KR20130068453A - Vacuum chuck for imprint - Google Patents

Vacuum chuck for imprint Download PDF

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Publication number
KR20130068453A
KR20130068453A KR1020110135627A KR20110135627A KR20130068453A KR 20130068453 A KR20130068453 A KR 20130068453A KR 1020110135627 A KR1020110135627 A KR 1020110135627A KR 20110135627 A KR20110135627 A KR 20110135627A KR 20130068453 A KR20130068453 A KR 20130068453A
Authority
KR
South Korea
Prior art keywords
sealing ring
substrate
sealing
vacuum
vacuum chuck
Prior art date
Application number
KR1020110135627A
Other languages
Korean (ko)
Inventor
김진식
Original Assignee
한국전자통신연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국전자통신연구원 filed Critical 한국전자통신연구원
Priority to KR1020110135627A priority Critical patent/KR20130068453A/en
Publication of KR20130068453A publication Critical patent/KR20130068453A/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

PURPOSE: A vacuum chuck for imprinting is provided to form the even thickness of a photosensitive layer on the center and edge of a substrate by using multiple height adjustable sealing rings. CONSTITUTION: A vacuum chuck(200) for imprinting comprises a support(100), multiple sealing rings(104), and a micro adjuster(400). The multiple sealing rings are located on the support. The micro adjuster adjusts the height of the sealing rings by being connected to each sealing ring. The sealing rings comprise a first sealing ring(104a), a second sealing ring(104b), a third sealing ring(104c), and a fourth sealing ring(104d). The first sealing ring is connected to a first micro adjuster(40), the second sealing ring is connected to a second adjuster(42), the third sealing ring is connected to a third adjuster(44), and the fourth sealing ring is connected to a fourth adjuster(46). When each sealing ring is adhered and sealed with a substrate(107), an empty space(500) is formed between the substrate and the support. By using the first and third sealing rings, the same height from the center to edge of the substrate is maintained to evenly adhere the substrate and a mold or a mask.

Description

Vacuum Chucks for Imprints {VACUUM CHUCK FOR IMPRINT}

The present invention relates to a wafer chuck for vacuum imprint.

A photolithography process is used to form a fine pattern on the substrate. However, as the size of substrates become larger, the pattern size becomes smaller, and the price competitiveness of each field becomes fierce, an imprint method has been proposed instead of a complicated photolithography process that performs exposure, development, and etching processes.

In the imprint method, a shape required for the surface of an inorganic or polymer having a relatively high strength is prepared in advance, and a fine pattern is formed by stamping it on another material as if it were painted.

In this case, the substrate on which the pattern is formed is fixed by a vacuum chuck, and a fine pattern is imprinted on the fixed substrate by using a mold, and the substrate may be fixed by using a vacuum chuck used in an existing exposure process.

However, the vacuum chuck used in the existing exposure process is optimized for the photographic process, and there is a problem in that it is not easy to uniformly apply sufficient pressure to the substrate using the mold.

And due to the characteristic that the edge portion of the substrate contacts the mold first and the center portion later contacts the vacuum chuck, there is a problem in that the thickness of the photosensitive layer of the central portion remains thicker than the edge thickness.

In addition, the bubble trapped in the center portion has a problem that remains in the center portion does not escape to the outside. Due to the trapped bubbles in this way there is a problem that the fine pattern is not taken.

Therefore, the present invention can form the photosensitive layer to have a uniform thickness without a difference in thickness at the edge and the center of the substrate, or to form the photosensitive layer so that the center portion is thinner than the thickness of the edge portion, and further Is to provide an imprint vacuum chuck that allows both the center and edge portions to be formed uniformly and with a minimum thickness.

The vacuum chuck for imprint according to the present invention for achieving the above object is connected to a plurality of sealing rings, a sealing ring located on the support, the support, and each includes a fine adjustment device for adjusting the height of the sealing ring.

By using the vacuum chuck for imprint including a height adjustable sealing ring as in the present invention to be in contact with the mold in the center portion of the substrate first to have a uniform thickness without a difference in thickness at the edge and the center of the substrate The photosensitive layer may be formed so that the photosensitive layer may be formed, or the photosensitive layer may be formed so that the center portion is thinner than the thickness of the edge portion, and furthermore, the center portion and the edge portion may both have a uniform minimum thickness.

1 is a schematic cross-sectional view of a vacuum chuck according to an embodiment of the present invention.
2 to 4 are views for explaining the operation of the vacuum chuck for an imprint according to an embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the drawings, the thickness is enlarged to clearly represent the layers and regions. Like parts are designated with like reference numerals throughout the specification. Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

Hereinafter, a vacuum chuck according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a vacuum chuck according to an embodiment of the present invention.

As shown in FIG. 1, the vacuum chuck 200 includes a support 100 and a plurality of sealing rings 104 installed on the support 100. The sealing ring 104 can adjust the interval and the number of the sealing ring 104 is disposed in accordance with the size of the substrate placed on the vacuum chuck, for example, as shown in FIG. 104a), the 2nd sealing ring 104b, the 3rd sealing ring 104c, and the 4th sealing ring 104d are arrange | positioned at regular intervals. In this case, the first to third sealing rings 104a to 104c are positioned within the boundary line of the substrate, and the fourth sealing ring 104d is positioned outside the boundary line of the substrate. In addition, a plurality of sealing rings (not shown) may exist between the first sealing ring 104a and the third sealing ring 104c. Hereinafter, four sealing rings will be described. However, depending on the size of the substrate, it may be disposed below or in excess.

The width of the sealing ring 104 preferably has a strength that can withstand the pressure during vacuum adsorption. The sealing ring 104 may be formed of a metal such as stainless steel, but may be made of an elastic material, for example, a rubber material to increase the sealing effect.

Each sealing ring 104 is connected to the fine adjustment device 400. That is, the first sealing ring 104a is connected to the first fine adjustment device 40, the second sealing ring 104b is connected to the second fine adjustment device 42, and the third sealing ring 104c is The fourth fine control device 44 is connected, and the fourth sealing ring 104d is connected to the fourth fine control device.

The first to fourth fine control devices 40 to 46 control the height of each of the first to fourth sealing rings 104a to 104d.

On the other hand, each sealing ring 104 forms an empty space 500 between the substrate 107 and the support 100 when sealed in contact with the substrate 107. That is, the first sealing ring 104a forms the first space 5a, the second sealing ring 104b forms the second space 5b, and the third sealing ring 104c forms the third space ( 5c). The fourth sealing ring 5d forms a fourth space 5d between the mold (not shown) or mask (not shown) described later and the support 100.

Each sealing ring 104 may have one or more openings 105 to maintain a pressure balance between the first to fourth spaces 5a to 5d. The openings 105 may be located in a straight line, but may be staggered.

The support 100 includes a plurality of vacuum holes 103. The vacuum hole 103 is for maintaining the vacuum of each space 500 and is located corresponding to the first to fourth spaces 5a to 5d.

Accordingly, when the substrate 107 is placed on the sealing ring 104, a vacuum is applied between the substrate 107 and the support 100 by the vacuum hole 103 to fix the substrate to the chuck.

And as in the present invention by installing the sealing ring 104, the height of each controllable by the microadjusting device 400 can be completely fixed to the substrate from the center to the edge of the substrate 107 on the substrate 107 The thickness of the film formed can be made uniform. The photosensitive layer may be formed to have a uniform thickness without a difference in thickness between the edge and the center of the substrate, or the photosensitive layer may be formed so that the center portion is thinner than the thickness of the edge portion, and furthermore, It is possible to make all the edge portions uniformly form a minimum thickness.

This will be described in detail with reference to FIGS. 2 to 4.

2 to 4 are diagrams for explaining the operation of the vacuum chuck for an imprint according to an embodiment of the present invention.

As shown in FIG. 2, after the substrate 107 is disposed on the support 100, a photosensitive material (not shown) is coated on the substrate 107. In addition, if necessary, the photosensitive material may be first coated on the substrate and then disposed on the support 100.

When the vacuum is applied by the vacuum hole 103, the substrate 107 and the first sealing ring 104a are fixed in vacuum while the vacuum is maintained in the first space 5a. This operation may be performed at this stage before the next operation or after the operation of the next stage.

And the height of the 1st sealing ring 104a is set higher than the position of the 2nd sealing ring 104b and the 3rd sealing ring 104c using the 1st fine adjustment apparatus 40. FIG.

When the substrate is disposed on the sealing ring 104 in such a state, the first sealing ring 104a and the substrate 107 come into contact with each other so that the center portion of the substrate 107 rises and the edge is bent downward.

As such, when the center of the substrate is raised and the edges are struck, the mold (not shown) or the mask (not shown) comes into contact with the center of the substrate 107 when the mold 107 contacts the substrate 107. Thereafter, when the vacuum is applied by the vacuum hole 103, the substrate 107 and the first sealing ring 104a are fixed in vacuum while the vacuum is maintained in the first space 5a.

In this case, the vacuum space may be walked by the first space 5a alone, and may be sequentially walked from the first space 5a to the third space 5c. You can walk up to three spaces (5c) at the same time.

At this time, since the second sealing ring 104b and the third sealing ring 104c are not in contact with the mold or the mask, the photosensitive material remaining in the center is pushed to the edge as the mold and the central part of the substrate are compressed. .

Then, as shown in FIG. 3, the height of the second sealing ring 104b is adjusted to the height of the first sealing ring 104a, whereby the substrate 107 and the second sealing ring 104b come into contact with the mold or mask. Done. And excess photoresist is pushed to the edge.

Then, as shown in FIG. 4, the height of the third sealing ring 104c is adjusted to the height of the first sealing ring 104a so that the substrate 107 and the third sealing ring 104c come into contact with the mold or mask at this portion. And excess photoresist is pushed out of the substrate 107.

As such, when the first to third sealing rings 104a to 104c are used to maintain the same height from the center to the edge of the substrate, the substrate 107 and the entire mold or mask may be in uniform contact. . Accordingly, a photosensitive film having a uniform thickness may be formed at the center and the edge of the substrate 107. Alternatively, the photosensitive layer may be formed such that the center portion is thinner than the thickness of the edge portion.

Although the three sealing rings have been described above, the process of FIGS. 2 and 3 may be repeated after placing more sealing rings according to the size of the substrate.

On the other hand, if the fourth sealing ring 104d is kept higher than the first to third sealing rings 104a to 104c, a vacuum may be applied between the substrate 107 and the mold or the mask, so as to be placed on the substrate 107. Bubbles and the like trapped in the applied photosensitive material can be removed. After removing the air bubbles for a suitable time, the height of the fourth sealing ring 104d is lowered to be the same as the first to third sealing rings 104a to 104c, or the height is kept higher or a little lower. ) May come into contact with the mold or mask.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of right.

5a: first space 5b: second space
5c: third space 5d: fourth space
40: first fine adjustment device 42: second fine adjustment device
44: third fine adjustment device 46: fourth fine adjustment device
40: vacuum pump 100: support
103: vacuum hole 104: sealing ring
104a: first sealing ring 104b: second sealing ring
104c: third sealing ring 104d: fourth sealing ring
105: opening 200: vacuum chuck
400: fine adjustment device 500: space

Claims (1)

support fixture,
A plurality of sealing rings positioned on the support,
Fine control device connected to the sealing ring and respectively adjusting the height of the sealing ring
Imprint vacuum chuck comprising a.


KR1020110135627A 2011-12-15 2011-12-15 Vacuum chuck for imprint KR20130068453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110135627A KR20130068453A (en) 2011-12-15 2011-12-15 Vacuum chuck for imprint

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110135627A KR20130068453A (en) 2011-12-15 2011-12-15 Vacuum chuck for imprint

Publications (1)

Publication Number Publication Date
KR20130068453A true KR20130068453A (en) 2013-06-26

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Application Number Title Priority Date Filing Date
KR1020110135627A KR20130068453A (en) 2011-12-15 2011-12-15 Vacuum chuck for imprint

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101674498B1 (en) * 2016-01-08 2016-11-09 김문수 Vacuum chuck
CN109887877A (en) * 2019-01-02 2019-06-14 长江存储科技有限责任公司 A kind of wafer fixed station and wafer bonding equipment
US20220359260A1 (en) * 2019-07-18 2022-11-10 Taiwan Semiconductor Manufacturing Co., Ltd. Chuck Design and Method for Wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101674498B1 (en) * 2016-01-08 2016-11-09 김문수 Vacuum chuck
CN109887877A (en) * 2019-01-02 2019-06-14 长江存储科技有限责任公司 A kind of wafer fixed station and wafer bonding equipment
US20220359260A1 (en) * 2019-07-18 2022-11-10 Taiwan Semiconductor Manufacturing Co., Ltd. Chuck Design and Method for Wafer

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