JP2011096709A - Substrate carrier in vacuum processing apparatus - Google Patents

Substrate carrier in vacuum processing apparatus Download PDF

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JP2011096709A
JP2011096709A JP2009246338A JP2009246338A JP2011096709A JP 2011096709 A JP2011096709 A JP 2011096709A JP 2009246338 A JP2009246338 A JP 2009246338A JP 2009246338 A JP2009246338 A JP 2009246338A JP 2011096709 A JP2011096709 A JP 2011096709A
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substrate
chamber
sheet
vacuum processing
vacuum
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Tetsuya Shimada
鉄也 島田
Hideyuki Odagi
秀幸 小田木
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Ulvac Inc
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Ulvac Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate carrier in a vacuum processing apparatus for carrying a long sheet-like substrate S through a vacuum processing chamber 2 and carrying out predetermined processing on the sheet-like substrate S, wherein the substrate carrier can carry the sheet-like substrate S without housing a delivery roller and winding roller in an upstream side auxiliary vacuum chamber 3<SB>1</SB>and a downstream side auxiliary vacuum chamber 3<SB>2</SB>respectively linked to an upstream side and a downstream side of the vacuum processing chamber 2 and without releasing the vacuum processing chamber 2 in an atmosphere. <P>SOLUTION: Partition valves 4 which close to sandwich the sheet-like substrate S are arranged respectively on an inlet part of the upstream side auxiliary vacuum chamber 3<SB>1</SB>, an outlet part of the downstream side auxiliary vacuum chamber 3<SB>2</SB>, and an inlet part and outlet part of the vacuum processing chamber. Substrate drawing mechanisms 5<SB>1</SB>, 5<SB>2</SB>draw the sheet-like substrate S of a predetermined length into the upstream side auxiliary vacuum chamber 3<SB>1</SB>and the downstream side auxiliary vacuum chamber 3<SB>2</SB>, and hold the drawn sheet-like substrate so as to freely draw the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、長尺のシート状基板を真空処理室を通して搬送し、この真空処理室でシート状基板に所定の処理を施す真空処理装置における基板搬送装置に関する。   The present invention relates to a substrate transport apparatus in a vacuum processing apparatus that transports a long sheet-shaped substrate through a vacuum processing chamber and performs a predetermined process on the sheet-shaped substrate in the vacuum processing chamber.

従来、この種の真空処理装置として、真空処理室の上流側と下流側に、夫々補助真空室を連設し、上流側補助真空室にシート状基板を巻回した繰出しローラを収納すると共に、下流側補助真空室に巻取りローラを収納し、繰出しローラから繰出されたシート状基板を
真空処理室を通して巻取りローラで巻取るようにしたものは知られている(例えば、特許文献1参照)。
Conventionally, as this type of vacuum processing apparatus, an auxiliary vacuum chamber is connected to the upstream side and the downstream side of the vacuum processing chamber, respectively, and a feeding roller around which a sheet-like substrate is wound is stored in the upstream side auxiliary vacuum chamber. It is known that a take-up roller is housed in a downstream auxiliary vacuum chamber, and a sheet-like substrate fed from the feed roller is wound by the take-up roller through the vacuum processing chamber (see, for example, Patent Document 1). .

上記従来例では、繰出しローラが空になる度に繰出しローラ及び巻取りローラの交換が必要になる。この交換作業に際しては、新たな繰出しローラから引き出したシート状基板の先端を真空処理室を経由して新たな巻取りローラに巻き付けることが必要で、作業に時間がかかる。そして、補助真空室の大きさの制限から、繰出しローラに巻回できるシート状基板の長さにも制限があるため、繰出しローラ及び巻取りローラを頻繁に交換せざるを得なくなる。その結果、交換作業に要する時間が多大になり、生産性の向上を図ることが困難になっている。   In the above conventional example, it is necessary to replace the feeding roller and the winding roller every time the feeding roller becomes empty. In this replacement operation, it is necessary to wind the leading end of the sheet-like substrate drawn out from the new feeding roller around the new winding roller via the vacuum processing chamber, which takes time. Since the size of the auxiliary vacuum chamber is limited, the length of the sheet-like substrate that can be wound around the feeding roller is also limited, so that the feeding roller and the winding roller must be frequently replaced. As a result, the time required for the replacement work increases, making it difficult to improve productivity.

尚、真空処理室の入口部及び出口部に、夫々シート状基板を挟むようにして閉じる仕切り弁を配置すると共に、上流側補助真空室と下流側補助真空室とを省略して、上流側と下流側の大気圧空間に繰出しローラと巻取りローラとを配置し、入口部と出口部の仕切り弁を開弁させた状態で繰出しローラから巻取りローラにシート状基板を所定長さ搬送し、搬送後に仕切り弁を閉弁して、真空処理室での処理を行うことも考えられる。   In addition, a gate valve that closes the sheet-like substrate between the inlet portion and the outlet portion of the vacuum processing chamber is disposed, and the upstream side auxiliary vacuum chamber and the downstream side auxiliary vacuum chamber are omitted, and the upstream side and the downstream side are omitted. A feeding roller and a winding roller are arranged in the atmospheric pressure space, and the sheet-like substrate is conveyed from the feeding roller to the winding roller for a predetermined length with the inlet and outlet gate valves opened. It is also conceivable to close the gate valve and perform processing in the vacuum processing chamber.

然し、この手法では、真空処理室が基板搬送時に大気解放されるため、仕切り弁の閉弁後に真空処理室を所要の真空度に減圧するのに時間がかかり、生産性を向上することはできない。また、仕切り弁を閉弁しても、シート状基板の側縁と仕切り弁との間に僅かではあるが隙間を生ずるため、真空処理室を所要の真空度まで減圧できないという問題もある。   However, in this method, since the vacuum processing chamber is released to the atmosphere when the substrate is transported, it takes time to depressurize the vacuum processing chamber to the required degree of vacuum after the gate valve is closed, and productivity cannot be improved. . Further, even if the gate valve is closed, there is a slight gap between the side edge of the sheet-like substrate and the gate valve, so that there is a problem that the vacuum processing chamber cannot be depressurized to a required degree of vacuum.

特開2008−57020号公報JP 2008-57020 A

本発明は、以上の点に鑑み、補助真空室に繰出しローラや巻取りローラを収納せずに、且つ、真空処理室を大気解放せずにシート状基板を搬送できるようにした真空処理装置における基板搬送装置を提供することをその課題としている。   In view of the above, the present invention provides a vacuum processing apparatus in which a sheet-like substrate can be conveyed without accommodating a feeding roller and a winding roller in an auxiliary vacuum chamber and without releasing the vacuum processing chamber to the atmosphere. An object of the present invention is to provide a substrate transfer device.

上記課題を解決するために、本発明は、長尺のシート状基板を真空処理室を通して搬送し、この真空処理室でシート状基板に所定の処理を施す真空処理装置における基板搬送装置であって、前記真空処理室の上流側に連設した上流側補助真空室と、前記真空処理室の下流側に連設した下流側補助真空室と、前記上流側補助真空室の入口部と、前記下流側補助真空室の出口部と、前記真空処理室の入口部及び出口部とに夫々配置した、シート状基板を挟むようにして閉じる仕切り弁と、所定長さ分のシート状基板を引き込み、引き込んだシート状基板を引き出し自在に保持する基板引き込み機構とを備え、前記上流側補助真空室と前記下流側補助真空室とに夫々前記基板引き込み機構が配置され、前記上流側補助真空室の入口部の前記仕切り弁を開弁させた状態で、前記上流側補助真空室に配置した前記基板引き込み機構により、シート状基板を前記上流側補助真空室にその上流側の大気圧空間から引き込み、前記下流側補助真空室の出口部の前記仕切り弁を開弁させた状態で、シート状基板を前記下流側補助真空室に配置した前記基板引き込み機構から前記下流側補助真空室の下流側の大気圧空間に引き出すことを特徴とする。   In order to solve the above problems, the present invention is a substrate transfer apparatus in a vacuum processing apparatus that transfers a long sheet-shaped substrate through a vacuum processing chamber and performs a predetermined process on the sheet-shaped substrate in the vacuum processing chamber. An upstream auxiliary vacuum chamber connected to the upstream side of the vacuum processing chamber; a downstream auxiliary vacuum chamber connected to the downstream side of the vacuum processing chamber; an inlet of the upstream auxiliary vacuum chamber; and the downstream A gate valve that is disposed at the outlet portion of the side auxiliary vacuum chamber and at the inlet portion and outlet portion of the vacuum processing chamber and closes so as to sandwich the sheet-like substrate, and the sheet-like substrate of a predetermined length is drawn in, and the sheet drawn in A substrate pull-in mechanism for detachably holding the substrate, and the substrate pull-in mechanism is disposed in each of the upstream auxiliary vacuum chamber and the downstream auxiliary vacuum chamber, and the inlet of the upstream auxiliary vacuum chamber Gate valve In the opened state, the substrate drawing mechanism disposed in the upstream side auxiliary vacuum chamber draws the sheet-like substrate into the upstream side auxiliary vacuum chamber from the upstream atmospheric pressure space, and the downstream side auxiliary vacuum chamber The sheet-like substrate is drawn out to the atmospheric pressure space on the downstream side of the downstream side auxiliary vacuum chamber from the substrate drawing mechanism arranged in the downstream side auxiliary vacuum chamber in a state where the gate valve of the outlet portion is opened. And

本発明によれば、上流側補助真空室に配置した基板引き込み機構により、シート状基板を上流側補助真空室にその上流側の大気圧空間から引き込んだ後、真空処理室の入口部と出口部の仕切り弁を開弁させた状態で、下流側補助真空室に配置した基板引き込み機構により、シート状基板を上流側補助真空室に配置した基板引き込み機構から真空処理室に引き出しつつ真空処理室から下流側補助真空室に引き込むこと、即ち、シート状基板を上流側補助真空室から真空処理室を経由して下流側補助真空室に搬送することができる。この際、予め上流側補助真空室の入口部の仕切り弁を閉弁して、上流側補助真空室を減圧しておくことにより、真空処理室が大気解放されることを防止できる。また、下流側補助真空室の出口部の仕切り弁を開弁させた状態で、シート状基板を下流側補助真空室の下流側の大気圧空間に引き出す際、予め真空処理層の出口部の仕切り弁を閉弁させておくことにより、真空処理層が大気解放されることを防止できる。   According to the present invention, after the sheet-like substrate is drawn into the upstream auxiliary vacuum chamber from the upstream atmospheric pressure space by the substrate drawing mechanism disposed in the upstream auxiliary vacuum chamber, the inlet portion and the outlet portion of the vacuum processing chamber. With the gate valve opened, the substrate pulling mechanism disposed in the downstream auxiliary vacuum chamber causes the sheet-like substrate to be drawn from the substrate pulling mechanism disposed in the upstream auxiliary vacuum chamber to the vacuum processing chamber. The sheet-like substrate can be drawn into the downstream auxiliary vacuum chamber, that is, the sheet-like substrate can be transferred from the upstream auxiliary vacuum chamber to the downstream auxiliary vacuum chamber via the vacuum processing chamber. At this time, it is possible to prevent the vacuum processing chamber from being released into the atmosphere by closing the partition valve at the inlet of the upstream auxiliary vacuum chamber in advance and reducing the pressure in the upstream auxiliary vacuum chamber. Further, when the sheet-like substrate is drawn out to the atmospheric pressure space on the downstream side of the downstream auxiliary vacuum chamber with the partition valve at the outlet portion of the downstream auxiliary vacuum chamber opened, the partition of the outlet portion of the vacuum processing layer is previously provided. By closing the valve, the vacuum processing layer can be prevented from being released to the atmosphere.

このように、本発明によれば、真空処理室を大気解放せずシート状基板を搬送できるため、基板搬送後に、真空処理室を短時間で所要の真空度に減圧してシート状基板に処理を施すことができ、生産性が向上する。また、上流側と下流側の補助真空室に繰出しローラと巻取りローラを収納するものと異なり、これらローラの頻繁な交換作業が不要になる。更には、前工程からシート状基板をロール状に巻き取らずにそのまま真空処理装置に搬送したり、真空処理装置からシート状基板をロール状に巻き取らずにそのまま後工程に搬送したりすることもでき、生産性の大幅な向上を図ることができる。   As described above, according to the present invention, since the sheet-like substrate can be transferred without releasing the vacuum processing chamber to the atmosphere, the vacuum processing chamber is decompressed to a required vacuum degree in a short time after the substrate transfer, and processed into a sheet-like substrate. The productivity can be improved. Further, unlike the case where the feeding roller and the winding roller are accommodated in the auxiliary vacuum chambers on the upstream side and the downstream side, frequent replacement work of these rollers becomes unnecessary. Furthermore, the sheet-like substrate is conveyed from the previous process to the vacuum processing apparatus as it is without being rolled up, or the sheet-shaped substrate is conveyed from the vacuum processing apparatus to the subsequent process as it is without being rolled up. It is possible to improve productivity significantly.

また、本発明においては、真空処理室内の入口部側と出口部側に、夫々基板引き込み機構を配置することが望ましい。これによれば、真空処理室の入口部の仕切り弁を開弁させた状態で、入口部側の基板引き込み機構により、シート状基板を上流側補助真空室に配置した基板引き込み機構から真空処理室に引き込んだ後、入口部の仕切り弁を閉弁し、真空処理室を所要の真空度に減圧した状態で、出口部側の基板引き込み機構により真空処理室内でシート状基板を搬送しつつ、シート状基板に連続的に処理を施すことができ、生産性を一層向上できる。   In the present invention, it is desirable to dispose a substrate pull-in mechanism on the inlet side and the outlet side in the vacuum processing chamber, respectively. According to this, in the state where the gate valve of the inlet portion of the vacuum processing chamber is opened, the substrate pulling mechanism on the inlet portion side causes the vacuum processing chamber from the substrate pulling mechanism in which the sheet-like substrate is disposed in the upstream auxiliary vacuum chamber. Then, the gate valve of the inlet portion is closed, and the sheet processing substrate is transported in the vacuum processing chamber by the substrate pulling mechanism on the outlet portion side while the vacuum processing chamber is depressurized to a required degree of vacuum. The substrate can be continuously processed, and the productivity can be further improved.

尚、仕切り弁を閉弁しても、シート状基板の側縁と仕切り弁との間に僅かではあるが隙間を生ずるため、真空処理装置の上流側の大気圧空間に対し真空処理室を上流側補助真空室の入口部の仕切り弁と真空処理室の入口部の仕切り弁とで2重にシールすると共に、下流側の大気圧空間に対し真空処理室を下流側補助真空室の出口部の仕切り弁と真空処理室の出口部の仕切り弁とで2重にシールしても、真空処理室を所定の真空度以上に減圧することが困難になる。   Even if the gate valve is closed, a slight gap is formed between the side edge of the sheet-like substrate and the gate valve, so that the vacuum processing chamber is located upstream of the atmospheric pressure space upstream of the vacuum processing apparatus. The gate valve of the inlet of the auxiliary vacuum chamber on the side and the gate valve of the inlet of the vacuum processing chamber are doubly sealed, and the vacuum processing chamber is connected to the atmospheric pressure space on the downstream side of the outlet of the downstream auxiliary vacuum chamber. Even if double sealing is performed between the gate valve and the gate valve at the outlet of the vacuum processing chamber, it is difficult to depressurize the vacuum processing chamber beyond a predetermined degree of vacuum.

ここで、上流側補助真空室と真空処理室との間に少なくとも1つの上流側バッファ室を介設すると共に、下流側補助真空室と真空処理室との間に少なくとも1つの下流側バッファ室を介設し、上流側バッファ室の入口部と下流側バッファ室の出口部とに、夫々シート状基板を挟むようにして閉じる仕切り弁を配置しておけば、真空処理室を大気圧空間に対して少なくとも3重にシールすることができ、真空処理室の要求真空度が高い場合にも対処できる。   Here, at least one upstream buffer chamber is interposed between the upstream auxiliary vacuum chamber and the vacuum processing chamber, and at least one downstream buffer chamber is provided between the downstream auxiliary vacuum chamber and the vacuum processing chamber. If a partition valve is disposed between the inlet portion of the upstream buffer chamber and the outlet portion of the downstream buffer chamber and is closed so as to sandwich the sheet-like substrate, the vacuum processing chamber is at least relative to the atmospheric pressure space. Triple sealing is possible, and it is possible to cope with a case where the required vacuum degree of the vacuum processing chamber is high.

尚、真空処理室を複数個備える場合は、これら真空処理室間に、前記基板引き込み機構を配置した中間補助真空室を介設してもよい。   When a plurality of vacuum processing chambers are provided, an intermediate auxiliary vacuum chamber in which the substrate drawing mechanism is disposed may be interposed between the vacuum processing chambers.

また、基板引き込み機構としては種々のものが考えられるが、シート状基板の搬送方向に間隔を存して配置した一対のガイドローラと、両ガイドローラ間に配置した、シート状基板の搬送方向と直交する方向に移動自在な可動ローラとで基板引き込み機構を構成すれば、構造簡単で且つ作動が確実になり、有利である。   Various substrate pull-in mechanisms are conceivable, including a pair of guide rollers disposed at intervals in the sheet-substrate conveyance direction, and a sheet-substrate conveyance direction disposed between the two guide rollers. If the substrate pull-in mechanism is constituted by a movable roller that is movable in the orthogonal direction, it is advantageous because the structure is simple and the operation is reliable.

本発明の第1実施形態の基板搬送装置を示す模式的断面図。1 is a schematic cross-sectional view showing a substrate transfer apparatus according to a first embodiment of the present invention. 図1の基板搬送装置の仕切り弁の部分の拡大断面図。The expanded sectional view of the part of the gate valve of the board | substrate conveyance apparatus of FIG. 第1実施形態の基板搬送装置の動作を示す説明図。Explanatory drawing which shows operation | movement of the board | substrate conveyance apparatus of 1st Embodiment. 第2実施形態の基板搬送装置を示す模式的断面図。A typical sectional view showing a substrate transfer device of a 2nd embodiment. 第2実施形態の基板搬送装置の動作を示す説明図。Explanatory drawing which shows operation | movement of the board | substrate conveyance apparatus of 2nd Embodiment. 第3実施形態の基板搬送装置を示す模式的断面図。A typical sectional view showing a substrate transfer device of a 3rd embodiment. 第4実施形態の基板搬送装置を示す模式的断面図。Typical sectional drawing which shows the board | substrate conveyance apparatus of 4th Embodiment.

図1を参照して、1は長尺のシート状基板Sに成膜処理を施す真空処理装置を示している。この真空処理装置1は、図外の真空ポンプで真空引きされる真空処理室2を備えている。真空処理室2には、シート状基板Sの搬送方向(図1の左右方向)に間隔を存して配置した一対のガイドローラ21,21と、両ガイドローラ21,21間に配置した、下側の半周面にシート状基板Sを巻回する冷却ローラ22と、冷却ローラ22の下方に配置したPVD方式の成膜ユニット23とが収納されている。そして、成膜ユニット23から蒸発やスパッタで発生する成膜材料から成る薄膜が冷却ローラ22に巻回したシート状基板Sの部分に成膜されるようにしている。また、真空処理室2には、成膜ユニット23を配置した真空処理室2の下部空間に対し上部空間を仕切る仕切り板24が設けられている。   Referring to FIG. 1, reference numeral 1 denotes a vacuum processing apparatus that performs a film forming process on a long sheet-like substrate S. The vacuum processing apparatus 1 includes a vacuum processing chamber 2 that is evacuated by a vacuum pump (not shown). In the vacuum processing chamber 2, a pair of guide rollers 21, 21 arranged at intervals in the conveyance direction of the sheet-like substrate S (left-right direction in FIG. 1), and the lower guide rollers 21, 21 arranged between the guide rollers 21, 21, A cooling roller 22 that winds the sheet-like substrate S and a PVD film forming unit 23 disposed below the cooling roller 22 are accommodated on the half circumferential surface on the side. A thin film made of a film forming material generated by evaporation or sputtering from the film forming unit 23 is formed on the portion of the sheet-like substrate S wound around the cooling roller 22. The vacuum processing chamber 2 is provided with a partition plate 24 that partitions the upper space with respect to the lower space of the vacuum processing chamber 2 in which the film forming unit 23 is disposed.

また、真空処理装置1は、真空処理室2の上流側(図1の左側)に連設した上流側補助真空室たる第1補助真空室3と、真空処理室2の下流側(図1の右側)に連設した下流側補助真空室たる第2補助真空室3とを備えている。これら補助真空室3,3は、真空処理室2と共通又は専用の真空ポンプで真空引きされる。 Further, the vacuum processing apparatus 1, the upstream side of the vacuum processing chamber 2 and the first auxiliary vacuum chamber 3 1 serving upstream auxiliary vacuum chamber which is continuously provided (left side in FIG. 1), downstream of the vacuum processing chamber 2 (Fig. 1 and a second auxiliary vacuum chamber 3 2 serving downstream auxiliary vacuum chamber which is continuously provided on the right side). These auxiliary vacuum chambers 3 1 and 3 2 are evacuated by a vacuum pump that is common or dedicated to the vacuum processing chamber 2.

第1補助真空室3の入口部と、真空処理室2の入口部及び出口部と、第2補助真空室3の出口部とには、夫々シート状基板Sを挟むようにして閉じる仕切り弁4が配置されている。仕切り弁4は、図2に示す如く、上記入口部や上記出口部に設けた弁座41と、弁座41に接離自在な弁体42とで構成されている。そして、シート状基板Sをガイドローラ43で弁座41に沿うように支持し、弁体42の閉じ動作でシート状基板Sが弁座41と弁体42との間に挟み込まれるようにしている。また、弁座41と弁体42には、気密性を高めるためシール材44が取り付けられている。尚、本実施形態では、弁体42を軸42aを中心にして回動する回動式のものとしているが、直動式の弁体を用いることも可能である。 A first auxiliary vacuum chamber 3 first inlet portion, the inlet portion and the outlet portion of the vacuum processing chamber 2, the second auxiliary vacuum chamber 3 second outlet portion, closed so as to sandwich the respective sheet-like substrate S sluice valve 4 Is arranged. As shown in FIG. 2, the gate valve 4 includes a valve seat 41 provided at the inlet and the outlet, and a valve body 42 that can contact and separate from the valve seat 41. Then, the sheet-like substrate S is supported along the valve seat 41 by the guide roller 43, and the sheet-like substrate S is sandwiched between the valve seat 41 and the valve body 42 by the closing operation of the valve body 42. . Further, a seal member 44 is attached to the valve seat 41 and the valve body 42 in order to improve airtightness. In the present embodiment, the valve body 42 is a rotary type that rotates about the shaft 42a. However, a direct-acting valve body can also be used.

また、第1と第2の各補助真空室3,3には、所定長さ分のシート状基板Sを引き込み、引き込んだシート状基板Sを引き出し自在に保持する第1と第2の各基板引き込み機構5,5が配置されている。各基板引き込み機構5,5は、シート状基板Sの搬送方向に間隔を存して配置した一対のガイドローラ51,51と、両ガイドローラ51,51間に配置した、シート状基板Sの搬送方向と直交する上下方向に図示省略したシリンダ等のアクチュエータによって移動自在な可動ローラ52とで構成されている。そして、可動ローラ52を下動させることにより、シート状基板Sが両ガイドローラ51,51間に所定長さ引き込まれ、可動ローラ52をフリーにすることにより、引き込んだシート状基板Sが引き出し自在になるようにしている。 Further, the first and second auxiliary vacuum chambers 3 1 and 3 2 are pulled in by a predetermined length of the sheet-like substrate S, and the first and second auxiliary vacuum chambers 3 1 and 2 hold the drawn sheet-like substrate S so that they can be pulled out. each substrate retraction mechanism 5 1, 5 2 are disposed. Mechanism 5 1, 5 2 pull each substrate, a pair of guide rollers 51, 51 arranged in the conveying direction of the sheet-like substrate S at intervals and placed between the two guide rollers 51, the sheet-like substrate S And a movable roller 52 that can be moved by an actuator such as a cylinder (not shown) in the vertical direction perpendicular to the conveying direction. Then, by moving the movable roller 52 downward, the sheet-like substrate S is drawn between the guide rollers 51 and 51 by a predetermined length, and by making the movable roller 52 free, the drawn sheet-like substrate S can be pulled out freely. It is trying to become.

ここで、シート状基板Sは、前工程Fから大気圧空間を通して真空処理装置1に搬送され、真空処理装置1から大気圧空間を通して後工程Rに搬送される。そして、真空処理装置1におけるシート状基板Sの搬送は、第1と第2の各基板引き込み機構5,5を作動することにより行われる。以下、真空処理装置1におけるシート状基板Sの搬送について、図3を参照して説明する。尚、図3において、開弁状態の仕切り弁4は白抜きで示している。 Here, the sheet-like substrate S is transferred from the previous process F to the vacuum processing apparatus 1 through the atmospheric pressure space, and is transferred from the vacuum processing apparatus 1 to the subsequent process R through the atmospheric pressure space. Then, conveyance of the sheet-like substrate S in the vacuum processing apparatus 1 is performed by operating the first and mechanism 5 1 retraction second respective substrates, 5 2. Hereinafter, the conveyance of the sheet-like substrate S in the vacuum processing apparatus 1 will be described with reference to FIG. In FIG. 3, the gate valve 4 in the opened state is shown in white.

シート状基板Sの搬送に際しては、先ず、図3(a)に示す如く、第1補助真空室3の入口部の仕切り弁4を開弁させた状態で、第1基板引き込み機構5の可動ローラ52を下動させる。これにより、所定長さ分のシート状基板Sが第1補助真空室3にその上流側の大気圧空間から引き込まれる。その後、第1補助真空室3の入口部の仕切り弁4を閉弁して、第1補助真空室3を減圧する。 In conveyance of the sheet-like substrate S, first, as shown in FIG. 3 (a), the first auxiliary vacuum chamber 3 1 in a state where the gate valve 4 is opened in the inlet portion, pull the first substrate mechanism 5 1 The movable roller 52 is moved downward. Thus, a sheet-like substrate S having a predetermined length amount is drawn from the atmospheric pressure space of the upstream side to the first auxiliary vacuum chamber 3 1. Thereafter, the gate valve 4 of the first auxiliary vacuum chamber 3 1 of the inlet portion and closed, to depressurize the first auxiliary vacuum chamber 3 1.

次に、図3(b)に示す如く、真空処理室2の入口部及び出口部の仕切り弁4,4を開弁させた状態で、第2基板引き込み機構5の可動ローラ52を一定ストロークで間欠的に下動させ、シート状基板Sを第1基板引き込み機構5から真空処理室2を介して第2補助真空室3に一定長さずつ間欠的に搬送する。この際、冷却ローラ22を第2基板引き込み機構5によるシート状基板Sの引き込みに同期して回転させ、シート状基板Sに冷却ローラ22と第2引き込み機構5との間で過大な張力が作用しないようにする。そして、各間欠搬送後に、真空処理室2の入口部及び出口部の仕切り弁4,4を閉弁して、真空処理室2を所要の真空度まで減圧し、シート状基板Sに一定長さずつ成膜処理を施す。 Next, as shown in FIG. 3 (b), in a state of being opened gate valve 4, 4 of the inlet and outlet of the vacuum processing chamber 2, a constant stroke of the second movable roller 52 of the substrate retraction mechanism 5 2 in intermittently moved downward, intermittently conveyed from mechanism 5 1 pull first substrate sheet substrate S by a predetermined length to a second auxiliary vacuum chamber 3 2 via the vacuum processing chamber 2. At this time, cool the rollers 22 are rotated synchronously by the second substrate retraction mechanism 5 2 in the retracted sheet substrate S, excessive tension between the sheet-like substrate S and the cooling roller 22 and the second retraction mechanism 5 2 To prevent it from working. And after each intermittent conveyance, the gate valves 4 and 4 of the inlet part and the outlet part of the vacuum processing chamber 2 are closed, the vacuum processing chamber 2 is depressurized to a required degree of vacuum, and the sheet-like substrate S has a certain length. A film forming process is performed one by one.

次に、図3(c)に示す如く、第2補助真空室3の出口部の仕切り弁4を開弁させた状態で、後工程R側に設けた引き出し機構により、シート状基板Sを第2基板引き込み機構5から第2補助真空室3の下流側の大気圧空間に引き出す。その後、第2補助真空室3の出口部の仕切り弁4を閉弁させて、第2補助真空室3を減圧すると共に、図3(a)に示す如く、第1補助真空室3にシート状基板Sを引き込む。以上の動作を繰り返して、成膜処理と基板搬送とを連続して行う。 Next, as shown in FIG. 3 (c), in a state in which the gate valve 4 is opened in the second outlet of the auxiliary vacuum chamber 3 2, the drawer mechanism provided on the rear step R side, a sheet-like substrate S withdrawn from the second substrate retraction mechanism 5 2 to the atmospheric pressure space of the second auxiliary vacuum chamber 3 2 of the downstream side. Thereafter, the gate valve 4 of the second outlet portion of the auxiliary vacuum chamber 3 2 by closing, with a second auxiliary vacuum chamber 3 2 depressurizing, as shown in FIG. 3 (a), the first auxiliary vacuum chamber 3 1 The sheet-like substrate S is drawn into the substrate. By repeating the above operation, the film forming process and the substrate transfer are continuously performed.

ここで、本実施形態では、第2基板引き込み機構5によりシート状基板Sを第1補助真空室3から真空処理室2を経由して第2補助真空室3に間欠搬送する際に、真空処理室2の入口部及び出口部の仕切り弁4,4を開弁させても、予め第1補助真空室3の入口部の仕切り弁4及び第2補助真空室3の出口部の仕切り弁4を閉弁して、第1と第2の両補助真空室3,3を減圧しておくことができるため、間歇搬送時に真空処理室2が大気解放されることはない。従って、間歇搬送後に、真空処理室2を短時間で所要の真空度に減圧して成膜処理を再開することができ、生産性が向上する。 In the present embodiment, when the intermittent transport in the second auxiliary vacuum chamber 3 2 via the second substrate retraction mechanism 5 2 vacuum processing chamber 2 a sheet-like substrate S from the first auxiliary vacuum chamber 3 1 , the inlet portion of the vacuum processing chamber 2 and also by opening the gate valve 4, 4 in the outlet portion, pre-gate valve 4 and the second auxiliary vacuum chamber 3 second outlet portion of the first auxiliary vacuum chamber 3 first inlet portion Since the first and second auxiliary vacuum chambers 3 1 and 3 2 can be depressurized by closing the gate valve 4, the vacuum processing chamber 2 is not released to the atmosphere during intermittent transfer. . Therefore, after the intermittent transfer, the vacuum processing chamber 2 can be decompressed to a required degree of vacuum in a short time and the film forming process can be resumed, thereby improving productivity.

また、前工程Fからシート状基板Sをロール状に巻き取らずにそのまま真空処理装置1に搬送したり、真空処理装置1からシート状基板Sをロール状に巻き取らずにそのまま後工程Rに搬送したりすることもでき、生産性の大幅な向上を図ることができる。   In addition, the sheet-like substrate S is transported to the vacuum processing apparatus 1 as it is without being wound in a roll form from the previous process F, or is directly transferred to the subsequent process R without being wound in a roll form from the vacuum processing apparatus 1. It can be transported, and productivity can be greatly improved.

尚、真空処理装置1の上流側と下流側の大気圧空間に夫々繰出しローラと巻取りローラを設置して、繰出しローラからシート状基板Sを第1基板引き込み機構5により引き込み、第2基板引き込み機構5からシート状基板Sを巻取りローラにより引き出すことも可能である。この場合、従来例の如く補助真空室に繰出しローラを収納するものと異なり、繰出しローラの大きさが制限されず、繰出しローラに多大な長さのシート状基板Sを巻回しておくことができる。そのため、繰出しローラと巻取りローラの交換頻度は少なくて済み、生産性が向上する。 Incidentally, the atmospheric pressure space upstream and downstream of the vacuum processing apparatus 1 installed respectively feed roller and the take-up roller, pulling the mechanism 5 1 pull first substrate sheet substrate S from the feed roller, a second substrate it is also possible to draw the pulling mechanism 5 2 a sheet-like substrate S by the take-up roller. In this case, unlike the conventional example in which the feeding roller is housed in the auxiliary vacuum chamber, the size of the feeding roller is not limited, and the sheet-like substrate S having a great length can be wound around the feeding roller. . As a result, the replacement frequency of the feeding roller and the winding roller can be reduced, and productivity is improved.

次に、図4に示す第2実施形態について説明する。第2実施形態の上記第1実施形態との相違点は、真空処理室2内に、入口部側と出口部側とに位置させて、一対の基板引き込み機構5in,5outを配置したことである。これら各基板引き込み機構5in,5outは、第1と第2の補助真空室3,3に配置した第1と第2の各基板引き込み機構5,5と同様に、一対のガイドローラ51,51と、両ガイドローラ51,51間に配置した可動ローラ52とで構成されている。 Next, a second embodiment shown in FIG. 4 will be described. The difference of the second embodiment from the first embodiment is that a pair of substrate drawing mechanisms 5 in and 5 out are arranged in the vacuum processing chamber 2 on the inlet side and the outlet side. . Each of these substrates retraction mechanism 5in, 5Out, like the first and the mechanism 5 1, 5 2 pull second respective substrates arranged first and the second auxiliary vacuum chamber 3 1, 3 2, a pair of guide rollers 51, 51 and a movable roller 52 disposed between the two guide rollers 51, 51.

第2実施形態では、先ず、図5(a)に示す如く、第1補助真空室3の入口部の仕切り弁4を開弁させた状態で、第1基板引き込み機構5の可動ローラ52を下動させ、シート状基板Sを第1補助真空室3にその上流側の大気圧空間から引き込んだ後、第1補助真空室3の入口部の仕切り弁4を閉弁して、第1補助真空室3を減圧する。次に、図5(b)に示す如く、真空処理室2の入口部の仕切り弁4を開弁させた状態で、入口側基板引き込み機構5inの可動ローラ52を下動させて、シート状基板Sを第1基板引き込み機構5から真空処理室2に引き込む。 In the second embodiment, first, as shown in FIG. 5 (a), in a state in which the gate valve 4 is opened in the first auxiliary vacuum chamber 3 first inlet portion, the first substrate retraction mechanism 5 first movable roller 52 the moved downward, after retracted from atmospheric space the sheet-like substrate S first auxiliary vacuum chamber 3 1 upstream thereof, to close the gate valve 4 of the first auxiliary vacuum chamber 3 1 of the inlet portion, a first auxiliary vacuum chamber 3 1 under reduced pressure. Next, as shown in FIG. 5B, the movable roller 52 of the inlet-side substrate pull-in mechanism 5 in is moved downward with the gate valve 4 at the inlet of the vacuum processing chamber 2 opened, so that the sheet-like substrate is moved down. S drawn into the vacuum processing chamber 2 from the first substrate retraction mechanism 5 1.

次に、真空処理室2の入口部の仕切り弁4を閉弁し、真空処理室2を所要の真空度に減圧して、成膜処理を開始する。そして、成膜処理中に、図5(c)に示す如く、出口側基板引き込み機構5outの可動ローラ52を一定ストロークで間欠的に下動させて、入口側基板引き込み機構5inから冷却ローラ22を介して出口側基板引き込み機構5outにシート状基板Sを一定長さずつ間欠的に搬送し、シート状基板Sに一定長さずつ成膜処理を施す。   Next, the gate valve 4 at the inlet of the vacuum processing chamber 2 is closed, the vacuum processing chamber 2 is depressurized to a required degree of vacuum, and the film forming process is started. Then, during the film forming process, as shown in FIG. 5C, the movable roller 52 of the outlet side substrate pulling mechanism 5out is intermittently moved downward at a constant stroke, and the cooling roller 22 is moved from the inlet side substrate pulling mechanism 5in. Then, the sheet-like substrate S is intermittently conveyed to the outlet-side substrate drawing mechanism 5out by a certain length, and the film-forming process is performed on the sheet-like substrate S by a certain length.

その後、図5(d)に示す如く、真空処理室2の出口部の仕切り弁4を開弁させた状態で、第2基板引き込み機構5の可動ローラ52を下動させ、シート状基板Sを出口側基板引き込み機構5outから第2補助真空室3に引き込む。次に、真空処理室2の出口部の仕切り弁4を閉弁した後、図5(a)に示す如く、第1補助真空室3の入口部の仕切り弁4及び第2補助真空室3の出口部の仕切り弁4を開弁させた状態で、第1基板引き込み機構5により第1補助真空室3にシート状基板Sを引き込むと共に、後工程R側に設けた引き出し機構により、シート状基板Sを第2基板引き込み機構5から第2補助真空室7の下流側に引き出す。以上の動作を繰り返して、成膜処理と基板搬送とを連続して行う。 Thereafter, as shown in FIG. 5 (d), in a state of being opened gate valve 4 in the outlet portion of the vacuum processing chamber 2, the second movable roller 52 of the substrate retraction mechanism 5 2 is moved downward, the sheet-like substrate S the pull from the outlet side substrate retraction mechanism 5out the second auxiliary vacuum chamber 3 2. Then, after closing the gate valve 4 in the outlet portion of the vacuum processing chamber 2, FIG. 5 as (a), the first auxiliary vacuum chamber 3 1 of the inlet portion of the gate valve 4 and the second auxiliary vacuum chamber 3 the gate valve 4 of the second outlet portion while it is opened, with the first auxiliary vacuum chamber 3 1 by the first substrate retraction mechanism 5 1 draw sheet substrate S, the drawer mechanism provided on the rear step R side draws second substrate sheet substrate S mechanism 5 drawn from 2 to the second downstream side of the auxiliary vacuum chamber 7 2. By repeating the above operation, the film forming process and the substrate transfer are continuously performed.

ここで、上記第1実施形態においては、第1基板引き込み機構5から第2基板引き込み機構5にシート状基板Sを一定長さずつ間欠搬送するたびに真空処理室2の入口部及び出口部の仕切り弁4を開弁させる必要がある。そして、仕切り弁4の開弁により真空処理室2の真空度が若干ではあるが低下してしまうため、仕切り弁4の閉弁後に、真空処理室2が所要の真空度に減圧されるまで待ってから成膜処理を再開することが必要になる。これに対し、第2実施形態では、真空処理室2の入口部及び出口部の仕切り弁4を閉弁させたまま、真空処理室2内でシート状基板Sを間欠搬送することができる。そのため、間欠搬送後に直ちに成膜処理を再開することができ、生産性が向上する。 Here, in the first embodiment, the vacuum processing chamber 2 in mechanism 5 2 pull second substrate from the first substrate retraction mechanism 5 1 each time intermittently conveying the sheet-like substrate S by a predetermined length inlet section and an outlet It is necessary to open the gate valve 4 of the part. Since the degree of vacuum in the vacuum processing chamber 2 slightly decreases due to the opening of the gate valve 4, after the gate valve 4 is closed, wait until the vacuum processing chamber 2 is depressurized to the required degree of vacuum. Then, it is necessary to restart the film forming process. On the other hand, in the second embodiment, the sheet-like substrate S can be intermittently conveyed in the vacuum processing chamber 2 with the gate valves 4 at the inlet and outlet of the vacuum processing chamber 2 closed. Therefore, the film forming process can be resumed immediately after intermittent conveyance, and productivity is improved.

尚、第2実施形態では、出口側基板引き込み機構5outの可動ローラ52を下降端位置まで一定速度で下動させ、シート状基板Sを入口側基板引き込み機構5inから出口側基板引き込み機構5outに連続搬送しながら成膜処理を施すこともできる。   In the second embodiment, the movable roller 52 of the outlet side substrate pulling mechanism 5out is moved down to a descending end position at a constant speed, and the sheet-like substrate S continues from the inlet side substrate pulling mechanism 5in to the outlet side substrate pulling mechanism 5out. A film forming process can also be performed while being conveyed.

次に、図6に示す第3実施形態について説明する。第3実施形態の上記第1実施形態との相違点は、第1補助真空室3と真空処理室2との間に第1バッファ室6を介設すると共に、第2補助真空室3と真空処理室2との間に第2バッファ室6を介設したことである。 Next, a third embodiment shown in FIG. 6 will be described. Differences from the first embodiment of the third embodiment, the first buffer chamber 61 as well as interposed between the first auxiliary vacuum chamber 3 1 and the vacuum processing chamber 2, the second auxiliary vacuum chamber 3 between the 2 and the vacuum processing chamber 2 is that the second interposed the buffer chamber 6 2.

第1と第2の各バッファ室6,6は、真空処理室2や第1と第2の各補助真空室3,3と共用の真空ポンプ或いは専用の真空ポンプにより真空引きされる。また、第1バッファ室6の入口部と第2バッファ室6の出口部には、夫々シート状基板Sを挟むようにして閉じる仕切り弁4が配置されている。 The first and second buffer chambers 6 1 and 6 2 are evacuated by a vacuum pump shared with the vacuum processing chamber 2 and the first and second auxiliary vacuum chambers 3 1 and 3 2 or by a dedicated vacuum pump. The Further, the first inlet portion of the buffer chamber 61 to the second outlet of the buffer chamber 6 2, gate valve 4 to close so as to sandwich the respective sheet-like substrate S is placed.

ここで、仕切り弁4を閉弁しても、シート状基板Sの側縁と仕切り弁4との間に僅かではあるが隙間を生ずる。そのため、第1実施形態の如く、真空処理装置1の上流側の大気圧空間に対し真空処理室2を第1補助真空室3の入口部の仕切り弁4と真空処理室2の入口部の仕切り弁4とで2重にシールすると共に、真空処理装置1の下流側の大気圧空間に対し真空処理室2を第2補助真空室3の出口部の仕切り弁4と真空処理室2の出口部の仕切り弁4とで2重にシールしても、真空処理室2を所定の真空度以上には減圧することが困難になる。 Here, even if the gate valve 4 is closed, a slight gap is generated between the side edge of the sheet substrate S and the gate valve 4. Therefore, as in the first embodiment, the vacuum processing apparatus 1 to the upstream atmospheric pressure space of the vacuum processing chamber 2 in the first auxiliary vacuum chamber 3 1 of the inlet portion of the gate valve 4 and the vacuum processing chamber 2 inlet of with sealed double by the gate valve 4, the vacuum processing apparatus 1 downstream of the vacuum processing chamber 2 to atmospheric pressure space of the second auxiliary vacuum chamber 3 2 outlet gate valve 4 and the vacuum processing chamber 2 of Even if double sealing is performed with the gate valve 4 at the outlet, it is difficult to depressurize the vacuum processing chamber 2 beyond a predetermined degree of vacuum.

これに対し、第3実施形態によれば、真空処理装置1の上流側の大気圧空間に対し真空処理室2を第1補助真空室3の入口部の仕切り弁4と第1バッファ室6の入口部の仕切り弁4と真空処理室2の入口部の仕切り弁4とで3重にシールすることができる。同様に真空処理装置1の下流側の大気圧空間に対し真空処理室2を第2補助真空室3の出口部の仕切り弁4と第2バッファ室6の出口部の仕切り弁4と真空処理室2の出口部の仕切り弁4とで3重にシールすることができる。そして、第1と第2の各補助真空室3,3の真空度よりも第1と第2の各バッファ室6,6の真空度の方が高くなり、真空処理室2の真空度は各バッファ室6,6の真空度よりも更に高くなる。そのため、真空処理室2をかなり高い真空度まで減圧でき、真空処理室2の高度の真空度が要求される場合にも対処できる。 In contrast, according to the third embodiment, a gate valve 4 of the inlet portion of the vacuum processing chamber 2 a first auxiliary vacuum chamber 3 1 to the upstream atmospheric pressure space of the vacuum processing apparatus 1 first buffer chamber 6 The gate valve 4 at the inlet of 1 and the gate valve 4 at the inlet of the vacuum processing chamber 2 can be triple sealed. Gate valve 4 and the vacuum of the sluice valve 4 and the second outlet portion of the buffer chamber 6 2 of the second outlet portion of the auxiliary vacuum chamber 3 2 vacuum processing chamber 2 to similarly atmospheric pressure space downstream of the vacuum processing apparatus 1 It is possible to provide a triple seal with the gate valve 4 at the outlet of the processing chamber 2. Then, than the first and second respective auxiliary vacuum chambers 3 1, 3 2 of the vacuum degree becomes higher in the first and second of each buffer chamber 6 1, 6 2 of the vacuum degree of the vacuum processing chamber 2 the degree of vacuum even higher than the vacuum degree of each buffer chamber 6 1, 6 2. Therefore, the vacuum processing chamber 2 can be depressurized to a considerably high degree of vacuum, and the case where a high degree of vacuum of the vacuum processing chamber 2 is required can be dealt with.

尚、第3実施形態では、第1と第2の各バッファ室6,6の数を1個にしているが、真空処理室2の要求真空度によっては各バッファ室6,6の数を2個以上としてもよい。また、第3実施形態において、真空処理室2内の入口部側と出口部側に、夫々第2実施形態の如く基板引き込み機構を配置してもよい。 In the third embodiment, the number of each of the first and second buffer chambers 6 1 , 6 2 is one. However, depending on the required vacuum degree of the vacuum processing chamber 2, each buffer chamber 6 1 , 6 2 is used. The number may be two or more. In the third embodiment, a substrate drawing mechanism may be arranged on the inlet side and the outlet side in the vacuum processing chamber 2 as in the second embodiment.

また、各バッファ室6,6に基板引き込み機構を配置してもよい。この場合、第1バッファ室6に配置した基板引き込み機構により、シート状基板Sを第1補助真空室3に配置した第1基板引き込み機構5から第1バッファ室6に引き込み、また、第2バッファ室6に配置した基板引き込み機構により、シート状基板Sを第1バッファ室6に配置した基板引き込み機構から真空処理室2を経由して第2バッファ室6に引き込み、更に、第2補助真空室3に配置した第2基板引き込み機構5により、シート状基板Sを第2バッファ室6に配置した基板引き込み機構から第2補助真空室3に引き込むようにする。尚、各バッファ室6,6に基板引き込み機構を配置することは、第1と第2の各基板引き込み機構5,5を内蔵する第1と第2の各補助真空室5,5を真空処理室2の上流側と下流側に夫々複数配置することと同じである。 Further, a substrate drawing mechanism may be arranged in each buffer chamber 6 1 , 6 2 . In this case, the substrate retraction mechanism disposed in the first buffer chamber 61 draws the first substrate retraction mechanism 5 1 placing the sheet-like substrate S to a first auxiliary vacuum chamber 3 1 into the first buffer chamber 6 1, also , by a substrate retraction mechanism disposed in the second buffer chamber 6 2 draws sheet substrate S from the substrate retraction mechanism disposed in the first buffer chamber 61 into the second buffer chamber 6 2 via the vacuum processing chamber 2, further, the second substrate retraction mechanism 5 2 disposed on the second auxiliary vacuum chamber 3 2, a sheet-like substrate S as the substrate retraction mechanism disposed in the second buffer chamber 6 2 drawn into the second auxiliary vacuum chamber 3 2 To do. It should be noted that the placement of the substrate drawing mechanism in each of the buffer chambers 6 1 , 6 2 means that each of the first and second auxiliary vacuum chambers 5 1 incorporating the first and second substrate drawing mechanisms 5 1 , 5 2 is included. is equivalent to each of a plurality placing 5 2 on the upstream side and the downstream side of the vacuum processing chamber 2.

次に、図7に示す第4実施形態について説明する。第4実施形態の上記第1実施形態との相違点は、真空処理装置1に複数個の真空処理室、例えば、第1と第2の2個の真空処理室2,2を設け、両真空処理室2,2間に中間補助真空室たる第3補助真空室3を介設して、第3補助真空室3に第3基板引き込み機構5を配置したことである。第3基板引き込み機構5は、第1と第2の各基板引き込み機構5,5と同様に、一対のガイドローラ51,51と両ガイドローラ51,51間に配置した可動ローラ52とで構成される。 Next, a fourth embodiment shown in FIG. 7 will be described. The difference of the fourth embodiment from the first embodiment is that the vacuum processing apparatus 1 is provided with a plurality of vacuum processing chambers, for example, first and second two vacuum processing chambers 2 1 and 2 2 , both the vacuum processing chamber 2 1, 2 serving intermediate auxiliary vacuum chamber between the 2 third auxiliary vacuum chamber 3 3 interposed, is to have the third substrate retraction mechanism 3 is disposed on the third auxiliary vacuum chamber 3 3 . The third substrate retraction mechanism 3, a mechanism 5 1 first and retraction second respective substrates, 5 2 in the same manner as a pair of guide rollers 51, 51 and the movable roller 52 disposed between the two guide rollers 51, 51 Consists of.

第4実施形態においては、第1補助真空室3に配置した第1基板引き込み機構5により、シート状基板Sを大気圧空間から第1補助真空室3に引き込むことと、第3基板引き込み機構5により、シート状基板Sを第1基板引き込み機構5から第1真空処理室2を経由して第3補助真空室3に引き込むことと、第2補助真空室3に配置した第2基板引き込み機構5により、シート状基板Sを第3基板引き込み機構5から第2真空処理室2を経由して第2補助真空室3に引き込むことと、シート状基板Sを第2基板引き込み機構5から下流側の大気圧空間に引き出すこととが行われる。そして、第1補助真空室3の入口部の仕切り弁4及び第2補助真空室3の出口部の仕切り弁4を閉弁させた状態で、第1真空処理室2及び第2真空処理室2にシート状基板Sを搬送し、各真空処理室2,2が大気解放されないようにする。 In the fourth embodiment, the first substrate retraction mechanism 5 1 arranged in a first auxiliary vacuum chamber 3 1, and to draw the sheet-like substrate S from atmospheric space into a first auxiliary vacuum chamber 3 1, third substrate the retraction mechanism 3, and be drawn into the third auxiliary vacuum chamber 3 3 mechanism 5 1 pull first substrate sheet substrate S via a first vacuum processing chamber 2 1, second auxiliary vacuum chamber 3 2 the second substrate retraction mechanism 5 2 placed, and to draw the sheet-like substrate S on the third from the substrate retraction mechanism 3 through the second vacuum processing chamber 2 2 second auxiliary vacuum chamber 3 2, a sheet-like substrate and it is carried out to draw S from the second substrate retraction mechanism 5 2 to the atmospheric pressure space downstream. In a state where the gate valve 4 was closed partition valve 4 and the second outlet portion of the auxiliary vacuum chamber 3 2 of the first auxiliary vacuum chamber 3 first inlet portion, the first vacuum processing chamber 2 1 and a second vacuum processing chamber 2 2 conveys a sheet-like substrate S, each vacuum processing chamber 2 1, 2 2 from being exposed to the atmosphere.

尚、第4実施形態において、第1と第2の各真空処理室2,2内の入口部側と出口部側に、夫々第2実施形態の如く基板引き込み機構を配置し、また、第1補助真空室3と第1真空処理室2との間及び第2補助真空室3と第2真空処理室2との間に、夫々第3実施形態の如くバッファ室を介設してもよい。 In the fourth embodiment, a substrate drawing mechanism is arranged on the inlet side and the outlet side in each of the first and second vacuum processing chambers 2 1 and 2 2 as in the second embodiment, and during and between the second auxiliary vacuum chamber 3 2 and the second vacuum processing chamber 2 2 of the first auxiliary vacuum chamber 3 1 and the first vacuum processing chamber 2 1, via a respective buffer chamber as in the third embodiment You may set up.

以上、本発明の実施形態について図面を参照して説明したが、本発明はこれに限定されない。例えば、上記実施形態では、各基板引き込み機構5,5,5,5in,5outを一対のガイドローラ51,51と両ガイドローラ51,51間に配置した可動ローラ52とで構成しているが、シート状基板Sを挟んで回転するピンチローラで各基板引き込み機構を構成することも可能である。但し、ピンチローラを用いた場合には、シート状基板Sとピンチローラ間での滑りによりシート状基板Sの引き込み不良を生ずることがある。これに対し、上記実施形態の如く可動ローラ52を用いれば、シート状基板Sを確実に引き込むことができ、有利である。 As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to this. For example, in the above embodiment, each of the substrate drawing mechanisms 5 1 , 5 2 , 5 3 , 5 in, 5 out is constituted by a pair of guide rollers 51, 51 and a movable roller 52 arranged between the guide rollers 51, 51. However, it is also possible to configure each substrate pull-in mechanism with a pinch roller that rotates with the sheet-like substrate S interposed therebetween. However, when a pinch roller is used, the sheet-like substrate S may be pulled in poorly due to slippage between the sheet-like substrate S and the pinch roller. On the other hand, if the movable roller 52 is used as in the above embodiment, the sheet-like substrate S can be reliably pulled in, which is advantageous.

また、上記実施形態は、シート状基板SにPVDによる成膜処理を施す真空処理装置の基板搬送装置に本発明を適用したものであるが、CVDによる成膜処理を施す真空処理装置、更にはエッチングなどの成膜処理以外の真空処理を施す真空処理装置の基板搬送装置にも同様に本発明を適用できる。   Moreover, although the said embodiment applies this invention to the board | substrate conveyance apparatus of the vacuum processing apparatus which performs the film-forming process by PVD to the sheet-like board | substrate S, the vacuum processing apparatus which performs the film-forming process by CVD, The present invention can be similarly applied to a substrate transfer device of a vacuum processing apparatus that performs vacuum processing other than film formation processing such as etching.

1…真空処理装置、2,2,2…真空処理室、3…第1補助真空室(上流側補助真空室)、3…第2補助真空室(下流側補助真空室)、3…第3補助真空室(中間補助真空室)、4…仕切り弁、5,5,5,5in,5out…基板引き込み機構、51…ガイドローラ、52…可動ローラ、6…第1バッファ室(上流側バッファ室)、6…第2バッファ室(下流側バッファ室)。 DESCRIPTION OF SYMBOLS 1 ... Vacuum processing apparatus, 2, 2 1 , 2 2 ... Vacuum processing chamber, 3 1 ... 1st auxiliary vacuum chamber (upstream side auxiliary vacuum chamber), 3 2 ... 2nd auxiliary vacuum chamber (downstream side auxiliary vacuum chamber), 3 3 ... 3rd auxiliary vacuum chamber (intermediate auxiliary vacuum chamber), 4 ... Gate valve, 5 1 , 5 2 , 5 3 , 5 in, 5 out ... Substrate drawing mechanism, 51 ... Guide roller, 52 ... Movable roller, 6 1 ... First buffer chamber (upstream buffer chamber), 6 2 ... Second buffer chamber (downstream buffer chamber).

Claims (5)

長尺のシート状基板を真空処理室を通して搬送し、この真空処理室でシート状基板に所定の処理を施す真空処理装置における基板搬送装置であって、
前記真空処理室の上流側に連設した上流側補助真空室と、
前記真空処理室の下流側に連設した下流側補助真空室と、
前記上流側補助真空室の入口部と、前記下流側補助真空室の出口部と、前記真空処理室の入口部及び出口部とに夫々配置した、シート状基板を挟むようにして閉じる仕切り弁と、
所定長さ分のシート状基板を引き込み、引き込んだシート状基板を引き出し自在に保持する基板引き込み機構とを備え、
前記上流側補助真空室と前記下流側補助真空室とに夫々前記基板引き込み機構が配置され、
前記上流側補助真空室の入口部の前記仕切り弁を開弁させた状態で、前記上流側補助真空室に配置した前記基板引き込み機構により、シート状基板を前記上流側補助真空室にその上流側の大気圧空間から引き込み、前記下流側補助真空室の出口部の前記仕切り弁を開弁させた状態で、シート状基板を前記下流側補助真空室に配置した前記基板引き込み機構から前記下流側補助真空室の下流側の大気圧空間に引き出すことを特徴とする真空処理装置における基板搬送装置。
A substrate transport apparatus in a vacuum processing apparatus that transports a long sheet-shaped substrate through a vacuum processing chamber and performs a predetermined process on the sheet-shaped substrate in the vacuum processing chamber,
An upstream auxiliary vacuum chamber connected to the upstream side of the vacuum processing chamber;
A downstream auxiliary vacuum chamber connected to the downstream side of the vacuum processing chamber;
A gate valve disposed so as to sandwich the sheet-like substrate, which is disposed at the inlet portion of the upstream auxiliary vacuum chamber, the outlet portion of the downstream auxiliary vacuum chamber, and the inlet portion and outlet portion of the vacuum processing chamber, respectively.
With a substrate pull-in mechanism that pulls in a sheet-like substrate for a predetermined length and holds the drawn sheet-like substrate freely,
The substrate drawing mechanism is arranged in each of the upstream side auxiliary vacuum chamber and the downstream side auxiliary vacuum chamber,
With the gate valve at the inlet of the upstream side auxiliary vacuum chamber opened, the substrate drawing mechanism disposed in the upstream side auxiliary vacuum chamber causes the sheet-like substrate to move to the upstream side auxiliary vacuum chamber. The downstream auxiliary from the substrate pull-in mechanism in which the sheet-like substrate is disposed in the downstream auxiliary vacuum chamber in a state where the downstream side auxiliary vacuum chamber is drawn in and the gate valve at the outlet of the downstream auxiliary vacuum chamber is opened. A substrate transfer apparatus in a vacuum processing apparatus, wherein the substrate transfer apparatus is pulled out to an atmospheric pressure space downstream of the vacuum chamber.
前記真空処理室内の入口部側と出口部側に、夫々前記基板引き込み機構が配置されることを特徴とする請求項1項記載の真空処理装置における基板搬送装置。   2. The substrate transfer apparatus in a vacuum processing apparatus according to claim 1, wherein the substrate drawing mechanism is arranged on each of an inlet portion side and an outlet portion side in the vacuum processing chamber. 前記上流側補助真空室と前記真空処理室との間に少なくとも1つの上流側バッファ室が介設されると共に、前記下流側補助真空室と前記真空処理室との間に少なくとも1つの下流側バッファ室が介設され、前記上流側バッファ室の入口部と前記下流側バッファ室の出口部とに、夫々シート状基板を挟むようにして閉じる仕切り弁が配置されることを特徴とする請求項1又は2項記載の真空処理装置における基板搬送装置。   At least one upstream buffer chamber is interposed between the upstream auxiliary vacuum chamber and the vacuum processing chamber, and at least one downstream buffer is interposed between the downstream auxiliary vacuum chamber and the vacuum processing chamber. A partition valve is disposed between the inlet portion of the upstream buffer chamber and the outlet portion of the downstream buffer chamber so as to sandwich the sheet-like substrate, respectively. A substrate transfer apparatus in the vacuum processing apparatus according to Item. 前記真空処理室を複数個備え、これら真空処理室間に、前記基板引き込み機構を配置した中間補助真空室が介設されることを特徴とする請求項1〜3の何れか1項記載の真空処理装置における基板搬送装置。   The vacuum according to any one of claims 1 to 3, wherein a plurality of the vacuum processing chambers are provided, and an intermediate auxiliary vacuum chamber in which the substrate drawing mechanism is disposed is interposed between the vacuum processing chambers. A substrate transfer apparatus in a processing apparatus. 前記基板引き込み機構は、シート状基板の搬送方向に間隔を存して配置した一対のガイドローラと、両ガイドローラ間に配置した、シート状基板の搬送方向と直交する方向に移動自在な可動ローラとで構成されることを特徴とする請求項1〜4の何れか1項記載の真空処理装置における基板搬送装置。   The substrate pull-in mechanism includes a pair of guide rollers arranged at intervals in the conveyance direction of the sheet-like substrate, and a movable roller arranged between the guide rollers and movable in a direction orthogonal to the conveyance direction of the sheet-like substrate. The substrate transfer apparatus in a vacuum processing apparatus according to claim 1, wherein the substrate transfer apparatus is configured as follows.
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