JP2011081183A - Method for manufacturing photomask and method for manufacturing plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve high-accuracy pattern formation by preliminarily measuring warpage of a substrate and forming a pattern complying with the amount of warpage in the process of manufacturing a photomask. <P>SOLUTION: The method for manufacturing a photomask using glass as the main material of a substrate comprises preliminarily measuring a warpage amount of the substrate and then selecting a photomask pattern complying with the warpage amount. It is preferable that, with every 100 μm or more of a change in the warpage of the substrate with respect to a reference value, the width of a pattern is changed to be thinner by 1 μm to 5 μm. The plasma display panel is manufactured by using the photomask. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a photomask used in a photolithography process and a method for manufacturing a plasma display panel using the photomask.

  A typical AC surface discharge type panel as a plasma display panel (hereinafter referred to as a PDP) has a large number of discharge cells formed between a front plate and a back plate arranged opposite to each other. The front plate includes a front substrate made of glass, a display electrode pair including a pair of scan electrodes and sustain electrodes, and a dielectric layer and a protective layer covering them. The back plate includes a glass back substrate, data electrodes, a dielectric layer covering the data electrodes, barrier ribs, and a phosphor layer. Then, the front plate and the rear plate are arranged opposite to each other so that the display electrode pair and the data electrode are three-dimensionally crossed and sealed, and a discharge gas is sealed in the internal discharge space. Here, a discharge cell is formed at a portion where the display electrode pair and the data electrode face each other. A gas discharge is generated in each discharge cell of the PDP configured as described above, and red, green, and blue phosphors are excited and emitted to perform color display.

  Each of the scan electrode and the sustain electrode is formed by, for example, laminating a narrow striped bus electrode on a wide striped transparent electrode. The transparent electrode is formed by, for example, patterning an ITO thin film formed on the front substrate using a sputtering method or the like into a stripe shape using a photolithographic method or the like. The bus electrode is formed by printing and baking a silver paste on a transparent electrode in a stripe shape (see, for example, Patent Document 1).

JP 2000-156168 A

  In the photomask manufacturing process, it is necessary to measure warpage during mask inspection and to re-create the mask if the warpage amount exceeds the standard value. Further, if the amount of warping is finely limited, there is a problem that the photomask material becomes expensive and the manufacturing cost increases. In addition, variation in pattern width occurs depending on the warp amount, and there is a problem of improving accuracy.

  In order to solve the above problems, the present invention provides a method for manufacturing a photomask using glass as a main material of a substrate. After measuring the amount of warpage of the substrate, the photomask pattern corresponding to the amount of warpage is selected and formed. It is characterized by doing. Here, every time the amount of warpage of the substrate changes by 100 μm or more with respect to the reference value, it is desirable to change the pattern width to 1 μm to 5 μm. Moreover, the manufacturing method of PDP of this invention is a manufacturing method using these photomasks.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to suppress the manufacturing loss of a photomask and to manufacture a photomask drawing pattern accurately.

Explanatory drawing of the manufacturing process of the photomask of embodiment of this invention Diagram showing frequency distribution of photomask warpage The disassembled perspective view of PDP in embodiment of this invention Front plate configuration diagram of an embodiment of the present invention Back plate configuration diagram in an embodiment of the present invention

  A method for manufacturing a photomask according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a flowchart of a photomask manufacturing process in an embodiment of the present invention. In this way, material processing, surface polishing, light shielding film formation, resist film formation, resist laser drawing, development, inspection, and shipping are performed in this order.

  In the prior art, the drawing pattern is inspected at the time of shipment, but the embodiment of the present invention is characterized by measuring the amount of warpage after surface polishing and selecting a pattern to be drawn. Yes.

  In the prior art, since the amount of warpage is measured before shipment, if the amount of warpage is large, a manufacturing loss for correcting pattern drawing again occurs. In contrast, in the embodiment of the present invention, the amount of warpage is measured in advance, and a photomask pattern corresponding to the measurement result is selected and created.

  FIG. 2 is a diagram showing the relationship between the amount of warpage of a substrate mainly made of glass and the frequency of occurrence thereof. As described above, the distribution of the warp amount is distributed with a large variation. In the embodiment of the present invention, the amount of warpage is measured by a laser displacement type with the substrate upright. This makes it possible to ignore the action due to its own weight with respect to the direction of displacement of the substrate, and it is possible to accurately measure the amount of warpage.

  In the embodiment of the present invention, the pattern width of the photomask is changed for each material in accordance with the change of the warp amount to 200 μm, preferably 100 μm or more with respect to the reference value.

  For example, in the electrode pattern of the PDP front plate, the electrode line width changes by 1 μm with respect to the warp amount of 100 μm. Therefore, the drawing corresponding to the electrode width is designed to be thinner by 1 μm as the warpage amount of 100 μm or more is measured as the pattern design line width. As a result, the electrode width is constant during PDP manufacturing. However, since the amount of change varies depending on the material, it is not uniquely determined and there is an optimum value.

  Hereinafter, a method for manufacturing a plasma display panel using a photomask according to an embodiment of the present invention will be described.

  FIG. 3 is an exploded perspective view showing the structure of the PDP in Embodiment 1 of the present invention. The PDP 10 is configured by disposing the front plate 20 and the back plate 30 so as to face each other and sealing the periphery using a sealing member (not shown), and a large number of discharge cells are formed therein. Yes.

  The front plate 20 includes a front substrate 21 made of glass, a display electrode pair 24 including a scan electrode 22 and a sustain electrode 23, a black stripe 25, a dielectric layer 26, and a protective layer 27. A plurality of display electrode pairs 24 including a pair of scanning electrodes 22 and sustain electrodes 23 are formed on the front substrate 21 in parallel with each other. A black stripe 25 is formed between adjacent display electrode pairs 24. 3, the display electrode pair 24 and the black stripe 25 are formed so as to become the scanning electrode 22, the sustain electrode 23, the black stripe 25, the scan electrode 22, the sustain electrode 23, the black stripe 25,. The figure is shown. However, the display electrode pair 24 and the black stripe 25 are composed of the scan electrode 22, the sustain electrode 23, the black stripe 25, the sustain electrode 23, the scan electrode 22, the black stripe 25, the scan electrode 22, the sustain electrode 23, the black stripe 25, and the sustain electrode. 23, the scanning electrode 22, the black stripe 25, and so on.

  A dielectric layer 26 is formed so as to cover the display electrode pair 24 and the black stripe 25, and a protective layer 27 is formed on the dielectric layer 26.

  The back plate 30 includes a glass back substrate 31, a data electrode 32, a dielectric layer 33, a partition wall 34, and a phosphor layer 35. On the back substrate 31, a plurality of data electrodes 32 are formed in parallel to each other. A dielectric layer 33 is formed so as to cover the data electrode 32, and a grid-like partition wall 34 is formed thereon, and red, green, and blue fluorescent lights are formed on the surface of the dielectric layer 33 and the side surfaces of the partition wall 34. A body layer 35 is formed.

  The front plate 20 and the back plate 30 are arranged to face each other so that the display electrode pair 24 and the data electrode 32 are three-dimensionally crossed, and a discharge cell is formed at a portion where the display electrode pair 24 and the data electrode 32 face each other. . The front plate 20 and the back plate 30 are sealed using low-melting glass at a position outside the image display area where the discharge cells are formed, and a discharge gas is sealed in the internal discharge space.

  Next, a method for manufacturing the PDP 10 will be described. FIG. 4 is a diagram for explaining a method of manufacturing the front plate 20 of the PDP 10 in the embodiment of the present invention.

  In order to manufacture the front plate 20, first, the glass front substrate 21 on which a transparent electrode (not shown) is formed is alkali-cleaned. Thereafter, the black layers 22c and 23c precursors 22cx and 23cx and the black stripe 25 precursor 25x are formed on the front substrate 21 using a black layer paste mainly composed of ruthenium oxide or a black pigment. These precursors 22cx, 23cx, and 25x are formed by a photolithography process using a photomask according to the above-described embodiment of the present invention, by applying a paste layer coated on the entire surface by a screen printing method. Thereafter, the precursors 22dx and 23dx of the conductive layers 22d and 23d are formed on the precursors 22cx and 23cx by the same method using the conductive layer paste containing silver (FIG. 4A).

  Next, the front substrate 21 on which the precursors 22cx, 23cx, 25x, 22dx, and 23dx are formed is fired to form bus electrodes 22a and 23a and black stripes 25. The peak temperature of the firing at this time is preferably 550 to 600 ° C., and in this embodiment is 580 ° C. The thickness of the bus electrodes 22a, 23a is preferably 1 μm to 6 μm, and is 4 μm in the present embodiment (FIG. 4B).

  Next, a precursor of a dielectric layer is formed on the front substrate 21 on which the scan electrode 22, the sustain electrode 23, and the black stripe 25 are formed by a known technique such as a printing method. Then, the dielectric layer precursor is baked to form a dielectric layer 26 having a thickness of 20 μm to 50 μm.

  In the present embodiment, boron oxide 35 wt%, silicon oxide 1.4 wt%, zinc oxide 27.6 wt%, barium oxide 3.3 wt%, bismuth oxide 25 wt%, aluminum oxide 1.1 wt%, molybdenum oxide 4.0 wt%. %, And a dielectric paste containing dielectric glass containing tungsten oxide 3.0 wt% was prepared. The dielectric glass thus prepared has a softening point of about 570 ° C. Next, a dielectric paste was applied to the front substrate 21 on which the scan electrodes 22, the sustain electrodes 23, and the black stripes 25 were formed by a die coating method to form a dielectric layer precursor. Then, the dielectric layer precursor was baked at about 590 ° C. to form the dielectric layer 26. The thickness of the dielectric layer 26 at this time is about 40 μm.

  In addition to the above, as the dielectric paste, for example, boron oxide, silicon oxide, zinc oxide, alkaline earth oxide, alkali metal oxide, bismuth oxide, aluminum oxide, molybdenum oxide, tungsten oxide, cerium oxide, etc. A dielectric paste containing dielectric glass having a softening point of 520 ° C. to 590 ° C. including some of them can be used.

  Then, a protective layer 27 containing magnesium oxide as a main component is formed on the dielectric layer 26 by a known technique such as a vacuum deposition method (FIG. 4C).

  Next, a method for manufacturing the back plate 30 will be described. First, by a screen printing method and a photolithography process using a photomask according to an embodiment of the present invention, a conductive layer paste mainly composed of silver is applied in stripes at regular intervals on the back substrate 31 to form data electrodes. 32 precursors 32x are formed (FIG. 5A).

  Next, the back substrate 31 on which the precursor 32x is formed is baked to form the data electrodes 32. The thickness of the data electrode 32 is, for example, 2 to 10 μm (FIG. 5B).

  Subsequently, a dielectric paste is applied on the back substrate 31 on which the data electrodes 32 are formed, and then baked to form a dielectric layer 33. The thickness of the dielectric layer 33 is, for example, about 5 to 15 μm (FIG. 5C).

  Subsequently, a photosensitive dielectric paste is applied on the back substrate 31 on which the dielectric layer 33 is formed, and then baked to form a precursor of the partition wall 34. After that, the barrier ribs 34 are formed by using a photomask according to an embodiment of the present invention, and exposing and etching. The height of the partition wall 34 is, for example, 100 to 150 μm (FIG. 5D).

  Then, a phosphor ink containing any one of a red phosphor, a green phosphor, and a blue phosphor is applied to the wall surface of the partition wall 34 and the surface of the dielectric layer 33. Thereafter, the phosphor layer 35 is formed by drying and firing (FIG. 5E).

  Then, the front plate 20 and the back plate 30 described above are arranged to face each other so that the display electrode pair 24 and the data electrode 32 are three-dimensionally crossed, and the low melting point glass is placed at a position outside the image display area where the discharge cells are formed. Use and seal. Thereafter, a discharge gas containing xenon is sealed in the internal discharge space, and the PDP 10 is completed.

  According to the present invention, it is industrially useful in that a photomask manufacturing loss can be suppressed and a photomask drawing pattern can be manufactured with high accuracy.

10 PDP
DESCRIPTION OF SYMBOLS 20 Front plate 21 Front substrate 22 Scan electrode 23 Sustain electrode 24 Display electrode pair 25 Black stripe 26 Dielectric layer 27 Protective layer 30 Back plate 31 Back substrate 32 Data electrode 33 Dielectric layer 34 Partition 35 Phosphor layer

Claims (3)

In a photomask manufacturing method using glass as a main material of a substrate, a photomask pattern is formed by selecting a photomask pattern corresponding to the warpage amount after measuring the warpage amount of the substrate. Method. 2. The method of manufacturing a photomask according to claim 1, wherein the width of the pattern is changed from 1 μm to 5 μm every time the warpage amount of the substrate changes by 100 μm or more with respect to a reference value. A method for manufacturing a plasma display panel, wherein a photolithography process is performed using the photomask according to claim 1.

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