JP2011108948A5 - - Google Patents

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Publication number
JP2011108948A5
JP2011108948A5 JP2009264314A JP2009264314A JP2011108948A5 JP 2011108948 A5 JP2011108948 A5 JP 2011108948A5 JP 2009264314 A JP2009264314 A JP 2009264314A JP 2009264314 A JP2009264314 A JP 2009264314A JP 2011108948 A5 JP2011108948 A5 JP 2011108948A5
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JP
Japan
Prior art keywords
silicon
resin layer
adhesive material
elastic resin
material supply
Prior art date
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Application number
JP2009264314A
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English (en)
Japanese (ja)
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JP5500954B2 (ja
JP2011108948A (ja
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Priority to JP2009264314A priority Critical patent/JP5500954B2/ja
Priority claimed from JP2009264314A external-priority patent/JP5500954B2/ja
Publication of JP2011108948A publication Critical patent/JP2011108948A/ja
Publication of JP2011108948A5 publication Critical patent/JP2011108948A5/ja
Application granted granted Critical
Publication of JP5500954B2 publication Critical patent/JP5500954B2/ja
Active legal-status Critical Current
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JP2009264314A 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法 Active JP5500954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011108948A JP2011108948A (ja) 2011-06-02
JP2011108948A5 true JP2011108948A5 (cg-RX-API-DMAC7.html) 2012-10-04
JP5500954B2 JP5500954B2 (ja) 2014-05-21

Family

ID=44232099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009264314A Active JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Country Status (1)

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JP (1) JP5500954B2 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088789B2 (ja) * 2012-10-26 2017-03-01 新光電気工業株式会社 粘着材供給装置及びその製造方法
KR102060831B1 (ko) 2013-02-27 2019-12-30 삼성전자주식회사 플립 칩 패키징 방법, 그리고 상기 플립 칩 패키징 방법에 적용되는 플럭스 헤드 및 그 제조 방법
KR101575641B1 (ko) 2014-04-21 2015-12-08 주식회사 루멘스 솔더 패터닝 시스템 및 솔더 패터닝 방법
US11850683B2 (en) * 2020-03-27 2023-12-26 S.S.P. Inc. Flux tool using elastic pad
KR102206228B1 (ko) * 2020-03-27 2021-01-22 (주)에스에스피 탄성패드를 이용한 플럭스툴
JP7698537B2 (ja) * 2021-09-22 2025-06-25 ファスフォードテクノロジ株式会社 ディッピング装置、ダイボンディング装置および半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720383Y2 (ja) * 1987-07-21 1995-05-15 株式会社明電舎 水車ガイドベ−ンの異常検出装置
JP2001135925A (ja) * 1999-11-04 2001-05-18 Nec Corp フラックス供給装置及び供給方法
JP2004047874A (ja) * 2002-07-15 2004-02-12 Nec Semiconductors Kyushu Ltd フラックス転写装置
JP4653787B2 (ja) * 2007-08-08 2011-03-16 株式会社東芝 複製スタンパおよびその製造方法

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