JP2011101825A - Board case and game machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board case which is not remarkably large-sized even if it contains two or more boards, which respectively have a heater element, and a game machine equipped with this board case. <P>SOLUTION: First board cooling air and second board cooling air are not mutually mixed together by forming a partition wall 98 which divides a first board cooling air passage 11, through which the first board cooling air, which cools a first board 71, circulates, and a second board cooling air passage 12, through which second board cooling air, which cools a second board 72, circulates. Thereby, since a rise in the temperature of the first board cooling air by the mixing of the second board cooling air is beforehand prevented, the first board cooling air which cools the graphic LSI 71A of the first board 71, does not become higher than the desired temperature, a need for the being large-sized of a blower 86 or the enlargement of the blower is lost, and it allows reduction in size of the board case 70. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention has a single-layered box shape in which a space for housing a substrate is formed, and a first substrate and a second substrate each having a heat generating element for generating heat are stored in the space. The present invention relates to a board case and a gaming machine including the board case.

Conventionally, gaming machines such as slot machines and pachinko gaming machines have been used as means for providing entertainment to people. Among these, the slot machine is a gaming machine provided with a plurality of rotating reels on which a plurality of types of symbols are written and which can be rotationally driven.
In such a slot machine, a game is started by inserting a medal and then operating a start lever or the like to start the rotating reels all at once. A plurality of rotating reels that are rotationally driven are stopped as appropriate, and a prize is awarded when the symbols displayed on these rotating reels are in a specific combination. When winning, the number of medals corresponding to the winning combination is paid out from the gaming machine.

In addition, as a gaming machine, one having a display device such as a liquid crystal display is used to display a moving image for producing a game. And if a higher resolution display is used as a display device and a dedicated LSI with higher processing power is adopted as a graphic processing device so that a more precise and smooth moving image can be displayed, It is possible to perform more sophisticated and diverse effects.
Here, an electronic element such as an LSI that performs high-speed computation such as graphic processing generates heat due to its operation, and therefore generally has some cooling structure in order to prevent overheating.
As such a cooling structure, an air-cooling type in which a heat sink having a large number of cooling fins is closely attached to an electronic element and heat generated by the electronic element is dissipated in the air by this heat sink is often used. Adopting a water-cooled type in which water is circulated between the radiator and the electronic element and the electronic element is cooled with water is also used slightly.

Here, when electronic components housed inside a box-shaped board case are cooled by an air-cooling type cooling structure, air circulates (convects) only inside the board case, and heat exchange with the outside is almost impossible. Since it is not performed, the temperature of the cooling air itself rises, and it may not be possible to prevent overheating of the electronic element with only a heat sink.
For this reason, when cooling the electronic components in the board case, it is preferable to employ a forced air cooling structure including a blower for replacing the air inside the board case with the outside air in addition to the heat sink.
If such a forced air cooling structure is adopted, the blower always introduces fresh external air, so heat exchange with the outside is actively performed, and overheating of the electronic elements stored in the board case is prevented. (For example, refer to Patent Document 1).

Japanese Unexamined Patent Publication No. 09-305267 (FIGS. 2 and 3)

However, when storing a plurality of substrates each having heating elements with different cooling conditions such as allowable temperature during use in a substrate case, it is necessary to set the air volume of the blower according to the heating elements with severe cooling conditions. Since the required air volume increases more than necessary, the size of the blower becomes larger than necessary, or the number of installed blowers becomes larger than necessary, and the substrate case becomes significantly larger than the expected size, resulting in a single-layer structure. There is a problem that it is extremely difficult to reduce the thickness even in the box shape.
More specifically, when two substrates each having two heat generating elements having different allowable temperatures are stored in the substrate case even though the heat generation amount per unit time is substantially the same, each heat generation is performed inside the substrate case. Air warmed by cooling the element mixes.

For this reason, there is a possibility that the temperature of the cooling air for cooling the first heat generating element having a low allowable temperature may be higher than a desired temperature, and if the cooling air having the same air volume as that of the second heat generating element having a high allowable temperature is supplied, Since there is a possibility that the first heat generating element cannot be sufficiently cooled, the air volume of the cooling air for cooling the first heat generating element having a low allowable temperature needs to be increased as compared with the case of cooling alone, thereby increasing the size of the blower. Alternatively, the number of fans installed increases, and the substrate case becomes extremely large.
Accordingly, each invention described in each claim has been made in view of the above-described problems of the prior art, and the object is to provide two or more substrates each having a heating element. It is an object to provide a board case that does not remarkably increase in size even when stored, and a gaming machine including the board case.

Each invention described in each claim is made to achieve the above-mentioned object. The features of each invention will be described below with reference to the embodiments of the invention shown in the drawings.
In addition, a code | symbol shows the code | symbol used in embodiment of this invention, and does not limit the technical scope of this invention.
(Claim 1)
(Feature point)
The invention described in claim 1 is characterized by the following points.
In other words, the invention described in claim 1 is a first substrate having a box-like structure with a single-layer structure in which a space for housing the substrate is formed and having heating elements (71A, 72A) that generate heat. 71) and a second case (70) for accommodating the second substrate (72) in the space, a first blower (86) for cooling the first substrate (71), and the second A second blower (87) for cooling the substrate (72), a first substrate cooling air inlet (93) for taking in a first substrate cooling air for cooling the first substrate (71), A second substrate cooling air intake (94) for taking in a second substrate cooling air for cooling the second substrate (72), and discharging the first substrate cooling air and the second substrate cooling air to the outside; A discharge port (95), a first substrate cooling air passage (11) through which the first substrate cooling air flows, and a second substrate through which the second substrate cooling air flows And 却空 air passage (12), characterized in that with these first substrate cooling air passage (11) and the second substrate cooling partition wall for partitioning between the air passage (12) (98) is provided.

(Claim 2)
(Feature point)
The invention described in claim 2 is the invention described in claim 1, and has the following characteristic points.
That is, in the invention according to claim 2, the first blower (86) is configured so that the cooling air can be applied substantially perpendicularly to the surface of the first substrate (71). The second air blower (87) is arranged so as to be substantially perpendicular to the surface of the second substrate (72). The heating element (72A) provided on the second substrate (72) is overlaid on the second substrate (72).

(Claim 3)
(Feature point)
The invention described in claim 3 is the invention described in claim 2 described above, and has the following characteristics.
That is, in the invention according to claim 3, in addition to the first substrate (71) and the second substrate (72), a third substrate (73) having a heat generating element (73A) for generating heat is accommodated. The one substrate cooling air passage (11) connects the first blower (86), the first substrate (71), and the third substrate (73) from the first substrate cooling air inlet (93). It is a passage that reaches the discharge port (95) sequentially.

(Claim 4)
(Feature point)
The invention described in claim 4 is the invention described in claim 3 described above, and has the following characteristics.
That is, according to a fourth aspect of the present invention, the second substrate cooling air passage (12) extends from the second substrate cooling air inlet (94) to the second blower (87) and the second substrate (72). ) And the third substrate (73) in order to reach the discharge port (95), and the partition wall (98) is connected to the first substrate cooling air at the position of the third substrate (73). The first substrate cooling air passage (11) and the second substrate cooling air passage (12) are connected to the third substrate cooling air inlet (93, 94) from the respective cooling air inlets (93, 94) so that the second substrate cooling air merges. It is characterized by extending so as to partition to the front of the substrate (73).

(Claim 5)
(Feature point)
The invention described in claim 5 is the invention described in claim 4 described above, and has the following features.
That is, the invention according to claim 5 is provided with a plurality of cooling fins (88A) arranged in parallel to each other in order to efficiently cool the heating element (71A) of the first substrate (71). The heat sink (88) is provided, the heat sink (88) is disposed on the heat generating element (71A) provided on the upper surface of the first substrate (71), and the heat sink (88) The groove (88B) formed between the plurality of cooling fins (88A) provided in the heat sink (88) is disposed on the third substrate. It extends to the (73) side, and is characterized by being a ventilation path for guiding the first substrate cooling air to the third substrate (73).

(Claim 6)
(Feature point)
The invention described in claim 6 is the invention described in claim 6, and has the following characteristic points.
That is, according to the sixth aspect of the present invention, the first substrate cooling air blown out between the cooling fins (88A) of the heat sink (88) provided on the first substrate (71) is the third substrate (73). The surface of the third substrate (73) is displaced from the surface of the first substrate (71) to the heat sink (88) side so that both the front side and the back side of the third substrate (73) can be cooled. It is arrange | positioned in the position.

(Claim 7)
(Feature point)
The invention described in claim 7 is the invention described in claim 6, which has the following characteristic points.
That is, in the invention described in claim 7, the third substrate (73) includes a heat radiating plate (73D) for radiating heat generated by the heat generating element (73A) of the third substrate (73). The heating element (73A) is provided on the back surface of the surface on which the heating element (73A) is provided.
(Claim 8)
(Feature point)
The invention described in claim 8 is the invention described in claim 7, which has the following characteristic points.

In other words, the invention according to claim 8 is the fourth substrate having a heating element (74A) that generates heat in addition to the first substrate (71), the second substrate (72), and the third substrate (73). 74) is housed, and a fourth substrate cooling air passage (13) for guiding a part of the cooling air blown by the second blower (87) to the fourth substrate (74) is formed. And
(Claim 9)
(Feature point)
The invention described in claim 9 is the invention described in claim 8, and has the following features.

  That is, the invention according to claim 9 is divided into two parts, a first case part (80) and a second case part (90) which form a single-layered box shape when combined with each other. At least one of the portion (80) and the second case portion (90) is formed in a box shape with one surface opened, and the first substrate (71), the second substrate (72), The third substrate (73) and the fourth substrate (74) are attached to the first case part (80) side, and at least the first substrate (71) and the second substrate (72) are electrically connected. An electric wire to be provided on the first case portion (80) side, and the partition wall (98) is provided on the second case portion (90) side, and a leading edge of the partition wall (98), A gap through which the electric wire can be inserted is formed between the first case portion (80) and the portion facing the partition wall (98).

(Claim 10)
(Feature point)
The invention described in claim 10 is the invention described in claim 9, and has the following features.
That is, the invention described in claim 10 employs a liquid crystal driving substrate for performing digital image processing for displaying an image on the liquid crystal panel display device (63) as the first substrate (71), and the second substrate ( 72) adopts a scaler substrate that performs an enlargement process and a reduction process of an image displayed on the liquid crystal panel display device (63), and is displayed on the liquid crystal panel display device (63) as the third substrate (73). A sound source board that performs digital sound processing to output sound corresponding to an image is adopted, and these liquid crystal drive board, scaler board, and sound source board require a cooling air amount corresponding to the cooling load. If the temperature exceeds the allowable temperature without cooling, malfunction may occur, and among these, the cooling load on the liquid crystal driving substrate is the largest.

(Claim 11)
(Feature point)
The invention described in claim 11 is the invention described in claim 10, which has the following characteristic points.
That is, the invention described in claim 11 employs an inverter board that supplies AC power to a backlight that illuminates the liquid crystal panel provided in the liquid crystal panel display device (63) from behind as the fourth board (74). It is characterized by being.
(Claim 12)
(Feature point)
A twelfth aspect of the present invention is a gaming machine including the board case according to the first aspect of the present invention, and specifically includes the following characteristic points.

  That is, the invention described in claim 12 is a substrate case formed in a box shape having a single layer structure, and a first substrate (71) and a second substrate (72) each having a heat generating element (71A, 72A) for generating heat. (70) as a component, and a gaming machine (1) in which the first substrate (71) and the second substrate (72) are housed in the substrate case (70), wherein the first substrate A first blower (86) for cooling (71), a second blower (87) for cooling the second substrate (72), and a first substrate cooling for cooling the first substrate (71) A first substrate cooling air inlet (93) for taking air into the inside, and a second substrate cooling air inlet (94) for taking in the second substrate cooling air for cooling the second substrate (72). A discharge port (95) for discharging the first substrate cooling air and the second substrate cooling air to the outside, and a first substrate cooling air passage (11) through which the first substrate cooling air flows. A second substrate cooling air passage (12) through which the second substrate cooling air flows, and a partition wall (98) separating the first substrate cooling air passage (11) and the second substrate cooling air passage (12). Is provided in the substrate case (70).

(Effect of Claim 1)
The present invention configured as described above has the following effects.
That is, according to the first aspect of the present invention, the first substrate cooling air passage through which the first substrate cooling air for cooling the first substrate flows, and the second substrate cooling air through which the second substrate cooling flows. Since the partition wall for partitioning between the two substrate cooling air passages is provided, the first substrate and the second substrate have the first heating element even if the cooling conditions such as the allowable temperature at the time of use are different from each other. The substrate cooling air and the second substrate cooling air are not mixed with each other, and therefore, there is no possibility that the temperature of the cooling air for cooling the heat generating element having the lower allowable temperature becomes higher than a desired temperature.

Therefore, it is not necessary to increase the air volume of the cooling air corresponding to the heat generating element having the lower allowable temperature, and it is only necessary to secure the air volume of the cooling air corresponding to each heat generating element. Or, it is possible to prevent an unnecessary increase in the number of installed fans, and even if two or more substrates each having a heating element are accommodated, the substrate case does not remarkably increase in size, thereby reducing the size of the substrate. As a result, the substrate case can be miniaturized, and the above-described object can be achieved.
In addition, if the board case can be reduced in size, when the board case is built in a product such as a gaming machine, there is a margin in the internal space of the housing of the product, so other devices provided inside the housing It is possible to increase the size of the game machine to enhance its function or to add a device having a new function, thereby improving the function of a product such as a gaming machine.

(Effect of claim 2)
According to the invention described in claim 2, in addition to the effect of the invention described in claim 1, the following effect is obtained.
That is, according to the invention described in claim 2, the first blower and the second blower are arranged so that the cooling air can be applied substantially perpendicularly to the respective surfaces of the first substrate and the second substrate. Therefore, the cooling air in which the temperature blown by the first blower and the second blower is made uniform can be directly applied to each heating element, and thereby each heating element can be cooled efficiently without unevenness.

Therefore, even when a heat generating element having a large heat generating area and a large heat generation amount, such as a large-sized LSI for graphic processing, is adopted as the heat generating element, the heat generating element can be reliably cooled without bias. Can do.
In addition, since the first blower and the second blower are arranged so as to overlap each other on the first substrate and the second substrate, the thickness of the substrate case can be reduced, and thus the thickness of the substrate case can be reduced. In view of this, it is possible to prevent the substrate case from being significantly enlarged.
(Effect of claim 3)
According to the invention described in claim 3, in addition to the effect of the invention described in claim 1, the following effect can be obtained.

That is, according to the third aspect of the present invention, even if a third substrate having a heat generating element that generates heat is additionally stored in the substrate case in addition to the first substrate and the second substrate, Since the cooling air passage reaches the discharge port through the first blower, the first substrate, and the third substrate sequentially from the first substrate cooling air intake, it is added without adding a blower. The third substrate can be cooled.
In addition, since the third substrate is arranged on the downstream side of the first substrate, the influence of the heat generated by the third substrate does not reach the first substrate, so it is necessary to increase the air volume of the first substrate cooling air. Therefore, when the first substrate is sufficiently cooled, an increase in the size of the first blower can be avoided, and thus, even if a third substrate is added, the substrate case is not increased more than necessary.

(Effect of claim 4)
According to the invention described in claim 4, in addition to the effect of the invention described in claim 3, the following effect is obtained.
That is, according to the fourth aspect of the invention, the first substrate cooling air passage and the second substrate cooling air passage are arranged so that the first substrate cooling air and the second substrate cooling air merge at the position of the third substrate. Since the partition wall extending so as to partition the first substrate to the front of the third substrate is adopted, the first substrate cooling air and the second substrate cooling are performed in order to cool the added third substrate in addition to the first substrate and the second substrate. Even if the air volume is insufficient for either one of the air, the third board is cooled by both the first board cooling air and the second board cooling air, so that the air volume shortage is eliminated, thereby increasing the number of fans installed. From this point, the substrate case can be prevented from being significantly enlarged.

Furthermore, since the first substrate cooling air and the second substrate cooling air are merged before being discharged from the substrate case, the number of discharge ports to be provided in the substrate case is only one, so there are multiple discharge ports. Compared with the case where it is provided, the degree of freedom regarding the position and shape of the discharge port in the layout of the discharge port in the substrate case is further increased, and the convenience in miniaturization can be achieved.
(Effect of Claim 5)
According to the invention described in claim 5, in addition to the effect of the invention described in claim 4, the following effect can be obtained.
That is, according to the fifth aspect of the present invention, in order to efficiently cool the heat generating element of the first substrate, the heat sink having a plurality of cooling fins is provided on the first substrate, and is formed between the cooling fins of the heat sink. Since the groove extends to the third substrate side, the cooling fin of the heat sink functions as a current plate.

Thereby, even if it arrange | positions so that a 1st air blower can apply cooling air substantially perpendicularly with respect to the surface of a 1st board | substrate, the 1st board | substrate cooling air can be efficiently ventilated to a 3rd board | substrate, In cooling the third substrate, there is no shortage of cooling air volume.
Therefore, also from this point, a dedicated blower for cooling the third substrate is not necessary, an increase in the number of installed blowers is prevented, and a significant increase in the size of the substrate case can be prevented.
(Effect of claim 6)
According to the invention described in claim 6, in addition to the effect of the invention described in claim 5, the following effect is obtained.

That is, according to the sixth aspect of the present invention, the installation position of the third substrate relative to the first substrate is shifted to the heat sink side with respect to the first substrate, so that the first substrate cooling air is on the front side and the back side of the third substrate. It becomes possible to cool both sides, and even when the heating elements are provided on both sides of the third substrate, these heating elements can be sufficiently cooled, and the back side surface of the third substrate is cooled. A dedicated blower is not required, and the increase in the number of installed blowers can be prevented in advance, and a significant increase in the size of the substrate case can be prevented.
(Effect of Claim 7)
According to the invention described in claim 7, in addition to the effect of the invention described in claim 6, the following effect can be obtained.

That is, according to the invention described in claim 7, the heat radiating plate for radiating the heat generated by the heat generating element of the third substrate is disposed on the back surface of the surface of the third substrate where the heat generating element is provided. Since it is provided, heat is also radiated from the back side of the third substrate on which the heat radiating plate is provided. As a result, even if a heating element having a large amount of heat generation is provided on the front side of the third substrate, cooling can be performed even with the first substrate cooling air flowing through the back side, thereby improving the cooling effect of the third substrate. Can do.
Therefore, the first substrate cooling air cools both the front side and the back side of the third substrate, so that the cooling effect can be improved reliably, and even if a heating element having a large heat generation amount is provided, A dedicated blower for cooling the substrate is not required, an increase in the number of installed blowers is prevented, and a significant increase in the size of the substrate case can be prevented.

(Effect of Claim 8)
According to the invention described in claim 8, in addition to the effect of the invention described in claim 7, the following effect is obtained.
That is, according to the eighth aspect of the invention, since the fourth substrate cooling air passage for guiding a part of the cooling air blown by the second blower to the fourth substrate is formed, the first blower can be added without adding a new blower. The four substrates can be cooled, thereby preventing an increase in the number of installed fans, and also from this point, the substrate case can be prevented from being significantly enlarged.
Here, it is sufficient to cool the heating element of the fourth substrate to such an extent that it is not destroyed by heat. For example, if the heating element of the fourth substrate is a power control element, even a part of the cooling air blown by the second blower It can be cooled sufficiently and does not interfere with the operation of the fourth substrate.

(Effect of Claim 9)
According to the invention described in claim 9, in addition to the effect of the invention described in claim 8, the following effect is obtained.
That is, according to the ninth aspect of the present invention, the partition wall is formed on the second case portion to which the first to fourth substrates are not attached, among the first case portion and the second case portion forming the substrate case. Since the first to fourth substrates are attached to the first case portion, the internal space of the substrate case is partitioned by the partition wall by combining the first case portion and the second case portion. Become. Therefore, when performing the mounting operation for mounting the first to fourth substrates on the first case portion, the partition wall does not become an obstacle to the mounting operation, and the first to fourth substrate mounting operations are performed. Can be easily.

In addition, since a gap through which the electric wire can be inserted is formed between the leading edge of the partition wall and the portion facing the partition wall of the first case portion, the first substrate, the second substrate, After attaching the 3rd board and the 4th board and electrically connecting these boards to each other with an electric wire, the first case part and the second case part are combined to partition the internal space of the board case with a partition wall. Even so, the electric wire connecting the substrates passes through the gap formed between the partition wall and the first case portion, and the substrate disposed on the other side from the substrate disposed on one side of the partition wall. To reach.
Therefore, since there is no partition wall, the wiring work for wiring the wires that electrically connect the substrates can be performed, so the partition wall does not become an obstacle to the wiring work. Wiring work of the electric wires to be electrically connected can be facilitated.

(Effect of Claim 10)
According to the invention described in claim 10, in addition to the effect of the invention described in claim 9, there is the following effect.
That is, according to the tenth aspect of the present invention, a liquid crystal driving substrate that performs digital image processing of a liquid crystal panel display device is employed as the first substrate, and an image enlargement process and reduction of the liquid crystal panel display device is employed as the second substrate. Since the scaler substrate that performs processing is used and the sound source substrate that outputs the sound corresponding to the image of the liquid crystal panel display device is adopted as the third substrate, the liquid crystal panel display device can display an image with sound. Even if all the necessary boards are stored inside the board case, and these boards are cooled by a blower, the increase in the number of installed blowers can be prevented, so the board case can be enlarged. As a result, the substrate case can be reduced in size.

For this reason, in order to produce an effect with the display image of the liquid crystal panel display device, it is possible to reduce the size of the substrate case when the liquid crystal panel display device is provided in the gaming machine. Since there is room in the body internal space, you can increase the size of other devices provided inside the gaming machine housing, strengthen its functions, or add devices with new functions, Thereby, the function improvement of a gaming machine can be aimed at.
(Effect of Claim 11)
According to the eleventh aspect of the invention, in addition to the effect of the tenth aspect, the following effect is obtained.

That is, according to the eleventh aspect of the present invention, since the inverter substrate that supplies AC power to the backlight that illuminates the liquid crystal panel of the liquid crystal panel display device from behind is adopted as the fourth substrate, the heating element of the inverter substrate is heated. It becomes an electric power control element that is sufficient if it is cooled to such an extent that it is not destroyed by this, and a part of the cooling air blown by the second blower can be sufficiently cooled. Thereby, even if the inverter board which is the fourth board is housed in the board case, it is not necessary to provide a dedicated fan for cooling the inverter board, and an increase in the number of installed fans can be prevented beforehand. However, it is possible to prevent a significant increase in the size of the substrate case.
(Effect of Claim 12)
According to invention of Claim 12, there exists an effect as described below.

That is, according to the twelfth aspect of the invention, the first substrate cooling air passage through which the first substrate cooling air for cooling the first substrate flows and the second substrate cooling air through which the second substrate cools circulates. Since the partition wall for partitioning between the two substrate cooling air passages is provided, the first substrate and the second substrate have the first heating element even if the cooling conditions such as the allowable temperature at the time of use are different from each other. The substrate cooling air and the second substrate cooling air are not mixed with each other, and therefore, there is no possibility that the temperature of the cooling air for cooling the heat generating element having the lower allowable temperature becomes higher than a desired temperature.
Therefore, it is not necessary to increase the air volume of the cooling air corresponding to the heat generating element having the lower allowable temperature, and it is only necessary to secure the air volume of the cooling air corresponding to each heat generating element. Or, it is possible to prevent an unnecessary increase in the number of installed fans, and even if two or more substrates each having a heating element are accommodated, the substrate case does not remarkably increase in size, thereby reducing the size of the substrate. As a result, the substrate case can be miniaturized, and the above-described object can be achieved.

  Also, if the board case can be miniaturized, if the board case is built into the gaming machine, there will be room in the internal space of the housing, so the other devices provided inside the housing will be enlarged, The function can be strengthened, or a device having a new function can be added, whereby the function of the gaming machine can be improved.

It is a front view showing a slot machine according to an embodiment of the present invention. It is a rear view which shows the front door of the slot machine which concerns on the said embodiment. It is a top view of the substrate case which concerns on the said embodiment. It is a top view which shows the inside of the 1st case part of the board | substrate case which concerns on the said embodiment. It is sectional drawing in the VV line | wire of FIG. It is sectional drawing in the VI-VI line of FIG.

Hereinafter, an embodiment which is the best mode for carrying out the present invention will be described with reference to the drawings.
1 to 6 show this embodiment. FIG. 1 is a front view showing a slot machine according to this embodiment, FIG. 2 is a rear view showing a front door of the slot machine according to this embodiment, and FIG. 3 is a plan view of a substrate case according to this embodiment. 4 is a plan view showing the inside of the first case portion of the substrate case according to the present embodiment, FIG. 5 is a cross-sectional view taken along line VV in FIG. 3, and FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. FIG.
(Overview of slot machine 1)
First, an outline of the configuration of the slot machine 1 according to the present embodiment will be described.

As shown in FIG. 1, the slot machine 1 according to the present embodiment includes a housing 20 formed in a substantially hexahedron box shape having an open front surface.
Inside the housing 20, there are a reel unit 50 having three rotating reels 61 that have the same diameter and are arranged side by side so as to be coaxial, and a hopper unit that pays out medals under the reel unit 50. A gaming device such as 3 that is indispensable for the gaming operation of the slot machine 1 is accommodated.
Each of the rotary reels 61 is a cylindrical member having a plurality of types of symbols on its outer peripheral surface. In addition to the rotating reels 61, the reel unit 50 includes a support frame (not shown) formed in a substantially hexahedron for rotatably supporting the rotating reels 61.

The housing 20 is provided with a front door 30 for closing an opening formed on the front surface thereof so as to be rotatable.
As shown in FIGS. 1 and 2, the front door 30 is provided with a reel window 42 at the center thereof so that the symbol of the rotary reel 61 can be visually recognized. The reel window 42 is formed to have a size that can display a total of nine symbols arranged in three rows and four when the rotation of all three rotary reels 61 is stopped.
A liquid crystal panel display device 63 capable of displaying various images including moving images is provided above the reel window 42 as shown in FIGS.

In addition, speakers 64 that emit a production sound or the like are provided at corner portions on both sides below the front door 30, respectively.
Further, as shown in FIG. 1, an effect lamp unit 65 that blinks at the time of winning or the like is provided above the liquid crystal panel display device 63.
Below the reel window 42, as shown in FIG. 1, a plurality of types of switches 31 to 33 are provided for the player to perform a game operation. That is, below the reel window 42, from the left side in FIG. 1, a bet switch 31A for inserting stored medals one by one, a start switch 32 for starting rotation of the rotary reel 61, and 3 stored medals. A Max / Bet switch 31B for loading sheets and three stop switches 33 for stopping the rotation of the three rotary reels 61 are provided.

Of the three stop switches 33, a medal insertion slot 34 into which medals are inserted is provided obliquely above and to the right of the rightmost stop switch 33 in FIG.
Also, a payout port 35 for discharging medals paid out by the hopper unit 3 that operates at the time of winning a prize to the outside is provided at the lower part of the front door 30. Below the payout opening 35, a tray 36 for storing medals paid out from the payout opening 35 is provided.
(Substrate case 70)
In the above, the liquid crystal panel display device 63 is attached to the substrate case 70 installed on the back surface of the front door 30 as shown in FIG. Hereinafter, the substrate case 70 will be described.

The substrate case 70 is based on the present invention. As shown in FIGS. 3 to 6, the substrate case 70 has a single-layered box shape that is substantially hexahedron-like, and includes a first to first described later. A space for accommodating the fourth substrates 71 to 74 is formed.
Here, each of the first to fourth substrates 71 to 74 is a circuit substrate on which a plurality of types of electronic elements including a heat generating element that generates heat are incorporated, thereby forming a predetermined electronic circuit.
More specifically, the substrate case 70 is divided into two parts, a first case part 80 and a second case part 90, which form a single-layered box shape when combined with each other. Of the first case portion 80 and the second case portion 90, the first case portion 80 is a base portion of the substrate case 70 and is attached to the front door 30.

And the 1st case part 80 attached to the front door 30 has the bottom face part 81 to which the 1st-4th board | substrates 71-74 are attached, and the four sides of this bottom face part 81, as shown in FIGS. It has a shallow bottom box shape having four side walls 82 formed so as to extend from the bottom surface 81 and extend along the peripheral edge. The box-shaped first case portion 80 is opened on one side.
Here, the first substrate 71 is a liquid crystal driving substrate that performs digital image processing for displaying an image on the liquid crystal panel display device 63, and includes a graphic LSI 71A that performs digital image processing as a heating element. Further, as shown in FIG. 4, the first substrate 71 is disposed at a position slightly shifted to the upper left from the central portion of the bottom surface portion 81.

The second substrate 72 is a scaler substrate that performs an enlargement process and a reduction process of an image displayed on the liquid crystal panel display device 63, and includes an LSI 72A that performs an enlargement process and a reduction process of the display image as a heating element. Further, as shown in FIG. 4, the second substrate 72 is arranged at a position shifted slightly to the right below the first substrate 71.
The second substrate 72 is provided with another heating element (not shown) in addition to the LSI 72A, and these heating elements are also cooled by the second blower 87.
The third substrate 73 is a sound source substrate that performs digital sound processing for outputting sound in accordance with an image displayed on the liquid crystal panel display device 63, and includes an IC 73A that performs processing for converting a digital sound signal into an analog sound signal. It is provided as a heating element. Further, as shown in FIG. 4, the third substrate 73 is disposed adjacent to the right side of the first substrate 71 at a position obliquely upper right of the second substrate 72.

The fourth substrate 74 is an inverter substrate that supplies AC power to a backlight (not shown) that illuminates the liquid crystal panel provided in the liquid crystal panel display device 63 from behind, and is required when converting DC power to AC power. A transformer 74A is provided as a heating element. Further, as shown in FIG. 4, the fourth substrate 71 is disposed on the left side of the first substrate 71 at a position near the left edge of the bottom surface portion 81.
On the surface of the bottom surface portion 81 to which the substrates 71 to 74 are attached, bosses 71B to 74B are provided so as to correspond to the substrates 71 to 74, respectively. Then, each of the substrates 71 to 74 is placed on the corresponding boss 71B to 74B, and is screwed to the boss 71B to 74B (not shown) that is screwed to the boss 71B to 74B in a state of being floated from the surface of the bottom surface portion 81 Are fixed to the bosses 71B to 74B.

As shown in FIGS. 5 and 6, a liquid crystal panel display device 63 is attached to the surface of the bottom surface portion 81 opposite to the side where the substrates 71 to 74 are attached.
That is, the bottom surface portion 81 of the first case portion 80 is provided with a fixing rib portion 84 that extends along the four peripheral edges of the bottom surface portion 81 and protrudes in the direction opposite to the side wall portion 82 described above.
The fixed rib portion 84 is fitted with a fixed frame 85 formed in the shape of a rectangular tube having a size corresponding to the fixed rib portion 84. The fixed frame 85 overlaps with the fixed rib portion 84 and has four side wall portions 85A forming a rectangular tube shape of the fixed frame 85, and a flange portion protruding inward from one end edge of each of the side wall portions 85A. And 85B.

The liquid crystal panel display device 63 is adapted to be fitted inside a fixed rib portion 84 formed on the four peripheral edges of the bottom surface portion 81. Further, a fixed frame 85 is fitted on the outer side of the fixed rib portion 84. Here, the liquid crystal panel display device 63 is prevented from being detached from the inside of the fixing rib portion 84 by the flange portion 85B of the fixing frame 85, and is thereby fixed to the bottom surface portion 81 of the first case portion 80. It is like that.
On the other hand, as shown in FIGS. 5 and 6, the second case portion 90 is formed as a lid for closing the opening of the first case portion 80 having one surface opened.
That is, the second case portion 90 is formed so as to cover the four side wall portions 91 formed so as to overlap the four side wall portions 82 of the first case portion 80 and the bottom surface portion 81 of the first case portion 80. And a substantially box-like shape having a surface facing the first case portion 80 opened.

The side wall portion 91 is fitted to the outside of the side wall portion 82 of the first case portion 80 without a gap. Thereby, the second case portion 90 is attached to the first case portion 80.
The ceiling portion 92 connects the tips of the four side wall portions 91 to each other, and the center portion bulges outside the substrate case 70.
Here, as shown in FIG. 3, the ceiling portion 92 has a planar position corresponding to each of the graphic LSI 71A of the first substrate 71 and the LSI 72A of the second substrate 72 provided on the first case portion 80 side. In addition, a first substrate cooling air inlet 93 and a second substrate cooling air inlet 94, which will be described later, are provided in order to introduce cooling air into the substrate case 70.

Further, in the vicinity of the upper right corner and the upper left corner of the ceiling portion 92 in FIG. 3, there are a first discharge port 95 formed by a plurality of small holes 95 </ b> A for discharging cooling air taken into the substrate case 70. A second discharge port 96 formed from a plurality of small holes 96A is provided.
A third discharge port 97 formed by a plurality of small holes 97A is also provided on the right side of the second discharge port 96 in order to discharge the cooling air taken into the substrate case 70.
In FIG. 4, the first blower 86 for cooling the first substrate 71 and the second blower are provided at planar positions corresponding to the graphic LSI 71A of the first substrate 71 and the LSI 72A of the second substrate 72, respectively. A second blower 87 for cooling the substrate 72 is provided.

The first blower 86 is an axial fan that blows air along a rotating shaft (not shown) of the rotating rotor blade 86A. As shown in FIGS. 5 and 6, the first blower 86 has a rotating shaft (not shown) with respect to the surface of the first substrate 71 so that the cooling air can be applied almost perpendicularly to the surface of the first substrate 71. And is arranged so as to be superimposed on a graphic LSI 71A provided on the first substrate 71.
Here, between the first blower 86 and the graphic LSI 71A, as shown in FIGS. 4 to 6, the graphic LSI 71A of the first substrate 71 is arranged in parallel with each other in order to efficiently cool the graphic LSI 71A. A heat sink 88 provided with a plurality of cooling fins 88A is interposed.

More specifically, on the graphic LSI 71A provided on the upper surface of the first substrate 71, a heat sink 88 is disposed so as to overlap as shown in FIG. On the heat sink 88, a first blower 86 is disposed so as to overlap. Further, as shown in FIG. 3, a first substrate cooling air inlet 93 provided in the ceiling portion 92 of the second case portion 90 is disposed on the first blower 86 in an overlapping manner.
Here, the first substrate cooling air inlet 93 is composed of a plurality of small holes 93A forming a substantially circular shape, and air for taking the first substrate cooling air for cooling the first substrate 71 into the substrate case 70. It is an intake.

The first blower 86 is fixed to the heat sink 88 with screws, and the heat sink 88 is fixed to the first substrate 71 with screws (not shown). Further, a flexible heat conductor such as silicon rubber is interposed between the heat sink 88 and the first substrate 71, whereby the heat sink 88 is in close contact with the surface of the first substrate 71.
The groove 88B formed between the plurality of cooling fins 88A provided in the heat sink 88 extends in the left-right direction in FIG. 4 as shown in FIG. 4, and the right end in FIG. It extends to the 3 substrate 73 side. As a result, the groove 88B of the heat sink 88 serves as a ventilation path for guiding the first substrate cooling air to the third substrate 73.

At this time, as shown in FIG. 6, the boss 73B supporting the third substrate 73 has a projecting dimension larger than the projecting dimension of the boss 71B supporting the first substrate 71. For this reason, the third substrate 73 is disposed at a position farther from the bottom surface portion 81 than the first substrate 71. In other words, the surface of the third substrate 73 is disposed at a position where the surface thereof is shifted to the heat sink 88 side with respect to the surface of the first substrate 71. As a result, the first substrate cooling air blown from between the cooling fins 88A of the heat sink 88 provided on the first substrate 71 can cool both the front side and the back side of the third substrate 73.
Further, on the back side of the surface of the third substrate 73 where the IC 73A is provided, as shown in FIGS. 4 and 6, there is a heat radiating plate 73D for radiating the heat generated by the IC 73A of the third substrate 73. The three substrates 73 are arranged apart from each other.

The heat radiating plate 73D is made of a material having excellent heat conduction characteristics such as aluminum, and is a flat plate member having substantially the same size as the third substrate 73 as shown in FIG. Installed.
That is, at the four corners of the heat radiating plate 73D, leg portions 73E that extend toward the four corners of the third substrate 73 and that have the tip portion sandwiched between the third substrate 73 and the boss 73B are integrally provided. ing. By these leg portions 73E, the heat radiating plate 73D is separated from both the third substrate 73 and the bottom surface portion 81, and is disposed at an intermediate position thereof.
In addition, a heat conduction portion 73F that absorbs the heat of the IC 73A from the back side of the third substrate 73 is integrally provided at substantially the center of the heat radiating plate 73D. The heat conducting portion 73F is in close contact with the surface of the third substrate 73 via a flexible heat conductor such as silicon rubber.

The second blower 87 is an axial fan that blows air along a rotating shaft (not shown) of the rotating rotor blade 87A. As shown in FIGS. 5 and 6, the second blower 87 has a rotating shaft (not shown) with respect to the surface of the second substrate 72 so that the cooling air can be applied substantially perpendicularly to the surface of the second substrate 72. And is arranged so as to be superimposed on an LSI 72A provided on the second substrate 72.
More specifically, on the LSI 72A provided on the upper surface of the second substrate 72, as shown in FIG. Then, on the second blower 87, as shown in FIG. 3, a second substrate cooling air inlet 94 provided in the ceiling portion 92 of the second case portion 90 is disposed so as to overlap.

Here, the second substrate cooling air inlet 94 is composed of a plurality of small holes 94A forming a substantially circular shape, and air for taking the second substrate cooling air for cooling the second substrate 72 into the substrate case 70. It is an intake.
The second blower 87 is fixed to the ceiling portion 92 of the second case portion 90 with screws (not shown).
In the substrate case 70 as described above, as shown in FIGS. 3 and 4, the first substrate cooling air passage 11 through which the first substrate cooling air flows and the second substrate through which the second substrate cooling air flows are provided. A cooling air passage 12 and a partition wall 98 that partitions between the first substrate cooling air passage 11 and the second substrate cooling air passage 12 are provided.

That is, the partition wall 98 divides the internal space of the substrate case 70 into two, and extends in an L shape in plan view inside the substrate case 70.
More specifically, as shown in FIGS. 5 and 6, the partition wall 98 is formed on the second case portion 90 so as to hang down from the ceiling portion 92 of the second case portion 90 toward the bottom surface portion 81 of the first case portion 80. It is a part formed integrally.
At this time, on the first case portion 80 side, electric wires such as electric wires that electrically connect the first substrate 71 and the second substrate 72, and electric wires that electrically connect the first substrate 71 and the fourth substrate 74, etc. Are wired so as to cross the partition wall 98.

As shown in FIGS. 5 and 6, the partition wall 98 is formed with a gap between the bottom surface portion 81, which is a portion facing the partition wall 98 of the first case portion 80, and the leading edge of the partition wall 98. As shown, the projecting dimensions are set. The above-described electric wire can be inserted into the gap between the leading edge of the partition wall 98 and the bottom surface portion 81.
As a result, even if the partition wall 98 that divides the internal space of the substrate case 70 into two is provided in the second case portion 90, no problem in wiring occurs.
Note that the front end portion of the partition wall 98 extends to the vicinity of the bottom surface portion 81 beyond the substrates 71 to 74. Thereby, even if there is a gap between the bottom surface portion 81 and the leading edge of the partition wall 98, the leakage of cooling air through the gap is suppressed to the minimum.

As shown in FIG. 3, the partition wall 98 is connected to the side wall portion 91 of the second case portion 90 at one end portion disposed between the second discharge port 96 and the third discharge port 97. The partition wall 98 extends from one end connected to the side wall 91 to the lower side in FIG. 4 through the space between the first substrate 71 and the fourth substrate 74 as shown in FIG.
Further, as shown in FIG. 4, the partition wall 98 has a bent portion 98A that is bent along the lower left corner portion of the first substrate 71 in FIG. The partition wall 98 extends rightward from the bent portion 98A as shown in FIG. 4, passes between the first substrate 71 and the second substrate 72, and has the other end portion of the second substrate 72 in the upper right in FIG. It is arranged in the vicinity of the corner.

As shown in FIG. 3, the first substrate cooling air passage 11 enters the inside of the substrate case 70 from the first substrate cooling air inlet 93. From the first substrate cooling air inlet 93, the first blower as shown in FIG. 86, the first substrate 71, and the third substrate 73 are sequentially reached to reach the first discharge port 95 as shown in FIG. 3, and the passage exits from the substrate case 70 through the first discharge port 95.
The second substrate cooling air passage 12 enters the inside of the substrate case 70 from the second substrate cooling air inlet 94 as shown in FIG. 3, and from the second substrate cooling air inlet 94 as shown in FIG. 87, the second substrate 72, and the third substrate 73 are sequentially reached to reach the first discharge port 95 as shown in FIG. 3, and the passage exits from the substrate case 70 through the first discharge port 95.

In the above, the partition wall 98 has the first substrate cooling air passage 11 and the second substrate cooling air passage 12 so that the first substrate cooling air and the second substrate cooling air merge at the position of the third substrate 73. The cooling air inlets 93 and 94 extend so as to partition to the front of the third substrate 73.
Further, as shown in FIGS. 3 and 4, a fourth substrate cooling air passage 13 through which the fourth substrate cooling air for cooling the fourth substrate 74 flows is provided inside the substrate case 70.
That is, the fourth substrate cooling air passage 13 enters the inside of the substrate case 70 from the second substrate cooling air inlet 94 as shown in FIG. 3, and from the second substrate cooling air inlet 94, as shown in FIG. 2 sequentially passes through the blower 87, the second substrate 72, and the fourth substrate 74, and reaches the second discharge port 96 as shown in FIG. .

In other words, the fourth substrate cooling air passage 13 extends along the partition wall 98 from the second blower 87 to the second discharge port 96, and a part of the cooling air blown by the second blower 87 to the fourth substrate 74. It is a ventilation path to guide.
Of the cooling air sent out from the first blower 86, the cooling air blown out from the end of the groove 88B of the heat sink 88 opposite to the first substrate cooling air passage 11 is as shown in FIGS. The second discharge port 96 is discharged to the outside through a third discharge port 97 formed on the right side in FIG.
In the above, the first substrate (liquid crystal drive substrate) 71, the second substrate (scaler substrate) 72, and the third substrate (sound source substrate) 73 depend on the amount of heat generated and the cooling load when considered from the side of the fans 86 and 87. The amount of cooling air is required, and there is a possibility of malfunction if the allowable temperature is exceeded without cooling.

On the other hand, even if the fourth substrate (inverter substrate) 74 rises in temperature due to its heat generation, the fourth substrate (inverter substrate) 74 is fully functional as long as it is below the allowable temperature at which it is thermally destroyed. However, cooling is sufficiently possible even with a high temperature and a small amount of cooling air.
Specifically, the allowable temperatures T1, T2, T3 of the first substrate (liquid crystal drive substrate) 71, the second substrate (scaler substrate) 72, and the third substrate (sound source substrate) 73, and the fourth substrate (inverter substrate). The durable temperature T4 of 74 is about 70 ° C., about 72 ° C., about 75 ° C. and about 80 ° C., respectively. Among these, the allowable temperature T1 of the first substrate (liquid crystal driving substrate) 71 is the lowest. It has become.
In addition, as the 1st air blower 86 and the 2nd air blower 87, the thing of the rated air volume is respectively 0.52 m2 / min and 0.24 m2 / min.

According to this embodiment as described above, the following effects can be obtained.
That is, the first substrate cooling air passage 11 through which the first substrate cooling air for cooling the first substrate 71 flows, and the second substrate cooling air passage 12 through which the second substrate cooling air for cooling the second substrate 72 flows. Since the partition wall 98 for partitioning is provided, the LSIs 71A and 72A, which are the heating elements of the first substrate 71 and the second substrate 72, have different cooling conditions such as allowable temperature during use, even if they are different from each other. The first substrate cooling air and the second substrate cooling air do not mix with each other, and therefore, there is no possibility that the temperature of the cooling air that cools the heat generating element having the lower allowable temperature becomes higher than the desired temperature.

Therefore, it is not necessary to increase the air volume of the cooling air corresponding to the heat generating element having the lower allowable temperature, and it is sufficient to ensure the air volume of the cooling air corresponding to each heat generating element. 2 or more substrates 71 and 72 each having a heating element (LSI 71A and 72A) can be prevented, for example, by increasing the size of the fan or installing a fan other than the fans 86 and 87. Even if the board case 70 is housed, the board case 70 is not significantly enlarged, and the board cases 70 can be downsized by downsizing the boards 71 to 74.
Further, when the board case 70 is built in the slot machine 1 due to the downsizing of the board case 70, there is a margin in the internal space of the housing 20, so that other devices provided in the housing 20 are enlarged. Thus, it is possible to reinforce the function or add a device having a new function, whereby the function of the slot machine 1 can be improved.

Further, since the first blower 86 and the second blower 87 are arranged so that the cooling air can be applied substantially perpendicularly to the surfaces of the first substrate 71 and the second substrate 72, the first blower 86 is provided. And the cooling air in which the temperature blown by the second blower 87 is made uniform can be directly applied to each of the LSIs 71A and 72A, whereby the LSIs 71A and 72A can be cooled efficiently without unevenness.
For this reason, even if the areas of the heat generation portions of the LSIs 71A and 72A are large and the heat generation amounts of the LSIs 71A and 72A are large, the LSIs 71A and 72A can be reliably cooled without deviation.
In addition, since the first blower 86 and the second blower 87 are arranged on the first board 71 and the second board 72, respectively, the thickness dimension of the board case 70 can be reduced. The thickness of the substrate case 70 can be reduced, and from this point, the substrate case 70 can be prevented from being significantly enlarged.

Further, in addition to the first substrate 71 and the second substrate 72, even if a third substrate 73 having an IC 73A as a heat generating element is additionally stored in the substrate case 70, the first substrate cooling air passage 11 is also stored. However, since the first blower 86, the first substrate 71, and the third substrate 73 are sequentially reached from the first substrate cooling air intake to the first discharge port 95, the first blower 86 and There is no need to provide a blower other than the second blower 87. In other words, the added third substrate 73 can be cooled without adding a blower.
In addition, since the third substrate 73 is arranged on the downstream side of the first substrate 71, the heat generated by the third substrate 73 does not affect the first substrate 71, so the air volume of the first substrate cooling air can be reduced. There is no need to increase the size of the first blower 86 when the first board 71 is sufficiently cooled. From this point, even if the third board 73 is added, the board case 70 is more than necessary. There is no increase in size.

  Further, the first substrate cooling air passage and the second substrate cooling air passage are partitioned to the front of the third substrate 73 so that the first substrate cooling air and the second substrate cooling air merge at the position of the third substrate 73. Since the partition wall 98 extending in this manner is employed, either the first substrate cooling air or the second substrate cooling air is used for cooling the added third substrate 73 in addition to the first substrate 71 and the second substrate 72. On the other hand, even if the air flow is insufficient, the third substrate 73 is cooled by both the first substrate cooling air and the second substrate cooling air, so that the air flow shortage is eliminated, so that no additional fan is required. An increase in the number of installations can be prevented in advance, and from this point as well, a significant increase in the size of the substrate case 70 can be prevented.

Furthermore, since the first substrate cooling air and the second substrate cooling air come to join before being discharged from the substrate case 70, the first discharge port 95 to be provided in the substrate case 70 on the downstream side of the third substrate 73. Therefore, the degree of freedom regarding the position and shape of the discharge port in the layout of the first discharge port 95 in the substrate case 70 is increased as compared with the case where a plurality of first discharge ports are provided. Convenience in reducing the size can be achieved.
Further, in order to efficiently cool the LSI 71A of the first substrate 71, a heat sink 88 having a plurality of cooling fins 88A is provided on the first substrate 71, and a groove 88B formed between the cooling fins 88A of the heat sink 88 is the first. Since the third substrate 73 extends, the cooling fin 88A of the heat sink 88 functions as a current plate.

Thereby, even if the first blower 86 is arranged so that the cooling air can be applied substantially perpendicularly to the surface of the first substrate 71, the first substrate cooling air can be efficiently blown to the third substrate 73. Therefore, when the third substrate 73 is cooled, there is no shortage of cooling air volume.
Therefore, also from this point, a dedicated blower for cooling the third substrate 73 is not required, an increase in the number of installed blowers is prevented, and a significant increase in the size of the substrate case 70 can be prevented.
Further, since the installation position of the third substrate 73 with respect to the first substrate 71 is shifted to the heat sink 88 side with respect to the first substrate 71, the first substrate cooling air can cool both the front side and the back side of the third substrate 73. Thus, the IC 73A of the third substrate 73 is cooled not only from the front side but also by the heat radiating plate 73D installed on the back side. As a result, the IC 73A can be sufficiently cooled without adding a blower. From this point as well, an increase in the number of installed blowers can be prevented, and a significant increase in the size of the substrate case 70 can be prevented. .

In addition, since the fourth board cooling air passage 13 is formed to guide part of the cooling air blown by the second blower 87 to the fourth board 74, the fourth board 74 can be cooled without adding a new blower. As a result, an increase in the number of installed fans can be prevented, and also from this point, a significant increase in the size of the substrate case can be prevented.
Here, since it is sufficient to cool the fourth substrate 74 so that the heat generating elements are not destroyed by heat, specifically, the transformer 74A, a part of the cooling air blown by the second blower 87 is sufficient. Therefore, the operation of the fourth substrate 74 is not hindered.
Further, since the partition wall 98 is provided in the second case portion 90 to which the substrates 71 to 74 are not attached among the first case portion 80 and the second case portion 90 that form the substrate case 70, the substrates 71 to 74 are Since the internal space of the substrate case 70 is partitioned by the partition wall 98 by combining the first case portion 80 and the second case portion 90 after being attached to the first case portion 80, the first case portion 80 When the mounting work for attaching the substrates 71 to 74 is performed, the partition wall 98 does not obstruct the mounting work, and the mounting work of the substrates 71 to 74 can be facilitated.

In addition, since a gap through which the electric wire can be inserted is formed between the leading edge of the partition wall 98 and the bottom surface portion 81 of the first case portion 80, the substrates 71 to 74 are attached to the first case portion 80, and these After the substrates 71 to 74 are electrically connected to each other with electric wires, the internal space of the substrate case 70 is partitioned by the partition wall 98 by combining the first case portion 80 and the second case portion 90. The electric wires connecting the substrates 71 to 74 can be inserted from one side of the partition wall 98 to the other side through a gap formed between the partition wall 98 and the bottom surface portion 81.
Therefore, in the state where there is no partition wall 98, it becomes possible to perform wiring work for wiring the wires that electrically connect the substrates 71 to 74, so that the partition wall 98 does not become an obstacle to the wiring work. Thereby, the wiring work of the electric wire which electrically connects the substrates 71 to 74 can be facilitated.

  In addition, a liquid crystal driving substrate that performs digital image processing of the liquid crystal panel display device 63 is employed as the first substrate 71, and a scaler substrate that performs image enlargement processing and reduction processing of the liquid crystal panel display device 63 is employed as the second substrate 72. A sound source substrate that outputs sound corresponding to the image of the liquid crystal panel display device 63 is employed as the third substrate 73, and a back light that illuminates the liquid crystal panel of the liquid crystal panel display device 63 from the back is employed as the fourth substrate 74. Since the inverter board that supplies AC power to the light is adopted, all the boards 71 to 74 necessary for displaying the image with sound on the liquid crystal panel display device 63 are housed in the board case 70, and these Even if the substrates 71 to 74 are cooled by the fans 86 and 87, the substrates 71 to 74 can be sufficiently cooled by only the two fans 86 and 87. As a result, an increase in the number of installed fans is prevented, so that an increase in the size of the substrate case 70 can be prevented, and as a result, a reduction in the size of the substrate case 70 can be achieved.

Furthermore, since the transformer 74A only needs to be cooled to such an extent that the heat generating elements of the fourth substrate 74 are not destroyed by heat, a part of the cooling air blown by the second blower 87 can be sufficiently cooled. Thereby, even if the inverter board as the fourth board 74 is housed in the board case 70, it is not necessary to provide a dedicated blower for cooling the fourth board 74, and an increase in the number of installed blowers can be prevented. Also from this point, it is possible to prevent the substrate case from being significantly enlarged.
In addition, this invention is not limited to the said embodiment, The deformation | transformation in the range which can achieve the objective of this invention, improvement, etc. are included.
For example, in the above-described embodiment, the first substrate cooling air passage 11 and the second substrate cooling air passage 12 are connected to each other so that the first substrate cooling air and the second substrate cooling air merge at the position of the third substrate 73. The partition wall 98 extending so as to partition to the front of the three substrates 73 is adopted, and the third substrate 73 is cooled by both the first substrate cooling air and the second substrate cooling air. You may make it carry out only with 1st board | substrate cooling air.

In this case, a fourth discharge port is newly provided as a dedicated discharge port for discharging the second substrate cooling air to the outside of the substrate case 70, and the first discharge port 95 is dedicated to discharging the first substrate cooling air. In order to prevent the cooling air and the second substrate cooling air from joining inside the substrate case 70, a partition wall is used to partition the first substrate cooling air passage 11 and the second substrate cooling air passage 12 to their respective outlets. Also good.
In addition, the partition wall is not limited to one in which a gap is formed between the first case portion and the portion facing the partition wall, but may be in close contact with the portion facing the partition wall of the first case portion. Good. In this case, if a flexible interposing member such as rubber is interposed between the front end edge of the partition wall and the first case portion, the front end edge of the partition wall may be in close contact with the first case portion. Due to the deformation of the interposition member, it is possible to insert the electric wire, and no wiring problem occurs.

  Further, the gaming machine is not limited to a slot machine, and may be other types of gaming machines such as a pachinko machine. In short, the present invention is a plurality of substrates provided with a heat generating element having a large amount of heat generation such as a graphic LSI. It can be applied to all gaming machines having a board case with a built-in board.

1 Slot machine as a gaming machine
11 First board cooling air passage
12 Second board cooling air passage
13 Fourth board cooling air passage
20 enclosure
30 Front door
63 LCD panel display
70 PCB case
71 1st board
71A Graphic LSI as a heating element
72 Second board
72A LSI as a heating element
73 3rd board
73A IC as a heating element
73D heat sink
74 Fourth board
74A Transformer as a heating element
80 1st case part
86 First blower
87 Second blower
88 heat sink
88A cooling fin
88B groove
90 Second case part
93 1st board cooling air inlet
94 Second board cooling air inlet
95 outlet (first outlet)
98 partition wall

Claims (5)

A first case part that forms a base part that is divided into two parts and that is open on one side and a second case part that is formed as a lid that closes the opening of the first case part are combined together to form a substrate inside. A box case having a single-layer structure box in which a space for storage is formed, and a first substrate and a second substrate each having a heat generating element that generates heat;
The first case portion has a bottom surface portion to which the first substrate and the second substrate are attached,
The second case part has a ceiling part formed so as to cover the upper part of the bottom part of the first case part,
A first blower for cooling the first substrate;
A second blower for cooling the second substrate;
A first substrate cooling air intake for taking in a first substrate cooling air for cooling the first substrate;
A second substrate cooling air intake for taking in a second substrate cooling air for cooling the second substrate;
A discharge port for discharging the first substrate cooling air and the second substrate cooling air to the outside;
A first substrate cooling air passage through which the first substrate cooling air flows;
A second substrate cooling air passage through which the second substrate cooling air flows;
A partition wall that partitions between the first substrate cooling air passage and the second substrate cooling air passage;
Is provided,
The first substrate cooling air intake and the second substrate cooling air intake are provided in the ceiling portion,
The said partition wall is formed so that it may hang down toward the said bottom face part from the said ceiling part.   The substrate case according to claim 1, wherein a gap is formed between the bottom surface portion and a leading edge of the partition wall.   The substrate case according to claim 1, wherein a deformable interposition member is interposed between a leading edge of the partition wall and the first case portion. Between the blower and the heating element of the substrate, a heat sink provided with a plurality of cooling fins arranged so as to be parallel to each other is interposed,
4. The substrate case according to claim 1, wherein the cooling fin is provided at a position parallel to the partition wall.   A gaming machine comprising the board case according to claim 1.

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