JP2011114238A5 - - Google Patents
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- JP2011114238A5 JP2011114238A5 JP2009270676A JP2009270676A JP2011114238A5 JP 2011114238 A5 JP2011114238 A5 JP 2011114238A5 JP 2009270676 A JP2009270676 A JP 2009270676A JP 2009270676 A JP2009270676 A JP 2009270676A JP 2011114238 A5 JP2011114238 A5 JP 2011114238A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bottom portion
- pin
- original
- exposure apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
上記課題を解決するために、本発明の基板保持装置は、複数のピン状凸部が形成された底部と、複数のピン状凸部の外周に位置する隔壁部と、底部に貫設された真空排気のための真空穴とを備えたチャック本体を有し、ピン状凸部の表面を含む載置面に基板が載置された際に、基板と底部との間に形成された領域を真空排気することで基板を吸着保持する基板保持装置であって、底部は、真空穴が貫設された中心領域とその外周に設けられた外周領域とを含み、中心領域の深さは、外周領域よりも深いことを特徴とする。
In order to solve the above problems, a substrate holding device of the present invention includes a bottom portion having a plurality of pin-like protrusions are formed, and the septum wall you position on the outer periphery of the plurality of pin-like protrusions, transmural the bottom It has a chuck body with a vacuum hole for evacuation provided, and is formed between the substrate and the bottom when the substrate is placed on the placement surface including the surface of the pin-like convex portion. A substrate holding device that sucks and holds the substrate by evacuating the region, the bottom portion including a central region in which a vacuum hole is penetrated and an outer peripheral region provided on the outer periphery thereof, the depth of the central region Is characterized by being deeper than the outer peripheral region.
Claims (4)
前記底部は、前記真空穴が貫設された中心領域とその外周に設けられた外周領域とを含み、前記中心領域の深さが前記外周領域よりも深いことを特徴とする基板保持装置。 Comprising a bottom portion in which a plurality of pin-like protrusions are formed, and the septum wall you located on an outer periphery of the plurality of pin-like protrusions, and a vacuum hole for evacuation was formed through the bottom portion When the substrate is placed on the placement surface including the surface of the pin-like convex portion , the region formed between the substrate and the bottom portion is evacuated to adsorb the substrate. A substrate holding device for holding,
The substrate holding apparatus according to claim 1, wherein the bottom includes a central region in which the vacuum hole is penetrated and an outer peripheral region provided on an outer periphery thereof, and the depth of the central region is deeper than the outer peripheral region.
前記基板ステージは、請求項１または２に記載の基板保持装置を備えることを特徴とする露光装置。 An illumination optical system that illuminates the original with light from the light source unit, a reticle stage that is movable by placing the original, a projection optical system that guides light from the original to the substrate, and the substrate An exposure apparatus having a movable substrate stage,
An exposure apparatus, wherein the substrate stage comprises the substrate holding device according to claim 1.
露光された基板を現像する工程と、
を備えることを特徴とするデバイス製造方法。
A step of exposing the substrate using the exposure apparatus according to claim 3;
Developing the exposed substrate;
A device manufacturing method comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009270676A JP5656392B2 (en) | 2009-11-27 | 2009-11-27 | Substrate holding apparatus, exposure apparatus using the same, and device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009270676A JP5656392B2 (en) | 2009-11-27 | 2009-11-27 | Substrate holding apparatus, exposure apparatus using the same, and device manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011114238A JP2011114238A (en) | 2011-06-09 |
| JP2011114238A5 true JP2011114238A5 (en) | 2013-01-17 |
| JP5656392B2 JP5656392B2 (en) | 2015-01-21 |
Family
ID=44236330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009270676A Active JP5656392B2 (en) | 2009-11-27 | 2009-11-27 | Substrate holding apparatus, exposure apparatus using the same, and device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5656392B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5934542B2 (en) * | 2012-03-29 | 2016-06-15 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate holding device and substrate processing apparatus |
| JP5521066B1 (en) * | 2013-01-25 | 2014-06-11 | 東京エレクトロン株式会社 | Joining apparatus and joining system |
| CN104516209B (en) * | 2013-10-08 | 2017-01-25 | 上海微电子装备有限公司 | Bearing fixing apparatus used in integrated circuit device |
| JP5538613B1 (en) * | 2013-11-13 | 2014-07-02 | 東京エレクトロン株式会社 | Joining apparatus and joining system |
| NL2013835A (en) | 2014-01-20 | 2015-07-21 | Asml Netherlands Bv | Substrate holder, support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
| JP2014150266A (en) * | 2014-03-13 | 2014-08-21 | Tokyo Electron Ltd | Bonding device and bonding system |
| KR102204884B1 (en) * | 2018-09-27 | 2021-01-19 | 세메스 주식회사 | Transfer robot and Apparatus for treating substrate with the robot |
| KR20240061613A (en) | 2022-10-31 | 2024-05-08 | 니혼도꾸슈도교 가부시키가이샤 | Substrate holding member |
| CN116487314B (en) * | 2023-06-21 | 2023-09-01 | 上海新创达半导体设备技术有限公司 | Wafer carrier with warp correction function |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718438A (en) * | 1993-06-17 | 1995-01-20 | Anelva Corp | Electrostatic chuck device |
| JP3312163B2 (en) * | 1994-11-18 | 2002-08-05 | 日本電信電話株式会社 | Vacuum suction device |
| JP3312164B2 (en) * | 1995-04-07 | 2002-08-05 | 日本電信電話株式会社 | Vacuum suction device |
| JP3287761B2 (en) * | 1995-06-19 | 2002-06-04 | 日本電信電話株式会社 | Vacuum suction equipment and processing equipment |
| JP4041256B2 (en) * | 1999-12-21 | 2008-01-30 | 株式会社日立ハイテクノロジーズ | Substrate chuck device |
| JP2001185607A (en) * | 1999-12-27 | 2001-07-06 | Canon Inc | Substrate suction holding device and device manufacturing method |
| US6494955B1 (en) * | 2000-02-15 | 2002-12-17 | Applied Materials, Inc. | Ceramic substrate support |
| EP1431825A1 (en) * | 2002-12-20 | 2004-06-23 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method, and substrate holder |
| JP2005277117A (en) * | 2004-03-25 | 2005-10-06 | Nikon Corp | Substrate holding device, exposure method and device, and device manufacturing method |
| JP2007273693A (en) * | 2006-03-31 | 2007-10-18 | Nikon Corp | Member, method, and device for holding substrate, and device and method for exposure |
| JP5016523B2 (en) * | 2008-02-29 | 2012-09-05 | 株式会社日本セラテック | Vacuum chuck |
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2009
- 2009-11-27 JP JP2009270676A patent/JP5656392B2/en active Active
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