JP2011096994A - Cooler, wiring board and light emitting body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooler which has relatively high cooling efficiency and durability. <P>SOLUTION: The cooler 10 has a refrigerant charged in a plate-like container 12, and is characterized in that at least partial areas of two opposite inner principal surfaces 12a and 12b of the container are made principally of dense ceramics, and porous ceramic bodies 14a and 14b in which the refrigerant passes are accommodated in the container, and joined to the dense ceramics of the inner principal surfaces. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cooler, a wiring board, and a light emitter.

  2. Description of the Related Art Conventionally, as an example of a cooler that absorbs and dissipates heat generated from a semiconductor integrated circuit such as a CPU, a flat plate cooler as shown in Patent Document 1 below has been proposed.

  A conventional flat plate cooler uses a container having a hollow flat plate structure made of a material having high thermal conductivity such as Cu, and a non-condensable gas such as air is deaerated in the internal space of the container. The fluid is sealed as a working fluid. In this type of cooler, the container absorbs heat from a heating element arranged outside the container, and the internal working fluid is evaporated by receiving heat from the container wall surface. The evaporated working fluid aggregates after diffusing inside the container and returns to the heat generating portion again. Thus, in the cooler, the heat absorption due to the heat of vaporization caused by evaporation is repeated continuously for a long time.

  In the conventional cooler, in order to disperse the working fluid throughout the inside of the container having a hollow flat plate structure, a dispersing portion that generates a capillary action is provided on the inner surface of the container. For example, Patent Document 1 below exemplifies a configuration in which a metal net is bundled in a rectangular parallelepiped in a vertical state as an example of a dispersion unit that causes such a capillary action.

JP 7-208884 A

  As for the conventional cooler, the container is comprised from metals, such as Cu. When a semiconductor integrated circuit such as a CPU is cooled using such a conventional cooler, an electronic circuit such as a CPU that is a heating element cannot be formed directly on the container surface, and is a non-conductive (insulating) circuit. It was necessary to place the substrate through a substrate or the like. For this reason, a part of the heat from the heating element is stored in the non-conductive member (insulating member), and the cooling effect is limited. In addition, the container made of metal and the dispersion part made of metal have a problem that they are relatively easily corroded by the working fluid and have relatively low durability. The present invention has been devised to solve such problems in the prior art.

  In order to solve the above problems, the present application is a cooler in which a refrigerant is sealed in a plate-like container, and the container has a dense area at least in part including two opposing inner main surfaces. A cooler comprising ceramics as a main component, wherein a porous ceramic body through which the refrigerant passes is bonded and accommodated in at least one of the inner main surfaces. provide. Moreover, the wiring board provided with the said container and the conductor wiring provided in the outer peripheral surface of the said container is provided. In addition, a light-emitting body is provided in which a light-emitting element electrically connected to the wiring board is provided on the surface of the wiring board.

  The cooler of the present invention has relatively high cooling efficiency and durability. Further, the circuit board of the present invention can efficiently cool the heat generated from the mounted circuit or functional element. In addition, the operation reliability of the circuit is high. Even when an element that generates a relatively large amount of heat, such as an LED element, is used for the light emitter of the present invention, this element is efficiently cooled, and stable light emission performance can be maintained over a long period of time.

It is a figure explaining the cooler which is one Embodiment of the cooler of this invention, (a) is a schematic perspective view of a cooler, (b) is a schematic plan view of the cooler 10, (c) is the cooler 10 The schematic sectional drawing of each is shown. It is an expanded sectional view of one embodiment of cooling of the present invention. (A)-(c) is a schematic sectional drawing explaining other embodiment of the cooler of this invention, respectively. It is a schematic perspective view explaining the wiring board which is one Embodiment of the wiring board of this invention. It is a schematic sectional drawing of other embodiment of the wiring board of this invention. It is a schematic perspective view explaining the light-emitting device which is one Embodiment of the light-emitting body of this invention. It is a schematic sectional drawing explaining other embodiment of the light-emitting body of this invention. It is a figure explaining other embodiment of the light-emitting device of this invention, (a) is a schematic perspective view, (b) has shown schematic sectional drawing, respectively. It is a figure explaining the wiring board with which the light-emitting device shown in FIG. 8 is provided, (a) is a schematic perspective view, (b) is a schematic plan view, (c) has shown schematic sectional drawing, respectively. It is a schematic sectional drawing which expands and shows the junction part vicinity of an element mounting body and a cover body in the light-emitting device shown in FIG. (A)-(c) is a schematic diagram of the result of the composition analysis of the position corresponding to the points A, B, and C shown in FIG. 10 when the lid and the element mounting body are both made of alumina ceramics. It is. (A) And (b) is a schematic sectional drawing explaining the joining state of a cover body and an element mounting body, (a) is the state which the cover body and element mounting body contact | abutted, (b) Indicates a state in which the lid and the element mounting body are joined. It is a schematic explanatory drawing explaining the element mounting body with which the light-emitting device shown in FIG. 8 is provided, (a) is a schematic perspective view of an element mounting body, (b) is a schematic perspective view of an element mounting body. It is a figure which shows the state by which the light emitting element was mounted in the element mounting body shown in FIG. 13, (a) is a top view, (b) is a schematic sectional drawing in the BB line shown to (a), (c ) Is a schematic cross-sectional view taken along the line CC shown in FIG.

  Hereinafter, the cooler of this invention is demonstrated with reference to drawings. FIG. 1 is a diagram illustrating a cooler 10 which is an embodiment of the cooler of the present invention. 1A is a schematic perspective view of the cooler 10, FIG. 1B is a schematic plan view of the cooler 10, and FIG. 1C is a schematic cross-sectional view of the cooler 10.

The cooler 10 shown in FIG. 1 includes a container body 12 made of dense ceramics and a dispersion portion 14 made of porous ceramics sealed in the internal space of the container body 12. In the internal space of the container body 12, for example, a coolant mainly containing water (H ₂ O) or an organic solvent is sealed.

The container body 12 is configured by joining a first member 12 a having a wall portion 16 at the peripheral portion and a plate-like lid body 12 b having a through hole 18. The through hole 18 is closed by a sealing member 19. Each of the first members 12a and 12b contains, for example, a dense ceramic whose main component is alumina (Al ₂ O ₃ ), for example. Here, the dense ceramic means a ceramic having an average pore diameter of 3.0 mm or less, preferably 0.2 mm or less. The average pore diameter is determined from, for example, an observation image of an arbitrary cross section of the measurement target member by an electron microscope or an optical microscope. For example, the average pore diameter is obtained by observing an arbitrary cross section of the measurement target member at a magnification of 20 to 100 times, and averaging the longest diameter values of the pores existing in the measurement area range of 0.5 to 30 mm ² of the observed image. The value. Each value may be obtained by confirming the observation image with the naked eye, or may be obtained by image processing of the taken observation image.

Moreover, the dispersion part 14 has, for example, porous ceramics whose main component is alumina (Al ₂ O ₃ ) or alundum as a main component. The dispersion part 14 includes a first dispersion part 14a joined to two opposing inner main surfaces of the container body 12, and a second dispersion part 14b provided between the opposing principal surfaces. The average pore diameter of the first dispersion part 14a is made larger than the average pore diameter of the second dispersion part 14b. For this reason, in the 1st dispersion | distribution part 14a, the refrigerant | coolant enclosed with the internal space of the container body 12 is smoothly disperse | distributed over a comparatively wide area | region in a short time compared with the 2nd dispersion | distribution part 14b. Further, the second dispersion part 14b has a relatively strong capillary force as compared with the first dispersion part 14a. For this reason, the refrigerant | coolant enclosed with the interior space of the container body 12 is favorably disperse | distributed inside the container body 12 to the up-down direction of FIG.1 (c). For example, regardless of the arrangement direction of the container body 12, the refrigerant is well dispersed in the direction against gravity. Further, since the second dispersion portion 14b is provided so as to extend from one inner main surface to the other inner main surface, the cooler 10 is less deformed by an external force applied in a direction substantially perpendicular to the main surface, for example. Durability is also relatively high.

  Here, the porous ceramics includes those in which, for example, glass components are mixed in ceramic particles. For example, the porous ceramics may be composed mainly of, for example, first particles made of alundum coarse particles and a glass component that bonds the first particles to each other. The alundum particles are particles mainly composed of alumina and containing, for example, titanium oxide and iron oxide. The alundum particles grow by heating, and the particle size after heating can be controlled by adjusting the heating conditions.

Further, the dispersion part 14 may be composed of alumina (Al ₂ O ₃ ) as a main component. The porosity and pore diameter of alumina (Al ₂ O ₃ ) increase as the firing temperature is lowered. Even when the container body 12, the first dispersion part 14a, and the second dispersion part 14b are all made of alumina (Al ₂ O ₃ ), the firing temperature at the time of producing each member is made different, and the porosity of each member Can be different.

For example, when the dispersion part 14 is composed of alumina (Al ₂ O ₃ ) as a main component, the pore diameter and the porosity of the porous body can be controlled by adjusting the firing temperature of alumina. For example, a porous body fired at 1100 ° C. may be used as the first dispersion part 14a, and a porous body fired at 1200 ° C. may be used as the second dispersion part 14b.

  The porous ceramic body may have a structure in which ceramic particles having a large particle size and ceramic particles having a small particle size are mixed and sintered. Typically, the average particle size of ceramic particles having a large particle size is 0.2 to 2.0 mm, and the average particle size of ceramic particles having a small particle size is 0.1 mm or less. The ratio of the ceramic particles having a large particle size present in the porous ceramic is preferably 40 to 80% by volume. The material of the ceramic particles is preferably alumina. This is because alumina is excellent in corrosion resistance against a solvent such as high-temperature water. By selecting a structure in which ceramic particles having different particle diameters are mixed, the average pore diameter can be set within a predetermined range. For example, the average pore diameter of the porous ceramic body can be set relatively easily in the range of 0.05 to 1 mm. In addition, it is preferable to contain 5-25 mass% of glass components in a porous ceramic body. Since the glass component has an action of firmly bonding the ceramic particles, a porous ceramic body having a relatively high strength can be obtained.

  In the cooler 10 shown in FIG. 1, the plurality of second dispersion portions 14b are dispersedly arranged. In the cooler 10 of the present embodiment, the flow path 11 sandwiched between the second dispersion portions 14b is formed to extend radially from the central portion toward the periphery in a plan view. A part of the evaporated solvent in the vapor phase also passes through the fluidized part 11 and quickly reaches the peripheral part of the container body 12 to be cooled and aggregated.

  The cooler 10 can be used for cooling a circuit or a functional element that generates relatively large heat, such as a light emitting device including a light emitting device such as an LED or a semiconductor integrated circuit such as a CPU.

  In the cooler 10, the liquid-phase refrigerant is dispersed and held in the surface direction by the capillary force of the first dispersion portion 14a. Further, the second dispersion portion 14b is continuous from one inner main surface to the other inner main surface, and both the two dispersion portions 14b are connected via the second dispersion portion 14b having a relatively strong capillary force regardless of the arrangement posture of the cooler. The refrigerant is dispersed in the first dispersion portion 14a on the inner main surface of the first.

  The shape and arrangement of the second dispersion portion 14b in the cooler 10 are not limited to the form shown in FIG. 1A, and may be set in various shapes and arrangements according to desired characteristics. Further, the pore diameter and the porosity of the first dispersion part 14a and the second dispersion part 14b may be partially changed according to desired characteristics.

  Hereinafter, the function of the cooler 10 will be described by taking, as an example, the case where the heat generating element generates heat in a state where the heat generating element including the light emitting element and the semiconductor integrated circuit is disposed on the outer main surface of the container body 12. For example, a case where a heating element is placed on one outer main surface shown by a broken line in FIGS. When the heating element generates heat, heat is transmitted through the wall surface of the container body 12 around the center of the first dispersion portion 14a joined to the inner main surface (in the broken line region and in the vicinity thereof). The refrigerant | coolant currently hold | maintained near the center part of the 1st dispersion | distribution part 14a is vaporized by this heat, and the heat transmitted to the container body 12 is taken away as vaporization heat. The vaporized refrigerant in the vapor phase mainly passes through the flow path 11 and moves (flows) from the vicinity of the central portion to the peripheral portion. At this time, part of the refrigerant in the gas phase also passes through the first dispersion part 14a and the second dispersion part 12b. In the periphery of the container body 12, the refrigerant in the vapor phase aggregates and returns to the liquid phase, moves in the first dispersion portion 14 a, and returns to the vicinity of the center portion.

  In the cooler 10, the container body 12 and the internal dispersion portion 14 are both composed mainly of ceramics. For this reason, there is almost no corrosion of the container body 12 and the dispersion | distribution part 14 which arises with the refrigerant | coolant etc. which were enclosed. Further, the container body 12 is also made of ceramics, so that the insulation of the container body 12 can be made extremely high. For this reason, a semiconductor integrated circuit, a light emitting element, etc. can be made to contact the surface of the container body 12 directly, and can be cooled efficiently.

  Next, an example of the manufacturing method of the cooler 10 will be described. First, the first member 12a and the lid body 12b constituting the container body 12 made of dense ceramics are prepared. The first member 12a and the lid body 12b of the container body 12 can be manufactured as follows, for example. First, raw material powder composed of 96 to 99.9% by mass of aluminum oxide powder and 0.1 to 4% by mass of sintering aid powder containing each powder of silicon oxide, calcium carbonate, and magnesium oxide was mixed, and polyethylene glycol was mixed. 3 to 8 parts by mass of an organic binder such as is added to 100 parts by mass of the raw material powder and mixed, and water is added to form a slurry. This slurry is spray-dried with a spray dryer, and the resulting granule is filled into a rubber mold and pressed with hydrostatic pressure to produce a molded body. The obtained molded body is processed and cut into shapes close to the shapes of the first member 12a and the lid body 12b, and a so-called near net molded body is produced. This near-net molded body is fired at 1500 to 1700 ° C. in a firing furnace to produce a sintered body. The sintered body is processed to produce the first member 212a and the lid body 12b.

  Also, the second dispersion part 14b is prepared. The second dispersion part 14b constitutes a near net molded body, for example, in the same process as the container body 12, and the near net molded body is fired at a temperature of less than 1500 ° C, preferably about 1000 ° C. For example, an alumina sintered body having a relatively large pore diameter can be produced by firing a near net molded body mainly composed of aluminum oxide powder at a relatively low temperature. Through this process, a plurality of block-shaped second dispersion portions 14b are prepared.

  Next, the second dispersion part 14b is arranged and fixed simultaneously with the formation of the first dispersion part 14a. First, a glass paste is applied to the entire inner main surface of the first member 12a and the lid 12b to a thickness of about 0.2 mm using screen printing, a brush, or the like. For example, a glass paste prepared by mixing and kneading a powder made of borosilicate glass having a melting point of 650 to 1000 ° C., a small amount of an organic binder, and a small amount of an organic solvent may be used. The portion of the through hole 18 is filled with a thermosetting resin such as an epoxy resin after the glass paste application step, and is thermally cured.

  Next, the raw material of the 1st dispersion | distribution part 14a is arrange | positioned to the whole inner main surface of the 1st member 12a and the cover body 12b. What is necessary is just to use what was produced as follows as a raw material of the 1st dispersion | distribution part 14a. First, after the alundum is heated to, for example, about 1300 ° C. to grow grains, only the alundum within a range of, for example, a particle size of about 0.1 to 3.0 mm is selectively collected using a vibration sieve. For example, 7 to 25% by mass (excluding the organic binder and the organic solvent) of the glass paste described above is added to and mixed with 100 parts by mass of the collected alundum to produce a raw material for the first dispersion part 14a. Instead of alundum, a mixture of raw materials obtained by selecting substantially spherical glass or ceramic having a diameter in the range of 0.5 to 3.0 mm, for example, is used as the raw material for the first dispersion portion 14a. It is good.

  A plurality of second dispersion portions 14b are arranged at predetermined positions on the inner surface of the first member 12a where the first dispersion portions 14a are arranged. In this state, the lid body 12b is disposed so as to close the opening of the first member 12a. At this time, the above-mentioned glass paste is applied to the joint between the first member 12a and the lid 12b, and the first member 12a and the lid 12b are joined via the glass paste. deep. Next, it cools, after heating at the temperature (650-1000 degreeC) more than melting | fusing point of a glass paste. During this heating, the thermosetting resin filled in the through hole 18 melts and evaporates. In this way, a structure is obtained in which the first member 12a, the lid 12b, the dispersion portion 14a, and the dispersion portion 14b are integrally joined by molten glass. Thereafter, the outer surface of the container body 12 is smooth polished by, for example, a surface grinder.

  In addition, you may perform joining of the 1st member 12a and the cover body 12b as follows. First, each of the joint surfaces of the first member 12a and the lid body 12b is mirror-polished so that the surface roughness Ra is 0.05 μm or less, for example. The mirror-polished surface is exposed with alumina particles as the main component, and is surrounded by a grain boundary glass layer 35 with Si as the main component.

  The surfaces in this state are faced to form a state in which the joint surfaces are in mechanical contact with each other, and then heat treatment is performed at a high temperature. When heat treatment is performed at a high temperature of 1000 ° C. to 1800 ° C. in this state, the components of the grain boundary glass layers in the vicinity of the joint surfaces of the first member 12a and the lid body 12b made of alumina ceramics are determined according to Fick's second law. Then, an intermediate layer mainly composed of an Si compound containing the eluted Si component is formed in the vicinity of the joint portion between the first member 12a and the lid body 12b by diffusing and moving to the joint surface between the first member 12a and the lid body 12b. The intermediate layer 26 relieves thermal stress at the time of bonding and suppresses cracks and cracks generated in the vicinity of the intermediate layer 26 in the vicinity of the bonded portion between the first member 12a and the lid 12b.

  Next, a liquid-phase refrigerant is sealed inside the container body 12. The refrigerant is sealed inside the container body 12 through the through hole 18. Thereafter, a metal body, other inorganic material, organic material, or the like is fixed to the through hole 18 to form the container body 12 sealed by the sealing member 19. For example, the container body 12 sealed by the sealing member 19 is configured by disposing a metal member in the through hole 18 and deforming the member by applying pressure from the outside (so-called caulking). In addition, what is necessary is just to use conventionally well-known methods, such as a heat extraction method, a vacuum pump method, and a gas liquefaction method, for enclosure of a refrigerant | coolant.

  In the manufacturing method of the present embodiment, the first dispersion portion 14a is composed of alundum particles, and the second dispersion portion 14b is composed of an alumina ceramic sintered body. The constituent material of the 1st dispersion | distribution part 14a and the 2nd dispersion | distribution part 14b is not limited, respectively. For example, both the first dispersion part 14a and the second dispersion part 14b may be made of alumina ceramics, and both the first dispersion part 14a and the second dispersion part 14b may be made of alundum particles. . It is possible to change the average pore diameter of the alundum particles and the alumina ceramic sintered body by changing the temperature conditions in the respective manufacturing steps, and the pore diameters of the first dispersion portion 14a and the second dispersion portion 14b. And the porosity can be adjusted to a desired range, respectively.

  For example, by using alundum particles heated under different temperature conditions for the first dispersion part 14a and the second dispersion part 14b, ceramic particles made of the same material and having different particle sizes are used as the main components. The 1st dispersion | distribution part 14a and the 2nd dispersion | distribution part 14b can be produced. At this time, as shown in a sectional view in FIG. 2, a glass component 61 for bonding ceramic particles (alundum particles) 51 included in the first dispersion portion 14a and ceramic particles (a) included in the second dispersion portion 14b. The glass component 62 that bonds the random particles 52 to each other melts and solidifies, and the first dispersion portion 14a and the second dispersion portion 14b are joined. In this case, in the joint part of the 1st dispersion | distribution part 14a and the 2nd dispersion | distribution part 14b, the particle | grains (alundum particle | grains) which consist of the same material and differed in size are mixed. For this reason, generation | occurrence | production of a big stress in a junction part, progress of the chemical reaction accompanying the contact of a different substance, etc. are suppressed.

  In the cooler 10 of the present embodiment, the members are joined with a relatively high strength, distortion and cracking due to external force are suppressed, and generation of particles from the cooler 10 is also suppressed.

  The cooler manufactured by the manufacturing method of this embodiment can constitute a cooler having high airtightness without using a member containing impurities such as an organic solvent such as an adhesive. In the cooler produced by the manufacturing method of the present embodiment, the first member 12a, the lid body 12b, the first dispersion part 14a, the second dispersion part 14b, and the generation of large stress at each joint part, Progress of chemical reaction accompanying contact of different substances is suppressed. In the cooler 10 of the present embodiment, the members are joined with a relatively high strength, distortion and cracking due to external force are suppressed, and generation of particles from the cooler 10 is also suppressed.

  3A to 3C are schematic cross-sectional views illustrating other embodiments of the cooler of the present invention. In the example shown in FIG. 3A, the gap between the second dispersion portions 14b is filled with a third dispersion portion 14c having an average pore diameter larger than that of the second dispersion portion 14b. The embodiment shown in FIG. 3A is preferable in that the degree of deformation when an external force is applied is further small and the operation reliability is high.

  In the example shown in FIG. 3 (b), the first dispersion part 14a made of porous ceramic is joined to both of the inner main surfaces of the container body 12, but the second dispersion part 14b shown in FIG. Not. The embodiment shown in FIG. 3 (b) is preferable in that the evaporated refrigerant flows well in the space formed between the first dispersion portions 14a and more efficiently aggregates and liquefies in the peripheral portion of the cooler 10. .

  In the embodiment shown in FIG. 3 (c), the first dispersion portion 14a is joined only to the inner main surface of the first member 12a of the container body 12 arranged on the lower side in FIG. 3 (c). . In the embodiment shown in FIG. 3A, the lower side in FIG. 3C is set as the lower direction along the vertical line, and the light emitter is mounted on the lower main surface of the outer main surface of the container body 12. It is preferably used in the state of being placed. In this case, the vapor-phase refrigerant evaporated from the first dispersion part 14a flows well in the upper space of the first dispersion part 14a, contacts the upper inner main surface of the container body 12, and heats the container body 12. Deprived. Thereby, a refrigerant | coolant aggregates and liquefies in an upper inner main surface. The liquefied refrigerant is dropped onto the first dispersion part 14a by gravity, and the inside of the first dispersion part 14a is dispersed in the surface direction. The embodiment shown in FIG. 3C is used favorably when the mounting area of the heating element, the installation posture of the container body 12, and the like are clear.

  FIG. 4 is a schematic perspective view illustrating a wiring board 30 which is an embodiment of the wiring board of the present invention. The wiring board 30 is configured such that a conductive wiring pattern 32 is formed on the surface of the container body 12 of the cooler 10. The wiring pattern 32 is created by, for example, a known metallization process. The container body 12 is made of ceramics such as alumina having a relatively high insulating property, and a desired conductive path can be formed by providing the wiring pattern 30.

  FIG. 5 is a schematic cross-sectional view of another embodiment of the wiring board of the present invention. In the embodiment shown in FIG. 4, a via conductor 36 extending from one outer main surface of the container body 12 to the other outer main surface is provided. The via conductor 6 may be formed using a known manufacturing method. For example, the first member 12a of the container body 12 may be formed using a so-called green sheet laminating method in which a plurality of ceramic layers are laminated and fired, and the via conductor 36 formed by laminating metal patterns may be configured.

  FIG. 6 is a schematic perspective view illustrating a light emitting device 50 which is an embodiment of the light emitter of the present invention. The light emitting device 50 has a configuration in which, for example, an LED light emitting element 52 is disposed on the surface of the wiring board 30 shown in FIG. The LED light emitting element 52 is electrically connected to the wiring pattern 32 provided on the surface of the wiring board 30 and emits light according to the electric power supplied through the wiring pattern 32. In the embodiment shown in FIG. 6, the light emitting element 52 is flip-chip connected to the wiring pattern 32 and fixed to the surface of the wiring substrate 30. The container body 12 of the present embodiment is configured to reflect the visible light region relatively well, for example, mainly composed of alumina, and the light emitted from the LED light emitting element 5 is relatively directed toward the upper side in FIG. Reflects well. In addition, as in the embodiment shown in the schematic cross-sectional view of FIG. 7, a convex portion 56 having a reflective surface 54 that favorably reflects light emitted from the light emitting element 52 upward may be provided.

  The light emitting element 52 generates relatively large heat as it emits light. In the light emitting device 50, the container body 12 (the lid body 12 b) on which the light emitting element 52 is mounted is directly cooled by the refrigerant sealed inside the container body 12. The light emitting device 50 can emit light emitted from the light emitting element 52 toward the upper side in FIG. 6 with high efficiency while keeping the temperature of the light emitting element 52 relatively low. The light emitting device 50 can irradiate a relatively high amount of light with respect to input power with high stability over a long period of time.

  FIG. 8 is a diagram for explaining a light emitting device 150 which is another embodiment of the light emitting device of the present invention. FIG. 8A is a schematic perspective view, and FIG. 8B is a schematic cross-sectional view. Yes. The light emitting device 150 includes a wiring board 130 according to another embodiment of the wiring board 150 of the present invention, and a light emitting element 152 that is mounted on the wiring board 130 and is made of, for example, an LED.

  The wiring board 130 includes the cooler 10 according to the above embodiment, the element mounting body 134 disposed on the surface of the lid 12b of the cooler 10, the wiring pattern 142 provided on the surface of the lid 12b, and the wiring pattern. 142 and a wire 144 that electrically connects the conductor layer 146 on the surface of the element mounting body 134.

  FIG. 9 is a diagram illustrating the wiring board 130 included in the light emitting device 150 illustrated in FIG. 8. FIG. 9 shows a state where the wiring pattern 142, the wire 144, the conductor layer 146, and the light emitting element 152 are removed from the wiring substrate 130. 9A is a schematic perspective view, FIG. 9B is a schematic plan view, and FIG. 9C is a schematic cross-sectional view.

  The light emitting element 152 is mounted on an element mounting body 134 made of a ceramic insulating material. The element mounting body 134 on which the light emitting element 152 is mounted is disposed in an area corresponding to the second dispersion portion 14b disposed in the central portion of the wiring board 130. For this reason, the heat generated by the light emission of the light emitting element 152 is efficiently cooled and removed.

  As shown in FIGS. 14B and 14C, the light emitting element 152 is provided corresponding to the arrangement region of the second dispersion portion 14b. For this reason, the heat generated by the light emission of the light emitting element 152 is efficiently cooled.

  The shape and arrangement of the second dispersion portion 14b in the wiring board 130 are not limited to the form shown in FIG. 8A, and may be set in various shapes and arrangements according to desired characteristics. Further, the pore diameter and the porosity of the first dispersion part 14a and the second dispersion part 14b may be partially changed according to desired characteristics.

  The element mounting body 134 is provided with a conductor layer 146 on the surface. The light emitting element 152 is electrically connected to the conductor layer 146, and is configured to emit light in accordance with the electric power supplied from the conductor layer 146. The conductor layer 146 is also electrically connected to the wiring pattern 142 on the surface of the lid 12b through the wire 144, and power is supplied to the conductor layer 146 through the wiring pattern 132.

The element mounting body 134 of the present embodiment is configured with alumina as a main component, for example, which reflects the visible light region relatively well, and the light emitted from the LED light emitting element 152 is in the upward direction of FIG. Reflected relatively well toward In the light emitting device 150, the lid 12b of the cooler 130 and the element mounting body 134 are each made of ceramics containing Si (aluminum) (Al ₂ O ₃ ) as a main component.

  The element mounting body 134 has a Si content higher than that of the lid body 12b and the element mounting body 134, and is a bonding layer mainly composed of the same elements (that is, Al and O) as the main component elements of the lid body 12b. It is joined relatively firmly via 155. The light emitting element 152 generates a relatively large amount of heat as it emits light. In the present embodiment, the lid 12b and the element mounting body 134 are made of the same component as the main component. It is joined with a high degree of adhesion through. For this reason, the heat conduction efficiency from the element mounting body 134 to the lid body 12b is also high, and the heat generated by the light emitting element 152 is efficiently radiated to the lid body 12b side. Further, the difference in thermal expansion coefficient among the lid body 12b, the element mounting body 134, and the bonding layer 155 is small, and the bonding strength is high, so that deterioration of the bonding strength of the bonding layer 155 due to heat generation of the light emitting element is suppressed. . Further, in the light emitting device 150 shown in FIG. 8, the cooling body (the lid body 112b) on which the light emitting element 152 is mounted is directly cooled by the refrigerant sealed in the cooling body. The light emitting device 150 can emit light emitted from the light emitting element 152 toward the upper side in FIG. 8 with high efficiency while keeping the temperature of the light emitting element 152 relatively low. The light emitting device 150 can irradiate a relatively high amount of light with respect to input power with high stability over a long period of time.

  FIG. 10 is an enlarged schematic cross-sectional view showing the vicinity of the joint between the element mounting body 134 and the lid body 12b in the light emitting device 150. FIG. In the present embodiment, the element mounting body 134 is disposed on the lid body 12b made of alumina ceramic containing Si component via the bonding layer 155 whose main component is the Si compound containing the same element as the Si compound contained in the lid body 12b. Are joined.

  The bonding layer 155 is formed by eluting Si components contained in the lid 12b and the element mounting body 134 to the bonding surface side with the element mounting body 134. Mainly Si compound. The structure bonded by the bonding layer 155 can achieve bonding with high adhesion without preparing an adhesive made of another material as the bonding layer. Further, since the bonding is performed through the bonding layer 155 whose main component is the Si compound component eluted from the lid 12b, it is possible to obtain a structure with a very thin and uniform high dimensional accuracy. Moreover, since Si components, such as a glass component, have comparatively high viscosity, when stress is applied to the structure, for example, the stress is relieved by the Si component existing between the ceramic particles.

  Here, the lid 12b is selected from polycrystalline ceramics and single crystals. Examples of the polycrystalline ceramics include ceramics mainly composed of alumina, forsterite, steatite, cordierite, zirconia, and the like. In particular, when the main component of the polycrystalline ceramic is an oxide, the bonding strength by the bonding layer 55 can be made relatively high.

Further, when the main component is a non-oxide, the bonding strength can be increased by using the lid body 12b whose surface is oxidized before bonding. Further, when the lid 12b is a single crystal, sapphire, quartz, langasite (La ₃ Ga ₅ SiO ₁₄ ), bismuth silicate (Bi ₁₄ Si ₃ O ₁₂ ), emerald (Be ₃ Al ₂ Si ₆ O ₁₈ ) Etc. The concentration of the Si component contained in the lid 12b is preferably 0.01% by weight or more.

  In addition, when the lid 12b is a polycrystalline ceramic, it is desirable that the Si component be interposed in the grain boundary layer in the polycrystalline ceramic. Since it is present in the grain boundary layer, the Si component easily elutes at the bonding interface between the lid 12b and the element mounting body 134 during the heat treatment during bonding, and can act as the bonding layer 155 with higher bonding strength. . Further, the Si component is any one of oxide, carbide, boride, nitride, or a composite thereof, and the lid body 12b preferably contains at least one or more Si component, and further has a glassy substance. It is desirable that

  In addition, although it does not specifically limit as components other than Si component, When Si component is glassy, it is preferable that it is an element and its compound which lower | hangs the melting | fusing point. By reducing the melting point of the glassy material, the heat treatment temperature at the time of bonding can be set low, and as a result, the residual stress on the lid 12b and the element mounting body 134 can be relaxed. Moreover, it is also preferable that it is an element and its compound which reduce the viscosity of Si component. By reducing the viscosity of the Si component, the Si component easily elutes at the bonding interface between the lid 12b and the element mounting body 134 during heat treatment, facilitating the formation of the bonding layer 155 and shortening the heat treatment time. Can do. Therefore, examples of the component other than the Si component include magnesium compounds, calcium compounds, sodium compounds, potassium compounds, boron compounds, lead compounds, and these compounds.

  The element mounting body 134 is mainly composed of a material selected from polycrystalline ceramics, single crystals, and metals. The element mounting body 134 does not necessarily contain a Si component, but the element mounting body 134 is also preferably made of a ceramic containing a Si component for the purpose of increasing the bonding strength. This is because the Si component is eluted from both the lid 12b and the element mounting body 134 on the bonding layer 155 side, and the Si compound is interposed in a sufficient amount on the bonding surface, so that the bonding strength can be further increased.

  Here, the lid 12b and the element mounting body 134 may be dense or porous, but are preferably dense, and may have any shape such as a plate shape or a block shape.

  Moreover, it is preferable that the Si component between the lid body 12b and the element mounting body 134 has a higher content ratio with respect to both the lid body 12b and the element mounting body 134. When the Si component is high, the effect of relaxing the stress generated in the joint is higher, and the reliability as the light emitting device tends to be higher.

  The wavy line shown in FIG. 10 shows the distribution of Si concentration in the lid 12b and the element mounting body 134. The portion having a low Si concentration in the lid 12b is α, and the Si concentration in the element mounting body 134 is The small part is shown as β. The composite ceramic body 110 of the present invention has a structure in which the lid body 12b, the element mounting body 134, and the bonding layer 155 are stacked. However, when the Si concentration decreases toward the bonding surface, apparently the lid body 12b Another layer (α, β) is formed between the bonding layer 155 and the element mounting body 134 and the bonding layer 155, and the α, β layer acts as a stress relaxation layer. It is thought that it acts on cracking and crack suppression while improving the bonding strength. In the present embodiment, it is preferable that the Si concentration of the lid body 12b or the element mounting body 134 decreases toward the bonding surface.

  FIGS. 11A to 11C show composition analysis at positions corresponding to points A, B, and C shown in FIG. 10 when the lid 12b and the element mounting body 134 are both made of alumina ceramics. It is a schematic diagram of a result. FIGS. 12A and 12B are schematic cross-sectional views for explaining the joined state of the lid 12b and the element mounting body 134. FIG. 12A is a state in which the lid 12b and the element mounting body 134 are in contact with each other. (B) has shown the state which the cover body 12b and the element mounting body 134 joined.

  In compositional analysis, the bonded surface was observed with a transmission electron microscope (TEM), and then elemental qualitative analysis was performed by EDS analysis. As is apparent from FIG. 11, it can be seen that the Si concentration at the point B near the joint surface is reduced with respect to the point A inside the lid 12b. The Si concentration continuously decreases toward the bonding surface, and the wavy line in FIG. 10 is shown for convenience. The Si concentration may decrease toward the bonding surface in either one of the lid body 12b and the element mounting body 134.

  Here, this phenomenon will be described in more detail by taking as an example the case where the lid body 12b and the element mounting body 134 are made of alumina ceramics.

  12 (a) and 12 (b), 154 indicates alumina particles and 156 indicates a grain boundary glass layer.

  The lid body 12b and the element mounting body 134 perform mirror polishing on the surfaces that become the bonding surfaces before bonding. The surfaces of the mirror-polished lid 12b and the element mounting body 134 are exposed with alumina particles 154 as the main component, and are surrounded by a grain boundary glass layer 136 having Si as the main component. It has become.

  The surfaces in this state face each other and are mechanically brought into close contact as shown in FIG. In this way, the mirror-polished surfaces are put together and brought into mechanical contact as shown in FIG. 11A, and then heat treatment is performed at a high temperature. In the state of being in close mechanical contact before the heat treatment, the concentration of Si present in the vicinity of the bonding surface is lower than that in the lid 12b and the element mounting body 134. When heat treatment is performed at a high temperature of 1000 ° C. to 1800 ° C. in this state, the components of the grain boundary glass layer 135 in the vicinity of the joint surfaces of the lid 12b and the element mounting body 134 made of alumina ceramics are converted into the lid 12b and It diffuses and moves to the bonding surface of the element mounting body 134, and a bonding layer 155 is formed as shown in FIG. Since the main component of the grain boundary glass layer 136 is Si and the diffusion is remarkable in the vicinity of the bonding surface, the Si component moves to the bonding surface side, so the vicinity of the bonding surface of the lid body 12b and the element mounting body 134. Therefore, the Si concentration in the vicinity of the bonding layer 155 is reduced compared to the inside. In this manner, the Si concentration is reduced and the bonding layer 155 is formed at the same time in the vicinity of the bonding layer 155, so that the bonding strength can be increased and the bonding layer 156 can relieve the thermal stress during bonding. Cracks and cracks generated in the part are suppressed.

  The bonding layer 155 positioned between the lid body 12b and the element mounting body 134 preferably has a thickness of 200 nm or less.

  Thereby, the layer of the bonding interface between the lid 12b and the element mounting body 134 is not substantially observed, and a bonding without a bonding interface can be obtained visually. Note that, as described above, the thickness of the bonding layer 155 and the bonding interface can be observed with a transmission electron microscope, and a sample for the observation can be manufactured by a normal method. In this embodiment, since the Si component contained in the lid body 12b and the element mounting body 134 is eluted and no separately prepared adhesive is used, the bonding layer 155 has a very thin thickness of 200 nm or less. It becomes uniform.

  Note that the bonding layer 155 preferably contains oxygen atoms in addition to the Si component. By containing oxygen atoms, the viscosity of the Si component can be lowered and the bonding strength can be increased. In addition, the thickness accuracy of the bonding layer 155 can be increased, and the parallelism between the lid body 12b and the element mounting body 134 can be improved.

  Further, since the component of the bonding layer 155 is molten glass, it is possible to eliminate a gap (a space at the atomic level) between the lid 12b and the element mounting body 134, and a high level of strength is maintained. Therefore, the presence of the bonding layer 155 can have high heat transfer performance and high heat resistance at the bonding portion between the lid body 12b and the element mounting body 134.

  Next, the element mounting 134 will be described with reference to the drawings. FIG. 13 is a schematic explanatory view for explaining the element mounting body 134, (a) is a schematic perspective view of the element mounting body 134, and (b) is a schematic perspective view of the element mounting body 134. 14A and 14B are diagrams showing a state where the light-emitting element 152 is placed on the element placing body 134, where FIG. 14A is a top view, and FIG. 14B is a schematic cross-sectional view taken along line BB shown in FIG. (C) is a schematic sectional drawing in CC line shown to (a).

  The element mounting body 134 is used with the light emitting element 152 mounted thereon. The element mounting body 134 has a conductor layer 146 and an electrode body 149 on the surface. The element mounting body 134 includes a flat portion 164 on which the light emitting element 152 is mounted, and a protrusion 168 including a slope 166 for reflecting light from the light emitting element so as to surround the flat portion 164. Is provided. The top surface 169 of the protrusion 168 is substantially parallel to the flat portion 164.

  In the element mounting body 134, the convex portion 161 is continuously provided from the flat portion 164 to the inclined surface 166. The convex portion 161 has a substantially triangular cross section with a smaller cross-sectional area as it approaches the top, and the angle α formed between the side surface 167 of the convex portion 161 and the flat portion 164 of the element mounting body 134 is 90 °. <Α. Further, an angle β formed by the side surface 167 of the convex portion 161 and the inclined surface 166 of the element mounting body 134 is 90 ° <β.

  As shown in the figure, the convex portion 161 is annularly continuous with the surface of the element mounting body 134. Two concave portions 121 surrounded by the continuous convex portion 161 are arranged adjacent to each other.

  The element mounting body 134 is composed mainly of ceramics. In the element mounting body 134 for mounting the light emitting element 152 made of LED, the ceramic is preferably mainly composed of alumina, for example. Alumina has good reflectivity with respect to light emission from the light emitting element 152. In addition, a fine structure of several mm to 1 mm or less can be formed relatively easily by molding. Further, it is possible to form the electrode relatively easily using metallization technology. In these respects, alumina is preferably used as a material constituting the element mounting body 134, but other ceramic materials, resin materials, and the like can also be used depending on applications. It is not limited.

  The conductive layer 146 is continuously provided from the flat portion 164 to the inclined surface 166, and is drawn outward from the flat portion 164 to the inclined surface 166. The conductive layer 146 is provided so as to fill the inside of the concave portion 121, and as shown in FIGS. 14B and 14C, the flat surface portion 164 of the element mounting body 134 and the side surface 167 of the convex portion 161. It is applied over. The conductive layer 146 has a known multilayer metal film structure in which a plating layer is laminated on a metallized layer, for example. The conductive layer 146 is configured, for example, by laminating a Ni plating layer and an Au plating layer on a Mo-Mn metallization layer. In the present embodiment, the height of the conductive layer 146 is set lower than the height of the convex portion 161. In other words, the height of the convex portion 161 is set to such a height that the conductive layer 146 does not overflow from the convex portion 161. Note that the conductive layer 146 may be higher than the height of the convex portion 161. For example, the conductive layer 146 may be formed in a shape that rises from the convex portion 161 due to surface tension.

  The electrode body 149 is formed on the top surface 169 of the protrusion 168, and a part of the electrode body 149 is connected to the conductive layer 146 so as to climb over the convex portion 161.

  When the conductive layer 146 is formed from the flat surface portion 164 to the inclined surface 166, for example, when a metallization process is used, defects such as disconnection are likely to occur near the corner of the boundary between the flat surface portion 164 and the inclined surface 166. Further, a protrusion 168 is provided so as to surround the flat portion 164, and movement of the electrode forming jig or the like is restricted. For example, in the state where there is no convex portion 161, the smaller the size of the element mounting body 134, the more likely to be a failure due to disconnection, performance variation due to electrode shape failure, or a short circuit.

  The element mounting body 134 and the side surface 167 of the convex portion 161 define the electrode width (lateral length in FIG. 8C), the position, and the shape of the conductive layer 146. Thereby, the shape and positional accuracy of the conductive layer 146 are relatively high. For example, even if the electrode width is as fine as 1 mm or less, the position and shape are defined with high accuracy.

  The light-emitting element 152 is a known light-emitting diode element, and is disposed on the planar portion 164 of the element mounting body 134 via a conductive layer 146 as shown in FIG. In the present embodiment, the light emitting element 152 is flip-chip connected to two electrically conductive layers 146 that are electrically independent from each other. Power is supplied to the light-emitting element 152 through the conductive layer 146, and the light-emitting element 152 emits light according to the supplied electrode.

  The electrode body 149 is connected to the wiring pattern 142 on the surface of the lid body 12b through, for example, a wire 144, and the light emitting element 152 emits light by the power supplied through the external power source. In this embodiment, since the wire 119 and the light emitting element 152 can be separated from each other, damage or the like of the light emitting element 152 in a wiring process such as a bonding process can be suppressed.

  The light emitting element 152 generates heat with light emission, and the conductive layer 146 and the element mounting body 134 thermally expand in response to the heat generation in the vicinity of the arrangement region of the light emitting element 152. For example, the element mounting body 134 made of ceramics and the conductive layer 146 made of, for example, a multilayer metal layer have different thermal expansion coefficients, and the degree of thermal expansion due to light emission is different. In the present embodiment, the conductive layer 146 is attached not only to the flat portion 164 but also to the inclined surface 166 of the convex portion 161 of the element mounting body 134, and the covering of the element mounting body 134 and the conductive layer 146 is performed. Strong wearing strength. Further, even when the conductive layer 146 expands and contracts more than the element mounting body 134, the expansion of the conductive layer 146 in the width direction is suppressed by the convex portions 161, and the stress along the width direction is reduced. It is suppressed. Moreover, in the light-emitting body 120, the convex portion 161 has a substantially triangular cross section that has a smaller cross-sectional area as it approaches the top, and has a relatively high mechanical strength. For this reason, even if the thermal stress accompanying light emission / extinction of the LED element 152 is applied, cracks and cracks are relatively unlikely to occur in the convex portion 161. Further, the angle α formed between the side surface 167 and the inclined surface 166 is an obtuse angle, that is, 90 ° <α, and the conductive layer 146 is easily expanded and contracted in the direction perpendicular to the plane portion 164. In the light emitting body 120, distortion at the joint surface between the element mounting body 134 and the conductive layer 146 is suppressed, and stress is dispersed in a direction perpendicular to the planar portion 164. In the present embodiment, the conductive layer 146 is formed in a predetermined shape and a predetermined position with high accuracy, and a failure such as peeling of the conductive layer 146 due to light emission hardly occurs. The light emitter 152 has relatively high electrical performance and light emission efficiency, and relatively high operation reliability.

  Hereinafter, an example of a method for manufacturing the light emitting device 501 will be described.

(1) Preparation of element mounting body 134 First, the element mounting body 34 is manufactured. First, alumina powder and sintering aid powder are mixed, water is added, and wet pulverization is performed. After grinding, a slurry is prepared by adding and mixing polyvinyl alcohol or the like as an organic binder. The slurry is spray dried to produce granules. The granules are pressure-molded using a mold to form a formed body. The shape of this mold is designed so that the shape of the substrate is obtained after firing. For example, a recess is formed in the mold so as to become a convex portion after firing. The generated shaped body is fired at 1500 to 1700 ° C. to produce the element mounting body 34 mainly composed of alumina. Thereafter, if necessary, the surface of the substrate may be barrel-polished in order to remove burrs, and further washed and dried. The height of the convex portion is, for example, 0.02 to 0.4 mm, and preferably 0.05 to 0.2 mm. The width | variety of a convex-shaped part is 0.05-0.6 mm, for example, Preferably it is 0.1-0.4 mm.

(2) Preparation of container body 12 Also, a container body 12 made of dense ceramics is prepared. The container body 12 can be produced, for example, through the same process as in the above-described embodiment. Similar to the above-described embodiment, after obtaining a structure in which the first member 12a, the lid body 12b, the dispersion portion 14a, and the dispersion portion 14b are integrally joined by molten glass, the outer surface of the container body 12 is flattened, for example, Smooth polishing with a grinding machine.

(3) Joining of each member Next, the produced element mounting body 34 and the container body 12 are joined. First, for each joint surface of the element mounting body 34 and the container body 12, for example, mirror polishing is performed so that the surface roughness Ra is 0.05 μm or less. The mirror-polished surface is exposed with alumina particles as the main component, and is surrounded by a grain boundary glass layer 56 with Si as the main component. The surfaces in this state are faced to form a state in which the joint surfaces are in mechanical contact with each other, and then heat treatment is performed at a high temperature. When heat treatment is performed at a high temperature of 1000 ° C. to 1800 ° C. in this state, the components of the grain boundary glass layer in the vicinity of the joint surfaces of the container body 12 and the element mounting body 34 made of alumina ceramics are converted into the container body 12 and the element. A diffusion layer 155 is diffused and moved to the bonding surface of the mounting body 34, and a bonding layer 155 mainly composed of an Si compound containing the eluted Si component is formed in the vicinity of the bonding portion between the container body 12 and the element mounting body 34. The layer 155 relaxes the thermal stress at the time of bonding, and cracks and cracks generated in the vicinity of the bonding layer 155 in the vicinity of the bonding portion between the container body 12 and the element mounting body 34 are suppressed.

(5) Formation of Conductor Wiring Next, a conductive layer 46 is formed on the element mounting body 34. A paste containing Mo powder and Mn powder is applied to the concave region surrounded by the convex portion 61 of the manufactured element mounting body 34. In this paste application, the paste is defined and arranged with high accuracy within the area surrounded by the convex portion 61 of the element mounting body 34. Thereafter, the whole is heat-treated in a reducing atmosphere with the paste disposed. By heating, the first metal layer attached to the element mounting body 34 is formed. Thereafter, a plating layer as a second metal layer is formed on the first metal layer. Plating is performed in the order of Ni plating and Au plating. The thickness of the Ni plating is, for example, 1 to 10 μm, and the thickness of the Au plating is, for example, 0.1 to 3 μm.

  Thereafter, an electrode body 49 is formed on the element mounting body 34. At the same time, the wiring pattern 42 is formed on the surface of the substrate 32. The electrode body 49 disposed on the flat top surface 69 and the wiring pattern 42 disposed on the base body 32 may be formed using a known printed wiring technique such as a screen printing method. The side surface 67a is inclined so as to approach the vertically lower side as it approaches the center of the flat surface portion 64 from the top surface 69. Even when the electrode paste is applied by screen printing or the like, the side surface 67a gets over the convex portion along the side surface 67a. In form, the electrode paste is connected to the conductive layer 46. For example, using a screen printing method, a paste containing Mo powder and Mn powder is applied in a predetermined shape, and heat treatment is performed in a reducing atmosphere to form a metallized layer having a predetermined shape. At this time, the paste passes over the convex portion and is connected to the conductive layer 46. Thereafter, an electrode body 49 is formed by sequentially laminating Ni plating and Au plating on the surface of the metallized layer.

  For example, when a light emitting element mounting body on which a wiring pattern has been applied in advance is used, if the heat treatment is performed at a high temperature of 1000 ° C. to 1800 ° C., the wiring that has been applied in advance may be melted. In the present embodiment, the element mounting body 34, the casing 36, and the base 32 are directly joined by heating to a high temperature, and then the conductive layer 46 and the wiring pattern 42 are formed by printing. In the element mounting body 34 of the present embodiment, the electrode width (lateral length in FIG. 8C), position, and shape of the conductive layer 46 are defined by the side surface 67 of the convex portion 61. Thereby, even when a technique such as printing is used, the shape and positional accuracy of the conductive layer 46 are relatively high.

(6) Encapsulation of refrigerant Next, a liquid-phase refrigerant is encapsulated inside the cooling body. The refrigerant is sealed inside the cooling body through the through hole 78. Thereafter, a metal, other inorganic substance, organic substance, or the like is fixed to the through hole 78 to form a cooling body sealed by the sealing member 79. For example, a cooling member sealed by the sealing member 19 is configured by disposing a metal member in the through hole 78 and deforming the member by applying pressure from the outside (so-called caulking). In addition, what is necessary is just to use conventionally well-known methods, such as a heat extraction method, a vacuum pump method, and a gas liquefaction method, for enclosure of a refrigerant | coolant.

(7) Arrangement of Light Emitting Element Next, the light emitting element 52 is arranged. The light emitting element 52 is disposed on the plane portion 64 through the electrode 52. An electrode (not shown) of the light emitting element 52 is disposed so as to face the conductive layer 46, and the electrode of the light emitting element 52 and the conductive layer 46 are joined by flip chip bonding. For mounting the light emitting element 52, a method by which the light emitting element 52 and the conductive layer 46 can be electrically connected can be selected. For example, the mounting method may be a soldering method, wire bonding connected through a metal wire, or the like.

  The light emitting device 150 of the present embodiment can also emit light emitted from the light emitting element 152 with high efficiency, for example, in the upward direction in FIG. The light emitting device 150 can irradiate a relatively high amount of light with respect to input power with high stability over a long period of time. Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 Cooler 12 Container body 14 Dispersion | distribution part 14a 1st dispersion | distribution part 14b 2nd dispersion | distribution part 16 Wall part 18 Through-hole 19 Sealing member 30 Wiring board 32 Wiring pattern 50 Light-emitting device 52 Light-emitting element 54 Reflective surface 56 Convex part

Claims (15)

A cooler in which a refrigerant is sealed in a plate-shaped container,
In the container, at least a part of two opposing inner main surfaces is composed mainly of dense ceramics,
A porous ceramic body through which the refrigerant passes is housed inside the container;
The cooler, wherein the porous shellac body is bonded to the dense ceramics on the inner main surface.   2. The cooler according to claim 1, wherein at least one of the two opposing inner main surfaces is entirely composed of a dense ceramic as a main component. The porous ceramic body is
The cooler according to claim 1, wherein the cooler is joined to both of the two inner main surfaces of the container. The porous ceramic body is
The cooler according to claim 3, wherein the cooler is continuous from one inner main surface to the other inner main surface. The porous ceramic body is
A first porous layer bonded to the inner main surface;
A second porous layer having an average opening diameter smaller than that of the first porous layer;
The cooler according to claim 1, comprising: The first porous layer is composed mainly of first ceramic particles and a glass component for bonding the first ceramic particles;
The second porous layer is composed mainly of second ceramic particles having a particle size smaller than that of the first ceramic particles and a glass component for bonding the second ceramic particles.
The cooler according to claim 5, wherein the first ceramic particles and the second ceramic particles are made of the same material.   The first porous layer and the second porous layer are bonded together by a glass component contained in the first porous layer and a glass component contained in the second porous layer. The cooler according to claim 6. The cooler according to any one of claims 1 to 7,
Conductor wiring provided on the surface of the container that the cooling body has,
A wiring board comprising: A wiring board according to claim 8,
A light emitting device comprising: a light emitting element disposed on the wiring board and electrically connected to the conductor wiring. In the container, at least a part of the outer main surface is mainly composed of ceramics containing Si,
An element mounting body mainly composed of ceramics containing Si, disposed in the partial region of the outer main surface;
The light emitting element is mounted on the element mounting body;
The container and the element mounting body have a higher Si content than at least one of the partial region of the container and the element mounting body, and are the same as the main component elements of the element mounting body A light emitting body which is bonded through a bonding layer containing an element as a main component. The light emitting body according to claim 10, wherein the container and the element mounting body include alumina (Al ₂ O ₃ ) as a main component.   The light emitting body according to claim 10 or 11, wherein the element mounting body has a flat surface portion on which the light emitting element is mounted, and a protruding portion disposed around the flat surface portion.   The light emitting body according to claim 10, wherein a conductor layer for electrically connecting to the light emitting element is provided on the surface of the element mounting body. The element mounting body includes a convex portion in a part of the region including the planar portion,
The light emitter according to claim 13, wherein the conductor layer is deposited from a surface of the flat portion to a side surface of the convex portion. The light emitter according to claim 14, wherein the side surface of the convex portion is inclined, and an angle formed with the surface of the flat portion is an obtuse angle.

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