JP2004133302A - Method for adhering photomask and apparatus therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for adhering a photomask in which production of an air reservoir can be definitely prevented, the evacuation time is significantly reduced and the production efficiency can be improved. <P>SOLUTION: A sealed space 27 between a metal thin plate 11 and a photomask 21 opposing to the metal thin plate 11 is evacuated to tightly adhere the metal thin plate 11 with the photomask 12. When the sealed space 27 is evacuated, the evacuation pressure is stepwise increased, with the evacuation pressure in the initial state controlled to 1.5% to 2.5% of the maximum evacuation pressure as possible and the evacuation time in the initial stage controlled to 40% to 60% of the total evacuation time. By optimizing the evacuation pressure and the evacuation time in the initial stage, production of the air reservoir is surely prevented as well as the evacuation time is reduced and the production efficiency is improved. <P>COPYRIGHT: (C)2004,JPO

Description

【００４３】
この結果を統計学的処理で解析したところ、第１段階での排気圧力つまり電子式真空レギュレータ３０の開き量、およびシリンダ３３のロッド３４の突出量がそれぞれ主要因であることが分かった。そして、次の表２は、この結果を考慮した複数の実施例について試みた結果を示す。
【００４４】
【表２】

【００４５】
これら実施例から、好ましい干渉縞が得られかつ所望の露光に要する時間短縮すなわち排気時間の短縮が得られる第１段階の排気圧力は最大排気圧力の１．５％〜２．５％のとき、つまり電子式真空レギュレータ３０の開き量が１．５％〜２．５％のときとなる。第１段階の排気圧力が最大排気圧力の１．５％より小さいと、干渉縞の状態は問題ないが、排気時間が所望の時間より延び好ましくなく、また、２．５％より大きいと、素ガラスを用いてチェックしたときの金属薄板１１への初期の密着状態が所望の範囲より大きくなり、空気溜まりが発生し易くなるために好ましくない。
【００４６】
したがって、最大排気圧力が８０ｋＰａのとき、好ましい第１段階の排気圧力は１．２ｋＰａ〜２．０ｋＰａとなる。１．２ｋＰａより小さいと、干渉縞の状態は問題ないが、排気時間が所望の時間より延び好ましくなく、また、２．０ｋＰａより大きいと、空気溜まりが発生し易くなるために好ましくない。
【００４７】
また、排気工程における総排気時間は２０秒〜４０秒とすることで、排気に要する時間を適正化できる。すなわち、２０秒より短いと、金属薄板１１とフォトマスク２１との所望の密着状態が得られず、また、４０秒より長いと目的とする時間短縮とならない。
【００４８】
また、第１段階の排気時間は総排気時間の４０％〜６０％とすることで、第１段階の排気に要する時間を最適化できる。すなわち、４０％より短いと、金属薄板１１とフォトマスク２１との所望の密着状態が得られず、また、６０％より長いと、目的とする時間短縮とならない。
【００４９】
このように、金属薄板１１とフォトマスク２１との間の密閉空間を排気する排気圧力を段階的に高めるとともに、初期段階の排気圧力を排気可能とする最大排気圧力の１．５％〜２．５％すなわち最大排気圧力が８０ｋＰａのときに１．２ｋＰａ〜２．０ｋＰａ、および初期段階の排気時間を総排気時間の４０％〜６０％とすることにより、初期段階での排気圧力と排気時間との最適化を図り、空気溜まりの発生を確実に防止できるとともに排気時間を十分に短縮できる。そのため、高品位のシャドウマスク４５を得ることができ、シャドウマスク４５の生産効率を向上できるとともに、露光装置１２の台数を増やさずに生産性を向上できる。
【００５０】
なお、前記実施の形態ではシャドウマスクについて説明したが、半導体集積回路装置に用いられるリードフレームなどの他の被露光部材にも適用でき、同様の作用効果が得られる。
【００５１】
【発明の効果】
本発明によれば、被露光部材とフォトマスクとの間の密閉空間を排気する排気圧力を段階的に高めるとともに、初期段階の排気圧力を排気可能とする最大排気圧力の１．５％〜２．５％、および初期段階の排気時間を総排気時間の４０％〜６０％とすることにより、初期段階での排気圧力と排気時間との最適化を図り、空気溜まりの発生を確実に防止できるとともに排気時間を十分に短縮でき、生産効率を向上できる。
【００５２】
また、被露光部材とフォトマスクとの間の密閉空間を排気する排気圧力を段階的に高めるとともに、初期段階の排気圧力を１．２ｋＰａ〜２．０ｋＰａ、および初期段階の排気時間を総排気時間の４０％〜６０％とすることにより、初期段階での排気圧力と排気時間との最適化を図り、空気溜まりの発生を確実に防止できるとともに排気時間を十分に短縮でき、生産効率を向上できる。
【図面の簡単な説明】
【図１】本発明のフォトマスク密着方法およびその装置の一実施の形態を示す露光装置による金属薄板とフォトマスクとの密着過程の説明図である。
【図２】同上露光装置による金属薄板とフォトマスクとの密着状態の説明図である。
【図３】同上露光装置の側面図である。
【図４】同上露光装置の正面図である。
【図５】同上露光装置による露光工程を（ａ）〜（ｅ）の順に説明する説明図である。
【符号の説明】
１１　　被露光部材としての金属薄板
２１　　フォトマスク
２２　　フォトマスク密着装置
２３　　保持フレーム
２７　　密閉空間
２８　　密閉手段
３０　　排気圧力調整手段としての電子式真空レギュレータ
３１　　制御手段
３２　　規制手段[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a photomask adhesion method and an apparatus for bringing a photomask into close contact with a member to be exposed.
[0002]
[Prior art]
For example, metal parts such as a shadow mask used for a color picture tube and a lead frame used for a semiconductor integrated circuit device are mainly manufactured using a photo-etching method.
[0003]
In the manufacturing process of the shadow mask using this photo-etching method, a step of forming a photosensitive resin layer on the surface of a thin metal plate which is a member to be exposed, and a step of forming a predetermined pattern on the surface of the thin metal plate through a photomask. An exposing step of exposing, a developing step of removing a non-exposed portion of the photosensitive resin layer on the surface of the metal sheet to form a resist film having a predetermined pattern, an etching step of etching the surface of the metal sheet, and a surface of the metal sheet. At least a stripping step of stripping the resist film is provided.
[0004]
In the exposure step, a thin metal plate was arranged between the pair of photomasks, and the holding frames holding the peripheral portions of the respective photomasks were approached by a predetermined drive mechanism, and were set on the sides of the pair of holding frames facing each other. A closed space in which a thin metal plate is disposed between a pair of photomasks is formed by contacting the packing for contact. By exhausting the air in the closed space, a force for shrinking the closed space acts, and the photomask adheres to the thin metal plate by utilizing the elasticity of the packing. The thin metal plate is exposed through the photomask in a state where the photomask and the thin metal plate are in close contact with each other.
[0005]
However, when the photomask comes into close contact with the thin metal plate by exhausting the enclosed space, a very small air pool is likely to be generated near the center between the photomask and the thin metal plate. Has a very small diameter, and unevenness may occur.
[0006]
In order to prevent the occurrence of such an air pocket, a method of increasing the exhaust time at a low exhaust pressure at the initial drop of exhaust gas is adopted. By the way, in the production of a shadow mask, reducing the time required for the production is an important item from the viewpoint of improving production efficiency. The time required for the exposure step is generally 140 seconds, of which the operation time is 30 seconds, the evacuation time is 60 seconds, the exposure time is 50 seconds, and the evacuation rate is the longest. If the method of taking a long time at a low exhaust pressure in the initial step of exhaust gas is adopted, the total time required for the exposure process becomes long, so the number of exposure apparatuses required in the manufacturing process increases, and accordingly a large installation space is required. It is necessary, which is not preferable in terms of production efficiency.
[0007]
Therefore, in order to prevent the generation of air pockets and shorten the evacuation time, the movement of the holding frame that holds the photomask during the evacuation is forcibly restricted, so that the photomask is bent, and the vicinity of the center of the photomask is bent. There is a method of increasing the area of close contact between the photomask and the metal thin plate by releasing the restriction on the movement of the holding frame after bringing the thin film into close contact with the metal thin plate (for example, see Patent Document 1).
[0008]
[Patent Document 1]
JP-A-2000-235266 (pages 5 to 6, FIG. 8)
[0009]
[Problems to be solved by the invention]
However, there is a method of forcibly restricting the movement of the holding frame that holds the photomask during the evacuation in order to prevent the generation of air pockets and shorten the evacuation time. However, the evacuation pressure and the evacuation time in the initial stage are also available. However, since the optimal relationship with the air cannot be sufficiently elucidated, there is a problem that it is not possible to sufficiently prevent the generation of air pockets and to shorten the exhaust time, and to sufficiently improve the production efficiency.
[0010]
The present invention has been made in view of the above points, and provides a photomask adhesion method and an apparatus thereof that can reliably prevent the generation of air pockets, can sufficiently reduce the evacuation time, and can improve production efficiency. Aim.
[0011]
[Means for Solving the Problems]
The present invention is a photomask contacting method for evacuating a sealed space between a member to be exposed and a photomask facing the member to be exposed, and bringing the member to be exposed into close contact with the photomask. When evacuating the enclosed space between the photomask and the exhaust mask, the exhaust pressure is gradually increased, and 1.5% to 2.5% of the maximum exhaust pressure enabling the initial stage exhaust pressure to be exhausted, and the initial stage. Is set to 40% to 60% of the total evacuation time.
[0012]
The present invention also provides a photomask contacting method for exhausting a closed space between a member to be exposed and a photomask facing the member to be exposed, and bringing the member to be exposed into close contact with the photomask. When evacuating the sealed space between the member and the photomask, the evacuation pressure is increased in a stepwise manner, and the evacuation pressure in the initial stage is increased from 1.2 kPa to 2.0 kPa, and the evacuation time in the initial stage is equal to the total evacuation time. 40 to 60%.
[0013]
When exhausting the enclosed space between the exposed member and the photomask, the exhaust pressure and the exhaust time in the initial stage are optimized to reliably prevent the occurrence of air pockets and reduce the exhaust time. Shorten sufficiently to improve production efficiency.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0015]
1 to 4, for example, in a manufacturing apparatus for manufacturing a shadow mask, an exposure apparatus 12 for exposing a predetermined pattern of the shadow mask to both front and back surfaces of a thin metal plate 11 as a member to be exposed, which is a material of the shadow mask. Is shown.
[0016]
The metal thin plate 11 is supplied in a state of being continuous in a belt shape and wound in a coil shape, and a plurality of shadow masks are continuously formed in the longitudinal direction of the metal thin plate 11.
[0017]
The exposure device 12 has a machine base 15, an exposure unit 16 for exposing the metal sheet 11 is installed at the center on the machine base 15, and the coil-shaped metal sheet 11 before exposure is placed on one side of the exposure unit 16. An installation box 17 for storing and supplying the metal sheet 11 to the exposure unit 16 is installed, and a winding box 18 for winding the exposed metal sheet 11 from the exposure unit 16 is installed on the other side of the exposure unit 16. I have.
[0018]
The exposure unit 16 has a pair of photomasks 21 for exposing the pattern of the shadow mask on both the front and back surfaces of the thin metal plate 11. Each of the photomasks 21 is made of, for example, glass and is formed in a rectangular plate shape, and a mask pattern for exposing the pattern of the shadow mask is formed. As the mask pattern, a mask pattern for a small hole image is formed on one photomask 21 and a mask pattern for a large hole image is formed on the other photomask 21.
[0019]
The pair of photomasks 21 are adhered to both the front and back surfaces of the thin metal plate 11 by the photomask adhesion device 22. The photomask contacting device 22 has a pair of rectangular frame-shaped holding frames 23 that hold the periphery of each photomask 21. The pair of holding frames 23 are supported by an interlocking mechanism 25 via a link lever 24 so as to be openable and closable about the thin metal plate 11, and are opened and closed by an open / close drive unit such as a cylinder (not shown).
[0020]
An annular packing 26 is attached to surfaces of the pair of holding frames 23 facing each other. When the pair of holding frames 23 are closed, the packings 26 come into contact with each other and come into close contact with each other, so that a closed space 27 surrounded by the pair of photomasks 21, the pair of holding frames 23 and the pair of packings 26 is formed. A pair of photomasks 21, a pair of holding frames 23, a pair of packings 26, and the like constitute a sealing unit 28 that forms a sealed space 27 between the thin metal plate 11 and the photomask 21 facing the thin metal plate 11. Have been.
[0021]
An exhaust passage 29 communicating with the closed space 27 is connected to one of the holding frames 23. The exhaust passage 29 is connected to an electronic vacuum regulator 30 as an exhaust pressure adjusting means for adjusting the exhaust pressure. Connected to an exhaust device having The electronic vacuum regulator 30 whose primary side is connected to the exhaust device and whose secondary side is connected to the exhaust passage 29 is controlled by the control means 31. The control means 31 increases the exhaust pressure for exhausting the closed space 27 between the thin metal plate 11 and the photomask 21 in a stepwise manner and exhausts the initial stage exhaust pressure, that is, the secondary pressure of the electronic vacuum regulator 30. It has a function of controlling the maximum possible exhaust pressure, that is, 1.5% to 2.5% of the primary side pressure of the electronic vacuum regulator 30, and the initial stage exhaust time to 40% to 60% of the total exhaust time. are doing. When the maximum exhaust pressure is 80 kPa, the initial exhaust pressure is 1.2 kPa to 2.0 kPa, and the total exhaust time is 20 seconds to 40 seconds.
[0022]
At least four corners of one holding frame 23 are provided with regulating means 32 for regulating the movement of the holding frame 23 in the initial stage of exhausting the closed space 27 between the thin metal plate 11 and the photomask 21. Each regulating means 32 has a cylinder 33 attached to one holding frame 23, and a rod 34 of this cylinder 33 advances and retreats from one holding frame 23 to the other holding frame 23, and this rod 34 To restrict the approaching movement of the pair of holding frames 23.
[0023]
Next, a manufacturing process of the shadow mask will be described with reference to FIG.
[0024]
For example, an amber material having a thickness of, for example, 0.12 mm is used as the thin metal plate 11, and both surfaces of the thin metal plate 11 are degreased and washed, and then a water-soluble photosensitive solution containing casein and ammonium bichromate is applied and dried. A photosensitive resin layer 41 is formed as shown in FIG.
[0025]
The thin metal plate 11 coated with the photosensitive resin layer 41 is mounted on the exposure device 12, and as shown in FIG. 5B, the pair of photomasks 21 are brought into close contact with the thin metal plate 11 by the exposure device 12, and The mask pattern for small hole image is exposed on one surface of the thin metal plate 11 through the mask 21, and the mask pattern for large hole image is exposed on the other surface of the thin metal plate 11 through the other photomask 21.
[0026]
The metal sheet 11 is taken out of the exposure device 12, and as shown in FIG. 5C, the unexposed portion, that is, the uncured portion of the photosensitive resin layer 41 is dissolved and developed with hot water, and the remaining photosensitive resin layer 41 is developed. By applying a hardening / burning process to the resist film 43, a resist film 43 having an opening 42 through which the metal sheet 11 is exposed is formed. The opening 42 of the resist film 43 on one surface of the thin metal plate 11 is for a small hole image, and the opening 42 of the resist film 43 on the other surface is for a large hole image.
[0027]
The etching liquid is brought into contact with the metal sheet 11, and the metal sheet 11 exposed from the opening 42 of the resist film 43 is etched to form a mask hole 44 in the metal sheet 11, as shown in FIG. Ferric chloride or the like having a temperature of 50 to 70 ° C. and a specific gravity of 1.470 to 1.520 is used as an etching solution, and this etching solution is sprayed onto the metal sheet 11 at a pressure of 0.5 to 4.0 kg / cm ^2. . The etching is two-stage etching. That is, in the first stage of etching, etching is performed from both sides of the metal thin plate 11 to form a small hole concave portion for a small hole image on one surface of the metal thin plate 11 and a large hole concave portion for a large hole image on the other surface. I do. Next, the metal sheet 11 is washed with water and dried, and then, for example, a photocurable resin is applied to one surface of the metal sheet 11 by a gravure coating method or the like, and the resin is irradiated with light to form the small sheet formed in the previous etching. An etching prevention layer that completely fills the concave portion on the hole side is formed. Subsequently, as a second stage of the etching, the other surface of the metal sheet 11 having the large hole concave portion for the large hole image is etched to form a mask hole 44 penetrating from the large hole concave portion side to the small hole concave portion.
[0028]
The etched metal sheet 11 was conveyed into a stripping tank using an aqueous solution obtained by adding a chelating agent to caustic soda as a stripping solution, and the stripping solution was brought into contact with the resist film 43 to swell and weaken the resist film 43. Thereafter, the swelled and weakened resistite film 43 is removed by spray cleaning to obtain a shadow mask 45 shown in FIG.
[0029]
Next, a method of attaching a photomask by the photomask attaching device 22 of the exposure apparatus 12 will be described.
[0030]
First, as shown in FIG. 1, the holding frame 23 holding the pair of photomasks 21 is moved closer by the interlocking mechanism 25 until the packings 26 come into close contact with each other to form a closed space 27. At this point, the pair of photomasks 21 are at positions shown by two-dot lines in FIG. 1 and are not in close contact with the metal thin plate 11.
[0031]
At this time, the rod 34 of the cylinder 33 of each regulating means 32 is made to protrude by a predetermined amount. When the amount of protrusion of the rod 34 is 0 mm when the pair of holding frames 23 in which the pair of photomasks 21 are in close contact with the thin metal plate 11 are set to 0 mm, the elasticity of the packing 26 and the diameter thereof also increase. Although it depends, it is preferably 2.5 mm to 4.5 mm. If it is smaller than 2.5 mm, air stagnation tends to occur near the center of the photomask 21, and if it is larger than 4.5 mm, a desired exhaust level, that is, a vacuum level is not reached within a desired time, which is not preferable.
[0032]
Then, the gas is exhausted through an exhaust passage 29 communicating with the closed space 27, and the exhaust pressure at this time is increased stepwise by an electronic vacuum regulator 30, here in three steps.
[0033]
In the first stage exhaust, the exhaust pressure for exhausting the closed space 27 is set so as to obtain 2% of the maximum exhaust pressure applied to the electronic vacuum regulator 30, and the exhaust time is set to 16 seconds.
[0034]
In the second-stage exhaust, the exhaust pressure for exhausting the closed space 27 is set so that 15% of the maximum exhaust pressure applied to the electronic vacuum regulator 30 is obtained, and the exhaust time is set to 4 seconds.
[0035]
In the third stage exhaust, the exhaust pressure for exhausting the closed space 27 is set so as to obtain 20% of the maximum exhaust pressure applied to the electronic vacuum regulator 30, and the exhaust time is set to 10 seconds.
[0036]
Therefore, the total evacuation time from the first stage to the third stage is 30 seconds.
[0037]
When the closed space 27 is evacuated, a force for contracting the closed space 27 acts. However, since the cylinder 33 of the restricting means 32 restricts the movement of the peripheral portions of the pair of photomasks 21, FIG. As shown by the solid line, the vicinity of the center of the pair of photomasks 21 is bent so as to approach the metal thin plate 11, and the vicinity of the center of the pair of photomasks 21 adheres to the metal thin plate 11.
[0038]
At this time, the close contact area near the center between the pair of photomasks 21 and the metal thin plate 11 can be adjusted to a desired range by the amount of protrusion of the rod 34 from the cylinder 33 of the restricting means 32. Air in the vicinity of the center between the thin metal plate 11 is reliably exhausted to prevent the occurrence of air pockets.
[0039]
After completion of the third-stage exhaust, the cylinder 33 of each regulating means 32 is actuated to release the regulation of the movement around the pair of photomasks 21 so that the packing 26 becomes elastic as shown in FIG. Then, the peripheral portions of the pair of photomasks 21 are in close contact with the metal thin plate 11, and the entire pair of the photomasks 21 and the metal thin plate 11 are in close contact with each other. According to the experiment, even after the completion of the second-stage exhaust, even if the cylinder 33 of each regulating means 32 is operated to release the regulation of the movement of the peripheral portions of the pair of photomasks 21, the shadow mask 45 is not moved. No effect on quality was observed.
[0040]
When the maximum exhaust pressure is 80 kPa, the first-stage exhaust pressure set to 2% of the maximum exhaust pressure is 1.6 kPa, the second-stage exhaust pressure set to 15% of the maximum exhaust pressure is 12 kPa, and the maximum exhaust pressure is set to 15% of the maximum exhaust pressure. The exhaust pressure in the third stage, which is set to 20% of the pressure, is 16 kPa. Therefore, when the maximum exhaust pressure is 80 kPa, the exhaust pressure of the closed space 27 after the first stage is 1.6 × 16 = 25.6 kPa, and the exhaust pressure of the closed space 27 after the second stage is 25.6+ (12 × 4) = 73.6 kPa, and the exhaust pressure of the sealed space 27 after the third stage is 25.6 + 73.6 + (16 × 10) = 233.6 kPa.
[0041]
By the way, in order to prevent the air accumulation which is likely to be generated near the center of the photomask 21, the exhaust condition of the first stage which is the initial stage is important. In order to determine the optimal exhaust condition of the first stage, the following table is used. An experiment was conducted on a combination of the six factors and the three levels shown in 1. In the experiment, the elemental glass for the photomask 21 was used, and the judgment was made based on the pattern of interference fringes by visual perception.
[0042]
[Table 1]

[0043]
Analysis of this result by statistical processing revealed that the exhaust pressure in the first stage, that is, the opening amount of the electronic vacuum regulator 30 and the protrusion amount of the rod 34 of the cylinder 33 were the main factors, respectively. Table 2 below shows the results of trials performed on a plurality of examples in consideration of the results.
[0044]
[Table 2]

[0045]
From these examples, it is found that the first stage exhaust pressure at which preferable interference fringes are obtained and the time required for desired exposure, that is, the exhaust time is shortened, is 1.5% to 2.5% of the maximum exhaust pressure. That is, the opening amount of the electronic vacuum regulator 30 is 1.5% to 2.5%. If the exhaust pressure in the first stage is less than 1.5% of the maximum exhaust pressure, the state of the interference fringes is not a problem. However, if the exhaust time is longer than desired, it is not preferable. The initial state of adhesion to the metal sheet 11 when checked using glass is larger than a desired range, which is not preferable because air accumulation is likely to occur.
[0046]
Therefore, when the maximum exhaust pressure is 80 kPa, the preferable first-stage exhaust pressure is 1.2 kPa to 2.0 kPa. When the pressure is less than 1.2 kPa, the state of the interference fringes is not a problem, but the evacuation time is longer than a desired time, which is not preferable. On the other hand, when the pressure is more than 2.0 kPa, air accumulation tends to occur, which is not preferable.
[0047]
Further, by setting the total evacuation time in the evacuation step to 20 seconds to 40 seconds, the time required for evacuation can be optimized. That is, if it is shorter than 20 seconds, a desired close contact state between the metal thin plate 11 and the photomask 21 cannot be obtained, and if it is longer than 40 seconds, the intended time cannot be shortened.
[0048]
Further, the time required for the first-stage exhaust can be optimized by setting the first-stage exhaust time to be 40% to 60% of the total exhaust time. That is, if it is shorter than 40%, a desired close contact state between the metal sheet 11 and the photomask 21 cannot be obtained, and if it is longer than 60%, the intended time cannot be shortened.
[0049]
As described above, the exhaust pressure for exhausting the closed space between the thin metal plate 11 and the photomask 21 is increased stepwise, and the exhaust pressure in the initial stage can be exhausted by 1.5% to 2. By setting 5%, that is, 1.2 kPa to 2.0 kPa when the maximum exhaust pressure is 80 kPa, and making the initial stage exhaust time 40% to 60% of the total exhaust time, the initial stage exhaust pressure and exhaust time can be reduced. , The occurrence of air accumulation can be reliably prevented, and the exhaust time can be sufficiently reduced. Therefore, a high-quality shadow mask 45 can be obtained, the production efficiency of the shadow mask 45 can be improved, and the productivity can be improved without increasing the number of the exposure apparatuses 12.
[0050]
In the above embodiment, the shadow mask has been described. However, the present invention can be applied to other exposed members such as a lead frame used in a semiconductor integrated circuit device, and the same operation and effect can be obtained.
[0051]
【The invention's effect】
According to the present invention, the exhaust pressure for exhausting the sealed space between the member to be exposed and the photomask is increased stepwise, and 1.5% to 2% of the maximum exhaust pressure at which the initial exhaust pressure can be exhausted. By adjusting the exhaust time in the initial stage to 0.5% and the exhaust time in the initial stage to be 40% to 60% of the total exhaust time, the exhaust pressure and the exhaust time in the initial stage can be optimized, and the occurrence of air pockets can be reliably prevented. In addition, the exhaust time can be sufficiently reduced, and the production efficiency can be improved.
[0052]
In addition, the exhaust pressure for exhausting the sealed space between the exposed member and the photomask is increased stepwise, the initial exhaust pressure is set to 1.2 kPa to 2.0 kPa, and the initial exhaust time is set to the total exhaust time. 40% to 60%, the exhaust pressure and the exhaust time in the initial stage can be optimized, air bubbles can be reliably prevented from being generated, the exhaust time can be sufficiently reduced, and production efficiency can be improved. .
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a process of adhering a thin metal plate and a photomask by an exposure apparatus showing an embodiment of the photomask adhering method and apparatus of the present invention.
FIG. 2 is an explanatory diagram of a state of close contact between a metal thin plate and a photomask by the exposure apparatus.
FIG. 3 is a side view of the exposure apparatus.
FIG. 4 is a front view of the same exposure apparatus.
FIG. 5 is an explanatory view for explaining an exposure step by the exposure apparatus in the order of (a) to (e).
[Explanation of symbols]
11 Thin metal plate 21 as a member to be exposed 21 Photomask 22 Photomask adhesion device 23 Holding frame 27 Sealed space 28 Sealing means 30 Electronic vacuum regulator 31 as exhaust pressure adjusting means 31 Control means 32 Regulation means

Claims (8)

A photomask adhesion method for evacuating a sealed space between a member to be exposed and a photomask facing the member to be exposed, and bringing the member to be exposed into close contact with the photomask,
When exhausting the closed space between the member to be exposed and the photomask, the exhaust pressure is increased stepwise, and 1.5% to 2.5% of the maximum exhaust pressure at which the initial stage exhaust pressure can be exhausted. Wherein the evacuation time in the initial stage is 40% to 60% of the total evacuation time. A photomask adhesion method for evacuating a sealed space between a member to be exposed and a photomask opposed to the member to be exposed, and bringing the member to be exposed into close contact with the photomask,
When evacuating the sealed space between the member to be exposed and the photomask, the evacuation pressure is increased stepwise, the evacuation pressure in the initial stage is increased from 1.2 kPa to 2.0 kPa, and the evacuation time in the initial stage is the total evacuation time. A photomask adhesion method, wherein the time is 40 to 60% of the time. 3. The method according to claim 1, wherein the total evacuation time is 20 seconds to 40 seconds. 4. The method according to claim 1, wherein when the closed space between the member to be exposed and the photomask is evacuated, close contact between the member to be exposed and a peripheral portion of the photomask in an initial stage is suppressed. Photomask adhesion method. A photomask facing the member to be exposed,
Sealing means for forming a sealed space between the exposed member and a photomask facing the exposed member,
Exhaust pressure adjusting means for adjusting the exhaust pressure for exhausting the closed space,
When exhausting the enclosed space, the exhaust pressure is increased stepwise by the exhaust pressure adjusting means, and 1.5% to 2.5% of the maximum exhaust pressure at which the initial stage exhaust pressure can be exhausted, and the initial stage. Control means for controlling the evacuation time to 40% to 60% of the total evacuation time. A photomask facing the member to be exposed,
Sealing means for forming a sealed space between the exposed member and a photomask facing the exposed member,
Exhaust pressure adjusting means for adjusting the exhaust pressure for exhausting the closed space,
When the closed space is evacuated, the exhaust pressure is increased stepwise by the exhaust pressure adjusting means, the initial exhaust pressure is set to 1.2 kPa to 2.0 kPa, and the initial exhaust time is set to a total exhaust time of 40 kPa. %. A photomask adhesion device, comprising: control means for controlling the concentration of the photomask to 60%. 7. The apparatus according to claim 5, wherein the total evacuation time is 20 seconds to 40 seconds. The sealing means holds the peripheral portion of the photomask and is movable in accordance with the close contact of the photomask with the member to be exposed. 8. The photomask adhesion device according to claim 5, further comprising:

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