JP2011091230A - Workpiece sticking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a workpiece sticking device capable of discharging particles to surfaces of workpieces for reforming, stacking two workpieces and sticking them on each other by pressing (or heating). <P>SOLUTION: A first workpiece W1 is placed on the inversion stage 31 of an inversion stage unit 30 and sucked and held, a second workpiece W2 is placed on the work stage 21 of a pressing stage unit 20, and the workpieces W1 and W2 are irradiated with UV light from, for example, a light irradiation unit 10 to reform surfaces thereof. Then the inversion stage unit 30 and pressing stage unit 20 are moved away from the light irradiation unit 10, the inversion stage 31 is turned over by 180° to put the workpieces W1 and W2 one over the other on the work stage 21, and the workpieces W1 and W2 are pressed (or heated) to be stuck together. The inversion stage 31 is turned over into the original state, and the stuck workpieces W1 and W2 (microchip) are taken out. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a workpiece (substrate) laminating apparatus, and more particularly to an apparatus for laminating workpieces (substrates) each having a fine channel formed in at least one of them.

In recent years, separation, synthesis, and extraction of trace amounts of reagents using a microreactor consisting of microchips, in which microscale analysis channels are formed on a small substrate made of, for example, silicon, silicone, glass, etc. Attention has been focused on methods for performing analysis and the like.
A reaction analysis system using such a microreactor is called a micro total analysis system (hereinafter referred to as “μTAS”). According to μTAS, the ratio of the surface area to the volume of the reagent is increased. It is possible to perform high-speed and high-accuracy reaction analysis, and to realize a compact and automated system.

In a microchip, a chip suitable for various applications can be configured by providing regions having various functions such as a reaction region in which a reagent is arranged in a flow path also called a microchannel. Typical applications of microchips include chemical analysis such as genetic analysis, clinical diagnosis, drug screening, analysis in the fields of chemistry, biochemistry, pharmacy, medicine, veterinary medicine, compound synthesis, and environmental measurement.
The above-described microchip typically has a structure in which a pair of substrates are bonded to face each other, and a fine channel (for example, a width of 10 to several hundreds μm, a depth of 10 to 10 μm) is provided on the surface of at least one of the substrates. About several hundred μm). Conventionally, a glass substrate is mainly used for a microchip because it can be easily manufactured and optically detected. Recently, development of a microchip using a resin substrate, which is light in weight but is less likely to be damaged than a glass substrate and inexpensive.

As a method for bonding microchips, a method using an adhesive or a method using heat fusion may be considered. However, both are not preferable for the following reasons.
When using an adhesive, the adhesive oozes out into the micro flow path and the flow path is blocked, a part of the micro flow path becomes narrow and the flow path becomes non-uniform, or the flow path wall surface is homogeneous. Problems such as the occurrence of disturbance of characteristics occur.
In addition, in the case of heat fusion, if fusion is performed at a temperature higher than the heat melting temperature, the flow path may be collapsed in the heating stage, or the flow path may not be maintained in a predetermined cross-sectional shape. It becomes difficult to increase the functionality of the microchip.
Therefore, in recent years, a method of attaching the substrates after irradiating the substrate surfaces with vacuum ultraviolet light to activate the substrate surfaces is common.

For example, in Patent Document 1, when a microchip substrate is bonded, a substrate made of silicone such as polydimethylsiloxane (PDMS) is irradiated with light from an excimer lamp having an emission line at a wavelength of 172 nm to the surface. There has been proposed a method in which a modification process (oxidation process) is performed, a substrate having a hydroxyl group on the surface (for example, a glass substrate) is brought into close contact with the surface to be modified of the silicone substrate, and the two substrates are bonded.
Patent Document 2 shows an example in which two resin substrates are used as a microchip substrate. That is, when the microchip substrate is bonded, for example, light from an excimer lamp having an emission line at a wavelength of 172 nm is applied to at least one substrate surface of two resin substrates made of cycloolefin polymer (COP) or the like. There have been proposed methods of irradiating and then laminating both substrates and heating them to a temperature below the composition deformation temperature, or joining them by applying pressure without heating. In addition, you may implement both a heating process and a pressurization process.

JP 2006-187730 A JP 2008-19348 A JP 2007-40751 A JP 2008-166548 A JP 2004-154898 A

As described above, when two microchip substrates each having a fine channel formed on at least one of them are bonded together, a modification capability such as irradiation with vacuum ultraviolet light is applied to the surface of at least one of the two substrates. It is effective to release the particles having a surface to modify the surface, and then laminate and bond the two together. After the lamination, the heat treatment for the laminated substrate as described above and the pressure treatment for the laminated substrate are performed.
As described above, both of the substrates may be resin substrates, or one may be a glass substrate and the other may be a resin substrate.
However, with respect to such two substrates (workpieces), a discharge process of particles having the ability to modify the work surface, a stacking process of the two works, a heating process and / or a pressurizing process of the two works There has not been proposed a bonding apparatus that can perform a series of bonding processes of a workpiece (microchip substrate) as described above and that the entire apparatus is configured in a compact manner.

For example, a bonding apparatus for a microchip substrate described in Patent Document 3 is a microchip substrate composed of a light-transmitting chip substrate and a light-absorbing chip substrate, and the light-transmitting chip substrate is disposed on the top. First, a microchip substrate on which both are laminated in advance is first placed in a pressurizing mechanism, and the microchip substrate is pressurized.
Thereafter, the microchip substrate is irradiated with flash light emitted from a flash lamp from the upper side of the microchip substrate (upper part of the light-transmitting chip substrate), and both chip substrates are bonded together by heat fusion.
That is, the thing of the patent document 3 is the board | substrate bonding apparatus using the heat sealing | fusion method, Comprising: The above-mentioned series of workpiece | work bonding processes (light irradiation->lamination-> pressurization and / or heating) are mentioned. It is not realized.

Further, the bonding apparatus described in Patent Document 4 bonds a support plate and a wafer together. First, an adhesive is applied to the upper surface of the support plate, and the support plate is inverted by an inversion mechanism so that the adhesive application surface of the support plate is on the lower surface side. And a support plate and a wafer are laminated | stacked via an adhesive agent, both are pressurized, and both are joined. That is, the thing of patent document 4 is a board | substrate bonding apparatus which uses the adhesive agent, Comprising: The above-mentioned series of workpiece | work bonding processes are not implement | achieved.
The bonding apparatus described in Patent Document 5 irradiates at least one of atmospheric pressure plasma and UV light (for example, wavelength 172 nm) onto a microchip and bonds them together. Specifically, the substrate conveyed by the conveyor is irradiated with at least one of atmospheric pressure plasma and UV light, the substrate is conveyed to the bonding apparatus by the handling robot, and then the substrate is bonded by the bonding apparatus. Is.
However, the specific configuration of the bonding apparatus is not disclosed in Patent Document 5, and the light irradiation / conveying apparatus using the conveyor and the bonding apparatus exist separately, so that the apparatus itself becomes large. ing.

  The present invention has been made in view of the circumstances as described above, and the problem is that, for two substrates (workpieces), a process for releasing particles having the ability to modify the workpiece surface, two workpieces Provided is a workpiece laminating apparatus capable of performing a series of workpiece laminating steps such as a laminating process, a heating process and / or a pressurizing process of two workpieces, and the entire apparatus being compact. There is.

In the present invention, in order to solve the above-described problem, a workpiece laminating apparatus for laminating first and second workpieces each having a fine channel formed at least on one side is configured as follows.
(1) A workpiece laminating apparatus, a stage that holds a first workpiece, and a discharge unit that discharges particles having a modifying ability for modifying the surface of the first workpiece held by the stage. The first workpiece and the second workpiece laminated so that one surface of the second workpiece contacts the modified surface of the first workpiece held on the stage at least in the vertical direction. The movement restricting mechanism for restricting and the pressurizing mechanism for pressurizing the first and second workpieces in the stacked state so as to pressurize their contact surfaces.
The first and second workpieces are, for example, microchip substrates, and the emission unit is, for example, a light source device that emits photons such as UV light, or an emission that emits plasma (oxygen plasma, inert gas plasma) particles. Unit etc.
Note that, in the above, by providing a gap setting mechanism for adjusting the gap (distance) between the surface of the first workpiece held on the stage and the discharge unit, this gap is optimized according to the discharge unit. Can be set to any value.
(2) The workpiece laminating apparatus includes a first stage for holding the first workpiece, a second stage for holding the second workpiece, the surface of the first workpiece and / or the second workpiece. At least one discharge unit that discharges particles having a modification ability for modifying the surface of the surface, and at least of the first and second workpieces held in the first and second stages. A workpiece laminating mechanism for laminating both workpieces so that the modified surface of one workpiece is in contact with the surface or modified surface of the other workpiece, and at least vertical movement of the laminated first and second workpieces is restricted. A movement restricting mechanism, a pressurizing mechanism that pressurizes the stacked first and second workpieces so that their contact surfaces are pressurized, and a first stage held by the first stage. The surface of the workpiece and / or It is composed of a surface of the second workpiece held by the second stage, the gap setting mechanism for adjusting independently the distance between the emission unit. (3) In the above (2), the discharge unit is composed of two units: a unit for the first workpiece held on the first stage and a unit for the second workpiece held on the second stage. .
(4) In the above (1), (2), and (3), a heating mechanism is provided in the stage or the first stage and / or the second stage.
(5) In the above (1), (2), and (3), between the stage and the discharge unit, or between the first stage and the discharge unit, and / or between the second stage and the discharge unit. In addition, a mask detachment mechanism is provided for limiting the modification process in a predetermined region of the workpiece surface.
(6) In the above (1), (2), and (3), a light emitting unit that emits photons having a wavelength of 200 nm or less is used as the emitting unit.
(7) In the above (1), (2), and (3), a plasma emission unit that emits plasma particles is used as the emission unit.
(8) In the above (1), (2), and (3), a mechanism for relatively moving the discharge unit and the stage or the discharge unit and the first stage and the second stage. Provide.
(9) In the above (1), (2), and (3), the pressurizing mechanism includes a mechanism that adjusts a contact pressure between the stacked first and second workpieces.

In the present invention, the following effects can be obtained.
(1) The work laminating apparatus includes a stage for holding the first work, a discharge unit for discharging particles having reforming ability, and one surface of the second work on the reforming surface of the first work. Since it is composed of a movement restricting mechanism that supports the second workpiece in a state of being stacked so as to be in contact with, and a pressure mechanism that pressurizes the first workpiece and the second workpiece, the ability to modify the workpiece surface A series of work bonding processes such as the discharge of particles having a pressure and the pressurization process of the stacked first and second works can be performed with one apparatus, and the entire apparatus can be configured compactly.
(2) The work laminating apparatus has first and second stages for holding the first and second works, and a reforming capability for modifying the surface of the first and / or second work. A discharge unit that discharges particles, a workpiece stacking mechanism that stacks the first and second workpieces so that the modified surfaces of the first and second workpieces are in contact with each other, a movement restricting mechanism that restricts vertical movement in this state, A pressurizing mechanism for pressurizing one workpiece and the second workpiece, and a gap setting mechanism for independently adjusting the surface of the first workpiece and / or the distance between the surface of the second workpiece and the discharge unit, respectively. Therefore, it is possible to carry out the discharge of particles having the ability to modify the surface of the first workpiece and the second workpiece, the lamination of the first and second workpieces, and the pressurizing step with a single device. The entire apparatus can be configured compactly.
Also, by providing a gap setting mechanism for independently adjusting the distance between the surface of the first work and / or the surface of the second work and the discharge unit, the discharge unit and the first and second work The respective gaps (distances) to the irradiation surface can be adjusted to the optimum gaps for modifying the workpiece surface, and effective modification is possible.
In addition, since the gap can be set to an optimum value according to the discharge unit, the atmosphere of the reforming process does not need to be a special atmosphere such as a vacuum atmosphere, and the apparatus is configured compactly. Can do.
For example, when irradiating UV light having a wavelength of 172 nm from the emission unit, the distance between the lower side of the UV lamp and the irradiation surface of both workpieces is set to 1 to 5 mm, for example, so that the UV light irradiation atmosphere is changed to a vacuum atmosphere. Therefore, the surface of the workpiece can be modified even if the irradiation atmosphere is in the air, and the UV light irradiation atmosphere does not need to be a vacuum atmosphere in which UV light having a wavelength of 172 nm is not attenuated. For this reason, the whole apparatus can be comprised more compactly.
(3) The discharge unit is composed of two units: a unit for the first workpiece held on the first stage and a unit for the second workpiece held on the second stage, thereby providing the first workpiece. It is possible to discharge the particles having the modifying ability from the discharge unit at the same time with respect to the second workpiece and to perform the work efficiently.
(4) By providing a heating mechanism on the stage, after discharging the particles having the ability to modify the workpiece surface and laminating the workpieces, (A) pressurizing the two workpieces, (B) 2 It is possible to selectively carry out an arbitrary process from a process group consisting of a heating process for a single workpiece, (C) a pressurizing process for two workpieces, and a heating process.
(5) By providing a mask desorption mechanism between the stage and the discharge unit, even if there is a region that is inconvenient for the modification process on the workpiece surface, the modification process can be performed by mounting the mask. Thus, an inconvenient area can be masked, and the inconvenient area can be protected by the modification process.
(6) By using a light emission unit that emits photons having a wavelength of 200 nm or less or a plasma emission unit that emits plasma particles as the emission unit, an effective modification process can be performed.
(7) By configuring so that the discharge unit and the stage can move relative to each other, a space on the workpiece placed on the stage can be secured. For this reason, the lamination | stacking process of a 1st and 2nd workpiece | work etc. can be performed easily.
(8) Pressurizing the first workpiece and the second workpiece with an appropriate pressure by providing a mechanism for adjusting the contact pressure between the first workpiece and the second workpiece stacked in the pressurizing mechanism. Can do.

It is a figure which shows the apparatus structural example of the 1st Example of this invention. It is the figure which looked at the inversion stage unit from the direction of arrow A of FIG. It is the figure which looked at the pressurization stage unit from the direction of arrow B of FIG. It is a figure (1) explaining the operation | movement (before light irradiation) of the 1st Example of this invention. It is FIG. (2) explaining the operation | movement (light irradiation) of the 1st Example of this invention. FIG. 6 is a diagram (3) for explaining the operation of the first embodiment of the present invention (retraction of the reversing stage unit and pressure stage unit). FIG. 6 is a diagram (4) for explaining the operation (preparation of reversal and pressurizing operation) of the first embodiment of the present invention. FIG. 5 is a diagram (5) for explaining the operation (inversion operation) of the first embodiment of the present invention. It is a figure (6) explaining the operation | movement (pressurization operation | movement) of 1st Example of this invention. It is a figure (7) explaining the operation | movement (pressurization operation | movement) of 1st Example of this invention. FIG. 8 is a diagram (8) for explaining the operation (work removal) of the first embodiment of the present invention. It is a figure explaining the distance (interval) between a light irradiation unit and a workpiece | work. It is a figure which shows the apparatus structural example provided with the heating mechanism which is the 2nd Example of this invention. It is a figure which shows the structural example at the time of providing the high-order controller which controls the execution timing of each control part which is the 3rd Example of this invention. It is a figure which shows the apparatus structural example at the time of comprising the light irradiation unit which is the 4th Example of this invention so that a vertical movement is possible. It is a figure which shows the apparatus structural example at the time of comprising so that light may be separately irradiated to the 1st, 2nd workpiece | work by one light irradiation unit which is the 5th Example of this invention. It is a figure which shows the apparatus structural example at the time of comprising so that a vacuum ultraviolet light etc. may be irradiated to only one of the two microchip substrates which is the 6th Example of invention. It is a figure (1) explaining the operation | movement (lamination | stacking of the 1st, 2nd workpiece | work) of the 6th Example of this invention. It is FIG. (2) explaining the operation | movement (preparation of installation of a pressure lid) of the 6th Example of this invention. It is FIG. (3) explaining the operation | movement (installation of the cover for pressurization) of the 6th Example of this invention. It is a figure (4) explaining the operation | movement (fixing operation | movement of a pressure lid) of the 6th Example of this invention. It is a figure (5) explaining the operation | movement (pressurization operation | movement) of the 6th Example of this invention. It is a figure (6) explaining the operation | movement (pressurization operation | movement) of the 6th Example of this invention. It is a figure (7) explaining the operation | movement (work taking-out) of the 6th Example of this invention. It is a figure which shows the structural example at the time of replacing with the light irradiation unit which is the 7th Example of this invention, and using a plasma generation means.

Hereinafter, specific examples of the present invention will be described.
1. Example 1
FIG. 1 shows a configuration example of a workpiece bonding apparatus according to a first embodiment of the present invention.
This apparatus irradiates the surfaces of two workpieces with UV light to modify the surfaces, stacks the two workpieces, and then applies pressure to the two workpieces to remove the two workpieces. It is for bonding.
The two workpieces are microchip substrates, and are made of, for example, a cyclic olefin copolymer (COC).
The first work is a substrate on the upper side of the microchip that is bonded and formed, and corresponds to a so-called lid. The second workpiece is formed with a flow path (microchannel) including a fine groove having a width of about 10 to several hundreds of micrometers and a depth of about 10 to several hundreds of micrometers. Note that the specimen (for example, saliva, blood, (cancer) cells, etc.) may be placed in advance on one substrate before the microchip substrate is bonded, or the microchip may be bonded after the two substrates are bonded. Sometimes installed inside. In this embodiment, an example in which an inspection body is installed in advance on the second workpiece (microchip substrate) before bonding the microchip substrate will be described.

[Device configuration]
The bonding apparatus in FIG. 1 is roughly divided into three units: a light irradiation unit 10 (discharge unit), a pressure stage unit 20 (pressure mechanism), and a reversing stage unit 30 (work stacking mechanism).
a. Light Irradiation Unit The light irradiation unit 10 is for irradiating the surface of the first workpiece W1 and the surface of the second workpiece W2 with UV light to modify both surfaces. The light irradiation unit 10 includes at least one or more UV lamps 11a, a reflection mirror 11b that reflects light emitted from the UV lamps 11a toward the work side (downward in FIG. 1), and a lamp house 10a that contains them. Consists of. As the UV lamp 11a, for example, a vacuum ultraviolet excimer lamp that emits monochromatic light having a center wavelength of 172 nm is employed. Lighting control of each UV lamp 11 a of the light irradiation unit 10 is performed by the lamp lighting device 13. That is, the lamp lighting device 13 functions to adjust the intensity of the UV light emitted from the UV lamp 11a by controlling the turning on / off of the UV lamp 11a or adjusting the value of the power supplied to the UV lamp 11a. Have

b. Reversing Stage Unit The reversing stage unit 30 cooperates with the pressure stage unit 20 to place the first work W1 placed on the reversing stage 31 on the work stage 21 of the pressure stage unit 20. For laminating the workpiece W2.
FIG. 2 is a view of the reversing stage unit viewed from the direction of arrow A in FIG.
The reversing stage 31 is provided with positioning pins 31c for positioning the first workpiece W1. In the case of a rectangular workpiece such as the first workpiece W1, three positioning pins 31c are provided. One of them corresponds to the short side of the quadrangular workpiece, and the other two correspond to the long side of the quadrangular workpiece.
The reversing stage 31 can suck and hold the first workpiece W1 by a vacuum chuck mechanism.
That is, a suction groove 31a configured to correspond to the shape of the workpiece (first workpiece W1) is formed on the workpiece placement surface of the reversing stage 31.
A vacuum supply path (not shown) is provided inside the reversing stage 31. One of the vacuum supply paths is connected to a vacuum supply pipe 35a, and the other of the vacuum supply paths communicates with a vacuum supply hole 31b provided in the suction groove 31a.
When the first workpiece W1 is placed on the reversing stage 31, a space consisting of a vacuum supply path, a suction groove 31a, and a placement surface for the first workpiece W1 via the vacuum supply pipe 35a by the vacuum supply mechanism 35. Is supplied with a vacuum (that is, the space is depressurized). Thereby, the first workpiece W1 is sucked and held on the reversing stage 31. The vacuum chuck mechanism is controlled by the vacuum chuck drive control unit 35b controlling the operation of the vacuum supply mechanism 35.

A shaft 33 b passes through one end side of the reversing stage 31. The shaft 33b and the reversing stage 31 are fixed with, for example, a set screw. As shown in FIGS. 1 and 2, the shaft is rotatably held by a bearing member 33 d provided on the reversing stage base 34.
One end of the shaft 33b is connected to a rotating shaft 33e of a reversing stage driving mechanism 33 such as a motor via a coupling 33c. The reversing stage controller 33a controls the operation of the reversing stage drive mechanism 33. For example, when the rotation shaft 33e of the reversing stage drive mechanism 33 is rotated 180 degrees clockwise (in FIG. 1) according to a command from the reversing stage control unit 33a, the shaft 33b connected via the coupling 33c is also rotated 180 degrees. . As a result, the inversion stage 31 fixed to the shaft also inverts 180 degrees.
In FIG. 1, the inversion stage 31 is held substantially horizontally by a stage holding mechanism 32 provided on the inversion stage 31 and a bearing member 33d that rotatably holds a shaft 33b fixed to the inversion stage 31. The
The stage holding mechanism 32 holds the reverse stage 31 from the back side of the reverse stage 31 via a spring.

When the bonding apparatus shown in FIG. 1 is installed in the atmosphere, the UV light having a wavelength of 172 nm emitted from the light irradiation unit 10 to the first workpiece W1 and the second workpiece W2 is significantly attenuated in the atmosphere. Therefore, in the atmosphere, the light irradiation unit 10, the surface of the first work W1, and the surface of the second work W2 need to be close to some extent.
The reversing stage base 34 can be adjusted in height by inserting a height adjusting spacer 34a. When the height of the inversion stage base 34 is changed, the height of the bearing member 33d installed on the upper surface of the inversion stage base 34 also changes. As a result, the inversion stage 31 is inclined.
However, when the height of the reversing stage base 34 is adjusted, the reversing stage 31 can be held substantially horizontally by adjusting the height of the stage holding mechanism 32 even if the height of the reversing stage base 34 is changed. Is possible.
The inversion stage fixing mechanism 36, the fixing mechanism driving unit 36a, and the fixing mechanism driving control unit 36b will be described later.

c. Pressure Stage Unit The pressure stage unit 20 cooperates with the reversing stage unit 30 to move the first work W1 placed on the reversing stage 31 onto the work stage 21 of the pressure stage unit 20. It is for laminating | stacking on the 2nd workpiece | work W2.
Furthermore, the first workpiece W1 and the second workpiece W2 that are stacked are pressed to join them together.
The pressure stage unit 20 includes a pressure stage 23, an auxiliary stage 22, and a work stage 21 arranged on the auxiliary stage 22. On the upper surface of the pressure stage 23, a spring 27 and a spring case 27a for accommodating the spring are installed, and the auxiliary stage 22 is held by the spring 27.
Two columnar columns 26 penetrate the pressure stage 23 and the auxiliary stage 22. A portion of each stage 23, 22 through which the column 26 passes has a bearing structure, and each stage 23, 22 is movable in a linear direction (that is, up and down direction) regulated by the column 26.
A flange portion 26 a is provided at the top of the column 26. In the column 26, a height adjusting collar 26 b is inserted between the flange portion 26 a and the auxiliary stage 22.
As will be described in detail later, by adjusting the thickness of the height adjustment collar 26b, the height of the work stage 21 from the base 41 (the surface of the second work W2 on the work stage 21 and the light irradiation unit 10). ) Can be adjusted.
The lower surface of the pressure stage 23 is connected to a stage moving mechanism 24 made of, for example, an air cylinder. By driving the stage moving mechanism 24, the pressure stage 23, the auxiliary stage 22, and the work stage 21 disposed on the auxiliary stage 22 move in the vertical direction. The driving of the stage moving mechanism 24 is controlled by a stage moving mechanism drive control unit 24a.

On the work stage 21, the second work W2 is placed. Although illustration is omitted, the work stage 21 is provided with a positioning mechanism (not shown) for positioning the position of the second work W2. As the positioning mechanism, for example, a positioning pin is used as in the case of the reversing stage.
If necessary, the work stage 21 is configured to be movable in the XY directions perpendicular to the vertical direction in FIG. 1 and perpendicular to each other. In some cases, the work stage is configured to be rotatable and tiltable with respect to a central axis (the direction of the axis is the same as the vertical direction in FIG. 1).
The driving of the work stage 21 is controlled by the work stage drive control unit 21a.

FIG. 3 is a view of the pressure stage unit as seen from the direction of arrow B in FIG.
As described above, the first and second workpieces W1 and W2 are, for example, microchip substrates. In this embodiment, before the two are bonded, the second workpiece W2 (microchip substrate) An inspection object is installed in advance. When the second workpiece W2 is irradiated with UV light in order to modify the surface of the second workpiece W2, the UV light is also irradiated onto the inspection object mounted on the second workpiece W2.
However, depending on the inspection object, the inspection object itself may be deteriorated by irradiation with UV light. In such a case, even if the microchip substrate is bonded to form a microchip, it becomes difficult to analyze and measure the specimen.
In such a case, it is desirable to shield the inspection object installed on the second workpiece W2 from being irradiated with UV light.
In this embodiment, a mask M is disposed between the light irradiation unit 10 and the second workpiece W2. The mask M is patterned so as not to irradiate the inspection body with UV light in accordance with the installation pattern of the inspection body.
The mask M is held by a mask holder 14. The mask holder 14 is configured to be movable, for example, in the direction of the arrow in FIG. 3 by the mask holder driving unit 14a. The driving of the mask holder driving unit 14a is controlled by the mask holder driving control unit 14b.
On the other hand, the pressure stage unit 20 has a stopper 28 that can be inserted into and removed from the space between the pressure stage 23 and the auxiliary stage 22. The stopper 28 is inserted into a space between the pressure stage 23 and the auxiliary stage 22 when both the workpieces are pressurized. The detailed operation of the stopper will be described later.
In this embodiment, the mask holder 14 that holds the mask M and the mask holder drive unit 14a that drives the mask M correspond to a mask attaching / detaching mechanism.

d. Base As shown in FIG. 1, the inversion stage unit 30 and the pressure stage unit 20 described above are provided on a linear motion base 42. The linear motion base 42 is installed on the base 41 and is configured to be movable in a linear direction. The driving of the linear motion base 42 is controlled by the linear motion base drive control unit 43. In order to simplify the illustration, it is assumed here that the linear motion base drive unit that drives the linear motion base 42 is included in the linear motion base.
In FIG. 1, the linear motion base 42 includes a first workpiece W 1 held by the reversing stage unit 30 installed on the linear motion base and a second workpiece W 2 held by the pressure stage unit 20. It is driven so that it can enter and leave the irradiation area of the UV light irradiated from the irradiation unit 10.

Hereinafter, an operation example of the bonding apparatus according to the first embodiment will be described with reference to FIGS.
A. Operation 1 (before light irradiation)
(1) As shown in FIG. 4, the linear motion base drive control unit 43 drives the linear motion base 42 so as to be positioned at the initial position. The initial position here refers to the position of the first workpiece W1 held by the reversing stage unit 30 installed on the linear motion base 42 and the position of the second workpiece W2 held by the pressure stage unit 20. This is a position away from the irradiation region of the UV light irradiated from the light irradiation unit 10. In addition, this initial position is also a position that does not interfere with the light irradiation unit 10 when the reversing stage 31 is reversed.
(2) In the reversing stage unit 30, in consideration of the thickness of the first workpiece W1, the height of the reversing stage base 34 is adjusted to a predetermined height by the height adjusting spacer 34a. The predetermined height means that when the first work W1 is placed on the reversing stage 31 and the first work W1 is positioned in the irradiation area of the light irradiation unit 10, the lower side of the UV lamp 11a and the first height W1 are set. The height is such that the distance from the irradiation surface of one workpiece W1 is D. That is, the height adjusting spacer 34 a functions as a gap setting mechanism that sets the distance between the light irradiation unit 10 (emission unit) and the surface of the first workpiece W 1 placed on the reversing stage 31.
(3) The first workpiece W1 is placed on the reversing stage 31 of the reversing stage unit 30 and positioned at a predetermined position. Here, it is assumed that the first workpiece W1 has a quadrangular shape. As shown in FIG. 2, the positioning is performed by pressing the positioning pin 31c. The first workpiece W1 may be installed by an operator, or may be performed using a well-known transport mechanism that is not shown or described.

(4) The vacuum chuck drive controller 35b drives the vacuum supply mechanism 35 to supply vacuum to the reversing stage 31 via the vacuum supply pipe 35a. That is, the space formed by the vacuum supply path (not shown), the suction groove 31a, and the mounting surface of the first work W1 is depressurized, and the first work W1 is sucked and held on the reversing stage 31.
(5) On the other hand, in the pressure stage unit 20, the second workpiece W2 is placed on the workpiece stage 21 and positioned at a predetermined position. The positioning is the same as the positioning of the first workpiece W1, for example, and details are omitted here. The installation of the second workpiece W2 may be performed by an operator, or may be performed using a well-known transport mechanism that is not shown or described.
(6) Considering the thickness of the second workpiece W2, the stage moving mechanism drive control unit 24a drives the stage moving mechanism 24 to move the pressure stage 23, the auxiliary stage 22, and the work stage 21, thereby moving the work stage. 21 is adjusted to a predetermined height. Specifically, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a, the surface of the auxiliary stage 22 comes into contact with the height adjusting collar 26b, and the height adjusting collar 26b is further connected to the flange portion 26a of the column 26. The pressure stage 23, the auxiliary stage 22, and the work stage 21 are moved until they come into contact with each other.

The height of the surface of the auxiliary stage 22 depends on the thickness of the height adjusting collar 26b provided between the auxiliary stage 22 and the flange portion 26a. That is, the height of the work stage 21 provided on the surface of the auxiliary stage 22 also depends on the thickness of the height adjusting collar 26b. The thickness of the height adjusting collar 26b is equal to the predetermined height described above. Selected to be. That is, the height adjustment collar 26 b functions as a gap setting mechanism that sets the distance between the light irradiation unit 10 (discharge unit) and the surface of the second workpiece W2 placed on the workpiece stage 21.
Here, the predetermined height means that the second work W2 is placed on the work stage 21 and the second work W2 is positioned under the UV lamp 11a when the second work W2 is positioned in the irradiation area of the light irradiation unit 10. The height is such that the distance between the side and the irradiation surface of the second workpiece W2 becomes D to be described later.
That is, the height of the irradiation surface of the first workpiece W1 from the base 41 and the height of the irradiation surface of the second workpiece W2 from the base 41 are substantially the same. The distance D when the mask holder 14 is interposed between the light irradiation unit 10 and the workpiece W2 will be described later.

(7) The mask M is disposed above the second workpiece W2. Specifically, the mask holder driving unit 14b is driven by the mask holder driving control unit 14b so that the mask holder 14 on which the mask M is mounted is positioned at a predetermined position (see FIG. 3).
As described above, the mask M is patterned so as not to irradiate the inspection body with UV light in accordance with the installation pattern of the inspection body on the second workpiece W2.
Here, when it is necessary to precisely align the position of the mask M and the position of the second workpiece W2, alignment marks are applied to the mask M and the second workpiece W2 in advance, and a microscope (not shown) is used. The alignment mark of the mask M and the alignment mark of the second workpiece W2 are detected. Then, based on the detection result, the work stage drive controller 21a drives the work stage 21 so that the positions of both alignment marks coincide. When the mask holder driving unit 14a has a function of precisely driving the mask holder 14 in a two-dimensional direction (XY direction perpendicular to the vertical direction in FIG. 4), instead of the workpiece W2 on the workpiece stage 21. The mask M may be moved to perform alignment.
Through the steps (1) to (7), the first work W1 is positioned on the reversing stage 31, the second work W2 is positioned on the work stage 21, the height of the surface of the first work W1 and the second work. The height of the W2 surface is adjusted and the mask M is arranged.

B. Operation 2 (light irradiation)
(8) As shown in FIG. 5, the linear motion base drive control unit 43 is configured such that the first workpiece W1 held by the reversing stage unit 30 and the second workpiece W2 held by the pressure stage unit 20 are the light irradiation unit 10. The linear motion base 42 is driven so as to be positioned in the irradiation region of the UV light irradiated from the side.
The irradiation surface of the first workpiece W1 and the irradiation surface of the second workpiece W2 are located on substantially the same plane. Further, D is the distance between the lower side of the UV lamp 11a and the irradiation surface of the first workpiece W1, and the distance between the lower side of the UV lamp 11a and the irradiation surface of the second workpiece W2. The distance D is set to 1 to 5 mm, for example, because UV light having a wavelength of 172 nm emitted from the UV lamp is significantly attenuated in the atmosphere.

Here, the distance D is set as shown in FIG.
12A, FIG. 12A shows the lower side of the UV lamp 11a and the irradiation surface of the workpiece W when the mask holder 14 on which the mask M is mounted is not provided between the light irradiation unit 10 and the workpiece W. FIG. 4B shows the distance, and the lower side of the UV lamp 11a and the irradiation surface of the workpiece W when the mask holder 14 on which the mask M is mounted is provided between the light irradiation unit 10 and the workpiece W. Indicates the distance.
When the mask holder 14 on which the mask M is mounted is not provided between the light irradiation unit 10 and the workpiece W, the lower side of the UV lamp 11a, the irradiation surface of the workpiece W, as shown in FIG. Is a distance D. On the other hand, when the mask holder 14 on which the mask M is mounted is provided between the light irradiation unit 10 and the workpiece W, as shown in FIG. When the distance from the upper surface is d1, and the distance between the lower surface of the mask M and the irradiation surface of the workpiece W is d2, the above D is d1 + d2. This is because the UV light hardly attenuates when passing through the mask M.
As described above, in this embodiment, the distance D is set by the height adjusting spacer 34a and the height adjusting collar 26b that function as a gap setting mechanism.
(9) The UV lamp 11 a is turned on by the lamp lighting device 13, and UV light having a wavelength of 172 nm is irradiated onto the first workpiece W 1 and is irradiated onto the second workpiece W 2 through the mask M. The lamp lighting device 13 controls the power supplied to the UV lamp 11a so that the irradiance on the surface of the first workpiece W1 and the surface of the second workpiece W2 becomes a predetermined value.
(10) After a predetermined irradiation time has elapsed, the lamp lighting device 13 turns off the UV lamp 11a. Here, it is assumed that the lamp lighting device 13 can also set the lamp lighting time.

Through the steps (8) to (10) described above, the first workpiece W1 and the second workpiece W2 are arranged in the irradiation region, and UV irradiation for a predetermined time is performed on both the workpieces.
In the steps (9) to (10), the first workpiece W1 and the second workpiece W2 are simultaneously irradiated with UV light, but it is not always necessary to perform the irradiation simultaneously. For example, the first workpiece is first processed. W1 may be irradiated with UV light, and then the second workpiece W2 may be irradiated with UV light. Alternatively, the second work W2 may be irradiated with UV light first, and then the first work W1 may be irradiated with UV light.

C. Operation 3 (Retraction stage unit, retraction stage unit)
(11) As shown in FIG. 6, the linear motion base drive control unit 43 drives the linear motion base 41 so as to be positioned at the initial position again. As described above, this initial position is a position that does not interfere with the light irradiation unit 10 when the reversing stage 31 is reversed.
(12) The mask M is retracted from above the second workpiece W2. Specifically, the mask holder driving control unit 14b (see FIG. 3) drives the mask holder driving unit 14a, and the mask holder 14 on which the mask M is mounted is retracted from above the second workpiece W2. The retracted position of the mask holder 14 is a position where the mask holder 14 does not interfere with the reversing stage 31 when the reversing stage 31 is reversed.
By the steps (11) to (12), the light irradiation unit and the mask holder are retracted from above the reversing stage.

D. Operation 4 (Preparation for reverse operation and pressurizing operation)
(13) As shown in FIG. 7, the stage moving mechanism drive controller 24a drives the stage moving mechanism 24 to move the pressure stage 23, the auxiliary stage 22, and the work stage 21 downward, so that the work stage 21 Is adjusted to a predetermined height. The predetermined height is a height at which the first work W1 sucked and held on the reversing stage 31 does not collide with the second work W2 on the work stage 21 when the reversing stage 31 is reversed. That is, when the inversion stage 31 is inverted, the first workpiece W1 and the second workpiece W2 are held with a predetermined gap.
(14) The stopper 28 is inserted into the space between the pressure stage 23 and the auxiliary stage 22. The stopper 28 is driven by a stopper driving unit 28a (see FIG. 3), and the control is performed by the stopper driving control unit 28b.
By the steps (13) to (14), the first work W1 attracted and held by the reversing stage 31 when the reversing stage 31 is reversed does not collide with the second workpiece W2 on the work stage 21, and the reversing stage 31 is moved. Reversible standby state. Moreover, it will be in the state which can transfer to the pressurization process following the following.

E. Operation 5 (Reverse operation)
(15) As shown in FIG. 8, in the reversing stage unit 30, the reversing stage 31 that sucks and holds the first work W1 is reversed, and the first work W2 is disposed at a position facing the second work W2. The
Specifically, the inversion stage drive mechanism 33 is driven by the inversion stage controller 33a shown in FIG. 2, and the rotation shaft 33e of the inversion stage drive mechanism 33 rotates 180 degrees. Here, since the shaft 33b to which the reversing stage 31 is fixed is connected to the rotating shaft 33e via the coupling 33c, when the rotating shaft 33e rotates, the shaft 33b also rotates, resulting in the shaft 33b. The inversion stage 31 fixed to is also inverted 180 degrees.
(16) After the inversion stage 31 is inverted, the inversion stage fixing mechanism 36 is driven to fix the inversion stage 31. In FIG. 8, the reversing stage fixing mechanism 36 restricts the reversing stage 31 from reversing counterclockwise. The clockwise rotation of the reversing stage 31 is restricted by a stopper (not shown).
The reversing stage fixing mechanism 36 is driven by a fixing mechanism driving unit 36a. The fixing mechanism driving unit 36a is controlled by the fixing mechanism driving control unit 36b. Here, the inversion stage fixing mechanism 36 is driven after the inversion stage 31 is inverted, and is retracted to a position where the inversion operation of the inversion stage 31 does not interfere before the inversion stage 31 is inverted.

(17) The first work W1 on the reversing stage 31 and the second work W2 on the work stage 21 are positioned so as to have a predetermined positional relationship after the reversing stage 31 is reversed. Here, the predetermined positional relationship is a desired positional relationship between the first workpiece W1 and the second workpiece W2 when the first workpiece W1 is stacked on the second workpiece W2 in the following steps. It is a relationship that seems to be repeated.
Here, when it is necessary to precisely align the first workpiece W1 and the second workpiece W2, alignment marks are provided in advance on the workpiece W1 and the workpiece W2, and an alignment mark detection mechanism (not shown) is used. The alignment mark of the first workpiece W1 and the alignment mark of the second workpiece W2 are detected. Then, based on the detection result, the work stage drive controller 21a drives the work stage 21 so that the positions of both alignment marks coincide.
By the steps (15) to (17), the inversion stage 31 is inverted, and the inversion stage 31 is fixed at the inversion position. In some cases, the first workpiece W1 and the second workpiece W2 are aligned.

F. Action 6 (Pressurizing action)
(18) As shown in FIG. 9, in the pressurizing stage unit 20, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a, so that the pressurizing stage 23, auxiliary stage 22, and work stage 21 are moved upward. The second work W2 placed on the work stage 21 and the first work W1 sucked and held on the reversing stage 31 are brought into contact with each other. At this time, the distance between the upper surface of the base 41 and the surface of the pressure stage 23 is S1.
(19) As shown in FIG. 10, after the first workpiece W1 and the second workpiece W2 are brought into contact with each other in the pressure stage unit 20 (the first workpiece W1 is stacked on the second workpiece W2). After), the stage moving mechanism 24 continues to be driven by the stage moving mechanism drive controller 24a. Then, when the upper surface of the pressure stage 23 comes into contact with the stopper 28, the drive of the stage moving mechanism 24 is stopped.
As described above, the reversing stage 31 that holds the first workpiece W1 by suction is restricted from being reversed counterclockwise by the reversing stage fixing mechanism 36. For this reason, the auxiliary stage 22 on which the work stage 21 on which the second work W2 is placed cannot be moved upward. Therefore, the upward moving distance (x) of the pressure stage 23 from the position where the first work W1 and the second work W2 are in contact to the position where the upper surface of the pressure stage 23 is in contact with the stopper 28. Only the spring 27 inserted between the pressure stage 23 and the auxiliary stage 22 is compressed.
That is, in the present embodiment, this corresponds to a movement restricting mechanism that restricts the upward movement of the first workpieces W1 and W2 on which the reversing stage fixing mechanism 36 is stacked.

That is, if the distance between the upper surface of the base 41 and the surface of the pressure stage 23 when the surface of the pressure stage 23 and the stopper 28 are in contact is S2, the moving distance x is x = S2-S1. Therefore, when the spring constant of the spring 27 is k, a pressure having a magnitude of P = | kx | is applied to the first workpiece W1 and the second workpiece W2.
That is, the pressure applied to the first workpiece W1 and the second workpiece W2 is adjusted to a predetermined value by adjusting the spring constant of the spring 27 and the insertion position of the stopper 28.
The pressure is measured using a pressure sensor 15 provided on the work stage 21. The pressure information detected by the pressure sensor 15 is sent to, for example, the stage moving mechanism drive control unit 24a. For example, it is sent to a pressure display means (not shown).
The pressure applied to the first workpiece W1 and the second workpiece W2 can be changed during the pressurization. For example, when a plurality of first workpieces W1 and second workpieces W2 are bonded together, there are variations in thickness depending on the workpieces. If such a variation exists, the distance between the upper surface of the base 41 and the surface of the pressure stage 23 when the second workpiece W2 and the first workpiece W1 come into contact with each other also varies in the value of S1. Therefore, the moving distance x = S2-S1 also varies, and as a result, the pressure P = | kx | applied to the first workpiece W1 and the second workpiece W2 also varies.

In this case, first, the stage moving mechanism is driven until the upper surface of the pressure stage 23 comes into contact with the stopper 28, and a pressure having a magnitude P = | kx | is applied to the first workpiece W1 and the second workpiece W2. . While maintaining this pressurized state, the pressure Ps detected by the pressure sensor 15 is checked next, and the position of the stopper 28 is moved in the vertical direction so that the pressure Ps becomes equal to the predetermined pressure P. That is, the variation in the distance S1 is corrected by adjusting the value of the distance S2.
Specifically, based on the pressure information from the pressure sensor 15, the stopper 28 is driven by the stopper driving unit 28 a, and the vertical position of the stopper 28 inserted between the pressure stage 23 and the auxiliary stage 22 is determined. adjust. As described above, the stopper drive unit 28a is controlled by the stopper drive control unit 28b. The stopper drive control unit 28b drives the stopper drive unit 28a based on the pressure information from the pressure sensor 15 so that the detected pressure Ps becomes equal to the predetermined pressure P. When pressure information is displayed on the pressure display means (not shown), the operator may operate the stopper drive control unit 28b while viewing the display information.
That is, by adjusting the position of the stopper 28 in the vertical direction, the value of the distance S2 is adjusted so that the moving distance becomes x, and the pressure applied to the first work W1 and the second work W2. The size of P = | kx | is adjusted.
By the steps (18) to (19), the first workpiece W1 and the second workpiece W2 are stacked and pressure is applied thereto.
In the present embodiment, the stopper 28 and the stopper driving unit 28a correspond to a mechanism for adjusting the contact pressure between the first workpiece W1 and the second workpiece W2 in a stacked state.

G. Action 7 (Removal of work (microchip))
(20) After a predetermined time has elapsed from the start of pressure application to the first workpiece W1 and the second workpiece W2, in the reversing stage unit 30, the vacuum chuck drive control unit 35b stops driving the vacuum supply mechanism 35, and the reversing stage. The supply of vacuum to 31 stops. Then, air is supplied to the reversing stage 31 by a purge mechanism (not shown). That is, the space formed by the vacuum supply path, the suction groove 31a, and the mounting surface of the first work W1 changes from the reduced pressure atmosphere to the atmospheric pressure atmosphere, and the reversing stage 31 and the microchip surface (the first work W1 of the microchip). The adsorbing relationship with the side surface is released.
Note that the above-described predetermined time is from the start of pressure application to the first workpiece W1 and the second workpiece W2 until the first chip W1 and the second workpiece W2 are joined and the microchip is formed. Is the time.
(21) As shown in FIG. 11, in the pressurizing stage unit 20, the stage moving mechanism drive controller 24a drives the stage moving mechanism 24 to move the pressurizing stage 23, the auxiliary stage 22, and the work stage 21 downward. Move. The moving position is an arbitrary position where the microchip surface is separated from the reversing stage 31 and the pressure on the microchip is released.

(22) The inversion stage fixing mechanism 36 is driven by the fixing mechanism driving unit 36a, and the inversion stage fixing mechanism 36 is retracted to a position where the inversion operation of the inversion stage 31 does not interfere. Thereby, the fixing of the inversion stage 31 is released.
(23) In the reversing stage unit 30, the reversing stage 31 that sucks and holds the first workpiece W1 is reversed in the direction opposite to the step (15), and the reversing stage 31 is retracted from above the microchip.
Specifically, the inversion stage drive mechanism 33 is driven by the inversion stage control unit 33a, and the inversion stage drive mechanism 33 is connected to the shaft 33b to which the inversion stage 31 is fixed and the coupling 33c (see FIG. 2). ) Is rotated by -180 degrees as shown in FIG.
(24) In the pressure stage unit 20, the microchip placed on the work stage 21 is taken out. Note that the microchip may be taken out by an operator, or may be performed using a well-known transport mechanism that is not shown or described.
By the steps (20) to (24), release of the pressure on the microchip, release of the vacuum chuck of the reversing stage 31, release of fixing of the reversing stage 31 and reversing to the original position, the microchip from the work stage 21 Is taken out.

In the above operations (1) to (7), the inversion stage unit 30 and the pressure stage unit 20 provided on the linear motion base 42 are not irradiated with UV light (steps (1) to (7)). Is located at a position (initial position) deviated from the UV light irradiation region irradiated from the light irradiation unit, and is positioned in the UV light irradiation region in the UV light irradiation step (steps (8 to 10)). In the subsequent pressurizing (heating) step (steps (11) to (24)), the head moves again to a position outside the irradiation region of the UV light.
This is because when the wavelength of the UV light emitted from the UV lamp 11a is 172 nm, the distance D between the lower side of the UV lamp 11a and the irradiation surface of each workpiece W is, for example, 1 to 5 mm. When the pressure stage unit 20 is in the UV light irradiation area, it is difficult to dispose the first work W1 and the second work W2 on the reversing stage 31 and the work stage 21, respectively, or to reverse the reversing stage 31. This is because.
If the wavelength of the UV light is set longer than the wavelength of 172 nm and the distance D can be set relatively large, the inversion stage unit 30 and the pressurizing stage unit 20 may remain arranged in the UV light irradiation region. .

According to the apparatus of the first embodiment described above, the following effects can be obtained.
The bonding apparatus shown in the present embodiment applies light to the first work W1 held on the reverse stage 31 of the reverse stage unit 30 and the second work W2 held on the work stage 21 of the pressure stage unit 20. It is possible to irradiate UV light from the irradiation unit, and by reversing the reversing stage 31 of the reversing stage unit 30 and controlling the height of the pressure stage unit 20, the first work W1 and It is possible to stack the second workpiece W2. Furthermore, it becomes possible to apply pressure to the first workpiece W1 and the second workpiece stacked by the pressurization mechanism of the pressurization stage unit 20.
That is, the bonding process of the microchip can be performed with one apparatus, and the entire apparatus can be configured compactly.

Furthermore, it is possible to adjust the UV light irradiation surface of the first workpiece W1 and the UV light irradiation surface of the second workpiece W2 to substantially the same height, and further, between these irradiation surfaces and the light irradiation unit. The distance can be arbitrarily set.
For example, when the UV light emitted from the light irradiation unit to the irradiation surfaces of both workpieces is UV light having a center wavelength of 172 nm, the distance between the lower side of the UV lamp and the irradiation surfaces of both workpieces is set to 1 to 5 mm, for example. It becomes possible to do.
Therefore, when irradiating UV light having a wavelength of 172 nm that is significantly attenuated in the air, it is possible to modify the surface of the first workpiece W1 and the surface of the second workpiece W2 even if the irradiation atmosphere is in the air. . That is, the UV light irradiation atmosphere does not need to be a vacuum atmosphere in which UV light having a wavelength of 172 nm is not attenuated, and thus the entire apparatus can be configured more compactly.
As described above, in this embodiment, the surface of the first workpiece W1 held on the reversing stage (first stage) 31 and the light irradiation unit by the height adjusting spacer 34a functioning as a gap setting mechanism. The distance from the (release unit) 10 can be adjusted. Similarly, by the height adjusting collar 26b that functions as a gap setting mechanism, the surface of the second workpiece W2 held on the workpiece stage (second stage) 21 and the light irradiation unit (discharge unit) 10 are arranged. The distance can be adjusted. That is, in this embodiment, the distance between the surface of the first work W1 held on the reversing stage (first stage) 31 and the light irradiation unit (discharge unit) 10 and / or the work stage (by the gap setting mechanism). The distance between the surface of the second workpiece W2 held on the second stage) 21 and the light irradiation unit (discharge unit) 10 can be adjusted independently.

2. Example 2
The laminating apparatus shown in the first embodiment is a series of two workpieces (substrates) including a light irradiation treatment process on a workpiece surface, a stacking process of two workpieces, and a pressurizing process of two workpieces. It is possible to perform a work (microchip substrate) bonding step.
The bonding apparatus of Example 2 is obtained by adding a substrate heating function to the bonding apparatus of Example 1. As a result, after the above-described two workpiece laminating step, (A) two workpiece pressing step, (B) two workpiece heating step, (C) two workpiece pressing step and heating. An arbitrary process can be selected from a process group consisting of processes.

[Device configuration]
As described above, the bonding apparatus according to the second embodiment is obtained by adding a workpiece heating mechanism to the bonding apparatus according to the first embodiment, and is the same as the bonding apparatus according to the first embodiment except for the workpiece heating mechanism. Therefore, only the workpiece heating mechanism will be described below.
As shown in FIG. 13, in the pressure stage unit 20 of the bonding apparatus according to the second embodiment, the heating mechanism 16 is provided on the work stage 21 on which the second work W2 is placed. The heating mechanism 16 is configured by, for example, embedding a sheath heater inside the work stage 21. The temperature control of the work stage 21 is performed by the temperature control unit 16a. The temperature control unit 16a controls the heating mechanism 16 based on temperature information on the surface of the work stage 21 measured by a temperature sensor (not shown) so that the surface temperature of the work stage 21 becomes a predetermined temperature.

Hereinafter, the operation of the bonding apparatus of this embodiment will be described. In the first embodiment, the case where the two workpieces are pressed and bonded together has been described. Therefore, here, (a) when the two workpieces are bonded together only by heating, (b) A case where the workpiece is bonded by pressurization and heating will be described. Note that a description of the steps having the same operations as those of the first embodiment will be omitted.
(A) When only the heating step is performed.
As described below, steps A (operation 1: before light irradiation) to E (operation 5: inversion operation) are the same as those in the first embodiment, and F (operation 5: pressurization) in the first embodiment. The steps of (operation) and G (operation 6: workpiece removal) are replaced with the following steps F ′ (heating operation) and G ′ (work removal).
A. Operation 1 (before light irradiation)
Since this is the same as (1) to (7) of the first embodiment described with reference to FIG.
B. Operation 2 (light irradiation)
Since it is the same as (8) to (10) of the first embodiment described with reference to FIG.
C. Operation 3 (Retraction of reversing stage unit 30 and pressure stage unit 20)
Since this is the same as (11) to (12) of the first embodiment described with reference to FIG. D. Operation 4 (Preparation for reverse operation and pressurizing operation)
Since this is the same as (13) to (14) of the first embodiment described with reference to FIG. E. Operation 5 (Reverse operation)
Since this is the same as (15) to (17) of the first embodiment described with reference to FIG.

F '. Operation 6 '(heating operation)
(18) As shown in FIG. 9, in the pressurizing stage unit 20, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a, so that the pressurizing stage 23, auxiliary stage 22, and work stage 21 are moved upward. The second work W2 placed on the work stage 21 and the first work W1 sucked and held on the reversing stage 31 are brought into contact with each other.
(19-1) The temperature control of the work stage 21 is started by the temperature control unit 16a shown in FIG. The temperature control unit 16a controls the heating mechanism based on the temperature information on the surface of the work stage 21 measured by a temperature sensor (not shown) so that the temperature of the surface of the work stage 21 becomes a predetermined temperature.
Through the steps (18) to (19-1), the first workpiece W1 and the second workpiece W2 are stacked and heated.

G '. Operation 7 ′ (work (microchip) removal)
(19-2) Temperature control of the work stage 21 by the temperature control unit 16a shown in FIG. 13 is stopped after a predetermined time has elapsed from the start of heating the first work W1 and the second work W2. The first workpiece W1 and the second workpiece W2 on the workpiece stage 21 are joined to form a microchip. Since the temperature control of the work stage 21 is stopped as described above, the work stage 21 and the microchip on the work stage 21 are cooled to room temperature.
In order to shorten the cooling time, a cooling mechanism (not shown) may be provided in the work stage 21. As the cooling mechanism, for example, a cooling pipe is embedded in the work stage 21 and a refrigerant is caused to flow through the cooling pipe. Then, the work stage 21 is cooled by heat exchange between the refrigerant and the work stage 21. The cooling mechanism is also controlled by, for example, the temperature control unit 16a. The temperature control unit 16a operates the cooling mechanism after stopping the operation of the heating mechanism 16, and the temperature of the surface of the work stage 21 is determined based on the temperature information of the surface of the work stage 21 measured by a temperature sensor (not shown). The cooling mechanism is controlled to reach the temperature.
Note that the above-described predetermined time is the time when the first workpiece W1 and the second workpiece W2 are heated to complete the joining of the first workpiece W1 and the second workpiece W2 to form a microchip. It is time to do.

(20 ′) After the temperature of the first workpiece W1 and the second workpiece W2 is cooled to a predetermined temperature, the vacuum chuck drive control unit 35b stops driving the vacuum supply mechanism 35 in the reversing stage unit 30, The supply of vacuum to the inversion stage 31 is stopped.
Then, air is supplied to the reversing stage 31 by a purge mechanism (not shown). That is, the space formed by the vacuum supply path, the suction groove 31a, and the mounting surface of the first work W1 changes from the reduced pressure atmosphere to the atmospheric pressure atmosphere, and the reversing stage 31 and the microchip surface (the first work W1 of the microchip). The adsorbing relationship with the side surface is released.
(21 ') As shown in FIG. 11, in the pressurizing stage unit 20, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a so that the pressurizing stage 23, the auxiliary stage 22, and the work stage 21 are moved downward. Move to. The moving position is an arbitrary position at which the microchip surface is separated from the reversing stage 31.
Since the following operations are the same as (22) to (24) of the first embodiment, the description thereof is omitted.
By the steps (19-2), (20 ′), (21 ′), (22) to (24), the heating to the microchip is released, the vacuum chuck of the inversion stage 31 is released, the fixing of the inversion stage 31 is released, and Inversion to the original position and removal of the microchip from the work stage 21 are performed.

(B) When performing both the pressurizing step and the heating step.
As described below, steps A (operation 1: before light irradiation) to E (operation 5: inversion operation) are the same as those in the first embodiment, and F (operation 5: pressurization) in the first embodiment. The steps of (operation) and G (operation 6: workpiece removal) are replaced with the following steps F ′ (heating operation) and G ′ (work removal).
A. Operation 1 (before light irradiation)
Since this is the same as (1) to (7) of the first embodiment described with reference to FIG.
B. Operation 2 (light irradiation)
Since it is the same as (8) to (10) of the first embodiment described with reference to FIG.
C. Operation 3 (Retraction of reversing stage unit 30 and pressure stage unit 20)
Since this is the same as (11) to (12) of the first embodiment described with reference to FIG. D. Operation 4 (Preparation for reverse operation and pressurizing operation)
Since this is the same as (13) to (14) of the first embodiment described with reference to FIG. E. Operation 5 (Reverse operation)
Since this is the same as (15) to (17) of the first embodiment described with reference to FIG.

F ”.Operation 6” (Pressurization / heating operation)
(18) As shown in FIG. 9, in the pressurizing stage unit 20, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a, so that the pressurizing stage 23, auxiliary stage 22, and work stage 21 are moved upward. The second work W2 placed on the work stage 21 and the first work W1 sucked and held on the reversing stage 31 are brought into contact with each other.
(19) As shown in FIG. 10, after the first workpiece W1 and the second workpiece W2 are brought into contact with each other in the pressure stage unit 20 (the first workpiece W1 is stacked on the second workpiece W2). After), the stage moving mechanism 24 continues to be driven by the stage moving mechanism drive controller 24a. Then, when the upper surface of the pressure stage 23 comes into contact with the stopper 28, the drive of the stage moving mechanism 24 is stopped.
As described in the first embodiment, the upward movement of the pressure stage 23 from the position where the first work W1 and the second work W2 are in contact to the position where the upper surface of the pressure stage 23 is in contact with the stopper 28 is performed. When the distance is x and the spring constant of the spring is k, a pressure of magnitude P = | kx | is applied to the first workpiece W1 and the second workpiece W2.
(19 ″) Temperature control of the work stage 21 is started by the temperature control unit 16a shown in FIG. 13. The temperature control unit 16a is based on temperature information on the surface of the work stage 21 measured by a temperature sensor (not shown). The heating mechanism is controlled so that the surface temperature of the work stage 21 becomes a predetermined temperature.

(18) Through the steps (19) and (19 ″), the first workpiece W1 and the second workpiece W2 are stacked, and pressurization and heating are performed on them.
As described above, the pressure applied to the first workpiece W1 and the second workpiece W2 can be changed during the pressurization. Specifically, the stopper 28 is driven by the stopper driving unit 28 a to adjust the vertical position of the stopper 28 inserted in the space between the pressure stage 23 and the auxiliary stage 22. As described above, the stopper drive unit 28a is controlled by the stopper drive control unit 28b.
That is, by adjusting the vertical position of the stopper 28 while maintaining the pressurized state, the value of the distance S2 is adjusted so that the moving distance becomes x, and the first workpiece W1 and the second workpiece W2 are adjusted. The magnitude of the pressure P = | kx | applied to the workpiece W2 is adjusted.

G ".Operation 7" (work (microchip) removal)
(19-3) The temperature control of the work stage 21 by the temperature control unit 16a shown in FIG. The first workpiece W1 and the second workpiece W2 on the workpiece stage 21 are joined to form a microchip. Since the temperature control of the work stage 21 is stopped as described above, the work stage 21 and the microchip on the work stage 21 are cooled to room temperature.
In order to shorten the cooling time, a cooling mechanism (not shown) may be provided in the work stage 21 as described above. As the cooling mechanism, for example, a cooling pipe is embedded in the work stage 21 and a refrigerant is caused to flow through the cooling pipe. Then, the work stage 21 is cooled by heat exchange between the refrigerant and the work stage 21. The cooling mechanism is also controlled by, for example, the temperature control unit 16a. The temperature control unit 16a operates the cooling mechanism after stopping the operation of the heating mechanism 16, and the temperature of the surface of the work stage 21 is determined based on the temperature information of the surface of the work stage 21 measured by a temperature sensor (not shown). The cooling mechanism is controlled to reach the temperature.
The above-mentioned predetermined time is the time when the first workpiece W1 and the second workpiece W2 are pressed and heated, and the joining of the first workpiece W1 and the second workpiece W2 is completed to form a microchip. It is time to do.

(20 ″) After the temperature of the first workpiece W1 and the second workpiece W2 is cooled to a predetermined temperature, the vacuum chuck drive control unit 35b stops driving the vacuum supply mechanism 35 in the reversing stage unit 30, The supply of vacuum to the inversion stage 31 is stopped.
Then, air is supplied to the reversing stage 31 by a purge mechanism (not shown). That is, the space formed by the vacuum supply path, the suction groove 31a, and the mounting surface of the first work W1 changes from the reduced pressure atmosphere to the atmospheric pressure atmosphere, and the reversing stage 31 and the microchip surface (the first work W1 of the microchip). The adsorbing relationship with the side surface is released.
Since the following operations are the same as (21) to (24) of the first embodiment, the description thereof will be omitted.
By the steps (19-3), (20 ″), (21) to (24), the pressure and heating to the microchip are released, the vacuum chuck of the reversing stage 31 is released, the fixing of the reversing stage 31 is released, and the original And the microchip is taken out from the work stage 21.

According to the apparatus of the second embodiment described above, the following effects can be obtained in addition to the effects of the apparatus of the first embodiment.
That is, since the heating mechanism 16 is applied to the work stage 21, the first execution is performed after performing the light irradiation treatment process on the work surface and the stacking process of the two works on the two works (substrates). In addition to the “pressing process of two workpieces” described in the example, there are three (3) consisting of “(b) heating process of two workpieces” and “(b) pressing process and heating process of two workpieces”. An arbitrary process can be selected from the process group and executed.

3. Example 3
Next, a third embodiment, which is a modification of the first and second embodiments, will be described.
As described above, the operation of each component in the first and second embodiments is performed by each control unit.
That is, the lamp lighting device 13 controls the lighting / extinguishing of the UV lamp 11a and the lamp lighting time. The vacuum chuck drive controller 35b controls the operation of the vacuum supply mechanism 35 for operating the vacuum chuck mechanism.
The inversion stage control unit 33 a controls the operation of the inversion stage driving mechanism 33 for inverting the inversion stage 31.
The stage moving mechanism drive control unit 24a controls the operation of the stage moving mechanism 24 that moves the pressure stage 23, the auxiliary stage 22, and the work stage 21 in the vertical direction.
The work stage drive control unit 21a drives and controls the work stage 21 in order to align the first work W1 and the second work W2 as necessary.

The mask holder drive control unit 14b controls the operation of the mask holder drive unit 14a for placing the mask holder 14 on which the mask M is mounted at a predetermined position.
The linear motion base drive controller 43 drives and controls the linear motion base 42 mounted with the reversing stage unit 30 and the pressure stage unit 20.
The stopper drive control unit 28b controls the operation of the stopper drive unit 28a for driving the stopper 28 that contributes to pressurization to the microchip.
The fixing mechanism drive control unit 36b controls the operation of the fixing mechanism driving unit 36a that drives the inversion stage fixing mechanism 36 for restricting the inversion stage 31 from being inverted counterclockwise in FIG.
The temperature controller 16a controls the operation of the heating mechanism 16 so that the temperature of the surface of the work stage 21 becomes a predetermined temperature based on the temperature information of the surface of the work stage 21 measured by a temperature sensor (not shown). Moreover, the temperature control part 16a controls the cooling mechanism which abbreviate | omitted illustration so that the temperature of the work stage 21 surface may become predetermined | prescribed temperature based on the said temperature information as needed. These control units perform the control in each step (1) to (24) described above.

Here, as shown in FIG. 14, a host controller 50 that is a control unit that instructs the execution timing of these control units may be provided, and a series of steps may be automatically performed.
The host controller 50 stores in advance command contents relating to the above-described process procedures (1) to (24), and controls each control unit described above based on the command contents.
The pressure sensor 15 detects the pressure applied to the first workpiece W1 and the second workpiece W2, and is sent to the stage moving mechanism drive control unit 24a as described above, for example, but the host controller 50 is provided. In this case, the output of the pressure sensor 15 may be sent to the host controller 50, and the stage moving mechanism drive control unit 24a may be controlled via the host controller 50.
In addition, when carrying in, installing, and carrying out the 1st workpiece | work W1 and the 2nd workpiece | work W2 to the inversion stage 31 and the work stage 21, respectively using a well-known conveyance mechanism, the control part which controls such a conveyance mechanism is provided. You may connect with the high-order controller 50. FIG.

4). Example 4
Next, a description will be given of a fourth embodiment, which is another modification of the first, second, and third embodiments.
As described above, when the first workpiece W1 and the second workpiece W2 are irradiated with UV light having a wavelength of 172 nm, the reversing stage unit 30 and the pressurizing stage unit 20 are subjected to the UV light irradiation step ((8) to (10 In step (2), it moves so as to be located in the UV light irradiation region, and in other steps, it is retracted from the UV light irradiation region.
In the embodiment described above, the reversing stage unit 30 and the pressure stage unit 20 are provided on the linear motion base 42 and configured to move on the base 41.
However, this configuration is not necessarily required. For example, as shown in FIG. 15, the light irradiation unit 10 may be configured to be movable in the vertical direction. Specifically, the light irradiation unit 10 is driven in the vertical direction by the light irradiation unit driving unit 17. . Here, the operation of the light irradiation unit drive unit 17 is controlled by the light irradiation unit drive control unit 17a.

  For example, in the operations (1) to (7) of the first embodiment, the light irradiation unit 10 is moved up by the light irradiation unit driving unit 17 before UV light irradiation (steps (1) to (7)). It moves in the direction and is kept in place. The predetermined position means that the first workpiece W1 and the second workpiece W2 are arranged on the reversing stage 31 and the work stage 21, respectively, between the light irradiation unit 10, the reversing stage unit 30, and the pressure stage unit 20. It is a position where a space that can be secured can be secured. The predetermined position is reversed between the light irradiation unit 10, the reversing stage unit 30, and the pressure stage unit 20 in the pressurization (heating) step and subsequent steps (steps (11) to (24)). This is a position where a space where the light irradiation unit 10 does not interfere when the stage 31 is reversed can be secured.

Next, the light irradiation unit 10 is moved downward by the light irradiation unit driving unit 17 in the UV light irradiation step (steps (8 to 10)), and the lower side of the UV lamp 11a and the irradiation surface of each workpiece. The distance D is maintained at a position of 1 to 5 mm, for example.
After the light irradiation is completed, the light irradiation unit 10 is moved upward by the light irradiation unit driving unit 17 and is maintained at the predetermined position described above.
As shown in the first embodiment, the reversing stage unit 30 and the pressure stage unit 20 are provided on the linear motion base 42, and the first work W1 held by the reversing stage unit 30 and the pressure stage unit 20 are When the linear motion base 42 is driven on the base 41 so that the second workpiece W2 to be held can enter and leave the irradiation region of the UV light irradiated from the light irradiation unit 10, the linear motion base 42 is driven. The base 41 becomes longer along the moving direction. For this reason, the floor area of the bonding apparatus also increases accordingly.
However, since the bonding apparatus shown in the fourth embodiment does not need to provide the linear motion base 42, the floor area of the bonding apparatus can be reduced.

5). Example 5
Next, a fifth embodiment, which is another modification of the first, second, third, and fourth embodiments, will be described.
In each of the above-described embodiments, the UV light is irradiated to the first work W1 and the second work W2 at the same time in the UV light irradiation step. The second workpiece W2 may be individually irradiated with UV light.
FIG. 16 is a diagram illustrating a configuration example of a bonding apparatus that individually irradiates UV light to the first workpiece W1 and the second workpiece W2.
The light irradiation unit 10 is configured to be driven left and right in FIG. 16 by the light irradiation unit driving unit 17. Here, the operation of the light irradiation unit drive unit 17 is controlled by the light irradiation unit drive control unit 17a. With such a configuration, it is possible to individually irradiate the first work W1 and the second work W2 with UV light emitted from the light irradiation unit 10.
Since the bonding apparatus shown in FIG. 16 can individually irradiate UV light to the first workpiece W1 and the second workpiece W2, the light irradiation unit 10 can be configured compactly. Become.

Also in the bonding apparatus shown in FIG. 16, the reversing stage unit 30 and the pressure stage unit 20 are moved so as to be positioned in the UV light irradiation region in the UV light irradiation process, and in other steps, the UV light irradiation process is performed. It is necessary to evacuate from the light irradiation area.
Therefore, as shown in the first embodiment, the reversing stage unit 30 and the pressurizing stage unit 20 may be provided on the linear motion base 42 and moved on the base 41. Similarly to the embodiment, the light irradiation unit 10 may be configured to be driven in the vertical direction by the light irradiation unit driving unit 17 as indicated by a dotted line in FIG.
By adopting such a configuration, it is possible to achieve the same effect as the bonding apparatus shown in the fourth embodiment.

6). Example 6
In the above-described Examples 1 to 5, an example in which vacuum ultraviolet light or the like is irradiated to both of two microchip substrates has been shown. That is, the surfaces of both substrates are irradiated with vacuum ultraviolet light or the like to modify the surfaces, the two workpieces are stacked, and then the two workpieces are pressed to attach the two workpieces. A device for matching was presented.
In this embodiment, an example of a workpiece bonding apparatus in the case where only one of two microchip substrates is irradiated with vacuum ultraviolet light or the like is shown. In particular, in this embodiment, an example of modifying the surface by irradiating the surface of the workpiece with vacuum ultraviolet light will be described.

[Device configuration]
FIG. 17 shows a device configuration example of this embodiment. The bonding apparatus of the present embodiment is mainly composed of a light irradiation unit 10 (release unit) and a pressure stage unit 20 (pressure mechanism) having the same configuration as that of the bonding apparatus of the first embodiment shown in FIG. Although it is composed of two units, it further includes a pressurizing lid 61 for fixing the work when the work is pressed as described later. In addition, since the structure of the light irradiation unit 10 and the pressurization stage unit 20 is the same as that of the 1st Example, it demonstrates easily below.
a. Light Irradiation Unit The light irradiation unit 10 is for irradiating the surface of the second workpiece W2 with UV light to modify the surface. As the lamp 11a, as described above, a vacuum ultraviolet excimer lamp that emits monochromatic light having a center wavelength at a wavelength of 172 nm is adopted, and lighting control of each lamp is performed by the lamp lighting device 13.
The light irradiation unit 10 is configured to be driven left and right in FIG. 17 by the light irradiation unit drive unit 17. Here, the operation of the light irradiation unit drive unit 17 is controlled by the light irradiation unit drive control unit 17a.

b. Pressurization stage unit The pressurization stage unit 20 pressurizes the stacked first workpiece W1 and second workpiece W2 and joins them together.
The pressure stage unit 20 includes a pressure stage 23, an auxiliary stage 22, and a work stage 21 arranged on the auxiliary stage 22. Each stage is movable in a linear direction (that is, up and down direction) restricted by the pillar 26.
Here, since the specific configuration is the same as that of the first embodiment, the description is omitted here, and the pressurizing lid 61 which is a new configuration in this embodiment will be described.
The pressurizing lid 61 is for restricting the upward movement of both the workpieces when pressurizing the stacked first workpiece W1 and second workpiece W2. The pressurizing lid 61 is driven in the left-right direction in FIG. 17 by a pressurizing lid driving unit 61a as shown in FIGS. The operation of the pressurizing lid driving unit 61a is controlled by the pressurizing lid driving control unit 61b. As described above, the pressure lid 61 is fixed in order to restrict the upward movement of both workpieces during the pressure operation. Here, the pressurizing lid 61 is fixed by the pressurizing lid fixing mechanism 62. The pressurizing lid fixing mechanism 62 has the same configuration as the inversion stage fixing mechanism 36 of the first embodiment, and is driven by a fixing mechanism driving unit 62a. The fixing mechanism driving unit 62a is controlled by the fixing mechanism driving control unit 62b.
In other words, in this embodiment, the pressure lid fixing mechanism 62 corresponds to a movement restricting mechanism that restricts the upward movement of the two works (the stacked first work W1 and second work W2).
c. Base As shown in FIG. 17, the above-described pressure stage unit 20 is provided on a base 41.

Hereinafter, an operation example of the bonding apparatus in this embodiment will be described.
In order to simplify the description, in this embodiment, a case is described in which after the first workpiece W1 and the second workpiece W2 are bonded together to form a microchip, an inspection object is placed on the microchip.
That is, as in the first embodiment, since the inspection body is not set in advance on the second workpiece W2 (microchip substrate) before the microchip substrate is bonded, the inspection body is shielded from being irradiated with UV light. Therefore, the mask M, the mask holder 14, the mask holder driving unit 14a, and the mask holder driving control unit 14b are omitted.

A. Operation 1 (from second workpiece W2 installation to light irradiation)
(1) As shown in FIG. 17, in the pressure stage unit 20, the second workpiece W2 is placed on the workpiece stage 21 and positioned at a predetermined position. The positioning is performed by pressing against a positioning pin, for example, as shown in FIG. The installation of the second workpiece W2 may be performed by an operator, or may be performed using a well-known transport mechanism that is not shown or described.
(2) In consideration of the thickness of the second workpiece W2, the stage moving mechanism drive control unit 24a drives the stage moving mechanism 24 to move the pressure stage 23, the auxiliary stage 22, and the work stage 21, thereby moving the work stage. 21 is adjusted to a predetermined height.
Specifically, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a, the surface of the auxiliary stage 22 comes into contact with the height adjusting collar 26b, and the height adjusting collar 26b is further connected to the flange portion 26a of the column 26. The pressure stage 23, the auxiliary stage 22, and the work stage 21 are moved until they come into contact with each other.

The height of the surface of the auxiliary stage 22 depends on the thickness of the height adjusting collar 26b provided between the auxiliary stage 22 and the flange portion 26a. That is, the height of the work stage 21 provided on the surface of the auxiliary stage 22 also depends on the thickness of the height adjusting collar 26b. The thickness of the height adjusting collar 26b is equal to the predetermined height described above. Selected to be.
Here, the predetermined height means that the second workpiece W2 is placed on the workpiece stage 21 and the second workpiece W2 is positioned below the UV lamp 11a when the second workpiece W2 is positioned in the irradiation area of the light irradiation unit 10. The height is such that the distance between the side and the irradiation surface of the second workpiece W2 is D.

(3) The light irradiation unit driving unit 17 drives the light irradiation unit 10 so that the second workpiece W2 is positioned in the irradiation region of the UV light irradiated from the light irradiation unit 10. Here, the operation of the light irradiation unit drive unit 17 is controlled by the light irradiation unit drive control unit 17a.
As described above, the distance between the lower side of the UV lamp 11a and the irradiation surface of the second workpiece W2 is D. Since the UV light having a wavelength of 172 nm emitted from the UV lamp is significantly attenuated in the atmosphere, the distance D is set to 1 to 5 mm, for example.
(4) The UV lamp 11a is turned on by the lamp lighting device 13, and the second work W2 is irradiated with UV light having a wavelength of 172 nm. The lamp lighting device 13 controls the power supplied to the UV lamp 11a so that the irradiance on the surface of the second workpiece W2 becomes a predetermined value. (5) After a predetermined irradiation time has elapsed, the lamp lighting device 13 turns off the UV lamp 11a. Here, it is assumed that the lamp lighting device 13 can also set the lamp lighting time.
Through the steps (1) to (5), the positioning of the second workpiece W2 on the workpiece stage 21, the adjustment of the height of the surface of the second workpiece W2, the arrangement of the second workpiece W2 in the irradiation region, and UV irradiation for a predetermined time is performed on the second workpiece W2.

B. Operation 2 (Lamination of first workpiece W1 and second workpiece W2)
(6) As shown in FIG. 18, the light irradiation unit drive unit 17 retracts the light irradiation unit 10 from the second workpiece W2. The retracted position is a position that does not interfere with the stacking process when the first work W1 described later is stacked on the second work W2.
(7) The first workpiece W1 is installed on the second workpiece W2. The first workpiece W1 may be installed by an operator, or may be performed using a well-known transport mechanism that is not shown or described.
The positioning of the first workpiece W1 is performed by pressing it against the positioning pins as in the case of the second workpiece W2. In this case, the height of the positioning pin is set to be higher than the thickness of the second workpiece W2 and lower than the height of both the workpieces when the first workpiece W1 and the second workpiece W2 are stacked. . Moreover, this height is set to a height that does not affect the pressurizing process described later.
Here, when it is necessary to precisely align the first workpiece W1 and the second workpiece W2, alignment marks are provided in advance on the workpiece W1 and the workpiece W2. Then, the first workpiece W1 is transferred onto the second workpiece W2 by a known transfer mechanism, and the alignment mark detection mechanism (not shown) is used to detect the alignment mark of the first workpiece W1 and the alignment mark of the second workpiece W2. Is detected. Then, based on the detection result, the work stage drive controller drives the work stage 21 so that the positions of both alignment marks coincide. And the said conveyance mechanism is driven and the 1st workpiece | work W1 is installed on the 2nd workpiece | work W2. Through the steps (6) to (7), the light irradiation unit 10 is retracted from the second work W2, and the first work W1 and the second work W2 are stacked.

C. Operation 3 (Preparation for installation of pressure lid)
(8) As shown in FIG. 19, the stage moving mechanism drive controller 24a drives the stage moving mechanism 24 to move the pressure stage 23, auxiliary stage 22, and work stage 21 downward, so that the work stage 21 Is adjusted to a predetermined height. The predetermined height is a height at which the pressurizing lid 61 does not collide with both the workpieces and the work stage 21 when the pressurizing lid 61 shown later enters both the workpieces.
Through the step (8), the pressurizing lid 61 can be inserted above the first and second workpieces W1, W2.

D. Operation 4 (Installation of pressure lid)
(9) As shown in FIG. 20, the pressurizing lid driving unit 61a drives the pressurizing lid 61 so that the pressurizing lid 61 is positioned above the first and second workpieces W1 and W2 stacked. . Here, the operation of the pressurizing lid driving unit 61a is controlled by the pressurizing lid driving control unit 61b. (10) The stopper 28 is inserted into the space between the pressure stage 23 and the auxiliary stage 22. The stopper 28 is driven by the above-described stopper driving unit 28a, and the control is performed by the stopper driving control unit 28b (see FIG. 3). It will be in the state located above the workpiece | work W2.

E. Action 5 (fixing action of pressure lid)
(11) As shown in FIG. 21, the pressure lid fixing mechanism 62 is driven to fix the pressure lid 61. The pressurizing lid fixing mechanism 62 restricts the pressurizing lid 61 from moving upward in the pressurizing step described later. As a result, the upward movement of the stacked first workpiece W1 and second workpiece W2 is restricted in the pressing step.
The pressure lid fixing mechanism 62 is driven by a fixing mechanism driving unit 62a. The fixing mechanism driving unit 62a is controlled by the fixing mechanism driving control unit 62b.
By the step (11), the pressurizing lid 61 is fixed, and the state can be shifted to the subsequent pressurizing step.

F. Action 6 (Pressurizing action)
(12) As shown in FIG. 22, in the pressurizing stage unit 20, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a, so that the pressurizing stage 23, the auxiliary stage 22, and the work stage 21 are moved upward. The first and second workpieces W1 and W2 stacked on the workpiece stage 21 are brought into contact with the pressure lid 61 (that is, the upper surface of the first workpiece W1 and the pressure lid 61). Contact). At this time, the distance between the upper surface of the base 41 and the surface of the pressure stage 23 is S1 ′.
(13) As shown in FIG. 23, in the pressurizing stage unit 20, the stage moving mechanism 24 continues to be driven by the stage moving mechanism drive control unit 24a even after both the workpieces and the pressurizing lid 61 are brought into contact with each other.
Then, when the upper surface of the pressure stage 23 comes into contact with the stopper 28, the drive of the stage moving mechanism 24 is stopped.

As described above, the upward movement of the stacked first workpiece W1 and second workpiece W2 is restricted by the pressure lid 61 fixed by the fixing mechanism 62. For this reason, the auxiliary stage 22 on which the work stage 21 on which both the works W1 and W2 are placed cannot move upward. Therefore, the upward movement distance (x) of the pressure stage 23 from the position where the workpieces W1, W2 and the pressure lid 61 are in contact to the position where the upper surface of the pressure stage 23 is in contact with the stopper 28. The spring 27 inserted between the pressure stage 23 and the auxiliary stage 22 is compressed.
That is, when the distance between the upper surface of the base 41 and the surface of the pressure stage 23 when the surface of the pressure stage 23 and the stopper 28 come into contact is S2 ′, the moving distance x is x = S2′−S1 ′.
Therefore, when the spring constant of the spring 27 is k, a pressure having a magnitude of P = | kx | is applied to the first workpiece W1 and the second workpiece W2.
That is, the pressure applied to the first workpiece W1 and the second workpiece W2 is adjusted to a predetermined value by adjusting the spring constant of the spring 27 and the insertion position of the stopper 28.
Note that the pressure is measured using the pressure sensor 15. The pressure information detected by the pressure sensor 15 is sent to, for example, the stage moving mechanism drive control unit 24a. For example, it is sent to a pressure display means (not shown).
By the steps (12) to (13), pressurization is performed on the stacked first workpiece W1 and second workpiece W2.

G. Action 7 (Removal of work (microchip))
(14) As shown in FIG. 24, after a predetermined time has elapsed from the start of pressure application to the first workpiece W1 and the second workpiece W2, the stage moving mechanism 24 is driven by the stage moving mechanism drive control unit 24a. The pressure stage 23, the auxiliary stage 22, and the work stage 21 are moved downward. The moving position is an arbitrary position where the surface of the first workpiece W1 is separated from the pressurizing lid 61 and the pressure on the first workpiece W1 and the second workpiece W2 is released. Note that the above-described predetermined time is from the start of pressure application to the first workpiece W1 and the second workpiece W2 until the first chip W1 and the second workpiece W2 are joined and the microchip is formed. Is the time.
(15) The pressurizing lid fixing mechanism 62 is driven by the fixing mechanism driving unit 62a, and the pressurizing lid fixing mechanism 62a moves to the right side of FIG. Thereby, the fixing of the pressure lid 61 is released.

(16) The pressurizing lid driving unit 61a moves the pressurizing lid 61 to the left side of FIG. 24 so that the pressurizing lid 61 is retracted from above the first and second works W2 (that is, microchips) stacked. To drive. Here, the operation of the pressurizing lid driving unit 61a is controlled by the pressurizing lid driving control unit 61b.
(17) In the pressure stage unit 20, the microchip placed on the work stage 21 is taken out. Note that the microchip may be taken out by an operator, or may be performed using a well-known transport mechanism that is not shown or described.
By the steps (15) to (17), release of the pressurization to the microchip, release of the fixing of the pressurization lid 61, inversion to the original position, and removal of the microchip from the work stage 21 are performed.

According to the apparatus of the present embodiment, the following effects can be obtained.
The bonding apparatus shown in the present embodiment can irradiate the second work W2 held on the work stage 21 of the pressure stage unit 20 with the UV light from the light irradiation unit 10, and the modification is performed. After the first workpiece W1 is stacked on the surface of the processed second workpiece W2, it is possible to apply pressure to the first workpiece W1 and the second workpiece stacked by the pressing mechanism of the pressing stage unit 20. It becomes.
That is, the bonding process of the microchip can be performed with one apparatus, and the entire apparatus can be configured compactly.

Furthermore, the distance between the UV light irradiation surface of the second workpiece W2 and the light irradiation unit 10 can be arbitrarily set. For example, when the UV light emitted from the light irradiation unit 10 to the irradiation surfaces of both workpieces is UV light having a center wavelength of 172 nm, the distance between the lower side of the UV lamp and the irradiation surfaces of both workpieces is set to 1 to 5 mm, for example. It becomes possible to set. Therefore, when irradiating UV light having a wavelength of 172 nm that significantly attenuates in the air, the surface of the second workpiece W2 can be modified even if the irradiation atmosphere is in the air.
That is, the UV light irradiation atmosphere does not need to be a vacuum atmosphere in which UV light having a wavelength of 172 nm is not attenuated, and thus the entire apparatus can be configured more compactly.
As in the second embodiment, a substrate heating function can be added to the bonding apparatus of this embodiment. As a result, after the above-described two workpiece laminating step, (A) two workpiece pressing step, (B) two workpiece heating step, (C) two workpiece pressing step and heating. An arbitrary process can be selected from a process group consisting of processes.
As in the third embodiment, a host controller 50 may be provided to automatically execute a series of steps.

7). Example 7
In the above-described Examples 1 to 6, the case where the light irradiation unit is modified by irradiating the surface of the workpiece with UV light has been described. However, particles having a modification ability for modifying the surface of the workpiece are released. As the emission unit, an emission unit that emits plasma (oxygen plasma, inert gas plasma) particles may be used.
FIG. 25 shows a configuration example of the plasma generating means. The configuration other than the plasma generating means is the same as that of the first to sixth embodiments, and only the configuration in the vicinity of the pressure stage unit 20 is shown in FIG.
As shown in the figure, the plasma generating means 70 includes a pair of electrodes 71a and 71b facing each other at a predetermined interval, a gas supply means 73 for supplying a gas between the pair of electrodes 71a and 71b, and a gas supply The power supply device 72 is configured to apply a pulsed voltage between the electrodes 71a and 71b while supplying gas from the means 73. The distance between the electrodes is set to several mm or less, and the space between the electrodes 71a and 71b becomes a plasma generation space. As the main component of the gas, for example, oxygen or an inert gas can be used.

Plasma generated between the electrodes 71a and 71b is emitted from the lower end openings of the electrodes 71a and 71b, and is irradiated onto the workpiece W placed on the workpiece stage 21 through the mask M provided on the mask holder 14. The structure of the mask M is a stencil plate structure that is patterned so as to prevent the plasma particles from coming into contact with the inspection body in accordance with the installation pattern of the inspection body.
The plasma generating means 70 is provided with a scanning means 74. When the plasma generating means 70 is scanned by the scanning means 74 in the direction of the arrow in FIG. Released to the entire surface of the workpiece W.
Thus, the workpiece can be exposed to an oxygen plasma atmosphere for plasma treatment, or the workpiece can be exposed to an inert gas plasma atmosphere using an inert gas for plasma treatment.
Other configurations are the same as those of the first to sixth embodiments, and as shown in the first embodiment, the plasma can be simultaneously emitted to the surface of the first workpiece W1 and the surface of the second workpiece W2. Two sets of generating means 70 may be provided, or plasma may be emitted individually to the first workpiece W1 and the second workpiece W2 as in the fifth embodiment. .
FIG. 25 shows the case where the mask M is provided between the plasma generating means 70 and the workpiece W. However, as shown in the sixth embodiment, the mask may not be arranged.

DESCRIPTION OF SYMBOLS 10 Light irradiation unit 10a Lamp house 11a UV lamp 11b Reflection mirror 13 Lamp lighting device 14 Mask holder 14a Mask holder drive part 14b Mask holder drive control part 15 Pressure sensor 16 Heating mechanism 16a Temperature control part 17 Light irradiation unit drive part 17a Light irradiation Unit drive control unit 20 Pressure stage unit 21 Work stage 21a Work stage drive control unit 22 Auxiliary stage 23 Pressure stage 24 Stage moving mechanism 24a Stage moving mechanism drive control unit 25 Drive shaft 26 Column 26a Flange portion 26b Height adjustment collar 27 Spring 27a Spring case 28 Stopper 28a Stopper drive unit 28b Stopper drive control unit 30 Reverse stage unit 31 Reverse stage 31a Suction groove 31b Vacuum supply hole 31c Positioning pin 32 Stage holding mechanism 33 Reverse stage drive mechanism 33a Reverse stage controller 33b Shaft 33c Coupling 33d Bearing member 33e Rotating shaft 34 Reverse stage base 34a Height adjustment spacer 35 Vacuum supply mechanism 35a Vacuum supply pipe 35b Vacuum chuck drive control Unit 36 Inversion stage fixing mechanism 36a Fixing mechanism drive unit 36b Fixing mechanism drive control unit 41 Base 42 Linear motion base 43 Linear motion base drive control unit 50 Host controller 61 Pressure lid 61a Pressure lid drive unit 61b Pressure lid drive control unit 62 Pressurizing lid fixing mechanism 62a Fixing mechanism 62b Fixing mechanism drive controller 70 Plasma generating means 71a, 71b Electrode 72 Power supply 73 Gas supply means 74 Scanning means
M Mask W, W1, W2 Workpiece

Claims (9)

A device for bonding the first and second workpieces having a fine flow path formed on at least one of them,
A stage for holding the first workpiece;
A discharge unit that discharges particles having a modification ability for modifying the surface of the first workpiece held on the stage; and
The movement of at least the vertical direction of the first workpiece and the second workpiece laminated so that one surface of the second workpiece contacts the modified surface of the first workpiece held on the stage is restricted. A movement restriction mechanism to
A workpiece laminating apparatus comprising: a pressurizing mechanism that pressurizes the first workpiece and the second workpiece in the stacked state so that the contact surfaces thereof are pressurized. A device for bonding the first and second workpieces having a fine flow path formed on at least one of them,
A first stage for holding the first workpiece;
A second stage for holding the second workpiece;
At least one discharge unit for discharging particles having a modification ability for modifying the surface of the first workpiece and / or the surface of the second workpiece;
At least the modified surface of one of the first and second workpieces held on the first and second stages is brought into contact with the surface or modified surface of the other workpiece. A workpiece laminating mechanism for laminating;
A movement regulating mechanism for regulating movement of at least the vertical direction of the stacked first and second workpieces;
A pressurizing mechanism that pressurizes the first workpiece and the second workpiece in a stacked state so that the contact surface is pressurized;
A gap setting mechanism for independently adjusting the distance between the discharge unit and the surface of the first workpiece held on the first stage and / or the surface of the second workpiece held on the second stage. With
A workpiece laminating apparatus characterized by that. 3. The discharge unit is composed of two units: a unit for a first work held on a first stage and a unit for a second work held on a second stage. The workpiece laminating device described in 1. The workpiece bonding apparatus according to claim 1, wherein a heating mechanism is provided in the stage or the first stage and / or the second stage. In order to limit the modification process in a predetermined region of the workpiece surface between the stage and the discharge unit, or between the first stage and the discharge unit and / or between the second stage and the discharge unit. 4. The workpiece bonding apparatus according to claim 1, further comprising a mask attaching / detaching mechanism. The workpiece bonding apparatus according to claim 1, wherein the emission unit is a light emission unit that emits photons having a wavelength of 200 nm or less. The workpiece bonding apparatus according to claim 1, wherein the discharge unit is a plasma discharge unit that discharges plasma particles. 4. The discharge unit and the stage, or the discharge unit, the first stage, and the second stage have a mechanism for relatively moving. The workpiece laminating device described in 1. 4. The workpiece bonding according to claim 1, wherein the pressurizing mechanism includes a mechanism for adjusting a contact pressure between the first workpiece and the second workpiece in a stacked state. apparatus.

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