 20 in the longitudinal direction of the substrate W. It is attached at intervals that cannot exist. The operator easily attaches the spacers 35 of the plurality of temperature sensing elements 30 to the substrate W to be processed using an adhesive. Further, since no wiring work is required for each thermometer 30, the substrate W is large in the seventh generation (G7: width 1900 mm × length 2200 mm) or the eighth generation (G8: width 2200 mm × length 2400 mm). Even if it is a glass substrate, many temperature sensing elements 30 can be attached easily.

  The substrate W on which the attachment of the plurality of temperature measuring elements 30 is completed is put into the processing line. The substrate W passes under the transmitting / receiving antenna 20 in the course of processing. At this time, the temperature of the substrate W is measured. More specifically, the substrate W that is linearly moved by the transport roller 12 sequentially passes below the transmitting / receiving antenna 20 from the tip. A plurality of temperature sensing elements 30 are mounted on the upper surface of the moving substrate W, and these temperature sensing elements 30 sequentially pass under the transmitting / receiving antenna 20. In the first embodiment, when the substrate W moves linearly, only one temperature sensing element 30 passes through the detection area of the transmitting / receiving antenna 20 at the same time. Then, when the temperature sensing element 30 passes through the detection area of the transmission / reception antenna 20, wireless transmission / reception is performed between the transmission / reception antenna 20 and the temperature sensing element 30 so that the temperature sensing element 30 is bonded to the substrate. Measure the temperature of W.

  The switch 61 continuously performs the operation of switching alternately between the transmitter 62 side and the receiver 63 side at high speed. As a result, when the substrate W is moved by the transport roller 12 and the temperature detecting element 30 passes through the detection area of the transmission / reception antenna 20, the switch 61 is switched to the transmitter 62 at a frequency of at least once. The transmitting / receiving antenna 20 is connected to the transmitter 62. At the connected timing, an electrical signal having a frequency corresponding to the natural frequency of the crystal resonator 32 of the temperature sensing element 30 is transmitted from the transmitter 62, and transmission corresponding to the natural frequency of the crystal resonator 32 is transmitted from the transmitting / receiving antenna 20. A wave is transmitted. The frequency of the electrical signal transmitted from the transmitter 62 is also transmitted from the transmitter 62 to the temperature calculation unit 69.

  The electrical signal transmitted from the transmitter 62 is transmitted from the transmission / reception antenna 20 as a transmission wave to the temperature sensing element 30 passing through the detection area immediately below the transmission / reception antenna 20. The transmitted wave is received by the sensor antenna 34 of the temperature sensing element 30 passing through the detection area, and as a result, the crystal resonator 32 of the temperature sensing element 30 resonates. In the first embodiment, only one temperature sensing element 30 passes through the detection area at the same time, and the electromagnetic wave transmitted from the transmitting / receiving antenna 20 is received by only one temperature sensing element 30 passing through the detection area. The

  Next, the transmission of the transmitter 62 is stopped, the transmission of the transmission wave is stopped, and the switch 61 is switched to the receiver 63 side. When the transmission of the transmission wave is stopped, the above-described resonated crystal resonator 32 oscillates at a frequency corresponding to the temperature of the substrate W (more precisely, the temperature at the position where the crystal resonator 32 is pressed). . Then, an electrical signal resulting from this damped vibration is transmitted from the crystal resonator 32. The electric signal transmitted from the crystal unit 32 is output as an electromagnetic wave from the sensor antenna 34 of the temperature sensing element 30, and the electromagnetic wave is received by the transmission / reception antenna 20. The receiver 63 receives the electrical signal transmitted from the crystal resonator 32 via the sensor antenna 34 and the transmission / reception antenna 20.

  The time interval from when the transmission / reception antenna 20 starts transmission of the transmission wave to reception of the electromagnetic wave generated by the transmission of the crystal unit 32 is an extremely short time of about 10 milliseconds. Therefore, even when the substrate W is linearly moved by the transport roller 12, transmission / reception between the transmission / reception antenna 20 and the temperature detection element 30 as described above is performed while the temperature detection element 30 passes through the detection area of the transmission / reception antenna 20. It is possible to complete.

  Subsequently, the frequency counter 64 counts the frequency of the electrical signal from the crystal unit 32 received by the receiver 63 and transmits the count value to the temperature calculation unit 69. The temperature calculation unit 69 calculates the change rate of the transmission / reception frequency based on the frequency of the electrical signal counted by the frequency counter 64 and the frequency of the transmitted electrical signal transmitted from the transmitter 62, and detects the temperature from the change rate. The temperature of the substrate W at the position where the element 30 is mounted is calculated.

  Such a temperature measurement process is performed every time the temperature sensing element 30 passes through the detection area of the transmission / reception antenna 20. As a result, temperature measurement is performed for all of the plurality of temperature sensing elements 30 bonded to the upper surface of the substrate W, and temperature measurement values for the entire surface of the substrate W can be acquired. After the temperature measurement is completed and the substrate W unloaded from the processing line is removed from all the temperature measuring elements 30, the substrate W is transferred to the next step.

  As described above, the temperature sensing element 30 including the crystal resonator 32 is attached to the main surface of the substrate W to be processed, and the temperature sensing element 30 passes through the lower detection area of the transmission / reception antenna 20 while moving the substrate W. Sometimes, wireless transmission / reception is performed between the transmission / reception antenna 20 and the temperature sensing element 30, and the temperature of the substrate W is measured from the rate of change of the transmission / reception frequency at that time. The time required for transmission / reception between the transmission / reception antenna 20 and the temperature detecting element 30 is about 10 milliseconds, and transmission / reception can be completed while the temperature detection element 30 passes through the detection area of the transmission / reception antenna 20. It is. Further, since the temperature of the substrate W is measured using the crystal unit 32, the temperature can be measured with very high accuracy. As a result, the temperature of the substrate W can be measured accurately and in real time while the substrate W to be processed is moved.

  In addition, since the temperature sensing element 30 is detachably attached to the substrate W, the temperature sensing element 30 is actually attached to the substrate W to be processed instead of the temperature measurement dedicated substrate, and the temperature can be measured. it can. Since the resin material having a small heat capacity is used for the spacer 35 of the temperature measuring element 30, the temperature change of the substrate W due to the mounting of the temperature detecting element 30 can be suppressed to be small.

  Moreover, it is not necessary to provide components such as a power supply unit for driving and a memory for data storage in the temperature measuring element 30 including the crystal resonator 32. Furthermore, wiring work for the temperature sensing element 30 mounted on the substrate W is not necessary. For this reason, even if the board | substrate W is a large sized glass substrate, the several temperature sensing element 30 can be attached safely and easily, and workability | operativity can be made favorable. In addition, the temperature of the substrate W can be accurately measured without being affected by the heat radiation from the power supply unit or the thermal effect of the wiring. Furthermore, there is no possibility that troubles such as loss or no acquisition of measurement data due to consumption of the power supply unit will occur.

  Further, the temperature measuring element 30 presses the crystal resonator 32 against the main surface of the substrate W by a leaf spring 36 that is an elastic member. For this reason, regardless of the type of the substrate W, the crystal unit 32 can surely directly contact the main surface of the substrate W and perform accurate temperature measurement.

  Further, the sensor antenna 34 electrically connected to the crystal unit 32 is held by a spacer 35 at a distance of about 10 mm from the main surface of the substrate W. For this reason, the sensor antenna 34 is located at a distance of at least 10 mm from the metal casing 11b. Similarly, the transmitting / receiving antenna 20 installed in the conveyance path via the block 22 is also provided at a distance of at least 10 mm from the metal casing 11a. As a result, the capacitance between the sensor antenna 34 and the housing 11b is reduced, and the capacitance between the transmission / reception antenna 20 and the housing 11a is also reduced. Interference with transmission / reception between the sensor antenna 34 and the sensor antenna 34, and measurement errors can be minimized.

<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. The second embodiment differs from the first embodiment in the structure of the temperature sensing element. FIG. 6 is a diagram schematically illustrating the structure of the temperature sensing element 130 of the second embodiment. In FIG. 6, the same elements as those in FIG. 4 of the first embodiment are denoted by the same reference numerals.

  The temperature measuring element 130 according to the second embodiment includes a crystal resonator 32, a sensor antenna 34, a spacer 135, and a coil spring 136. The crystal unit 32 is built in the package and attached to the lower end of the coil spring 136. As in the first embodiment, the spacer 135 is a cylindrical member formed of a resin material having a small heat capacity. The height of the cylindrical spacer 135 is 10 mm. A glass epoxy substrate on which the sensor antenna 34 is patterned is mounted on the cylindrical upper portion of the spacer 135.

  The upper end of the coil spring 136 is connected to the central portion of the lower surface of the glass epoxy substrate provided with the sensor antenna 34. The coil spring 136 is made of an insulating resin material. The crystal unit 32 and the sensor antenna 34 are electrically connected by a wiring 137.

  When the temperature measuring element 130 having such a structure is attached to the main surface of the substrate W, the crystal unit 32 can be pressed against the main surface of the substrate W as shown in FIG. That is, when the spacer 135 is bonded to the main surface of the substrate W by the adhesive, the coil spring 136 is slightly contracted and pressed in a state where the crystal resonator 32 is in direct contact with the upper surface of the substrate W. In the second embodiment, the coil spring 136 functions as an elastic member that presses the crystal unit 32 against the main surface of the substrate W. However, since the coil spring 136 is an elastic member that linearly expands and contracts, the spacer 135 of the second embodiment is not provided with a notch for the coil spring 136.

  The remaining configuration of the second embodiment other than the structure of the temperature measuring element is the same as that of the first embodiment. The temperature measurement procedure for the substrate W is also the same as in the first embodiment. Even when the temperature measuring device 130 of the second embodiment is used, the same effect as that of the first embodiment can be obtained.

<3. Third Embodiment>
Next, a third embodiment of the present invention will be described. The third embodiment differs from the first embodiment in the structure of the temperature sensing element. FIG. 7 is a diagram schematically showing the structure of the temperature measuring element 230 of the third embodiment. FIG. 7A is a side view of the temperature sensing element 230 according to the third embodiment, and FIG. 7B is a plan view of the temperature sensing element 230.

  The temperature measuring element 230 of the third embodiment is configured by connecting a sensor holding unit 231 and an antenna holding unit 235. The antenna holding part 235 is a glass epoxy substrate on which the sensor antenna 236 is patterned. The thickness of the antenna holding part 235 is 2 mm.

  On the other hand, the sensor holding portion 231 is also a glass epoxy substrate, and a crystal resonator 232 incorporated in the package is fixed to the tip of the lower surface. The sensor holding unit 231 is fixedly connected to the antenna holding unit 235 on the base end side, and the upper surface of the sensor holding unit 231 and the upper surface of the antenna holding unit 235 are flush with each other. The thickness of the sensor holding portion 231 is 1 mm, and the thickness of the package incorporating the crystal resonator 232 is 1.15 mm. That is, the total thickness (2.25 mm) of the sensor holding unit 231 and the crystal resonator 232 is larger than the thickness (2 mm) of the antenna holding unit 235.

  In order to attach the temperature measuring element 230 to the main surface of the substrate W, an adhesive is applied to the lower surface of the antenna holding portion 235 and then the antenna holding portion 235 is pressed against the main surface of the substrate W to be bonded. At this time, since the total thickness of the sensor holding unit 231 and the crystal unit 232 is larger than the thickness of the antenna holding unit 235, the glass epoxy substrate of the sensor holding unit 231 is slightly bent and the crystal unit 232 is attached to the substrate W. It will press in the state made to contact the main surface. That is, in the third embodiment, the glass epoxy substrate itself of the sensor holding portion 231 functions as an elastic member that presses the crystal resonator 232 against the main surface of the substrate W.

  The remaining configuration of the third embodiment other than the structure of the temperature measuring element is the same as that of the first embodiment. The temperature measurement procedure for the substrate W is also the same as in the first embodiment. Even in the third embodiment, substantially the same effect as that of the first embodiment can be obtained. However, in the third embodiment, the distance between the sensor antenna 236 and the main surface of the substrate W is smaller than in the first and second embodiments. For this reason, in order to prevent the metal casing 11b from interfering with transmission / reception, it is preferable to increase the distance between the substrate W to be moved and the casing 11b.

<4. Fourth Embodiment>
Next, a fourth embodiment of the present invention will be described. The fourth embodiment differs from the first embodiment in the structure of the temperature sensing element. FIG. 8 is a diagram schematically showing the structure of the temperature sensing element 330 of the fourth embodiment. FIG. 8A is a side view of the temperature sensing element 330 according to the fourth embodiment, and FIG. 8B is a plan view of the temperature sensing element 330.

  The temperature measuring element 330 according to the fourth embodiment includes a crystal resonator 332, a sensor antenna 334, a spacer 335, and a leaf spring 336. The crystal resonator 332 is built in the package and attached to the center of the lower surface of the leaf spring 336. The leaf spring 336 is formed of a resin material, and is configured such that three support plates extend radially from the central disc member at 120 ° intervals. The spacer 335 is a rod-shaped member made of a resin material having a small heat capacity. In the third embodiment, the lower ends of the three spacers 335 are fixed to the tips of the three support plates of the plate spring 336, respectively.

  On the other hand, an antenna holding portion 337 including a sensor antenna 334 is fixed to the upper ends of the three spacers 335. The antenna holding part 337 is an annular member formed of a resin material. The sensor antenna 334 provided along the ring-shaped antenna holding portion 337 is electrically connected to the crystal resonator 332 and the wiring 338. The height of the spacer 335 is 10 mm. The lower end portion of the crystal unit 332 protrudes slightly from the lower end portion of the spacer 135.

  When the temperature measuring element 330 having such a structure is bonded to the main surface of the substrate W, an adhesive is applied to the lower ends of the three spacers 335, and then the spacers 335 are pressed and bonded to the main surface of the substrate W. When the lower end of the spacer 335 comes into contact with the upper surface of the substrate W, the lower end portion of the crystal resonator 332 slightly protrudes from the lower end portion of the spacer 335, so that the leaf spring 336 is slightly bent and the crystal resonator 332 is moved to the main portion of the substrate W. It will press in the state made to contact the surface. That is, in the fourth embodiment, the leaf spring 336 functions as an elastic member that presses the crystal resonator 332 against the main surface of the substrate W.

  The remaining configuration of the fourth embodiment other than the structure of the temperature measuring element is the same as that of the first embodiment. The temperature measurement procedure for the substrate W is also the same as in the first embodiment. Even in the fourth embodiment, substantially the same effect as in the first embodiment can be obtained. In addition, the temperature measuring element 330 according to the fourth embodiment includes an open portion that exposes a part of a region that is covered when the temperature detecting element 330 is mounted on the substrate W. Specifically, an annular antenna holding portion 235 is attached to the upper portion, and the inside thereof is opened. Further, the interval between the three support plates of the lower leaf spring 336 and the interval between the three spacers 335 are also opened. For this reason, even when the processing liquid is supplied to the substrate W on which the plurality of temperature sensing elements 330 are mounted and liquid processing (for example, cleaning processing or etching processing) is performed, the processing liquid is transferred from the opening portion of the temperature sensing element 330 to the substrate. The main surface of W can be contacted, and it is possible to minimize the adhesion of the temperature measuring element 330 to inhibit the liquid treatment of the substrate W.

<5. Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described. In the first to fourth embodiments, the transmitting / receiving antenna 20 is provided above the moving substrate W, and only one temperature detecting element passes through the detection area of the transmitting / receiving antenna 20 at the same time. In the fifth embodiment, the transmission / reception antenna 120 is provided below the moving substrate W, and a plurality of temperature sensing elements pass through the detection area of the transmission / reception antenna 120 at the same time.

  FIG. 9 is a plan view of the substrate W being transferred according to the fifth embodiment as viewed from above. Similar to the first embodiment, the substrate W is linearly moved by a transfer roller (not shown in FIG. 9) as indicated by an arrow AR9. In addition, metal casings are provided above and below the transport path of the substrate W. In the fifth embodiment, an insulating block 122 is installed on the lower housing, and the transmission / reception antenna 120 is held by the block 122. The transmitting / receiving antenna 120 installed via the block 122 is provided at a distance of at least 10 mm from the lower housing.

  In the fifth embodiment, the transmitting / receiving antenna 120 is configured by arranging four coils in a line. The four coils constituting the transmitting / receiving antenna 120 are arranged along the horizontal direction (width direction of the substrate W) perpendicular to the transport direction of the substrate W. The four coils constituting the transmitting / receiving antenna 120 are connected to the transmitting / receiving unit 60 by wiring. On the other hand, a plurality of temperature measuring elements 30 are bonded to the upper surface of the substrate W to be processed. The configuration of the temperature measuring element 30 itself is the same as that of the first embodiment. In addition, it may replace with the temperature sensing element 30 of 1st Embodiment, and you may make it use the temperature sensing element of 2nd Embodiment-4th Embodiment.

  As shown in FIG. 9, in the fifth embodiment, a set of four temperature measuring elements 30 are attached to the upper surface of the substrate W. The four temperature measuring elements 30 constituting one set are attached in a line along the width direction of the substrate W at a predetermined interval. The arrangement interval of the four temperature sensing elements 30 attached in a line along the width direction of the substrate W is the same as the arrangement interval of the four coils constituting the transmission / reception antenna 120. Therefore, in the fifth embodiment, when the substrate W moves linearly, the four temperature sensing elements 30 pass through the detection area of the transmission / reception antenna 120 at the same time. In addition, it is preferable to select four points suitable for measuring the temperature distribution in the width direction as positions where the four temperature sensing elements 30 are bonded in the width direction of the substrate W. In the fifth embodiment, the natural frequencies of the crystal resonators 32 provided in the four temperature measuring elements 30 attached in a line along the width direction of the substrate W are different from each other.

  When the temperature of the substrate W is measured by the temperature measurement system of the fifth embodiment, the measurement is performed as follows. First, an operator sequentially attaches a plurality of temperature sensing elements 30 to a substrate W to be processed and a temperature measurement target. At this time, a set of four temperature measuring elements 30 each having a quartz resonator 32 having different natural frequencies are mounted in a line along the width direction of the substrate W. It is preferable to provide a predetermined regularity in the arrangement order of the set of four temperature measuring elements 30 in the substrate W width direction. For example, the quartz crystal element 32 having a small natural frequency is attached in order from the right end in the moving direction of the substrate W, and the temperature detecting element 30 is attached. For the convenience of the operator who performs such mounting work, it is preferable to mark the set of four temperature measuring elements 30 according to the natural frequency of the built-in crystal resonator 32. For example, the spacer 35 of the temperature measuring element 30 may be colored according to the natural frequency of the crystal resonator 32. Naturally, the colors applied to the set of four temperature measuring elements 30 are different.

  The substrate W on which the attachment of the plurality of temperature measuring elements 30 is completed is put into the processing line. The substrate W passes over the transmitting / receiving antenna 120 in the course of processing. At this time, the temperature of the substrate W is measured. More specifically, the substrate W that is linearly moved by the transfer roller sequentially passes above the transmission / reception antenna 120 from the tip. A plurality of temperature sensing elements 30 are mounted on the upper surface of the moving substrate W, and these temperature sensing elements 30 sequentially pass above the transmission / reception antenna 120. In the fifth embodiment, when the substrate W moves linearly, the four temperature sensing elements 30 pass through the detection area of the transmission / reception antenna 120 at the same time. When the four temperature sensing elements 30 pass through the detection area of the transmission / reception antenna 120, transmission / reception is performed between the transmission / reception antenna 120 and the four temperature sensing elements 30, and the four temperature sensing elements 30 are bonded. Measure the temperature of the substrate W at the site.

When the substrate W is linearly moved and the four temperature sensing elements 30 pass through the detection area of the transmission / reception antenna 120, the switch 61 is switched to the transmitter 62 side, and the transmission / reception antenna 120 is connected to the transmitter 62. The Subsequently, an electric signal having a frequency f ₁ corresponding to the natural frequency of one crystal resonator 32 among the four crystal resonators 32 of the four temperature sensing elements 30 passing through the detection area of the transmitting / receiving antenna 120 at the same time is transmitted. Call from device 62. As a result, the transmission wave having the frequency f ₁ is transmitted from the four coils constituting the transmission / reception antenna 120. The frequency of the electrical signal transmitted by the transmitter 62 (here, f ₁ ) is also transmitted from the transmitter 62 to the temperature calculation unit 69.

The electrical signal transmitted from the transmitter 62 is transmitted as transmission waves from the four coils constituting the transmission / reception antenna 120 to the four temperature sensing elements 30 passing through the detection area immediately above the transmission / reception antenna 120. As a result of transmitting the transmission wave having the frequency f ₁ from the four coils constituting the transmission / reception antenna 120, the transmission wave is received by the sensor antenna 34 of the temperature sensing element 30 and converted into an electrical signal, and the four passing through the detection area are transmitted. crystal oscillator 32 having a natural frequency corresponding to the frequency f ₁ of the crystal oscillator 32 having temperature detecting element 30 of resonates at a frequency f _1.

  Next, the transmission of the transmitter 62 is stopped, the transmission of the transmission wave is stopped, and the switch 61 is switched to the receiver 63 side. When the transmission of the transmission wave is stopped, the above-described resonated crystal resonator 32 oscillates at a frequency corresponding to the temperature of the substrate W (more precisely, the temperature at the position where the crystal resonator 32 is pressed). . Then, an electrical signal resulting from this damped vibration is transmitted from the crystal resonator 32. The electric signal transmitted from the crystal unit 32 is output as an electromagnetic wave from the sensor antenna 34 of the temperature sensing element 30, and the electromagnetic wave is received by the transmission / reception antenna 120. The receiver 63 receives the electrical signal transmitted from the crystal unit 32 via the sensor antenna 34 and the transmission / reception antenna 120.

Subsequently, the frequency counter 64 counts the frequency of the electrical signal from the crystal unit 32 received by the receiver 63 and transmits the count value to the temperature calculation unit 69. The temperature calculation unit 69 calculates the change rate of the transmission / reception frequency based on the frequency of the electrical signal counted by the frequency counter 64 and the frequency of the transmitted electrical signal transmitted from the transmitter 62, and detects the temperature from the change rate. The temperature of the substrate W at the position where the element 30 (the temperature measuring element 30 having the crystal resonator 32 resonated at the frequency f ₁ ) is mounted is calculated.

Next, the switch 61 is switched again to the transmitter 62 side, and the transmission / reception antenna 120 is connected to the transmitter 62. Then, the frequency f ₂ corresponding to the natural frequency of one of the quartz vibrators 32 different from the above among the quartz vibrators 32 of the four temperature sensing elements 30 passing through the detection area of the transmitting / receiving antenna 120 simultaneously. Is transmitted from the transmitter 62. As a result, the transmission wave having the frequency f ₂ is transmitted from the four coils constituting the transmission / reception antenna 120 to the four temperature sensing elements 30. As a result, a crystal oscillator 32 having a natural frequency corresponding to the frequency f ₂ of the crystal oscillator 32 to four temperature measuring elements 30 passing through the detection area has resonates at a frequency f _2. Subsequently, the transmission of the transmitter 62 is stopped, the transmission of the transmission wave is stopped, and the switch 61 is switched again to the receiver 63 side.

After the transmission of the transmission wave is stopped, the electromagnetic wave output from the sensor antenna 34 of the temperature sensing element 30 having the crystal resonator 32 resonated at the frequency f ₂ is received by the transmission / reception antenna 120 and transmitted to the receiver 63 as an electric signal. . The frequency counter 64 counts the frequency of the electrical signal and transmits the count value to the temperature calculation unit 69. The temperature calculation unit 69 calculates the change rate of the transmission / reception frequency based on the frequency of the electrical signal counted by the frequency counter 64 and the frequency of the transmitted electrical signal transmitted from the transmitter 62, and detects the temperature from the change rate. The temperature of the substrate W at the position where the element 30 (the temperature measuring element 30 having the crystal resonator 32 resonated at the frequency f ₂ ) is bonded is calculated.

Thereafter, the same procedure is repeated, and the temperature of the substrate W at the position where each of the four temperature sensing elements 30 passing through the detection area of the transmitting / receiving antenna 120 is mounted is sequentially measured. That is, the frequencies (f ₁ , f ₂ , f ₃ , f ₄ ) corresponding to the respective natural frequencies of the crystal resonators 32 included in the four temperature sensing elements 30 passing through the detection area of the transmitting / receiving antenna 120 simultaneously. Are sequentially transmitted from the transmission / reception antenna 120 to the four temperature measuring elements 30 to resonate the crystal resonator 32 having the natural frequency corresponding to the frequency. Then, the transmission / reception antenna 120 receives the electromagnetic wave output from the temperature sensing element 30 having the quartz crystal resonator 32 that has resonated after the transmission of the transmission wave is stopped, and based on the frequency of the received electromagnetic wave and the frequency of the transmission wave. Temperature measurement is performed at four locations along the width direction of the substrate W (locations where the temperature sensing element 30 is mounted). As a result, it is possible to individually calculate the temperature of the substrate W at the position where the four temperature sensing elements 30 that are simultaneously passing through the detection area of the transmission / reception antenna 120 are mounted.

  As described in the first embodiment, the time interval from when the transmission / reception antenna 20 starts transmission of the transmission wave to reception of the electromagnetic wave generated by the transmission of the crystal resonator 32 is an extremely short time of about 10 milliseconds. Therefore, even if the substrate W is moved linearly, four temperature sensing elements 30 are individually transmitted to and received from each temperature sensing element 30 while passing through the detection area of the transmission / reception antenna 120 to complete temperature measurement at four locations. Is possible.

  Even in the above manner, the temperature of the substrate W can be measured accurately and in real time while moving the substrate W to be processed, and the same effect as in the first embodiment can be obtained.

<6. Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described. In the sixth embodiment, the substrate W to be processed is a disk-shaped silicon semiconductor wafer. FIG. 10 is a diagram schematically illustrating a configuration of an apparatus for processing the substrate W according to the sixth embodiment. This apparatus includes a spin chuck 401, a rotation drive unit 402, a processing cup 403, and a processing liquid nozzle 410 inside a housing 400.

  The spin chuck 401 holds the central portion of the lower surface of the substrate W by suction. The rotation driving unit 402 including a motor rotates the substrate W held by the spin chuck 401 around the central axis along the vertical direction as indicated by an arrow AR10. The processing liquid nozzle 410 supplies a processing liquid to the upper surface of the substrate W held on the spin chuck 401. The processing cup 403 collects the processing liquid shaken off by the centrifugal force from the rotating substrate W. The “treatment liquid” includes both pure water and chemicals.

  A transmission / reception antenna 420 is provided on the ceiling of the housing 400. The casing 400 itself may be made of metal, but the vicinity of the transmission / reception antenna 420 is formed of an insulating material (for example, resin or ceramics). The transmission / reception antenna 420 is connected to the transmission / reception unit 60 (see FIG. 5). This transmission / reception antenna 420 extends long in the direction of the broken line with respect to the rotation direction of the substrate W, that is, in the radial direction, and its detection area is the entire surface of the substrate W held by the spin chuck 401.

  A plurality of temperature measuring elements 30 are bonded to the upper surface of the substrate W to be processed. The configuration of the temperature measuring element 30 itself is the same as that of the first embodiment. In the sixth embodiment, three temperature sensing elements 30 are attached to the upper surface of the substrate W. Specifically, the temperature measuring elements 30 are mounted at three locations, the center position, the edge position, and the intermediate position of the circular substrate W. In the sixth embodiment, since the entire surface of the substrate W held by the spin chuck 401 is a detection area of the transmission / reception antenna 420, the three temperature sensing elements 30 are always provided even when the substrate W is rotated by the rotation drive unit 402. It is located in the detection area of the transmission / reception antenna 420. In the sixth embodiment, the natural frequencies of the crystal resonators 32 provided in the three temperature measuring elements 30 attached to the upper surface of the substrate W are different from each other. Note that the temperature sensing element of the second to fourth embodiments may be used in place of the temperature sensing element 30 similar to that of the first embodiment. In particular, in the sixth embodiment in which the processing liquid is supplied to the substrate W, It is preferable to use the temperature measuring element 330 of the fourth embodiment.

  When the temperature of the substrate W is measured by the temperature measurement system of the sixth embodiment, the measurement is performed as follows. First, an operator sequentially attaches a plurality of temperature sensing elements 30 to a substrate W to be processed and a temperature measurement target. At this time, the three temperature measuring elements 30 including the crystal resonators 32 having different natural frequencies are mounted at the center position, the edge position, and the intermediate position of the substrate W.

  The substrate W on which the plurality of temperature measuring elements 30 have been attached is put into the apparatus of FIG. 10 and held by the spin chuck 401. Then, the processing liquid nozzle 420 supplies the processing liquid to the upper surface of the substrate W while the rotation driving unit 402 rotates the substrate W around the central axis along the vertical direction, and the processing proceeds. In the sixth embodiment, the temperature of the substrate W that is being processed by the processing liquid while being rotationally moved by the rotation driving unit 402 is measured. More specifically, in the sixth embodiment, the three temperature sensing elements 30 are always located within the detection area of the transmission / reception antenna 420 even when the substrate W is rotated by the rotation drive unit 402. The temperature of the substrate W during the liquid processing is measured by performing transmission / reception between the three temperature sensing elements 30 mounted on the substrate W being processed by the processing liquid while being rotated and the transmission / reception antenna 420.

The mode of transmission / reception between the three temperature sensing elements 30 and the transmission / reception antenna 420 at this time is substantially the same as described in the fifth embodiment. That is, the frequencies (f ₁ , f ₂₎ corresponding to the respective natural frequencies of the crystal resonators 32 included in the three temperature sensing elements 30 mounted on the substrate W that is being rotated and processed by the processing liquid. , F ₃ ) are sequentially transmitted from the transmitting / receiving antenna 420 to the three temperature sensing elements 30 to resonate the crystal resonator 32 having the natural frequency corresponding to the frequency. Then, the transmission / reception antenna 420 receives the electromagnetic wave output from the temperature sensing element 30 having the crystal resonator 32 that has resonated after stopping the transmission of the transmission wave, and based on the frequency of the received electromagnetic wave and the frequency of the transmission wave. Temperature measurement is performed at three locations on the substrate W (location where the temperature sensing element 30 is bonded). As a result, the temperature of the substrate W being processed while being moved can be measured accurately and in real time.

<7. Modification>
While the embodiments of the present invention have been described above, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention. For example, in the first to fifth embodiments, the temperature of the substrate W that is being processed while being moved is measured, but the temperature of the substrate W that is moving on the transport path is measured. You may do it. As the predetermined treatment, for example, heat treatment on a metal bake plate or liquid treatment by supplying a treatment liquid can be performed. According to the temperature measurement system of the present invention, the temperature of the substrate W being processed can be measured accurately and in real time.

  In the first to fifth embodiments, the transmission / reception antennas 20 (or 120) may be installed at a plurality of locations, and a series of temperature histories of the substrate W transported through the processing line may be measured.

  Further, in the first to fifth embodiments, the substrate W is transported by the transport roller 12, but the moving means for the substrate W is not limited to this. For example, the substrate W may be moved by a transfer robot having a transfer arm, or may be moved by a shuttle mechanism that reciprocates between two points.

  In the first to fourth embodiments, the transmitting / receiving antenna 20 is provided above the moving substrate W. However, the transmitting / receiving antenna 20 may be provided below the substrate W. Conversely, in the fifth embodiment, the transmitting / receiving antenna 120 may be provided above the moving substrate W.

  In the first to fourth embodiments, the transmission / reception antenna 120 configured by arranging a plurality of coils in a line as in the fifth embodiment may be applied. Conversely, in the fifth embodiment, the transmission / reception antenna 20 configured as a loop antenna as in the first embodiment may be applied.

  Further, in the first to fourth embodiments, the direction in which the transmission / reception antenna 20 extends long intersecting with the moving direction of the substrate W is provided along the horizontal direction perpendicular to the substrate transport direction. The intersection with the moving direction of the substrate W is not necessarily limited to a vertical direction, and may be another angle.

  In addition, when mounting a plurality of temperature sensing elements 30 in a grid pattern on the substrate W, the angle is selected so that the temperature sensing elements 30 and the direction in which the transmission / reception antenna 20 extends are selected, and the transmission / reception antenna 20 is installed. Thus, the plurality of temperature sensing elements 30 can be prevented from passing through the detection area of the transmitting / receiving antenna 20 at the same time, and the natural frequency of the crystal resonator 32 is not necessarily different as in the fifth embodiment. It is possible to measure the temperature of a plurality of grid-like locations on the substrate W. In other words, on the substrate W, a plurality of temperature sensing elements 30 mounted in the moving direction of the substrate W and mounted in a direction perpendicular to the moving direction of the substrate can be used to measure the temperature. The measurement with the temperature sensor 30 mounted in such a grid pattern can grasp the temperature distribution of the substrate W being processed, that is, the in-plane distribution of the temperature, and thus the uniformity of the process in the heat-dependent process. This is extremely useful in knowing the state of the substrate W being processed.

  In the first, second, and fourth embodiments, the height of the spacers 35, 135, and 335 is 10 mm. However, the height of the spacer may be 10 mm or more. What is necessary is just to hold | maintain the connected sensor antenna at least 10 mm away from the upper surface of the board | substrate W. FIG.

  In the first to fifth embodiments, four temperature sensing elements 30 are attached in the width direction of the substrate W. However, the number of temperature sensing elements 30 attached in the width direction is arbitrary depending on the size of the substrate W. Can be. However, when a plurality of temperature sensing elements 30 attached in a line along the width direction of the substrate W pass through the detection area of the transmission / reception antenna 120 at the same time as in the fifth embodiment, they pass at the same time. The natural frequency of the crystal resonator 32 provided in the temperature measuring element 30 needs to be different from each other. Further, it is necessary to transmit transmission waves having different frequencies to each of the plurality of temperature sensing elements 30 passing through the transmitting / receiving antenna 120 at the same time.

  In the fifth embodiment, a plurality of temperature sensing elements 30 that pass through the detection area of the transmission / reception antenna 120 at the same time are marked with a color corresponding to the frequency to which each temperature sensing element 30 corresponds. However, the marking method is not limited to coloring, and other methods that can identify the temperature measuring element 30 can also be adopted. For example, a plurality of temperature sensing elements 30 that pass through the detection area of the transmission / reception antenna 120 at the same time may be marked with identification symbols or numbers, and marked according to the corresponding frequency. By attaching markings corresponding to the frequencies corresponding to the plurality of temperature sensing elements 30 that pass through the detection area of the transmission / reception antenna 120 at the same time, it is possible to improve the workability of bonding the temperature sensing elements 30 to the substrate W.

  Further, the substrate W to be processed by the temperature measurement system according to the present invention is not limited to a glass substrate or a semiconductor wafer, and may be a silicon substrate for manufacturing a solar cell.

11a, 11b Case 12 Transport roller 20, 120, 420 Transmit / receive antenna 30, 130, 230, 330 Temperature sensing element 32, 232, 332 Quartz crystal 34, 236, 334 Sensor antenna 35, 135, 335 Spacer 36, 336 Leaf spring 60 Transmission / Reception Unit 61 Switch 62 Transmitter 63 Receiver 64 Frequency Counter 69 Temperature Calculation Unit 136 Coil Spring 231 Sensor Holding Unit 235,337 Antenna Holding Unit 401 Spin Chuck 402 Rotation Drive Unit 403 Processing Cup 410 Processing Liquid Nozzle W Substrate

Claims (10)

A temperature measurement system that measures the temperature of multiple locations on a moving substrate,
A temperature sensing element that is mounted on the substrate along the moving direction of the substrate and includes a crystal resonator and a sensor antenna connected to the crystal resonator;
A transmitting / receiving antenna that is provided on one side of the moving substrate, extends long in a direction crossing the moving direction of the substrate, and transmits and receives wirelessly with a sensor antenna of a temperature sensing element mounted on the substrate;
Transmitting and receiving means for transmitting a transmission wave to the temperature sensing element via the transmission / reception antenna and receiving an electromagnetic wave emitted from the temperature sensing element after stopping transmission of the transmission wave via the transmission / reception antenna;
Temperature calculating means for calculating the temperature of the substrate based on the frequency of the electromagnetic wave from the temperature measuring element received by the transmitting / receiving means;
A temperature measurement system comprising: The temperature measurement system according to claim 1,
The temperature measuring system further includes a spacer that has a lower surface detachably attached to a substrate, and an upper surface that holds the sensor antenna at a predetermined distance from the substrate surface. The temperature measurement system according to claim 2,
The temperature measuring element is
One end is held by the spacer, the other end is held by a crystal resonator, and an elastic member that urges the crystal resonator to press against the substrate;
Wiring for electrically connecting the crystal unit and the sensor antenna;
The temperature measurement system further comprising: The temperature measurement system according to claim 3, wherein
The temperature measuring system includes an open part that exposes a part of a region to be covered when mounted on a substrate. The temperature measurement system according to any one of claims 1 to 4,
A plurality of temperature sensing elements are mounted on the substrate at intervals so that only one temperature sensing element passes through the detection area of the transmitting / receiving means at the same time,
The temperature measuring system, wherein the transmission / reception means transmits a transmission wave having the same frequency to all temperature detecting elements mounted on the substrate. The temperature measurement system according to any one of claims 1 to 4,
A plurality of temperature sensing elements are mounted on the substrate so that a plurality of temperature sensing elements pass through the detection area of the transmitting / receiving means at the same time,
The temperature transmitter / receiver transmits a transmission wave having a different frequency to each of a plurality of temperature detectors that pass through the detection area at the same time. The temperature measurement system according to claim 6, wherein
A temperature measurement system, wherein markings according to frequencies corresponding to a plurality of temperature sensing elements passing through the detection area at the same time are attached. The temperature measurement system according to any one of claims 1 to 7,
The temperature calculation system is characterized in that the temperature calculation means calculates the temperature of a substrate that is being moved and subjected to predetermined processing. The temperature measurement system according to any one of claims 1 to 8,
A temperature measurement system characterized by measuring temperatures at a plurality of locations on a substrate moved linearly. The temperature measurement system according to any one of claims 1 to 8,
A temperature measuring system for measuring temperatures at a plurality of locations on a substrate that is rotated and moved.

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