JP2011096961A - Method of manufacturing led element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED element manufacturing method allowing batch mounting of many LED elements. <P>SOLUTION: The method at least includes: a step of cutting an LED element wafer stuck onto an expanded tape vertically and horizontally to form respective LED element chips and expanding the expanded tape up to a predetermined size; the positioning step of inserting the respective LED element chips on the expanded and enlarged expanded tape into openings in a positioning tool plate to bring corners of the respective LED element chips into contact with the corners of the openings in the tool plate and aligning the respective LED element chips at predetermined positions; and the step of putting and mounting the aligned LED element chips onto a circuit board. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an LED element.

  In recent years, light-emitting diodes (hereinafter referred to as “LEDs”) have been rapidly used for new markets such as lighting, automobile lamps, TVs and personal computers. Various methods for manufacturing these LED elements have been proposed. As an example, a method for mounting a single LED element chip on a substrate is disclosed (for example, see Patent Document 1). This LED element is formed by dividing and separating a large number of LED elements formed on a wafer substrate such as silicon by photoetching technology into individual LED element chips, and thereafter die bonding, wire bonding, resin sealing, etc. It is assembled through the process. Hereinafter, this conventional manufacturing method will be briefly described with reference to FIGS.

  As shown in FIG. 12 (a), a wafer substrate 1 in which LEDs are formed is stuck on an expandable expandable tape 2, and as shown in FIG. 12 (b), the wafer substrate on the expandable tape 2 is attached. 1 is divided into each LED element chip 4 by a dicing apparatus, and as shown in FIG. 12C, the expanded tape 2 is stretched to secure the distance c between the individual LED element chips 4 on the expanded tape 2A. To separate.

  Thereafter, as shown in FIG. 13A, the LED element chip 4 is pulled away from the expanded tape 2 </ b> A using a pickup device, and the single LED element chip 4 is transferred and mounted on the circuit board 6. FIG. 13B is a schematic cross-sectional view showing the operation of the pickup device. The expanded tape 2A is sucked and sucked by the air in the tape guide 7, and the LED element chip 4 is pushed up by the needle and separated from the expanded tape 2A. Then, it is adsorbed and transferred to the adsorption collet 5 (see, for example, Patent Document 2). Next, as shown in FIG. 13C, a translucent sealing resin 8 is formed on the circuit board 6 so as to cover the LED element chip 4, and as shown in FIG. 6 and the sealing resin 8 are diced vertically and horizontally at predetermined positions to obtain individual LED elements 10.

JP 2008-521210 A (refer to page 6-7, FIG. 2-3) Japanese Patent Laid-Open No. 11-260892 (see page 2, FIG. 2)

  However, in the LED element manufacturing method in the prior art, the expanded tape is only a means for extending the expanded tape from the outer periphery in order to widen the chip interval from the state in which the LED element wafer is cut into LED element chips. It was. For this reason, a single LED element chip is mounted on the substrate, and there is a problem that the accuracy when mounting the LED element chip on the substrate is required to be high, and the mounting time increases.

(Object of invention)
The present invention has been made in view of the above problems, and an object of the present invention is to provide an LED element manufacturing method capable of mounting a large number of LED elements with high accuracy and collectively.

  In order to achieve the above object, the LED element manufacturing method of the present invention is a process of cutting each LED element chip by vertically and horizontally cutting an LED element wafer adhered on an expanded tape, and expanding the expanded tape to a predetermined size. And inserting each LED element chip on the expanded expansion tape into the opening of the positioning jig plate and bringing the corner of each LED element chip into contact with the corner of the opening of the jig plate. And a step of aligning the LED element chips at a predetermined position and a step of mounting the aligned LED element chips on a circuit board and mounting the LED element chips.

  A positioning step of moving the jig plate in a predetermined direction to bring a corner of each LED element chip into contact with a corner of the opening and aligning the LED element chips at a predetermined position; A step of fixing a temporary fixing member to the upper surface of each of the aligned LED element chips; and peeling off the expansion tape; and placing each LED element chip fixed to the temporary fixing member on a circuit board. A crimping step of crimping, and a step of releasing the fixation between each LED element chip and the temporary fixing member and then finally crimping and mounting each LED element chip on a circuit board.

The step of temporarily fixing a temporary fixing member to the upper surface of each of the aligned LED element chips is characterized by temporarily fixing an adhesive tape to the upper surface of each of the aligned LED element chips.
Further, the step of fixing the temporary fixing member to the upper surface of the aligned LED element chips is characterized in that the LED element chips are sucked and temporarily fixed by a vacuum chuck table.
Each LED element chip is adsorbed by a vacuum chuck table via a porous Teflon sheet (registered trademark).

  A step of placing the positioning jig plate at a predetermined position on the circuit board and inserting each LED element chip on the expanded expanded tape into the opening of the jig plate; The expanded tape is sucked by the vacuum chuck table and moved in a predetermined direction so that the corners of the LED element chips are brought into contact with the corners of the opening of the jig plate to bring the LED element chips into a predetermined position. A positioning step for aligning, a pressure-bonding step for releasing the adsorption between the expansion tape and the vacuum chuck table and placing each LED element chip on the expansion tape on a circuit board and pressure-bonding; and the expansion expansion And a step of peeling the tape from each of the LED element chips and mounting each LED element chip by press-bonding onto the circuit board. The features.

  Moreover, the process of peeling the said expansion | extension expanded tape from each said LED element chip is a state which made the convex part provided in the jig plate for peeling penetrate the said expansion | extension tape, and pressed the said each LED element chip | tip. The expanded expandable tape is peeled off from the LED element chips.

  Moreover, it has the process of irradiating an ultraviolet-ray to the said expanded expanded tape, and reducing the adhesive force of the said expanded expand tape.

  Further, the jig plate is removed from each LED element chip, a sealing resin member is formed on the circuit board so as to cover the LED element chip, and the circuit board and the sealing resin member are vertically and horizontally arranged. And a step of cutting into individual LED elements.

  As described above, according to the present invention, the LED element chip group on the expanded expanded tape can be accurately aligned at a predetermined position, and many LED element chips can be collectively placed on the circuit board. It becomes possible to mount with high accuracy. As a result, it is possible to realize an LED element manufacturing method that enables efficient mounting with a short assembly time while maintaining positional accuracy.

It is sectional drawing which shows the manufacturing process of the LED element in the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the LED element in the 1st Embodiment of this invention. It is a top view which shows the positioning process of the LED element in the 1st Embodiment of this invention. It is sectional drawing which shows the other example of the moving method of the jig board in the 1st Embodiment of this invention. It is a top view which shows the jig | tool board for positioning in the 1st Embodiment of this invention, and the positioning method of a circuit board. It is sectional drawing which shows the LED element manufactured by the manufacturing method of the LED element in the 1st Embodiment of this invention. It is sectional drawing which shows the LED element manufactured by the manufacturing method of the LED element in the 1st Embodiment of this invention. It is sectional drawing which shows the other example of the positioning process of the LED element in the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the LED element in the 2nd Embodiment of this invention. It is a top view which shows the positioning process of the LED element in the 2nd Embodiment of this invention. It is sectional drawing which shows the method of peeling an expanded tape from the LED element in the 2nd Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the LED element in a prior art. It is sectional drawing which shows the manufacturing process of the LED element in a prior art.

  FIGS. 1 to 8 are diagrams for explaining a manufacturing method of the LED element in the first embodiment, and FIGS. 9 to 11 are diagrams for explaining a manufacturing method of the LED element in the second embodiment. . Hereinafter, the manufacturing method of the LED element in embodiment of this invention is demonstrated based on figures.

(First embodiment)
1 and 2 are cross-sectional views showing the manufacturing steps of the LED element in the first embodiment. As shown to Fig.1 (a), the LED element wafer 11 in which LED was formed in the inside on the expanded tape 12 is stuck. Next, as shown in FIG. 1B, the LED element wafer 11 affixed on the expanded tape 12 is subjected to full dicing using a diamond blade in a desired chip size vertically and horizontally at predetermined positions. Divide into LED element chips 14. The LED element chips 14 divided at this time are arranged in a matrix in a state of being attached to the expanded tape 12.

  Next, as shown in FIG. 1C, the expanded tape 12 to which the fully-diced LED element chip 14 is attached is expanded. The expanded tape 12 is expanded to become an expanded expanded tape 12A, and the distance a between the LED element chips 14 is expanded accordingly. At this time, the expanded tape 12 is expanded so that each LED element chip 14 is located at a position corresponding to a position on a circuit board 16 to be described later. However, the positional accuracy is low, and a positional shift occurs. Thus, since each LED element chip 14 in the expanded state is not aligned at the correct position, positioning is performed using a jig plate as shown below.

  Next, as shown in FIG.1 (d), the positioning jig board 51 which has the opening part 52 is arrange | positioned on each LED element chip 14 side on the expansion expanded tape 12A, and each LED element chip 14 is mounted on a jig board. The jig plate 51 is placed on the enlarged expanded tape 12A as shown in FIG. 1 (e). A plan view of this state is shown in FIG. As shown in FIG. 3A, the opening 52 of the jig plate 51 is arranged so as to correspond to the position of each LED element chip 14 arranged on a circuit board described later, and the size thereof is It is set to a large value for each LED element chip 14 to such an extent that the displacement of the LED element chip 14 can be absorbed. Note that the shapes of the LED element chip 14 and the opening 52 of the jig plate 51 will be described by taking a quadrilateral shape as an example.

  Next, the jig plate 51 is moved in the direction indicated by the arrow A in FIG. f) and as shown in FIG. 3B, each LED element chip 14 is positioned by bringing the corner part 14a of each LED element chip 14 into contact with the corner part 52a of the opening 52 of the jig plate 51 to obtain a predetermined value. Align to the position.

  Next, as shown in FIG. 2A, adhesive tape 19 as a temporary fixing member is attached to the upper surface of each LED element chip 14 aligned by the jig plate 51 on the enlarged expanded tape 12A and temporarily fixed. . Next, the expanded expandable tape 12A is irradiated with ultraviolet rays to reduce the adhesive force between each LED element chip 14 and the expanded expandable tape 12A, and then the expanded expandable tape 12A is peeled off from each LED element chip 14 to obtain FIG. As shown in b), the LED element chips 14 temporarily fixed to the adhesive tape 19 are collectively placed on the circuit board 16 and bonded. Next, the adhesive tape 19 is peeled from each LED element chip 14, and each LED element chip 14 is finally pressure-bonded onto the circuit board. As a result, the LED element chips 14 are collectively and mechanically bonded and mounted on the circuit board 16. Note that for the pressure bonding, ultrasonic pressure bonding or the like in which ultrasonic waves are applied using an ultrasonic head is preferable. As the circuit board 16, a glass epoxy type or silicon type substrate can be used. A silicon substrate is preferable because it has good thermal conductivity and is excellent in the cooling effect of the LED element chip 14.

  Fig.5 (a) is a top view which shows the positioning method of the jig board 51 and the circuit board 16, FIG.5 (b) is AA sectional drawing of Fig.5 (a). As shown in FIG. 5, the positioning pins 55a and 55b are provided on the circuit board 16, and the positioning holes 53a53b are provided at the positions of the jig plate 51 corresponding to the positioning pins 55a and 55b. The board | substrate 16 can be aligned easily and, thereby, each LED element chip 14 and the circuit board 16 can be aligned accurately.

  In the temporary fixing step described above, each LED element chip 14 can be temporarily fixed by being sucked by a vacuum chuck table instead of the adhesive tape 19. At this time, as shown in FIG. 4, each LED element chip 14 is preferably adsorbed by a vacuum chuck table 21 via a porous Teflon sheet (registered trademark) 22. The porous Teflon sheet (registered trademark) 22 can prevent the displacement of the LED element chips 14 and the scratches generated on the LED element chips 14 when the vacuum chuck table 21 is released from the adsorption of the LED element chips 14. . Moreover, the level | step difference by the dispersion | variation in the height of each LED element chip 14 at the time of mounting each LED element chip 14 on the circuit board 16 can be eased.

  Next, as shown in FIG. 2C, the jig plate 51 is removed from each LED element chip 14, and the sealing resin member 18 is formed on the circuit board 16 so as to cover the LED element chip 14. A light-transmitting insulating material such as a silicone resin is used for the sealing resin member 18, and it is cured after flowing between the LED element chips 14. The light-transmitting insulating material is not particularly limited as long as it is light-transmitting, and epoxy resin, urea resin, fluorine resin, or the like can be used.

  Next, as shown in FIG. 2D, the circuit board 16 and the sealing resin member 18 are fully diced vertically and horizontally at predetermined positions to form individual LED elements 20. As described above, according to the present embodiment, in the process of mounting on the circuit board, it is easy to position many LED elements at once, so that the LE element is excellent in positional accuracy and efficient. A manufacturing method can be realized.

  FIG. 6 is a cross-sectional view showing the LED element 20 manufactured by the LED element manufacturing method according to the first embodiment. As shown in FIG. 6, in the LED element 20, the LED element chip 14 is placed on the electrodes 17a and 17b of the glass epoxy circuit board 16, and the pads 13a and 13b of the LED element chip 14 (of the LED element chip 14). Anode electrode or cathode electrode) and electrodes 17 a and 17 b of circuit board 16 are connected by bumps 15. Further, the LED element chip 14 and the bump 15 are sealed and protected by a sealing resin member 18 formed on the circuit board 16. In the description of the manufacturing method, illustration and description of the electrodes on the LED element chip 14 and the circuit board 16 are omitted. As the material of the bump 15, gold (Au), eutectic solder (Au—Sn), Pb—Sn, lead-free solder, or the like can be used. In this embodiment, eutectic solder (Au—Sn) is used.

  FIG. 7 shows an example in which a jig plate 61 having a recess 62 is used instead of the jig plate 51 having an opening 52. As shown in FIG. 7, a positioning jig plate 61 having a recess 62 is arranged on each LED element chip 14 side on the expanded expandable tape 12 </ b> A, and each LED element chip 14 is inserted into the recess 62 of the jig plate 61. A jig plate 61 is placed on the enlarged expanded tape 12A. Thereafter, the jig plate 61 is moved in the direction of arrow A in the same manner as the jig plate 51 shown in FIG. 3A, and the corner portions 14 a of the LED element chips 14 are moved to the corner portions 62 a of the openings 62 of the jig plate 61. Each LED element chip 14 is positioned by contact and aligned at a predetermined position. Thereafter, the jig plate 61 is removed in a state where the LED element chips 14 are aligned, and the adhesive tape 19 is attached and fixed to the upper surface of each LED element chip 14 and mounted on the circuit board 16.

  FIG. 8 shows another example using a jig plate 61 having a recess 62. As shown in FIG. 8A, the jig plate 61 is arranged with the opening side of the concave portion 62 facing upward, and each LED element chip 14 on the enlarged expanded tape 12 </ b> A is inserted into the concave portion 62 of the jig plate 61. Next, the expansion expandable tape 12A is irradiated with ultraviolet rays to reduce the adhesive force between each LED element chip 14 and the expanded expandable tape 12A. Next, as shown in FIG. 8B, each LED element chip 14 is pushed by penetrating the protruding pin 29 from the side of the expanded expandable tape 12A, and the LED element chip 14 is recessed from the expanded expandable tape 12A. Drop to 62. Alternatively, each of the LED element chips 14 may be dropped into the concave portion 62 of the jig plate 61 by applying vibration to the enlarged expanded tape 12A. Thereafter, as shown in FIG. 8C, the jig plate 61 is tilted so that the corner 62 a of the opening 62 is lowered, and the corner 14 a of each LED element chip 14 is turned to the corner of the opening 62 of the jig plate 61. Each LED element chip 14 is positioned by being brought into contact with 62a and aligned at a predetermined position. At this time, the jig plate 61 may be vibrated. Thereafter, each LED element chip 14 is sucked and fixed by the vacuum chuck table 21 via the porous Teflon sheet (registered trademark) 22 shown in FIG. 4 and mounted on the circuit board 16.

(Second Embodiment)
FIG. 9 is a cross-sectional view showing a manufacturing process of the LED element in the second embodiment. The LED element manufacturing method according to the present embodiment is an example in which each LED element chip on the expanded expandable tape is inserted and positioned in an opening of a positioning jig plate previously arranged on a circuit board. Others are the same as those of the first embodiment, and the same components are given the same reference numerals and description thereof is omitted.

  As shown in FIG. 9A, a positioning jig plate 51 is disposed on the circuit board 16. The positioning of the circuit board 16 and the jig plate 51 is the same as the example shown in FIG. 5 of the first embodiment. Next, each LED element chip 14 on the expanded expandable tape 12 </ b> A is inserted into the opening 52 of the jig plate 51 on the circuit board 16. Next, the expansion expandable tape 12A is irradiated with ultraviolet rays to reduce the adhesive force between each LED element chip 14 and the expanded expandable tape 12A. Next, as shown in FIG. 9 (b), the expanded expanded tape 12A is sucked and fixed by the vacuum chuck table 21, and is arranged in the direction indicated by the arrow A as shown in FIG. The jig plate 51 is moved in the direction of about 45 degrees with respect to the X direction of the LED element chip 14, and the corner portion 14 a of each LED element chip 14 is brought into contact with the corner portion 52 a of the opening 52 of the jig plate 51. Each LED element chip 14 is positioned and aligned at a predetermined position. In addition, it can replace with the vacuum chuck table 21 and can also use an adhesive tape.

  Next, the expanded expandable tape 12A is peeled from each LED element chip 14, and each LED element chip 14 is pressure-bonded and mounted on a circuit board. Subsequent processes are the same as those in the first embodiment, and a description thereof will be omitted. FIG. 11 shows an example of a method for peeling the enlarged expanded tape 12A from each LED element chip 14. As shown in FIG. 11, a needle-like convex portion 27 is provided at a position corresponding to each LED element chip 14 on the substrate 25, and each LED element chip 14 is pressed through the expanded tape 12 </ b> A by the convex portion 27. Then, the expanded expandable tape 12A is peeled off from each LED element chip 14. Thereby, the position shift prevention of each LED element chip 14 can be ensured. Also in this embodiment, the same effect as that of the first embodiment can be obtained.

  In addition, although demonstrated by the example which applies an ultrasonic wave as a means to mount LED element chip 14 group on the circuit board 16, and crimps electrodes together, it is not limited to this, It welds by pressurization and heating And may be joined.

DESCRIPTION OF SYMBOLS 11 LED element wafer 12 Expanded tape 12A Expanded expansion expanded tape 13a, 13b Pad electrode 14 LED element chip 14a Corner | angular part 15 of LED element chip Bump 16 Circuit board 17a, 17b Circuit board electrode 18 Sealing resin member 19 Adhesive tape 20 LED element 21 Vacuum chuck table
22 Porous Teflon Sheet (registered trademark)
25 Substrate 27 Protruding portion 29 Ejecting pin 51 Jig plate 52 Jig plate opening 52a Opening corners 53a and 53b Positioning holes 55a and 55b Positioning pins 61 Jig plate 62 Jig plate concave portion 62a Recess corner

Claims (9)

Cutting the LED element wafer adhered on the expanded tape vertically and horizontally to form each LED element chip and expanding the expanded tape to a predetermined size; and
Each LED element chip on the expanded expanded tape is inserted into an opening portion of a positioning jig plate, and a corner portion of each LED element chip is brought into contact with a corner portion of the opening portion of the jig plate. A positioning step of aligning each LED element chip at a predetermined position;
Mounting and mounting each of the aligned LED element chips on a circuit board;
The manufacturing method of the LED element characterized by including at least. A positioning step of moving the jig plate in a predetermined direction to bring the corners of the LED element chips into contact with the corners of the opening and aligning the LED element chips at a predetermined position;
Fixing a temporary fixing member on the upper surface of each aligned LED element chip;
A pressure bonding step of peeling off the expanded expand tape, placing each LED element chip fixed to the temporary fixing member on a circuit board, and pressure bonding;
The step of releasing the fixation between each LED element chip and the temporary fixing member and finally mounting each LED element chip on a circuit board; and
The manufacturing method of the LED element of Claim 1 characterized by the above-mentioned.   3. The process of temporarily fixing a temporary fixing member to the upper surface of each of the aligned LED element chips includes temporarily bonding an adhesive tape to the upper surface of each of the aligned LED element chips. The manufacturing method of the LED element of description.   3. The LED element according to claim 2, wherein in the step of fixing the temporary fixing member to the upper surface of the aligned LED element chips, the LED element chips are temporarily fixed by being sucked by a vacuum chuck table. Production method.   5. The method of manufacturing an LED element according to claim 4, wherein each of the LED element chips is adsorbed by a vacuum chuck table via a porous Teflon sheet (registered trademark). Placing the positioning jig plate at a predetermined position on the circuit board, and inserting each LED element chip on the expanded expanded tape into the opening of the jig plate;
The expanding tape is adsorbed by a vacuum chuck table and moved in a predetermined direction so that the corners of the LED element chips are brought into contact with the corners of the opening of the jig plate so that the LED element chips are A positioning step to align with the position;
A pressure bonding step of releasing the adsorption between the expanded tape and the vacuum chuck table and placing each LED element chip on the expanded tape on a circuit board for pressure bonding;
Peeling the expanded expandable tape from the LED element chips, and mounting each LED element chip by pressure bonding on a circuit board;
The manufacturing method of the LED element of Claim 1 characterized by the above-mentioned.   The step of peeling the enlarged expandable tape from each LED element chip includes the step of passing the convex portion provided on the peeling jig plate through the enlarged expanded tape and pressing the convex portion against the LED element chip. The method of manufacturing an LED element according to claim 6, wherein the expanded tape is peeled from each of the LED element chips.   The LED element manufacturing method according to any one of claims 1 to 7, further comprising a step of irradiating the expanded expanded tape with ultraviolet rays to reduce the adhesive strength of the expanded expandable tape. Method. The jig plate is removed from each LED element chip, a sealing resin member is formed on the circuit board so as to cover the LED element chip, and the circuit board and the sealing resin member are cut vertically and horizontally. Separating the individual LED elements,
The manufacturing method of the LED element of any one of Claims 1-8 characterized by the above-mentioned.

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