JP2011096755A - Substrate for mounting electronic component - Google Patents

Substrate for mounting electronic component Download PDF

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Publication number
JP2011096755A
JP2011096755A JP2009247276A JP2009247276A JP2011096755A JP 2011096755 A JP2011096755 A JP 2011096755A JP 2009247276 A JP2009247276 A JP 2009247276A JP 2009247276 A JP2009247276 A JP 2009247276A JP 2011096755 A JP2011096755 A JP 2011096755A
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Prior art keywords
electronic component
mounting
substrate
epoxy resin
mounting portion
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JP2009247276A
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JP5230578B2 (en
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Tetsuo Hirakawa
哲生 平川
Kazuhiro Matsuo
一博 松尾
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component that effectively suppresses an epoxy resin filled between the lower face of an electronic component and a mounting part from flowing out to the outside of the mounting part. <P>SOLUTION: The substrate 9 for mounting an electronic component includes an insulating substrate 1 formed of a ceramic sintered body and having on the upper face a mounting part 1a to which an electronic component 3 whose lower face has a plurality of electrodes 3a is mounted, and each electrode pad 2 formed on the mounting part 1a so as to be oppositely connected to each electrode 3a of the electronic component 3 via each conductive connection material 4. An epoxy resin 5 is filled between the lower face of the electronic component 3 and the mounting part 1a. The substrate 9 for mounting an electronic component is configured such that the part surrounding the mounting part 1a on the upper face of the insulating substrate 1 is deposited with molecules of silicone oil so as to be hydrophobic. The upper face of the insulating substrate 1, which surrounds the mounting part 1a, is made hydrophobic, thereby suppressing the epoxy resin 5 with a polar group from flowing out to the outside of the mounting part 1a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、絶縁基体の上面に、半導体素子や圧電素子等の電子部品を搭載するための搭載部が設けられた電子部品搭載用基板に関するものであり、特に、電子部品の下面が搭載部に対向して搭載され、電子部品の下面と搭載部との間にアンダーフィルとしてエポキシ樹脂が充填される電子部品搭載用基板に関するものである。   The present invention relates to an electronic component mounting board in which a mounting portion for mounting an electronic component such as a semiconductor element or a piezoelectric element is provided on the upper surface of an insulating substrate, and in particular, the lower surface of the electronic component is the mounting portion. The present invention relates to an electronic component mounting substrate which is mounted facing and filled with epoxy resin as an underfill between the lower surface of the electronic component and the mounting portion.

従来、携帯電話やデジタルカメラ，コンピュータ等の電子機器に使用される半導体素子や圧電素子等の電子部品を搭載するための電子部品搭載用基板として、酸化アルミニウム質焼結体等のセラミック焼結体から成り、その上面に電子部品が搭載される搭載部を有する絶縁基体と、搭載部に形成された電極パッドとを備えた電子部品搭載用基板が広く用いられている。   Conventionally, ceramic sintered bodies such as aluminum oxide sintered bodies are used as substrates for mounting electronic components for mounting electronic components such as semiconductor elements and piezoelectric elements used in electronic devices such as mobile phones, digital cameras, and computers. An electronic component mounting substrate comprising an insulating base having a mounting portion on which an electronic component is mounted and an electrode pad formed on the mounting portion is widely used.

この電子部品用基板の搭載部に電子部品が、電子部品の下面に配置された電極が電極パッドと対向するようにして搭載され、電極と電極パッドとが、はんだや導電性接着剤等の導電性接続材を介して電気的および機械的に接続される。電極パッドは、例えば絶縁基体の上面等の表面や内部に形成された配線導体等を介して搭載部の外側に電気的に導出され、外部の電気回路等と電気的に接続される。   The electronic component is mounted on the mounting portion of the electronic component substrate such that the electrode disposed on the lower surface of the electronic component is opposed to the electrode pad, and the electrode and the electrode pad are electrically connected to each other such as solder or conductive adhesive. Electrically and mechanically connected through a conductive connecting material. The electrode pads are electrically led out to the outside of the mounting portion via, for example, the surface such as the upper surface of the insulating base or a wiring conductor formed inside, and are electrically connected to an external electric circuit or the like.

なお、このような電子部品の搭載に際しては、電子部品の電子部品搭載用基板に対する機械的な接続の強度を高く確保するために、エポキシ樹脂等の樹脂材料（いわゆるアンダーフィル）が、電子部品の下面と電子部品搭載用基板の上面の搭載部との間に充填されるのが一般的である。エポキシ樹脂の充填は、通常、流動性を有する未硬化のエポキシ樹脂を電子部品と搭載部との間にいわゆるポッティング等の方法で流し込んで充填し、その後、加熱または紫外線照射等の方法で未硬化のエポキシ樹脂を硬化させる方法で行なわれる。   When mounting such an electronic component, a resin material (so-called underfill) such as an epoxy resin is used for the electronic component in order to ensure high mechanical connection strength of the electronic component to the electronic component mounting board. It is common to fill the space between the lower surface and the mounting portion on the upper surface of the electronic component mounting substrate. The filling of the epoxy resin is usually performed by pouring an uncured epoxy resin having fluidity between the electronic component and the mounting portion by a method such as so-called potting, and then uncured by a method such as heating or ultraviolet irradiation. This method is carried out by curing the epoxy resin.

特開2000−299414号公報JP 2000-299414 A 特開2007−145996号公報JP 2007-145996 特開2008−251836号公報JP 2008-251836 A

しかしながら、上記従来技術の電子部品搭載用基板においては、アンダーフィルとしてのエポキシ樹脂が電子部品搭載用基板の搭載部よりも外側に流れ出てしまいやすいという問題があった。これは、樹脂材料であるエポキシ樹脂が、分子鎖中にエポキシ基や水酸基等の極性基を有していること、および外気の水分が絶縁基体の露出表面に付着しているために絶縁基体の搭載部を含む上面も親水性となっていることから、絶縁基体の表面（上面）に対してエポキシ樹脂が濡れやすいためである。エポキシ樹脂が流れ出てしまうと、電子部品の下面と搭載部との間を充填し切れずに空隙が生じ、電子部品と電子部品搭載用基板に対する接続強度を十分に高くすることができない可能性がある。また、流れ出た樹脂材料が、絶縁基体の上面等の表面に形成されている配線導体等を覆い、配線導体と外部電気回路との電気的な接続が妨げられる等の不具合を生じる可能性がある。   However, the above-described conventional electronic component mounting board has a problem in that an epoxy resin as an underfill tends to flow out from the mounting portion of the electronic component mounting board. This is because the epoxy resin, which is a resin material, has a polar group such as an epoxy group or a hydroxyl group in the molecular chain, and moisture of the outside air adheres to the exposed surface of the insulating substrate. This is because the upper surface including the mounting portion is also hydrophilic, so that the epoxy resin is easily wetted with the surface (upper surface) of the insulating base. If the epoxy resin flows out, there is a possibility that the gap between the lower surface of the electronic component and the mounting part is not completely filled and a gap is generated, and the connection strength between the electronic component and the electronic component mounting board cannot be sufficiently increased. is there. In addition, the resin material that has flowed out may cover a wiring conductor or the like formed on the surface such as the upper surface of the insulating base, and may cause problems such as hindering electrical connection between the wiring conductor and an external electric circuit. .

特に、近年、電子部品搭載用基板に電子部品が搭載されてなる電子装置の小型化の要求に応じて、電子部品搭載用基板の小型化や、電極パッドと電極とが対向して接続する面積の減少や、配線導体の高密度化等が進んでいるため、わずかな樹脂材料の流れ出しでも上記のような不具合を生じやすくなってきている。   In particular, in response to demands for downsizing of electronic devices in which electronic components are mounted on electronic component mounting boards in recent years, downsizing of electronic component mounting boards and areas where electrode pads and electrodes are connected to face each other Therefore, the above-mentioned problems are likely to occur even when a small amount of resin material flows out.

本発明は上記問題点に鑑み案出されたものであり、その目的は、複数の電極が形成された電子部品の下面が絶縁基体の上面の搭載部に対向して搭載される電子部品搭載用基板において、電子部品の下面と搭載部との間に充填されるエポキシ樹脂が搭載部の外側に流れ出ることを効果的に抑制できる電子部品搭載用基板を提供することにある。   The present invention has been devised in view of the above problems, and its purpose is to mount an electronic component in which the lower surface of an electronic component on which a plurality of electrodes are formed is mounted facing the mounting portion on the upper surface of the insulating substrate. An object of the present invention is to provide an electronic component mounting board that can effectively suppress the epoxy resin filled between the lower surface of the electronic component and the mounting portion from flowing out of the mounting portion.

本発明の電子部品搭載用基板は、セラミック焼結体からなり、複数の電極が下面に形成された電子部品を搭載するための搭載部を上面に有する絶縁基体と、前記搭載部に形成された、前記電子部品の前記電極に対向して導電性接続材を介して接続される電極パッドとを備え、前記電子部品の前記下面と前記搭載部との間にエポキシ樹脂が充填される電子部品搭載用基板であって、前記絶縁基体の前記上面の前記搭載部を取り囲む部位は、シリコーンオイルの分子が付着して疎水性になっていることを特徴とするものである。   An electronic component mounting substrate of the present invention is formed of a ceramic sintered body, and has an insulating base having an upper surface for mounting an electronic component having a plurality of electrodes formed on the lower surface, and is formed on the mounting portion. An electronic component mounting comprising an electrode pad connected to the electrode of the electronic component via a conductive connecting material, and filled with an epoxy resin between the lower surface of the electronic component and the mounting portion A portion of the insulating substrate surrounding the mounting portion on the upper surface of the insulating substrate is made hydrophobic by adhesion of silicone oil molecules.

また、本発明の電子部品搭載用基板は、上記構成において、前記シリコーンオイルの分子が直鎖構造であり、該分子が前記絶縁基体の前記上面に生じている凹凸部分に機械的に付着していることを特徴とするものである。   In the electronic component mounting board of the present invention, in the above configuration, the molecules of the silicone oil have a linear structure, and the molecules are mechanically attached to the uneven portions formed on the upper surface of the insulating substrate. It is characterized by being.

本発明の電子部品搭載用基板によれば、絶縁基体の上面の搭載部を取り囲む部位が、シリコーンオイルの分子が付着して疎水性になっていることから、極性基を有するエポキシ樹脂（未硬化のもの）は、この疎水性の上面に対しての濡れ性が低い。そのため、電子部品を搭載部に搭載して、電子部品の下面と搭載部との間にエポキシ樹脂を充填したときに、エポキシ樹脂の流れを、絶縁基体の上面の、搭載部を取り囲む疎水性の部分で効果的に阻止することができる。したがってエポキシ樹脂が搭載部よりも外側に流れ出ることを効果的に抑制することができる電子部品搭載用基板を提供することができる。   According to the electronic component mounting substrate of the present invention, the portion surrounding the mounting portion on the upper surface of the insulating base is made hydrophobic by the adhesion of silicone oil molecules. Are low in wettability with respect to this hydrophobic upper surface. Therefore, when the electronic component is mounted on the mounting portion and the epoxy resin is filled between the lower surface of the electronic component and the mounting portion, the flow of the epoxy resin is changed to the hydrophobicity surrounding the mounting portion on the upper surface of the insulating substrate. It can be effectively blocked at the part. Therefore, it is possible to provide an electronic component mounting board that can effectively suppress the epoxy resin from flowing out of the mounting portion.

また、本発明の電子部品搭載用基板によれば、上記構成において、シリコーンオイルの分子が直鎖構造であり、その分子が絶縁基体の上面に生じている凹凸部分に機械的に付着している場合には、シリコーンオイルの分子と絶縁基体の上面との間の機械的な接触の面積をより大きく確保することができる。したがって、この場合には、シリコーンオイルの分子を絶縁基体の上面により強固に付着させておくことが可能であり、より確実にエポキシ樹脂の流れ出しを抑制することが可能な電子部品搭載用基板を提供することができる。   According to the electronic component mounting substrate of the present invention, in the above configuration, the silicone oil molecule has a linear structure, and the molecule is mechanically attached to the uneven portion formed on the upper surface of the insulating substrate. In this case, a larger area of mechanical contact between the silicone oil molecules and the upper surface of the insulating substrate can be secured. Therefore, in this case, it is possible to adhere the silicone oil molecules more firmly to the upper surface of the insulating base, and to provide an electronic component mounting substrate that can more reliably suppress the flow of epoxy resin. can do.

本発明の電子部品搭載用基板の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the electronic component mounting board | substrate of this invention. 図１に示す電子部品搭載用基板に電子部品を搭載した状態を示す断面図である。It is sectional drawing which shows the state which mounted the electronic component on the electronic component mounting board | substrate shown in FIG. （ａ）は本発明の電子部品搭載用基板の実施の形態の一例における要部を拡大して模式的に示す要部拡大断面図であり、（ｂ）は（ａ）のＡ部分をさらに拡大して示す要部拡大断面図である。(A) is a principal part expanded sectional view which expands and shows typically the principal part in an example of embodiment of the electronic component mounting board | substrate of this invention, (b) further expands the A part of (a). It is a principal part expanded sectional view shown.

本発明の電子部品搭載用基板について添付図面を参照しつつ説明する。   The electronic component mounting board of the present invention will be described with reference to the accompanying drawings.

図１は本発明の電子部品搭載用基板の実施の形態の一例を示す平面図であり、図２は図１に示す電子部品搭載用基板に電子部品を搭載した状態を示す断面図である。   FIG. 1 is a plan view showing an example of an embodiment of an electronic component mounting board according to the present invention, and FIG. 2 is a cross-sectional view showing a state in which the electronic component is mounted on the electronic component mounting board shown in FIG.

図１および図２において、１は絶縁基体，１ａは搭載部，２は電極パッド，３は電子部品，３ａは電極，４は導電性接続材，５はエポキシ樹脂である。絶縁基体１および電極パッド２により電子部品搭載用基板９が基本的に構成され、この電子部品搭載用基板９に電子部品３が搭載されて電子装置が形成されている。   1 and 2, 1 is an insulating substrate, 1a is a mounting portion, 2 is an electrode pad, 3 is an electronic component, 3a is an electrode, 4 is a conductive connecting material, and 5 is an epoxy resin. An electronic component mounting substrate 9 is basically constituted by the insulating base 1 and the electrode pads 2, and the electronic component 3 is mounted on the electronic component mounting substrate 9 to form an electronic device.

絶縁基体１は、ガラスセラミック焼結体や酸化アルミニウム質焼結体，ムライト質焼結体，窒化アルミニウム質焼結体等のセラミック焼結体からなり、その上面に電子部品３が搭載される搭載部１ａが設けられている。   The insulating base 1 is made of a ceramic sintered body such as a glass ceramic sintered body, an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and the electronic component 3 is mounted on the upper surface thereof. Part 1a is provided.

絶縁基体１は、例えば、ガラスセラミック焼結体で形成されている場合であれば、ホウケイ酸系ガラス粉末や酸化アルミニウム，酸化カルシウム等のセラミック粉末等を含む原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿物を作るとともに、この泥漿物をドクターブレード法やカレンダーロール法等によりシート状に成形してセラミックグリーンシート（セラミック生シート）を作製して、その後、セラミックグリーンシートに適当な打ち抜き加工を施すとともにこれを複数枚積層し、約950〜1000℃で焼成することによって製作される。   If the insulating substrate 1 is formed of, for example, a glass ceramic sintered body, an organic binder, a solvent, etc. suitable for a raw material powder containing a borosilicate glass powder, a ceramic powder such as aluminum oxide or calcium oxide, etc. Is added and mixed to make a mud, and this mud is formed into a sheet by a doctor blade method or a calender roll method to produce a ceramic green sheet (ceramic green sheet), and then suitable for a ceramic green sheet It is manufactured by stacking a plurality of sheets and firing them at about 950-1000 ° C.

絶縁基体１上面の搭載部１ａには、電子部品３の電極３ａと対向して、はんだや導電性接着剤等の導電性接続材４を介して電気的および機械的に接続される複数の電極パッド２が形成されている。   A plurality of electrodes that are electrically and mechanically connected to the mounting portion 1a on the upper surface of the insulating base 1 through the conductive connecting material 4 such as solder or conductive adhesive, facing the electrode 3a of the electronic component 3 A pad 2 is formed.

電極パッド２は、例えば円形状や楕円形状，四角形状、またはこれらの形状であって外辺の一部に凹凸部分が設けられたような形状であり、銅や銀，パラジウム，金，白金，タングステン，モリブデン，マンガン等の金属材料により形成されている。   The electrode pad 2 has, for example, a circular shape, an elliptical shape, a quadrangular shape, or a shape in which an uneven portion is provided on a part of the outer side, such as copper, silver, palladium, gold, platinum, It is made of a metal material such as tungsten, molybdenum, or manganese.

電極パッド２は、例えば銅からなる場合であれば、銅の粉末に有機バインダーおよび溶剤を添加混合して金属ペーストを作製して、この金属ペーストをスクリーン印刷法等の印刷方法で絶縁基体１となるセラミックグリーンシートの上面に所定の円形状等のパターンに印刷塗布しておくことによって形成される。   If the electrode pad 2 is made of, for example, copper, a metal paste is prepared by adding and mixing an organic binder and a solvent to the copper powder, and the metal paste is bonded to the insulating substrate 1 by a printing method such as a screen printing method. It is formed by printing and applying a predetermined circular pattern or the like on the upper surface of the ceramic green sheet.

電極パッド２は、例えば、絶縁基体１上面の電極パッド２が形成されている部分から絶縁基体１の下面にかけて形成された配線導体６を介して絶縁基体１の下面等の外表面に電気的に導出されている。この配線導体６を外部電気回路（図示せず）に電気的に接続すれば、搭載される電子部品３の電極３ａを外部電気回路に電気的に接続することができる。   The electrode pad 2 is electrically connected to an outer surface such as a lower surface of the insulating base 1 via a wiring conductor 6 formed from a portion where the electrode pad 2 on the upper surface of the insulating base 1 is formed to a lower surface of the insulating base 1, for example. Has been derived. If this wiring conductor 6 is electrically connected to an external electric circuit (not shown), the electrode 3a of the electronic component 3 to be mounted can be electrically connected to the external electric circuit.

搭載部１ａに搭載される電子部品３は、半導体集積回路素子（ＩＣ）やフォトダイオー（ＰＤ）等の半導体素子，弾性表面波素子，圧力センサ素子や加速度センサ素子等のセンサ素子，コンデンサ，インダクタ，抵抗器等である。   The electronic component 3 mounted on the mounting portion 1a includes semiconductor elements such as semiconductor integrated circuit elements (IC) and photodiodes (PD), surface acoustic wave elements, sensor elements such as pressure sensor elements and acceleration sensor elements, capacitors, and inductors. , Resistors, etc.

電子部品３は、例えばＩＣの場合であれば、シリコン等の半導体基板の主面に電極３ａが形成されている。この電極３ａが電子部品搭載用基板９の電極パッド２と対向し、導電性接続材４を介して接続される。つまり、電子部品３は、電極３ａが形成された主面が下向きに（下面となって）搭載される、いわゆるフリップチップ実装の方法で搭載される。   If the electronic component 3 is an IC, for example, an electrode 3a is formed on the main surface of a semiconductor substrate such as silicon. The electrode 3 a faces the electrode pad 2 of the electronic component mounting substrate 9 and is connected via the conductive connecting material 4. That is, the electronic component 3 is mounted by a so-called flip-chip mounting method in which the main surface on which the electrode 3a is formed is mounted downward (becomes a lower surface).

導電性接続材４は、上記のようにはんだや導電性接着剤等である。例えば、はんだペーストを介して電極パッド２と電極３ａとが対向するように位置合わせしておいて、治具等で保持しながら炉中で加熱すれば、はんだからなる導電性接続材４を介して電極パッド２と電極３ａとが電気的および機械的に接続される。   As described above, the conductive connecting material 4 is solder, a conductive adhesive, or the like. For example, if the electrode pad 2 and the electrode 3a are aligned so as to face each other via a solder paste and heated in a furnace while being held by a jig or the like, the conductive connection material 4 made of solder is interposed. Thus, the electrode pad 2 and the electrode 3a are electrically and mechanically connected.

また、この電子部品搭載用基板９においては、電子部品３が搭載された後に、搭載部１ａと電子部品３の下面との間（導電性接続材４の部分を除く空間部分）に、アンダーフィルとしてエポキシ樹脂５が充填される。   Further, in this electronic component mounting substrate 9, after the electronic component 3 is mounted, an underfill is formed between the mounting portion 1a and the lower surface of the electronic component 3 (a space portion excluding the portion of the conductive connecting material 4). As shown in FIG.

エポキシ樹脂５は、電子部品搭載用基板９の上面（搭載部１ａ）と電子部品３の下面とを機械的に接続して、電子部品３の電子部品搭載用基板９に対する機械的な接続の強度を確保するためのものである。エポキシ樹脂５は、例えば熱硬化型であり、流動性を有する未硬化の状態で搭載部１ａと電子部品３の下面との間に、ポッティング等の方法で充填される。   The epoxy resin 5 mechanically connects the upper surface (mounting portion 1 a) of the electronic component mounting substrate 9 and the lower surface of the electronic component 3, and the mechanical connection strength of the electronic component 3 to the electronic component mounting substrate 9 is increased. It is for securing. The epoxy resin 5 is, for example, a thermosetting type, and is filled between the mounting portion 1a and the lower surface of the electronic component 3 by a method such as potting in an uncured state having fluidity.

熱硬化型のエポキシ樹脂５としては、ビスフェノールＡ型エポキシ樹脂，ビスフェノールＦ型エポキシ樹脂，フェノールノボラック型エポキシ樹脂およびクレゾールノボラック型エポキシ樹脂等が挙げられる。これらのエポキシ樹脂は、末端にエポキシ基を有する分子同士が互いのエポキシ基の間で重合反応を生じ、いわゆる３次元構造を形成して硬化する。このようなエポキシ樹脂５は、極性が大きいエポキシ基や水酸基（フェノールの水酸基等）を有しているため、全体的に極性が大きい。   Examples of the thermosetting epoxy resin 5 include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, and cresol novolak type epoxy resin. In these epoxy resins, molecules having an epoxy group at the end cause a polymerization reaction between the epoxy groups, and form a so-called three-dimensional structure to be cured. Since such an epoxy resin 5 has a highly polar epoxy group or hydroxyl group (such as a hydroxyl group of phenol), it has a large polarity as a whole.

また、セラミック焼結体からなる絶縁基体１は、セラミック焼結体中に酸素成分を有し、この酸素成分が極性を有していることや、外気中の水分が露出する表面に付着しやすいことから、後述する搭載部１ａを取り囲む部分を除く表面が親水性になっている。そのため、この表面の一部である上面の搭載部１ａにエポキシ樹脂５が濡れやすく、電子部品３の下面と搭載部１ａとの間にエポキシ樹脂５が良好に充填される。   Further, the insulating base 1 made of a ceramic sintered body has an oxygen component in the ceramic sintered body, and the oxygen component has a polarity, and easily adheres to the surface where moisture in the outside air is exposed. For this reason, the surface excluding the portion surrounding the mounting portion 1a described later is hydrophilic. Therefore, the epoxy resin 5 is easily wetted on the mounting portion 1a on the upper surface which is a part of this surface, and the epoxy resin 5 is satisfactorily filled between the lower surface of the electronic component 3 and the mounting portion 1a.

そして、この電子部品搭載用基板９は、上記のように電子部品３の下面と搭載部１ａとの間にエポキシ樹脂５が充填されるものであって、絶縁基体１の上面の搭載部１ａを取り囲む部位Ｓは、シリコーンオイルの分子が付着して疎水性になっている。   The electronic component mounting board 9 is filled with the epoxy resin 5 between the lower surface of the electronic component 3 and the mounting portion 1a as described above, and the mounting portion 1a on the upper surface of the insulating base 1 is formed. The surrounding portion S is hydrophobic due to the adhesion of silicone oil molecules.

この電子部品搭載用基板９によれば、絶縁基体１の上面の搭載部１ａを取り囲む部位Ｓが、シリコーンオイルの分子が付着して疎水性になっていることから、極性基を有するエポキシ樹脂５（未硬化のエポキシ樹脂）は、この疎水性の上面に対しての濡れ性が低い。そのため、電子部品３を搭載部１ａに搭載して、電子部品３の下面と搭載部１ａとの間に未硬化のエポキシ樹脂５を充填したときに、そのエポキシ樹脂５の流れを、絶縁基体１の上面の、搭載部１ａを取り囲む疎水性の部分Ａで効果的に阻止することができる。したがってエポキシ樹脂５が搭載部１ａよりも外側に流れ出すことを効果的に抑制することができる電子部品搭載用基板９を提供することができる。   According to this electronic component mounting substrate 9, the portion S surrounding the mounting portion 1a on the upper surface of the insulating base 1 is made hydrophobic by the adhesion of silicone oil molecules. (Uncured epoxy resin) has low wettability with respect to this hydrophobic upper surface. Therefore, when the electronic component 3 is mounted on the mounting portion 1a and the uncured epoxy resin 5 is filled between the lower surface of the electronic component 3 and the mounting portion 1a, the flow of the epoxy resin 5 is changed to the insulating substrate 1. Can be effectively blocked by the hydrophobic portion A surrounding the mounting portion 1a. Therefore, it is possible to provide the electronic component mounting substrate 9 that can effectively suppress the epoxy resin 5 from flowing out of the mounting portion 1a.

この場合、シリコーンオイルは、層状に被着しているのではなく、シリコーンオイルを構成している低重合度のシリコーンの分子が、分子レベルで絶縁基体１の上面に機械的に付着している。シリコーンオイルは、例えばジメチルシリコーンやジエチルシリコーン等の重合体であり、シロキサン結合（−Ｓｉ−Ｏ−）の繰り返しの主構造のケイ素（Ｓｉ）に極性の低いメチル基やエチル基が結合してなるシリコーンであって、重合度が比較的低いもの（１つのシロキサン結合を単位とした重合度が約100〜2000程度のもの）である。このアルキル基等の極性が小さいため、シリコーンオイルは全体に極性が小さい。そして、この極性が小さいシリコーンオイルが絶縁基体１の上面の搭載部１ａを取り囲む部位Ｓに付着しているため、この部位Ｓにおいて絶縁基体１の上面が疎水性になっている。   In this case, the silicone oil is not deposited in layers, but the low polymerization degree silicone molecules constituting the silicone oil are mechanically attached to the upper surface of the insulating substrate 1 at the molecular level. . Silicone oil is, for example, a polymer such as dimethyl silicone or diethyl silicone, and is formed by bonding a low-polarity methyl group or ethyl group to silicon (Si) having a repeating main structure of siloxane bond (-Si-O-). Silicone having a relatively low degree of polymerization (having a degree of polymerization of about 100 to 2000 with one siloxane bond as a unit). Since the polarity of the alkyl group and the like is small, the silicone oil has a small polarity as a whole. And since this silicone oil with a small polarity adheres to the site | part S surrounding the mounting part 1a of the upper surface of the insulation base | substrate 1, the upper surface of the insulation base | substrate 1 is hydrophobic in this site | part S. FIG.

なお、電子部品３と絶縁基体１の搭載部１ａとの間に充填するアンダーフィルとしてのエポキシ樹脂５は、酸化アルミニウム粉末等の無機粉末（図示せず）が添加されたものや、異なる組成のエポキシ樹脂が混合されたものや、ポリウレタン樹脂等の他の樹脂材料（図示せず）が混合されているものでもよい。これらの添加される酸化アルミニウム粉末や極性基であるシアノール基等を有するウレタン樹脂等も極性を有しているため、エポキシ樹脂５中に分散させることが容易であり、また、疎水性とされた絶縁基体１の上面の部位Ｓには流れにくい。   In addition, the epoxy resin 5 as an underfill filled between the electronic component 3 and the mounting portion 1a of the insulating base 1 may be an inorganic powder (not shown) such as an aluminum oxide powder or a different composition. What mixed the epoxy resin and other resin materials (not shown), such as a polyurethane resin, may be mixed. Since these added aluminum oxide powder and urethane resin having a cyanol group which is a polar group also have polarity, it can be easily dispersed in the epoxy resin 5 and is made hydrophobic. It is difficult to flow through the portion S on the upper surface of the insulating substrate 1.

上記の無機粉末やエポキシ樹脂以外の樹脂材料は、例えばセラミック焼結体からなる絶縁基体１とエポキシ樹脂５との間で熱膨張率の差を小さくして、両者の間に生じる熱応力を低減することや、エポキシ樹脂５の弾性率を低くして絶縁基体１と電子部品３との間に生じる熱応力を緩和すること等のために混合される。   Resin materials other than the above inorganic powder and epoxy resin reduce the difference in thermal expansion coefficient between the insulating base 1 made of a ceramic sintered body and the epoxy resin 5, for example, and reduce the thermal stress generated between the two. For example, to reduce the elastic modulus of the epoxy resin 5 and to relieve the thermal stress generated between the insulating substrate 1 and the electronic component 3.

このようなシリコーンオイルの付着は、例えばシリコーンオイルが添加されたシリコーンゴム（図示せず）を絶縁基体１の上面の所定部位に押し当てることにより行なうことができる。この押し当ての際に圧力により、シリコーンゴムに添加されたシリコーンオイルがにじみ出て、絶縁基体１の上面に被着される。シリコーンオイルの分子は、層状とするほどに厚く被着させる必要はなく、また化学結合をさせるための加温等の操作も不必要なので、上記のような簡単な方法で、絶縁基体１の上面に被着させることができる。   Such adhesion of silicone oil can be performed, for example, by pressing a silicone rubber (not shown) to which silicone oil is added against a predetermined portion of the upper surface of the insulating substrate 1. During this pressing, the silicone oil added to the silicone rubber oozes out due to the pressure, and adheres to the upper surface of the insulating substrate 1. The silicone oil molecules do not need to be deposited thick enough to form a layer, and operations such as heating for chemical bonding are not necessary. Therefore, the top surface of the insulating substrate 1 can be obtained by a simple method as described above. Can be attached.

シリコーンゴムへのシリコーンオイルの添加は、例えばシリコーンゴムの粉末にシリコーンオイルを混合し、これらに加硫や成型、加熱等の加工を施して所定の形状に形成することによって行なうことができる。   The silicone oil can be added to the silicone rubber by, for example, mixing the silicone oil with a silicone rubber powder and subjecting these to vulcanization, molding, heating, or the like to form a predetermined shape.

絶縁基体１上面のシリコーンオイルを付着させる部位Ｓの内周は、搭載部１ａの外周と同じか、または少し外側に設定すればよい。搭載部１ａの外周は、例えば、絶縁基体１の上面のうち、搭載部１ａに電子部品３を搭載したときに平面視で電子部品３の外周と重なる位置である。例えば、図２に示す例では、絶縁基体１の上面のうち平面視で電子部品３の外周よりも少し外側にシリコーンオイルを付着させて、エポキシ樹脂５の流れ出しを阻止している。この場合には、エポキシ樹脂５の外側面が外側に傾斜しているため、エポキシ樹脂５と絶縁基体１との接合面積を大きくして、エポキシ樹脂５の絶縁基体１に対する接合強度を高くすることができる。   What is necessary is just to set the inner periphery of the site | part S to which the silicone oil of the upper surface of the insulation base | substrate 1 adheres the same as the outer periphery of the mounting part 1a, or a little outside. The outer periphery of the mounting portion 1a is, for example, a position on the upper surface of the insulating base 1 that overlaps with the outer periphery of the electronic component 3 in plan view when the electronic component 3 is mounted on the mounting portion 1a. For example, in the example shown in FIG. 2, silicone oil is attached to the outside of the upper surface of the insulating base 1 slightly outside the outer periphery of the electronic component 3 in plan view to prevent the epoxy resin 5 from flowing out. In this case, since the outer surface of the epoxy resin 5 is inclined outward, the bonding area between the epoxy resin 5 and the insulating base 1 is increased to increase the bonding strength of the epoxy resin 5 to the insulating base 1. Can do.

また、絶縁基体１上面のシリコーンオイルを付着させる部位Ｓの外周は、図１に示す例では絶縁基体１の上面の外周よりも内側に位置しているが、上面の外周と同じ位置であってもよい。つまり、絶縁基体１の上面のうち搭載部１ａを除く部位のほぼ全面または全面にシリコーンオイルを付着させるようにしてもよい。また、シリコーンオイルは、絶縁基体１の下面や側面等に付着していても構わない。   Further, in the example shown in FIG. 1, the outer periphery of the part S to which the silicone oil on the upper surface of the insulating substrate 1 is attached is located on the inner side of the outer periphery of the upper surface of the insulating substrate 1, but the same position as the outer periphery of the upper surface Also good. That is, silicone oil may be adhered to almost the entire surface or the entire surface of the upper surface of the insulating substrate 1 excluding the mounting portion 1a. Further, the silicone oil may be attached to the lower surface or the side surface of the insulating substrate 1.

シリコーンゴムに対するシリコーンオイルの添加量は、例えばジメチルシリコーンの分子を付着させる場合であれば、約１〜10質量％程度に設定すればよい。   The amount of silicone oil added to the silicone rubber may be set to about 1 to 10% by mass in the case of attaching dimethyl silicone molecules, for example.

なお、本発明の電子部品搭載用基板９においては、絶縁基体１の上面における性質を疎水性とすることによりエポキシ樹脂５の流れ出しを抑制しているため、例えば搭載部１ａを取り囲むように絶縁基体１の上面に樹脂材料等でいわゆるダム（図示せず）を設けて、このダムでエポキシ樹脂５の流れを機械的に止めるようにした場合に比べて、次のような利点がある。すなわち、この電子部品搭載用基板９においては、電子部品３が搭載される搭載部１ａを取り囲む部位にダム等の突起物がないため、電子部品３の搭載部１ａへの搭載は、ダム等で妨げられることがなく、容易に行なうことができる。また、ダム等に比べて、上記のように簡単な方法で被着させることができるので、電子部品搭載用基板９としての生産性やコストの点でも有利である。   In the electronic component mounting substrate 9 of the present invention, since the flow of the epoxy resin 5 is suppressed by making the property on the upper surface of the insulating base 1 hydrophobic, the insulating base is surrounded so as to surround the mounting portion 1a, for example. There are the following advantages compared to the case where a so-called dam (not shown) is provided on the upper surface of 1 and the flow of the epoxy resin 5 is mechanically stopped by this dam. That is, in this electronic component mounting board 9, since there is no protrusion such as a dam in a portion surrounding the mounting portion 1a on which the electronic component 3 is mounted, the mounting of the electronic component 3 on the mounting portion 1a is performed by a dam or the like. It can be done easily without being disturbed. Further, as compared with a dam or the like, since it can be deposited by a simple method as described above, it is advantageous in terms of productivity and cost as the electronic component mounting board 9.

この電子部品搭載用基板９は、上記構成において、例えば図３（ａ）および（ｂ）に示すように、シリコーンオイルの分子ＳＢが直鎖構造であり、その分子が、絶縁基体１の上面に生じている凹凸部分に機械的に付着している場合には、シリコーンオイルの分子ＳＢと絶縁基体１の上面との間の機械的な接触の面積をより大きく確保することができる。したがって、この場合には、シリコーンオイルの分子ＳＢを絶縁基体１の上面により強固に付着させておくことが可能であり、より確実にエポキシ樹脂５の流れ出しを抑制することが可能な電子部品搭載用基板９を提供することができる。なお、図３（ａ）は、本発明の電子部品搭載用基板９の実施の形態の一例における要部を拡大して模式的に示す要部拡大断面図であり、図３（ｂ）は、図３（ａ）の破線で囲んだＡ部分をさらに拡大して示す要部拡大断面である。図３において図１および図２と同様の部位には同様の符号を付している。   In the electronic component mounting substrate 9, in the above-described configuration, for example, as shown in FIGS. 3A and 3B, the silicone oil molecule SB has a linear structure, and the molecule is formed on the upper surface of the insulating substrate 1. In the case of mechanically adhering to the generated uneven portions, a larger area of mechanical contact between the silicone oil molecule SB and the upper surface of the insulating substrate 1 can be secured. Therefore, in this case, the silicone oil molecules SB can be adhered more firmly to the upper surface of the insulating substrate 1, and the electronic component mounting that can more reliably suppress the epoxy resin 5 from flowing out. A substrate 9 can be provided. FIG. 3 (a) is an enlarged cross-sectional view schematically showing an essential part in an example of an embodiment of the electronic component mounting substrate 9 of the present invention, and FIG. It is a principal part expanded section which expands and shows further the A section enclosed with the broken line of Fig.3 (a). In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

この場合、極性の小さいシリコーンオイルの分子ＳＢが極性の絶縁基体１の上面に付着する機構は、上記のように機械的な摩擦力等によるものであり、このような機械的な付着を有効に行なわせる上で、絶縁基体１の上面における表面粗さは、算術平均粗さ（Ｒａ）で約0.1μｍ以上であることが好ましい。   In this case, the mechanism in which the molecules SB of the silicone oil having a small polarity adhere to the upper surface of the polar insulating base 1 is due to the mechanical frictional force or the like as described above. In performing this, the surface roughness of the upper surface of the insulating substrate 1 is preferably about 0.1 μm or more in terms of arithmetic average roughness (Ra).

また、シリコーンオイルの分子ＳＢが直鎖構造であり、分子構造における立体的な障害が小さいので、シリコーンオイルとしての流動性が良好であり、シリコーンゴムから絶縁基体１の上面に流動させて塗布することや、絶縁基体１の上面に流動させて均一に付着させることがより容易である。   In addition, since the molecule SB of the silicone oil has a linear structure, and the steric hindrance in the molecular structure is small, the fluidity as the silicone oil is good, and the silicone oil is applied by flowing from the silicone rubber to the upper surface of the insulating substrate 1. In addition, it is easier to flow and uniformly adhere to the upper surface of the insulating substrate 1.

重合度が約500〜1000のジメチルシリコーンからなるシリコーンオイルを、酸化アルミニウム質焼結体を用いて作製した絶縁基体の上面に、この上面の搭載部を取り囲むようにしてシリコーンオイルを付着させて、エポキシ樹脂の流れ出しの有無を確認した。絶縁基体は、平面視で１辺の長さが約10ｍｍの正方形状であり、搭載部は、上面の中央部に位置した、１辺の長さが約0.4ｍｍの正方形状であった。   Silicone oil composed of dimethyl silicone having a degree of polymerization of about 500 to 1000 is attached to the upper surface of an insulating base made using an aluminum oxide sintered body so as to surround the mounting portion of the upper surface, The presence or absence of the epoxy resin flowing out was confirmed. The insulating base has a square shape with one side having a length of about 10 mm in plan view, and the mounting portion has a square shape with one side having a length of about 0.4 mm located at the center of the upper surface.

シリコーンオイルは、重合度約10000以上のジメチルシリコーンからなるシリコーンゴムに上記のシリコーンオイルを添加したものを準備し、これを、上記の搭載部を取り囲む枠状に切断した後、搭載部を取り囲むように絶縁基体の上面に約10秒間押し当てる方法で付着させた。なお、絶縁基体のシリコーンオイルを付着させた部位における表面粗さは、針を用いた機械的な方法で測定したところ、算術平均粗さ（Ｒａ）で約0.1〜0.5μｍであった。   Silicone oil is prepared by adding the above-mentioned silicone oil to silicone rubber composed of dimethyl silicone having a polymerization degree of about 10,000 or more, and cutting it into a frame surrounding the above-mentioned mounting part, and then surrounding the mounting part. Was adhered to the upper surface of the insulating substrate by pressing for about 10 seconds. In addition, the surface roughness in the site | part to which the silicone oil of the insulating base | substrate was made to adhere was measured by the mechanical method using a needle | hook, and was about 0.1-0.5 micrometer in arithmetic mean roughness (Ra).

搭載部には、１辺の長さが約0.38ｍｍの正方形板状の半導体基板を試験用の電子部品として搭載し、電子部品と搭載部との間にビスフェノールＡ型のエポキシ樹脂を充填した後に加熱硬化させた。その後、エポキシ樹脂の搭載部からの流れ出しの有無を目視によって確認した。   After mounting a square-plate-shaped semiconductor substrate with a side length of about 0.38 mm as a test electronic component on the mounting portion and filling a bisphenol A type epoxy resin between the electronic component and the mounting portion Heat-cured. Then, the presence or absence of the flow from the epoxy resin mounting part was confirmed visually.

なお、比較例として、上記本発明の電子部品搭載用基板の実施例のようなシリコーンオイルの塗布を行なわない電子部品搭載用基板を準備し、上記の実施例と同様にエポキシ樹脂の流れ出しの有無を確認した。   In addition, as a comparative example, an electronic component mounting substrate not applied with silicone oil was prepared as in the embodiment of the electronic component mounting substrate of the present invention. It was confirmed.

その結果、実施例の電子部品搭載用基板においては、試験した100個においてエポキシ樹脂の流れ出しが確認されなかったのに対し、比較例の電子部品搭載用基板においては、試験した100個のうち２個において搭載部の外側にエポキシ樹脂が、それぞれ搭載部の１辺において、約0.5〜0.6ｍｍ程度、エポキシ樹脂が流れ出ているのが確認された。これにより、本発明の電子部品搭載用基板における、搭載部の外側へのエポキシ樹脂の流れ出しを抑制する効果を確認することができた。   As a result, in the electronic component mounting substrate of the example, the flow of epoxy resin was not confirmed in 100 tested, whereas in the electronic component mounting substrate of the comparative example, 2 out of 100 tested. It was confirmed that the epoxy resin flowed out about 0.5 to 0.6 mm on one side of the mounting portion on the outside of the mounting portion in each piece. Thereby, the effect which suppresses the outflow of the epoxy resin to the outer side of the mounting part in the electronic component mounting board | substrate of this invention was able to be confirmed.

１・・・絶縁基体
１ａ・・搭載部
２・・・電極パッド
３・・・電子部品
３ａ・・電極
４・・・導電性接続材
５・・・エポキシ樹脂
６・・・配線導体
９・・・電子部品搭載用基板
Ｓ・・・シリコーンオイルを付着させた部位
ＳＢ・・シリコーンオイルの分子 DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ... Mounting part 2 ... Electrode pad 3 ... Electronic component 3a ... Electrode 4 ... Conductive connection material 5 ... Epoxy resin 6 ... Wiring conductor 9 ...・ Electronic component mounting substrate S ・ ・ ・ Parts SB to which silicone oil is attached. ・ Silicone oil molecules

Claims (2)

セラミック焼結体からなり、複数の電極が下面に形成された電子部品を搭載するための搭載部を上面に有する絶縁基体と、前記搭載部に形成された、前記電子部品の前記電極に対向して導電性接続材を介して接続される電極パッドとを備え、前記電子部品の前記下面と前記搭載部との間にエポキシ樹脂が充填される電子部品搭載用基板であって、前記絶縁基体の前記上面の前記搭載部を取り囲む部位は、シリコーンオイルの分子が付着して疎水性になっていることを特徴とする電子部品搭載用基板。 An insulating substrate made of a ceramic sintered body and having a mounting portion on the top surface for mounting an electronic component having a plurality of electrodes formed on the bottom surface, and facing the electrodes of the electronic component formed on the mounting portion. And an electrode pad connected via an electrically conductive connecting material, and an electronic component mounting board filled with an epoxy resin between the lower surface of the electronic component and the mounting portion. A substrate for mounting an electronic component, wherein a portion of the upper surface surrounding the mounting portion is made hydrophobic by adhesion of silicone oil molecules. 前記シリコーンオイルの分子が直鎖構造であり、該分子が前記絶縁基体の前記上面に生じている凹凸部分に機械的に付着していることを特徴とする請求項１記載の電子部品搭載用基板。 2. The electronic component mounting substrate according to claim 1, wherein the molecules of the silicone oil have a linear structure, and the molecules are mechanically attached to the uneven portions formed on the upper surface of the insulating base. .
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US20150250051A1 (en) * 2014-03-03 2015-09-03 Shinko Electric Industries Co., Ltd. Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer
US9195003B2 (en) 2012-09-21 2015-11-24 Fujitsu Limited Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same

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JPH10214924A (en) * 1997-01-30 1998-08-11 Fujitsu Ten Ltd Resin sealing structure of semiconductor device
JP2004179578A (en) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd Wiring board and its manufacturing method

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JPH10214924A (en) * 1997-01-30 1998-08-11 Fujitsu Ten Ltd Resin sealing structure of semiconductor device
JP2004179578A (en) * 2002-11-29 2004-06-24 Ngk Spark Plug Co Ltd Wiring board and its manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9195003B2 (en) 2012-09-21 2015-11-24 Fujitsu Limited Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same
US20150250051A1 (en) * 2014-03-03 2015-09-03 Shinko Electric Industries Co., Ltd. Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer
US9538668B2 (en) * 2014-03-03 2017-01-03 Shinko Electric Industries Co., Ltd. Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer

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