JP2011095053A - Method and system for preparing setting data of inspection region for inspecting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To speed up processing for preparing the setting data of an inspection region for a part having a plurality of electrode pins. <P>SOLUTION: After the reference image in a region containing a part 201 to be treated is displayed to take up operation for indicating the region 30 corresponding to a part body, indication using an indication frame 32 is taken up. A user adjusts the width of the indication frame 32 so that a first electrode pin to a third electrode pin are contained and aligns the side of the outside of the indication frame 32 with the leading end position of a land. If the indication is completed, the electrode pins and the land are extracted from the reference image of the range corresponding to the indication frame 32 and the rule related to these arrangements is specified. Further, on the basis of the specified rule or the region 30, the inspection regions S11, S21, S31 and S41 corresponding to the individual electrode pins or inspection regions S1, S2, S3 and S4 becoming the allotment standards of an imaging target region are set. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is based on the premise that the mounting state of a component on a component mounting board is inspected by an image processing technique, and a method of creating inspection area setting data necessary for this inspection, and inspection data to which this method is applied Regarding the creation system.

  In general, a component mounting board visual inspection apparatus generates a two-dimensional image by imaging a board to be inspected, sets an inspection area corresponding to the type of the part in the image, and processes an image in the inspection area. By doing so, it is determined whether or not the soldering state is appropriate and whether or not there is a positional shift of the component (see Patent Document 1). In addition, there is a technique in which height information is added to a two-dimensional image to form a three-dimensional image, and the height of an electrode or a component is determined using this (see Patent Document 2).

  In general, the inspection data in this type of inspection apparatus is used to extract inspection region setting data (indicating the number of inspection regions and the setting position and size of each inspection region) and the inspection site in each inspection region. The binarization threshold value, the logic of the measurement process in each inspection region, the determination reference value, and the like are included. Since the specific inspection contents differ depending on the appearance of the parts, the conventional board appearance inspection apparatus uses standard inspections called “library data” for each part type in advance to reduce the burden of teaching work. Data is prepared, and library data corresponding to the part type is applied to each part to be inspected.

  For example, Patent Document 1 displays a specific image of a part to be taught and items to be input for a part type corresponding to this part, and for each item, a predetermined number of appearance information options are selected. It is described that the user selects a part corresponding to the displayed part, reads out library data matching the selected appearance information, and specifies an inspection area for the part to be taught based on this.

  Also in Patent Document 2, a lead area is extracted from a three-dimensional image of a substrate based on a three-dimensional shape and luminance value of an electrode pin (lead), and a component type of an inspection part is determined from the total number of leads, a distance between leads, and the like. And selecting a component library stored in advance based on the determined component type.

JP 2008-32525 A JP 2006-250609 A

  In IC parts such as QFP and SOP, the number and pitch of electrode pins vary depending on the parts, and the lengths of electrode pins also vary. For this reason, in the conventional appearance inspection apparatus provided by the applicant, only a rough setting rule is defined for the inspection area for IC parts, and each electrode pin and the land to which these are connected from the reference image of the substrate to be inspected. Is automatically extracted, and the above-described setting rule is applied to the extracted electrode pins and lands, thereby specifying the inspection region.

  However, in order to correctly extract a large number of electrode pins and lands, the extraction program becomes complicated, and it takes a considerable time to complete the extraction of all electrode pins and lands. In addition, when there are large variations in the color and brightness of the extraction target part in the image, it is difficult to extract on a uniform basis, and there is an error in the color part that closely resembles the extraction target part around the part. The point extracted is also a problem.

  The present invention pays attention to the above-mentioned problems, and when creating inspection area setting data for a part having a large number of electrode pins, by specifying the inspection area according to a simple designation operation by the user, The purpose is to speed up the creation of inspection area setting data.

  The inspection area setting method according to the present invention is capable of distinguishing between the electrode of the component of the board after mounting the component and other parts, and using the image representing the state of observing the surface from the front, It creates inspection area setting data used for inspecting the mounting state of a component, and is characterized by executing the following first to sixth steps.

  In the first step, a reference image representing a mounting state of the target component is displayed on a monitor, with a component in which a plurality of electrode pins are regularly arranged along the edge of the component main body being set. In the second step, on the display screen of the reference image, an operation for designating the first area corresponding to the component main body of the target part, and the direction along the reference side and the reference line based on one side of the first area An operation of designating the second region by designating a range in a direction from the side toward the outside of the first region is accepted. These designations preferably specify the second area after the first area is specified, but this does not exclude reversing the designation order.

  In the third step, in response to the designation of the first and second regions, electrode pins are extracted from the reference image in the range corresponding to the second region. The fourth step is performed in response to the extraction of the plurality of electrode pins along the reference side by the processing of the third step. The relationship between the extracted electrode pins and the relationship between the electrode pins and the first region Based on the relationship, the rules regarding the arrangement of the electrode pins are specified.

  In the fifth step, by applying the rule specified in the fourth step to at least the reference side of each side of the first region, an inspection region for inspecting the electrode pin outside the first region Are set along a side to which the rule is applied. In the sixth step, in accordance with the execution of the fifth step, the reference image displayed on the monitor is updated to the one representing the state where the inspection area is set, and the confirmation operation is performed on the updated display. Accordingly, setting data used for setting the inspection area is determined.

  According to the above method, when creating inspection area setting data for a part in which a plurality of electrode pins are regularly arranged along the edge of the part body, the screen of the reference image displayed on the monitor In response to the user specifying the first and second regions above, a plurality of inspection regions are automatically set along at least one side of the first region, and the display of the reference image indicates the setting state You can switch to something. When the user determines that the setting of the examination area is appropriate by this display and performs a confirmation operation, the setting data of the examination area being displayed is confirmed.

  In the side where the electrode pins of the SOP or QFP component main body are arranged, the electrode pins having the same size and shape are usually arranged at equal intervals with equal margins at both ends. Therefore, for such a component, the user correctly specifies the region corresponding to the component main body of the component to be set, and the electrode pins arranged along one side of the component main body are arranged in order from the electrode pin located at the end. If two or more are selected and the areas corresponding to these are correctly specified, it is possible to correctly specify the rules regarding the arrangement of the electrode pins and set the inspection area with high accuracy.

  In a preferred aspect of the above method, in the fourth step, as the rules regarding the arrangement of the electrode pins, the width, length and pitch of the electrode pins, and the distance from the corner of the first region to the nearest electrode pin are set. , Identify each. If such information is specified, the number and positions of electrode pins on one side of the component main body can be determined, and an inspection area can be set for each individual electrode pin or land.

  In another preferred embodiment, a reference image before component mounting and a reference image of a substrate after component mounting are prepared, and the latter reference image is displayed in the first step, and in the third step, designation by the second designation operation is performed. Is applied to each reference image to extract the electrode pins from the reference image of the substrate after component mounting in the range corresponding to the second region, and the reference of the substrate before component mounting in the range corresponding to the second region Extract a land from an image. Further, in the fourth step, as the rules regarding the arrangement of the electrode pins, the width, length and pitch of the electrode pins, the distance from one corner of the first region to the nearest electrode pin, and the electrode pins and the land corresponding to each other And the positional relationship with each other.

  According to the above aspect, the user designates the second region so that the electrode pins arranged along one side of the component main body and the lands corresponding thereto are plurally included in order from the one located at the end, respectively, A plurality of combinations of electrode pins and lands are extracted from this region. And since the positional relationship between the electrode pins and the lands is specified together with information necessary to determine the number and position of the electrode pins on one side of the component main body region, the connection state between each electrode pin and the land is inspected. The inspection area can be set with high accuracy.

  In another preferable aspect of the above method, a plurality of electrode pins are arranged on two opposing sides of the rectangular component body, and a line-symmetric relationship is established between the arrangement of the electrode pins on these sides. A part (SOP) is set as a setting target. In the fifth step in this case, applying the rule specified in the fourth step to the reference side, setting a plurality of inspection regions at positions along the reference side outside the first region; The step of rotating these inspection regions by 180 degrees is set outside the first region at a position along the side opposite to the reference side.

  In another preferred embodiment, a plurality of electrode pins are arranged on each side of the rectangular component body, and a component in which a line-symmetric relationship is established between the arrangement of the electrode pins on the two opposing sides ( QFP) is the target of setting. In the fifth step in this case, the rule specified in the fourth step is applied to one of the reference side and two sides orthogonal to the reference side, respectively, and the outside of the first region The step of setting a plurality of inspection regions at positions along the target side and the rotation of these inspection regions by 180 degrees are set at positions along the side opposite to the target side outside the first region. And execute steps.

  According to each aspect described above, the inspection area set for one side is applied to the other side using the symmetry between the two opposing sides, and the setting data for each inspection area is efficiently created. It becomes possible to do.

  Next, the inspection data creation system to which the present invention is applied is capable of distinguishing between the electrode of the component on the board after mounting the component and other parts, and using an image representing the state of observing the surface from the front. Information required for inspection of the mounting state of each component on the board is created. In this system, a reference image display for displaying a reference image representing a mounting state of a target component on a monitor with a component in which a plurality of electrode pins are regularly arranged along the edge of the component main body as a setting target Means: On the display screen of the reference image, an operation for designating the first area corresponding to the component main body of the target part, and the direction along the reference side and the reference side based on one side of the first area Region designation accepting means for accepting an operation for designating a second area by specifying a range in a direction toward the outside of the one area; that the area designation accepting means accepts designation for the first area and the second area. Accordingly, extraction processing means for extracting electrode pins from a reference image in a range corresponding to the second region; extracted when a plurality of electrode pins are extracted along the reference side by the extraction processing means An arrangement rule specifying means for specifying a rule regarding the arrangement of the electrode pins based on the relationship between the pole pins and the relationship between the electrode pins and the first area; at least a reference side among the sides of the first area by the arrangement rule specifying means Area setting means for applying a specified rule and setting a plurality of inspection areas for inspection of the electrode pins along the side to which the rule is applied outside the first area; the inspection area by the area setting means In response to the setting, the reference image displayed on the monitor is updated to the one representing the state where the inspection area is set, and the confirmation operation is performed on the updated display. And an area determining means for determining setting data used for setting the inspection area.

  According to the above system, the inspection area setting data can be efficiently created by executing the inspection area setting method described above. Note that this system can be installed in an inspection apparatus, but can also be installed in an external computer such as a personal computer. In the latter case, the created inspection data can be transplanted to the inspection apparatus by communication, for example.

  According to the present invention, for a component in which a plurality of electrode pins such as SOP and QFP are regularly arranged along the edge of the component body, an inspection region suitable for the state of each electrode pin and the land corresponding thereto. This makes it possible to easily identify and improve the efficiency of creating the inspection area setting data. In addition, if the first area is specified according to the shape of the displayed part, and the part of the part including the end is specified for the arrangement of the electrode pins and lands on one side of the part, the inspection is performed. Since the area can be set correctly, even a user who is not used to setting work can easily set an appropriate inspection area.

It is a figure which shows the structure of a board | substrate external appearance inspection apparatus with the relationship with the computer for test | inspection data creation. It is a flowchart which shows the procedure of the creation process of the variation by a test | inspection data creation system. It is a figure which shows the setting method of the test | inspection area | region with respect to a chip component. It is a figure which shows the setting screen of the test | inspection area | region which made SOP object. It is a figure which shows the change of the screen display after designating a component corresponding | compatible area | region in the screen of FIG. It is a figure which shows the example of designation | designated operation by a designation | designated frame, and the example of a setting of the test | inspection area | region according to this designation | designated. It is a figure which shows the parameter derived | led-out for the setting of a test | inspection area | region. It is a flowchart which shows the detail about the setting process of the inspection area | region which made SOP and QFP object. It is a figure which shows the data structural example of an assumption pitch table. It is a figure which shows the example whose width of a land is not constant. It is a figure which shows the setting screen in the case of setting manually the area | region corresponding to an electrode pin and a land. It is a figure which shows the example of designation | designated operation implemented on the screen of FIG.

  FIG. 1 shows a main configuration of an inspection apparatus 1 that performs an automatic appearance inspection of a component mounting board, together with a personal computer 7 connected to the inspection apparatus 1.

  The inspection apparatus 1 according to this embodiment is for performing an inspection on a finished board 200 manufactured by a solder printing process, a component mounting process, and a reflow process, and a camera 2 for color photography. , The illumination unit 3, the substrate stage 4, and the control processing unit 5.

  The substrate stage 4 is provided with a table unit 41 for supporting the substrate 200 and a moving mechanism 42 for moving the table unit 41 in the X and Y axial directions. The camera 2 is arranged above the substrate stage 4 with the imaging surface facing downward and the optical axis aligned with the vertical direction.

  The illumination unit 3 includes annular light sources 3R, 3G, and 3B that respectively emit red, green, and blue color lights, and are disposed between the substrate stage 4 and the camera 2. Each of the light sources 3R, 3G, and 3B has a different diameter, and is disposed in a state in which each central portion is aligned with the optical axis of the camera 2. Thereby, since each light of red, green, and blue is irradiated to the board | substrate 200 from the direction from which an elevation angle differs, respectively, the inclination state of highly specular reflective parts, such as a solder fillet and an electrode pin mentioned later, is illuminated. An image expressed by the color of light can be generated. In the schematic diagrams of the images in FIGS. 3 to 6 and the like, the colors in the images are replaced with patterns such as halftone dots.

  The control processing unit 5 includes a computer control unit 50, an image input unit 51, an imaging control unit 52, an illumination control unit 53, an XY stage control unit 54, a memory 55, a display unit 56, an input unit 57, and a communication interface 58. Etc. are provided.

  The image input unit 51 includes an A / D conversion circuit for digitally converting an image from the camera 2. The imaging control unit 52 outputs a timing signal for instructing imaging to the camera 2, and the illumination control unit 53 controls the on / off operation and the light amount of each of the light sources 3R, 3G, and 3B. The XY stage controller 54 controls the movement timing of the substrate stage 4 and the movement amount in the X and Y axial directions.

  The memory 55 stores a program describing a series of processing procedures for executing an inspection and a database for storing inspection data (hereinafter referred to as “inspection database”). In the inspection database, for each component mounted on the board 200 to be inspected, data relating to the setting of the inspection area to be set (indicating the position and size of the inspection area), the color of the part to be inspected in each inspection area A plurality of types of inspection data, such as a binarization threshold value for detecting the detection value, determination logic for determining the suitability of the measurement value (mainly area) of the region to be inspected, and a determination reference value, are set.

  In the present specification, of the above inspection data, data indicating the position and size of the inspection region is referred to as “inspection region setting data”, and other inspection data is collectively referred to as “inspection parameter”.

  Next, the substrate 200 of this embodiment is imaged in a plurality of regions. The inspection database also stores data relating to the allocation of the field of view of the camera 2 to the substrate 200. The control unit 50 controls the movement of the substrate stage 4 via the XY stage control unit 54 based on this data, thereby aligning the camera 2 with each imaging target region in order to perform imaging. A color image generated by imaging every hour is input to the control unit 50 via the image input unit 51 and stored in an internal memory (such as a RAM). The control unit 50 pays attention to the components in the image stored in the internal memory in order, and sequentially sets the inspection area, binarization, measurement, and pass / fail judgment processing for the target component based on the inspection data. Execute.

  The control unit 50 is connected to the personal computer 7 in the figure and a host device (not shown) via the communication interface 58 and the communication line 6. Each time the inspection of one substrate 200 is completed, the control unit 50 outputs the inspection result for the substrate 200, the image used for the inspection, and the like to the host device. In addition, the inspection result and the image are also displayed on the display unit 56.

  The personal computer 7 incorporates a system (hereinafter referred to as “inspection data creation system” or simply “system”) for creating inspection data used in the above-described inspection apparatus. In this inspection data creation system, hierarchical structure data in which sub-part types are associated with a plurality of part types is registered. The component type is set by classifying the appearance of various components that can be assumed mainly by the difference in the shape of the component body. A sub-part type is obtained by finely classifying this part type based on differences in the color of the part, the shape of the electrode, and the like.

  In each component type, a basic setting rule of an inspection area suitable for the component type is registered. Each sub-part type is registered with basic library data including link information to the setting rule for the inspection region of the upper part type and inspection parameters according to the appearance characteristics of the sub-part type.

  In this embodiment, in the inspection apparatus, the non-defective product model before and after the component mounting of the substrate 200 is divided into a plurality of regions and images are taken for each region, and the generated images are connected to each other. A reference image representing the overall configuration is generated. Hereinafter, a reference image indicating a substrate before component mounting is referred to as a “pre-mounting reference image”, and a reference image indicating a substrate after component mounting is referred to as a “post-mounting reference image”.

  In the inspection data creation system, each reference image and CAD data of the substrate 200 are input, and by using these input information and the above basic library data, sub models suitable for the model are provided for each part model represented by the CAD data. Using the inspection parameters linked to the specified sub part type, specify the part type, create library data of the variation corresponding to the model (hereinafter simply referred to as “variation”), and register it. . Note that this processing is not necessary for models for which variations are already registered.

  When the above registration process is completed, the system applies the variation corresponding to the model to each part indicated by the CAD data, and creates inspection data for each part. The completed inspection data is transmitted to the inspection apparatus 1 and stored in the inspection database in the memory 55.

FIG. 2 shows a schematic procedure of processing executed by the inspection data creation system with respect to creation of the above variation.
The description will be made with reference to this flowchart. First, the inspection data creation system searches the CAD data of the board 200 for parts for which no variation is registered, and a list (hereinafter, referred to as a part type) of the parts extracted by this search. “Unregistered list”) is displayed on the monitor 17 shown in FIG. 1 (ST1). When the user selects one part type in the unregistered list (ST2 is “YES”), the inspection data creation system calculates the mounting position of the part of the selected type from the CAD data, and mounts within the range including this part. The rear reference image is displayed on the monitor 17 (ST3).

A list of sample images of various component types and sub-component types is also displayed on the display screen at this time. The user collates the shape and color of the part of the selected model with this list, and selects a part type and sub-part type that match the part.
Further, the user designates an area corresponding to the component main body of the component to be set on the displayed image. The area designated here is hereinafter referred to as “component body area”.

  In the inspection data creation system, when each of the above operations is received (ST4, 5), an inspection area setting rule suitable for the selected component type and sub-component type is read out, and this rule is the range in which the component main body region is set. The inspection area is set by applying to (ST6). Further, the post-mounting reference image being displayed is updated to indicate the setting state of the inspection area (ST7).

When the user performs a confirming operation on this display (ST8), the inspection data system combines the inspection parameter of the sub-part type selected for the setting target part with the setting data of the inspection area being displayed, This combination is registered as a new variation (ST10).
The new variation is given the part number of the part to be set as the variation name. If the user determines that the display is inappropriate for the display of the setting state of the inspection area and performs a cancel operation, the inspection area is corrected according to the user's manual operation (ST9).

  Thereafter, these are sequentially selected until there is no unregistered part type, and the same processing as described above is executed. As a result, when variations suitable for all types are created and registered, ST11 becomes “NO” and the variation creation process is terminated.

Hereinafter, the inspection area setting process in ST6 will be described in detail.
In this embodiment, for a chip component in which the number of electrodes is relatively small and the number of electrodes is fixed, the component type of the component 202 to be processed is set as shown in FIG. Various inspection areas S101 to S104 are set based on the component main body area 30 designated by the user based on the basic rules. However, since the position and size of the land on the board side vary, as shown in FIGS. 3B and 3C, the land is extracted from the corresponding range of the pre-mounting reference image, and the extraction result is Accordingly, the inspection areas S101 and S102 for inspection of the soldered state are corrected.
Note that the inspection area S103 in the drawing is used for inspection for determining the presence or absence of a component. In addition, the inspection area S104 is used for the purpose of finely adjusting the positions of the inspection areas S101 to S103 by extracting parts and lands to be inspected from the actual processing target image.

  On the other hand, when a large number of electrode pins, such as SOP and QFP, are arranged and a component having a different number of electrode pins depending on the component type is to be set, it is necessary to first specify the number and pitch of the electrode pins. In order to identify this, it is possible to extract lands from the pre-mounting reference image or to extract electrode pins from the post-mounting reference image. It is necessary to perform complicated processing, and processing time may be long. In addition, when the land is plated, the color or brightness in the image varies due to uneven surface irregularities, etc., and the extraction fails, or the color is very similar to the electrode pins and lands around the part. There is a possibility that the accuracy of extraction cannot be ensured, for example, the part of the above is erroneously extracted.

  Therefore, in this embodiment, focusing on the fact that the electrode pins are regularly arranged in SOP and QFP and having a line-symmetric shape, an area including some electrode pins and lands is shown to the user. Is specified, the regularity of the electrode pins and lands is specified from the image in the area, and the inspection areas for all the electrode pins and lands are set based on the result.

  4 and 5 show the work screens used in setting the examination area by the above method in the order in which they are presented. On the left side of this screen, an image display area 100 for displaying a reference image after mounting of the substrate 200 is provided, and on the right side, a column 101 for displaying information on a component to be selected and a user setting operation are supported. For example, a guidance area 102 is provided.

  The screen shown in FIG. 4 is displayed in response to the selection of the component type and sub-component type of the component to be processed (the component of the currently selected type). A post-mounting reference image centering on the target component 201 (SOP in this example) is displayed together with the component main body region 30 by default setting. In addition, a sample image 103 of the selected sub-part type is displayed at the upper right of the screen and at the center of the guidance area 102.

  The component main body region 30 is used as a reference for setting each inspection region, and a triangular mark 31 is set on one side of a rectangular frame representing the range. The mark 31 indicates the orientation of the component 201. For example, if the mark 31 is facing right, the orientation of the component 201 is 0 degrees, and if the mark 31 is facing upward, the orientation of the component 201 is 90 degrees. The orientation of the component 201 is set based on CAD data.

  The guidance area 102 is provided with “automatic” and “manual” tabs. When the “automatic” tab is selected as in the examples of FIGS. 4 and 5, a mode for automatically extracting electrode pins and lands is set, and the guidance area 102 relates to designation of the target area for automatic extraction. A message 104 to the user is displayed.

  In addition, two buttons 105 and 106 are provided in the guidance area 102 at this time. The button 105 notifies that the designation of the component main body area has been completed. Hereinafter, this button 105 is referred to as a “designation button 105”. The button 106 is used to change the orientation of the component main body region 30 when the orientation is different from the definition of the inspection data.

  Furthermore, a “return” button 107 for returning the screen to the previous one is provided below the guidance area 102. Below the image display area 100, a setting area 108 for switching the display magnification in the area 100, a switching button 109 for switching the image being displayed, and the like are provided. The button 109 is operated when the state of the component to be set in the image display area 100 is not good. When this operation is performed, the display in the image display area 100 is the part type being selected. , It is updated to one centered on a part in a location different from the currently displayed one.

  The component main body region 30 displayed in the image display region 100 in the example of FIG. 4 is set based on the basic setting rule of the selected component type, but is not suitable for an actual component. . In this embodiment, the user is requested to adjust each side of the component main body region 30 to match the actual component main body using the mouse. When the user performs an operation corresponding to this request and operates the designation button 105, the reception process of ST5 in FIG. 2 is executed.

When the designation of the component main body area 30 is accepted, the screen is switched to that shown in FIG. In the image display area 100 of this screen, a rectangular frame 32 is displayed in the vicinity of the lower left corner of the adjusted component main body area 30. In the guidance area 102, the content of the comment 104 is changed to that instructing a designation operation using the rectangular frame 32, and a button 110 with “extract” characters is provided instead of the designation button 105. This button 110 is used to instruct to automatically set an inspection region using an image in the designation frame 32.
Hereinafter, the rectangular frame 32 is referred to as a “designated frame 32”, and the button 110 is referred to as an “extract button 110”.

  Further, below the guidance area 102 on the screen after this stage, a button 111 with a “change frame” character is provided. This button 111 is for instructing to change the position of the designation frame 32. Each time the button 111 is operated, the designation frame 32 moves in order near each corner of the component main body region 30.

  The user adjusts the position and size of the designation frame 32 according to the comment 104 in the guidance area 102 and operates the extraction button 110. As a result, the component main body area 30 is determined as the first specified area, and the area corresponding to the specified frame 32 is determined as the second specified area, and the automatic setting process of the inspection area is started.

  FIG. 6 shows the display transition in the image display area 100 after the screen of FIG. 5 with the display limited to the component 201 to be processed. In the figure, (1) and (2) show displays according to the adjustment work of the user's designated frame 32, and (3) shows a display example when the inspection area is finally automatically set.

  The designation frame 32 of this embodiment is set so that the width can be freely changed by the mouse. One of the two sides along the width direction of the designated frame 32 is positioned and fixed inside the component main body region 30 from the initial stage, but the side located outside the component main body region can be freely adjusted. be able to. In this embodiment, using these adjustment functions, the user adjusts the width of the designation frame 32 so that three pin electrodes arranged along one side of the component main body are included in order from the leftmost one. A request is made to align the outer side of the designated frame 32 with the tip position of the land. When the user performs an adjustment operation as shown in FIGS. 6 (1) and 6 (2) according to this request and operates the extraction button 110, all inspection areas necessary for the part inspection are set, and the display state is shown in FIG. 6 (3). It is updated as shown in

In this display, a rectangular frame indicating the set inspection area is displayed superimposed on the image of the component 201.
The inspection area set here will be briefly described. In this embodiment, the electrode pins arranged along one side of the component main body are divided into 3 to 4 groups, and the electrode pins in the group and Inspection areas S1 to S4 are set in a range including lands corresponding to these. In addition, an inspection region is individually set for each electrode pin. In the display example of FIG. 6C, for each group, one of the electrode pins in the group is used as a representative electrode pin. Only the inspection areas S11, S21, S31, and S41 set in the above are displayed.

  Although not displayed in this example, inspection areas for detecting bridges are set between inspection areas in units of electrode pins such as S11, S21, S31, S41, and the like, from the tip of each electrode pin. An inspection area for inspecting the state of the fillet between the two is set in the range up to the tip of the land.

The inspection area in units of electrode pins is used for inspection to determine the presence / absence of electrode pins, positional deviation, suitability of shape, and the like.
Further, the inspection areas S1 to S4 in group units are used as reference units when assigning the imaging target areas. That is, the hourly imaging target region is set so that the entire range included in the same group is included in the same image. Thereby, it is possible to ensure the accuracy of the inspection performed in units of electrode pins and lands.

  In this embodiment, even after the designation button 105 is operated, the position and size of the component main body region 30 can be corrected until the extraction button 110 is operated. Similarly, the designation frame 32 can be adjusted any number of times before the extraction button 110 is operated. If the user determines that the accuracy of the image at the initial setting position of the designated frame 32 is not good, by operating the change button 111 in FIG. 5, near the other corner of the component main body region 30. The designated frame 32 can be moved to a place where the accuracy of the image is good.

  Although the entire screen after the extraction button 110 is operated is not illustrated, the guidance area 102 is provided with a confirmation button for confirming the setting of the examination area, a cancel button for discarding the setting, and the like. When the user determines that the displayed examination area is appropriate and operates the confirm button, the setting data relating to the examination area being displayed is confirmed, and the process of ST10 of FIG. 2 is executed. On the other hand, when the cancel button is operated, the setting data of the examination area is discarded, and the guidance area 102 is returned to the state shown in FIG.

FIG. 7 shows the main parameters derived for setting the inspection area. In the figure, P _W is the width of the electrode pins, P _M is the length of the electrode pins, the P _D is the pitch between the electrode pins. Further, L _W is the width of the land, L _M is the distance from the edge of the part to the end edge of the land. _SD is a distance from one corner of the component to the nearest electrode pin (hereinafter, this distance is referred to as “margin”).

  FIG. 8 shows a procedure of processing executed by the examination data creation system in accordance with the operation of the extraction button 110. In the following, a process for creating inspection area setting data for SOP and QFP will be described with reference to this flowchart.

  In this process, first, an electrode pin image is extracted from a range corresponding to the designated frame 32 for the post-mounting reference image (ST101). In this embodiment, the specification frame 32 is required to include three electrode pins and lands corresponding to them, but the range along one side of the component main body region 30 may be specified. For example, even if the designation frame 32 is expanded to a range including four or more electrode pins, the designation is valid. However, when the number of electrode pins extracted in ST101 is two or less, error processing such as displaying a message for requesting re-designation in the guidance area 102 without receiving designation by the designation frame 32 is executed.

When three or more electrode pins are extracted in ST101 (“YES” in ST102), the width and length of each electrode pin are measured based on these extraction results, and the average value of each is obtained. Then, the average value of the measured value of the width and _{P W,} the average length of the measured values and _{P M} (ST103).

Next, in step ST104, the distance between the first pin and the second pin and the distance between the second pin and the third pin are respectively measured, and the pitch P _D between the electrode pins is measured based on each measured value. Is identified. To ensure accuracy in this process to identify the best fit assuming the pitch with reference to the assumed pitch table for each measured value shown in FIG. 9, a replaces the identified assumed pitch units of pixels and P _D To do. The assumed pitch table stores specific values of pitch based on information empirically constructed by the developer (indicated by characters a to g in FIG. 9).

Next, a process for obtaining the margin margin _SD of the component main body is executed (ST105). Here, paying attention to the electrode pin extracted from the designation frame 32 and closest to the corner of the component main body region 30, the distance between the corner and the focused electrode pin is measured, and the measured value is obtained. Let margin _SD .

Next, the processing target is switched to the pre-mounting reference image, and a land is extracted from the range corresponding to the designated frame 32 (ST106). Furthermore, the width and length of each land that is extracted is measured and the average value of the measurement values of each width is L _W, the average value of the measurement values of each length to L _M (ST107).

When various parameters are derived in this way, in ST108, the side corresponding to the designated frame of the component main body region 30 is set as a reference side, and margins _SD are set at both ends of the reference side. Then, using a length and a pitch P _D range excluding the margin S _D at both ends, to identify the number and position of each electrode pin of the electrode pins in the reference side.

Next, in ST109, an inspection area is assigned to each electrode pin specified by the above processing. Specifically, based on the parameters P _W , P _M , L _W , and L _M indicating the width and length of the electrode pins and lands, the inspection area for each electrode pin (S11, S21, S31, The width and length of S41) are specified, and these are set at the specified positions for each electrode pin. Further, these inspection areas are grouped in units of 3 or 4 to set inspection areas in units of groups (S1, S2, S3, S4 in FIG. 6 (3)). Further, an inspection area for bridge inspection, an inspection area for lands, and the like are set.
When specifying the inspection area in units of electrode pins, the width of the inspection area is set assuming that the width direction of the electrode pins and the land is aligned at the center position.

When the inspection areas corresponding to the reference sides are set by the above processing, those obtained by rotating these inspection areas by 180 degrees are set as the sides opposite to the reference sides (ST110). In this embodiment, as the inspection area rotation processing, the array of inspection areas in the image is rotated clockwise or counterclockwise. A process of rotating the shaft (a conversion process for turning each inspection region upside down) may be performed.
If the part to be processed is SOP, the next ST111 is “NO”, and the setting process of the inspection area is completed.

  On the other hand, when the component to be processed is QFP (ST111 is “YES”), one of the two sides orthogonal to the reference side of the component main body region is changed to the reference side (ST112). The number and position of the electrode pins on the reference side are identified (ST113), and the inspection area allocation processing is executed based on the identification result (ST114). Further, the inspection area set by this process rotated 180 degrees is set as the side opposite to the reference side (ST115). This completes the inspection area setting process.

  In ST113, ST114, and ST115, the same processes as ST108, ST109, and ST110 are executed, respectively. However, if the component body of the component to be processed is not square, the margins on two orthogonal sides may be different. In order to cope with this difference in margin, in ST114, after allocating inspection areas in units of electrode pins, each inspection area is set so that the center position of the array of these inspection areas is aligned with the center of the reference side. Make fine adjustments.

Further, when a plurality of pitches close in value are stored in the assumed pitch table shown in FIG. 9, these are approximated to the pitch measured from the image in the assumed pitch table, and which one is selected. It is considered that it may be difficult to determine whether the image is good. In this embodiment this respect, in ST 104, when two or more values in the assumed pitch table approximating the pitch measured from an image, all of these values are provisionally set as P _D. In addition ST 108, a P _D using specific results and that particular time identifying the number and location of electrode pins based on the temporary decision value of P _D, can place each electrode pins in the state closer to an equal interval adopt. Furthermore, when running ST113 After this, the pitch _{P D,} use the value of the person employed in ST 106.

In the examples shown in FIGS. 4 to 6, the width of each land is uniform. However, depending on the substrate, as shown in FIG. 10, the width L _W1 of the end land is the width of the other land. It may be larger than _LW2 . In such a case, in ST107, each width L _W1 and L _W2 is calculated individually, and these values are reflected in the setting of the inspection region.

  In this embodiment, it is required to include three or more electrode pins in the designated frame 32 because of variations in land width as in the above example, and extraction accuracy when extracting electrode pins and lands from an image. Is to consider. However, as long as the accuracy of extraction can be guaranteed, the effective range of the designation frame 32 may be allowed up to a range including only the extreme end and the adjacent two electrode pins and lands corresponding thereto.

  As described above, in this embodiment, for SOP and QFP, among the electrode pins arranged along one side of the component body using the regular arrangement of each electrode pin and each land and the line symmetrical shape of the component Three electrode pins and lands corresponding thereto are extracted from the image in order from the end, and the regularity in the extracted part is applied to the entire part, thereby setting inspection regions for all the electrode pins and lands. Therefore, the burden on the image processing for extracting the electrode pins and lands can be reduced, and the processing time required for setting the inspection area can be shortened. Further, if the user correctly sets the component main body region 30 and the specification frame 32, parameters indicating the arrangement rules of electrode pins and lands can be obtained with sufficient accuracy based on these specifications. Accuracy can be ensured.

  In this embodiment, if the land or electrode pin images in the range corresponding to the designated frame 32 are not suitable for extraction, the position of the designated frame 32 can be changed using the change button 111. Therefore, the user can select the most suitable place for extraction of lands and electrode pins and perform the designation by the designation frame 32, so that the accuracy of the inspection area can be ensured.

  However, depending on the configuration of the parts and the state of the image, it may be difficult to ensure the accuracy of extracting lands and electrode pins from the image. Therefore, in this embodiment, a manual setting mode that allows the user to specify a range corresponding to a land or an electrode pin can be executed without using image processing.

  FIG. 11 shows an example of a work screen when manual setting is selected. The screen of this example is at a stage where the specification of the component main body area 30 is completed, and the image display area 100 has a designation frame 33 smaller than the example of FIG. 11 at a position near the lower left corner of the processing target component. Is displayed. Further, in the guidance area 102, in addition to the buttons 106 and 110 similar to those in the example of FIG. 5, switching buttons 112, 113 and 114, a reset button 115 for switching the target of designation and setting, up, down, left and right directions The movement button 116 is provided.

FIG. 12 shows a change in display in the image display area 100 according to the user's designation operation limited to a part of the processing target component 201 (part corresponding to the designation frame 33).
In this embodiment, two electrode pins arranged in a row are designated in order from the end, and lands corresponding to these electrode pins are designated.

  The specific work flow will be described with reference to FIG. 11 and FIG. 12. First, the designated frame 33 is called by operating the “1 pin” button 112 in the guidance area 102. Adjustment is made so as to match the leftmost electrode pin (FIG. 12 (1)). Next, when the “1 land” button 113 is operated, a designation frame 34 for land designation is displayed slightly outside the designation frame 33 with a color different from that of the designation frame 33 (FIG. 12 (2)). ). The user adjusts the tip of the designated frame 34 so that it matches the tip of the left land (FIG. 12 (3)).

  Next, when the user operates the “2-pin land” button 114 in the guidance area 102, the designated frames 33 and 34 are copied and displayed on the right hand side of the current display position (FIG. 12 (4)). The user aligns the copied designation frames 33 and 34 with the second electrode pin and land from the left by dragging and dropping the mouse or operating the arrow key 116 (FIG. 12 (5)). As shown in FIG. 10, when the land at the end is wide, it is necessary to adjust the positional relationship between the designated frame 34 and the designated frames 33 and 34 with respect to the second land.

  As described above, it is possible to designate the nearest electrode pin at one corner of the component main body region 30 and the adjacent electrode pin and the land corresponding thereto. Thereafter, when the extraction button 110 is operated, the inspection data creation system regards the designated frames 33 and 34 as electrode pins and lands, respectively, and performs the same processing as ST103 and subsequent steps in FIG. 8 (except ST106). ). This makes it possible to set the inspection area without performing image processing for extracting electrode pins and lands.

  Therefore, even if there is a problem in the extraction accuracy of the electrode pins and lands from the image and the setting of the inspection area is not successful, if the user visually checks the electrode pins and lands and specifies these correctly, The inspection area can be set with high accuracy. Further, the user can specify only two electrode pins and two lands, so that the setting work of the inspection region can be completed in a short time without imposing a heavy burden.

  In the first embodiment, the designation frame 32 is required to be designated so as to include electrode pins and lands. However, the present invention is not limited to this, and a portion that needs to be completely included in the designation frame 32 is not limited to this. You may limit only to a pin. Even in this case, for example, after extracting each electrode pin from the region corresponding to the designation frame 32 of the post-mounting reference image, the color of the land is set starting from the position corresponding to the tip of each electrode pin for the pre-mounting reference image. Since the land corresponding to each electrode pin can be extracted by searching for, the parameters shown in FIG. 7 can be obtained without hindrance.

  In each of the embodiments, a part such as SOP, QFP, or the like that has a line-symmetric relationship with the arrangement of electrode pins between two opposing sides is set as an object of setting. With regard to the above, by setting the designation frame 32 (or 33, 34) on the side where a plurality of electrode pins are arranged, it is possible to create inspection area setting data in the same manner as in the above embodiment.

  In the above-described embodiment, the inspection area setting data is created in the process of creating the library data for the sub part type corresponding to the part type. A similar process can be applied to the case where the inspection region setting data is specified for each individual part using the post-mounting reference image.

  Further, the image to be processed is not limited to the two-dimensional image as in the above embodiment, but a three-dimensional image obtained by combining the two-dimensional image with the height data of each part, or three-dimensional information restored from the X-ray CT image. In the case of performing the inspection for the target, it is possible to specify the setting data of the inspection area by the same method as described above.

DESCRIPTION OF SYMBOLS 1 Inspection apparatus 2 Camera 7 Personal computer 17 Monitor 30 Parts corresponding | compatible area 32, 33, 34 Specification frame 100 Image display area 102 Guidance area 110 Extraction button 201 Parts S1, S2, S3, S4, S11, S21, S31, S41 Inspection area

Claims (6)

The inspection area used for inspecting the mounting state of the component on the board by using an image showing the state of the surface observed from the front, which can distinguish the electrode of the component on the board after mounting the component and other parts In the method of creating the setting data of
A first step of displaying a reference image representing a mounting state of the target component on a monitor, with a component in which a plurality of electrode pins are regularly arranged along the edge of the component main body being set;
On the display screen of the reference image, an operation for designating a first area corresponding to the component main body of the target part, and a direction along the reference side and a reference side from the one side of the first area as a reference. A second step of accepting an operation of designating a second region by designating a range in a direction toward the outside of the region of 1,
A third step of extracting electrode pins from a reference image in a range corresponding to the second region in response to the first and second regions being designated;
When a plurality of electrode pins are extracted along the reference side by the processing in the third step, the electrode pins are arranged based on the relationship between the extracted electrode pins and the relationship between the electrode pins and the first region. The fourth step of identifying the rules,
Applying the rule specified in the fourth step to at least the reference side of each side of the first region, an inspection region for inspecting an electrode pin is provided outside the first region. A fifth step of setting a plurality along the side to which the rule is applied;
In accordance with the execution of the fifth step, the reference image displayed on the monitor is updated to one representing the state where the inspection area is set, and the confirmation operation has been performed on the updated display. In response, a sixth step of determining setting data used for setting the inspection area is executed. A method for creating inspection area setting data for substrate inspection. The method of claim 1, wherein
In the fourth step, as the rules regarding the arrangement of the electrode pins, the width and length of the electrode pins and the pitch, and the distance from one corner of the first region to the nearest electrode pin are specified, respectively. Method for creating inspection area setting data for board inspection. The method of claim 1, wherein
A reference image of the substrate before component mounting and a reference image of the substrate after component mounting are prepared, and the latter reference image is displayed in the first step. In the third step, designation by the second designation operation is performed Applied to the reference image, the electrode pins are extracted from the reference image of the substrate after component mounting in the range corresponding to the second region, and from the reference image of the substrate before component mounting in the range corresponding to the second region. Extract the land,
In the fourth step, as a rule relating to the arrangement of the electrode pins, the width, length and pitch of the electrode pins, and the distance between the corner of the first region and the nearest electrode pin, and the corresponding electrodes Identify the positional relationship between pins and lands,
Method for creating inspection area setting data for board inspection. In the method as described in any one of Claims 1-3,
A plurality of electrode pins are arranged on the two opposing sides of the rectangular component body, and a part in which a line symmetric relationship is established between the electrode pin arrangements on these sides is set as a setting target.
Applying a rule specified in the fourth step to the reference side in the fifth step, and setting a plurality of inspection regions at positions along the reference side outside the first region; And a step of setting the inspection region rotated 180 degrees to a position along the side opposite to the reference side outside the first region. Method. In the method as described in any one of Claims 1-3,
A plurality of electrode pins are arranged on each side of the rectangular component body, and a part in which a line-symmetrical relationship is established between the arrangement of electrode pins on two opposite sides is set as an object of setting.
In the fifth step, the rule specified in the fourth step is applied to one of the reference side and two sides orthogonal to the reference side, respectively, and the outside of the first region A step of setting a plurality of inspection areas at positions along the target side and a position obtained by rotating these inspection areas by 180 degrees to a position along the side facing the target side outside the first area. A method for creating inspection area setting data for board inspection. It is possible to distinguish between the electrode of the component on the board after mounting the component and other parts, and using the image showing the state of observing the surface from the front, information necessary for inspection of the mounting state of the component on the substrate A system to create,
Reference image display means for displaying a reference image representing a mounting state of the target component on a monitor, with a component in which a plurality of electrode pins are regularly arranged along the edge of the component main body being set.
On the display screen of the reference image, an operation for designating a first area corresponding to the component main body of the target part, and a direction along the reference side and a reference side from the one side of the first area as a reference. An area designation accepting unit for accepting an operation for designating a second area by a range designation in a direction toward the outside of the one area;
An extraction processing means for extracting an electrode pin from a reference image in a range corresponding to the second area in response to the designation of the first area and the second area being received by the area designation receiving means;
When a plurality of electrode pins are extracted along the reference side by the extraction processing means, rules regarding the arrangement of electrode pins based on the relationship between the extracted electrode pins and the relationship between the electrode pins and the first region are set. An arrangement rule identification means to identify,
Applying the rule specified by the arrangement rule specifying means to at least the reference side of each side of the first region, an inspection region for inspecting the electrode pin is provided outside the first region. Area setting means for setting a plurality along the side to which the rule is applied,
In response to setting of the inspection area by the area setting means, the reference image displayed on the monitor is updated to the one representing the state where the inspection area is set, and the confirmation operation is performed on the updated display. Area determining means for determining setting data used for setting the inspection area in response to
An inspection data creation system for inspecting a substrate, comprising:

Images