JP2011084054A - Molded body and method of molding the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a hollow molded body with a two-layer structure which is formed by performing insert molding to install a hollow component within a cavity by a simple mechanism without causing deformation of the component and in which an information recording medium such as an IC tag is filled between two layers, and a method of molding the molded body. <P>SOLUTION: After the information recording medium 3 is mounted to the outer side of the hollow component 4 having an opening, the component 4 is installed within the cavity 2 of a die, and liquid is filled in a hollow part of the component 4. With the opening sealed, a molten material is filled in an air gap between an outer wall of the component 4 and an inner wall of the cavity 2. Specifically, filling of the molten material is performed in an injection molding method, and the liquid filling can prevent deformation of the hollow part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an injection molded body having a hollow shape with a two-layer structure, and in particular, an injection molding including an IC tag or a two-dimensional barcode between a first layer and a second layer constituting two layers. The present invention relates to a molding method by injection molding of a body and the separate part.

  Injection molding is widely used in various fields as a method of mainly molding thermoplastic polymer materials. In this molding method, one or both of the abutment surfaces of a mold composed of two members, a fixed side and a movable side that can be opened and closed, are engraved with a recess called a cavity, to which the product shape is transferred. A molten polymer material is filled at a high pressure through a flow path called a sprue, a runner, and a gate in a state where the contact surface is in pressure contact, and a molded product is obtained.

  On the other hand, to help ensure product management and traceability. A thin data carrier such as an IC tag or a two-dimensional barcode that records information about a product is attached to the product. Specifically, the data carrier is operated by attaching it to a product using a strap or directly attaching it to the surface of the product using an adhesive.

  When this is applied to a product manufactured by injection molding, a tag is directly attached to the product using an adhesive or is attached to the outside of the package. However, polymer materials generally used for injection molding are difficult to join with an adhesive.

  In order to cope with this problem, there is a means of forming the molded body into a two-layer structure and enclosing the data carrier between the two layers. In injection molding, the primary molded body is inserted into a predetermined position of the mold. In general, a method of filling a gap between the primary molded body and the cavity with a molding material to obtain a secondary molded body integrated with the primary molded body, that is, insert molding is generally performed. An example of such a gear is a gear having a metal shaft and a plastic body.

  If such a molding method can be applied to a hollow molded body, that is, a container, it can be considered that it can contribute to the expansion of the use of data carriers such as IC tags and two-dimensional barcodes. However, if the part installed inside the cavity has a hollow shape, when the molten material is filled in the cavity, the hollow part is crushed by the filling pressure, and it is difficult to obtain a required shape. This phenomenon is particularly prominent when the hollow part is a separately molded plastic body.

  As a means for coping with such a problem, Patent Document 1 discloses that a hollow part installed in a cavity is deformed by performing a process of closing a mold and a process of press-fusing molten material into the cavity in parallel. A technique for preventing the above is disclosed. However, this method has a problem that the structure of the mold becomes complicated and increases the manufacturing cost of the product, and the difficulty of setting the molding conditions increases.

JP 2004-268456 A

  Therefore, an object of the present invention is to perform insert molding in which a hollow part is installed in a cavity by a simple mechanism so that the part is not deformed, and a data carrier such as an IC tag is placed between two layers. An object of the present invention is to provide a sealed hollow molded body having a two-layer structure and a molding method thereof.

  In general, the compressibility of a liquid when a pressure is applied is small enough to be ignored when compared with a gas. Further, for example, a hollow product such as a bottle has an opening as a matter of course, and it is very easy to inject and discharge liquid. Therefore, if the hollow part of such a part is placed in a mold in a state where the liquid is filled and sealed and insert molding is performed, it is considered that the hollow part is less deformed by the filling pressure of the molten material.

  Based on such knowledge, the present invention has been made as a result of studying a method for sealing an opening of a hollow-shaped component installed inside a mold and a mold structure suitable for the method.

  In other words, the present invention is a hollow molded body having a two-layer structure and having an opening, in which a data carrier is enclosed between a first layer and a second layer.

  Further, the present invention is the above-mentioned molded product, wherein the data carrier is at least one of an IC tag and a two-dimensional barcode.

  Further, the present invention provides a method in which after mounting the data carrier on the outside of a hollow part having an opening, the part is placed in a cavity of a mold, and a liquid is sealed in the hollow part of the part. In the molding method of the molded body, the gap between the outer wall of the component and the inner wall of the cavity is filled with a molten material in a state where the opening is sealed.

  According to the present invention, a container enclosing a data carrier such as an IC tag or a two-dimensional barcode can be provided by a method capable of mass production called injection molding. As a result, it is possible to contribute to the management of merchandise provided in liquids such as beverages, cosmetics, and detergents, and reduction of distribution costs.

  When encapsulating a two-dimensional barcode, it is necessary to use a transparent material, but light reflection and refraction occur at the interface between the two layers that make up the molded body, depending on the choice of material and molding conditions. A visual effect that cannot be obtained with a molded product of the manufacturing method can be obtained. As a result, a sense of quality can be imparted to the molded body, which increases the added value.

  In addition, when using a two-dimensional barcode of a thin medium such as paper, it is desirable to reinforce with a laminate or the like. In the case of an IC tag, depending on the frequency of radio waves to be used, the influence of the reach distance and surrounding members may be different. However, in the present invention, any frequency can be applied. The frequency may be selected by adapting.

Sectional drawing which shows the state of an example of the molded object which concerns on this invention in an injection molding process. The figure which shows the example of the container shape | molded by the shaping | molding method which concerns on this invention. The figure which shows the electric circuit of the IC tag of HF band.

  FIG. 1 is a cross-sectional view showing an example of a molded body according to the present invention in an injection molding process, and is an example using an IC tag as an information recording medium. In FIG. 1, 1 is a movable side mold, 2 is a cavity, 3 is an IC tag, 4 is a hollow part, 5 is an R-shaped part, 6 is a slide core, 7 is an O-ring, 8 is an opening sealing member, Reference numeral 9 denotes a fixed side mold.

  In this example, a thermoplastic polymer material is prepared as a hollow shaped part 4 by blow molding or injection molding, and the IC tag 3 is temporarily attached to the outside with an adhesive or the like. Attached to the opening of the component 4, the opening is sealed by the O-ring 7, and fitted into a predetermined position of the fixed side mold 9.

  Here, various oils and water can be used as the liquid filled in the hollow part 4. Depending on the fluidity of the material used for molding, the material may be filled at a temperature of 200 ° C. or higher, and the mold temperature may be set higher correspondingly. In this case, it is necessary to use a liquid having a high boiling point such as silicon oil. However, since water is the easiest to handle as the liquid, it is desirable to select a material having as high a fluidity as possible for the material used for molding.

  Next, the slide core 6 and the movable mold 1 are operated to obtain the state shown in FIG. 1, and the cavity 2 is filled with a molten polymer material plasticized by a cylinder (not shown) of a molding machine. Thereafter, the movable mold 1 and the slide core 6 are opened, and the molded body is taken out.

  FIG. 2 is a view showing an example of a container formed by the forming method according to the present invention. In FIG. 2, 10 is a hollow-shaped part set in the fixed die 9 during molding, that is, a primary molded body, 11 is an IC tag, 12 is a portion molded by filling the cavity 2, that is, secondary molding. Is the body.

FIG. 3 is a diagram showing an electric circuit of an IC tag in an HF band of 13.56 MHz, for example, as an example in the case of using an IC tag. In FIG. 3, 13 is a coil, and 14 is a capacitor. The inductance L of the coil 13 and the capacitance C of the capacitor 14 are designed according to the following formula so that the resonance frequency f ₀ of these parallel resonance circuits is equal to the use frequency of the wireless tag.
1 / {2π (LC) ^1/2 } = f ₀

  Reference numeral 15 denotes a signal line that generates a resonance voltage in read / write radio waves from a reader / writer described later. Reference numeral 16 denotes an example of a rectifying / smoothing circuit for rectifying a 13.56 MHz resonant AC voltage and converting it to a DC power supply voltage. Since the smoothing / rectifying circuit 16 can be easily formed using a known circuit, detailed description thereof is omitted. A DC power supply voltage used in other circuits of the tag is supplied to the power supply line 17 through the rectifying / smoothing circuit.

  Reference numeral 18 denotes an interface circuit that converts (detects or demodulates), for example, Doug information superimposed on the resonant AC signal from a modulated wave to a pulse wave that can be recognized by a normal logic circuit. It also has the function of modulating the pulse signal indicating the result of reading the memory from the logic circuit with the high frequency used by the tag and superimposing it on the 15 signal lines.

  A logic circuit 19 interprets commands from the host sent via the reader / writer and reads / writes a memory described later. Reference numeral 20 denotes a memory for storing the ID of the IC tag and the like, and a read-only memory (ROM), a nonvolatile read / write memory (RAM), or both are mounted depending on the purpose. In recent years, those integrating 15 to 20 functions into a one-chip microcontroller have been developed, and these are becoming mainstream.

  The above is the circuit configuration of the IC tag, and its function will be described below. When magnetic field lines of a high-frequency electromagnetic field from a reader / writer described later are linked to the coil 13 of the IC tag, a high-frequency voltage is generated at both ends of the coil 13 according to Faraday's law of electromagnetic induction. This high-frequency voltage signal has a large amplitude due to the resonance action of the coil 13 and the capacitor 14. A signal having a large amplitude is supplied to the signal line 15.

  A high-frequency AC voltage signal generated in the signal line 15 is converted by a rectifying and smoothing circuit 16 into a DC voltage (power supply) signal 17 used by a subsequent circuit. The interface circuit 18 converts the command signal via the reader / writer superimposed on the signal line into a pulse signal that can be recognized by the logic circuit 19 at the next stage.

  The logic circuit 19 interprets a command from the host. For example, if the command from the host is a request for tag ID information, the logic circuit 19 reads the information in the ID signal recording unit of the memory 20 at the next stage and interfaces as a pulse signal. Return to circuit 18. Then, the interface circuit 18 modulates the pulse signal with a high frequency used in the IC tag and superimposes the pulse signal on the high frequency signal line 15.

  Then, since the current flowing through the coil 13 is modulated by the pulse signal of ID information, the magnetic flux interlinking with the coil 13 is modulated by the pulse signal of ID information. This signal is detected by a reader / writer described later and transmitted to the host.

  Next, the configuration and operation of the wireless tag system will be described with reference to FIGS. FIG. 4 is a block diagram of the wireless tag system, and FIG. 5 is a flowchart showing the operation of the IC tag.

  In FIG. 5, reference numeral 21 denotes an IC tag whose circuit is shown in FIG. A reader / writer 22 has a function of sending a command from a host, which will be described later, to the IC tag as a high-frequency electromagnetic field signal and receiving an electromagnetic field signal responding from the wireless tag. Reference numeral 23 denotes a host, which can easily give its function to a general-purpose personal computer.

  In a simple system, the reader / writer 22 can be equipped with a microcontroller and a display element so as to have the function of the host 23. The above-mentioned system has already been released from a plurality of companies, and detailed description of the internal configuration is omitted.

  Next, the operation of the wireless tag will be described with reference to FIG. At the start of step 24, when the host 23 is powered on and the associated control software is activated, the reader / writer 22 is also brought into an operable state along with its initialization.

  Next, in the command operation in step 25, the host 23 detects whether the operator has operated a member for requesting, for example, the ID information of the IC tag. If the operation is performed (Yes), the command in step 26 is performed. Proceeding to transmission, the reader / writer 22 sends an ID request command signal to the IC tag 21. If no operation is performed here (No), the process returns to the command operation in step 25 and waits for the operation while going around the loop.

  After sending the command signal from the reader / writer 22 in the command transmission in step 26, the host 23 performs the operation of detecting the presence / absence of a response from the IC tag 21 in step 27 via the reader / writer 22. If there is no response (No), the process returns to the step 27 for detecting the presence / absence of the IC tag response, and waits for the response while going around the loop. If there is a response (Yes), the control software proceeds to the determination procedure in step 28.

  When the response signal from the IC tag 21 satisfies the standard (OK) in the determination procedure of step 28, the normal display of step 29 is executed on the display of the host 23 or some display device, and then the step 25 of step 25 is executed. Return to the command operation and wait for the next operation. If the response signal from the IC tag 21 does not satisfy the standard (NG) in the determination procedure of step 28, the abnormality warning display of step 30 is executed on the display of the host 23 or some display device, and then step 25 is performed. Return to the command operation and wait for the next operation.

  The above is the operation of the wireless tag. In the example shown here, the ID request embedded in the IC tag 21 is described as a command, but other functions can be easily performed by the same operation. realizable. For example, when you embed this tag in a product, you can easily record the information on whether or not you have paid as “unpaid” and change the information to “paid” when you pay at the cash register. Can be realized.

  As described above, when the IC tag 21 is embedded between the layers of the two-layer molded article, it is extremely difficult to remove or replace the IC tag 21, and a system with extremely high security can be constructed. There are benefits. In addition, if information on whether or not the product has been paid is recorded, if a reader / writer is installed at the exit of the store, it is possible to detect and warn that shoplifted items are taken out. In addition to this, it is possible to use all the functions of the wireless tag, which greatly contributes to improving product management and logistics reliability and reducing costs.

  Note that the present invention is not limited to the above-described embodiment, and includes various thermosetting polymers as a primary molded body, such as deformation and correction that can be conceived by those having ordinary knowledge in the technical field. Needless to say, the present invention is also included in the present invention.

DESCRIPTION OF SYMBOLS 1 Movable side metal mold | die 2 Cavity 3,11 IC tag 4 Hollow shape part 5 R shape part 6 Slide core 7 O-ring 8 Opening part sealing member 9 Fixed side metal mold | die 10 Primary molded object 12 Secondary molded object 13 Coil 14 Capacitor 15 signal line 16 rectification / smoothing circuit 17 power supply line 18 interface circuit 19 logic circuit 20 memory 21 IC tag 22 reader / writer 23 host 24 step 24; start 25 step 25; command operation 26 step 26; command transmission 27 step 27; IC tag Detecting presence / absence of response 28 Step 28; Judgment procedure 29 Step 29; Normal display 30 Step 30; Abnormal warning display

Claims (3)

  A hollow molded body having a two-layer structure and having an opening, wherein the data carrier is enclosed between a first layer and a second layer.   The molded body according to claim 1, wherein the data carrier is at least one of an IC tag and a two-dimensional barcode.   After the data carrier is attached to the outside of the hollow-shaped component having an opening, the component is placed in the cavity of the mold, the liquid is sealed in the hollow of the component, and the opening is sealed The method for molding a molded body according to claim 1 or 2, wherein a molten material is filled in a gap between the outer wall of the part and the inner wall of the cavity.

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