JP2000101148A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JP2000101148A JP2000101148A JP10270787A JP27078798A JP2000101148A JP 2000101148 A JP2000101148 A JP 2000101148A JP 10270787 A JP10270787 A JP 10270787A JP 27078798 A JP27078798 A JP 27078798A JP 2000101148 A JP2000101148 A JP 2000101148A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- light
- cap
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光素子で発色す
る発光波長を他の発光波長に変換する発光ダイオ−ドに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode for converting an emission wavelength of light emitted from a light emitting element into another emission wavelength.
【０００２】[0002]
【従来の技術】発光素子で発色する発光波長を白色に波
長変換する発光ダイオ−ド（以下、ＬＥＤと略称する）
として、従来、図５に示す構成のものが知られている。
図５は、ＬＥＤを一部断面で示す縦断正面図である。図
５において、ＬＥＤ１ａは二本一対のリ−ド端子３、４
が設けられており、その一方のリ−ド端子４の先端部
に、鉄材よりなるフレ−ム５を形成している。このＬＥ
Ｄ１ａの発光素子２としては、例えばＧａＮ等の窒素化
合物を発光層として青色を発色するものが使用される。2. Description of the Related Art A light-emitting diode (hereinafter abbreviated as an LED) for converting the wavelength of light emitted from a light-emitting element into white light.
Conventionally, the configuration shown in FIG. 5 is known.
FIG. 5 is a vertical sectional front view showing the LED in a partial cross section. In FIG. 5, the LED 1a has a pair of lead terminals 3, 4
And a frame 5 made of an iron material is formed at the tip of one of the lead terminals 4. This LE
As the light emitting element 2 of D1a, for example, a light emitting element that emits blue light using a nitrogen compound such as GaN as a light emitting layer is used.
【０００３】フレ−ム５の略中央部には凹部５ａが形成
される。この凹部５ａは、外径を発光素子２の外径より
も大きく選定し、その深さを発光素子２の厚さよりも大
きくして、凹部５ａに発光素子２を収容する。発光素子
２は、銀ペ−スト又は透明エポキシ樹脂の接合材料１０
を用いてフレ−ム５の凹部５ａにダイボンデングされ
る。また、発光素子２は金属線６によりリ−ド端子３に
ワイヤボンデングされ、金属線７によりにフレ−ム５の
先端部にワイヤボンデングされる。A concave portion 5a is formed substantially at the center of the frame 5. The outer diameter of the concave portion 5a is selected to be larger than the outer diameter of the light emitting element 2, the depth thereof is larger than the thickness of the light emitting element 2, and the light emitting element 2 is accommodated in the concave portion 5a. The light emitting element 2 is made of a bonding material 10 made of silver paste or transparent epoxy resin.
Is die-bonded to the recess 5a of the frame 5. Further, the light emitting element 2 is wire-bonded to the lead terminal 3 by a metal wire 6 and wire-bonded to the leading end of the frame 5 by a metal wire 7.
【０００４】８は、フレ−ム５の凹部５ａに銀ペ−スト
又は透明エポキシ樹脂の接合材料１０によりダイボンデ
ングされると共に、金属線６、７によりリ−ド端子３、
フレ−ム５の先端部にワイヤボンデングされた発光素子
２を覆い、リ−ド端子３、４をパッケ−ジする透明又は
半透明の合成樹脂製モ−ルド部である。モ−ルド部８の
先端部には、略半球形状のレンズ９が形成される。この
ようにＬＥＤ１ａは、先端が略半球形状の円筒体の形
状、すなわちド−ム形状に形成される。[0004] 8 is die-bonded to the recess 5 a of the frame 5 with a bonding material 10 of silver paste or transparent epoxy resin, and the lead terminals 3, 3 are provided by metal wires 6, 7.
A transparent or translucent synthetic resin mold section for covering the light emitting element 2 wire-bonded to the end of the frame 5 and packaging the lead terminals 3 and 4. An approximately hemispherical lens 9 is formed at the tip of the mold section 8. As described above, the LED 1a is formed in a cylindrical shape having a substantially hemispherical tip, that is, in a dome shape.
【０００５】発光素子２の周囲に蛍光塗料１１を塗布す
る。発光素子２を励起すると青色の発光色が得られる
が、当該青色の発光色により蛍光塗料１１が励起され、
白色に波長変換された出力光が発射される。この白色に
波長変換された出力光は発光素子２の前方に直進し、透
明又は半透明の合成樹脂製モ−ルド部８の先端部に形成
されたレンズ９により屈折して外部に放射される。A fluorescent paint 11 is applied around the light emitting element 2. When the light-emitting element 2 is excited, a blue emission color is obtained, and the fluorescent paint 11 is excited by the blue emission color,
Output light whose wavelength has been converted to white is emitted. The output light whose wavelength has been converted to white light travels straight ahead of the light emitting element 2, is refracted by a lens 9 formed at the tip of a transparent or translucent synthetic resin molded part 8, and is emitted to the outside. .
【０００６】図５に示したように、発光素子２の周囲に
蛍光塗料１１を塗布する構成では、蛍光塗料１１の塗布
量に差異があると、白色に波長変換される度合いにバラ
ツキが発生し、外部には規定の白色の出力光が放射され
ないことになる。外部に規定の白色の出力光が放射され
ないと、ユ−ザで発光ダイオ−ドを使用する際に色ムラ
が生じてしまう。このため、かかる発光ダイオ−ドは不
良品として出荷が止められることになり、同一ロットの
製品全てが不良品になる可能性がある。As shown in FIG. 5, in the configuration in which the fluorescent paint 11 is applied around the light emitting element 2, if the amount of the fluorescent paint 11 applied is different, the degree of wavelength conversion to white varies. Therefore, the prescribed white output light is not emitted to the outside. If the specified white output light is not radiated to the outside, color unevenness will occur when the user uses the light emitting diode. For this reason, shipment of such a light emitting diode is stopped as a defective product, and there is a possibility that all products of the same lot become defective products.
【０００７】[0007]
【発明が解決しようとする課題】上記のような不良品の
発生を防止するためには、蛍光塗料１１の塗布量を均一
にする必要があるが、蛍光塗料の塗布量管理が困難であ
るために適正な塗布量とするための処理時間を要し、発
光ダイオ−ドの生産効率が低下するという問題があっ
た。In order to prevent the occurrence of defective products as described above, it is necessary to make the coating amount of the fluorescent coating 11 uniform, but it is difficult to control the coating amount of the fluorescent coating. However, there is a problem that the processing time is required to obtain an appropriate coating amount, and the production efficiency of the light emitting diode is reduced.
【０００８】本発明はこのような問題に鑑み、発光素子
で発色した発光波長を他の発光波長に変換する際に、蛍
光塗料の塗布量管理を不要として生産性を高めた発光ダ
イオ−ドの提供を目的とする。The present invention has been made in view of the above-mentioned problems, and when converting a light emission wavelength generated by a light emitting element to another light emission wavelength, there is no need to control the application amount of a fluorescent paint, thereby improving the productivity of the light emitting diode. For the purpose of providing.
【０００９】[0009]
【課題を解決するための手段】本発明の上記目的は、発
光ダイオ−ドを、発光素子と、発光素子をダイボンデン
グする取付け部材と、ダイボンデングされた発光素子を
ワイヤボンデングする一対の導電部材と、発光素子をパ
ッケ−ジする透明又は半透明合成樹脂製のモ−ルド部
と、発光素子で発色する発光波長を他の発光波長に変換
する蛍光物質を弾性を有する透光性の基材に含有させ、
形状をモ−ルド部の外形形状に適合させて形成されたキ
ャップとを備え、前記キャップをモ−ルド部に被着する
構成とすることによって達成される。SUMMARY OF THE INVENTION The object of the present invention is to provide a light emitting diode, a light emitting element, a mounting member for die bonding the light emitting element, and a pair of conductive members for wire bonding the die bonded light emitting element. A molded part made of a transparent or translucent synthetic resin for packaging the light emitting element, and a fluorescent material for converting the emission wavelength of light emitted from the light emitting element to another emission wavelength on an elastic translucent substrate. Contain
And a cap formed in conformity with the outer shape of the mold part, and the cap is attached to the mold part.
【００１０】本発明の上記特徴によれば、発光素子で発
色する発光波長を他の発光波長に変換する蛍光物質を含
有させた弾性を有する透光性の基材でキャップを形成
し、このキャップをモ−ルド部に被着しているので、蛍
光塗料の塗布料の管理が不要であり、発光ダイオ−ドの
生産性を向上させることができる。また、上記のキャッ
プを用いることにより変換された発光波長にバラツキの
ない発光ダイオ−ドが得られる。According to the above feature of the present invention, the cap is formed of an elastic translucent base material containing a fluorescent substance for converting the emission wavelength of light emitted from the light emitting element to another emission wavelength. Is adhered to the mold part, so that it is not necessary to control the coating material of the fluorescent paint, and the productivity of the light emitting diode can be improved. Also, by using the above cap, a light emitting diode having no variation in the converted light emitting wavelength can be obtained.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施の形態につい
て図を参照して説明する。図２は、本発明のＬＥＤに使
用される蛍光物質を含有したキャップの断面図である。
図２においてキャップ１２は、例えばシリコンゴムやウ
レタンゴム等の弾性を有する透光性の基材に、蛍光塗料
や蛍光染料等の蛍光物質を含有させて形成される。Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a sectional view of a cap containing a fluorescent substance used in the LED of the present invention.
In FIG. 2, the cap 12 is formed by adding a fluorescent material such as a fluorescent paint or a fluorescent dye to an elastic translucent base material such as silicon rubber or urethane rubber.
【００１２】キャップ１２は、先端部に略半球形状の部
分１２ｃを有する有底の中空円筒状の形状として、開口
側の端部には円形に鍔部１２ｂを形成している。このよ
うな形状のキャップ１２は、シリコンゴム等の基材に蛍
光物質を練り込んだ原材料を適宜の金型を用いて射出成
形することにより製作することができる。The cap 12 has a hollow cylindrical shape with a bottom and a substantially hemispherical portion 12c at the tip, and a circular flange 12b is formed at the end on the opening side. The cap 12 having such a shape can be manufactured by injection-molding a raw material obtained by kneading a fluorescent substance into a base material such as silicon rubber using an appropriate mold.
【００１３】図３は、本発明のＬＥＤを一部断面で部分
的に示す縦断正面図である。図５と同一の部分、または
対応するところには同一の符号を付しており、詳細な説
明は省略する。図３の構成では、ＬＥＤ１ｂは発光素子
２の周囲に蛍光塗料１１を塗布していないので、発光素
子２を励起すると青色の発光色が前方に発射される。FIG. 3 is a vertical sectional front view partially showing the LED of the present invention in a partial cross section. The same parts as those in FIG. 5 or corresponding parts are denoted by the same reference numerals, and detailed description thereof will be omitted. In the configuration of FIG. 3, since the LED 1 b does not apply the fluorescent paint 11 around the light emitting element 2, when the light emitting element 2 is excited, a blue emission color is emitted forward.
【００１４】図１は、本発明のＬＥＤ１を一部断面で示
す縦断正面図である。本発明においては、図３に示した
構成の、先端部に略半球形状のレンズ９が形成されてい
る円筒状のモ−ルド部８を有するＬＥＤ１ｂの外形に沿
って、図２に示した構成の、先端部が略半球形状の有底
中空円筒状のキャップ１２を被着してＬＥＤ１を構成し
ている。すなわち、キャップ１２の形状はモ−ルド部８
の外形に適合した形状の中空ド−ム形状に選定されてい
る。FIG. 1 is a longitudinal sectional front view showing an LED 1 of the present invention in a partial cross section. In the present invention, the configuration shown in FIG. 2 is taken along the outer shape of the LED 1b having the cylindrical mold portion 8 having the substantially hemispherical lens 9 formed at the tip end of the configuration shown in FIG. The LED 1 is formed by attaching a cap 12 having a hollow cylindrical shape with a bottom having a substantially hemispherical shape at the tip. That is, the shape of the cap 12 is
Is selected as a hollow dome shape that conforms to the external shape.
【００１５】キャップ１２は弾性を有するので、開口側
を外側に拡張してＬＥＤ１ｂの外形に沿って容易に被着
することができる。また、キャップ１２をモ−ルド部８
に被着する際に、キャップ１２の開口側の端部に設けて
いる円形の鍔部１２ｂは、弾性の復元力でモ−ルド部８
の底面端部８ａに係合される。このため、モ−ルド部８
とキャップ１２との密着性を高め、波長変換された出力
光を効率よく外部に発射することができる。Since the cap 12 has elasticity, it can be easily attached along the outer shape of the LED 1b by expanding the opening side outward. Also, the cap 12 is connected to the mold section 8.
The circular flange 12b provided at the opening-side end of the cap 12 at the time of being attached to the
At the bottom end 8a. Therefore, the molding unit 8
And the cap 12 can be improved in adhesion, and the wavelength-converted output light can be efficiently emitted to the outside.
【００１６】発光素子２を励起すると青色の発光色が前
方に出力されるが、キャップ１２は蛍光物質を含有して
いるので、青色の発光波長はキャップ１２で白色の発光
波長に変換されて、白色の出力光が外部に発射される。When the light emitting element 2 is excited, a blue emission color is output forward. However, since the cap 12 contains a fluorescent substance, the blue emission wavelength is converted into a white emission wavelength by the cap 12, and White output light is emitted to the outside.
【００１７】シリコンゴムやウレタンゴム等の弾性を有
する透光性の基材に含有される蛍光物質の含有量は、白
色の波長変換の度合いを考慮して適宜定められる。一旦
蛍光物質の含有量が選定されると、キャップ１２はシリ
コンゴムやウレタンゴム等の弾性を有する透光性の基材
に蛍光物質が均一に含有されている材料で製作されるの
で、蛍光物質の含有量の管理が不要となり、生産性が向
上する。The content of the fluorescent substance contained in the elastic translucent base material such as silicon rubber or urethane rubber is appropriately determined in consideration of the degree of white wavelength conversion. Once the content of the fluorescent substance is selected, the cap 12 is made of a material in which the fluorescent substance is uniformly contained in an elastic translucent base material such as silicon rubber or urethane rubber. It is not necessary to control the content of, and productivity is improved.
【００１８】また、キャップ１２を複数製造する場合に
はいずれのキャップ１２を用いても波長変換にバラツキ
が発生しない。さらに、発光素子２の発光波長にバラツ
キが生じた場合でも、キャップ１２により波長変換させ
ることにより、外部には所定の波長の白色の出力光を発
射することができるので、不良製品の発生を抑制でき
る。In the case where a plurality of caps 12 are manufactured, no variation occurs in wavelength conversion regardless of which cap 12 is used. Further, even when the emission wavelength of the light emitting element 2 varies, the white light output of a predetermined wavelength can be emitted to the outside by converting the wavelength by the cap 12, thereby suppressing the occurrence of defective products. it can.
【００１９】図４は、本発明の別の実施の形態のＬＥＤ
１を一部断面で示す縦断正面図である。図４の例では、
モ−ルド部８の下部にフランジ部８ｘを形成している。
また、キャップ１２は、モ−ルド部８のフランジ部８ｘ
に対応する位置に外方に突出する突出部１２ｘを形成し
ている。このように図４の例では、モ−ルド部８に形成
したフランジ部８ｘにキャップ１２の突出部１２ｘを係
合しているので、キャップ１２をより強固にモ−ルド部
８に被着することができる。FIG. 4 shows an LED according to another embodiment of the present invention.
FIG. 1 is a longitudinal sectional front view showing a part 1 in a cross section. In the example of FIG.
A flange portion 8x is formed below the mold portion 8.
Further, the cap 12 is provided with a flange portion 8x of the mold portion 8.
Is formed at a position corresponding to. As described above, in the example of FIG. 4, the projection 12x of the cap 12 is engaged with the flange 8x formed on the mold portion 8, so that the cap 12 is more firmly attached to the mold portion 8. be able to.
【００２０】なお、本発明のＬＥＤは、発光素子２をパ
ッケ−ジする透明又は半透明合成樹脂製のモ−ルド部８
の形状は、図１に示したように先端側が略半球形状とす
るド−ム形状のものには限定されない。モ−ルド部８の
形状を矩形状としたものにも適用でき、この場合にも、
キャップはモ−ルド部８の外形に合わせた形状として射
出成形により製造される。The LED of the present invention has a molded part 8 made of a transparent or translucent synthetic resin for packaging the light emitting element 2.
The shape is not limited to a dome shape having a substantially hemispherical tip side as shown in FIG. The shape of the mold part 8 can be applied to a rectangular shape.
The cap is manufactured by injection molding to have a shape conforming to the outer shape of the mold section 8.
【００２１】[0021]
【発明の効果】以上説明したように本発明は、発光素子
で発色する発光波長を他の発光波長に変換する蛍光物質
を含有させた弾性を有する透光性の基材でキャップを形
成し、このキャップをモ−ルド部に被着しているので、
蛍光塗料の塗布料の管理が不要であり、発光ダイオ−ド
の生産性を向上させることができる。また、上記のキャ
ップを用いることにより変換された発光波長にバラツキ
のない発光ダイオ−ドが得られる。As described above, according to the present invention, a cap is formed of an elastic translucent base material containing a fluorescent substance for converting the emission wavelength of light emitted from a light emitting element to another emission wavelength, Since this cap is attached to the mold part,
It is not necessary to control the coating material of the fluorescent paint, and the productivity of the light emitting diode can be improved. Also, by using the above cap, a light emitting diode having no variation in the converted light emitting wavelength can be obtained.
【図１】本発明の実施の形態に係るＬＥＤランプを一部
断面で示す縦断正面図である。FIG. 1 is a longitudinal sectional front view showing a partial cross section of an LED lamp according to an embodiment of the present invention.
【図２】キャップの断面図である。FIG. 2 is a sectional view of a cap.
【図３】キャップ被着前のＬＥＤランプを一部断面で示
す縦断正面図である。FIG. 3 is a vertical sectional front view showing a part of the LED lamp before the cap is attached.
【図４】本発明の別の実施の形態に係るＬＥＤランプを
一部断面で示す縦断正面図である。FIG. 4 is a longitudinal sectional front view showing a partial cross section of an LED lamp according to another embodiment of the present invention.
【図５】従来例のＬＥＤランプを一部断面で示す縦断正
面図である。FIG. 5 is a vertical sectional front view showing a conventional LED lamp in a partial cross section.
１、１ａ、１ｂ 発光ダイオ−ド（ＬＥＤ） ２ 発光素子 ３、４ リ−ド端子 ５ フレ−ム ５ａ 凹部 ６、７ 金属線 ８ モ−ルド部 ９ レンズ １０ 銀または透明エポキシ樹脂の接合材料 １１ 蛍光塗料 １２ キャップ DESCRIPTION OF SYMBOLS 1, 1a, 1b Light emitting diode (LED) 2 Light emitting element 3, 4 Lead terminal 5 Frame 5a Concave part 6, 7 Metal wire 8 Mold part 9 Lens 10 Silver or transparent epoxy resin bonding material 11 Fluorescent paint 12 cap
Claims (1)
する取付け部材と、ダイボンデングされた発光素子をワ
イヤボンデングする一対の導電部材と、発光素子をパッ
ケ−ジする透明又は半透明合成樹脂製のモ−ルド部と、
発光素子で発色する発光波長を他の発光波長に変換する
蛍光物質を弾性を有する透光性の基材に含有させ、形状
をモ−ルド部の外形形状に適合させて形成されたキャッ
プとを備え、前記キャップをモ−ルド部に被着してなる
ことを特徴とする発光ダイオ−ド。1. A light-emitting element, a mounting member for die-bonding the light-emitting element, a pair of conductive members for wire-bonding the die-bonded light-emitting element, and a transparent or translucent synthetic resin module for packaging the light-emitting element. -Part and
A cap formed by incorporating a fluorescent substance for converting the emission wavelength of light emitted from the light emitting element into another emission wavelength into a translucent base material having elasticity and adapting the shape to the external shape of the mold part. A light emitting diode comprising: a cap;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10270787A JP2000101148A (en) | 1998-09-25 | 1998-09-25 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10270787A JP2000101148A (en) | 1998-09-25 | 1998-09-25 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000101148A true JP2000101148A (en) | 2000-04-07 |
Family
ID=17491003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10270787A Pending JP2000101148A (en) | 1998-09-25 | 1998-09-25 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000101148A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002221658A (en) * | 2001-01-26 | 2002-08-09 | Rabo Sufia Kk | Bulk type lens, light emitting body, light receiving body, illumination instrument, optical information communication system and method for manufacturing bulk type lens |
| JP2002225762A (en) * | 2001-01-30 | 2002-08-14 | Rabo Sufia Kk | Bicycle light using bulk lens |
| JP2002231023A (en) * | 2001-01-30 | 2002-08-16 | Rabo Sufia Kk | Interior lighting apparatus |
| US7084435B2 (en) | 2001-07-26 | 2006-08-01 | Matsushita Electric Works, Ltd. | Light emitting device using LED |
| JP2007504972A (en) * | 2003-09-09 | 2007-03-08 | クリー インコーポレイテッド | Transmission type optical element comprising transparent plastic shell having phosphor dispersed therein and method for manufacturing the same |
| US7479662B2 (en) | 2002-08-30 | 2009-01-20 | Lumination Llc | Coated LED with improved efficiency |
| US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
| US7842960B2 (en) | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
| JP2013537714A (en) * | 2010-07-28 | 2013-10-03 | ジーイー・ライティング・ソルーションズ，エルエルシー | Phosphor suspended in silicone, molded / formed and used in a remote phosphor configuration |
| US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
| US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
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-
1998
- 1998-09-25 JP JP10270787A patent/JP2000101148A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002221658A (en) * | 2001-01-26 | 2002-08-09 | Rabo Sufia Kk | Bulk type lens, light emitting body, light receiving body, illumination instrument, optical information communication system and method for manufacturing bulk type lens |
| JP2002225762A (en) * | 2001-01-30 | 2002-08-14 | Rabo Sufia Kk | Bicycle light using bulk lens |
| JP2002231023A (en) * | 2001-01-30 | 2002-08-16 | Rabo Sufia Kk | Interior lighting apparatus |
| US7084435B2 (en) | 2001-07-26 | 2006-08-01 | Matsushita Electric Works, Ltd. | Light emitting device using LED |
| US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
| US7479662B2 (en) | 2002-08-30 | 2009-01-20 | Lumination Llc | Coated LED with improved efficiency |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| JP2007504972A (en) * | 2003-09-09 | 2007-03-08 | クリー インコーポレイテッド | Transmission type optical element comprising transparent plastic shell having phosphor dispersed therein and method for manufacturing the same |
| JP4674318B2 (en) * | 2003-09-09 | 2011-04-20 | クリー インコーポレイテッド | Transmission type optical element comprising transparent plastic shell having phosphor dispersed therein and method for manufacturing the same |
| US7842960B2 (en) | 2006-09-06 | 2010-11-30 | Lumination Llc | Light emitting packages and methods of making same |
| US9951938B2 (en) | 2009-10-02 | 2018-04-24 | GE Lighting Solutions, LLC | LED lamp |
| JP2013537714A (en) * | 2010-07-28 | 2013-10-03 | ジーイー・ライティング・ソルーションズ，エルエルシー | Phosphor suspended in silicone, molded / formed and used in a remote phosphor configuration |
| US9841175B2 (en) | 2012-05-04 | 2017-12-12 | GE Lighting Solutions, LLC | Optics system for solid state lighting apparatus |
| US10139095B2 (en) | 2012-05-04 | 2018-11-27 | GE Lighting Solutions, LLC | Reflector and lamp comprised thereof |
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