JP2011114094A - Illuminator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminator capable of reducing color unevenness of irradiated light on an irradiated face. <P>SOLUTION: The illuminator 20 comprises: a light emitting apparatus 10 containing LED chips 1 as a plurality of light-emitting elements mounted on one surface 2a of a mounting substrate 2 and a wavelength converting part 3 so disposed as to cover the LED chips 1 and convert the wavelength of light irradiated from the LED chips 1; and a lens 5 as a light distribution controlling part for distribution-controlling light irradiated from the light-emitting apparatus 10 into a predetermined direction where the light-emitting apparatus 10 comprises along a periphery of a light irradiating face 10a, a plurality of light-emitting sites for emitting light which becomes a complementary color relative to a luminescent color of light irradiated from the periphery based on a luminescent color at a central part of the light-emitting face 10a when viewing the side of the light-emitting face 10a of the light-emitting apparatus 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a lighting device using a light emitting device including a light emitting element and a wavelength conversion unit.

  In recent years, a light-emitting element composed of a semiconductor light-emitting element such as an LED chip and a phosphor that coats the light-emitting element and absorbs at least a part of the light from the light-emitting element and converts the wavelength to emit complementary fluorescence are contained. For example, a light emitting device that includes a wavelength conversion unit made of a translucent material and emits white light in which blue light from a light emitting element and yellow light from a wavelength conversion unit are mixed has been developed. This type of light-emitting device is used as a lighting device as the light output of the light-emitting element is improved.

  As an illumination device to which such a light emitting device is applied, for example, as shown in FIGS. 7A and 7B, a plurality of light emitting elements 1 ′ and all of the light emitting elements 1 ′ are mounted on a mounting substrate 2 ′. And a wavelength conversion unit 3 ′ for converting the wavelength of light emitted from the light emitting element 1 ′, and a light emitting direction of the plurality of light emitting elements 1 ′, and disposed via the air layer 11. In addition, there is known an illuminating device 20 ′ including a lens 5 ′ serving as a light distribution control unit for controlling light distribution from a light emitting element 1 ′ and a wavelength conversion unit 3 ′ in a predetermined direction ( For example, see Patent Document 1).

  The lighting device 20 ′ has a conductor pattern 12 formed on the mounting substrate 2 ′, and is configured to be able to supply power to the light emitting element 1 ′ from an external connection terminal 13 that is an end of the conductor pattern 12. Here, the light distribution can be changed by changing the shapes of the light incident surface 5b 'and the light emitting surface 5a' of the lens 5 '.

  In the illuminating device 20 ′ configured as described above, for example, the light emitting element 1 ′ emits blue light, and the wavelength conversion unit 3 ′ converts the wavelength of the blue light to emit yellow fluorescence, which is emitted from the light emitting element 1 ′. The mixed color light (white light) in which the blue light and the yellow light emitted from the wavelength conversion unit 3 ′ are mixed is radiated to the outside from the lens 5 ′ serving as the light distribution control unit disposed via the air layer 11. Let

  As a result, the lighting device 20 ′ adjusts the amount of light that the mixed color light emitted from the lighting device 20 ′ reaches the irradiated surface by the difference in refractive index between the air layer 11 and the lens 5 ′. It is said that illuminance variation can be reduced.

JP 2006-190723 A

  By the way, in the illuminating device 20 ′ having the above-described configuration, the light emitted from the wavelength conversion unit 3 ′ is efficiently incident on the lens 5 ′ serving as the light distribution control unit. The circular wavelength conversion unit 3 ′ (see FIG. 7A) is arranged so as to match the central part. Therefore, in the irradiated surface of the light emitted from the illuminating device 20 ′, the central portion of the light emitting surface (see FIG. 7C) in the wavelength conversion unit 3 ′ of the illuminating device 20 ′ is located at the center of the irradiated surface. The light emitted from 3e ′ is irradiated, and the light emitted from the peripheral portion 3d ′ on the light emitting surface is irradiated to the periphery of the irradiated surface. That is, the emission color on the light exit surface of the illumination device 20 'is reflected on the irradiated surface side.

  In addition, the wavelength conversion unit 3 ′ covers the plurality of light emitting elements 1 ′ so as to cover the entire light emitting element 1 ′, and the peripheral portion on the light emission surface of the wavelength conversion unit 3 ′ is disposed to the outside of the light emitting element 1 ′.

  Here, the light emitting element 1 ′ has not only the light incident on the wavelength conversion unit 3 ′ in the light emitting direction along the thickness direction of the light emitting element 1 ′ but also the light emitting direction along the thickness direction of the light emitting element 1 ′. Light is emitted in the direction deviated from. Thereby, in the peripheral part of wavelength conversion part 3 ', the optical path length of the light shifted from the light emission direction along the thickness direction of light emitting element 1' which passes wavelength conversion part 3 'is the thickness direction of light emitting element 1'. It becomes longer than the optical path length of the light radiated | emitted in the light emission direction along. Of the light emitted from the illuminating device 20 ′, the emission color of the light emitted from the peripheral portion of the wavelength conversion unit 3 ′ is wavelength-converted by the length of the optical path length of the light transmitted through the wavelength conversion unit 3 ′. Since the ratio of the wavelength component of the yellow light to the wavelength component of the blue light increases, the emission color with a yellowish color temperature and a low color temperature is obtained. As a result, even if the color of the mixed color light emitted from the lighting device 20 ′ is white at the center of the irradiated surface, the color at the peripheral portion of the irradiated surface is yellowish with a low color temperature. The color of the surface to be irradiated may become uneven.

  In the illumination device 20 ′, the uniformity of the emission color of the irradiation light on the irradiated surface is more strongly required, and the configuration of the illumination device 20 ′ described above is not sufficient, and further improvement is required. .

  This invention is made | formed in view of the said reason, The objective is to provide the illuminating device which can reduce the color nonuniformity in the to-be-irradiated surface of the light radiated | emitted from the illuminating device.

  The invention according to claim 1 includes a plurality of light emitting elements mounted on one surface of the mounting substrate, a wavelength conversion unit arranged to cover the light emitting elements, and wavelength-converting light emitted from the light emitting elements. And a light distribution control unit that controls light distribution of the light emitted from the light emitting device in a predetermined direction. The light emitting device has a light emitting surface side of the light emitting device. As seen from the above, a plurality of light emitting portions that emit light that is complementary to the light emission color of the light emitted from the peripheral portion of the light emitting surface on the basis of the light emitting color at the central portion of the light emitting surface. It is characterized by being provided along.

  According to this invention, the light emitting device emits light emitted from the peripheral portion of the light emitting surface with reference to the light emission color at the center of the light emitting surface when viewed from the light emitting surface side of the light emitting device. The light emitted from the central portion is emitted from the peripheral portion of the light emitting surface by providing the peripheral portion with a plurality of light emitting portions that emit light that is complementary to the color. Thus, it is possible to improve the uniformity of the emission color of the light exit surface. Therefore, the light emitted from the lighting device can reduce color unevenness on the irradiated surface.

  According to a second aspect of the present invention, in the first aspect of the present invention, the plurality of light emitting portions are arranged uniformly along the peripheral portion.

  According to the present invention, the plurality of light emitting portions are evenly arranged along the peripheral portion, so that the emission color of light emitted from the peripheral portion of the light emitting surface is changed from the central portion. It can be made closer to the emission color of the emitted light, and the uniformity of the emission color of the light exit surface can be further improved. Therefore, the light emitted from the lighting device can further reduce the color unevenness on the irradiated surface.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the light emitting portion is a plurality of the light emitting elements that are not covered with the wavelength conversion unit among the plurality of light emitting elements. It is characterized by using a part.

  According to the present invention, the light emitting part is constituted by a part of the plurality of light emitting elements that are not covered with the wavelength conversion unit among the plurality of light emitting elements, so that a relatively simple illumination device is provided. With this configuration, it is possible to reduce color unevenness on the irradiated surface. For example, the illumination device has a small unevenness of color on the irradiated surface due to a manufacturing process in which, among the plurality of light emitting elements, a part of the light emitting elements is formed without simply covering the wavelength conversion unit. Compared with what forms the said light emission site | part, it can manufacture at a lower manufacturing cost.

  The invention according to claim 4 is the invention according to claim 1 or 2, wherein the light emitting portion has a thickness of the wavelength conversion unit covering the plurality of light emitting elements, among the plurality of light emitting elements. It is characterized by comprising a concave portion which becomes thin on a part of the light emitting elements.

  According to the present invention, the light emitting portion includes a recess in which the thickness of the wavelength conversion portion covering the plurality of light emitting elements is reduced on a part of the light emitting elements among the plurality of light emitting elements. As a result, the thickness of the wavelength conversion part is partially reduced, and the emission color of light emitted from the light emitting surface of the light emitting device changes, so that the color on the irradiated surface of the light emitted from the illumination device is changed. Unevenness can be reduced.

  In addition, since the light emitting part is protected by covering each of the plurality of light emitting elements by the wavelength conversion unit, the reliability of the light emitting element can be improved. Furthermore, the illuminating device can adjust the luminescent color of the said light emission site | part by setting the depth of the said recessed part suitably. Therefore, even when the light emitting part is formed by using a plurality of the light emitting elements, the lighting device connects the light emitting element of the light emitting part and the other light emitting elements to the conductor pattern of the mounting substrate, etc. There is no need to separately form each of the components, and the circuit configuration including the conductive pattern of the mounting substrate can be simplified to improve the reliability.

  According to a fifth aspect of the present invention, in the invention according to the fourth aspect, the concave portion includes a tapered portion in which the thickness of the wavelength converting portion continuously changes.

  According to the present invention, the concave portion includes a tapered portion in which the thickness of the wavelength conversion portion continuously changes. Therefore, the amount of light that is wavelength-converted by the wavelength conversion portion in the light emitting portion is continuously increased. Thus, the color unevenness on the light exit surface can be further reduced. Therefore, the illuminating device can further reduce color unevenness on the irradiated surface of the light emitted from the illuminating device.

  The invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the light emitting part uses a part of the plurality of light emitting elements, An electric circuit portion for energizing the light emitting element in the light emitting part is configured separately from an electric circuit portion for energizing the other light emitting elements.

  According to this invention, the light emitting part uses a part of the light emitting elements among the plurality of light emitting elements, and the electric circuit part for energizing the light emitting element in the light emitting part is provided with the other light emitting elements. By being configured separately from the electric circuit unit for energizing the light emitting element, the drive current of the light emitting element of the light emitting unit can be adjusted separately from the other light emitting elements, and the light It is possible to further reduce the color unevenness of the emission surface. Therefore, the lighting device can further reduce color unevenness on the irradiated surface of the light emitted from the lighting device.

  In the first aspect of the present invention, the light emitting device, when viewed from the light emitting surface side of the light emitting device, has the light emitted from the peripheral portion of the light emitting surface with reference to the emission color of the central portion of the light emitting surface. Provided is an illuminating device capable of reducing color unevenness on a surface to be irradiated with light emitted from the illuminating device by providing a light emitting portion that emits light complementary to the luminescent color along the peripheral portion. There is a remarkable effect of being able to.

The illuminating device of Embodiment 1 is shown, (a) is a schematic sectional drawing, (b) is a schematic enlarged plan view of the principal part, (c) is a schematic enlarged sectional view of the principal part. It is principal part explanatory drawing same as the above. The other principal part structure same as the above is shown, (a) is a schematic plan view, (b) is a schematic sectional drawing. The other principal part structure same as the above is shown, (a) is a schematic plan view, (b) is a schematic sectional drawing. The principal part structure of the illuminating device of Embodiment 2 is shown, (a) is a schematic plan view, (b) is a schematic sectional drawing. The principal part structure of the illuminating device of Embodiment 3 is shown, (a) is a schematic plan view, (b) is a schematic sectional drawing. The lighting apparatus for a comparison is shown, (a) is a top view, (b) is sectional drawing, (c) is the illustration in the principal part.

(Embodiment 1)
Hereinafter, the illuminating device 20 of this embodiment is demonstrated based on FIGS. 1-4. In FIG. 1 to FIG. 4, the same members are denoted by the same reference numerals and redundant description is omitted.

  A lighting device 20 shown in FIG. 1A of the present embodiment is arranged so as to cover a plurality of LED chips 1 that are light emitting elements mounted on one surface 2a of the mounting substrate 2 and the LED chips 1. A light-emitting device 10 having a wavelength conversion unit 3 that converts the wavelength of light emitted from the chip 1 and a mixed color light emitted from the LED chip 1 and the wavelength conversion unit 3 of the light-emitting device 10 And a lens 5 serving as a light distribution control unit that performs light distribution control in a predetermined direction according to the optical axis X.

  Here, FIGS. 1B and 1C illustrate an enlarged view of the light emitting device 10 in the illumination device 20 of the present embodiment, and the light emitting device 10 looks at the light emitting surface 10a side of the light emitting device 10. A plurality of light emitting portions that emit light that is complementary to the emission color of the light emitted from the peripheral portion of the light emitting surface 10a on the basis of the emission color of the central portion of the light emitting surface 10a. It is provided along. Here, the light emitting part is constituted by the LED chip 1 arranged in the cutout part 3 a of the wavelength conversion part 3.

  More specifically, as shown in the cross-sectional view of FIG. 1A, the lighting device 20 of the present embodiment is configured such that the tool body 6 of the lighting device 20 is formed in a bottomed cylindrical shape. A light emitting device 10 disposed on the inner bottom surface and a lens 5 serving as a light distribution control unit that is housed in the fixture body 6 and controls light distribution of the mixed color light emitted from the light emitting device 10 in a predetermined direction. The instrument body 6 is made of a metal material (for example, Al).

  In addition, the lens 5 has a concave surface on the side facing the light emitting device 10, and includes a convex portion serving as the entrance surface 5 b of the lens 5 projecting toward the light emitting device 10. It is formed like a bowl. As a result, the lens 5 narrows the incident light incident on the lens 5 from the light emitting device 10 by a refracting action on the entrance surface 5b and the exit surface 5a of the lens 5 and a total reflection action on the side surface 5c of the lens 5. Thus, the asymmetric lens can be radiated from the exit surface 5a of the lens 5 by controlling the light distribution. The focal point F (see FIG. 2) of the lens 5 can be set at the center of the light emitting surface 10a of the light emitting device 10 or in the vicinity thereof.

  The light emitted from the light emitting device 10 includes light emitted from the vicinity of the focal point F (see the solid line arrow in FIG. 2) and light emitted from the peripheral portion of the light emitting surface 10a of the light emitting device 10 (FIG. 2 (see the broken-line arrows in FIG. 2), and is emitted to the outside of the illumination device 20 via the lens 5.

  Here, in the light emitting device 10 of the lighting device 20, a plurality of LED chips 1 are mounted on one surface 2 a of the mounting substrate 2, and the light emitting device 10 is mounted on the wiring substrate 7. The plurality of LED chips 1 are electrically connected to a conductor pattern (not shown) provided on one surface 2 a of the mounting substrate 2. Similarly, the light emitting device 10 is electrically connected to a wiring pattern (not shown) on the wiring board 7. The mounting substrate 2 of the light emitting device 10 can be mounted on the wiring substrate 7 by solder reflow, and an electrode provided on the conductor pattern of the mounting substrate 2 and an electrode provided on the wiring pattern of the wiring substrate 7 are: For example, they are connected by metal wires (not shown) such as Au wires and Cu wires.

  The wiring board 7 is fixed to the inner bottom surface of the fixture body 6 of the lighting device 20 by a plurality of fixing screws 61. That is, the wiring board 7 on which the light emitting device 10 is mounted is, for example, at the corners that are the four corners of the rectangular wiring board 7 from the one surface 2a side on which the light emitting device 10 is mounted to the inner bottom surface of the fixture body 6. A plurality of fixing screws 61 are screwed into screw holes provided on the inner bottom surface of the instrument body 6. In addition, the light emitting device 10 arranged inside the lighting device 20 is electrically supplied through the wiring board 7 from the power cord 62 led out through a through hole provided in the fixture body 6 of the lighting device 20. Connected.

  Therefore, the illuminating device 20 feeds power from the power cord 62 provided outside the illuminating device 20 to the light emitting device 10 disposed inside the illuminating device 20, so that the conductor pattern of the mounting substrate 2 and the wiring of the wiring substrate 7 are provided. Light can be emitted through an electric circuit unit for energizing each LED chip 1 such as a pattern. In addition, the electric circuit unit of the lighting device 20 of the present embodiment is supplied with power from a power source (not shown), and has a control unit having a variable resistor that can individually control the light output of each LED chip 1. (Not shown) may be provided.

  The illuminating device 20 of the present embodiment includes an annular holding frame 8 that holds the opening edge of the instrument body 6 and the outer flange portion 5d extending outward from the edge of the lens 5 in a sandwiched manner. ing. Here, the holding frame 8 is fixed to the instrument body 6 by a plurality of mounting screws 81.

  Further, the light emitting device 10 used in the lighting device 20 of the present embodiment has a pair of conductor patterns (not shown) plated with Au on a rectangular flat alumina ceramic substrate as shown in FIGS. The mounting substrate 2 on which is not formed) is used. The pair of conductor patterns on the mounting substrate 2 are electrically connected to the electrodes of the plurality of LED chips 1 via conductive members (for example, Au bumps, AuSn, Ag paste, etc.). The LED chip 1 of the light-emitting device 10 has an n-type gallium nitride compound semiconductor layer, a light-emitting layer made of a gallium nitride compound semiconductor containing In, and a p-type gallium nitride compound semiconductor layer sequentially stacked on a sapphire substrate. Has been.

  In the LED chip 1, the n-type gallium nitride compound semiconductor layer is partially exposed by removing a part of the light emitting layer and the p-type gallium nitride compound semiconductor layer, and the p-type p An anode electrode and a cathode electrode that are electrically connected to each of the n-type and n-type gallium nitride compound semiconductor layers are provided. In the LED chip 1, the anode electrode and the cathode electrode provided on the same plane side of the LED chip 1 are mounted on an Au bump on a pair of conductor patterns of the mounting substrate 2 so that power can be supplied by flip chip mounting.

  Each LED chip 1 mounted on one surface 2a of the mounting substrate 2 emits blue light having a peak wavelength of, for example, 460 nm by light emission by energization. The outer shape of such an LED chip 1 can be, for example, a size of about 1 mm square and a thickness of about 100 μm.

Further, the wavelength conversion unit 3 is a yellow phosphor capable of emitting light capable of converting the wavelength of the blue light emitted from the LED chip 1 into a complementary yellow fluorescence (for example, activated by Eu (Sr, Ba)). ₂ SiO ₄ or Y ₃ Al ₅ O ₁₂ activated with Ce) is uniformly used in a translucent heat-resistant resin (eg, silicone resin) having a refractive index of about 1.2 to about 1.5. Are arranged so as to cover the plurality of LED chips 1.

  Here, the light-emitting device 10 includes a plurality of (here, 40) LED chips 1 that emit blue light shown in FIG. 1B on a surface 2a of the mounting substrate 2 in a virtually circular range. They are arranged at substantially uniform intervals so that they can be stored inside. In addition, the wavelength conversion unit 3 that covers the LED chip 1 has a plurality of (here, eight) in order to expose a part of the plurality of LED chips 1 at the outer peripheral end portion that becomes the peripheral portion of the light emitting surface 10a. ) Notch 3a. Therefore, the light-emitting device 10 includes a plurality of LED chips 1 that are arranged at approximately equal intervals along the peripheral portion of the light emitting surface 10a for each of the plurality of notches 3a of the wavelength conversion unit 3. Parts (eight in this case) are exposed from the wavelength converter 3.

  The conductor pattern provided on the one surface 2 a of the mounting substrate 2 of the light emitting device 10 is formed by the LED chip 1 provided in the notch 3 a of the wavelength converting unit 3 of the light emitting device 10 and the wavelength converting unit 3. Each of the covered LED chips 1 is formed as each of the electric circuit portions so that it can be separately lit. Further, the LED chip 1 disposed in the notch 3 a of the wavelength conversion unit 3 of the light emitting device 10 adjusts the amount of current using a variable resistor (not shown) provided on the wiring board 7 of the lighting device 20. Also configured to be able to.

  Hereinafter, each structure used for the illuminating device 20 of this embodiment is explained in full detail.

  The LED chip 1 which is a light emitting element used in the light emitting device 10 in the lighting device 20 of the first embodiment can emit light by energization. The light emitted from the light-emitting element can be, for example, blue light having a peak wavelength in the range of 450 nm to 470 nm of visible light, but is not limited to blue light. Ultraviolet light may be used to efficiently excite the conversion unit 3. As the LED chip 1 which is a light emitting element, for example, an n-type gallium nitride compound semiconductor layer, a multiple quantum well structure or the like is formed on a crystal growth substrate such as a sapphire substrate, a spinel substrate, a gallium nitride substrate, a zinc oxide substrate or a silicon carbide substrate. For example, a gallium nitride compound body layer containing indium and a p-type gallium nitride compound semiconductor layer, which are light emitting layers having a single quantum well structure, are sequentially stacked.

  The LED chip 1 using an insulating substrate as a crystal growth substrate is exposed on the same plane side by exposing a part of the n-type gallium nitride compound semiconductor layer from the p-type gallium nitride semiconductor layer side. Thus, an anode electrode and a cathode electrode can be formed respectively. The LED chip 1 using a conductive substrate may be formed with an anode electrode and a cathode electrode on both sides in the thickness direction of the LED chip 1.

  The anode electrode or the cathode electrode provided on the LED chip 1 is a material that can obtain good ohmic characteristics with a laminated film of a Ni film and an Au film, a gallium nitride compound semiconductor layer such as an Al film, an ITO film, or the like. It is not limited.

  The LED chip 1 in which the anode electrode and the cathode electrode are provided on the same plane side can be flip-chip mounted on a pair of conductor patterns on one surface 2a of the mounting substrate 2 using metal bumps such as Au bumps. . When the LED chip 1 having the anode electrode and the cathode electrode formed on both sides in the thickness direction is used as the LED chip 1, the LED chip 1 is formed on one surface 2a of the mounting substrate 2 on which the LED chip 1 is mounted. One conductor pattern of the pair of conductor patterns and the anode electrode or the cathode electrode of the LED chip 1 are electrically bonded by die bonding via a conductive member (for example, AuSn or Ag paste). Connect. The other cathode electrode or anode electrode on the light extraction surface side of the LED chip 1 may be electrically connected to the other conductor pattern via a wire (for example, a gold wire or an aluminum wire).

  The plurality of LED chips 1 in the light emitting device 10 of the present embodiment are arranged on the mounting substrate 2 by looking at the light emitting surface 10a of the light emitting device 10 according to the shape of the incident surface 5a of the lens 5 that is a light distribution control unit. On the one surface 2a, for example, a plurality of LED chips 1 may be mounted substantially equally at regular intervals inside a circular range. Such a plurality of LED chips 1 may be electrically connected in series, parallel, or series-parallel to each LED chip 1 through a conductor pattern provided on the mounting substrate 2.

  Next, the mounting substrate 2 of the light emitting device 10 used in the lighting device 20 of the present embodiment can mount the LED chips 1 as a plurality of light emitting elements. Further, the mounting substrate 2 forms a current-carrying path for each LED chip 1 by using a pair of conductor patterns (for example, a conductor pattern plated with Au on the outermost surface) on one surface 2a of the mounting substrate 2. Also good. As such a mounting substrate 2, a ceramic substrate using alumina, aluminum nitride, or the like, a metal base substrate using a metal material such as Cu, Al, or Fe, a glass epoxy resin substrate, or the like can be used. When an alumina ceramic substrate is used as the mounting substrate 2, it is easy to form a conductor pattern, has higher thermal conductivity than a glass epoxy resin substrate, etc., and efficiently dissipates heat generated by lighting the LED chip 1 to the outside. The heat dissipation of the light emitting device 10 can be improved.

  Further, the mounting substrate 2 is not limited to a rectangular shape in plan view, and may be, for example, a circular shape, an elliptical shape, or a polygonal shape. The LED chip 1 mounted on the mounting substrate 2 is bonded to a die pad portion made of a part of a conductor pattern provided on one surface 2a of the mounting substrate 2 using a bonding material such as AuSn, solder or silver paste. Can do. The LED chip 1 may be mounted on one surface 2a of the mounting substrate 2 via a submount.

  In addition, although the light-emitting device 10 of this embodiment uses the rectangular flat plate-shaped mounting substrate 2, the light from the LED chip 1 and the wavelength conversion unit 3 is reflected on the peripheral portion of the one surface 2a of the mounting substrate 2. You may use the mounting board | substrate 2 provided with the reflector.

In addition, the light emitting device 10 of the present embodiment may be provided with a reflective film (not shown) on the one surface 2a of the mounting substrate 2, and such a reflective film is formed with light emitted from the LED chip 1. , Which can efficiently reflect the light emitted from the wavelength conversion unit 3, specifically, a metal material such as Al, Al alloy, Ag, Ag alloy, or a white pigment such as BaSO ₄ What is necessary is just to comprise using the glass and resin containing this.

  Furthermore, in the light emitting device 10, a light transmitting part may be separately arranged on the wavelength converting part 3 in order to protect the plurality of LED chips 1, the wavelength converting part 3 and the like from the outside. Specific materials for the translucent part include, for example, silicone resin, epoxy resin, acrylic resin, polycarbonate resin, and glass. Such a light transmitting portion may be formed in a flat plate shape, or may be formed in a lens shape such as a convex shape or a concave shape that controls light distribution from the light emitting device 10 in a desired direction. Further, the light transmissive part may contain a light diffusing material for the purpose of scattering the light from the LED chip 1 or the light from the wavelength converting part 3 to improve the color mixing property. Such light diffusing materials include inorganic materials such as aluminum oxide, silica, and titanium oxide, organic materials such as fluororesin, and organic / inorganic hybrids that combine organic and inorganic components at the molecular level and particle level. The average particle size may be appropriately selected from several μm to several tens of μm, for example.

  The mounting substrate 2 may be configured such that a conductor pattern extends from the one surface 2 a of the mounting substrate 2 to the side surface and the back surface and extends across the side surface and the back surface as an external electrode of the light emitting device 10. . Such external electrodes of the light emitting device 10 can be electrically connected to the wiring substrate 7 of the lighting device 20 by a reflow process or the like.

  The wavelength conversion unit 3 used in the present embodiment converts the wavelength of light emitted from the LED chip 1 as a light emitting element, and emits fluorescence having a main emission wavelength on the longer wavelength side than the light from the LED chip 1. . For example, the wavelength conversion unit 3 contains light emitted from the LED chip 1 in a translucent material serving as a binder with a particulate phosphor that emits fluorescence having a main emission wavelength on the longer wavelength side. What is necessary is just to form. Note that the translucent material used as the material of the wavelength conversion unit 3 can be suitably a silicone resin that is a heat-resistant resin, but is not limited to a silicone resin, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, or glass. Etc. may be adopted. Further, as the phosphor used in the wavelength conversion unit 3, a plurality of types of phosphors may be used for the purpose of adjusting the emission color and improving the color rendering. For example, in order to change the light emitted from the lighting device 20 to white light having high color rendering properties, the combination of the LED chip 1 that emits blue light and the wavelength conversion unit 3 is blue as the phosphor of the wavelength conversion unit 3. A green phosphor that absorbs light and emits green light and a red phosphor that absorbs blue light and emits red light can be used.

Examples of the phosphor used in the wavelength conversion unit 3 include aluminate-based phosphors such as Y ₃ Al ₅ O ₁₂ activated by Ce and Tb ₃ Al ₅ O ₁₂ activated by Ce. in addition, were activated by the activated with _Ba 2 SiO ₄ and Eu in Eu (Sr, _Ba) silicate phosphors such as 2 SiO _4, are activated by activated with CaAlSiN _3, Eu with Eu and _{Sr 2 Si 5 N 8, Eu} Ca 2 was activated by _Si 5 _N 8, Eu in CaSi are activated by activated with SrSi ₇ N ₁₀ and Eu ₇ N ₁₀ nitride phosphor such as Can be adopted.

Green phosphors emitting green light include Ca ₃ Sc ₂ Si ₃ O ₁₂ activated by Ce, CaSc ₂ O ₄ activated by Ce and Eu (Sr, Ba, Ca). Examples of yellow phosphors that emit yellow light such as SiO ₄ were Y ₃ Al ₅ O ₁₂ activated by Ce, Tb ₃ Al ₅ O ₁₂ activated by Ce, and Eu (Sr, Ba) ₂ SiO _{4 and} other red phosphors include CaAlSiN ₃ activated with Eu, (Sr, Ca, Mg) AlSiN ₃ activated with Eu, and (Sr, Ca, Mg) activated with Ce. ) AlSiN ₃ , (Sr, Ca) ₂ Si ₅ N ₈ activated with Ce, and the like.

  When the wavelength conversion unit 3 forms the wavelength conversion unit 3 using a plurality of types of phosphors, the wavelength conversion unit 3 may include a mixture of a plurality of types of phosphors in a translucent material serving as a binder, In the translucent resin, a plurality of types of phosphors may be formed in multiple layers.

  The wavelength conversion unit 3 covers the plurality of LED chips 1 mounted on the inner side in a virtual circular range on the one surface 2 a of the mounting substrate 2. Here, it is a peripheral portion of the circular wavelength conversion section 3, and is divided into a peripheral portion in which the fan-shaped central angle obtained by equally dividing the circumference in the circular shape (in this case, eight divisions) is about 45 °. A portion 3a is provided. The LED chip 1 is disposed in the notch 3 a of the wavelength conversion unit 3, and some of the LED chips 1 among the plurality of LED chips 1 are not covered with the wavelength conversion unit 3.

  Here, when the light emitting device 10 uses, for example, a plurality of LED chips 1 that emit blue light, the LED chip 1 disposed in the cutout portion 3a of the wavelength conversion unit 3 is connected to the light emitting surface 10a. The light emitting part that emits light of a complementary color to the light emission color of the light emitted from the peripheral portion of the light emitting surface 10a is configured with the light emission color at the center of the light emission surface 10a as a reference.

  The interval between the notches 3a where the wavelength conversion unit 3 does not cover the LED chip 1 is not limited to the interval at which the central angle is 45 °, but may be other intervals, for example, the central angle is 30 °. You can also Further, the notches 3a in the wavelength conversion unit 3 do not have to be provided at exactly equal intervals, and may be at substantially equal intervals.

  In addition, in the light emitting device 10 shown in FIGS. 3A and 3B, instead of providing the notch 3a in the wavelength converter 3, the opening 3b that does not cover the LED chip 1 with the peripheral portion in the wavelength converter 3 is provided. May be provided. The LED chip 1 exposed from the wavelength conversion unit 3 by the opening 3b of the wavelength conversion unit 3 is made of a translucent material such as silicone resin so as to protect the LED chip 1, and has a convex cross section. It may be covered with the optical member 9. The light transmissive member 9 may contain a light diffusing material that diffuses light from the LED chip 1.

  Furthermore, the opening 3 b in the circular wavelength conversion unit 3 is formed so that only the LED chip 1 arranged on the outermost peripheral side of the wavelength conversion unit 3 shown in FIG. 3 is not covered with the wavelength conversion unit 3. It is not necessarily limited to the one provided with 3b.

  Therefore, as shown in FIGS. 4A and 4B, the light emitting device 10 has a concentric circular shape in which the opening 3b in the circular wavelength converter 3 is removed except for the central portion of the light emitting surface 10a of the light emitting device 10. On the virtual circle (here, two virtual circles), they may be arranged substantially equally at regular intervals along the circumferential direction.

  That is, in the light emitting device 10 shown in FIG. 4, among the plurality of LED chips 1 mounted on the one surface 2 a of the mounting substrate 2 at substantially equal intervals inside the virtual circular range, Openings 3b are also provided in the outermost outer periphery and the LED chip 1 inside the outermost outer periphery at intervals corresponding to each fan-shaped central angle obtained by equally dividing the peripheral portion. In addition, each LED chip 1 arrange | positioned at the opening part 3b is covered so that the cross section may be protected with the translucent member 9 with a convex shape. Here, the shape of the notch 3a and the opening 3b of the wavelength conversion unit 3 may be any shape that allows at least a part of the LED chip 1 to be exposed from the wavelength conversion unit 3. For example, a circular shape, an elliptical shape, a triangular shape, etc. It can be formed in a shape, rectangular shape, or polygonal shape. Needless to say, the notch 3a and the opening 3b provided in the wavelength conversion unit 3 may be used in combination.

  In addition, the light-emitting device 10 in the illuminating device 20 of this embodiment can be formed by the following formation process, for example.

  A plurality of LED chips 1 are flip-chip mounted on the one surface 2a of the mounting substrate 2 using Au bumps. After that, when the light emitting surface 10a side of the light emitting device 10 is viewed, the light emitting portion is formed on the peripheral portion of the light emitting surface 10a so as to be complementary to the emission color of the light emitted from the peripheral portion. The light transmissive member 9 is formed in advance by applying and curing a resin material of the light transmissive member 9 made of silicone resin on a part of the plurality of LED chips 1 arranged on the peripheral portion of the emission surface 10a.

  Next, the wavelength conversion unit 3 is a material in which a phosphor is filled on a plurality of LED chips 1 with a silicone resin as a translucent material as a binder, except for the LED chip 1 on which the translucent member 9 is formed. Can be formed using a screen printing method and the like, followed by heat curing.

  The wavelength conversion unit 3 is formed so as to cover all of the plurality of LED chips 1 and then partially removed using wet etching, dry etching, or the like, and the notch 3a in the wavelength conversion unit 3 is removed. Or an opening 3b may be formed.

  The light distribution control unit of the lighting device 20 controls the light distribution of the light emitted from the plurality of LED chips 1 and the wavelength conversion unit 3 of the light emitting device 10 in a predetermined direction. It can be composed of a mirror or the like. Therefore, the light distribution control unit can design the shape so that the light emitted from the light emitting surface 10a of the light emitting device 10 can be emitted to the outside of the lighting device 20 with a narrow angle light distribution. When the lens 5 is used as the light distribution control unit, the material of the lens 5 is, for example, a resin (for example, acrylic resin or polycarbonate resin) or glass that efficiently transmits light emitted from the LED chip 1 or the wavelength conversion unit 3. Is mentioned.

  Further, instead of the lens 5 having the focal point F at the central point of the light emitting surface 10a of the light emitting device 10 as the light distribution control unit of the lighting device 20, for example, the central point of the light emitting surface 10a in the light emitting device 10 is used. A reflecting mirror formed in a parabolic shape as the focal point F may be used. In addition, the shape of the inner surface of the reflecting mirror as the light distribution control unit is not particularly limited, and the light emitting device is arranged along the optical axis X of the light emitting device 10 according to a desired light distribution characteristic of the lighting device 20. As the center point of the light exit surface 10a in FIG. 10 moves away from the focal point F, it can be formed into a bowl-like curved surface shape in which the opening area of the reflecting mirror gradually increases. In addition, when a reflecting mirror is used as the light distribution control unit, Ag is vapor-deposited on the inner surface of the reflecting mirror or a white pigment or the like is used to efficiently reflect the light from the light emitting device 10. It can also be painted.

  Further, the electric circuit portion of the present embodiment is for energizing the LED chip 1 to light up, and is a conductor pattern provided on one surface 2 a of the mounting substrate 2 of the light emitting device 10, the wiring substrate 7. Can be constituted by a variable resistor or the like that can adjust the amount of current supplied for lighting each LED chip 1.

(Embodiment 2)
The basic configuration of the illuminating device 20 of the present embodiment is substantially the same as that of the first embodiment, and the notch 3a of the wavelength conversion unit 3 in the light emitting device 10 shown in FIGS. Instead of constituting the light emitting part with the arranged LED chip 1, the thickness of the wavelength conversion unit 3 covering the plurality of LED chips 1 is part of the plurality of LED chips 1 as shown in FIG. 5. The point which comprised with the light emission site | part provided with the recessed part 3c thinned on the LED chip 1 of this is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted suitably.

  In the light emitting device 10 in the illumination device 20 of this embodiment shown in FIG. 5A, a plurality of LED chips 1 are arranged on one surface 2 a of the mounting substrate 2.

  In addition, the wavelength conversion unit 3 of the light emitting device 10 in the lighting device 20 includes a plurality of LED chips 1 mounted on the inside surface of the virtual circular shape on the one surface 2a of the mounting substrate 2 at substantially equal intervals. All covered. In the plurality of light emitting portions that emit light of complementary colors in the lighting device 20 of the present embodiment, the wavelength conversion unit 3 that covers the plurality of LED chips 1 has a thickness of some of the plurality of LED chips 1. A recess 3 c that is thin on the chip 1 is provided.

  Here, the thickness of the wavelength conversion unit 3 provided with the recess 3c of the wavelength conversion unit 3 in the light emitting device 10 is such that the color unevenness on the irradiated surface of the light emitted from the illumination device 20 is reduced. The light output ratio of the light radiated from the LED chip 1 that transmits the light 3 and the light that has been wavelength-converted by the wavelength converter 3 may be appropriately considered. In addition, the wavelength conversion unit 3 may be formed in a convex shape with the thickness of the wavelength conversion unit 3 on which a plurality of other LED chips 1 are arranged based on the thickness of the wavelength conversion unit 3 of the light emitting part as a reference. Good.

  Note that all of the plurality of LED chips 1 of the light emitting device 10 used in the lighting device 20 of the present embodiment are electrically connected in series by a conductor pattern on one surface 2a of the mounting substrate 2.

  In the illumination device 20 of the present embodiment, the thickness of the wavelength conversion unit 3 on the LED chip 1 that emits the complementary color light that constitutes the light emitting portion among the plurality of LED chips 1 is the same as that of the plurality of LED chips 1. Since the thickness of the wavelength conversion unit 3 on the other LED chip 1 is thin, the light emitted from the wavelength conversion unit 3 in this region has a color temperature higher than that of the light emitted from the wavelength conversion unit 3 on the other LED chip 1. High light can be emitted.

  The wavelength conversion unit 3 of the light emitting device 10 used for the lighting device 20 includes a phosphor on the LED chip 1 after mounting the plurality of LED chips 1 on the one surface 2a of the mounting substrate 2. It is also possible to form the light-transmitting material by applying it by a screen printing method and then curing it. If multi-color printing by the screen printing method is used, the film thickness of a specific part in the wavelength conversion unit 3 can be appropriately changed. In addition, after mounting the LED chip 1 on the one surface 2a of the mounting substrate 2, the LED chip 1 that becomes the central portion of the light emitting surface 10a on the light emitting surface 10a side of the light emitting device 10 by using an inkjet printing method. The wavelength conversion part 3 can also be formed by discharging a translucent material containing a phosphor only on the top. Moreover, the film thickness of the specific site | part in the wavelength conversion part 3 can also be changed suitably by adjusting the discharge amount of an inkjet printing method, or controlling the frequency | count of repeating discharge.

  The illuminating device 20 of this embodiment adjusts the color temperature of the light radiated | emitted from the said light emission site | part by changing partially the thickness of the wavelength conversion part 3 in the said light-projection surface 10a of the light-emitting device 10. FIG. Can do. Therefore, it is not necessary to separate the electric circuit portion for energizing the plurality of LED chips 1 mounted on the one surface 2a of the mounting substrate 2, and the conductor pattern of the mounting substrate 2, the wiring pattern of the wiring substrate 7, etc. It is possible to simplify and further improve the reliability of the lighting device 20. Further, in the light emitting device 10 of the lighting device 20, the light emitting part uses a part of the LED chips 1 among the plurality of LED chips 1, and an electric circuit for energizing the LED chip 1 in the light emitting part. By configuring the unit separately from the electric circuit unit for energizing the other LED chip 1, it is possible to further reduce the color unevenness on the irradiated surface due to the mixed color light emitted from the illumination device 20. .

(Embodiment 3)
The illuminating device 20 of this embodiment is substantially the same as the structure of the illuminating device 20 of Embodiment 2 shown in FIG. 5, and the shape of the recessed part 3c provided in the wavelength conversion part 3 in the light-emitting device 10 of Embodiment 2 is the following. As shown in FIG. 6, the concave portion 3c of the wavelength converting portion 3 is formed from the inner bottom surface of the concave portion 3c, whereas the wall surface is substantially perpendicular to the mounting substrate 2 and the inner bottom surface is substantially parallel to the mounting substrate 2. The difference is that it is provided with a tapered portion 3d formed of a side wall in which the thickness to the peripheral portion of the recess 3c is continuously increased. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 2, and description is abbreviate | omitted suitably.

  That is, the concave portion 3c in the wavelength conversion unit 3 of the light emitting device 10 used in the lighting device 20 of the present embodiment includes a tapered portion 3d in which the thickness of the wavelength conversion unit 3 continuously changes as a side wall. The side wall of the recess 3 c has a shape that widens toward the surface of the wavelength conversion unit 3. Therefore, the light emitting portion continuously changes the amount of light that is wavelength-converted by the wavelength conversion unit 3 in the light emitting portion at the interface portion that becomes the tapered portion 3d, and the emission color continuously changes. Color unevenness on the surface 10a can be further reduced.

  Thereby, the illuminating device 20 of this embodiment can further reduce color unevenness on the irradiated surface of the light emitted from the illuminating device 20.

1 LED chip (light emitting device)
2 Mounting substrate 2a One surface 3 Wavelength conversion part 3c Concave part 3d Taper part 5 Lens (light distribution control part)
DESCRIPTION OF SYMBOLS 10 Light-emitting device 10a Light emission surface 20 Illumination device

Claims (6)

  A plurality of light-emitting elements mounted on one surface of the mounting substrate, a light-emitting device that is disposed so as to cover the light-emitting elements, and that includes a wavelength conversion unit that converts the wavelength of light emitted from the light-emitting elements; An illumination device including a light distribution control unit configured to perform light distribution control of light emitted from the device in a predetermined direction, wherein the light emitting device looks at the light emitting surface side of the light emitting device, and the light emitting surface A plurality of light emitting portions that emit light of complementary colors with respect to the light emission color of light emitted from the peripheral portion of the light emitting surface with reference to the light emission color of the central portion of the light emitting surface is provided along the peripheral portion. A lighting device.   The lighting device according to claim 1, wherein the plurality of light emitting portions are uniformly arranged along the peripheral portion.   The said light emission site | part is comprised using a part of several said light emitting elements which are not covered with the said wavelength conversion part among the said several light emitting elements. 2. The illumination device according to 2.   The light emitting portion includes a concave portion in which the thickness of the wavelength conversion portion covering the plurality of light emitting elements is reduced on a part of the light emitting elements among the plurality of light emitting elements. The lighting device according to claim 1 or 2.   The illumination device according to claim 4, wherein the concave portion includes a tapered portion in which a thickness of the wavelength conversion portion continuously changes. The light emitting part uses a part of the light emitting elements among the plurality of light emitting elements, and an electric circuit portion for energizing the light emitting elements in the light emitting part is energized to the other light emitting elements. The lighting device according to any one of claims 1 to 5, wherein the lighting device is configured separately from the electrical circuit section.

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