JP2011091250A - Capacitor and power conversion apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a capacitor that can prevent local temperature rise in capacitor elements and hence is able to increase the permissible amount of current that flows in the capacitor elements as a whole. <P>SOLUTION: A plurality of capacitor elements 3 are stored in a storage case 2. The capacitor elements 3 each have a pair of electrode faces 30 in end portions, on the opening 20 side and the bottom face 21 side of the storage case 2, respectively. An opening-side bus bar 4a is disposed on the electrode faces 30 on the opening 20 side of the capacitor elements 3, and a bottom face-side bus bar 4b is disposed on the electrode faces 30 on the bottom face 21 side of the capacitor elements 3. The plurality of capacitor elements 3 are connected in parallel by the opening-side bus bar 4a and the bottom face-side bus bar 4b. The opening-side bus bar 4a and the bottom face-side bus bar 4b have connection terminals 5a, 5b for connecting to external apparatuses, respectively, that are disposed in such a manner as not to be located in the vicinity of the capacitor elements 3. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a capacitor having a pair of bus bars and a power conversion device using the capacitor.

  Conventionally, a capacitor used in a power converter or the like is known (see Patent Document 1 below). 14 and 15 are an exploded perspective view and a cross-sectional view of a conventional capacitor 90. FIG. As shown in the figure, the capacitor 90 includes a plurality of capacitor elements 91 having electrode surfaces 96 at both ends, and a pair of bus bars 93 and 94 are connected to the electrode surfaces 96 at both ends to thereby connect a plurality of capacitors 91. Are connected in parallel. The capacitor element 91 and the bus bars 93 and 94 are stored in a storage case 92 and sealed with a resin 95 as shown in FIG.

  The bus bars 93 and 94 include connection terminals 93a and 94a for connecting to external devices. These connection terminals 93 a and 94 a are erected from the bus bars 93 and 94 toward the opening 97 of the storage case 92 and protrude from the surface of the resin 95.

  When the capacitor 90 is used, a current flows between the connection terminals 93a and 94a, and the capacitor element 91 generates heat. If the temperature rises due to heat generation and exceeds the allowable value, the capacitor element 91 may be damaged. Therefore, it is necessary to limit the amount of current so that the temperature of the capacitor element 91 does not exceed the allowable value.

JP 2008-130640 A

  However, the conventional capacitor 90 has a problem that the temperature of the capacitor element 91a adjacent to the connection terminal 94a among the plurality of capacitor elements 91 is particularly likely to rise. For this reason, the temperature of the capacitor element 91a quickly reached the allowable value, and the other capacitor elements could not pass any more current even though they were relatively low in temperature.

There are three main reasons why the temperature of the capacitor element 91a adjacent to the connection terminal 94a is particularly likely to rise.
The first reason is that the impedance of the capacitor element 91a tends to be smaller than that of other capacitor elements, and a large current flows through the capacitor element 91a and heat is easily generated. That is, as shown in FIG. 15, the direction of the current i1 flowing through the capacitor element 91a is opposite to the direction of the current i2 flowing through the connection terminal 94a. Therefore, when the capacitor element 91a and the connection terminal 94a, which are the current paths in the opposite direction, are close to each other, the inductance L therebetween is reduced. As a result, the impedance Z of the capacitor element 91 also tends to decrease.

  The second reason is that since the connection terminal 94a and the capacitor element 91a are close to each other, the resistance heat generated from the connection terminal 94a is easily transmitted to the capacitor element 91a.

The third reason is that when a high frequency current flows through the connection terminal 94a, an eddy current is generated in the capacitor element 91a, heat is generated by induction heating, and the temperature rises.
In particular, when the capacitor 90 is used in a power conversion device, other capacitors may be connected in parallel. A resonance phenomenon occurs due to these capacitors, and a high-frequency current easily flows through the connection terminal 94a.

  As described above, in the conventional capacitor 90, the temperature of the capacitor element 91a quickly reaches an allowable value, and even though the other capacitor elements are relatively low in temperature, no more current can flow. Therefore, there has been a demand for a capacitor that can prevent a local temperature rise of the capacitor element and, in turn, increase the allowable amount of current flowing through the entire capacitor element, and a power conversion device using the capacitor.

  The present invention has been made in view of such conventional problems, and it is possible to prevent a local temperature rise of the capacitor element, and thus to increase the allowable amount of current flowing through the entire capacitor element, and the capacitor. The power converter used is to be provided.

A first invention includes a storage case having an opening,
A plurality of capacitor elements housed in the housing case and having a pair of electrode surfaces at the opening side and bottom side of the housing case;
An opening-side bus bar disposed on the electrode surface on the opening side of the capacitor element;
A bottom-side bus bar disposed on the electrode surface on the bottom side of the capacitor element;
The plurality of capacitor elements are connected in parallel by the opening-side bus bar and the bottom-side bus bar,
The opening-side bus bar and the bottom-side bus bar each have a connection terminal for connecting to an external device, arranged in a state not close to the side surface of the capacitor element.

  A second invention includes the capacitor, a semiconductor module incorporating a switching element constituting a power conversion circuit, and a snubber capacitor for absorbing a surge voltage of the semiconductor module, wherein the capacitor and the snubber capacitor are The power converter is connected in parallel (Claim 6).

The function and effect of the first invention will be described. The capacitor of the present invention includes a plurality of capacitor elements stored in a storage case, and an opening-side bus bar and a bottom-side bus bar that connect the plurality of capacitor elements in parallel. Each of the opening-side bus bar and the bottom-side bus bar includes a connection terminal for connecting to an external device, which is disposed in a state not close to the side surface of the capacitor element.
In this way, local temperature rise of the capacitor element can be prevented.
That is, in the present invention, since the connection terminal is disposed in a state not close to the side surface of the capacitor element, the capacitor element is hardly affected by the current flowing through the connection terminal. As a result, as in the prior art (see FIG. 15), the inductance and impedance of the capacitor element 91a are affected by the current i2 flowing through the connection terminal 94a, and a large current flows only through the capacitor element 91a to generate heat. Can be prevented.

  In the present invention, since the connection terminal is not close to the capacitor element, it is difficult for the capacitor element to receive resistance heat generated from the connection terminal.

  Furthermore, in the present invention, since the connection terminal is not close to the capacitor element, even when a high-frequency current flows through the connection terminal, the capacitor element is not easily affected by the magnetic field generated by the high-frequency current. Therefore, eddy currents are less likely to be generated in the capacitor element, and a problem that the capacitor element generates heat due to induction heating can be prevented.

  As described above, according to the present invention, the local temperature rise of the capacitor elements can be prevented, and the temperatures of the plurality of capacitor elements can be made uniform. Thereby, the allowable amount of current flowing through the entire capacitor can be increased.

  Next, the function and effect of the second invention will be described. The power conversion device of the present invention includes the semiconductor module, the capacitor according to the first invention, and the snubber capacitor, and the capacitor and the snubber capacitor are connected in parallel.

When the capacitor and the snubber capacitor are connected in parallel, a resonance phenomenon occurs, and a high-frequency current tends to flow through the connection terminal of the capacitor. Therefore, if the capacitor 90 in which the connection terminal 94a is disposed close to the capacitor element 91a is used as in the conventional case (see FIG. 15), the capacitor element 91a is likely to generate heat by induction heating.
However, if a capacitor whose connection terminal is not disposed close to the side surface of the capacitor element as in the present invention is used, an eddy current is hardly generated in the capacitor element even when a high-frequency current flows. For this reason, it is easy to prevent the capacitor element adjacent to the connection terminal from generating heat due to induction heating. Thereby, the temperature of a some capacitor | condenser element can be equalized, and the allowable amount of the electric current which flows into the whole capacitor | condenser element can be increased.

  Further, in the present invention, a capacitor is used in which the connection terminal is disposed in a state where the connection terminal is not close to the capacitor element. Therefore, the capacitor element is not easily affected by the current flowing through the connection terminal. As a result, as in the prior art (see FIG. 15), the inductance and impedance of the capacitor element 91a are reduced by the influence of the current i2 flowing through the connection terminal 94a, and a large current flows only to the capacitor element 91a and heat is generated. Can be prevented.

  In the present invention, a capacitor whose connection terminal is not close to the capacitor element is used. Therefore, it becomes difficult for the capacitor element to receive resistance heat generated from the connection terminal.

  As described above, according to the present invention, a capacitor capable of preventing a local temperature rise of the capacitor element and thus increasing the allowable amount of current flowing through the entire capacitor element, and a power converter using the capacitor are provided. can do.

FIG. 4 is a cross-sectional view of the capacitor according to the first embodiment, which is a cross-sectional view taken along the line BB in FIG. 3. FIG. 4 is a cross-sectional view of the capacitor according to the first embodiment, which is a cross-sectional view taken along the line CC in FIG. 3. AA sectional drawing of FIG. FIG. 3 is a perspective view of a capacitor in the first embodiment. The circuit diagram of the power converter device in Example 1. FIG. FIG. 9 is a cross-sectional view of the capacitor according to the second embodiment, which is a cross-sectional view taken along the line E-E in FIG. 7. FIG. 7 is a cross-sectional view of the capacitor according to the second embodiment, which is a cross-sectional view taken along the line DD of FIG. 6. The perspective view of the capacitor | condenser in Example 2. FIG. FIG. 10 is a cross-sectional view of the capacitor according to the third embodiment, and is a GG cross-sectional view of FIG. 10. FIG. 10 is a cross-sectional view of the capacitor in Example 3, which is a cross-sectional view taken along the line FF in FIG. 9. HH sectional drawing of FIG. FIG. 14 is a cross-sectional view of the capacitor in Example 4, which is a cross-sectional view taken along line JJ in FIG. 13. FIG. 13 is a cross-sectional view of the capacitor in Example 4, which is a cross-sectional view taken along the line II in FIG. 12. The exploded perspective view of the capacitor in the conventional example. Sectional drawing of the capacitor | condenser in a prior art example.

A preferred embodiment of the present invention described above will be described.
In the first invention, it is preferable that the connection terminal of the bottom-side bus bar extends to the side of the bottom-side bus bar and protrudes from the side wall of the storage case.
In this way, the direction of the current flowing through the connection terminal and the direction of the current flowing through the capacitor element are orthogonal. Therefore, the capacitor element is not easily affected by the current flowing through the connection terminal. As a result, the impedance of the capacitor element adjacent to the connection terminal is reduced, and it becomes easy to prevent a problem that a large current flows to generate heat or an eddy current is generated in the capacitor element to generate heat. Further, even if resistance heat is generated from the connection terminal, the temperature of the capacitor element is hardly increased.

The storage case has a quadrangular cross section parallel to the bottom surface, the connection terminal of the bottom side bus bar is a flat plate shape, and stands on the opening side at the corner of the storage case. It is preferable that the width direction of the connection terminal is inclined with respect to the side wall of the storage case.
If it does in this way, the space between the corner of a storage case can be used effectively and the distance between a connecting terminal and a capacitor element adjacent to this connecting terminal can be lengthened. Therefore, the capacitor element is not easily affected by the current flowing through the connection terminal, and a local temperature rise of the capacitor element can be prevented. Moreover, it becomes difficult for the capacitor element to receive resistance heat generated from the connection terminal.
Further, since the space at the corner of the storage case can be used effectively, the capacitor can be made compact.

Further, the connection terminals of the opening-side bus bar and the bottom-side bus bar are respectively erected on the opening side, and the connection terminal of the bottom-side bus bar is more than the connection terminal of the opening-side bus bar. It is preferable to stand upright at a position away from the side surface of the capacitor element.
In this case, since the connection terminal of the bottom side bus bar is erected at a position farther from the capacitor element than the connection terminal of the opening side bus bar, the influence of the current flowing through the connection terminal of the bottom side bus bar, The capacitor element adjacent to the connection terminal is not easily affected by the resistance heat generated from the connection terminal. Thereby, the local temperature rise of a capacitor | condenser element can be prevented.

Moreover, it is preferable that the connection terminal of the bottom surface side bus bar has a through hole on a surface facing the side surface of the capacitor element.
If it does in this way, it will become easy to acquire the effect of the present invention especially. That is, according to the above configuration, even if a current is passed through the connection terminal of the bottom side bus bar, the current does not flow through the portion where the through hole is formed. Can be small. Thereby, the fall of the impedance of a capacitor | condenser element and generation | occurrence | production of an eddy current can be prevented. In addition, since resistance heat is not generated in the portion where the through hole is formed, the temperature of the capacitor element adjacent to the connection terminal is hardly increased by resistance heat.
Moreover, according to the said structure, even if the connection terminal of a bottom face side bus bar exists comparatively near the capacitor | condenser element, the effect of invention can be acquired. Therefore, the capacitor can be made compact.

Example 1
A capacitor and a power converter according to an embodiment of the present invention will be described with reference to FIGS.
The capacitor 1 of this example includes a storage case 2 having an opening 20 as shown in FIGS. A plurality of capacitor elements 3 are stored in the storage case 2. The capacitor element 3 has a pair of electrode surfaces 30 at the ends of the storage case 2 on the opening 20 side and the bottom surface 21 side.
An opening-side bus bar 4 a is arranged on the electrode surface 30 on the opening 20 side of the capacitor element 3. Furthermore, the bottom surface side bus bar 4 b is arranged on the electrode surface 30 on the bottom surface 21 side of the capacitor element 3. A plurality of capacitor elements 3 are connected in parallel by the opening-side bus bar 4a and the bottom-side bus bar 4b.
The opening-side bus bar 4a and the bottom-side bus bar 4b have connection terminals 5a and 5b for connecting external devices, which are arranged in a state not close to the side surface of the capacitor element 3, respectively.
The details will be described below.

The capacitor 1 of this example uses a film capacitor formed by winding a metallized film as the capacitor element 3. A pair of electrode surfaces 30 are formed at both ends in the winding axis direction. The plurality of capacitor elements 3 are arranged in the storage case 2 with the winding axis direction being the vertical direction (a direction perpendicular to the bottom surface 21). The capacitor element 3 is embedded in the resin 6 in the storage case 2. The opening-side bus bar 4a and the bottom-side bus bar 4b are also embedded in the resin 6 except for the connection terminals 5a and 5b. The capacitor element 3 has a substantially elliptic cylinder shape.
Moreover, the copper plate is used as the opening side bus bar 4a and the bottom face side bus bar 4b. As will be described later, the capacitor 1 is used in a power conversion device 10 for a vehicle.

As shown in FIGS. 1 to 4, the connection terminal 5 b of the bottom-side bus bar 4 b is configured to extend to the side of the bottom-side bus bar 4 b and protrude from the side wall of the storage case 2.
Further, as shown in FIG. 3, the connection terminal 5 a of the opening-side bus bar 4 a is erected toward the opening 20 side of the storage case 2 and protrudes from the surface of the resin 6.

  Next, a circuit diagram of the power conversion device 10 of this example is shown in FIG. As shown in the figure, the power conversion device 10 of this example includes a capacitor 1 as described above, a semiconductor module 11 including a switching element 11a constituting a power conversion circuit, and a surge voltage for absorbing the surge voltage of the semiconductor module 11. A snubber capacitor 12 is provided, and the capacitor 1 and the snubber capacitor 12 are connected in parallel.

  The power conversion device 10 of this example is mounted on a vehicle such as a hybrid car or an electric vehicle. As shown in FIG. 5, the power converter 10 includes a booster 10a and an inverter 10b. The boosting unit 10a boosts the voltage of the DC power supply 14, and the inverter unit 10b converts the boosted DC power into AC power. Then, the AC power is used to drive the three-phase AC motor 15 to drive the vehicle. The capacitor 1 is used as a smoothing capacitor 1a for smoothing the voltage boosted by the boosting unit 10a.

  The inverter unit 10 b includes a plurality of the semiconductor modules 11 and a snubber capacitor 12. The semiconductor module 11 includes an IGBT element 11a as a switching element and a flywheel diode 11b. By switching the IGBT element 11a, direct current power is converted into alternating current.

  When the IGBT element 11a performs a switching operation, a surge voltage is generated between the terminals of the IGBT element 11a. When this surge voltage increases, the IGBT element 11a may be destroyed. Therefore, the snubber capacitor 12 for absorbing the surge voltage and protecting the IGBT element 11a is provided.

  Note that a boosting capacitor 16 is provided in the boosting unit 10a. The capacitor element that constitutes the boosting capacitor 16 and the capacitor element that constitutes the smoothing capacitor 1a described above may be accommodated in one storage case 2.

The effect of this example will be described. As shown in FIGS. 1 to 4, the capacitor 1 of this example includes a plurality of capacitor elements 3 housed in a housing case 2, an opening-side bus bar 4 a and a bottom-side bus bar that connect the plurality of capacitor elements 3 in parallel. 4b. The opening-side bus bar 4 a and the bottom-side bus bar 4 b include connection terminals 5 a and 5 b for connecting to external devices, which are arranged in a state not close to the side surface of the capacitor element 3.
If it does in this way, the local temperature rise of the capacitor | condenser element 3 can be prevented.
That is, in the capacitor 1 of this example, since the connection terminals 5a and 5b are arranged in a state not close to the capacitor element 3, the capacitor element 3 is not easily affected by the current flowing through the connection terminals 5a and 5b.

  In the capacitor 1 of this example, as shown in FIG. 4, the capacitor element 3a is not close to the connection terminal 5b of the bottom side bus bar 4b. Therefore, the capacitor element 3a is less likely to be affected by the current I2 flowing through the connection terminal 5b, and the inductance and impedance of the capacitor element 3a are less likely to decrease. Therefore, a problem that a large current flows only in the capacitor element 3a and the capacitor element 3a generates heat can be prevented.

  Further, in the capacitor 1 of this example, since the connection terminal 5b is not close to the capacitor element 3a, it is difficult for the capacitor element 3a to receive resistance heat generated from the connection terminal 5b.

  Furthermore, in the capacitor 1 of this example, since the connection terminal 5b is not close to the capacitor element 3a, even when a high frequency current flows through the connection terminal 5b, the capacitor element 3a is not easily affected by the magnetic field generated by the high frequency current. Become. Therefore, eddy currents are less likely to occur in the capacitor element 3a, and a problem that the capacitor element 3a generates heat due to induction heating can be prevented.

  In particular, as shown in FIG. 4, the capacitor 1 of this example is configured such that the connection terminal 5 b of the bottom side bus bar 4 b extends to the side of the bottom side bus bar 4 b and projects from the side wall of the storage case 2. Therefore, the direction of the current I2 flowing through the connection terminal 5b is orthogonal to the direction of the current I1 flowing through the capacitor element 3a. Therefore, it is difficult for the capacitor element 3a to be affected by the current I2 flowing through the connection terminal 5b.

  Thus, the capacitor 1 of this example can prevent the local temperature rise of the capacitor element 3 and can equalize the temperature of the plurality of capacitor elements 3. Thereby, the allowable amount of current flowing through the entire capacitor 1 can be increased.

Moreover, the power converter device 10 of this example is provided with the semiconductor module 11, the capacitor | condenser 1, and the snubber capacitor 12 as shown in FIG. 5, and the capacitor | condenser 1 and the snubber capacitor 12 are connected in parallel.
When the capacitor 1 and the snubber capacitor 12 are connected in parallel, a resonance phenomenon occurs and a high-frequency current tends to flow through the connection terminal 5 of the capacitor 1. Therefore, if the capacitor 90 in which the connection terminal 94a is disposed close to the capacitor element 91a as in the conventional case (see FIG. 15) is used, the adjacent capacitor element 91a is likely to generate heat due to induction heating.
However, if the capacitor 1 in which the connection terminal 5b is not disposed close to the capacitor element 3a is used as in the power conversion device 10 of the present example, eddy current is hardly generated in the capacitor element 3a even if a high-frequency current flows. Become. Therefore, it becomes easy to prevent a problem that the capacitor element 3a adjacent to the connection terminal 5b (see FIG. 4) generates heat due to induction heating. Thereby, the temperature of the several capacitor | condenser element 3 can be equalized, and the allowable amount of the electric current which flows into the whole capacitor | condenser element 3 can be increased.

  As described above, according to this example, the local temperature rise of the capacitor element 3 can be prevented, and the allowable amount of current flowing through the capacitor element 3 as a whole can be increased, and the power using the capacitor 1 can be increased. A conversion device 10 can be provided.

(Example 2)
In this example, the shape of the connection terminal 5b of the bottom side bus bar 4b is changed. As shown in FIGS. 6 to 8, in the capacitor 1 of this example, the storage case 2 has a quadrangular cross section parallel to the bottom surface 21, and the connection terminals 5b of the bottom side bus bar 4b have a flat plate shape. 2 is erected on the opening 20 side, and the width direction of the connection terminal 5 b is inclined with respect to the side wall of the storage case 2.
In addition, the configuration is the same as that of the first embodiment.

The effect of this example will be described.
With the above configuration, the space at the corner of the storage case 2 can be effectively used to increase the average distance between the connection terminal 5b and the capacitor element 3a. Therefore, the capacitor element 3a is not easily affected by the current flowing through the connection terminal 5b, and a local temperature rise of the capacitor element 3a can be prevented. Further, it becomes difficult for the capacitor element 3a to receive the resistance heat generated from the connection terminal 5b.
Further, since the corner space of the storage case 2 can be effectively used, the capacitor 1 can be made compact.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, the shape of the connection terminal 5b of the bottom side bus bar 4b is changed. As shown in FIGS. 9 to 11, in the capacitor 1 of this example, the connection terminals 5a and 5b of the opening-side bus bar 4a and the bottom-side bus bar 4b are respectively erected on the opening side, and the connection terminals of the bottom-side bus bar 4b 5b is erected at a position farther from the side surface of the capacitor element 3 than the connection terminal 5a of the opening-side bus bar 4a.
In this example, the connection terminal 5b is sufficiently separated from the side surface of the capacitor element 3a so that the temperature does not rise above the heat-resistant temperature of the capacitor element 3. For example, the distance between the capacitor element 3a and the connection terminal 5b is preferably 10 mm or more.
In addition, the configuration is the same as that of the first embodiment.

The effect of this example will be described. With the above configuration, the connection terminal 5b of the bottom side bus bar 4b is erected at a position farther from the side surface of the capacitor element 3 than the connection terminal 5a of the opening side bus bar 4a. Capacitor element 3a is less susceptible to the influence of the current flowing in 5b and the influence of resistance heat generated from connection terminal 5b. Thereby, the local temperature rise of the capacitor | condenser element 3 can be prevented.
In addition, the same effects as those of the first embodiment are obtained.

Example 4
In this example, the shape of the connection terminal 5b of the bottom side bus bar 4b is changed. As shown in FIGS. 12 and 13, in the capacitor 1 of this example, the connection terminal 5b of the bottom-side bus bar 4b has a through hole 50 on the surface facing the side surface of the capacitor element 3a. The area of the through hole 50 is determined so that the temperature of the connection terminal 5b raised by the resistance heat does not exceed the heat resistance temperature of the capacitor element 3a.
In addition, the configuration is the same as that of the first embodiment.

The effect of this example will be described. With the above configuration, even if a current flows through the connection terminal 5b of the bottom side bus bar 4b, no current flows through the portion where the through hole 50 is formed, so the current applied to the capacitor element 3a adjacent to the connection terminal 5b The influence can be reduced. Thereby, the fall of the impedance of the capacitor | condenser element 3a and generation | occurrence | production of an eddy current can be prevented. Moreover, since resistance heat does not generate | occur | produce in the part in which the through-hole 50 is formed, the temperature of the capacitor | condenser element 3a becomes difficult to raise by resistance heat.
Moreover, according to the said structure, even if the connection terminal 5b of the bottom face side bus-bar 4b exists comparatively near the capacitor | condenser element 3a, the effect of invention can be acquired. Therefore, the capacitor can be made compact.
In addition, the same effects as those of the first embodiment are obtained.

DESCRIPTION OF SYMBOLS 1 Capacitor 10 Power converter 2 Storage case 3 Capacitor element 4a Opening side bus bar 4b Bottom side bus bar 5a (Open side bus bar) connection terminal 5b (Bottom side bus bar) connection terminal

Claims (6)

A storage case having an opening;
A plurality of capacitor elements housed in the housing case and having a pair of electrode surfaces at the opening side and bottom side of the housing case;
An opening-side bus bar disposed on the electrode surface on the opening side of the capacitor element;
A bottom-side bus bar disposed on the electrode surface on the bottom side of the capacitor element;
The plurality of capacitor elements are connected in parallel by the opening-side bus bar and the bottom-side bus bar,
The capacitor, wherein the opening-side bus bar and the bottom-side bus bar each have a connection terminal for connecting to an external device, disposed in a state not close to the side surface of the capacitor element.   2. The capacitor according to claim 1, wherein the connection terminal of the bottom side bus bar extends to the side of the bottom side bus bar and protrudes from a side wall of the storage case.   2. The storage case according to claim 1, wherein the storage case has a quadrangular cross section parallel to the bottom surface, the connection terminal of the bottom bus bar is a flat plate, and is erected on the opening side at the corner of the storage case. And the width direction of this connection terminal inclines with respect to the side wall of the said storage case, The capacitor | condenser characterized by the above-mentioned.   In Claim 1, the said connection terminal of the said opening side bus bar and the said bottom face side bus bar is each standingly arranged in the said opening part side, and the said connection terminal of the said bottom face side bus bar is from the said connection terminal of the said opening side bus bar. And a capacitor standing upright from a side surface of the capacitor element.   5. The capacitor according to claim 1, wherein the connection terminal of the bottom-side bus bar has a through hole in a surface facing a side surface of the capacitor element. 6.   A capacitor according to any one of claims 1 to 5, a semiconductor module incorporating a switching element constituting a power conversion circuit, and a snubber capacitor for absorbing a surge voltage of the semiconductor module, The power conversion device, wherein the capacitor and the snubber capacitor are connected in parallel.

Images