JP2011119402A - Light source unit - Google Patents

Light source unit Download PDF

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Publication number
JP2011119402A
JP2011119402A JP2009274701A JP2009274701A JP2011119402A JP 2011119402 A JP2011119402 A JP 2011119402A JP 2009274701 A JP2009274701 A JP 2009274701A JP 2009274701 A JP2009274701 A JP 2009274701A JP 2011119402 A JP2011119402 A JP 2011119402A
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Prior art keywords
resin
led element
light
light source
fluorescent material
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Inventor
Morinari Machida
謹斎 町田
Takehisa Takeuchi
剛久 竹内
Eijiro Shimoyama
栄治郎 下山
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Fuji Electric FA Components and Systems Co Ltd
Chichibu Fuji Co Ltd
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Fuji Electric FA Components and Systems Co Ltd
Chichibu Fuji Co Ltd
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Priority to JP2009274701A priority Critical patent/JP2011119402A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source of white light of high uniformity by eliminating the unevenness of the emission color of a light source unit that subjects the emission light of an LED element to wavelength conversion using a fluorescent material to generate white light. <P>SOLUTION: The light source unit includes a cup-shaped resin case integrally holding a metal base and a metal lead by insert molding, and an LED element stuck on the metal base inside the resin case, an electrode of the LED element being connected to the metal lead by a connection wire inside the resin case, the LED element being sealed by a sealing resin layer formed by packing a transparent sealing resin to which a fluorescent material converting excitation light into visible light having a different wavelength from the wavelength of the excitation light is added. The resin sealing layer is separated into two upper and lower layers. Each of the layers separated is made of the transparent sealing resin to which the fluorescent material is added. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、発光源に発光ダイオード(以下LEDという)を使用し、これを樹脂でモールドして封止した光源ユニットに関する。   The present invention relates to a light source unit in which a light emitting diode (hereinafter referred to as LED) is used as a light emitting source, which is molded and sealed with a resin.

LED素子を樹脂でモールドして構成した光源ユニットとして、特許文献1に示されるように、LED素子を封止する樹脂中にLED素子の発光光により励起されて励起光の波長とは異なる波長の可視光に変換する蛍光材料を添加したものが知られている。   As a light source unit configured by molding an LED element with a resin, as shown in Patent Document 1, it is excited by light emitted from the LED element in a resin that seals the LED element and has a wavelength different from the wavelength of the excitation light. A material to which a fluorescent material that converts visible light is added is known.

図3に、この種の従来の光源ユニット20の構成を示す。21はLED素子、22はリードフレームで構成された金属ベース、23および24は、同様にリードフレームで構成された金属リードである。25は、リードフレームに結合された状態で金属ベース22および金属リード23、24を樹脂によりインサート成形して形成したカップ状の樹脂ケースである。この樹脂ケース25内の金属ベース22の露出面上にLED素子21を固着し、LED素子21の2つの表面電極(図示せず)と金属リード23,24とに金線等からなる接続線26をワイヤーボンディング法により接続する。その後、樹脂ケース25のLED素子21の納められた空所内に蛍光材料27の添加された透明の封止樹脂を充填して形成した樹脂封止層28によりLED素子21を封止することにより光源ユニット20が形成される。1つのリードフレーム上には複数の光源ユニットが形成されるが、リードフレームのステーから切断して個々に分離される。   FIG. 3 shows the configuration of a conventional light source unit 20 of this type. 21 is an LED element, 22 is a metal base composed of a lead frame, and 23 and 24 are metal leads similarly composed of a lead frame. Reference numeral 25 denotes a cup-shaped resin case formed by insert-molding the metal base 22 and the metal leads 23 and 24 with resin while being coupled to the lead frame. The LED element 21 is fixed on the exposed surface of the metal base 22 in the resin case 25, and the connection line 26 made of a gold wire or the like is connected to the two surface electrodes (not shown) of the LED element 21 and the metal leads 23 and 24. Are connected by wire bonding. Thereafter, the LED element 21 is sealed with a resin sealing layer 28 formed by filling a transparent sealing resin to which a fluorescent material 27 is added into a space in which the LED element 21 of the resin case 25 is housed, thereby providing a light source. A unit 20 is formed. A plurality of light source units are formed on one lead frame, but are separated from each other by cutting from the lead frame stay.

このような光源ユニット20は、金属リード23、24間に、直流の電圧を加えることにより、LED素子21が発光し、このLED光により、封止樹脂層28中に添加された蛍光材料27が励起されてLED光とは異なる波長の可視光に変換して白色光を発生する。   In such a light source unit 20, when a DC voltage is applied between the metal leads 23 and 24, the LED element 21 emits light, and the fluorescent material 27 added in the sealing resin layer 28 is emitted by the LED light. When excited, it is converted into visible light having a wavelength different from that of the LED light to generate white light.

ところで、このような波長変換により白色発光を行うようにした光源ユニット20において、樹脂封止層28を熱硬化性樹脂で構成した場合、樹脂ケース25に充填された封止樹脂を加熱して硬化する過程で、封止樹脂が一時的に流動化して液状化する。封止樹脂がこのように液状化することにより封止樹脂に添加された蛍光材料27は、樹脂に対して比重が重いため、封止樹脂中で沈降し、ほとんどが樹脂ケース5の空所の底部に堆積して層をなす。この結果、封止樹脂が硬化して形成された樹脂封止層28中の蛍光材料27は、ほとんどが図3に示すように樹脂封止層28の底部に偏在した層となる。   By the way, in the light source unit 20 configured to emit white light by such wavelength conversion, when the resin sealing layer 28 is made of a thermosetting resin, the sealing resin filled in the resin case 25 is heated and cured. In the process, the sealing resin is temporarily fluidized and liquefied. Since the specific gravity of the fluorescent material 27 added to the sealing resin due to the liquefaction of the sealing resin is heavy with respect to the resin, the fluorescent material 27 settles in the sealing resin, and most of them are in the voids of the resin case 5. Deposit on bottom and layer. As a result, most of the fluorescent material 27 in the resin sealing layer 28 formed by curing the sealing resin is a layer unevenly distributed at the bottom of the resin sealing layer 28 as shown in FIG.

このように、蛍光材料27が樹脂封止層28の底部に偏在するようになるとLED素子21の主に周囲側面からの発光光が蛍光材料27へ当たらないで直接外部へ放射されるようになるため、LED素子21による蛍光材料の励起効率が低下するとともに、発光色に色むらが生じ、均一な白色光を得ることができないという不都合が生じる。   As described above, when the fluorescent material 27 is unevenly distributed at the bottom of the resin sealing layer 28, the emitted light mainly from the peripheral side surface of the LED element 21 does not hit the fluorescent material 27 and is directly emitted to the outside. For this reason, the excitation efficiency of the fluorescent material by the LED element 21 is lowered, the color of the emitted color is uneven, and uniform white light cannot be obtained.

このような光源ユニットの発光色の色むらの発生を解消するために、特許文献2では、図4に示すように、LED素子21を封止する樹脂封止層28を、第1樹脂封止層28aと第2樹脂封止層28bとに区分して2段構成にした光源ユニット30が提案されている。   In order to eliminate the occurrence of the uneven color of the light emission color of the light source unit, in Patent Document 2, as shown in FIG. 4, a resin sealing layer 28 for sealing the LED element 21 is formed by the first resin sealing. A light source unit 30 that is divided into a layer 28a and a second resin sealing layer 28b and has a two-stage structure has been proposed.

LED素子21を直接覆う下段の第1樹脂封止層28aは、蛍光材料の添加されてない透明な封止樹脂のみを充填して形成され、上段の樹脂封止層28bは、第1樹脂封止層28aの封止樹脂が硬化した後に、その上から、蛍光材料27bの添加された透明な封止樹脂を充填して形成される。   The lower first resin sealing layer 28a directly covering the LED element 21 is formed by filling only a transparent sealing resin to which no fluorescent material is added, and the upper resin sealing layer 28b is formed by filling the first resin sealing layer 28b. After the sealing resin of the stop layer 28a is cured, the transparent sealing resin to which the fluorescent material 27b is added is filled from above.

このような構成の光源ユニット30によれば、樹脂封止層28の封止樹脂を加熱硬化する過程で、樹脂中に添加された蛍光材料27bが沈降しても、樹脂封止層28の第1樹脂封止層28aの下段の第1樹脂封止層28aとの境界付近の底部にとどまるので、図4に示すように、蛍光材料27bがLED素子21の上面より上方の樹脂封止層28の中間部付近に堆積して層をなすようになる。   According to the light source unit 30 having such a configuration, even when the fluorescent material 27b added to the resin settles during the process of heat-curing the sealing resin of the resin sealing layer 28, Since the resin stays at the bottom near the boundary with the first resin sealing layer 28a at the lower stage of the one resin sealing layer 28a, the fluorescent material 27b is above the upper surface of the LED element 21 as shown in FIG. It is deposited near the middle part of the film and forms a layer.

このため、この光源ユニット30は、蛍光材料27bの層がLED素子21の上面より上方の位置に存在ることにより、LED素子21の発光光のほとんどが蛍光材料27bに当たるようになり、LED素子21による蛍光材料の励起効率が増大し、蛍光材料7による発光光の波長変換効率が高まり、図3に示す従来の光源ユニット20より発光色の色むらの発生が抑制され、白色光の均一性を高めることができる。   For this reason, in the light source unit 30, since the layer of the fluorescent material 27 b exists at a position above the upper surface of the LED element 21, most of the emitted light from the LED element 21 comes into contact with the fluorescent material 27 b. The excitation efficiency of the fluorescent material is increased, the wavelength conversion efficiency of the emitted light by the fluorescent material 7 is increased, the occurrence of uneven color of the emitted color is suppressed from the conventional light source unit 20 shown in FIG. Can be increased.

特許第2900928号公報Japanese Patent No. 2900928 特開2000‐077723号公報JP 2000-077723 A

しかしながら発光色の色むら発生が改善された図4に示す従来の光源ユニット30においても、次のような不都合がある。   However, the conventional light source unit 30 shown in FIG. 4 in which the occurrence of uneven color of the emission color is improved also has the following disadvantages.

すなわち、光源ユニット30のLED素子21の上面電極(図示せず)上に、LED素子21へ電流を供給するために一端の接続された接続線26が他端を金属リード23、24上に接続されるとき、中間部が弧状に湾曲される。このような接続線26の湾曲部の頂部が樹脂封止層28の第1樹脂封止層28aの上面から突出することがある。このような場合、第1樹脂封止層28aが加熱硬化過程で液状化したとき、樹脂の表面張力により接続線26に沿って頂部付近まで這い上がるため、第1樹脂封止層28aの上面を平坦面とすることができない。第1樹脂封止層28aの接続線26に沿って這い上がった部分と接する第2樹脂封止層28bの底部に隆起する部分が生じ、この隆起部分には、樹脂中に添加された蛍光材料7が堆積され難くなり、蛍光材料27bが分布しないか、分布しても希な分布となり、この部分でのLED素子1の発光光の波長変換効率が低下する。この結果、LED素子21に接続された接続線26の湾曲部、すなわち光源ユニット30の中心部において発光色にむらが生じ、均一な白色光とすることができないのである。   That is, on the upper surface electrode (not shown) of the LED element 21 of the light source unit 30, a connection line 26 having one end connected to supply current to the LED element 21 connects the other end to the metal leads 23 and 24. When being done, the middle part is curved in an arc. The top of the curved portion of the connection line 26 may protrude from the upper surface of the first resin sealing layer 28 a of the resin sealing layer 28. In such a case, when the first resin sealing layer 28a is liquefied during the heat curing process, the first resin sealing layer 28a rises to the vicinity of the top along the connection line 26 due to the surface tension of the resin. It cannot be a flat surface. A raised portion is formed at the bottom of the second resin sealing layer 28b in contact with the portion crawled up along the connection line 26 of the first resin sealing layer 28a, and the fluorescent material added in the resin is formed in the raised portion. 7 is difficult to deposit, and the fluorescent material 27b is not distributed or distributed even if it is distributed, and the wavelength conversion efficiency of the emitted light of the LED element 1 in this portion is lowered. As a result, the emission color is uneven at the curved portion of the connection line 26 connected to the LED element 21, that is, the central portion of the light source unit 30, and uniform white light cannot be obtained.

この発明は、このような不都合を解消して、より均一な白色光を発生する光源ユニットを提供することを課題とするものである。   An object of the present invention is to provide a light source unit that eliminates such disadvantages and generates more uniform white light.

この発明は、このような課題を解決するために、金属ベースおよび金属リードをインサート成形により一体的に保持するカップ状の樹脂ケースを備え、この樹脂ケース内の前記金属ベース上にLED素子を固着し、この樹脂ケース内において前記LED素子の電極と前記金属リードとを接続線により接続するとともに、励起する光をこの光の波長とは異なる波長の可視光に変換する蛍光材料を添加した透明な封止樹脂を充填して形成した樹脂封止層により前記LED素子を封止してなる光源ユニットおいて、前記樹脂封止層を上下2層に区分して構成し、前記区分した各層を前記蛍光材料の添加された透明の封止樹脂で形成することを特徴とするものである。   In order to solve such problems, the present invention includes a cup-shaped resin case that integrally holds a metal base and a metal lead by insert molding, and an LED element is fixed on the metal base in the resin case. In the resin case, the electrode of the LED element and the metal lead are connected by a connecting line, and a transparent material to which a fluorescent material that converts the excitation light into visible light having a wavelength different from the wavelength of the light is added. In the light source unit formed by sealing the LED element with a resin sealing layer formed by filling a sealing resin, the resin sealing layer is divided into two upper and lower layers, and each of the divided layers is It is formed by a transparent sealing resin to which a fluorescent material is added.

この発明においては、前記カップ状の樹脂ケースの内周面ならびに金属ベースおよび金属リードの露出面に光の反射面を形成するのがよい。また、前記金属ベースおよび金属リードはリードフレームで構成することができる。   In the present invention, a light reflecting surface is preferably formed on the inner peripheral surface of the cup-shaped resin case and on the exposed surfaces of the metal base and the metal lead. Further, the metal base and the metal lead can be constituted by a lead frame.

この発明は、光源ユニットのLED素子を封止する樹脂封止層を蛍光材料を添加した透明樹脂で形成する場合に、樹脂封止層を上下2層に区分して構成し、区分した各層をそれぞれ蛍光材料を添加した透明樹脂で形成することにより、樹脂封止層の区分された2層にともに蛍光材料の分散層が形成され、各層の蛍光材料が相互に補完しあって、全体において蛍光材料の波長変換が効果的に行われるようになるため、色むらの発生が抑制され、均一性の高い白色光を発生することが可能となる。   In the present invention, when the resin sealing layer for sealing the LED element of the light source unit is formed of a transparent resin to which a fluorescent material is added, the resin sealing layer is divided into two upper and lower layers. By forming each with a transparent resin to which a fluorescent material is added, a dispersed layer of the fluorescent material is formed on each of the two separated layers of the resin sealing layer, and the fluorescent materials of each layer complement each other, so that the entire fluorescent layer is fluorescent. Since the wavelength conversion of the material is effectively performed, the occurrence of color unevenness is suppressed and white light with high uniformity can be generated.

照光式押しボタンスイッチ等に組み込まれる表示灯の光源に適用したこの発明の光源ユニットの実施例の構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the Example of the light source unit of this invention applied to the light source of the indicator lamp integrated in an illumination type pushbutton switch etc. 図1に示す表示灯の光源ユニットの部分を拡大して示す縦断面図である。It is a longitudinal cross-sectional view which expands and shows the part of the light source unit of the indicator lamp shown in FIG. 従来の光源ユニットの構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the conventional light source unit. 従来の改良された光源ユニットの構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the conventional improved light source unit.

以下にこの発明を図に示す実施例について説明する。   Embodiments of the present invention shown in the drawings will be described below.

図1は、照光式押しボタンスイッチ等に組み込まれる表示灯の光源に適用したこの発明の光源ユニットの実施例の構成を示す縦断面図、図2は、この表示灯の光源ユニットの部分を拡大して示す縦断面図である。   FIG. 1 is a longitudinal sectional view showing a configuration of an embodiment of a light source unit of the present invention applied to a light source of an indicator lamp incorporated in an illuminated push button switch or the like, and FIG. 2 is an enlarged view of the light source unit portion of the indicator lamp. It is a longitudinal cross-sectional view shown.

図1および図2において、50は表示灯、10はこの表示灯50に組み込まれた光源ユニットである。光源ユニット10を保持する表示灯50のホルダ51には、外部接続端子52、53が設けられ、電流制限抵抗54、55を介して光源ユニットの金属リード13、14に接続される。   In FIGS. 1 and 2, reference numeral 50 denotes an indicator lamp, and 10 denotes a light source unit incorporated in the indicator lamp 50. The holder 51 of the indicator lamp 50 that holds the light source unit 10 is provided with external connection terminals 52 and 53, and is connected to the metal leads 13 and 14 of the light source unit via current limiting resistors 54 and 55.

光源ユニット10は、金属ベース12および金属リード13、14をインサート成形により一体構成したカップ状の樹脂ベース15を備え、この樹脂ベース15の空所内の金属ベース12の露出面上にLED素子11を固着する。LED素子11の表面電極(図示せず)上に金線等からなる接続線16の一端を接合し、この接続線16の中間部を弧状に湾曲させながら他端を金属リード13、14の樹脂ベース15から露出した面に接合することによりLED素子11の電極と金属リード13、14とを接続する。これにより、LED素子11の電極が電流制限抵抗54、55を介して外部接続端子52.53に接続される。   The light source unit 10 includes a cup-shaped resin base 15 in which a metal base 12 and metal leads 13 and 14 are integrally formed by insert molding, and the LED element 11 is placed on the exposed surface of the metal base 12 in the space of the resin base 15. Stick. One end of a connection line 16 made of a gold wire or the like is joined to a surface electrode (not shown) of the LED element 11, and the other end is made of resin of the metal leads 13 and 14 while curving an intermediate portion of the connection line 16 in an arc shape. The electrodes of the LED element 11 and the metal leads 13 and 14 are connected by bonding to the surface exposed from the base 15. As a result, the electrode of the LED element 11 is connected to the external connection terminal 52.53 via the current limiting resistors 54 and 55.

LED素子11の収められたカップ状の樹脂ベース15の空所内に、励起光をその波長と異なる波長の可視光に変換する蛍光材料17の添加された透明の封止樹脂を充填することによりLED素子11を密封する樹脂封止層18を形成する。封止樹脂としては例えばエポキシ樹脂のような熱硬化性の透明樹脂を用いる。   By filling the empty space of the cup-shaped resin base 15 containing the LED element 11 with a transparent sealing resin to which a fluorescent material 17 that converts excitation light into visible light having a wavelength different from the excitation light is added, the LED A resin sealing layer 18 for sealing the element 11 is formed. As the sealing resin, for example, a thermosetting transparent resin such as an epoxy resin is used.

樹脂封止層18は、上下2層に区分された第1樹脂封止層18aおよび第2樹脂封止層18bにより構成される。この2層の樹脂封止層18は、蛍光材料の添加された透明の封止樹脂を2回に分けて充填することにより形成することができる。   The resin sealing layer 18 includes a first resin sealing layer 18a and a second resin sealing layer 18b that are divided into two upper and lower layers. The two resin sealing layers 18 can be formed by filling the transparent sealing resin to which the fluorescent material is added in two portions.

すなわち、最初に樹脂ベース15のLED素子11の収められた空所内に蛍光材料17aの添加された透明の封止樹脂を空所のほぼ半分の深さまで充填し、これを加熱硬化して第1樹脂封止層18aを形成する。そして次に、樹脂ベース15のLED素子11の収められた空所内にこの第1樹脂封止層18aの上から残りの空所一杯に蛍光材料17bの添加された透明の封止樹脂を充填し、これを加熱硬化することにより第2樹脂封止層18bを形成する。第1樹脂封止層18a、第2樹脂封止層18bを構成する封止樹脂および蛍光材料は必ずしも同じ材料にする必要はなく、異なる材料であってもよい。   That is, first, a transparent sealing resin to which the fluorescent material 17a is added is filled in a space in which the LED element 11 of the resin base 15 is accommodated to a half depth of the space, and this is heated and cured to be first. A resin sealing layer 18a is formed. Then, the space where the LED element 11 of the resin base 15 is accommodated is filled with the transparent sealing resin to which the fluorescent material 17b is added from above the first resin sealing layer 18a to the remaining space. The second resin sealing layer 18b is formed by heat curing. The sealing resin and the fluorescent material constituting the first resin sealing layer 18a and the second resin sealing layer 18b are not necessarily the same material, and may be different materials.

こうして完成した光源ユニット10における樹脂封止層18内の2層に区分された第1樹脂封止層18aおよび第2樹脂封止層18bには、図2に示すようにそれぞれの層の底部に蛍光材料17a、17bの堆積して蛍光材料層が形成される。このように第1および第2の樹脂封止層18a、18bの底部に蛍光材料層が形成されるのは、樹脂封止層を形成する透明の封止樹脂全体に分散して添加されていた蛍光材料が、熱硬化性の封止樹脂の加熱硬化過程で、一時的に封止樹脂が流動化して液状となったとき、蛍光材料の比重が樹脂より重いことにより沈降して堆積するためである。   As shown in FIG. 2, the first resin sealing layer 18a and the second resin sealing layer 18b divided into two layers in the resin sealing layer 18 in the light source unit 10 thus completed are provided at the bottom of each layer as shown in FIG. The fluorescent materials 17a and 17b are deposited to form a fluorescent material layer. In this way, the fluorescent material layer is formed at the bottom of the first and second resin sealing layers 18a and 18b, which is dispersed and added to the entire transparent sealing resin forming the resin sealing layer. This is because the fluorescent material settles and deposits due to the specific gravity of the fluorescent material being heavier than that of the resin when the sealing resin is temporarily fluidized and becomes liquid during the heat curing process of the thermosetting sealing resin. is there.

第1樹脂封止層18aにおいては、その底部とLED素子11の表面に堆積した蛍光材料17aが蛍光材料層を形成する。第2樹脂封止層18bでは、第1樹脂封止層18aと第2樹脂封止層18bとの境界部となる第2樹脂封止層18bの底部に堆積した蛍光材料17bが蛍光材料層を形成する。第1樹脂封止層18aの接続線6の突出する部分では、封止樹脂の表面張力により接続線16に沿って引き上げられるため、上面が隆起するようになる。このため第2樹脂封止層18bの第1樹脂封止層18aの上面と接する底面も接続線16の侵入する部分で隆起する。この第2樹脂封止層18bの隆起部分では蛍光材料の堆積がほとんどないか、堆積しても僅かで、蛍光材料の分布が希薄となる。   In the first resin sealing layer 18a, the fluorescent material 17a deposited on the bottom and the surface of the LED element 11 forms a fluorescent material layer. In the second resin sealing layer 18b, the fluorescent material 17b deposited on the bottom of the second resin sealing layer 18b, which is the boundary between the first resin sealing layer 18a and the second resin sealing layer 18b, is a fluorescent material layer. Form. In the portion where the connection line 6 protrudes from the first resin sealing layer 18a, the upper surface is raised because the connection resin 16 is pulled up by the surface tension of the sealing resin. For this reason, the bottom surface of the second resin sealing layer 18b that contacts the top surface of the first resin sealing layer 18a also protrudes at the portion where the connection line 16 enters. In the raised portion of the second resin sealing layer 18b, there is little or no deposition of the fluorescent material, and the distribution of the fluorescent material becomes dilute.

なお、前記の金属ベース12、金属リード13、14は、これらを多数組み備えたリードフレームにより構成するのが最適である。そして、樹脂ベース15のLED素子11の収容された空所の内周壁面15aおよび金属ベース12および金属リード13、14の上表面は光の反射面となるように仕上げるのがよい。   The metal base 12 and the metal leads 13 and 14 are optimally constituted by a lead frame provided with a large number of these. And it is good to finish so that the inner peripheral wall surface 15a of the space in which the LED element 11 of the resin base 15 is accommodated, and the upper surfaces of the metal base 12 and the metal leads 13 and 14 may be light reflecting surfaces.

このように構成された光源ユニット10は、外部接続端子52、53に外部電源から直流電圧を印加することによりLED素子11が発光する。このLED素子11の発光光は周囲へ放射され樹脂封止層18の2層の樹脂封止層18aおよび18bの中を直進、又は樹脂ベース15の内周面15a等で反射されながら進行し外部へ放射される。   In the light source unit 10 configured as described above, the LED element 11 emits light when a DC voltage is applied to the external connection terminals 52 and 53 from an external power source. The emitted light of the LED element 11 is radiated to the surroundings and travels straight through the two resin sealing layers 18a and 18b of the resin sealing layer 18 or is reflected by the inner peripheral surface 15a of the resin base 15 and the like. To be emitted.

LED素子11の発光光が封止樹脂層18a、18b中を進行する過程で、各樹脂封止層の底部に形成された蛍光材料層を蛍光材料17a、17bに当たってこれを励起すると、蛍光材料17a、17bがLED素子11の発光光をこれとは異なる波長の可視光に変換する作用を行い、白色光が発生される。   When the emitted light of the LED element 11 travels through the sealing resin layers 18a and 18b, the fluorescent material layer formed on the bottom of each resin sealing layer hits the fluorescent materials 17a and 17b to excite the fluorescent material layer 17a. 17b perform the action of converting the light emitted from the LED element 11 into visible light having a wavelength different from that of the LED element 11, and white light is generated.

樹脂封止層18の上段の第2樹脂封止層18bの底部のLED素子11と金属リード13、14との間に接続された接続線16の湾曲部の頂部付近まで接続線16に沿って引き上げられた部分には蛍光材料17bの堆積がほとんどないので、この付近では、LED素子11の発光光が波長変換が行われないまま外部へ放射される。   Along the connection line 16 to the vicinity of the top of the curved portion of the connection line 16 connected between the LED element 11 at the bottom of the second resin sealing layer 18b in the upper stage of the resin sealing layer 18 and the metal leads 13 and 14. Since the fluorescent material 17b is hardly deposited on the pulled up portion, the light emitted from the LED element 11 is radiated to the outside without being wavelength-converted in this vicinity.

しかしながら、この発明では、下段の第1樹脂封止層18aにも蛍光材料17aが添加されており、この蛍光材料17aが沈降し、底部へ堆積する過程で、LED素子11の上表面上に堆積するようになる。このLED素子11の上表面上に堆積された蛍光材料17aがLED素子11の発光光により励起され、LED素子11の発光光の波長変換を行うので、波長変換された可視光がここから上方へ進行し、上段の第2樹脂封止層18bのLED素子11の上方に位置する蛍光材料17bの堆積のない部分を通って外部へ出射するようになるため、この部分での色むらの発生が抑制され、より均一な白色光を得ることができる。   However, in the present invention, the fluorescent material 17a is also added to the lower first resin sealing layer 18a, and the fluorescent material 17a is deposited on the upper surface of the LED element 11 in the process of being settled and deposited on the bottom. To come. The fluorescent material 17a deposited on the upper surface of the LED element 11 is excited by the light emitted from the LED element 11 and converts the wavelength of the light emitted from the LED element 11, so that the wavelength-converted visible light moves upward from here. Since it progresses and emits to the outside through a portion where the fluorescent material 17b is not deposited on the LED element 11 of the upper second resin sealing layer 18b, color unevenness occurs in this portion. Suppressed and more uniform white light can be obtained.

このように、この発明によれば、LED素子を封止する樹脂封止層を構成する上下2層の樹脂封止層をともに蛍光材料の添加された透明樹脂で形成することにより、樹脂封止層の区分された2層の樹脂封止層の蛍光材料が相互に補完しあって、全体において蛍光材料による波長変換を効果的に行うことができるため、色むらの発生が抑制され、均一性の高い白色光を発生することが可能となる。   As described above, according to the present invention, both the upper and lower two resin sealing layers constituting the resin sealing layer for sealing the LED element are formed of the transparent resin to which the fluorescent material is added, thereby encapsulating the resin. Since the fluorescent materials of the two resin-encapsulated layers separated from each other complement each other and wavelength conversion by the fluorescent material can be effectively performed as a whole, the occurrence of color unevenness is suppressed and uniformity is achieved. High white light can be generated.

10:光源ユニット
11:LED素子
12:金属ベース
13、14:金属リード
15:樹脂ベース
16:接続線
17、17a、17b:蛍光材料
18、18a、18b:樹脂封止層
50:表示灯
10: Light source unit 11: LED element 12: Metal base 13, 14: Metal lead 15: Resin base 16: Connection lines 17, 17a, 17b: Fluorescent material 18, 18a, 18b: Resin sealing layer 50: Indicator lamp

Claims (3)

金属ベースおよび金属リードをインサート成形により一体的に保持するカップ状の樹脂ケースを備え、この樹脂ケース内の前記金属ベース上にLED素子を固着し、この樹脂ケース内において前記LED素子の電極と前記金属リードとを接続線により接続するとともに、励起する光をこの光の波長とは異なる波長の可視光に変換する蛍光材料を添加した透明な封止樹脂を充填して形成した封止樹脂層により前記LED素子を封止してなる光源ユニットにおいて、前記樹脂封止層を上下2層に区分して構成し、前記区分した各層を前記蛍光材料の添加された透明の封止樹脂で形成することを特徴とする光源ユニット。   A cup-shaped resin case for integrally holding a metal base and a metal lead by insert molding is provided, and an LED element is fixed on the metal base in the resin case, and the electrode of the LED element and the electrode in the resin case A sealing resin layer formed by filling a metal lead with a transparent sealing resin added with a fluorescent material that converts excitation light into visible light having a wavelength different from the wavelength of the light while connecting the lead with a connection line. In the light source unit formed by sealing the LED element, the resin sealing layer is divided into two upper and lower layers, and each of the divided layers is formed of a transparent sealing resin to which the fluorescent material is added. A light source unit characterized by 請求項1に記載の光源ユニットにおいて、前記カップ状の樹脂ケースの内周面ならびに金属ベースおよび金属リードの露出面に光の反射面を形成することを特徴とする光源ユニット。   2. The light source unit according to claim 1, wherein a light reflecting surface is formed on an inner peripheral surface of the cup-shaped resin case and exposed surfaces of the metal base and the metal lead. 請求項1または2に記載の光源ユニットにおいて、前記金属ベースおよび金属リードはリードフレームで構成することを特徴とする光源ユニット。   The light source unit according to claim 1, wherein the metal base and the metal lead are constituted by a lead frame.
JP2009274701A 2009-12-02 2009-12-02 Light source unit Pending JP2011119402A (en)

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