JPH06247776A - Porous ceramic joined body and its production - Google Patents
Porous ceramic joined body and its productionInfo
- Publication number
- JPH06247776A JPH06247776A JP5808393A JP5808393A JPH06247776A JP H06247776 A JPH06247776 A JP H06247776A JP 5808393 A JP5808393 A JP 5808393A JP 5808393 A JP5808393 A JP 5808393A JP H06247776 A JPH06247776 A JP H06247776A
- Authority
- JP
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- Prior art keywords
- porous
- joined
- ceramics
- porous material
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、少なくとも一方が多
孔材から成る被接合セラミックス部材を互いに接合した
多孔セラミックス接合体及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a porous ceramics joined body in which joined ceramics members, at least one of which is made of a porous material, are joined to each other, and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、セラミックス部材の接合方法とし
て、ＣａＯ，ＳｉＯ2 等からなる酸化物ソルダーを被接
合面に塗布した後、両者を加圧しながら高温に保持して
接合する方法が広く知られている。 2. Description of the Related Art Heretofore, as a method for joining ceramic members, a method is widely known in which an oxide solder made of CaO, SiO 2 or the like is applied to the surfaces to be joined, and then both are held at a high temperature while being pressurized. ing.
【０００３】また、特開平２−２１７３７０号公報に
は、セラミックスと金属の接合材及び接合方法が開示さ
れている。該接合材は、表層部が酸化被膜で覆われた金
属材と、この金属材の上記酸化被膜側の面に接合される
多孔質の酸化物系セラミックス材と、これらセラミック
ス材と金属材との間に介在させられて一面側が上記酸化
被膜に接着し、且つ他面側が上記セラミックス材のポー
ラスに一部を入り込ませた状態で固着した接合ガラス層
とを有するものである。Japanese Unexamined Patent Publication (Kokai) No. 2-217370 discloses a bonding material for a ceramic and a metal and a bonding method. The bonding material includes a metal material whose surface layer is covered with an oxide film, a porous oxide-based ceramic material bonded to the surface of the metal material on the oxide film side, and the ceramic material and the metal material. It has a bonded glass layer which is interposed between and adheres to the oxide film on one surface side and is fixed on the other surface side with a part of the ceramic material inserted into the porous material.
【０００４】また、セラミックス・金属接合体の製造方
法として、特開平３−１０３３６９号公報に開示された
ものがある。該セラミックス・金属接合体の製造方法
は、セラミックス体と金属体との接合面に、セラミック
ス多孔層を形成し、この接合層を介して金属体とセラミ
ックス体とを接合するものである。Further, as a method for manufacturing a ceramic / metal bonded body, there is one disclosed in Japanese Patent Laid-Open No. 3-103369. In the method for manufacturing the ceramic / metal bonded body, a ceramic porous layer is formed on the bonding surface between the ceramic body and the metal body, and the metal body and the ceramic body are bonded via this bonded layer.
【０００５】[0005]
【発明が解決しようとする課題】ところで、セラミック
ス部材の接合方法として、多孔セラミックスを緻密セラ
ミックス又は多孔セラミックスに接合する場合に、酸化
物ソルダーを被接合面に塗布する方法では、多孔セラミ
ックスが気孔を含んでいる分、接合面積が減少するため
に高い接合強度が得られない。また、接合相近傍の結晶
粒子間の結合が弱い場合にも高い接合強度が得られない
という問題がある。By the way, as a method of joining ceramic members, in the case of joining porous ceramics to dense ceramics or porous ceramics, in the method of applying oxide solder to the surfaces to be joined, the porous ceramics form pores. Since the bonding area is reduced due to the inclusion, high bonding strength cannot be obtained. Further, there is a problem that high bonding strength cannot be obtained even when the bond between the crystal grains in the vicinity of the bonding phase is weak.
【０００６】前掲特開平２−２１７３７０号公報に開示
されたセラミックスと金属の接合材及び接合方法は、接
合面積を増大させているが、基本的にはセラミックスと
金属との接合に関する技術的思想であり、セラミックス
としては熱膨張係数の大きい酸化物を選定している。そ
のため、該接合方法は、含浸材としてもやはり熱膨張係
数の大きいガラス材を使用しており、このようなガラス
材では粘度を低下させることが困難であり、従って、多
孔材中の気孔サイズをかなり大きく形成する必要があ
る。また、前掲特開平３−１０３３６９号公報に開示さ
れたセラミックス・金属接合体の製造方法は、基本的に
は上記と同様にセラミックスと金属との接合である。The bonding material and bonding method for ceramics and metal disclosed in Japanese Patent Laid-Open No. 217370/1990 increase the bonding area, but basically, it is a technical idea regarding the bonding of ceramics and metal. Therefore, oxides having a large coefficient of thermal expansion are selected as ceramics. Therefore, in the joining method, a glass material having a large thermal expansion coefficient is also used as the impregnating material, and it is difficult to reduce the viscosity with such a glass material, and therefore the pore size in the porous material is reduced. It needs to be made quite large. Further, the method of manufacturing a ceramic / metal bonded body disclosed in the above-mentioned Japanese Patent Laid-Open No. 3-103369 is basically bonding ceramics and metal in the same manner as described above.
【０００７】そこで、この発明の目的は、上記の課題を
解決することであり、互いに接合される被接合セラミッ
クス部材が多孔材と多孔材或いは多孔材と緻密材から成
り、多孔材の気孔中にソルダー剤と反応する有機ケイ素
ポリマーを充填し、気孔を有機ケイ素ポリマーで閉塞し
て熱分解させ、その表面にソルダー剤を塗布し、高温加
圧することで実質的に接合面積を増大させて接合強度を
高める多孔セラミックス接合体及びその製造方法を提供
することである。Therefore, an object of the present invention is to solve the above-mentioned problems, and the ceramic members to be joined which are joined to each other are composed of a porous material and a porous material or a porous material and a dense material, and It is filled with an organosilicon polymer that reacts with the solder agent, the pores are blocked with the organosilicon polymer and pyrolyzed, the solder agent is applied to the surface, and the bonding area is substantially increased by applying high temperature pressure to increase the bond strength. It is an object of the present invention to provide a porous ceramics joined body which enhances the temperature and a manufacturing method thereof.
【０００８】[0008]
【課題を解決するための手段】この発明は、上記の目的
を達成するために、次のように構成されている。即ち、
この発明は、互いに接合される被接合セラミックス部材
のうち少なくとも一方が多孔材であり、接合部近傍の部
分に含まれる気孔の全部又は一部に有機ケイ素ポリマー
が転化したセラミックスが充填されていることを特徴と
する多孔セラミックス接合体に関する。In order to achieve the above object, the present invention is configured as follows. That is,
According to the present invention, at least one of the ceramic members to be bonded to each other is a porous material, and all or some of the pores included in the vicinity of the bonding portion are filled with ceramics obtained by converting the organosilicon polymer. Relates to a porous ceramics joined body.
【０００９】或いは、この発明は、互いに接合される被
接合セラミックス部材のうち少なくとも一方の多孔材の
接合部近傍に含まれる気孔に有機ケイ素ポリマーを含浸
させた後、該有機ケイ素ポリマーを熱分解させるステッ
プ、前記多孔材の接合面にガラス質ソルダーを塗布し、
ガラス質ソルダーを塗布した前記多孔材に他方の前記被
接合セラミックス部材を重ね合わせるステップ、次いで
前記ガラス質ソルダーの融点以上に加熱するステップを
有することを特徴とする多孔セラミックス接合体の製造
方法に関する。Alternatively, according to the present invention, after the organic silicon polymer is impregnated into the pores included in the vicinity of the bonded portion of at least one of the porous members to be bonded to each other, the organic silicon polymer is thermally decomposed. Step, apply a glassy solder to the joint surface of the porous material,
The present invention relates to a method for producing a porous ceramics joined body, comprising a step of superimposing the other ceramic member to be joined on the porous material coated with the glassy solder, and a step of heating to the melting point of the glassy solder or higher.
【００１０】[0010]
【作用】この発明による多孔セラミックス接合体及びそ
の製造方法は、上記のように構成されており、次のよう
に作用する。即ち、この多孔セラミックス接合体は、互
いに接合される被接合セラミックス部材のうち少なくと
も一方が多孔材であり、接合部近傍の部分に含まれる気
孔の全部又は一部に有機ケイ素ポリマーが充填されてい
るものであり、有機ケイ素ポリマーの粘度は希釈の度合
いで大きな範囲にわたってコントロールができ、例え
ば、１０μｍ程度の穴でも毛細管現象により含浸可能で
あり、接合部近傍の気孔のサイズが小さくても含浸でき
る。しかるに、多孔セラミックスの気孔にガラス材、金
属等を含浸させるためには、気孔のサイズを大きくする
必要があり、セラミックスが有する気孔を大きくする
と、結果的に多孔セラミックスの強度が低下する。The porous ceramics bonded body and the method for manufacturing the same according to the present invention are configured as described above, and operate as follows. That is, in this porous ceramics bonded body, at least one of the bonded ceramics members to be bonded to each other is a porous material, and all or some of the pores included in the vicinity of the bonded portion are filled with the organosilicon polymer. The viscosity of the organosilicon polymer can be controlled over a wide range by the degree of dilution, and for example, even a hole of about 10 μm can be impregnated by a capillary phenomenon and can be impregnated even if the size of pores near the joint is small. However, in order to impregnate the pores of the porous ceramics with a glass material, a metal or the like, it is necessary to increase the size of the pores, and if the pores of the ceramics are enlarged, the strength of the porous ceramics decreases as a result.
【００１１】そして、有機ケイ素ポリマーを含浸させた
強度の高い多孔材の表面にソルダー材を塗布し、高温加
圧させることによって実質的に接合面積を増大させると
共に、この部分に含まれる結晶粒子間の結合力を高める
ことができ、接合強度を向上できる。従って、この発明
による多孔セラミックス接合体は、少なくとも一方が多
孔材であれば、高い接合強度を確保できるものであり、
多孔材と多孔材との接合、或いは多孔材と緻密質材との
接合を良好に行うことができるものである。Then, the solder material is applied to the surface of the porous material having a high strength impregnated with the organosilicon polymer, and the bonding area is substantially increased by pressurizing at a high temperature. It is possible to increase the bonding strength of the above and improve the bonding strength. Therefore, the porous ceramics joined body according to the present invention can secure a high joining strength if at least one is a porous material,
It is possible to favorably bond the porous material and the porous material or the porous material and the dense material.
【００１２】[0012]
【実施例】以下、図面を参照して、この発明による多孔
セラミックス接合体及びその製造方法の実施例を説明す
る。図１はこの発明による多孔セラミックス接合体の一
実施例を示す説明図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the porous ceramics bonded body and the method for manufacturing the same according to the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view showing an embodiment of a porous ceramics joined body according to the present invention.
【００１３】この発明による多孔セラミックス接合体の
一実施例を、図１を参照して説明する。図１に示すよう
に、この多孔セラミックス接合体は、被接合セラミック
ス部材のうち一方が多孔材１であり、他方が緻密質材２
であり、両者を接合部３を介して互いに接合したもので
ある。多孔材１の接合部３の近傍の部分に含まれる気孔
４の全部又は一部に有機ケイ素ポリマーが転化したセラ
ミックス５が充填されているものである。図中、符号Ａ
は多孔材１の領域を示し、符号Ｂは緻密質材２の領域を
示し、符号Ｃは接合層の領域を示し、更に符号Ｄは多孔
材１の気孔４が有機ケイ素ポリマーが転化したセラミッ
クス５が充填された気孔閉塞領域を示している。このよ
うな多孔セラミックス接合体としては、例えば、エンジ
ン部品では、ピストンヘッド部の遮熱構造を構成する材
料として利用できる。An embodiment of the porous ceramics bonded body according to the present invention will be described with reference to FIG. As shown in FIG. 1, in this porous ceramics joined body, one of the joined ceramic members is a porous material 1 and the other is a dense material 2.
And both are bonded to each other via the bonding portion 3. All or some of the pores 4 included in the portion of the porous material 1 in the vicinity of the joint 3 are filled with the ceramics 5 in which the organosilicon polymer is converted. Reference numeral A in the figure
Indicates the region of the porous material 1, the reference symbol B indicates the region of the dense material 2, the reference symbol C indicates the region of the bonding layer, and the reference symbol D indicates the ceramics 5 in which the pores 4 of the porous material 1 are converted by the organosilicon polymer. Shows a closed pore area. Such a porous ceramics bonded body can be used, for example, as a material for forming a heat shield structure of a piston head portion in an engine part.
【００１４】この実施例の多孔セラミックス接合体にお
いて、多孔材１は、Ｓｉを主成分とするセラミックスで
あり、その他Ａｌ，Ｔｉ，Ｏ，Ｎから構成されているセ
ラミックスである。更に、多孔材１は、気孔が３０％以
上であり、その３点曲げ平均強度が６０ＭＰａ以上の強
度を有しており、熱膨張係数が４×１０- 6 ／℃以下の
ものである。また、有機ケイ素ポリマーとしては、ポリ
シラザン、ポリカルボシランを使用できる。緻密質材２
としては、例えば、気孔が１％以下の窒化ケイ素Ｓｉ3
Ｎ4 等のセラミックスである。また、接合層の領域Ｃ
は、例えば、２０〜１００μｍ程度である。In the porous ceramics joined body of this embodiment, the porous material 1 is a ceramic containing Si as a main component, and other ceramics composed of Al, Ti, O and N. Further, the porous material 1, the pores is 30% or more, the three-point bending average intensity has an intensity of more than 60 MPa, the thermal expansion coefficient of 4 × 10 - is of the 6 / ° C. or less. Further, as the organosilicon polymer, polysilazane or polycarbosilane can be used. Dense material 2
Is, for example, silicon nitride Si 3 having a porosity of 1% or less.
Ceramics such as N 4 . In addition, the region C of the bonding layer
Is, for example, about 20 to 100 μm.
【００１５】この発明による多孔セラミックス接合体の
別の実施例を、図２を参照して説明する。この実施例で
は、上記実施例の部材と同一部材には同一の符号を付し
ている。図２に示すように、この多孔セラミックス接合
体は、被接合セラミックス部材は両者とも多孔材１であ
り、両者を接合部３を介して互いに接合したものであ
る。両方の多孔材１の接合部３の近傍の部分に含まれる
気孔４の全部又は一部には、有機ケイ素ポリマーが転化
したセラミックス５が充填されている。図中、符号Ａは
多孔材１の領域を示し、符号Ｃは接合層の領域を示し、
更に、符号Ｄは多孔材１の気孔４が有機ケイ素ポリマー
が転化したセラミックス５が充填された気孔閉塞領域を
示している。Another embodiment of the porous ceramics bonded body according to the present invention will be described with reference to FIG. In this embodiment, the same members as those in the above embodiment are designated by the same reference numerals. As shown in FIG. 2, in this porous ceramics bonded body, both ceramic members to be bonded are porous materials 1, and both are bonded to each other via a bonding portion 3. Ceramics 5 in which an organosilicon polymer is converted is filled in all or a part of the pores 4 included in a portion near the joint portion 3 of both porous materials 1. In the figure, symbol A indicates the region of the porous material 1, symbol C indicates the region of the bonding layer,
Further, symbol D indicates a pore closed region in which the pores 4 of the porous material 1 are filled with the ceramics 5 in which the organosilicon polymer is converted.
【００１６】この多孔セラミックス接合体において、多
孔材１は、Ｓｉを主成分とするセラミックスであり、そ
の他Ａｌ，Ｔｉ，Ｏ，Ｎから構成されているセラミック
スである。更に、多孔材１は、気孔が３０％以上であ
り、その３点曲げ平均強度が６０ＭＰａ以上の強度を有
しており、熱膨張係数が４×１０- 6 ／℃以下のもので
ある。また、有機ケイ素ポリマー５としては、ポリシラ
ザン、ポリカルボシランを使用できる。In this porous ceramics joined body, the porous material 1 is a ceramic containing Si as a main component, and other ceramics composed of Al, Ti, O and N. Further, the porous material 1, the pores is 30% or more, the three-point bending average intensity has an intensity of more than 60 MPa, the thermal expansion coefficient of 4 × 10 - is of the 6 / ° C. or less. As the organosilicon polymer 5, polysilazane or polycarbosilane can be used.
【００１７】次に、この発明による多孔セラミックス接
合体の製造方法を説明する。この多孔セラミックス接合
体の製造方法は、主として、互いに接合される被接合セ
ラミックス部材のうち少なくとも一方の多孔材の接合部
近傍に含まれる気孔に有機ケイ素ポリマーを含浸させた
後、該有機ケイ素ポリマーを熱分解させるステップ、前
記多孔材の接合面にガラス質ソルダーを塗布し、ガラス
質ソルダーを塗布した前記多孔材に他方の前記被接合セ
ラミックス部材を重ね合わせるステップ、次いで前記ガ
ラス質ソルダーの融点以上に加熱するステップを有する
ものである。Next, a method of manufacturing the porous ceramics bonded body according to the present invention will be described. This method for producing a porous ceramics bonded body is mainly performed by impregnating the pores included in the vicinity of the bonded portion of at least one porous material of the bonded ceramic members to be bonded with each other with the organic silicon polymer, Step of thermally decomposing, applying a glassy solder to the bonding surface of the porous material, superimposing the other ceramic material to be bonded to the porous material coated with a glassy solder, then to the melting point of the glassy solder or more It has a step of heating.
【００１８】この多孔セラミックス接合体の製造方法の
一実施例として、一方が多孔材で且つ他方が緻密質材か
ら成る被接合セラミックス部材を互いに接合するものを
説明する。まず、ＳｉとＴｉＡｌ2 Ｏ5 とを６５：３５
の重量比となるように秤量し、蒸留水を媒体として混合
して混合物を作り、該混合物を乾燥した後に、乾燥混合
物を粉砕して粒状物を作製した。更に粒状物を分級して
粉末原料を作製した。この粉末原料を成形原料として金
型で予備成形した後、ＣＩＰによって約１トン／ｃｍ2
の圧力で成形して成形体を作製した。この成形体を加熱
脱脂した後、窒素雰囲気中で最高１４００℃まで加熱し
て反応焼成を行った。こうして得られた焼成体は焼成後
生成した不安定な窒化物が存在している。そこで、焼成
体を大気炉内で１０００℃で約１０時間加熱処理し、窒
化物を安定した酸化物に転化させた。As an example of the method for manufacturing the porous ceramics joined body, a method for joining the joined ceramics members, one of which is a porous material and the other of which is a dense material, will be described. First, Si and TiAl 2 O 5 are mixed at 65:35.
The mixture was weighed so as to have a weight ratio of 1, and distilled water was mixed as a medium to prepare a mixture, and the mixture was dried, and then the dried mixture was pulverized to prepare granules. Further, the granular material was classified to prepare a powder raw material. This powdered raw material was used as a forming raw material and was preformed in a mold, and then about 1 ton / cm 2 by CIP
A molded body was produced by molding under pressure. This molded body was heated and degreased, and then heated to a maximum of 1400 ° C. in a nitrogen atmosphere to carry out reaction firing. The fired body thus obtained has unstable nitrides formed after firing. Therefore, the fired body was heat-treated in an atmospheric furnace at 1000 ° C. for about 10 hours to convert the nitride into a stable oxide.
【００１９】上記の製造方法で得られたセラミックス
は、ＳＥＭ（Scanning Electron Microscopy）の観察と
画像処理装置による測定によれば、約２８％の気孔を含
む多孔材であった。これらの気孔は、開気孔と閉気孔の
両者を含んでいるものである。また、この多孔材は、熱
伝導率が２．８Ｗ／ｍ・Ｋと低く、熱膨張係数が４×１
０- 6 ／℃以下であり、また、４点曲げ平均強度が約２
１０ＭＰａであった。この多孔材は、低熱伝導材として
は高強度を有するため、例えば、断熱エンジン部品に利
用できるものである。The ceramic obtained by the above manufacturing method was a porous material containing about 28% of pores as observed by SEM (Scanning Electron Microscopy) and measured by an image processing apparatus. These pores include both open pores and closed pores. Also, this porous material has a low thermal conductivity of 2.8 W / m · K and a thermal expansion coefficient of 4 × 1.
0 - 6 / ° C. or less, also, the average bending strength 4 point about 2
It was 10 MPa. Since this porous material has high strength as a low heat conductive material, it can be used, for example, in heat insulating engine parts.
【００２０】一方、有機ケイ素ポリマーとしてポリカル
ボシランを使用し、該ポリカルボシランをトルエンで希
釈した２０％濃度溶液を作製し、該溶液を上記で得た多
孔材の表面に含浸させた。上記溶液が含浸した多孔材を
１５０℃で乾燥した後、所定温度に加熱し、ポリカルボ
シランをセラミックスに転化させた。この工程を数回繰
り返し行った結果、多孔材の表面層近傍の気孔は、多孔
材の基材中のそれに比較して大幅に減少しており、多孔
材の表面層のみがあたかも緻密質セラミックスであるよ
うな組織となっていることを観察により確認できた。On the other hand, polycarbosilane was used as the organosilicon polymer to prepare a 20% concentration solution of the polycarbosilane diluted with toluene, and the solution was impregnated on the surface of the porous material obtained above. The porous material impregnated with the above solution was dried at 150 ° C. and then heated to a predetermined temperature to convert polycarbosilane into ceramics. As a result of repeating this process several times, the pores in the vicinity of the surface layer of the porous material were significantly reduced as compared with those in the base material of the porous material, and only the surface layer of the porous material was as dense ceramic. It was possible to confirm by observation that the tissue had a certain structure.
【００２１】また、ソルダー材として、ＣａＯとＳｉＯ
2 を２：３の割合で配合した後、加熱溶融し、それを水
中で急冷することで作製されたガラスを粉砕し、該ガラ
ス粉末に所定量のＳｉ3 Ｎ4 粉末を配合し、更に粘度を
高めるために、ポリビニルアルコール溶液を混合したソ
ルダー材ペイストを作製した。Further, as a solder material, CaO and SiO
2 was mixed at a ratio of 2: 3, heated and melted, and the glass produced by quenching it in water was crushed, and a predetermined amount of Si 3 N 4 powder was added to the glass powder, and the viscosity was further increased. In order to increase the temperature, a paste of solder material was prepared by mixing a polyvinyl alcohol solution.
【００２２】上記多孔材に接合する相手材の被接合セラ
ミックス部材の緻密質材としては、相対密度９９％以上
のＳｉ3 Ｎ4 のガス圧焼成体を選定した。そこで、緻密
質材と多孔材とを４０×４０×４０ｍｍの立方体の接合
試料にそれぞれ加工した。次いで、両者の被接合セラミ
ックス部材の接合面を加工して研磨し、十分な平面にす
ると共に平滑度を上げた後、上記のソルダー材ペイスト
を多孔材と緻密質材との接合面に塗布し、多孔材と緻密
質材とを加圧して脱気した後、６００℃まで大気中にて
加熱することで脱脂した。As the dense material of the ceramic material to be bonded, which is a mating material to be bonded to the porous material, a gas pressure fired body of Si 3 N 4 having a relative density of 99% or more was selected. Therefore, the dense material and the porous material were processed into cubic bonded samples of 40 × 40 × 40 mm, respectively. Then, the joint surfaces of the two ceramic members to be joined are processed and polished to have a sufficient flatness and smoothness, and then the solder material paste is applied to the joint surface of the porous material and the dense material. After depressurizing the porous material and the dense material by depressurizing, the material was heated to 600 ° C. in the atmosphere to degrease.
【００２３】緻密質材と多孔材との接合は、ホットプレ
スにより行った。即ち、緻密質材と多孔材との試料を黒
鉛ダイス内に置き、Ｎ2 雰囲気中で所定圧を付与した状
態で、最高１５５０℃まで加熱した。次いで、炉冷し、
緻密質材と多孔材との接合体を炉から取り出し、接合体
の接合部を中央にした形状の３点曲げ試験片に加工し
た。２０本の接合体の試験片の３点曲げ強度を測定した
ところ、接合体の平均強度は約１９４ＭＰａであった。
また、接合体を６００℃の雰囲気中で強度を測定した
が、強度は低下しないことが確認できた。接合体の破断
面を観察すると、接合体の約８割が接合層の部分で破壊
していることを確認した。The dense material and the porous material were joined by hot pressing. That is, a sample of a dense material and a porous material was placed in a graphite die and heated to a maximum of 1550 ° C. in a N 2 atmosphere with a predetermined pressure applied. Then furnace cool,
The bonded body of the dense material and the porous material was taken out from the furnace and processed into a three-point bending test piece having a shape with the bonded portion of the bonded body in the center. When the three-point bending strength of 20 test pieces of the joined body was measured, the average strength of the joined body was about 194 MPa.
Moreover, the strength of the bonded body was measured in an atmosphere of 600 ° C., but it was confirmed that the strength did not decrease. By observing the fracture surface of the joined body, it was confirmed that about 80% of the joined body was broken at the joining layer.
【００２４】この発明による多孔セラミックス接合体
を、別の接合体と比較するため、比較接合体を作製し
た。比較接合体は、上記製造工程において、有機ケイ素
ポリマーの含浸工程を除いて同様の工程で比較試験片を
作製した。このようにして作製した比較試験片の強度試
験を行ったところ、３点曲げ強度の平均強度は６６ＭＰ
ａと低いレベルのものであった。また、比較試験片の破
断面を観察したところ、多孔材の表面層の粒子が破断面
の各所に付着しており、接合後、こうした部分の結合力
が低くなっていると考えられた。A comparative joint was prepared in order to compare the porous ceramic joint according to the present invention with another joint. As for the comparative joined body, a comparative test piece was produced in the same process in the above manufacturing process except for the impregnation step of the organic silicon polymer. When the strength test of the comparative test piece manufactured in this way was conducted, the average strength of the three-point bending strength was 66MP.
It was as low as a. Further, when the fracture surface of the comparative test piece was observed, it was considered that the particles of the surface layer of the porous material adhered to various places on the fracture surface, and the bonding force of such a portion became low after joining.
【００２５】次に、この発明による多孔セラミックス接
合体の製造方法の別の実施例を説明する。この実施例
は、被接合セラミックス部材の両者が多孔材からなり、
多孔材同志を互いに接合するものである。即ち、この実
施例は、上記実施例における緻密質材の代わりに多孔材
を用いたものである。多孔材及びソルダー材の作製、使
用した有機ケイ素ポリマーは、上記実施例と同様の条件
であるので、ここではそれらの工程についての説明は省
略する。多孔材と多孔材との接合体の強度評価を行った
ところ、これらの接合体の接合部の平均強度は、１８７
ＭＰａ程度であった。そして、この接合部の平均強度
は、多孔材の強度とほぼ同等の強度であることが確認で
きた。Next, another embodiment of the method for producing a porous ceramics joined body according to the present invention will be described. In this example, both of the ceramic members to be joined are made of a porous material,
The porous materials are joined together. That is, in this example, a porous material was used in place of the dense material in the above example. The organic silicon polymer used for producing the porous material and the solder material and the used organic silicon polymer are under the same conditions as those in the above-mentioned examples, and therefore, the description of those steps is omitted here. When the strength evaluation of the bonded body of the porous materials was carried out, the average strength of the bonded portion of these bonded bodies was 187
It was about MPa. And, it was confirmed that the average strength of this joint was almost the same as the strength of the porous material.
【００２６】[0026]
【発明の効果】この発明による多孔セラミックス接合体
及びその製造方法は、上記のように構成されており、次
のような効果を有する。即ち、この発明による多孔セラ
ミックス接合体は、互いに接合される被接合セラミック
ス部材のうち少なくとも一方が多孔材であり、接合部近
傍の部分に含まれる気孔の全部又は一部に有機ケイ素ポ
リマーを転化させたセラミックスが充填されているの
で、接合部を高強度にすることができ、多孔材の持つ特
性、或いは緻密質材の持つ特性を有効に活かした複合構
造体を得ることができる。しかも、この多孔セラミック
ス接合体は、高温状態でも、接合強度が低下しないもの
である。従って、例えば、エンジン部品として、ピスト
ンヘッド部の遮熱構造を高強度な構造で且つ遮熱性を向
上させたものに作製できる。The porous ceramics bonded body and the method for producing the same according to the present invention are configured as described above and have the following effects. That is, in the porous ceramics joined body according to the present invention, at least one of the joined ceramics members to be joined to each other is a porous material, and the organosilicon polymer is converted into all or a part of the pores included in the portion in the vicinity of the joined portion. Since it is filled with ceramics, the joint portion can be made to have high strength, and a composite structure can be obtained in which the characteristics of the porous material or the characteristics of the dense material are effectively utilized. Moreover, this porous ceramics bonded body does not have a decreased bonding strength even in a high temperature state. Therefore, for example, as an engine component, the heat shield structure of the piston head portion can be manufactured to have a high strength structure and an improved heat shield property.
【００２７】また、この多孔セラミックス接合体は、互
いに接合される被接合セラミックス部材のうち少なくと
も一方の多孔材の接合部近傍に含まれる気孔に有機ケイ
素ポリマーを含浸させ、多孔材の気孔に含浸した有機ケ
イ素ポリマーを熱分解させ、前記多孔材の接合面に塗布
したガラス質ソルダーを介在して他方の前記被接合セラ
ミックス部材を重ね合わせ、次いで前記ガラス質ソルダ
ーの融点以上に加熱することによって作製することがで
きる。Further, in this porous ceramics joined body, the pores included in the vicinity of the joined portion of at least one of the joined porous ceramic members to be joined are impregnated with the organosilicon polymer, and the pores of the porous material are impregnated. It is prepared by thermally decomposing an organosilicon polymer, stacking the other ceramic members to be bonded with a glassy solder applied to the bonding surface of the porous material interposed therebetween, and then heating the glassy solder to a temperature above the melting point of the glassy solder. be able to.
【図１】この発明による多孔セラミックス接合体の一実
施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of a porous ceramics joined body according to the present invention.
【図２】この発明による多孔セラミックス接合体の別の
実施例を示す断面図である。FIG. 2 is a cross-sectional view showing another embodiment of a porous ceramics joined body according to the present invention.
１ 多孔材 ２ 緻密質材 ３ 接合部 ４ 気孔 ５ 有機ケイ素ポリマーの転化したセラミックス DESCRIPTION OF SYMBOLS 1 Porous material 2 Dense material 3 Joined portion 4 Porosity 5 Ceramics obtained by converting organosilicon polymer
Claims (2)
材のうち少なくとも一方が多孔材であり、接合部近傍の
部分に含まれる気孔の全部又は一部に有機ケイ素ポリマ
ーを転化させたセラミックスが充填されていることを特
徴とする多孔セラミックス接合体。1. At least one of the ceramic members to be bonded to each other is a porous material, and ceramics obtained by converting an organosilicon polymer is filled in all or some of the pores included in the vicinity of the bonding portion. A porous ceramics joined body characterized by being present.
材のうち少なくとも一方の多孔材の接合部近傍に含まれ
る気孔に有機ケイ素ポリマーを含浸させた後、該有機ケ
イ素ポリマーを熱分解させるステップ、前記多孔材の接
合面にガラス質ソルダーを塗布し、ガラス質ソルダーを
塗布した前記多孔材に他方の前記被接合セラミックス部
材を重ね合わせるステップ、次いで前記ガラス質ソルダ
ーの融点以上に加熱するステップを有することを特徴と
する多孔セラミックス接合体の製造方法。2. A step of impregnating pores included in the vicinity of a joint portion of at least one porous material of ceramic members to be joined with each other with an organic silicon polymer, and then thermally decomposing the organic silicon polymer, Applying a vitreous solder to the joint surface of the material, superimposing the other ceramic material to be joined to the porous material coated with the vitreous solder, and then heating to above the melting point of the vitreous solder. A method for producing a joined porous ceramics body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5808393A JPH06247776A (en) | 1993-02-24 | 1993-02-24 | Porous ceramic joined body and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5808393A JPH06247776A (en) | 1993-02-24 | 1993-02-24 | Porous ceramic joined body and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06247776A true JPH06247776A (en) | 1994-09-06 |
Family
ID=13074034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5808393A Pending JPH06247776A (en) | 1993-02-24 | 1993-02-24 | Porous ceramic joined body and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06247776A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096994A (en) * | 2009-09-29 | 2011-05-12 | Kyocera Corp | Cooler, wiring board and light emitting body |
| CN112555283A (en) * | 2019-09-26 | 2021-03-26 | 大同金属工业株式会社 | Sliding member |
-
1993
- 1993-02-24 JP JP5808393A patent/JPH06247776A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011096994A (en) * | 2009-09-29 | 2011-05-12 | Kyocera Corp | Cooler, wiring board and light emitting body |
| CN112555283A (en) * | 2019-09-26 | 2021-03-26 | 大同金属工业株式会社 | Sliding member |
| CN112555283B (en) * | 2019-09-26 | 2022-11-15 | 大同金属工业株式会社 | Sliding member |
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